Grounding system defect positioning method, device, equipment and medium

Abstract

The invention provides a grounding system defect positioning method, device, equipment and medium, and the method comprises the steps: a monitoring device injects a first current into a grounding resistor in a measurement region to obtain first feedback current information and first magnetic field intensity information of the grounding resistor, and a plurality of current-carrying branches are arranged in the measurement region; determining position information of a current carrying branch according to the first feedback current information and the first magnetic field intensity information, drawing a grounding grid planar graph according to the position information, and reconstructing the grounding grid planar graph into a first grounding grid topological graph; the monitoring device injects a second current into the grounding resistor, and the acquisition device acquires a second feedback current of the current monitoring device and other monitoring devices; and obtaining node potential data and soil resistivity of the measurement area, and obtaining a grounding network defect position in the first grounding network topological graph according to the node potential data, the soil resistivity and the second feedback current. According to the technical scheme of the embodiment, accurate positioning of the local defect of the grounding system can be effectively realized.

Description

Technical Field

[0001] The present invention relates to the technical field of defect location, and in particular to a method, device, equipment and medium for locating a defect in a grounding system. Background Art

[0002] The current method for locating defects in grounding systems is generally based on empirical sampling, in which the grounding status of the entire grounding system is determined by excavating conductors. However, sampling excavation has disadvantages such as large workload and low accuracy. In actual on-site operations, it is often encountered that the excavation cannot be carried out or the excavation cannot be carried out accurately, resulting in the inability to effectively identify and eliminate defects in the grounding system. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a method, device, equipment and medium for locating defects in a grounding system, which can accurately locate local defects in the grounding system.

[0004] In a first aspect, an embodiment of the present invention provides a method for locating a defect in a grounding system, characterized in that the method is applied to a defect locating system, wherein the defect locating system includes multiple grounding resistors, multiple monitoring devices, and multiple acquisition devices, wherein the grounding resistors are respectively connected to the monitoring devices and the acquisition devices, and the method for locating a defect in a grounding system includes: The monitoring device injects a first current into the grounding resistor in a measurement area to obtain first feedback current information and first magnetic field strength information of the grounding resistor, wherein a plurality of current-carrying branches are arranged in the measurement area; Determine the position information of the plurality of current-carrying branches according to the first feedback current information and the first magnetic field strength information, draw a grounding grid plan view of the measurement area according to the position information, and reconstruct the grounding grid plan view into a first grounding grid topology map; The monitoring device injects a second current into the grounding resistor, so that the collecting device collects the second feedback current of the current monitoring device and the other monitoring devices; Node potential data and soil resistivity of the measurement area are obtained, and the grounding network defect position in the first grounding network topology diagram is obtained according to the node potential data, the soil resistivity and the second feedback current.

[0005] In some embodiments of the present invention, the grounding system is further provided with a current-carrying conductor, and the current-carrying conductor is respectively connected to the grounding resistor and the acquisition device, and the reconstructing the grounding grid plan view into a first grounding grid topology diagram includes: Obtaining the soil magnetic permeability of the measurement area, the buried depth of the current-carrying conductor in the measurement area, the real-time current of the current-carrying conductor, and the vertical distance between the current-carrying conductor and the measurement point of the measurement area after the current-carrying conductor is buried in the measurement area; Calculate a first magnetic induction intensity of the current-carrying conductor according to the magnetic permeability, the buried depth, the real-time current and the vertical distance; A second magnetic induction intensity at the measuring point parallel to the measuring area is calculated according to the first magnetic induction intensity.

[0006] In some embodiments of the present invention, the second magnetic induction intensity of the measuring point parallel to the measuring area is calculated according to the first magnetic induction intensity, and is obtained according to the following formula: ; in, is the second magnetic induction intensity, is the soil magnetic permeability, I is the real-time current, h is the vertical distance, and y is the burial depth.

[0007] In some embodiments of the present invention, reconstructing the grounding grid plan view into a first grounding grid topology view includes: Inputting a third current of different strengths to each of the ground resistors in the measurement area, and inputting a first magnetic field strength value before the second current is input and a second magnetic field strength value after the third current is input to the acquisition device; The grounding grid plan view is reconstructed into the first grounding grid topology view according to the first magnetic field strength value and the second magnetic field strength value.

[0008] In some embodiments of the present invention, drawing a ground grid plan view of the measurement area according to the location information includes: Selecting a coordinate origin of the measurement area and establishing a coordinate system according to the coordinate origin; Performing magnetic field measurement along the X-axis and the Y-axis of the coordinate system and performing differential calculation to locate a plurality of first branches where the X-axis intersects the Y-axis; A ground grid plan view of the measurement area is drawn according to the plurality of first branches.

[0009] In some embodiments of the present invention, obtaining the grounding network defect position in the first grounding network topology map includes: Determining a defect type of the first grounding grid topology diagram; Calculate a first resistivity and a second resistivity in the first grounding grid topology map according to the defect type, the node potential data, the soil resistivity, and the second feedback current, wherein the first resistivity is the resistivity of the defective part, the second resistivity is the resistivity of the normal part, and the first resistivity is greater than the second resistivity; The first resistivity is combined with a resistivity imaging method to locate local defects in the first grounding grid topology map.

[0010] In some embodiments of the present invention, the defect location system is further provided with an alarm unit, and the alarm unit is connected to the monitoring device and the acquisition device respectively. After obtaining the grounding network defect position in the first grounding network topology map, the method further includes: Obtaining a real-time monitoring current value of the grounding resistance; The real-time monitored current value is compared with a system safety threshold value preset in the alarm unit. When the real-time monitored current value is greater than the system safety threshold value, the alarm unit issues an alarm and performs a positioning operation on the grounding resistance.

[0011] In a second aspect, an embodiment of the present invention provides a grounding system defect locating device, comprising at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions executable by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute the grounding system defect locating method as described in the first aspect above.

[0012] In a third aspect, an embodiment of the present invention provides an electronic device, comprising the grounding system defect locating device as described in the second aspect above.

[0013] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium storing computer-executable instructions, wherein the computer-executable instructions are used to execute the grounding system defect locating method as described in the first aspect above.

[0014] The grounding system defect location method according to the embodiment of the present invention has at least the following beneficial effects: The monitoring device injects a first current into the grounding resistance in the measurement area to obtain the first feedback current information and the first magnetic field strength information of the grounding resistance, wherein a plurality of current-carrying branches are arranged in the measurement area; the position information of the plurality of current-carrying branches is determined according to the first feedback current information and the first magnetic field strength information, a grounding grid plan of the measurement area is drawn according to the position information, and the grounding grid plan is reconstructed into a first grounding grid topology diagram; the monitoring device injects a second current into the grounding resistance so that the acquisition device acquires the second feedback current of the current monitoring device and the remaining monitoring devices; the node potential data and the soil resistivity of the measurement area are acquired, and the position of the grounding network defect in the first grounding grid topology diagram is acquired according to the node potential data, the soil resistivity and the second feedback current. According to the technical solution of this embodiment, the accurate positioning of local defects in the grounding system can be effectively achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a flow chart of a method for locating a grounding system defect provided by an embodiment of the present invention; Figure 2 is a flow chart of reconstructing the grounding grid plan view into a first grounding grid topology view provided by this embodiment; Figure 3 is a flow chart of a monitoring device provided by an embodiment of the present invention before injecting a second current into the grounding resistor; Figure 4 is a flow chart of drawing a grounding grid plan view of the measurement area according to the location information provided by an embodiment of the present invention; Figure 5 A flowchart of obtaining the defect location of the grounding network in the first grounding network topology diagram provided by an embodiment of the present invention; Figure 6 is a flow chart after obtaining the defect position of the grounding network in the first grounding network topology diagram provided by an embodiment of the present invention; Figure 7 is a structural diagram of a grounding system defect locating device provided by another embodiment of the present invention; Figure 8 is a first grounding grid topology diagram of a measured area provided by an embodiment of the present invention; Fig. 9 is a plane diagram of an analytical network established by a magnetic field differential method provided by an embodiment of the present invention; Fig.10 This is a plane diagram after inputting sinusoidal currents of different intensities provided by an embodiment of the present invention; Fig.11 It is a schematic diagram of imaging of ground corrosion defects of a grid grounding grid provided by an embodiment of the present invention; Fig.12It is a schematic diagram of imaging grounding corrosion defects of a U-shaped grounding grid and an L-shaped grounding grid provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0016] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0017] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0018] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0019] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0020] An embodiment of the present invention provides a method for locating defects in a grounding system, which is applied to a defect locating system. The defect locating system specifically includes multiple grounding resistors, multiple monitoring devices, multiple collecting devices, current-carrying conductors and alarm devices. The grounding resistors and the alarm devices are respectively connected to the monitoring devices and the collecting devices, and the current-carrying conductors are respectively connected to the grounding resistors and the collecting devices.

[0021] It should be noted that the grounding resistor can provide a stable grounding loop; the monitoring device can monitor the state of the grounding resistor and the current change of the current-carrying conductor in real time. When the monitoring device detects abnormal data, the monitoring device triggers the alarm device to alarm. Furthermore, the current-carrying conductor can transmit current from the power supply to the grounding resistor and the acquisition device, so that the defect location system can monitor the current information and magnetic field strength information of the grounding resistor in real time, and accurately locate the defect position by analyzing the current information and magnetic field strength information of the grounding resistor.

[0022] According to the technical solution of this embodiment, to locate the defects of the grounding system, firstly, a grounding resistance monitoring device is installed in the measured area, a grounding resistance acquisition device is installed on the grounding down conductor in the measured area, and the signals of the acquisition device and the monitoring device are introduced into the background of the grounding system; The grounding grid reconstruction method is used to reconstruct the grounding grid plane map into the first grounding grid topology map, such as Figure 8 As shown; A, B and C belong to three different tank areas in the measurement area. Each tank area is equipped with a collection device and a monitoring device, and is marked with letters and numbers corresponding to A, B and C respectively; After the system acquisition device acquires the node potential data of the grounding grid, the acquired data is analyzed and calculated through the grounding grid resistivity imaging positioning algorithm to obtain the three-dimensional imaging results of the grounding system defect positioning.

[0023] The control method of the embodiment of the present invention is further described below based on the accompanying drawings.

[0024] Reference Figure 1 , Figure 1 A flow chart of a grounding system defect locating method provided by an embodiment of the present invention, the grounding system defect locating method includes but is not limited to the following steps: Step S11, the monitoring device injects a first current into the grounding resistance in the measurement area to obtain first feedback current information and first magnetic field strength information of the grounding resistance, wherein a plurality of current-carrying branches are arranged in the measurement area; It should be noted that the monitoring device injects a first current into the grounding resistor in the measurement area through a current source, and the first current injected into the grounding resistor will generate a corresponding voltage drop in the grounding resistor, thereby forming a first feedback current. At the same time, when the first current flows in the first resistor, a magnetic field is generated, thereby obtaining the first magnetic field strength information of the grounding resistor. It can be understood by those skilled in the art that the multiple current-carrying branches set in the measurement area can be regarded as a current network. By setting up multiple current-carrying branches, the first current injected in the measurement area is distributed more evenly, and the redundancy of the grounding system is increased.

[0025] Step S12, determining the position information of the plurality of current-carrying branches according to the first feedback current information and the first magnetic field strength information, drawing a grounding grid plan view of the measurement area according to the position information, and reconstructing the grounding grid plan view into a first grounding grid topology map; It should be noted that, according to the first feedback current information and the first magnetic field strength information, the flow path of the current in the measurement area is obtained, and the position of the current-carrying branch is determined by comparing and analyzing the first magnetic field strength information of different grounding resistors, and the accurate position of the current-carrying branch is further obtained by combining the first feedback current information. According to the position information of the determined multiple current-carrying branches, a grounding grid plan of the measurement area is drawn. On the basis of the grounding grid plan, the grounding grid plan is reconstructed to obtain a first grounding grid topology map.

[0026] Step S13, the monitoring device injects a second current into the grounding resistance, so that the collection device collects the second feedback current of the current monitoring device and the remaining monitoring devices; It should be noted that the second current is a sinusoidal current of a specific frequency injected into a certain point in the first grounding grid topology diagram, which will generate second magnetic field strength information on the surface of the measurement area. The collection device obtains complete and accurate current information of the measurement area by collecting the second feedback current of the current monitoring device and the remaining monitoring devices.

[0027] Step S14, obtaining node potential data and soil resistivity of the measurement area, and obtaining the grounding network defect position in the first grounding network topology diagram according to the node potential data, soil resistivity and the second feedback current.

[0028] It should be noted that after obtaining the node potential data and soil resistivity of the first grounding grid topology map, the grounding grid resistivity imaging positioning algorithm is used to calculate and obtain the three-dimensional imaging result of the grounding grid defect positioning, thereby determining the location of the grounding network defect.

[0029] It should be noted that the grounding network is buried underground, and the actual structure of the grounding network can only be established based on non-contact measurement methods. In this embodiment, by injecting a second current into the grounding network, the first magnetic field strength information and the second magnetic field strength information of the surface are measured at multiple points and differential and derivative operations are performed, so as to accurately locate the underground carrier and the current-carrying branch. In this embodiment, by inputting a first current into the grounding resistor, a first feedback current and a first magnetic field strength information are obtained, and a grounding network plan is drawn according to the first feedback current and the first magnetic field strength information, and the grounding network plan is reconstructed into a first grounding network topology map. Reconstruction is performed on the basis of the first grounding network topology map, a second current is injected into the grounding resistor, and a second feedback current of the monitoring device is obtained, and according to the second feedback current, the node potential data and the soil resistivity of the measurement area are used to obtain the defect position of the grounding network, and the corresponding underground conductor is located.

[0030] In addition, in one embodiment, referring to Figure 2 ,exist Figure 1 Step S12 of the illustrated embodiment also includes but is not limited to the following steps: Step S21, obtaining the soil magnetic permeability of the measurement area, the buried depth of the current-carrying conductor in the measurement area, the real-time current of the current-carrying conductor, and the vertical distance between the current-carrying conductor and the measurement point of the measurement area after the current-carrying conductor is buried in the measurement area; Step S22, calculating the first magnetic induction intensity of the current-carrying conductor according to the magnetic permeability, the buried depth, the real-time current and the vertical distance; Step S23, calculating a second magnetic induction intensity of the measuring point parallel to the measuring area according to the first magnetic induction intensity.

[0031] It should be noted that by accurately measuring the magnetic permeability of the soil, the electromagnetic characteristics of the underground environment in the measurement area can be accurately understood. Furthermore, the buried depth, real-time current and vertical distance provide the specific spatial relationship between the current-carrying conductor and the measurement point. By using the above parameters to calculate the first magnetic induction intensity of the current-carrying conductor, and calculating the second magnetic induction intensity of the measurement point based on the first magnetic induction intensity, the electromagnetic situation at the measurement point can be finely analyzed.

[0032] In addition, in one embodiment, the second magnetic induction intensity of the measuring point parallel to the measuring area is calculated according to the first magnetic induction intensity, and is obtained according to the following formula: ; in, is the second magnetic induction intensity, is the soil magnetic permeability, I is the real-time current, h is the vertical distance, and y is the burial depth.

[0033] Specifically, this embodiment generates a magnetic field distribution on the surface by injecting a sinusoidal current of a specific frequency at a point in the grounding grid, and locates the corresponding underground current conductor by performing a distance differential operation on the magnetic field distribution and according to the peak characteristics of the magnetic field differential result image.

[0034] Furthermore, the current-carrying conductor is placed on the X-axis through the coordinate origin, and the soil conductor is buried horizontally in the soil with a magnetic permeability of In a single layer of uniform soil, the buried depth of the current-carrying conductor is h, the current flowing in the current-carrying conductor is I, and the current direction is perpendicular to the yz plane and outward. For a point P on the ground surface, the vertical distance from the current-carrying conductor is , the angle between line segment OP and the z-axis is .

[0035] According to the above parameters, the first magnetic induction intensity of the current-carrying conductor at a point P on the ground surface is obtained by the following formula: ; Wherein, B is the first magnetic induction intensity, I is the injected current, p is the vertical distance, and y is the straight-line distance between the current-carrying conductor and the measuring point P.

[0036] It should be noted that, by describing the horizontal magnetic field distribution generated by a single current-carrying conductor, for a grid-shaped grounding network, the horizontal magnetic field distribution on the ground surface of the grounding grid can be equivalent to the superposition of the first formula of each current-carrying branch of the grounding grid. By taking the second-order and fourth-order derivatives of the first formula, the positions of each current-carrying branch in the grounding grid in the measurement area can be determined, and then the first grounding grid topology diagram can be drawn.

[0037] In addition, in one embodiment, referring to Figure 3 ,exist Figure 1 Before step S13 of the illustrated embodiment, the following steps are also included but not limited to: Step S31, inputting a third current of different strengths to each ground resistor in the measurement area, and the acquisition device acquires a first magnetic field strength value before the second current is input and a second magnetic field strength value after the third current is input; Step S32: reconstructing the grounding grid plan view into a first grounding grid topology view according to the first magnetic field strength value and the second magnetic field strength value.

[0038] It should be noted that, refer to Fig.10 , by inputting three different intensities of sinusoidal current at each installation point of the grounding resistor, so that the remaining units can detect the different magnetic field intensities of the grounding resistor. The acquisition device collects the first magnetic field strength value of the second current signature and the second magnetic field strength value after the third current is input, and reconstructs the grounding grid plan into a first grounding grid topology diagram based on the magnetic field differential method and circuit law theory. Through the precise construction and analysis of the grounding grid topology diagram, the defects of the grounding system can be effectively located, and the grounding system can be monitored and diagnosed in real time, the corrosion area of ​​the grounding grid can be discovered in time, and the corrosion condition at the node can be determined.

[0039] In addition, in one embodiment, referring to Figure 4 and Fig. 9 ,exist Figure 1 Step S12 of the illustrated embodiment also includes but is not limited to the following steps: Step S41, selecting the coordinate origin of the measurement area and establishing a coordinate system according to the coordinate origin; Step S42, measuring the magnetic field along the X-axis and the Y-axis of the coordinate system, and performing differential calculation to locate a plurality of first branches where the X-axis and the Y-axis intersect; Step S43, drawing a ground grid plan view of the measurement area according to the multiple first branches.

[0040] It should be noted that the magnetic field differential method is used to reconstruct the topological structure of the grounding grid. A down conductor is selected as the coordinate origin, and a coordinate system is established according to the measurement area. Then, the magnetic field is measured along the x-axis and y-axis of the coordinate system, and differential calculations are performed to locate the first branch that intersects the x-axis and y-axis. Further, it is located along the x-axis or y-axis to see if there are other missed branches and to exclude false branches. Finally, the topological structure of the entire grounding grid is obtained, and a plan view of the grounding grid in the measurement area is drawn according to the topological structure.

[0041] In addition, in one embodiment, referring to Figure 5 ,exist Figure 1 Step S14 of the illustrated embodiment also includes but is not limited to the following steps: Step S51, determining the defect type of the first grounding grid topology diagram; Step S52, calculating the first resistivity and the second resistivity in the first grounding grid topology diagram according to the defect type, the node potential data, the soil resistivity and the second feedback current, wherein the first resistivity is the resistivity of the defective part, the second resistivity is the resistivity of the normal part, and the first resistivity is greater than the second resistivity; Step S53: using the first resistivity combined with resistivity imaging method to locate local defects in the first grounding grid topology map.

[0042] It should be noted that this embodiment uses bioresistivity imaging technology to locate grounding defects. Specifically, the resistivity of different tissues in the body has different resistivities under different physiological or pathological conditions. By applying the installation voltage, the corresponding voltage signal is measured in vitro to establish an internal resistivity distribution image. Furthermore, when the branch of the grounding grid has local defects such as fracture and corrosion, the resistivity of the defective part will increase. Therefore, the bioresistivity imaging method is used to locate local defects in the grounding system.

[0043] Specifically, by using the resistivity imaging method, taking the "grid" grounding grid partition as an example, a single-point corrosion fault is set in the grounding grid, and nine nodes in the grid are used as potential collection points. The corrosion defect is located according to the resistivity imaging method of the above embodiment. The obtained corrosion fault imaging result is as follows: Fig.11 and Fig.12 shown.

[0044] In actual use, the grounding grid structure includes but is not limited to the grid shape, U shape and L shape, and this embodiment does not make specific restrictions. Therefore, resistivity imaging can accurately locate the corrosion or breakpoint defects of the existing structure of the grounding grid, regardless of the structure of the grounding grid. In addition, this embodiment also conducts simulation tests on U-shaped and L-shaped grounding grids. The settings in the experiment are consistent with the grid shape, and the imaging results obtained are as follows: Fig.11 and Fig.12 shown.

[0045] In addition, in one embodiment, referring to Figure 6 ,exist Figure 1 After step S14 in the illustrated embodiment, the following steps are also included but not limited to: Step S61, obtaining a real-time monitoring current value of the ground resistance; Step S62, comparing the real-time monitored current value with the system safety threshold value preset in the alarm unit, when the real-time monitored current value is greater than the system safety threshold value, the alarm unit issues an alarm and performs a positioning operation on the grounding resistance.

[0046] It should be noted that by monitoring the current value of the grounding resistance, abnormal changes in the grounding system can be discovered in time. When the real-time current value of the grounding resistance exceeds the preset safety threshold value, the alarm unit can respond quickly and sound an alarm, thereby reminding the operator to take corresponding measures in time. Furthermore, this embodiment compares the real-time monitoring current value of the grounding resistance with the preset system safety threshold value, and combines positioning technology to accurately determine whether there are defects in the grounding resistance in the grounding grid in the measurement area, as well as the specific location of the defects, and promptly repair the defects in the grounding system, thereby reducing the occurrence of damage to equipment in the grounding system due to long-term exposure to abnormal currents.

[0047] like Figure 7 As shown, Figure 7 : is a structural diagram of a grounding system defect locating device provided by an embodiment of the present invention. The present invention also provides a grounding system defect locating device, comprising: The processor 701 may be implemented by a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application; The memory 702 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 702 can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 702, and the processor 701 calls and executes the grounding system defect location method of the embodiment of the present application; Input / output interface 703, used to implement information input and output; Communication interface 704, used to realize communication interaction between the present apparatus and other devices, which can be realized by wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.); A bus 705 that transmits information between various components of the device (e.g., the processor 701, the memory 702, the input / output interface 703, and the communication interface 704); The processor 701 , the memory 702 , the input / output interface 703 and the communication interface 704 are connected to each other in communication within the device via a bus 705 .

[0048] An embodiment of the present application also provides an electronic device, comprising the grounding system defect locating device as described above.

[0049] An embodiment of the present application further provides a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the above-mentioned grounding system defect locating method is implemented.

[0050] As a non-transient computer-readable storage medium, the memory can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof. The device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and are implemented to be located in one place, or may also be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0051] It will be appreciated by those skilled in the art that all or some of the steps and systems in the methods disclosed above may be implemented as software, firmware, hardware, and appropriate combinations thereof. Some or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or non-transitory medium) and a communication medium (or transient medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically include computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0052] The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions under the shared conditions without violating the spirit of the present invention. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A method for locating defects in a grounding system, characterized in that: Applied to a defect location system, the defect location system comprises a plurality of grounding resistors, a plurality of monitoring devices and a plurality of acquisition devices, the grounding resistors are respectively connected to the monitoring devices and the acquisition devices, and the grounding system defect location method comprises: The monitoring device injects a first current into the grounding resistor in a measurement area to obtain first feedback current information and first magnetic field strength information of the grounding resistor, wherein a plurality of current-carrying branches are arranged in the measurement area; Determine the position information of the plurality of current-carrying branches according to the first feedback current information and the first magnetic field strength information, draw a grounding grid plan view of the measurement area according to the position information, and reconstruct the grounding grid plan view into a first grounding grid topology map; The monitoring device injects a second current into the grounding resistor, so that the collecting device collects the second feedback current of the current monitoring device and the other monitoring devices; Node potential data and soil resistivity of the measurement area are obtained, and the grounding network defect position in the first grounding network topology diagram is obtained according to the node potential data, the soil resistivity and the second feedback current.

2. The method for locating grounding system defects according to claim 1, characterized in that: The grounding system is further provided with a current-carrying conductor, and the current-carrying conductor is respectively connected to the grounding resistor and the acquisition device. The grounding grid plan view is reconstructed into a first grounding grid topology view, including: Obtaining the soil magnetic permeability of the measurement area, the buried depth of the current-carrying conductor in the measurement area, the real-time current of the current-carrying conductor, and the vertical distance between the current-carrying conductor and the measurement point of the measurement area after the current-carrying conductor is buried in the measurement area; Calculate a first magnetic induction intensity of the current-carrying conductor according to the magnetic permeability, the buried depth, the real-time current and the vertical distance; A second magnetic induction intensity at the measuring point parallel to the measuring area is calculated according to the first magnetic induction intensity.

3. The method for locating grounding system defects according to claim 2, characterized in that: The second magnetic induction intensity of the measuring point parallel to the measuring area is calculated according to the first magnetic induction intensity, and is obtained according to the following formula: ； in, is the second magnetic induction intensity, is the soil magnetic permeability, I is the real-time current, h is the vertical distance, and y is the burial depth.

4. The method for locating a grounding system defect according to claim 1, characterized in that: The step of reconstructing the grounding grid plan view into a first grounding grid topology view comprises: Inputting a third current of different strengths to each of the ground resistors in the measurement area, and inputting a first magnetic field strength value before the second current is input and a second magnetic field strength value after the third current is input to the acquisition device; The grounding grid plan view is reconstructed into the first grounding grid topology view according to the first magnetic field strength value and the second magnetic field strength value.

5. The method for locating grounding system defects according to claim 1, characterized in that: Drawing a grounding grid plan view of the measurement area according to the location information includes: Selecting a coordinate origin of the measurement area and establishing a coordinate system according to the coordinate origin; Performing magnetic field measurement along the X-axis and the Y-axis of the coordinate system and performing differential calculation to locate a plurality of first branches where the X-axis intersects the Y-axis; A ground grid plan view of the measurement area is drawn according to the plurality of first branches.

6. The method for locating a grounding system defect according to claim 1, characterized in that: The obtaining of the grounding network defect position in the first grounding network topology map includes: Determining a defect type of the first grounding grid topology diagram; Calculate a first resistivity and a second resistivity in the first grounding grid topology map according to the defect type, the node potential data, the soil resistivity, and the second feedback current, wherein the first resistivity is the resistivity of the defective part, the second resistivity is the resistivity of the normal part, and the first resistivity is greater than the second resistivity; The first resistivity is combined with a resistivity imaging method to locate local defects in the first grounding grid topology map.

7. The method for locating a grounding system defect according to claim 1, characterized in that: The defect location system is further provided with an alarm unit, and the alarm unit is connected to the monitoring device and the acquisition device respectively. After obtaining the grounding network defect position in the first grounding network topology map, the method further includes: Obtaining a real-time monitoring current value of the grounding resistance; The real-time monitored current value is compared with a system safety threshold value preset in the alarm unit. When the real-time monitored current value is greater than the system safety threshold value, the alarm unit issues an alarm and performs a positioning operation on the grounding resistance.

8. A grounding system defect location device, characterized in that: It includes at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions that can be executed by the at least one control processor, and the instructions are executed by the at least one control processor to enable the at least one control processor to execute the grounding system defect locating method as described in any one of claims 1 to 7.

9. An electronic device, characterized in that: Including the grounding system defect locating device as described in claim 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the grounding system defect locating method according to any one of claims 1 to 7.

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