A screen printing device for stacked high voltage piezoelectric ceramic bonding process

Abstract

The application relates to the technical field of piezoelectric device preparation, and discloses a screen printing device for a stacking high-voltage piezoelectric ceramic bonding process, which comprises, from top to bottom, an operation table, a ceramic fixing device and a base. The operation table comprises a general control device, a pressure rod, a sliding support, a sliding rod, a retainer and a screen. The two sides of the general control device are fixedly connected with the sliding support, the two sides of the retainer are fixedly connected with the sliding rod, the sliding support is slidably arranged on the outer periphery of the sliding rod and is used for moving the general control device above the retainer. The screen is arranged on the inner side of the retainer. A glue discharging plate and a glue extruding plate are arranged at the position, facing the screen, of the general control device. The controller of the general control device controls the lifting of the glue discharging plate and the glue extruding plate. The glue layer on the surface of the piezoelectric ceramic is uniform and smooth, the thickness of the glue layer is easy to control, and the glue can be recycled and reused. The thickness consistency of each layer of piezoelectric ceramic is good, the piezoelectric ceramics are stacked in order, and the piezoelectric ceramics are firmly bonded. The overall structure of the application is simple and reasonable, the operation is simple, and the production efficiency is high.

Description

Technical Field

[0001] This invention belongs to the field of piezoelectric device manufacturing technology, and more specifically, relates to a screen printing device for a stacked high-voltage piezoelectric ceramic bonding process. Background Technology

[0002] The fabrication process of high-voltage piezoelectric ceramic stacking requires the piezoelectric ceramics to undergo shape and parameter testing. After passing the tests, the surface of the piezoelectric ceramics needs to be treated. Adhesive for bonding the piezoelectric ceramics is then applied to the treated surface, followed by a series of processing steps including adhesive application, alignment, and curing, ultimately resulting in a qualified high-voltage piezoelectric ceramic.

[0003] In the adhesive application step, the adhesive needs to be applied evenly and smoothly to the surface of the piezoelectric ceramic, and a high degree of thickness is required. If the adhesive layer is too thick, too much excess adhesive will be squeezed out during the subsequent adhesive removal process, resulting in waste; if the adhesive layer is too thin, the bonding effect will be poor, and the piezoelectric ceramic will not adhere firmly. Therefore, ensuring the thickness and evenness of the adhesive layer during the adhesive application step is very important.

[0004] Based on the above, the present invention provides a screen printing device for stacked high-voltage piezoelectric ceramic bonding process, which provides uniform and flat adhesive application, good thickness consistency, strong bonding of piezoelectric ceramics, recyclable and reusable adhesive, and simple operation. Summary of the Invention

[0005] The purpose of this invention is to provide a screen printing device for the bonding process of stacked high-voltage piezoelectric ceramics, which aims to solve the problems in the prior art, such as poor uniformity and flatness of the adhesive coating on piezoelectric ceramics, poor thickness consistency, weak bonding of piezoelectric ceramics, non-recyclable adhesive, and complicated operation.

[0006] The present invention is implemented as follows: a screen printing device for a stacked high-voltage piezoelectric ceramic bonding process, comprising, from top to bottom, an operating table, a ceramic fixing device and a base;

[0007] The operating table includes a central control device, a pressure rod, a sliding support, a slide rod, a retainer, and a wire mesh. The two sides of the central control device are fixedly connected to the sliding support, and the two sides of the retainer are fixedly connected to the slide rod. The sliding support is slidably fitted onto the outer periphery of the slide rod, allowing the central control device to move above the retainer. The wire mesh is located inside the retainer. The central control device, facing the wire mesh, has a glue-dispensing plate for applying adhesive to the wire mesh and a glue-extruding plate for squeezing the adhesive through the wire mesh. The two sides of the central control device are rotatably connected to the two ends of the pressure rod, which positions the glue-dispensing plate and the glue-extruding plate above the wire mesh. The central control device contains a controller that controls the raising and lowering of the glue-dispensing plate and the glue-extruding plate.

[0008] The base includes a base plate, and the operating table is movably connected to the base plate;

[0009] A ceramic fixing device is located on the base plate, below the wire mesh, and is used to place the piezoelectric ceramic.

[0010] Furthermore, the ceramic fixing device comprises, from top to bottom, multiple layers of sleeve plates, a bottom sleeve plate, and a support plate;

[0011] The bottom sleeve plate is provided with a plurality of grooves for placing the first layer of piezoelectric ceramic, and the edges of the grooves are provided with adhesive leakage holes; the multilayer sleeve plate is provided with through holes of similar shape and size corresponding to the grooves, and the through holes are used to place the second layer of piezoelectric ceramic bonded to the first layer of piezoelectric ceramic;

[0012] The adhesive plate has an adhesive receiving groove below each of the grooves, and the adhesive receiving groove is used to receive excess adhesive flowing out of the adhesive leakage hole.

[0013] Furthermore, the four corners of the adhesive plate are provided with telescopic positioning pins, and the multi-layer sleeve plate and the bottom sleeve plate are provided with pin holes corresponding to the telescopic positioning pins. The telescopic positioning pins pass through the pin holes, and the multi-layer sleeve plate and the bottom sleeve plate are stacked on the adhesive plate in sequence.

[0014] Furthermore, the main control device is equipped with a pull rod, which is used to move the operating table back and forth above the retainer.

[0015] Furthermore, the main control device is equipped with a pressure gauge and a locking button. The controller is electrically connected to a pressure sensor. The pressure gauge is used to display the pressure value of the extrusion plate pressing the wire mesh as measured by the pressure sensor. The locking button is used to lock the descent height of the extrusion plate corresponding to the required extrusion pressure.

[0016] Furthermore, one side of the retainer is provided with a height-adjusting operating table screw; the other side of the retainer is provided with a base-adjusting screw between it and the base plate; the operating table adjusting screw and the base adjusting screw are used together to adjust the distance between the wire mesh and the base.

[0017] Furthermore, the wire mesh is provided with markings for positioning the wire mesh with the ceramic fixing device.

[0018] Furthermore, the base plate is also provided with an adjusting micrometer that abuts against the periphery of the ceramic fixing device for adjusting its position.

[0019] Furthermore, the base plate is provided with two rotating shaft supports, and a rotating shaft is provided between the two rotating shaft supports; the retainer is rotatably connected to the rotating shaft.

[0020] Furthermore, the bottom of the base plate is provided with foot pads for support.

[0021] This invention provides uniform and smooth adhesive application, precise control of adhesive thickness, and consistent thickness. The adhesive is recyclable and reusable, and the operation is simple and efficient.

[0022] The beneficial effects of this invention are as follows:

[0023] 1. The movable and liftable glue-dispensing plate and glue-extrusion plate, together with the adjustable mesh screen, ensure that the glue layer applied to the piezoelectric ceramic is uniform and flat after the glue-dispensing and glue-extrusion processes, with precise thickness control and good consistency.

[0024] 2. The structural design of the ceramic fixing device ensures neat and firm bonding of the stacked high-voltage piezoelectric ceramics. The number of multi-layer sleeves can be set as needed to meet personalized requirements. The design of glue leakage holes and glue receiving grooves allows for the recycling of excess glue, promoting green energy conservation. Adjusting the alignment between the ceramic fixing device and the wire mesh or wire mesh markings using a micrometer further ensures the precision, uniformity, and flatness of the glue application layer.

[0025] 3. The pressure gauge and locking button ensure that the adhesive layer applied to each layer of piezoelectric ceramic is of consistent and uniform thickness. The operating table adjustment screw and the base adjustment screw work together to adjust the distance between the wire mesh and the base, making the entire operation more precise and the equipment more stable.

[0026] 4. The screen printing device of the present invention has a simple and reasonable overall structure, is easy and reliable to operate, and has high production efficiency. Attached Figure Description

[0027] Figure 1 This is a three-dimensional structural schematic diagram of the screen printing device for stacked high-voltage piezoelectric ceramic bonding process provided by the present invention.

[0028] Figure 2 A three-dimensional structural diagram of the operating table provided by the present invention;

[0029] Figure 3 The right view of the operating console provided by this invention;

[0030] Figure 4 The ceramic fixing device and base combination provided by the present invention Figure 3 A schematic diagram of the three-dimensional structure;

[0031] Figure 5 This is an exploded view of the ceramic fixing device provided by the present invention;

[0032] In the diagram: 1-Control panel; 101-Main control device; 102-Pressure gauge; 103-Pressure rod; 104-Sliding support; 105-Slide rod; 106-Cage; 107-Wire mesh; 108-Pull rod; 109-Locking button; 110-Control panel adjusting screw; 111-Cage chamfer; 112-Glue extrusion plate; 113-Glue discharge plate; 2-Ceramic fixing device; 201-Multi-layer sleeve plate; 202-Bottom layer sleeve plate; 203-Glue receiving plate; 204-Piezoelectric ceramic; 205-Telescopic positioning pin; 206-Pin hole; 207-Glue leakage hole; 208-Glue receiving groove; 3-Base; 301-Rotating shaft; 302-Rotating shaft support; 303-Base plate; 304-Foot pad; 305-Base adjusting screw; 306-Adjusting micrometer. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0034] The implementation of the present invention will be described in detail below with reference to specific embodiments.

[0035] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this invention, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0036] Reference Figure 1-5 The image shows a preferred embodiment of the present invention.

[0037] A screen printing apparatus for a stacked high-voltage piezoelectric ceramic bonding process includes, from top to bottom, an operating table 1, a ceramic fixing device 2, and a base 3, as shown in the figure. Figure 1 The control panel 1 includes a central control unit 101, a pressure gauge 102, a pressure rod 103, a sliding support 104, a slide rod 105, a retainer 106, a wire mesh 107, a pull rod 108, a locking button 109, a control panel adjusting screw 110, a retainer chamfer 111, a glue extrusion plate 112, and a glue discharge plate 113. (Refer to...) Figure 2 , Figure 3 .

[0038] The left and right sides of the main control device 101 are fixedly connected to a sliding support 104, and the left and right sides of the retainer 106 are fixedly connected to a slide rod 105. The sliding support 104 is slidably fitted onto the outer periphery of the slide rod 105. Through the slidable connection between the sliding support 104 and the slide rod 105, the main control device 101 moves back and forth above the retainer 106. The wire mesh 107 is located inside the retainer 106. The wire mesh 107 can be a semi-transparent mesh with an adjustable mesh size, and the mesh opening can be designed according to the shape and size of the piezoelectric ceramic 204 to be coated. The connection between the wire mesh 107 and the retainer 106 can be set as a detachable connection. A strip groove is provided on the inner side of the retainer 106, and the dimensions of the four sides of the wire mesh 107 match the strip groove. When in use, the wire mesh 107 is inserted into the strip groove, and when replaced, it can be pulled out from the strip groove. The wire mesh 107 is marked for positioning between the wire mesh 107 and the ceramic fixing device 2.

[0039] The main control device 101 is provided with a glue-dispensing plate 113 and a glue-extruding plate 112 spaced apart towards the screen 107. The glue-dispensing plate 113 is used to spread the glue applied to the screen 107 evenly. The glue-extruding plate 112 is used to squeeze the glue applied to the screen 107 through the screen 107 and apply it onto the piezoelectric ceramic 204. The two sides of the main control device 101 are rotatably connected to the two ends of the pressure rod 103, and the connection between the two ends of the pressure rod 103 and the two sides of the main control device 101 forms a closed loop. The pressure rod 103 is used to position the glue-dispensing plate 113 and the glue-extruding plate 112 above the screen 107. The main control device 101 is equipped with a controller, which adjusts the raising and lowering of the glue-dispensing plate 113 and the glue-extruding plate 112. A pull rod 108 is provided on the front side of the main control device 101. Pulling the pull rod 108 can move the movable operating table 1 back and forth on the retainer 106. The pressure rod 103 can be manually pressed down and automatically reset. Pressing it down to the same level as the pull rod 108 will allow the main control device 101 to slide back and forth.

[0040] The main control unit 101 is equipped with a pressure gauge 102 and a locking button 109. The main control unit 101 contains a pressure sensor, which measures the pressure of the extrusion plate 112 pressing the wire mesh 107. The pressure sensor is electrically connected to the controller. The pressure gauge 102 displays the pressure value measured by the pressure sensor as the extrusion plate 112 presses the wire mesh 107. The locking button 109 is used to lock the descent height of the extrusion plate 112 corresponding to the required extrusion pressure. The locking button 109 is a downward pressure locking control; it locks the descent height of the extrusion plate 112 corresponding to the required extrusion pressure, ensuring that subsequent downward pressures are consistent.

[0041] The ceramic fixing device 2 is used to place the piezoelectric ceramic 204, and it is located on the base plate 303 and below the wire mesh 107. The ceramic fixing device 2, from top to bottom, includes a multi-layer sleeve plate 201, a bottom sleeve plate 202, and a support plate 203. The multi-layer sleeve plate 201, the bottom sleeve plate 202, and the support plate 203 are preferably rectangular plates of similar size. Figure 5 The bottom sleeve plate 202 has several grooves for placing the first layer of piezoelectric ceramics 204. The shape and size of the grooves are set according to the shape and size of the piezoelectric ceramics 204, for example, they can be rectangular, circular, rectangular rings, or circular rings. The edges of the grooves have glue-draining holes 207. When the groove is rectangular, the glue-draining holes 207 can be placed at the four corners to allow excess glue applied to the first layer of piezoelectric ceramics 204 to flow downwards to the adhesive-supporting plate 203. The multilayer sleeve plate 201 has several through holes with shapes and sizes similar to the grooves. The through holes are used to place the second layer of piezoelectric ceramics 204 bonded to the first layer of piezoelectric ceramics 204, meaning the bottom of the second layer of piezoelectric ceramics 204 placed in the through hole directly contacts the glue on the top of the first layer of piezoelectric ceramics 204. N multilayer sleeve plates 201 are set on the bottom sleeve plate 202 as needed, where N≥1.

[0042] The bottom of the rubber-coated sheet 203 contacts the base plate 303, as shown in the reference. Figure 4 The adhesive-receiving plate 203 has at least one adhesive-receiving groove 208 below each of the grooves. The adhesive-receiving groove 208 can collect excess adhesive flowing out from the adhesive leakage hole 207. The four corners of the adhesive-receiving plate 203 are provided with telescopic positioning pins 205. The multi-layer sleeve plate 201 and the bottom sleeve plate 202 are provided with pin holes 206 corresponding to the positions of the telescopic positioning pins 205. The telescopic positioning pins 205 pass through the pin holes 206, and the cooperation between the telescopic positioning pins 205 and the through pin holes 206 ensures that the multi-layer sleeve plate 201 and the bottom sleeve plate 202 are aligned and stacked on the adhesive-receiving plate 203, that is, the through holes correspond one-to-one with the grooves.

[0043] The base plate 303 is also provided with an adjusting micrometer 306 that abuts against the periphery of the ceramic fixing device 2. Adjusting the micrometer 306 can push the ceramic fixing device 2 connected to it, adjust the position of the ceramic fixing device 2, and thus ensure that the relative position of the piezoelectric ceramic 204 placed on it and the wire mesh 107 is correct.

[0044] The base 3 is movably connected to the control panel 1. (Refer to...) Figure 4The base 3 includes a base plate 303, with two pivot supports 302 on one side of the base plate 303, and a pivot 301 between the two pivot supports 302. The bottom of one side of the retainer 106 is rotatably connected to the pivot 301. The retainer 106 has a retainer chamfer 111 to facilitate its rotation. The base 3 is connected to the operating table 1 via the pivot 301 and the pivot supports 302, ensuring that the operating table 1 can rotate along the pivot 301. The operating table 1 can rotate towards or away from the base 3, facilitating the placement or removal of the ceramic fixing device 2.

[0045] To adjust the distance between the wire mesh 107 and the base 3, the retainer 106 has a height-adjusting operating table screw 110 on the side where the rotation shaft 301 is located. The operating table screw 110 can adjust the height of one side of the retainer 106. A base adjusting screw 305 is provided between the other side of the retainer 106 and the base plate 303. The base adjusting screw 305 is rotatably mounted on the base plate 303, with its top abutting against the bottom of the retainer 106. Two base adjusting screws 305 are symmetrically arranged. The base adjusting screw 305 can adjust the distance between the base 3 and the other side of the retainer 106. The operating table adjusting screw 110 and the base adjusting screw 305 work together to adjust the distance between the wire mesh 107 and the base 3, and the distance can be locked after adjustment. The bottom of the base plate 303 also has support feet 304.

[0046] Working principle:

[0047] During the stacked high-voltage piezoelectric ceramic bonding process, after the piezoelectric ceramic 204 is processed, the first layer of piezoelectric ceramic 204 is placed into the groove on the bottom sleeve plate 202. The distance between the retainer 106 and the first layer of piezoelectric ceramic 204 is changed by adjusting the base adjusting screw 305 and the operating table adjusting screw 110, thereby bringing the wire mesh 107 into contact with the first layer of piezoelectric ceramic 204. The micrometer 306 is adjusted so that the ceramic fixing device 2 corresponds to the marked position on the wire mesh 107.

[0048] The glue is squeezed onto the screen 107, and the pressure rod 103 is pressed down to a horizontal position with the pull rod 108, allowing the main control device 101 to slide back and forth. Before pulling forward, the glue dispensing plate 113 descends to contact the screen 107. During the forward pulling process, the glue dispensing plate 113 squeezes the glue onto each mesh opening on the screen 107. Before the main control device 101 slides backward, the glue dispensing plate 113 rises and the glue extrusion plate 112 descends to a state of compression with the screen 107. During the backward sliding process, the glue extrusion plate 112 squeezes the glue onto the first layer of piezoelectric ceramic 204.

[0049] Throughout the adhesive application process, pressure gauge 102 displays the pressure applied each time. The amount of adhesive on the piezoelectric ceramic 204 corresponds to the pressure on pressure gauge 102, which in turn corresponds to adjusting the compression of the extrusion plate 112 onto the screen 107. By adjusting the compression of the extrusion plate 112 onto the screen 107, the amount of adhesive applied each time is controlled. The pressure value corresponding to the appropriate amount of adhesive is displayed in real time on pressure gauge 102. Once the appropriate pressure is found, the locking button 109 can be adjusted to lock the descent height of the extrusion plate 112, ensuring that the pressure is the same for each subsequent application, thereby guaranteeing a consistent and uniform adhesive layer thickness applied to the piezoelectric ceramic 204 each time.

[0050] After the first layer of piezoelectric ceramic 204 is coated with adhesive, a multi-layer sleeve plate 201 can be installed on the bottom sleeve plate 202. A second layer of the first layer of piezoelectric ceramic 204 is placed in the through-hole, directly contacting the adhesive layer of the first layer, and adhesive is applied according to the steps described above. Due to the squeezing action of the extrusion plate 112, the adhesive between the two layers of piezoelectric ceramic 204 is squeezed out and flows through the glue leakage hole 207 into the glue receiving groove 208, thus simultaneously completing the adhesive application and discharging process. The multi-layer sleeve plate 201 can be added according to the required number of piezoelectric ceramic 204 to be bonded. Each time a layer is added, a new piezoelectric ceramic 204 is placed in the through-hole, and adhesive application continues according to the steps described above.

[0051] This invention is not intended to limit the scope of the invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the invention should be included within the scope of protection of the invention.

Claims

1. A screen printing apparatus for a stacked high-voltage piezoelectric ceramic bonding process, characterized in that, From top to bottom, it includes an operating table (1), a ceramic fixing device (2), and a base (3); The operating table (1) includes a central control device (101), a pressure rod (103), a sliding support (104), a slide rod (105), a retainer (106), and a wire mesh (107). The central control device (101) is fixedly connected to the sliding support (104) on both sides, and the retainer (106) is fixedly connected to the slide rod (105) on both sides. The sliding support (104) is slidably sleeved on the outer periphery of the slide rod (105) for the central control device (101) to move above the retainer (106). The wire mesh (107) is located inside the retainer (106). The main control device (101) is provided with a glue-dispensing plate (113) for applying glue to the screen (107) and a glue-extruding plate (112) for squeezing the glue through the screen (107) at the position opposite to the screen (107). The two sides of the main control device (101) are rotatably connected to the two ends of the pressure rod (103). The pressure rod (103) is used to position the glue-dispensing plate (113) and the glue-extruding plate (112) above the screen (107). The main control device (101) is provided with a controller, which controls the raising and lowering of the glue-dispensing plate (113) and the glue-extruding plate (112). The base (3) includes a base plate (303), and the operating table (1) is movably connected to the base plate (303); A ceramic fixing device (2) is located on the base plate (303) and below the wire mesh (107), and is used to place piezoelectric ceramics (204). The ceramic fixing device (2) includes, from top to bottom, a multi-layer sleeve plate (201), a bottom sleeve plate (202), and a support plate (203). The bottom sleeve plate (202) is provided with a plurality of grooves for placing the first layer of piezoelectric ceramics (204), and the edges of the grooves are provided with glue leakage holes (207). The multi-layer sleeve plate (201) is provided with through holes of similar shape and size corresponding to the grooves, and the through holes are used to place the second layer of piezoelectric ceramics (204) glued to the first layer of piezoelectric ceramics (204). The support plate (203) is provided with a glue-receiving groove (208) below the plurality of grooves, and the glue-receiving groove (208) is used to receive excess glue flowing out from the glue leakage holes (207).

2. The screen printing apparatus for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that, The four corners of the adhesive plate (203) are provided with telescopic positioning pins (205). The multi-layer sleeve plate (201) and the bottom sleeve plate (202) are provided with pin holes (206) corresponding to the telescopic positioning pins (205). The telescopic positioning pins (205) pass through the pin holes (206). The multi-layer sleeve plate (201) and the bottom sleeve plate (202) are stacked on the adhesive plate (203) in sequence.

3. The screen printing apparatus for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that, The main control device (101) is provided with a pull rod (108), which is used to pull the operating table (1) to move back and forth above the retainer (106).

4. The screen printing apparatus for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that, The main control device (101) is equipped with a pressure gauge (102) and a locking button (109). The controller is electrically connected to a pressure sensor. The pressure gauge (102) is used to display the pressure value measured by the pressure sensor of the extrusion plate (112) pressing the wire mesh (107). The locking button (109) is used to lock the descent height of the extrusion plate (112) corresponding to the required extrusion pressure.

5. The screen printing apparatus for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that, One side of the retainer (106) is provided with a height-adjusting operating table screw (110); the other side of the retainer (106) is provided with a base adjusting screw (305) between it and the base plate (303); the operating table adjusting screw (110) and the base adjusting screw (305) are used together to adjust the distance between the wire mesh (107) and the base (3).

6. The screen printing apparatus for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that, The wire mesh (107) is provided with markings for positioning the wire mesh (107) and the ceramic fixing device (2).

7. The screen printing apparatus for stacked high-voltage piezoelectric ceramic bonding process according to claim 6, characterized in that, The base plate (303) is also provided with an adjusting micrometer (306) that abuts against the ceramic fixing device (2) around the perimeter for adjusting the position.

8. The screen printing apparatus for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that, The base plate (303) is provided with two rotating shaft supports (302), and a rotating shaft (301) is provided between the two rotating shaft supports (302); the retainer (106) is rotatably connected to the rotating shaft (301).

9. The screen printing apparatus for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that, The bottom of the base plate (303) is provided with foot pads (304) for support.

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