Chip bonding equipment with stable clamping function

By using the technology of automatic cutting and connecting bond wires in chip bonding equipment, the problem of alignment and overlapping of bond wires during replacement in existing equipment is solved, and stable clamping and efficient bonding are achieved.

CN119601475AActive Publication Date: 2025-03-11容泰半导体(江苏)有限公司
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Patent Information

Application Number
CN202411398118.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-09
Publication Date
2025-03-11
Estimated Expiration
2044-10-09

AI Technical Summary

Technical Problem

When existing bonding equipment replaces bonding wires, the bonding wires fail to align or overlap for the first time, causing the material to accumulate in the bonding zone, affecting the uniformity of the feeding, and the process is time-consuming and labor-intensive.

Method used

A chip bonding device with stable clamping function is adopted. The equipment includes a work cabinet, a bonding gun, a loading plate, a rotary part, a wire laying part, a coil number measurement module, a slider, a shear component and a guide component. By automatically cutting and connecting the bonding line, the stable replacement of the bonding line is achieved.

Benefits of technology

Automatic replacement of bonding wires is achieved, downtime is shortened, repeated calibration is avoided, feed uniformity is ensured, and chip bonding is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of bonding equipment, in particular to chip bonding equipment with a stable clamping function. Comprising a working cabinet, a bonding gun is arranged in the working cabinet, the working cabinet is fixedly connected with a bearing plate, the bearing plate is rotatably connected with rotating parts in mirror image distribution, the rotating parts are detachably provided with wire releasing parts, the wire releasing parts are wound with bonding wires, the bearing plate is provided with a coil number measuring module in mirror image distribution, and the wire number measuring module is connected with the bonding gun. The lower side of the bearing plate is provided with a first sliding part, and the first sliding part is fixedly connected with a delivery part which is used for conveying the bonding wires which are distributed on the wire releasing part in a mirror image manner. According to the invention, a mode of adding the standby bonding wire is adopted, so that after the bonding wire is used, the cutting and the connection of the bonding wire are automatically completed, the shutdown time is shortened, the bonding wire does not need to be calibrated repeatedly, and in the process of automatically replacing the bonding wire, the supplement of the standby bonding wire is manually completed in a simple and convenient mode.
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Description

Technical Field

[0001] The present invention relates to the technical field of bonding equipment, and in particular to a chip bonding equipment with a stable clamping function. Background Art

[0002] Chip bonding is the core link of semiconductor manufacturing. It connects different chips or wafer layers through physical methods to achieve three-dimensional integration and packaging of circuits.

[0003] In specific implementation, the chip is first fixed to the lead frame, and then the bonding wire (commonly used as metal wire) uses heat energy, pressure or ultrasonic energy to form a fusion or pressure welding connection between the contact point of the chip and the conductive pin of the frame, thereby establishing an electrical path between the chip and the external circuit board.

[0004] The existing bonding equipment consists of a feeding part, a bearing part, a force applying part, a heating part, a bonding part and a wire pay-off part. The wire pay-off part has a built-in winding roller on which the bonding wire is wound. During operation, if the bonding wire is exhausted, the equipment will pause so that the technician can replace it with a new wire. This process covers the cutting and connection of the bonding wire. During this period, the alignment of the ends of the two sections of bonding wire after cutting is particularly critical. If the first cutting fails to align or overlap occurs, repeated processing is required. Overlapping bonding wires can easily cause material accumulation in the bonding area, thereby affecting the uniformity of feeding, and this method is time-consuming and labor-intensive. Summary of the invention

[0005] In order to solve the problem that when replacing the bonding wires in the existing bonding equipment, the bonding wires may not be aligned for the first time or overlap and need to be reprocessed, and the overlapping bonding wires may cause the material to be pushed into the bonding area, thereby affecting the uniformity of the material feeding, and this method is time-consuming and labor-intensive, the present invention provides a chip bonding device with a stable clamping function.

[0006] The technical solution of the present invention is: a chip bonding device with a stable clamping function, comprising a work cabinet, a bonding gun is arranged in the work cabinet, a carrying plate is fixedly connected to the work cabinet, the carrying plate is rotatably connected to a rotating member with mirror distribution, a wire release member is detachably installed on the rotating member, the wire release member is wound with bonding wire, the carrying plate is provided with a coil turn measurement module with mirror distribution, a first sliding member is arranged on the lower side of the carrying plate, the first sliding member is fixedly connected to a delivery member for conveying the bonding wire on the wire release member with mirror distribution, and the bonding wire on the wire release member is fixedly connected to the bonding wire on the wire release member. The wire is connected to the bonding gun, the first sliding member is provided with a first shearing component for cutting the bonding wire on the delivery member, the first sliding member is provided with a first fixing component for keeping the bonding wire on the delivery member stable during the cutting process, the supporting plate is provided with a second shearing component, the second shearing component is used to cut the bonding wire on the wire release member with mirror distribution, the supporting plate is provided with a guiding component for guiding the bonding wire on the wire release member with mirror distribution, and the working cabinet is provided with a clamping component for clamping the chip.

[0007] In addition, it is particularly preferred that the first shearing assembly includes a fixed plate, the fixed plate is fixedly connected to the lower side of the carrying plate and is located above the first sliding member, the fixed plate is limitedly slidably connected to a first connecting rod, the first connecting rod is rotatably connected to two first shearing members that are both limitedly slidably connected to the fixed plate, the two first shearing members are cross-distributed, the fixed plate is provided with three sliding grooves, the first connecting rod is provided with springs in adjacent sliding grooves, the two first shearing members and the first connecting rod are respectively located in the three sliding grooves, the first sliding member is fixedly connected to a first electric drive member, and the telescopic end of the first electric drive member is extruded and fitted with the first connecting rod.

[0008] In addition, it is particularly preferred that the first fixed component includes a first extrusion frame, the first extrusion frame is slidably connected to the side of the first sliding member away from the supporting plate, the first extrusion frame is slidably matched with the telescopic part of the first electric drive member, a spring is arranged between the telescopic part of the first electric drive member and the first extrusion frame, the first sliding member is slidably connected to two staggered moving members on the side away from the supporting plate, the two staggered moving members are slidably matched with each other, the two staggered moving members are both extruded and matched with the first extrusion frame, the moving members are limitedly matched with adjacent bonding wires, a tension spring is arranged between the moving members and the first sliding member, and the supporting force provided to the two staggered moving members by adjacent tension springs is less than the supporting force provided to them by adjacent springs of the first extrusion frame.

[0009] In addition, it is particularly preferred that the second shearing assembly includes a mirror-image L-shaped fixing frame, the mirror-image L-shaped fixing frames are all fixedly connected to the bearing plate, the L-shaped fixing frames are located below the adjacent wire-releasing member, the opposite sides of the mirror-image L-shaped fixing frames are fixedly connected with a second electric drive component, the telescopic end of the second electric drive component is fixedly connected with a second extrusion frame, the mirror-image L-shaped fixing frames are all slidably connected with an L-shaped sliding frame, the second extrusion frame is extrusion-matched with the adjacent L-shaped sliding frame, and a tension spring is fixedly connected between the L-shaped sliding frame and the adjacent L-shaped fixing frame. The opposite sides of the L-shaped sliding frame distributed in a mirror image are slidably connected with a third extrusion frame, and the third extrusion frame is extruded and matched with the adjacent second extrusion frame. The opposite sides of the L-shaped sliding frame distributed in a mirror image are rotatably connected with a second connecting rod, and the second connecting rod is rotatably connected with two cross-distributed second shearing pieces, and a spring is arranged between two adjacent second shearing pieces, and two adjacent second shearing pieces are extruded and matched with the adjacent L-shaped sliding frame, and the third extrusion frame is provided with two pits, and the second shearing piece is limitedly matched with adjacent pits on the adjacent third extrusion frame.

[0010] In addition, it is particularly preferred that the supporting force provided by the spring between two adjacent second shearing members is smaller than the supporting force provided by the adjacent tension springs of the L-shaped sliding frame to it.

[0011] In addition, it is particularly preferred that the guide assembly includes sliding blocks with mirror-image distribution, and the sliding blocks with mirror-image distribution are all slidably connected to the supporting plate, the sliding block is located below the adjacent wire release member, and the sliding block is slidably connected to a second sliding member on the side of the sliding block facing away from the supporting plate, and a tension spring is fixedly connected between the second sliding member and the adjacent sliding block, and the sliding block and the adjacent second sliding member are used to guide the spare bonding wire, and a mirror-image extrusion block is fixedly connected to the upper side of the first sliding member, and the extrusion block is extrusion-matched with the adjacent second sliding member, and a second fixing component for fixing the adjacent bonding wires is provided on the sliding block.

[0012] In addition, it is particularly preferred that the second fixed component includes a first oil storage part, the first oil storage part is fixedly connected to the upper side of the adjacent sliding block, the third sliding part is slidably connected in the first oil storage part, a spring is arranged in the first oil storage part for compression fit with the adjacent third sliding part, the telescopic part of the second electric drive part is fixedly connected to the adjacent third sliding part through a connecting plate, the sliding block and the lower side of the adjacent second sliding part are both fixedly connected with a second oil storage part, the second oil storage part is slidably connected with a fourth sliding part for contact fit with the adjacent bonding wire, the sliding block is externally connected to a welding device for connecting the bonding wire in the fourth sliding part, the second oil storage part is connected to the adjacent first oil storage part through a connecting pipe, and hydraulic oil is stored between the first oil storage part, the adjacent connecting pipe and the adjacent second oil storage part.

[0013] In addition, it is particularly preferred that the clamping assembly includes a bearing platform, the bearing platform is fixedly connected in the work cabinet, the bearing platform is fixedly connected to two slide rails of different sizes, a plurality of electric sliders are arranged in the two slide rails, two adjacent electric sliders in the two slide rails are commonly fixedly connected to the sliding platform, the sliding platform is slidably connected with a mirror-distributed fifth sliding member and a mirror-distributed sixth sliding member, the mirror-distributed fifth sliding member and the adjacent and mirror-distributed sixth sliding member are cross-distributed, the mirror-distributed fifth sliding member is extruded and matched with the adjacent sixth sliding member, springs are arranged between the fifth sliding member and the adjacent sixth sliding member and the adjacent sliding platform, and a mirror-distributed extrusion member is fixedly connected to one side of the bearing platform, and the extrusion member is extruded and matched with the adjacent sixth sliding member.

[0014] In addition, it is particularly preferred that an air bag is further included, and the air bag is fixedly connected to the upper side of the sliding table. A third fixing component for fixing the chip is commonly provided on a plurality of the sliding tables.

[0015] In addition, it is particularly preferred that the third fixed component includes an air storage part, the air storage part is fixedly connected to the lower side of the adjacent sliding table, the sliding table is provided with a nine-square grid groove, the air storage part is connected with the adjacent nine-square grid groove through a connecting pipe, a sealing part is slidably connected to the air storage part, the air storage part is provided with air holes, and a mirror-distributed magnetic suction part is fixedly connected to the air storage part, the mirror-distributed magnetic suction parts are magnetically matched with the adjacent sealing parts, and the two sliding rails are fixedly connected with an extrusion plate, and the extrusion plate is extrusion-matched with several of the sealing parts.

[0016] The beneficial effects of the present invention are as follows: the present invention adopts the method of "adding spare bonding wires" so that after the bonding wires are used, the cutting and connection of the bonding wires are automatically completed, thereby shortening the downtime and eliminating the need to repeatedly calibrate the bonding wires. In addition, in the "bonding wire automatic replacement process", the "spare bonding wires" are manually supplemented in a simple manner. The chip is fixed in the center by moving the fifth sliding member and the adjacent sixth sliding member, and the chip is stably clamped and fixed in a clamping manner. When the bonding wires are used, the used bonding wires are fixed first, and then the used bonding wires and the spare bonding wires are fixed. The wires are cut uniformly to reduce the overlap between the used bonding wires and the spare bonding wires, avoid the overlapping bonding wires from piling up in the bonding area, affect the uniformity of the feeding, and even reduce the quality and efficiency of chip bonding. The used bonding wires and the spare bonding wires are clamped to facilitate the bonding of the used bonding wires and the spare bonding wires. Before the chip is bonded, it is fixed on the sliding table in a negative pressure fixing manner. The sliding table drives the chip to complete the bonding step, and under the action of the nine-square grid groove, the suction force of the negative pressure extraction is evenly distributed to avoid the single position of the chip being adsorbed, resulting in deformation of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front view of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the carrying plate of the present invention; Figure 3 is a three-dimensional structural cross-sectional view of the first sliding member of the present invention; Figure 4 A bottom view of the three-dimensional structure of the fixing plate of the present invention; Figure 5 It is a three-dimensional structural exploded view of the first extrusion frame and the moving part of the present invention; Figure 6 It is a three-dimensional structural cross-sectional view of the L-shaped fixing frame of the present invention; Figure 7 A bottom view of the three-dimensional structure of the L-shaped fixing frame of the present invention; Figure 8 It is a top view of the three-dimensional structure of the third extrusion frame of the present invention; Fig. 9 It is a three-dimensional structural exploded diagram of the sliding block and the second sliding member of the present invention; Fig.10 A top view of the three-dimensional structure of the carrier platform of the present invention; Fig.11 A bottom view of the three-dimensional structure of the slide rail of the present invention; Fig.12 It is a schematic diagram of the three-dimensional structure of the sliding table and the extrusion plate of the present invention; Fig.13It is a three-dimensional structural exploded view of the sliding platform, the fifth sliding member and the sixth sliding member of the present invention; Fig.14 It is a three-dimensional structural cross-sectional view of the sliding platform of the present invention.

[0018] The markings in the figure are: 10-working cabinet, 11-bonding gun, 12-carrying plate, 13-rotating part, 14-wire releasing part, 15-coil number measurement module, 16-first sliding part, 17-delivery part, 20-fixed plate, 21-first connecting rod, 22-first shearing part, 23-slideway, 24-first electric drive part, 30-first extrusion frame, 31-moving part, 40-L-shaped fixed frame, 41-second electric drive part, 42-second extrusion frame, 43-L-shaped sliding frame, 44-third Extrusion frame, 45-second connecting rod, 46-second shearing piece, 50-sliding block, 51-second sliding piece, 52-extrusion block, 60-first oil storage piece, 61-third sliding piece, 62-second oil storage piece, 63-fourth sliding piece, 70-carrying platform, 71-slide rail, 72-sliding platform, 73-fifth sliding piece, 74-sixth sliding piece, 75-extrusion piece, 8-air bag, 9-nine-square slot, 90-air storage piece, 91-sealing piece, 92-magnetic piece, 93-extrusion plate. DETAILED DESCRIPTION

[0019] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments, but the protection scope and application scope of the present invention are not limited.

[0020] In order to solve the problem that when replacing the bonding wires in the existing bonding equipment, the bonding wires fail to align for the first time or overlap and need to be reprocessed, and the overlapping bonding wires may cause the materials to be pushed into the bonding area, thereby affecting the uniformity of the feeding, and this method is laborious and time-consuming, the present invention adopts the method of "adding spare bonding wires", so that the bonding wires can be automatically cut and connected after use, shortening the downtime while eliminating the need for repeated calibration of the bonding wires, and in the "process of automatic replacement of the bonding wires", the "spare bonding wires" can be manually supplemented in a simple manner.

[0021] Example 1: A chip bonding device with a stable clamping function, please refer to Figure 1-Figure 4, including a work cabinet 10, a bonding gun 11 is arranged in the work cabinet 10, the bonding gun 11 is used to bond the chip, the bonding gun 11 is electrically connected to the remote control terminal (not marked in the figure), a carrying plate 12 is fixedly connected to the upper side of the work cabinet 10, the front side of the carrying plate 12 is limited and rotatably connected to two rotating parts 13 distributed in left and right mirror images, the rotating part 13 is electrically connected to the remote control terminal, the rotating part 13 is composed of an electric turntable fixed to each other and four fixed rods distributed in a ring array, the rotating part 13 is detachably installed with a wire release part 14, the wire release part 14 is wound with a bonding wire, the rotating part 13 is used to drive the adjacent wire release part 14 to rotate, so as to realize the release of the bonding wire on the wire release part 14, the carrying plate 12 is provided with two coil turn measurement modules 15 distributed in left and right mirror images, the coil turn measurement module 15 is used to monitor the number of remaining bonding wires on the adjacent wire release parts 14, the lower side of the carrying plate 12 is provided with an electric slide rail, the electric slide rail at the lower side of the carrying plate 12 The rail is slidably connected to a first sliding member 16 through an electric slider, a delivery member 17 is fixedly connected to the lower side of the first sliding member 16 (the delivery member 17 is an existing bonding wire feeding member), the delivery member 17 is used to transport the bonding wire on the wire release member 14 in use, the delivery member 17 is used to transport the bonding wire into the bonding gun 11, a first shearing component is arranged on the first sliding member 16, the first shearing component is used to cut the bonding wire on the delivery member 17 into a length that meets the requirements of the work, a first fixing component is arranged on the first sliding member 16 for keeping the bonding wire on the delivery member 17 stable during the cutting process, a second shearing component is arranged on the supporting plate 12, the second shearing component is used to cut the bonding wires on the two wire release members 14 distributed in a mirror image into a length that meets the requirements of the work, a guiding component is arranged on the supporting plate 12 for guiding the bonding wires on the wire release members 14 distributed in a mirror image, and a clamping component for clamping the chip is arranged in the working cabinet 10.

[0022] Please refer to Figure 2-Figure 5The first shearing assembly includes a fixed plate 20 fixed to the lower side of the carrier plate 12 and located above the first sliding member 16. The fixed plate 20 is limitedly slidably connected to a first connecting rod 21. The first connecting rod 21 is limitedly rotatably connected to two first shearing members 22 both of which are limitedly slidably connected to the fixed plate 20. The two first shearing members 22 are cross-distributed. The fixed plate 20 is provided with three slide grooves 23. The two slide grooves 23 distributed on the left and right are in an "inner eight state". The first connecting rod 21 is provided with a spring in the slide groove 23 located in the middle. The spring is used to drive the first connecting rod 21 to reset and move. The first connecting rod 21 moves to the front side. When the two first shearing members 22 are in the "eight-inner state", the rear sides of the two first shearing members 22 are respectively slid along the adjacent slide grooves 23. When the two slide grooves 23 distributed on the left and right are in the "eight-inner state", the front sides of the two first shearing members 22 are rotated inward, so as to realize the cutting of the bonding wire. The two first shearing members 22 and the first connecting rod 21 are respectively located in the three slide grooves 23. The first sliding member 16 is fixedly connected with a first electric drive member 24 electrically connected to the remote control terminal. The first electric drive member 24 is an electric push rod. The diameter of the front side of the telescopic part of the first electric drive member 24 is smaller than the diameter of the rear side. The telescopic end of the first electric drive member 24 is squeezed and fitted with the first connecting rod 21.

[0023] Please refer to Figure 3-Figure 5 The first fixed component includes a first extrusion frame 30 that is limitedly slidably connected to the front side of the first sliding member 16. The first extrusion frame 30 is limitedly slidably matched with the primary telescopic part of the first electric drive member 24. A spring is arranged between the primary telescopic part of the first electric drive member 24 and the first extrusion frame 30. The spring is used to drive the first extrusion frame 30 to reset and move. The front side of the first sliding member 16 is limitedly slidably connected with two staggered moving members 31. The two staggered moving members 31 slide and cooperate with each other. The two staggered moving members 31 are both limitedly matched with adjacent bonding wires. The moving member 31 is composed of sliding columns fixed to each other and L-shaped frames distributed at equal intervals. The bonding wire is fixed in an embracing manner by the two moving parts 31 moving toward each other, and the bonding wire is gradually moved toward the middle of the two moving parts 31 by the extrusion of the L-shaped frame inside the moving part 31, so as to realize the calibration of the bonding wire. The two moving parts 31 distributed in left and right mirror images are both extruded and matched with the first extrusion frame 30, and a tension spring is arranged between the moving part 31 and the first sliding part 16. This tension spring is used to drive the adjacent moving parts 31 to reset and move. The supporting force provided by the adjacent tension springs of the two staggered moving parts 31 is smaller than the supporting force provided by the adjacent springs of the first extrusion frame 30, so as to make the two moving parts 31 move before the first extrusion frame 30.

[0024] Please refer to Figure 2 and Figure 6-Figure 9The second shearing assembly includes two L-shaped fixed frames 40 distributed in left and right mirror images, the two L-shaped fixed frames 40 distributed in left and right mirror images are both fixedly connected to the front side of the carrying plate 12, the L-shaped fixed frames 40 are located below the adjacent wire release member 14, the opposite sides of the two L-shaped fixed frames 40 distributed in left and right mirror images are fixedly connected with a second electric drive component 41, the second electric drive component 41 is a secondary electric push rod, the second electric drive component 41 is electrically connected to the remote control terminal, the telescopic end of the second electric drive component 41 is fixedly connected with a second extrusion frame 42, the lower side of the second extrusion frame 42 is provided with an inclined surface, the two L-shaped fixed frames 40 distributed in left and right mirror images are both limitedly slidably connected with an L-shaped sliding frame 43, the second extrusion frame 42 is extruded and matched with the adjacent L-shaped sliding frame 43, a tension spring is fixedly connected between the L-shaped sliding frame 43 and the adjacent L-shaped fixed frames 40, the tension spring is used to drive the L-shaped sliding frame 43 to reset and move, the opposite sides of the two L-shaped sliding frames 43 distributed in left and right mirror images are A third extrusion frame 44 is connected with a limited sliding connection, and the back sides of the two third extrusion frames 44 distributed in left and right mirror images are provided with inclined surfaces, and the inclined surfaces on the third extrusion frame 44 are squeezed and matched with the inclined surfaces on the lower sides of the adjacent second extrusion frames 42, and the opposite sides of the two L-shaped sliding frames 43 distributed in left and right mirror images are rotatably connected with second connecting rods 45, and the second connecting rods 45 are rotatably connected with two cross-distributed second shearing pieces 46, and a spring is provided between the two adjacent second shearing pieces 46, and the supporting force provided by the spring between the two adjacent second shearing pieces 46 is less than the supporting force provided by the adjacent tension springs of the L-shaped sliding frames 43, and the cutting of the bonding wire is realized by the relative swinging of the two adjacent second shearing pieces 46, and the adjacent cross-distributed second shearing pieces 46 are squeezed and matched with the adjacent L-shaped sliding frames 43, and the third extrusion frame 44 is provided with two pits, and the second shearing piece 46 is limitedly matched with the adjacent pits on the adjacent third extrusion frame 44.

[0025] Please refer to Figure 2 , Figure 6 , Figure 7 and Fig. 9The guide assembly includes two sliding blocks 50 distributed in left and right mirror images, and the two sliding blocks 50 distributed in left and right mirror images are both slidably connected to the front side of the carrying plate 12. The sliding block 50 is located below the adjacent wire-releasing member 14. The front side of the sliding block 50 is limited and slidably connected with two sliding members 51. A tension spring is fixedly connected between the second sliding member 51 and the adjacent sliding block 50. This tension spring is used to drive the adjacent second sliding member 51 to reset and move. The sliding block 50 and the adjacent second sliding member 51 are used to guide the spare bonding wire. The upper side of the first sliding member 16 is fixedly connected with two extrusion blocks 52 distributed in left and right mirror images. The cross-section of the extrusion block 52 is triangular, and a triangular notch is provided on the rear side of the second sliding member 51. The triangular notch on the rear side of the second sliding member 51 is extruded and matched with the adjacent extrusion block 52. When the extrusion block 52 squeezes the triangular notch on the rear side of the adjacent second sliding member 51, the second sliding member 51 moves forward. A second fixing component for fixing the adjacent bonding wires is provided on the sliding block 50.

[0026] Please refer to Figure 6 , Figure 7 and Fig. 9 The second fixed component includes a first oil storage member 60 fixedly connected to the upper side of the adjacent sliding block 50, and a third sliding member 61 is sealed and slidably connected in the first oil storage member 60. The third sliding member 61 is not sealed with the upper side of the adjacent first oil storage member 60. A spring that is pressed and matched with the adjacent third sliding member 61 is provided in the first oil storage member 60. The spring is used to drive the adjacent third sliding member 61 to reset and move. The secondary telescopic portion of the second electric drive member 41 is fixedly connected to the adjacent third sliding member 61 through a connecting plate. The sliding block 50 and The lower side of the adjacent second sliding parts 51 is fixedly connected with a second oil storage part 62, and the second oil storage part 62 is sealed and slidably connected with a fourth sliding part 63, the fourth sliding part 63 is in contact and cooperate with the adjacent bonding wire, and the sliding block 50 is externally connected to a welding device (existing mechanism, not marked in the figure), the welding equipment is used to weld the bonding wire, the second oil storage part 62 is connected to the adjacent first oil storage part 60 through a connecting pipe, and hydraulic oil is stored between the first oil storage part 60, the adjacent connecting pipe and the adjacent second oil storage part 62.

[0027] Please refer to Figure 1 and Figure 10-13The clamping assembly includes a carrier 70 fixedly connected to the work cabinet 10. The carrier 70 is fixedly connected to two slide rails 71 of different sizes. The size of the inner slide rail 71 on the carrier 70 is smaller than the size of the outer slide rail 71 on the carrier 70. The distance between the two slide rails 71 is always consistent. Two groups of electric sliders are arranged in the two slide rails 71, each group is composed of two electric sliders. Two adjacent electric sliders in the two slide rails 71 are fixedly connected to a sliding table 72. The sliding table 72 is a carrier table for carrying chips. The sliding table 72 is slidably connected to two fifth sliding members 73 and two sixth sliding members 74 distributed in a mirror image. The two mirror-distributed fifth sliding members 73 and the two adjacent and mirror-distributed sixth sliding members 74 are cross-distributed. The two mirror-distributed fifth sliding members 73 are squeezed and matched with the adjacent sixth sliding member 74. A spring is provided between the fifth sliding member 73 and the adjacent sliding table 72. This spring is used to drive the adjacent fifth sliding member 73 to reset and move. A spring is provided between the sixth sliding member 74 and the adjacent sliding table 72. This spring is used to drive the adjacent sixth sliding member 74 to reset and move. Two extrusion members 75 with mirror-distributed left and right are fixed to the right side of the supporting platform 70. The extrusion member 75 is squeezed and matched with the adjacent sixth sliding member 74.

[0028] Before using this device to bond the chip, the staff starts all the electric sliders in the two slide rails 71. Taking the movement process of two adjacent electric sliders as an example, the two adjacent electric sliders drive the adjacent sliding tables 72 to move counterclockwise along the two slide rails 71. During this process, the staff places the chip on the sliding table 72 located on the left side of the carrier table 70, and the two adjacent electric sliders drive the adjacent sliding tables 72, the carrier table 70 and its accessories to move.

[0029] When two adjacent electric sliders drive the adjacent sliding tables 72 to move to the front curved parts of the two slide rails 71, the two adjacent electric sliders drive the adjacent sliding tables 72 to change directions (change the front and rear directions of the sliding tables 72), so that the two adjacent electric sliders drive the adjacent sliding tables 72 to move toward the right rear side of the supporting platform 70.

[0030] When two adjacent electric sliders drive the adjacent sliding tables 72 to move until the two adjacent sixth sliding members 74 contact the two adjacent extrusion members 75 respectively, the sixth sliding member 74 is squeezed by the adjacent extrusion members 75 to move in the direction of the chip. During the movement of the sixth sliding member 74, the adjacent spring and the adjacent fifth sliding member 73 are squeezed. Through the movement of the fifth sliding member 73 and the adjacent sixth sliding member 74, the chip is centered and fixed, and the chip is stably clamped and fixed in a clamping manner.

[0031] After the chip is fixed, the two adjacent electric sliders stop moving temporarily, and the bonding gun 11 performs bonding operation on the chip (the bonding process is consistent with the existing method). During the chip bonding process, the rotating part 13 on the right drives the adjacent wire release part 14 to rotate, and then the delivery part 17 transfers the bonding wire on the wire release part 14 to the bonding gun 11, thereby completing the transfer of the bonding wire.

[0032] When the chip mentioned above is bonded, the two adjacent electric sliders drive the sliding table 72, the chip and its accessories to move to the rear side. When the sliding table 72 drives the two adjacent sixth sliding members 74 to release from the adjacent extrusion members 75, the two adjacent sixth sliding members 74 are reset and moved under the action of adjacent springs to lose the extrusion of the adjacent fifth sliding member 73. The fifth sliding member 73 is reset and moved under the action of adjacent springs. The clamping and fixation of the chip are released by the reset movement of the sixth sliding member 74 and the fifth sliding member 73, thereby facilitating the removal of the chip.

[0033] When the bonding wire on the wire release component 14 is in the process of being released, the coil turn number measuring module 15 monitors the bonding wire on the wire release component 14. When the bonding wire on the wire release component 14 is used up, the coil turn number measuring module 15 transmits a signal to the remote control terminal, and the remote control terminal controls the delivery component 17 to no longer deliver the bonding wire, and no longer controls the bonding gun 11 to bond the chip.

[0034] When the bonding wire on the wire release component 14 is used up, the remote control terminal controls all the electric sliders to stop moving, and then the remote control terminal controls the telescopic part of the first electric drive component 24 to move forward. The telescopic part of the first electric drive component 24 drives the first extrusion frame 30 to move forward through the spring, so that the first extrusion frame 30 squeezes the two moving parts 31, and the two moving parts 31 then move toward each other crosswise. The adjacent tension springs are stretched during the movement of the moving parts 31. The bonding wire is limited and fixed during the movement of the two moving parts 31. Under the action of the two moving parts 31 moving toward each other, the bonding wire is gradually moved toward the middle of the moving part 31 during the extrusion process, thereby completing the limitation of the position of the bonding wire.

[0035] When the two moving parts 31 move to a position sufficient to fix the bonding wire, the telescopic part of the first electric drive part 24 squeezes the adjacent springs and slides along the first extrusion frame 30. During the forward movement of the telescopic part of the first electric drive part 24, the first connecting rod 21 is squeezed forward, so that the first connecting rod 21 drives the two first shearing parts 22 to move forward. During the forward movement of the first connecting rod 21, it moves forward along the slide groove 23 located in the middle and squeezes the adjacent springs. Under the action of the first connecting rod 21 moving forward, the first connecting rod 21 drives the two first shearing parts 22 to move forward synchronously, and under the action of the first shearing part 22 sliding along the adjacent slide groove 23, the two first shearing parts 22 are rotated along the first connecting rod 21, so as to realize the cutting of the bonding wire around the first sliding part 16, so that the bonding wire around the first sliding part 16 can be kept at a fixed length.

[0036] After the cutting of the bonding wires around the first sliding member 16 is completed, the electric slider on the lower inner side of the supporting plate 12 drives the first sliding member 16 and its accessory parts to move to the left. After the first sliding member 16 moves to the left until the telescopic part of the first electric drive member 24 is no longer in contact with the first connecting rod 21, the first connecting rod 21 drives the two first shearing members 22 to move backward under the action of the adjacent springs. Under the action of the first shearing member 22 moving along the adjacent slide groove 23, the first shearing member 22 is reset and rotated along the first connecting rod 21.

[0037] During the process of the first sliding member 16 driving its accessory parts to move to the left side (taking the movement process of the accessory parts on the left L-shaped sliding frame 43 as an example), the second electric drive member 41 is controlled by the remote control terminal to move the first-level telescopic part downward, and the first-level telescopic part of the second electric drive member 41 drives the second extrusion frame 42 to move downward. Under the action of the support force provided by the spring between the two second shearing members 46 to the two is less than the support force provided by the adjacent tension spring of the L-shaped sliding frame 43, the second extrusion frame 42 squeezes the adjacent third extrusion frame 44 to move to the right side. In the process of the third extrusion frame 44 moving to the right side, it squeezes the two adjacent second shearing members 46, so that the two adjacent second shearing members 46 rotate along the adjacent second connecting rods 45 and squeeze the adjacent springs. In the process of the rotation of the two adjacent second shearing members 46, the bonding wires around the third extrusion frame 44 are cut.

[0038] When the second extrusion frame 42 squeezes the third extrusion frame 44 to the point where the two adjacent second shearing pieces 46 are sufficient to cut the surrounding bonding wires, the left sides of the two adjacent second shearing pieces 46 are respectively located in the pits in the third extrusion frame 44. At this time, the third extrusion frame 44 is squeezed to the extreme position, and the first-level telescopic part of the second electric drive component 41 drives the third extrusion frame 44 and the L-shaped sliding frame 43 and its accessory parts to move downward synchronously (the adjacent tension springs are stretched during the downward movement of the L-shaped sliding frame 43).

[0039] When the first-stage telescopic part of the second electric drive component 41 moves to the extreme position (the first-stage telescopic part of the second electric drive component 41 extends out to the extreme length), all the accessory parts on the upper side of the L-shaped sliding frame 43 are located below the first sliding component 16, and then the second telescopic part of the second electric drive component 41 is controlled by the remote control terminal, so that the second telescopic part of the second electric drive component 41 drives the adjacent third sliding component 61, the adjacent first oil storage component 60, the adjacent sliding block 50, the adjacent second sliding component 51 and the first-stage telescopic part of the second electric drive component 41 to move downward synchronously through the connecting plate (at this time, the resistance to the movement of the sliding block 50 is less than the extrusion force provided by the adjacent spring in the first oil storage component 60 on the adjacent third sliding component 61).

[0040] During the movement of the above parts, when the first sliding member 16 drives its attached parts to move to the middle of the first sliding member 16 and is on the same vertical line as the adjacent sliding block 50 , the two squeezing blocks 52 on the first sliding member 16 are respectively located on the left and right sides below the adjacent sliding block 50 .

[0041] When the second telescopic part of the second electric drive component 41 drives the adjacent sliding block 50 to move to its lower side and fit with the supporting plate 12, the bonding wire on the first sliding component 16 contacts the bonding wire on the adjacent sliding block 50, and the second telescopic part of the second electric drive component 41 drives the third sliding component 61 to move downward through the connecting plate (the adjacent spring is squeezed during the movement of the third sliding component 61), so that the hydraulic oil in the first oil storage component 60 is respectively transported to the two adjacent second oil storage components 62 through two adjacent connecting pipes, so that the two adjacent fourth sliding components 63 move toward each other, and the bonding wires on the adjacent sliding blocks 50 and the bonding wires on the first sliding component 16 are squeezed and fixed, and then the two bonding wires mentioned above are processed by the welding equipment external to the sliding block 50, so that the two bonding wires are combined into one, thereby realizing unmanned connection of the bonding wires.

[0042] During the unmanned connection of the bonding wire, the staff removes the old wire-releasing component 14 (the wire-releasing component 14 located on the right side in the present invention), and then places the new wire-releasing component 14 on the adjacent rotating component 13. The staff then places the bonding wire on the new wire-releasing component 14 between the adjacent sliding blocks 50 and the second sliding component 51, thereby completing the replacement of the spare wire-releasing component 14.

[0043] When the processing of the bonding wire is completed, the bonding wire on the sliding block 50 and the bonding wire on the first sliding member 16 are combined into "a complete bonding wire". At this time, the second telescopic part of the second electric drive part 41 on the right is moved upward and reset by the remote control terminal. The first oil storage part 60 slides relative to the third sliding member 61 under the action of the adjacent spring, so that the hydraulic oil in the two adjacent second oil storage parts 62 enters the first oil storage part 60 through the adjacent connecting pipes respectively, so that the two fourth sliding members 63 no longer squeeze the bonding wire. Subsequently, the electric slider located on the lower side of the carrier plate 12 is controlled by the remote control terminal to drive the first sliding member 16 and its attached parts to move toward the middle of the carrier plate 12. During the process of the first sliding member 16 driving the two extrusion blocks 52 to move to the right and reset, the extrusion block 52 on the left squeezes the adjacent second sliding member 51, so that the second sliding member 51 moves to the front side to break away from the fixation of the adjacent bonding wire (the adjacent tension spring is stretched during the movement of the second sliding member 51).

[0044] When the bonding wire is out of contact with the adjacent second sliding member 51 and the sliding block 50, the extrusion block 52 no longer squeezes the adjacent second sliding member 51, and the second sliding member 51 is reset and moved under the action of the adjacent tension spring. After the first sliding member 16 and its accessory parts move to the middle of the carrier plate 12, the replacement of the bonding wire is completed, and then the rotating member 13 on the left is controlled to rotate by the remote control terminal to release the bonding wire on the adjacent wire release member 14, and finally the delivery member 17 delivers the bonding wire to restore the bonding to the chip.

[0045] After the first sliding member 16 and its attached parts move to the middle of the carrying plate 12, the telescopic portion of the second electric drive member 41 on the left side drives the third sliding member 61, the adjacent sliding block 50 and its attached parts to move upward through the adjacent connecting plate. After the telescopic portion of the second electric drive member 41 on the left side retracts to the basic state, the telescopic portion of the first electric drive member 24 on the left side drives the second extrusion frame 42 to move upward and reset, and the L-shaped sliding frame 43 moves and resets under the action of the adjacent tension spring. The above-mentioned parts move to Figure 7 and Figure 8 After the state is reached, the movement stops, at which time the third extrusion frame 44 no longer extrudes the two adjacent second shearing members 46, and the two adjacent second shearing members 46 are reset under the action of the adjacent springs.

[0046] When the bonding wire needs to be replaced again, the above steps can be repeated. When the chip no longer needs to be bonded, the staff can turn off the above-mentioned power components.

[0047] Example 2: Based on Example 1, please refer to Fig.12 and Fig.13, and also includes an airbag 8, which is fixed to the upper side of the sliding table 72. The airbag 8 is used to provide a flexible pad for the lower side of the chip. The two sliding tables 72 are jointly provided with a third fixing component for fixing the chip in a negative pressure fixing manner (in the present invention, the number of sliding tables 72 is only for example and not limited).

[0048] Please refer to Figure 10-Figure 14 The third fixing component includes an air storage member 90 fixedly connected to the lower side of the adjacent sliding platform 72. The sliding platform 72 is provided with a nine-square slot 9. The air storage member 90 is connected to the adjacent nine-square slot 9 through a connecting pipe. A sealing member 91 is sealed and slidably connected in the air storage member 90. The sealing member 91 is made of metal. The air storage member 90 is provided with air holes. Two magnetic suction members 92 distributed in a mirror image are fixedly connected in the air storage member 90. The two magnetic suction members 92 distributed in a mirror image are magnetically matched with the adjacent sealing member 91. The magnetic suction member 92 is an annular magnet. The magnetic suction member 92 is used to magnetically attract the adjacent sealing member 91. The two The slide rails 71 are all fixedly connected with an extrusion plate 93, and the extrusion plate 93 is provided with an inclined surface. The extrusion plate 93 is extruded and matched with the two seals 91, and the seals 91 are extruded and matched with the inclined surfaces on the adjacent extrusion plates 93. Through the cooperation between the seals 91 and the inclined surfaces on the adjacent extrusion plates 93, the seals 91 slide in the adjacent gas storage parts 90 and extract the gas in the nine-grid grooves 9 to create a negative pressure fixed environment between the chip and the adjacent nine-grid grooves 9. Under the action of the nine-grid grooves 9, the suction force of the negative pressure extraction is evenly distributed to avoid adsorption of a single position of the chip, which causes deformation of the chip.

[0049] When the sliding table 72 transports the chip, the chip contacts the upper side of the airbag 8, providing a flexible pad for the lower side of the chip to prevent the chip from being squeezed by the adjacent fifth sliding member 73 and the sixth sliding member 74, causing hard friction between the chip and the upper side of the sliding table 72, resulting in chip damage and other problems.

[0050] After the chip is placed on the upper side of the sliding table 72, the chip is located on the upper side of the adjacent nine-grid slot 9. At this time, the two electric sliders drive the sliding table 72 to move until the seal 91 contacts the inclined surface of the right extrusion plate 93, so that the seal 91 moves to the side away from the adjacent extrusion plate 93. During the movement of the seal 91, the gas between the chip and the nine-grid slot 9 is extracted through the connecting pipe to create a negative pressure fixed environment between the chip and the adjacent nine-grid slot 9. Under the action of the nine-grid slot 9, the suction force of the negative pressure extraction is evenly distributed to avoid adsorption of a single position of the chip, which causes deformation of the chip.

[0051] After the sealing member 91 is squeezed by the adjacent squeezing plate 93 until it contacts the adjacent magnetic attraction member 92 , the sealing member 91 is fixed to ensure the sealing degree between the chip and the nine-grid slot 9 .

[0052] When the chip is bonded and transferred from the right side to the left side of the carrier 70, the extrusion plate 93 located on the inner slide rail 71 squeezes the adjacent seal 91, so that the seal 91 is separated from the adjacent magnetic component 92 (thereby making the seal 91 contact with another adjacent magnetic component 92, thereby ensuring that the seal 91 does not slide freely after being moved and reset), and pushes the gas in the adjacent gas storage component 90 back into the space between the chip and the adjacent nine-square grid slot 9 through the connecting pipe, thereby releasing the fixation of the chip and allowing the chip to be taken out.

[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present invention.

Claims

1. A chip bonding device with a stable clamping function, comprising a work cabinet (10), a bonding gun (11) being arranged in the work cabinet (10), and a carrier plate (12) being fixedly connected to the work cabinet (10), wherein: It also includes a mirror-distributed rotating member (13), the mirror-distributed rotating members (13) are all rotatably connected to the carrier plate (12), the rotating member (13) is detachably mounted with a wire release member (14), the wire release member (14) is wound with a bonding wire, the carrier plate (12) is provided with a mirror-distributed coil number measurement module (15), the lower side of the carrier plate (12) is provided with a first sliding member (16), the first sliding member (16) is fixedly connected with a delivery member (17) for conveying the bonding wire on the mirror-distributed wire release member (14), the bonding wire on the wire release member (14) is connected to the bonding gun (11), The first sliding member (16) is provided with a first cutting component for cutting the bonding wire on the delivery member (17); the first sliding member (16) is provided with a first fixing component for keeping the bonding wire on the delivery member (17) stable during the cutting process; the supporting plate (12) is provided with a second cutting component, the second cutting component is used to cut the bonding wire on the wire release member (14) distributed in a mirror image; the supporting plate (12) is provided with a guiding component for guiding the bonding wire on the wire release member (14) distributed in a mirror image; and the working cabinet (10) is provided with a clamping component for clamping the chip.

2. A chip bonding device with a stable clamping function according to claim 1, characterized in that: The first shearing assembly comprises a fixed plate (20), wherein the fixed plate (20) is fixedly connected to the lower side of the bearing plate (12) and is located above the first sliding member (16); the fixed plate (20) is connected to a first connecting rod (21) in a limited sliding manner; the first connecting rod (21) is rotatably connected to two first shearing members (22) both of which are connected to the fixed plate (20) in a limited sliding manner; the two first shearing members (22) are cross-distributed; the fixed plate (20) is provided with three sliding grooves (23); the first connecting rod (21) is provided with springs in adjacent sliding grooves (23); the two first shearing members (22) and the first connecting rod (21) are respectively located in the three sliding grooves (23); the first sliding member (16) is fixedly connected to a first electric drive member (24); the telescopic end of the first electric drive member (24) is pressed and matched with the first connecting rod (21).

3. A chip bonding device with stable clamping function according to claim 2, characterized in that: The first fixed component comprises a first extrusion frame (30), the first extrusion frame (30) being slidably connected to a side of the first sliding member (16) away from the bearing plate (12), the first extrusion frame (30) being slidably matched with the telescopic part of the first electric drive member (24), a spring being arranged between the telescopic part of the first electric drive member (24) and the first extrusion frame (30), the side of the first sliding member (16) away from the bearing plate (12) being slidably connected with two staggered movable members (31), the two staggered movable members (31) being slidably matched with each other, the two staggered movable members (31) being both extruded and matched with the first extrusion frame (30), the movable members (31) being limitedly matched with adjacent bonding wires, a tension spring being arranged between the movable members (31) and the first sliding member (16), the supporting force provided to the two staggered movable members (31) by the adjacent tension springs being smaller than the supporting force provided to the two staggered movable members by the adjacent springs of the first extrusion frame (30).

4. A chip bonding device with a stable clamping function according to claim 3, characterized in that: The second shearing assembly comprises a mirror-distributed L-shaped fixing frame (40), the mirror-distributed L-shaped fixing frame (40) is fixedly connected to the bearing plate (12), the L-shaped fixing frame (40) is located below the adjacent wire-releasing member (14), the opposite sides of the mirror-distributed L-shaped fixing frame (40) are fixedly connected with a second electric drive member (41), the telescopic end of the second electric drive member (41) is fixedly connected with a second extrusion frame (42), the mirror-distributed L-shaped fixing frame (40) is slidably connected with an L-shaped sliding frame (43), the second extrusion frame (42) is extruded and matched with the adjacent L-shaped sliding frame (43), a tension spring is fixedly connected between the L-shaped sliding frame (43) and the adjacent L-shaped fixing frame (40), and the mirror-distributed L-shaped fixing frame (40) is fixedly connected with a second electric drive member (41). The opposite sides of the L-shaped sliding frame (43) are slidably connected to the third extrusion frame (44), and the third extrusion frame (44) is extruded and matched with the adjacent second extrusion frame (42). The opposite sides of the L-shaped sliding frame (43) are rotatably connected to the second connecting rod (45), and the second connecting rod (45) is rotatably connected to two cross-distributed second shearing members (46), a spring is provided between two adjacent second shearing members (46), and two adjacent second shearing members (46) are extruded and matched with the adjacent L-shaped sliding frame (43), and the third extrusion frame (44) is provided with two pits, and the second shearing member (46) is limitedly matched with the adjacent pits on the adjacent third extrusion frame (44).

5. A chip bonding device with a stable clamping function according to claim 4, characterized in that: The supporting force provided by the spring between two adjacent second shearing members (46) is smaller than the supporting force provided by the adjacent tension springs of the L-shaped sliding frame (43).

6. A chip bonding device with stable clamping function according to claim 4, characterized in that: The guide assembly comprises a mirror-distributed sliding block (50), the mirror-distributed sliding blocks (50) are all slidably connected to the supporting plate (12), the sliding block (50) is located below the adjacent wire release member (14), the sliding block (50) is slidably connected to a second sliding member (51) on the side of the sliding block (50) facing away from the supporting plate (12), a tension spring is fixedly connected between the second sliding member (51) and the adjacent sliding block (50), the sliding block (50) and the adjacent second sliding member (51) are used to guide the spare bonding wire, the upper side of the first sliding member (16) is fixedly connected to a mirror-distributed extrusion block (52), the extrusion block (52) is extruded and matched with the adjacent second sliding member (51), and a second fixing component for fixing the adjacent bonding wire is arranged on the sliding block (50).

7. A chip bonding device with a stable clamping function according to claim 6, characterized in that: The second fixed assembly comprises a first oil storage member (60), the first oil storage member (60) being fixedly connected to the upper side of the adjacent sliding block (50), a third sliding member (61) being slidably connected in the first oil storage member (60), a spring being arranged in the first oil storage member (60) for compression fit with the adjacent third sliding member (61), the telescopic portion of the second electric drive member (41) being fixedly connected to the adjacent third sliding member (61) via a connecting plate, the sliding block (50) being connected to the adjacent second sliding member ( A second oil storage member (62) is fixedly connected to the lower side of each of the plurality of sliding blocks (51), a fourth sliding member (63) which is in sliding connection with an adjacent bonding wire is slidably connected inside the second oil storage member (62), a welding device for connecting the bonding wire inside the fourth sliding member (63) is externally connected to the sliding block (50), the second oil storage member (62) is connected to the adjacent first oil storage member (60) through a connecting pipe, and hydraulic oil is stored between the first oil storage member (60), the adjacent connecting pipe and the adjacent second oil storage member (62).

8. A chip bonding device with a stable clamping function according to claim 1, characterized in that: The clamping assembly comprises a bearing platform (70), the bearing platform (70) being fixedly connected to the working cabinet (10), the bearing platform (70) being fixedly connected to two slide rails (71) of different sizes, a plurality of electric sliders being arranged in each of the two slide rails (71), two adjacent electric sliders in the two slide rails (71) being fixedly connected to a sliding platform (72), the sliding platform (72) being slidably connected to a fifth sliding member (73) and a sixth sliding member (74) which are arranged in a mirror image, the fifth sliding member (73) and the sixth sliding member (74) which are arranged in a mirror image The sliding member (73) and the adjacent and mirror-distributed sixth sliding member (74) are cross-distributed, the mirror-distributed fifth sliding member (73) is squeezed and matched with the adjacent sixth sliding member (74), springs are arranged between the fifth sliding member (73) and the adjacent sixth sliding member (74) and the adjacent sliding platform (72), and a mirror-distributed extrusion member (75) is fixed to one side of the support platform (70), and the extrusion member (75) is squeezed and matched with the adjacent sixth sliding member (74).

9. A chip bonding device with a stable clamping function according to claim 8, characterized in that: It also includes an air bag (8), the air bag (8) being fixedly connected to the upper side of the sliding platform (72), and a third fixing component for fixing the chip is commonly provided on a plurality of the sliding platforms (72).

10. A chip bonding device with a stable clamping function according to claim 9, characterized in that: The third fixed component comprises an air storage component (90), the air storage component (90) is fixedly connected to the lower side of the adjacent sliding platform (72), the sliding platform (72) is provided with a nine-square grid groove (9), the air storage component (90) is connected to the adjacent nine-square grid groove (9) through a connecting pipe, a sealing component (91) is slidably connected to the air storage component (90), the air storage component (90) is provided with an air hole, a mirror-distributed magnetic suction component (92) is fixedly connected to the air storage component (90), the mirror-distributed magnetic suction components (92) are magnetically matched with the adjacent sealing components (91), and the two sliding rails (71) are fixedly connected with an extrusion plate (93), and the extrusion plate (93) is extruded and matched with a plurality of the sealing components (91).

Citation Information

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