Chip transfer and fixed connection device and chip transfer and fixed connection method

Abstract

The invention provides chip transferring and fixedly connecting equipment and a chip transferring and fixedly connecting method. The chip transfer and fixed connection device comprises a signal control module, a substrate preheating module and a chip fixed connection module. The substrate preheating module is allowed to be configured to preheat the circuit substrate at a predetermined preheating temperature through the control of the signal control module, so that a plurality of welding materials arranged between each chip and the circuit substrate are preheated through the predetermined preheating temperature provided by the substrate preheating module. The chip fixing module is configured to instantly heat a plurality of welding materials arranged between each chip and the circuit substrate at a preset heating temperature under the control of the signal control module. When the substrate preheating module and the chip fixing module are selectively configured and used at the same time, the substrate preheating module is configured to be used for providing a preset preheating temperature, and the chip fixing module is configured to be used for providing a preset heating temperature.

Description

Technical Field

[0001] The present invention relates to a transfer and fixing device and a transfer and fixing method, and in particular to a chip transfer and fixing device and a chip transfer and fixing method. Background Art

[0002] In the prior art, a semiconductor chip needs to be bonded to a circuit board through a soldering furnace. However, the prior art chip bonding devices and chip bonding methods still have room for improvement. Summary of the invention

[0003] The problem to be improved or solved by the present invention is to provide a chip transfer and fixing device and a chip transfer and fixing method in view of the deficiencies in the prior art.

[0004] In order to improve or solve the above-mentioned problems, one of the technical means adopted by the present invention is to provide a chip transfer and fixing device, which includes: a signal control module, a substrate carrying module, a chip transfer module, a substrate preheating module and a chip fixing module. The substrate carrying module is electrically connected to the signal control module. The chip transfer module is electrically connected to the signal control module and is movably arranged above the substrate carrying module. The substrate preheating module is electrically connected to the signal control module and is configured to correspond to the substrate carrying module. The chip fixing module is electrically connected to the signal control module and is configured to correspond to the substrate carrying module. Wherein, when the substrate carrying module is selectively configured for use, the substrate carrying module allows to be configured to carry a circuit substrate through the control of the signal control module; wherein, when the chip transfer module is selectively configured for use, the chip transfer module allows to be configured to transfer multiple chips to the circuit substrate through the control of the signal control module; wherein, when the substrate preheating module is selectively configured for use, the substrate preheating module allows to be configured to preheat the circuit substrate to a predetermined preheating temperature through the control of the signal control module, thereby allowing multiple welding materials arranged between each chip and the circuit substrate to be preheated by the predetermined preheating temperature provided by the substrate preheating module; wherein, when the chip fixing module is selectively configured for use, the chip fixing module allows to be configured to instantaneously heat multiple welding materials arranged between each chip and the circuit substrate to a predetermined heating temperature through the control of the signal control module; wherein, when the substrate preheating module and the chip fixing module are selectively configured and used simultaneously, the substrate preheating module is configured to provide the predetermined preheating temperature, and the chip fixing module is configured to provide the predetermined heating temperature.

[0005] In order to improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide a chip transfer and fixing device, which includes: a signal control module, a substrate carrying module, a chip transfer module, a substrate preheating module and a chip fixing module. The chip transfer module is electrically connected to the signal control module and can be movably arranged above the substrate carrying module. The substrate preheating module is electrically connected to the signal control module. The chip fixing module is electrically connected to the signal control module. Among them, when the substrate preheating module and the chip fixing module are selectively configured and used at the same time, the substrate preheating module is configured to provide a predetermined preheating temperature, and the chip fixing module is configured to provide a predetermined heating temperature.

[0006] In order to improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide a chip transfer and fixing method, which includes: carrying a circuit substrate through a substrate carrying module; transferring multiple chips to the circuit substrate through a chip transfer module; preheating the circuit substrate to a predetermined preheating temperature through a substrate preheating module, so that multiple welding materials arranged between each chip and the circuit substrate are preheated by the predetermined preheating temperature provided by the substrate preheating module; and, while the step of preheating the circuit substrate to a predetermined preheating temperature through the substrate preheating module continues, instantaneously heating the multiple welding materials arranged between each chip and the circuit substrate to a predetermined heating temperature through a chip fixing module. Wherein, when the substrate preheating module and the chip fixing module are selectively configured and used simultaneously, the substrate preheating module is configured to provide a predetermined preheating temperature, and the chip fixing module is configured to provide a predetermined heating temperature.

[0007] One of the beneficial effects of the present invention is that the chip transfer and fixing device provided by the present invention can adopt the technical scheme of "the substrate preheating module is configured to provide a predetermined preheating temperature" and "the chip fixing module is configured to provide a predetermined heating temperature" so that when the substrate preheating module and the chip fixing module are selectively configured and used simultaneously, the circuit substrate and multiple welding materials can be directly and instantly heated from the predetermined preheating temperature to the predetermined heating temperature.

[0008] One of the beneficial effects of the present invention is that the chip transfer and fixing method provided by the present invention can achieve the technical scheme of "carrying a circuit substrate through a substrate carrying module", "transferring multiple chips to the circuit substrate through a chip transfer module", "preheating the circuit substrate to a predetermined preheating temperature through a substrate preheating module, thereby preheating multiple welding materials arranged between each chip and the circuit substrate through the predetermined preheating temperature provided by the substrate preheating module" and "while the step of preheating the circuit substrate to a predetermined preheating temperature through the substrate preheating module is continuously performed, instantaneously heating the multiple welding materials arranged between each chip and the circuit substrate to a predetermined heating temperature through a chip fixing module", so that when the substrate preheating module and the chip fixing module are selectively configured and used simultaneously, the circuit substrate and the multiple welding materials can be directly and instantly heated from the predetermined preheating temperature to the predetermined heating temperature.

[0009] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a functional block diagram of the chip transfer and fixing equipment provided by the present invention.

[0011] Figure 2 Schematic diagram of step S100 and step S102 of the chip transfer and fixing method provided in the first embodiment of the present invention.

[0012] Figure 3 It is a schematic diagram of step S104 of the chip transfer and fixing method provided in the first embodiment of the present invention.

[0013] Figure 4 A schematic diagram of step S106 of the chip transfer and bonding method provided in the first embodiment of the present invention (a schematic diagram of the heating plate structure and the laser heater being selectively configured and used simultaneously).

[0014] Figure 5 It is a schematic diagram of step S108 of the chip transfer and fixing method provided in the first embodiment of the present invention.

[0015] Figure 6 It is a schematic diagram of step S110 of the chip transfer and fixing method provided in the first embodiment of the present invention.

[0016] Figure 7 Flow chart of the chip transfer and fixing method provided by the first embodiment of the present invention.

[0017] Figure 8 A schematic diagram of a chip transfer and bonding device provided by a second embodiment of the present invention (a schematic diagram of a laser preheater and a laser heater being selectively configured and used simultaneously).

[0018] Fig. 9 A schematic diagram of a chip transfer and fixing device provided by a third embodiment of the present invention (a schematic diagram of a heating plate structure and a micro-heater group being selectively configured and used simultaneously).

[0019] Fig.10 A schematic diagram of a chip transfer and bonding device provided by a fourth embodiment of the present invention (a schematic diagram of a laser preheater and a micro-heater group being selectively configured and used simultaneously). DETAILED DESCRIPTION

[0020] The following is an explanation of the implementation methods of the "chip transfer and fixing device" and "chip transfer and fixing method" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, it should be stated in advance that the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0021] See also Figures 1 to 10 As shown, the present invention provides a chip transfer and fixing device D, which at least includes: a signal control module 1, a substrate carrying module 2, a chip transfer module 3, a substrate preheating module 4 and a chip fixing module 5. Further, the chip transfer module 3 is electrically connected to the signal control module 1 and movably arranged above the substrate carrying module 2, the substrate preheating module 4 is electrically connected to the signal control module 1, and the chip fixing module 5 is electrically connected to the signal control module 1. It is worth noting that when the substrate preheating module 4 and the chip fixing module 5 are selectively configured and used at the same time, the substrate preheating module 4 can be configured to directly or indirectly provide a predetermined preheating temperature to a plurality of welding materials S, and the chip fixing module 5 can be configured to directly or indirectly provide a predetermined heating temperature to a plurality of welding materials S. Therefore, when the substrate preheating module 4 and the chip fixing module 5 are selectively configured and used at the same time, a plurality of welding materials S can be directly and instantly heated from a predetermined preheating temperature to a predetermined heating temperature, thereby reducing or avoiding residual stress (or thermal stress) in the welding area.

[0022] First embodiment

[0023] See also Figures 1 to 6 As shown, the first embodiment of the present invention provides a chip transfer and fixing device D, which at least includes: a signal control module 1, a substrate supporting module 2, a chip transfer module 3, a substrate preheating module 4 and a chip fixing module 5.

[0024] Furthermore, with Figure 1 and Figure 2 As shown, the substrate carrying module 2 is electrically connected to the signal control module 1, and the chip transfer module 3 is electrically connected to the signal control module 1 and is movably arranged above the substrate carrying module 2. For example, the signal control module 1 can be a computer, a laptop, a tablet or any kind of portable electronic device that at least includes a central processing unit (CPU), a digital signal processor (DSP), a microprocessor (MPU), a microcontroller (MCU) or any kind of signal control chip. In addition, the substrate carrying module 2 can be a movable fixture, a movable vacuum suction cup or any kind of carrier, which can be used to carry any kind of substrate. In addition, the chip transfer module 3 (or chip moving module, chip carrying module) can be a movable clamp, a movable vacuum suction nozzle or any chip transfer structure that can be used to transfer a chip from one place to another. It is worth noting that when the substrate carrying module 2 is selectively configured for use, the substrate carrying module 2 can be configured to carry a circuit substrate P through the control of the signal control module 1 (or the substrate carrying module 2 can carry the circuit substrate P indirectly through the substrate preheating module 4). In addition, when the chip transfer module 3 is selectively configured for use, the chip transfer module 3 can be configured to transfer multiple chips C (such as LED chips or any type of semiconductor chips, or grains, or electronic components) to the circuit substrate P through the control of the signal control module 1. It is worth noting that the chip transfer module 3 can be configured to carry or move a temporary carrier substrate T (such as a glass substrate, a plastic substrate, or a transparent substrate made of any material), and the multiple chips C can be pre-adhered to the adhesive layer T100 of the temporary carrier substrate T. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0025] Furthermore, with Figure 1 , Figure 2 and Figure 3As shown, the substrate preheating module 4 is electrically connected to the signal control module 1 and is configured to correspond to the substrate carrying module 2. For example, when the substrate preheating module 4 is selectively configured for use, the substrate preheating module 4 can be configured to preheat the circuit substrate P to a predetermined preheating temperature (or a specific preheating temperature) through the control of the signal control module 1, so that "a plurality of welding materials S disposed between each chip C and the circuit substrate P" can be preheated by the predetermined preheating temperature provided by the substrate preheating module 4. In one feasible embodiment, the substrate preheating module 4 may include a heating plate structure 41 for providing thermal energy (for example, a heating structure having at least one heating coil or at least one heater), and the heating plate structure 41 of the substrate preheating module 4 is electrically connected to the signal control module 1 and disposed on the substrate carrying module 2. Thus, when the heating plate structure 41 is selectively configured for use, the heating plate structure 41 can be configured to transfer the heat energy provided by the heating plate structure 41 to the plurality of soldering materials S disposed between each chip C and the circuit substrate P through the control of the signal control module 1, thereby preheating the plurality of soldering materials S to a predetermined preheating temperature. That is, before the step of "the chip fixing module 5 is configured to instantaneously heat the plurality of soldering materials S disposed between each chip C and the circuit substrate P to a predetermined heating temperature" (before performing the heating step), the substrate preheating module 4 can be configured to preheat the circuit substrate P and the plurality of soldering materials S to a predetermined preheating temperature, so that the circuit substrate P and the plurality of soldering materials S can be gradually heated from room temperature (e.g., 25°C) to a predetermined preheating temperature (e.g., raising the temperature of the soldering material S from room temperature to a preheating temperature of "any positive integer between 50°C and 200°C", or a preheating temperature of "any positive integer less than 50°C", or a preheating temperature of "any positive integer greater than 200°C"). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0026] Furthermore, with Figure 1 , Figure 3 and Figure 4As shown, the chip fixing module 5 is electrically connected to the signal control module 1 and is configured to correspond to the substrate carrying module 2. For example, when the chip fixing module 5 is selectively configured for use, the chip fixing module 5 can be configured to instantaneously heat "a plurality of welding materials S disposed between each chip C and the circuit substrate P" at a predetermined heating temperature (or a specific heating temperature) through the control of the signal control module 1. In one feasible embodiment, the chip fixing module 5 includes a laser heater 51 (such as a laser diode or any type of laser generator, the light emission wavelength or light emission band provided by it can be adjusted or replaced according to different needs) for providing a laser heating beam L1, and the laser heater 51 of the chip fixing module 5 is electrically connected to the signal control module 1 and can be movably or fixedly arranged above the substrate carrying module 2. Therefore, when the laser heater 51 is selectively configured for use, the laser heater 51 can be configured to project the laser heating beam L1 to the plurality of welding materials S disposed between each chip C and the circuit substrate P through the control of the signal control module 1, thereby instantaneously heating the plurality of welding materials S at a predetermined heating temperature. That is to say, when "the chip fixing module 5 is configured to instantaneously heat the multiple welding materials S arranged between each chip C and the circuit substrate P to a predetermined heating temperature" (during the heating step), the substrate preheating module 4 can be configured to continuously preheat the circuit substrate P and the multiple welding materials S to a predetermined preheating temperature, so that the circuit substrate P and the multiple welding materials S can be instantly heated from the predetermined preheating temperature to the predetermined heating temperature (or in other words, the circuit substrate P and the multiple welding materials S will not be directly instantly heated from room temperature to the predetermined heating temperature, thereby avoiding the generation of residual thermal stress in the welding area due to instantaneous thermal expansion and contraction) (for example, under the condition that the predetermined heating temperature is greater than the predetermined preheating temperature, the temperature of the welding material S is increased from the predetermined preheating temperature to a heating temperature of "any positive integer between 200°C and 300°C", or it can also be a heating temperature of "any positive integer less than 200°C", or it can also be a heating temperature of "any positive integer greater than 200°C"). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0027] Furthermore, with Figure 1 , Figure 4 and Figure 5As shown, after the step of "the chip fixing module 5 is configured to instantaneously heat the multiple welding materials S arranged between each chip C and the circuit substrate P to a predetermined heating temperature" (after completing the heating step), the substrate preheating module 4 can be configured to continuously preheat the circuit substrate P and the multiple welding materials S to a predetermined preheating temperature (or keep them warm, keep them at a constant temperature) to avoid the circuit substrate P and the multiple welding materials S from being instantly cooled down from the predetermined heating temperature to room temperature (or avoid residual thermal stress in the welding area due to instantaneous thermal expansion and contraction), thereby increasing the "connection strength or bonding strength (bonding strength) between the welding material S and the chip C" and the "connection strength or bonding strength (bonding strength) between the welding material S and the circuit substrate P".

[0028] It is worth noting that with Figures 1 to 7 As shown, the first embodiment of the present invention further provides a chip transfer and fixing method, which includes: first, Figure 2 and Figure 7 As shown, a circuit substrate P is carried by a substrate carrying module 2 (step S100), and a plurality of chips C are transferred to the circuit substrate P by a chip transfer module 3 (step S102); then, Figure 3 and Figure 7 As shown, a substrate preheating module 4 is used to preheat the circuit substrate P to a predetermined preheating temperature (step S104), so that "a plurality of soldering materials S disposed between each chip C and the circuit substrate P" can be preheated at the predetermined preheating temperature provided by the substrate preheating module 4; then, Figure 4 and Figure 7 As shown, while the step of "preheating the circuit substrate P to a predetermined preheating temperature by the substrate preheating module 4" continues (the circuit substrate P and the plurality of soldering materials S can be kept at a constant temperature), a chip fixing module 5 is used to instantaneously heat the "plurality of soldering materials S disposed between each chip C and the circuit substrate P" to a predetermined heating temperature (step S106); next, in conjunction with Figure 5 and Figure 7 As shown, the substrate preheating module 4 is configured to continuously preheat (or keep warm) the circuit substrate P and the plurality of soldering materials S at a predetermined preheating temperature (step S108) to prevent the circuit substrate P and the plurality of soldering materials S from being instantly cooled down from the predetermined heating temperature to room temperature; then, Figure 6 and Figure 7 As shown, the temporary carrier substrate T is removed by the chip transfer module 3 (step S110 ).

[0029] It is worth noting that Figure 3As shown, before step S106 of "instantaneously heating the multiple welding materials S arranged between each chip C and the circuit substrate P to a predetermined heating temperature through the chip fixing module 5", the substrate preheating module 4 can be configured to preheat the circuit substrate P and the multiple welding materials S to a predetermined preheating temperature, so that the circuit substrate P and the multiple welding materials S can be gradually heated from room temperature to the predetermined preheating temperature, thereby preventing residual thermal stress from being generated in the welding area due to instantaneous thermal expansion and contraction.

[0030] It is worth noting that Figure 4 As shown, in step S106 of "instantaneously heating the multiple welding materials S arranged between each chip C and the circuit substrate P to a predetermined heating temperature through the chip fixing module 5", the substrate preheating module 4 can be configured to continuously preheat the circuit substrate P and the multiple welding materials S to a predetermined preheating temperature, so that the circuit substrate P and the multiple welding materials S can be instantly heated from the predetermined preheating temperature to the predetermined heating temperature, thereby avoiding the generation of residual thermal stress in the welding area due to instantaneous thermal expansion (to avoid the generation of thermal stress in the "welding area between the welding material S and the chip C" and the "welding area between the welding material S and the circuit substrate P").

[0031] It is worth noting that with Figure 4 and Figure 5 As shown, after step S106 of "instantaneously heating the multiple welding materials S arranged between each chip C and the circuit substrate P to a predetermined heating temperature through the chip fixing module 5", the substrate preheating module 4 can be configured to continuously preheat the circuit substrate P and the multiple welding materials S to a predetermined preheating temperature, so as to avoid the circuit substrate P and the multiple welding materials S from being instantly cooled down from the predetermined heating temperature to room temperature (or to avoid residual thermal stress in the welding area due to instantaneous shrinkage), thereby increasing the "connection strength or bonding strength between the welding material S and the chip C" and the "connection strength or bonding strength between the welding material S and the circuit substrate P".

[0032] Second embodiment

[0033] See also Figure 1 and Figure 8 As shown, the second embodiment of the present invention provides a chip transfer and fixing device D, which at least includes: a signal control module 1, a substrate supporting module 2, a chip transfer module 3, a substrate preheating module 4 and a chip fixing module 5. Figure 8 and Figure 4It can be seen from the comparison that the main difference between the second embodiment of the present invention and the first embodiment is that: in the second embodiment, the substrate preheating module 4 may include a laser preheater 42 for providing a laser preheating beam L2 (such as a laser diode or any type of laser generator, the light emitting wavelength or light emitting band provided by it can be adjusted or replaced according to different needs), and the laser preheater 42 of the substrate preheating module 4 is electrically connected to the signal control module 1 and can be movably or fixedly arranged above the substrate supporting module 2.

[0034] For example, if Figure 8 As shown, when the laser preheater 42 is selectively configured for use, the laser preheater 42 can be configured to project the laser preheating beam L2 provided by the laser preheater 42 onto the plurality of welding materials S disposed between each chip C and the circuit substrate P through the control of the signal control module 1, thereby preheating the plurality of welding materials S to a predetermined preheating temperature. It is worth noting that when "the chip fixing module 5 (or the laser heater 51) is configured to instantaneously heat the plurality of welding materials S disposed between each chip C and the circuit substrate P to a predetermined heating temperature" (during the heating step), the substrate preheating module 4 (or the laser preheater 42) can be configured to continuously preheat the circuit substrate P and the plurality of welding materials S to a predetermined preheating temperature, so that the circuit substrate P and the plurality of welding materials S can be instantly heated from the predetermined preheating temperature to the predetermined heating temperature (or in other words, the circuit substrate P and the plurality of welding materials S will not be directly and instantly heated from the room temperature to the predetermined heating temperature), thereby avoiding residual thermal stress in the welding area due to instantaneous thermal expansion).

[0035] Third embodiment

[0036] See also Figure 1 and Fig. 9 As shown, the third embodiment of the present invention provides a chip transfer and fixing device D, which at least includes: a signal control module 1, a substrate supporting module 2, a chip transfer module 3, a substrate preheating module 4 and a chip fixing module 5. Fig. 9 and Figure 4 From the comparison, it can be seen that the main difference between the third embodiment of the present invention and the first embodiment is that: in the third embodiment, the chip fixing module 5 includes a plurality of micro-heaters 52 (such as metal wires, semiconductor chips or any type of heating elements) for providing thermal energy, and the plurality of micro-heaters 52 of the chip fixing module 5 are electrically connected to the signal control module 1 and are arranged on or inside the circuit substrate P.

[0037] For example, if Fig. 9As shown, when the multiple micro-heaters 52 are selectively configured for use, the multiple micro-heaters 52 can be configured to transfer the heat energy provided by the multiple micro-heaters 52 to the multiple soldering materials S disposed between each chip C and the circuit substrate P through the control of the signal control module 1, thereby instantaneously heating the multiple soldering materials S to a predetermined heating temperature. It is worth noting that when "the chip fixing module 5 (or the multiple micro-heaters 52) is configured to instantaneously heat the multiple soldering materials S disposed between each chip C and the circuit substrate P to a predetermined heating temperature" (during the heating step), the substrate preheating module 4 (or the heating plate structure 41) can be configured to continuously preheat the circuit substrate P and the multiple soldering materials S to a predetermined preheating temperature, so that the circuit substrate P and the multiple soldering materials S can be instantly heated from the predetermined preheating temperature to the predetermined heating temperature (or in other words, the circuit substrate P and the multiple soldering materials S will not be directly and instantly heated from room temperature to the predetermined heating temperature), thereby avoiding residual thermal stress in the soldering area due to instantaneous thermal expansion).

[0038] Fourth embodiment

[0039] See also Figure 1 and Fig.10 As shown, the fourth embodiment of the present invention provides a chip transfer and fixing device D, which at least includes: a signal control module 1, a substrate supporting module 2, a chip transfer module 3, a substrate preheating module 4 and a chip fixing module 5. Fig.10 and Fig. 9 From the comparison, it can be known that the main difference between the fourth embodiment of the present invention and the third embodiment is that: in the fourth embodiment, the substrate preheating module 4 may include a laser preheater 42 for providing a laser preheating beam L2 (such as a laser diode or any type of laser generator, the light emitting wavelength or light emitting band provided by it can be adjusted or replaced according to different needs), and the laser preheater 42 of the substrate preheating module 4 is electrically connected to the signal control module 1 and can be movably or fixedly arranged above the substrate supporting module 2.

[0040] For example, if Fig.10As shown, when the laser preheater 42 is selectively configured for use, the laser preheater 42 can be configured to project the laser preheating beam L2 provided by the laser preheater 42 to the multiple welding materials S disposed between each chip C and the circuit substrate P through the control of the signal control module 1, thereby preheating the multiple welding materials S to a predetermined preheating temperature. It is worth noting that when "the chip fixing module 5 (or multiple micro-heaters 52) is configured to instantaneously heat the multiple welding materials S disposed between each chip C and the circuit substrate P to a predetermined heating temperature" (during the heating step), the substrate preheating module 4 (or the laser preheater 42) can be configured to continuously preheat the circuit substrate P and the multiple welding materials S to a predetermined preheating temperature, so that the circuit substrate P and the multiple welding materials S can be instantly heated from the predetermined preheating temperature to the predetermined heating temperature (or in other words, the circuit substrate P and the multiple welding materials S will not be directly instantly heated from room temperature to the predetermined heating temperature), thereby avoiding the generation of residual thermal stress in the welding area due to instantaneous thermal expansion).

[0041] Advantageous Effects of Embodiments

[0042] One of the beneficial effects of the present invention is that a chip transfer and fixing device D provided by the present invention can be configured to provide a predetermined preheating temperature through the technical solution of "the substrate preheating module 4 is configured to provide a predetermined preheating temperature" and "the chip fixing module 5 is configured to provide a predetermined heating temperature", so that when the substrate preheating module 4 and the chip fixing module 5 are selectively configured and used simultaneously, the circuit substrate P and multiple welding materials S can be directly and instantly heated from the predetermined preheating temperature to the predetermined heating temperature.

[0043] One of the beneficial effects of the present invention is that the chip transfer and fixing method provided by the present invention can be achieved through the technical scheme of "carrying a circuit substrate P through a substrate carrying module 2", "transferring multiple chips C to the circuit substrate P through a chip transfer module 3", "preheating the circuit substrate P to a predetermined preheating temperature through a substrate preheating module 4, so that multiple welding materials S arranged between each chip C and the circuit substrate P can be preheated by the predetermined preheating temperature provided by the substrate preheating module 4" and "while the step of preheating the circuit substrate P to a predetermined preheating temperature through the substrate preheating module 4 is continuously performed, instantaneously heating the multiple welding materials S arranged between each chip C and the circuit substrate P to a predetermined heating temperature through a chip fixing module 5". Therefore, when the substrate preheating module 4 and the chip fixing module 5 are selectively configured and used simultaneously, the circuit substrate P and the multiple welding materials S can be directly and instantly heated from the predetermined preheating temperature to the predetermined heating temperature.

[0044] The contents disclosed above are only optional feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A chip transfer and fixing device, characterized in that: The chip transfer and fixing equipment includes: a signal control module; a substrate carrying module, the substrate carrying module being electrically connected to the signal control module; a chip transfer module, the chip transfer module is electrically connected to the signal control module and is movably disposed above the substrate carrying module; a substrate preheating module, the substrate preheating module being electrically connected to the signal control module and configured to correspond to the substrate supporting module; and a chip fixing module, the chip fixing module is electrically connected to the signal control module and is configured to correspond to the substrate carrying module; Wherein, when the substrate carrying module is selectively configured for use, the substrate carrying module is allowed to be configured to carry a circuit substrate through the control of the signal control module; Wherein, when the chip transfer module is selectively configured for use, the chip transfer module is allowed to be configured to transfer a plurality of chips to the circuit substrate under the control of the signal control module; Wherein, when the substrate preheating module is selectively configured for use, the substrate preheating module allows to be configured to preheat the circuit substrate to a predetermined preheating temperature through the control of the signal control module, so that a plurality of soldering materials disposed between each of the chips and the circuit substrate are preheated by the predetermined preheating temperature provided by the substrate preheating module; Wherein, when the chip fixing module is selectively configured for use, the chip fixing module allows to be configured through the control of the signal control module to instantly heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to a predetermined heating temperature; Wherein, when the substrate preheating module and the chip fixing module are selectively configured and used simultaneously, the substrate preheating module is configured to provide the predetermined preheating temperature, and the chip fixing module is configured to provide the predetermined heating temperature.

2. The chip transfer and fixing device according to claim 1, characterized in that: in, The substrate preheating module includes a heating plate structure for providing heat energy, the heating plate structure is electrically connected to the signal control module and is disposed on the substrate carrying module; Wherein, when the heating plate structure is selectively configured for use, the heating plate structure allows to be configured through the control of the signal control module to transmit the heat energy provided by the heating plate structure to the plurality of welding materials disposed between each of the chips and the circuit substrate, thereby preheating the plurality of welding materials to the predetermined preheating temperature; Wherein, the chip fixing module includes a laser heater for providing a laser heating beam, the laser heater is electrically connected to the signal control module and is movably disposed above the substrate carrying module; Wherein, when the laser heater is selectively configured for use, the laser heater is configured to project the laser heating beam to the plurality of welding materials disposed between each of the chips and the circuit substrate under the control of the signal control module, thereby instantaneously heating the plurality of welding materials to the predetermined heating temperature; Wherein, before the chip fixing module is configured to instantaneously heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to preheat the circuit substrate and the plurality of soldering materials to the predetermined preheating temperature, so that the circuit substrate and the plurality of soldering materials are gradually heated from room temperature to the predetermined preheating temperature; Wherein, when the chip fixing module is configured to instantaneously heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to continuously preheat the circuit substrate and the plurality of soldering materials to the predetermined preheating temperature, so that the circuit substrate and the plurality of soldering materials are instantaneously heated from the predetermined preheating temperature to the predetermined heating temperature; Among them, after the chip fixing module is configured to instantaneously heat the multiple welding materials arranged between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to continuously preheat the circuit substrate and the multiple welding materials to the predetermined preheating temperature to avoid the circuit substrate and the multiple welding materials being instantly cooled down from the predetermined heating temperature to room temperature.

3. The chip transfer and fixing device according to claim 1, characterized in that: in, The substrate preheating module includes a heating plate structure for providing heat energy, the heating plate structure is electrically connected to the signal control module and is disposed on the substrate carrying module; Wherein, when the heating plate structure is selectively configured for use, the heating plate structure allows to be configured through the control of the signal control module to transmit the heat energy provided by the heating plate structure to the plurality of welding materials disposed between each of the chips and the circuit substrate, thereby preheating the plurality of welding materials to the predetermined preheating temperature; Wherein, the chip fixing module includes a plurality of micro heaters for providing heat energy, and the plurality of micro heaters are electrically connected to the signal control module and are arranged on or inside the circuit substrate; Wherein, when the plurality of micro-heaters are selectively configured for use, the plurality of micro-heaters are allowed to be configured through the control of the signal control module to transfer the heat energy provided by the plurality of micro-heaters to the plurality of soldering materials disposed between each of the chips and the circuit substrate, thereby instantaneously heating the plurality of soldering materials to the predetermined heating temperature; Wherein, before the chip fixing module is configured to instantaneously heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to preheat the circuit substrate and the plurality of soldering materials to the predetermined preheating temperature, so that the circuit substrate and the plurality of soldering materials are gradually heated from room temperature to the predetermined preheating temperature; Wherein, when the chip fixing module is configured to instantaneously heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to continuously preheat the circuit substrate and the plurality of soldering materials to the predetermined preheating temperature, so that the circuit substrate and the plurality of soldering materials are instantaneously heated from the predetermined preheating temperature to the predetermined heating temperature; Among them, after the chip fixing module is configured to instantaneously heat the multiple welding materials arranged between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to continuously preheat the circuit substrate and the multiple welding materials to the predetermined preheating temperature to avoid the circuit substrate and the multiple welding materials being instantly cooled down from the predetermined heating temperature to room temperature.

4. The chip transfer and fixing device according to claim 1, characterized in that: in, The substrate preheating module includes a laser preheater for providing a laser preheating beam, wherein the laser preheater is electrically connected to the signal control module and is movably disposed above the substrate supporting module; Wherein, when the laser preheater is selectively configured for use, the laser preheater is allowed to be configured through the control of the signal control module to project the laser preheating beam provided by the laser preheater to the plurality of welding materials disposed between each of the chips and the circuit substrate, thereby preheating the plurality of welding materials to the predetermined preheating temperature; Wherein, the chip fixing module includes a laser heater for providing a laser heating beam, the laser heater is electrically connected to the signal control module and is movably disposed above the substrate carrying module; Wherein, when the laser heater is selectively configured for use, the laser heater is configured to project the laser heating beam to the plurality of welding materials disposed between each of the chips and the circuit substrate under the control of the signal control module, thereby instantaneously heating the plurality of welding materials to the predetermined heating temperature; Wherein, before the chip fixing module is configured to instantaneously heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to preheat the circuit substrate and the plurality of soldering materials to the predetermined preheating temperature, so that the circuit substrate and the plurality of soldering materials are gradually heated from room temperature to the predetermined preheating temperature; Wherein, when the chip fixing module is configured to instantaneously heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to continuously preheat the circuit substrate and the plurality of soldering materials to the predetermined preheating temperature, so that the circuit substrate and the plurality of soldering materials are instantaneously heated from the predetermined preheating temperature to the predetermined heating temperature; Among them, after the chip fixing module is configured to instantaneously heat the multiple welding materials arranged between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to continuously preheat the circuit substrate and the multiple welding materials to the predetermined preheating temperature to avoid the circuit substrate and the multiple welding materials being instantly cooled down from the predetermined heating temperature to room temperature.

5. The chip transfer and fixing device according to claim 1, characterized in that: in, The substrate preheating module includes a laser preheater for providing a laser preheating beam, wherein the laser preheater is electrically connected to the signal control module and is movably disposed above the substrate supporting module; Wherein, when the laser preheater is selectively configured for use, the laser preheater is allowed to be configured through the control of the signal control module to project the laser preheating beam provided by the laser preheater to the plurality of welding materials disposed between each of the chips and the circuit substrate, thereby preheating the plurality of welding materials to the predetermined preheating temperature; Wherein, the chip fixing module includes a plurality of micro heaters for providing heat energy, and the plurality of micro heaters are electrically connected to the signal control module and are arranged on or inside the circuit substrate; Wherein, when the plurality of micro-heaters are selectively configured for use, the plurality of micro-heaters are allowed to be configured through the control of the signal control module to transfer the heat energy provided by the plurality of micro-heaters to the plurality of soldering materials disposed between each of the chips and the circuit substrate, thereby instantaneously heating the plurality of soldering materials to the predetermined heating temperature; Wherein, before the chip fixing module is configured to instantaneously heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to preheat the circuit substrate and the plurality of soldering materials to the predetermined preheating temperature, so that the circuit substrate and the plurality of soldering materials are gradually heated from room temperature to the predetermined preheating temperature; Wherein, when the chip fixing module is configured to instantaneously heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to continuously preheat the circuit substrate and the plurality of soldering materials to the predetermined preheating temperature, so that the circuit substrate and the plurality of soldering materials are instantaneously heated from the predetermined preheating temperature to the predetermined heating temperature; Among them, after the chip fixing module is configured to instantaneously heat the multiple welding materials arranged between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to continuously preheat the circuit substrate and the multiple welding materials to the predetermined preheating temperature to avoid the circuit substrate and the multiple welding materials being instantly cooled down from the predetermined heating temperature to room temperature.

6. A chip transfer and fixing device, characterized in that: The chip transfer and fixing equipment includes: a signal control module; a substrate carrying module; a chip transfer module, the chip transfer module is electrically connected to the signal control module and is movably disposed above the substrate carrying module; a substrate preheating module, the substrate preheating module being electrically connected to the signal control module; and a chip fixing module, the chip fixing module being electrically connected to the signal control module; Wherein, when the substrate preheating module and the chip fixing module are selectively configured and used simultaneously, the substrate preheating module is configured to provide a predetermined preheating temperature, and the chip fixing module is configured to provide a predetermined heating temperature.

7. The chip transfer and fixing device according to claim 6, characterized in that: in, The substrate carrying module allows to be configured to carry a circuit substrate under the control of the signal control module; The chip transfer module is configured to transfer a plurality of chips to the circuit substrate carrying a plurality of soldering materials under the control of the signal control module; Wherein, the substrate preheating module comprises a heating plate structure for providing heat energy, the heating plate structure is electrically connected to the signal control module and is arranged on the substrate carrying module; Wherein, when the heating plate structure is selectively configured for use, the heating plate structure allows to be configured through the control of the signal control module to transmit the heat energy provided by the heating plate structure to the plurality of welding materials disposed between each of the chips and the circuit substrate, thereby preheating the plurality of welding materials to the predetermined preheating temperature; Wherein, the substrate preheating module comprises a laser preheater for providing a laser preheating beam, the laser preheater is electrically connected to the signal control module and is movably disposed above the substrate supporting module; Wherein, when the laser preheater is selectively configured for use, the laser preheater is allowed to be configured through the control of the signal control module to project the laser preheating beam provided by the laser preheater to the plurality of welding materials disposed between each of the chips and the circuit substrate, thereby preheating the plurality of welding materials to the predetermined preheating temperature; Wherein, the chip fixing module includes a laser heater for providing a laser heating beam, the laser heater is electrically connected to the signal control module and is movably disposed above the substrate carrying module; Wherein, when the laser heater is selectively configured for use, the laser heater is configured to project the laser heating beam to the plurality of welding materials disposed between each of the chips and the circuit substrate under the control of the signal control module, thereby instantaneously heating the plurality of welding materials to the predetermined heating temperature; Wherein, the chip fixing module includes a plurality of micro heaters for providing heat energy, and the plurality of micro heaters are electrically connected to the signal control module and are arranged on or inside the circuit substrate; Wherein, when the plurality of micro-heaters are selectively configured for use, the plurality of micro-heaters are allowed to be configured through the control of the signal control module to transfer the heat energy provided by the plurality of micro-heaters to the plurality of soldering materials disposed between each of the chips and the circuit substrate, thereby instantaneously heating the plurality of soldering materials to the predetermined heating temperature; Wherein, before the chip fixing module is configured to instantaneously heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to preheat the circuit substrate and the plurality of soldering materials to the predetermined preheating temperature, so that the circuit substrate and the plurality of soldering materials are gradually heated from room temperature to the predetermined preheating temperature; Wherein, when the chip fixing module is configured to instantaneously heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to continuously preheat the circuit substrate and the plurality of soldering materials to the predetermined preheating temperature, so that the circuit substrate and the plurality of soldering materials are instantaneously heated from the predetermined preheating temperature to the predetermined heating temperature; Among them, after the chip fixing module is configured to instantaneously heat the multiple welding materials arranged between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to continuously preheat the circuit substrate and the multiple welding materials to the predetermined preheating temperature to avoid the circuit substrate and the multiple welding materials being instantly cooled down from the predetermined heating temperature to room temperature.

8. A chip transfer and fixing method, characterized in that: The chip transfer and fixing method comprises: A circuit substrate is carried by a substrate carrying module; Transferring a plurality of chips to the circuit substrate through a chip transfer module; Preheating the circuit substrate to a predetermined preheating temperature by a substrate preheating module, so that a plurality of soldering materials disposed between each of the chips and the circuit substrate are preheated by the predetermined preheating temperature provided by the substrate preheating module; and While the step of preheating the circuit substrate to the predetermined preheating temperature by the substrate preheating module continues, a chip fixing module is used to instantaneously heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to a predetermined heating temperature; Wherein, when the substrate preheating module and the chip fixing module are selectively configured and used simultaneously, the substrate preheating module is configured to provide a predetermined preheating temperature, and the chip fixing module is configured to provide a predetermined heating temperature.

9. The chip transfer and fixing method according to claim 8, characterized in that: in, The chip transfer module, the substrate preheating module and the chip fixing module are electrically connected to a signal control module; Wherein, the substrate preheating module comprises a heating plate structure for providing heat energy, the heating plate structure is electrically connected to the signal control module and is arranged on the substrate carrying module; Wherein, when the heating plate structure is selectively configured for use, the heating plate structure allows to be configured through the control of the signal control module to transmit the heat energy provided by the heating plate structure to the plurality of welding materials disposed between each of the chips and the circuit substrate, thereby preheating the plurality of welding materials to the predetermined preheating temperature; Wherein, the substrate preheating module comprises a laser preheater for providing a laser preheating beam, the laser preheater is electrically connected to the signal control module and is movably disposed above the substrate supporting module; Wherein, when the laser preheater is selectively configured for use, the laser preheater is allowed to be configured through the control of the signal control module to project the laser preheating beam provided by the laser preheater to the plurality of welding materials disposed between each of the chips and the circuit substrate, thereby preheating the plurality of welding materials to the predetermined preheating temperature; Wherein, the chip fixing module includes a laser heater for providing a laser heating beam, the laser heater is electrically connected to the signal control module and is movably disposed above the substrate carrying module; Wherein, when the laser heater is selectively configured for use, the laser heater is configured to project the laser heating beam to the plurality of welding materials disposed between each of the chips and the circuit substrate under the control of the signal control module, thereby instantaneously heating the plurality of welding materials to the predetermined heating temperature; Wherein, the chip fixing module includes a plurality of micro heaters for providing heat energy, and the plurality of micro heaters are electrically connected to the signal control module and are arranged on or inside the circuit substrate; Among them, when the multiple microheaters are selectively configured for use, the multiple microheaters are allowed to be configured through the control of the signal control module to transfer the heat energy provided by the multiple microheaters to the multiple welding materials arranged between each of the chips and the circuit substrate, thereby instantaneously heating the multiple welding materials to the predetermined heating temperature.

10. The chip transfer and fixing method according to claim 8, characterized in that: in, Before the chip fixing module is configured to instantaneously heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to preheat the circuit substrate and the plurality of soldering materials to the predetermined preheating temperature, so that the circuit substrate and the plurality of soldering materials are gradually heated from room temperature to the predetermined preheating temperature; Wherein, when the chip fixing module is configured to instantaneously heat the plurality of soldering materials disposed between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to continuously preheat the circuit substrate and the plurality of soldering materials to the predetermined preheating temperature, so that the circuit substrate and the plurality of soldering materials are instantaneously heated from the predetermined preheating temperature to the predetermined heating temperature; Among them, after the chip fixing module is configured to instantaneously heat the multiple welding materials arranged between each of the chips and the circuit substrate to the predetermined heating temperature, the substrate preheating module is configured to continuously preheat the circuit substrate and the multiple welding materials to the predetermined preheating temperature to avoid the circuit substrate and the multiple welding materials being instantly cooled down from the predetermined heating temperature to room temperature.

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