A semiconductor chip packaging device

Abstract

The present invention is a semiconductor chip packaging device, which includes a base, a heating block, an auxiliary block, an arc slide rail, a transmission block and a spraying block. A substrate is arranged above the base, and a flip-chip is installed at the top of the substrate. The substrate and the chip are connected by metal balls in the middle. The transmission block controls the movement of the spraying block, and the spraying block guides the adhesive in the adhesive bottle to spray out into the gap between the chip and the substrate towards the gap between the chip and the substrate. An arc slide rail is arranged around the chip and the substrate, and a telescopic displacement block is arranged at the arc slide rail. The telescopic displacement block can change its position at the arc slide rail. The telescopic displacement block is connected with a defoaming needle and a partition piece, and they can act together to defoam the gap between the metal balls, and at the same time disturb the adhesive to promote the uniform distribution of the adhesive.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and specifically relates to a semiconductor chip packaging device. Background Art

[0002] The packaging of semiconductor chips is of crucial significance in the modern electronics industry. It not only protects the chips but also affects the performance, reliability, and manufacturing cost of the entire electronic device;

[0003] Encapsulating the chips can protect the chips from physical damage, moisture, dust, and other environmental factors, improving the durability and working life of the components. At the same time, it can help the chips dissipate the heat generated during operation, avoid damage caused by overheating, and improve the reliability and performance of the devices;

[0004] In the existing flip-chip process, the chip is inverted and covered above the substrate. A number of metal balls are arranged between the chip and the substrate to connect the chip and the substrate. The flip-chip form can generate more connection points between the chip and the substrate, greatly improving the performance of the chip. At the same time, when flip-chip bonding, a thermal conductive adhesive needs to be filled between the chip and the substrate to dissipate heat from the chip. The spraying of the thermal conductive adhesive mostly adopts the spraying method, and the capillary phenomenon of the liquid is used to continuously cover the gaps between the metal balls. However, due to the relatively viscous physical properties of the thermal conductive adhesive and the dense state between the metal balls, it is extremely easy to cause air bubbles to form between the metal balls and uneven distribution of the thermal conductive adhesive at the same time. Summary of the Invention

[0005] The purpose of the present invention is to provide a semiconductor chip packaging device to solve the problems of poor clamping stability caused by the workpiece clamping method in the prior art and single-direction welding of the workpiece weld seams, with narrow applicability.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A semiconductor chip packaging device includes a base. A substrate is installed at the top of the base. Above the substrate, there are a number of metal balls arranged in a linear array and a flip-chip. Below the substrate, there is a heating block, and the heating block is connected to the metal balls above the substrate through heat release to control the connection between the metal balls and the substrate;

[0008] Above the base, there is an auxiliary block. Above the auxiliary block, there is a transmission block. A power supply is arranged between the base and the transmission block. The transmission block is movably connected to a spraying block, and the spraying block is connected to a glue bottle. The spraying block controls the glue in the glue bottle to be sprayed between the chip and the substrate;

[0009] The auxiliary block includes an arc slide rail, a telescopic displacement block, a displacement belt, and a defoaming needle. A telescopic displacement block is slidably connected in the arc slide rail. A displacement belt is arranged in the telescopic displacement block. The displacement belt includes a toothed belt and two gears. Rotating shafts are hinged to both ends of each gear. The telescopic displacement block is hinged to an adjustment plate. One ends of a number of first telescopic rods are movably connected in the adjustment plate. The other end of each first telescopic rod is hinged to a defoaming needle. The first telescopic rod controls the defoaming needle to extend into the gap between metal balls through telescoping.

[0010] Optionally, a number of clamping slide rails are arranged in the heating block. A clamping plate is slidably connected at each clamping slide rail. The clamping plate controls the connection between the substrate and the base through sliding.

[0011] Optionally, a number of second telescopic rods are connected to the auxiliary block. The second telescopic rods are symmetrically arranged with the telescopic displacement block as the center. The second telescopic rod controls the telescopic displacement block to slide at the arc slide rail through telescoping. When the telescopic displacement block moves at the arc slide, the telescopic displacement block itself can maintain its connection with the second telescopic rod and the arc slide rail through telescoping.

[0012] Optionally, symmetrically arranged auxiliary defoaming forks are connected to the outside of each defoaming needle. The first telescopic rod controls the auxiliary defoaming fork to enter the gap between metal balls through telescoping.

[0013] Optionally, one end of a third telescopic rod is also arranged in the telescopic displacement block. The other end of the third telescopic rod is joined to a connection block. A number of partition pieces are hinged at the connection block. The partition pieces are movably connected to the connection block. Each defoaming needle passes through the partition piece and enters the gap between metal balls. The auxiliary defoaming fork connected to each defoaming needle will contact the partition piece when passing through the partition piece.

[0014] Optionally, a splash-proof plate is hinged to the spraying block. The splash-proof plate is located away from the chip on the outside of the spraying block.

[0015] Optionally, the outer shape of the auxiliary defoaming fork is arc-shaped, and the center of the auxiliary defoaming fork is arranged towards the side close to the chip.

[0016] Beneficial effects: 1. The defoaming needle of the present invention and the auxiliary defoaming fork connected thereto can move in the gap between metal balls. Furthermore, the auxiliary defoaming fork can cyclically generate bending deformation during the moving process. Furthermore, it can cause the bubbles to burst with its large-amplitude movement, and furthermore, a good defoaming effect can be achieved.

[0017] 2. The arc-shaped slide rail of the present invention can allow the telescopic displacement block to change its position through continuous sliding, so that the telescopic displacement block can face the three surfaces of the chip away from the spraying block. Furthermore, it can control the defoaming needle and the auxiliary defoaming fork connected thereto to move relative to the gap between the metal balls in different directions, disturbing the thermal conductive adhesive between the metal balls, making the thermal conductive adhesive more uniform between the chip and the substrate, and helping the thermal conductive adhesive to better utilize its physical properties to assist the operation of the chip.

[0018] 3. By being arranged around the chip, the partition piece and the splash guard of the present invention cooperate with the defoaming needle and the spraying block respectively, so as to prevent the defoaming needle and the spraying block from causing the thermal conductive adhesive to overflow during operation, effectively avoiding the influence on other components on the surface of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front isometric structure schematic diagram of the whole of the present invention.

[0020] Figure 2 It is a connection schematic diagram of the arc-shaped slide rail and the telescopic displacement block of the present invention.

[0021] Figure 3 It is a connection schematic diagram of the spraying block of the present invention.

[0022] Figure 4 It is a schematic diagram of the telescopic displacement block of the present invention.

[0023] In the figure: 1. Base; 11. Substrate; 12. Metal ball; 13. Chip; 14. Heating block; 15. Power supply; 16. Clamping slide rail; 17. Clamping plate; 18. Splash guard; 2. Auxiliary block; 21. Arc-shaped slide rail; 22. Telescopic displacement block; 23. Displacement belt; 231. Tooth-shaped belt; 232. Gear; 24. Defoaming needle; 241. Auxiliary defoaming fork; 25. Rotating shaft; 26. Position adjusting plate; 27. First telescopic rod; 28. Second telescopic rod; 3. Transmission block; 4. Spraying block; 5. Glue bottle; 6. Partition piece; 61. Third telescopic rod; 62. Connecting block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] Please refer to Figures 1-4 , the present invention provides a semiconductor chip packaging device, and the specific implementation scheme is as follows:

[0026] As Figure 1 , Figure 2 and Figure 3 shown, a semiconductor chip packaging device includes a base 1. A substrate 11 is installed at the top of the base 1. An inverted chip 13 is covered above the substrate 11. A number of metal balls 12 are provided on the opposite surfaces of the chip 13 and the substrate 11. The metal balls 12 are connected to the chip 13. After the metal balls 12 correspond to the substrate 11, a heating block 14 is provided below the substrate 11. The heating block 14 passes through the base 1 and is connected to a power supply 15. The heating block 14 controls the liquefaction of the metal balls 12 above the substrate 11 by releasing heat. After stopping heating, when the metal balls 12 solidify, the metal balls 12 are used to package the chip 13 and the substrate 11. A number of clamping slide rails 16 are provided in the heating block 14. A clamping plate 17 is slidably connected at each clamping slide rail 16. The clamping plate 17 controls the two ends of the substrate 11 to contact the base 1 and the clamping plate 17 respectively through sliding, so that the clamping plate 17 and the base 1 can limit the substrate 11.

[0027] An auxiliary block 2 is provided above the base 1. A transmission block 3 is provided above the auxiliary block 2. A spraying block 4 is sleeved on the transmission block 3. A power supply 15 is provided between the base 1 and the transmission block 3. The power supply 15 supplies power to the auxiliary block 2, the transmission block 3 and the spraying block 4. The part of the spraying block 4 close to between the chip 13 and the substrate 11 is provided with a certain inclination. A splash-proof plate 18 is hinged at one end of the spraying block 4 close to between the chip 13 and the substrate 11. The splash-proof plate 18 is inclined along the inclined direction of the spraying block 4. The splash-proof plate 18 is located outside the spraying block 4. At the same time, the splash-proof plate 18 is located at a position outside the spraying block 4 away from the chip 13 and the substrate 11. Therefore, when the spraying block 4 sprays the adhesive between the chip 13 and the substrate 11, since the spraying block 4 sprays the adhesive obliquely, when the adhesive starts to be sprayed and ends to be sprayed, the splash-proof plate 18 can prevent the adhesive from splashing onto the surface of the substrate 11 where no metal balls 12 are connected, thereby reducing the impact of the adhesive on other electronic devices connected to the substrate 11;

[0028] The transmission block 3 includes a square frame. A horizontal moving block and a radial moving block are respectively slidably connected to the top and bottom of the square frame. The spraying block 4 is sleeved with the horizontal moving block and the radial moving block. A number of positioning telescopic rods are respectively provided in the horizontal moving block and the radial moving block. All the positioning telescopic rods are symmetrically arranged with the spraying block 4 as the center. The positioning telescopic rods in the horizontal moving block control the horizontal movement of the spraying block 4 relative to the square block through telescoping, and the positioning telescopic rods in the radial moving block control the radial movement of the spraying block 4 relative to the square block through telescoping.

[0029] The spraying block 4 is specifically a nozzle structure. A glue bottle 5 is connected to the outside of the spraying block 4. A filler port is arranged on the outside of the glue bottle 5 for adding glue. At the same time, a booster pump is externally connected to the glue bottle 5. The booster pump can apply pressure to the inside of the glue bottle 5. The glue in the glue bottle 5 flows into the spraying block 4 under pressure and is sprayed out through the spraying block 4. The spraying block 4 mainly functions as a nozzle guide, which can guide the glue to flow between the chip 13 and the substrate 11. The spraying block 4 guides the glue in the glue bottle 5 to contact the metal balls 12 between the chip 13 and the substrate 11.

[0030] As Figures 1-4 shown, the auxiliary block 2 includes an arc slide rail 21, a telescopic displacement block 22, a displacement belt 23, and a defoaming needle 24. A telescopic displacement block 22 is slidably connected in the arc slide rail 21. A displacement belt 23 is arranged in the telescopic displacement block 22. The displacement belt 23 includes a toothed belt 231 and two gears 232. The two gears 232 are arranged vertically. The toothed belt 231 is sleeved on the outside of the two gears 232. The rotating shafts 25 arranged on both sides of the gear 232 pass through the telescopic displacement block 22 and are connected to the power supply 15. The rotating shafts 25 drive the gears 232 to rotate through electric control. A positioning plate 26 is hinged to the side of the toothed belt 231 facing the chip 13. The rotating shafts 25 connected to the two gears 232 can adjust the up-and-down movement of the toothed belt 231 by rotating in opposite directions. An auxiliary telescopic rod is hinged to the side of the telescopic displacement block 22 close to the positioning plate 26. When the toothed belt 231 moves up and down, one end of the positioning plate 26 can be driven to swing accordingly, and then the other end of the positioning plate 26 swings in the opposite direction. The swing of the positioning plate 26 immediately drives the inclination of the first telescopic rod 27, the defoaming needle 24, and the auxiliary defoaming fork 241.

[0031] Therefore, when there are some components on the surface of the substrate 11 located on the running paths of the defoaming needle 24 and the auxiliary defoaming fork 241, the defoaming needle 24 and the auxiliary defoaming fork 241 can avoid them to a certain extent. Then, the defoaming needle 24 and the auxiliary defoaming fork 241 can enter between the chip 13 and the substrate 11 in a direction inclined relative to the horizontal plane to defoam the gap between the metal balls 12.

[0032] The materials of the defoaming needle 24 and the auxiliary defoaming fork 241 are both relatively soft materials, which can undergo large bending deformations. At the same time, the outer shape of the auxiliary defoaming fork 241 is arc-shaped, and the center of the auxiliary defoaming fork 241 is arranged towards the side close to the chip 13. Therefore, the auxiliary defoaming fork 241 will come into more sufficient contact with the metal ball 12. Then, as the first telescopic rod 27 controls the further penetration of the defoaming needle 24 through telescoping, the auxiliary defoaming fork 241 will bend. After bending until the auxiliary defoaming fork 241 can pass through the gap between the metal balls 12, the auxiliary defoaming fork 241 will expand to its original state when it encounters a relatively spacious space. Until passing through the gap between the next metal balls 12, the auxiliary defoaming fork 241 will bend again under the influence of the metal balls 12; when the first telescopic rod 27 controls the defoaming needle 24 to move away from the chip 13 through telescoping, the auxiliary defoaming fork 241 will still bend when passing through the gap between the metal balls 12. However, compared with when the defoaming needle 24 moves towards the side close to the chip 13, when moving away from the chip 13, the auxiliary defoaming fork 241 will produce a relatively smaller deformation.

[0033] A number of second telescopic rods 28 are connected to the auxiliary block 2. The second telescopic rods 28 are symmetrically arranged with the telescopic displacement block 22 as the center. The telescopic directions of the second telescopic rods 28 on both sides of the telescopic displacement block 22 are opposite. Therefore, the second telescopic rods 28 on both sides of the telescopic displacement block can control the telescopic displacement block 22 to move in the same plane as the arc-shaped slide rail 21 through telescoping. A telescopic structure is arranged inside the telescopic displacement block 22. At the same time, the telescopic displacement block 22 is divided into two parts, namely a fixed part connected to the second telescopic rod 28 and a movable part connected to the arc-shaped slide rail 21. Inside the telescopic structure in the telescopic displacement block 22, the movable part of the telescopic displacement block 22 will perform telescopic movement relative to the fixed part of the telescopic displacement block 22. At the same time, the movable part of the telescopic displacement block 22 will also swing at a certain angle relative to the fixed part of the telescopic displacement block 22. Therefore, the telescopic displacement block 22 can adapt to slide inside the arc-shaped slide rail 21;

[0034] At the same time, the second telescopic rods 28 on both sides of the telescopic displacement block respectively control the position of the telescopic displacement block 22 at the arc-shaped slide rail 21 through telescoping, so as to achieve the purpose of changing the relative position between the telescopic displacement block 22 and the chip 13. Through the second telescopic rod 28, the telescopic displacement block 22 can slide at the arc-shaped slide rail 21 until the telescopic displacement block 22 faces the three faces of the chip 13 away from the spraying block 4 respectively. Then, the defoaming needle 24 can correspond to the gap between the metal balls 12, and defoaming can be carried out smoothly.

[0035] A symmetrically arranged auxiliary defoaming fork 241 is connected to the outside of each defoaming needle 24. Therefore, the symmetrically arranged auxiliary defoaming forks 241 can be in the same plane. When the defoaming needle 24 enters the gap between the metal balls 12, the two symmetrically arranged auxiliary defoaming forks 241 can avoid contacting the chip 13 or the substrate 11 during auxiliary defoaming, reducing damage to the chip 13 or the substrate 11.

[0036] One end of a third telescopic rod 61 is also arranged inside the telescopic displacement block 22. The other end of the third telescopic rod 61 is hinged to a connecting block 62. A plurality of partition sheets 6 are hinged at the connecting block 62. The partition sheets 6 are movably connected to the connecting block 62. Each partition sheet 6 is arranged in a linear array along the connecting block 62. When the first telescopic rod 27 expands and contracts, the defoaming needle 24 and the auxiliary defoaming fork 241 will pass through the gap between the partition sheets 6, and then can pass through the partition sheets 6 and enter between the chip 13 and the substrate 11. When the auxiliary defoaming fork 241 passes through the gap between the partition sheets 6, the morphological change of the auxiliary defoaming fork 241 will be consistent with the gap between the metal balls 12. When moving towards the chip 13 direction through the partition sheets 6, the auxiliary defoaming fork 241 will generate a large bend, and then bend to be able to pass through the gap between the partition sheets 6, and then enter the gap between the metal balls 12. When the auxiliary defoaming fork 241 passes through the partition sheets 6 in the direction away from the chip 13, the auxiliary defoaming fork 241 will generate a relatively small deformation until it can pass through the gap between the partition sheets 6;

[0037] However, when the auxiliary defoaming fork 241 passes through the gap between the partition sheets 6 at this time, most of the glue adsorbed on the surfaces of the defoaming needle 24 and the auxiliary defoaming fork 241 will be scraped off by the partition sheets 6 located on both sides of the defoaming needle 24. Then, the scraped-off glue will contact the surface of the metal ball 12 closest to it. These metal balls 12 are located on the three faces of the chip 13 away from the spraying block 4. Therefore, there will be some parts of the surfaces of these metal balls 12 that are not directly sprayed by the spraying block 4 without glue. However, these parts without glue will contact the glue scraped off by the partition sheets 6. The complete coverage of the surface of the metal ball 12 with glue can effectively improve the heat dissipation performance of the metal ball 12, and at the same time can further ensure the uniformity of the glue between the chip 13 and the substrate 11, thereby assisting the smooth operation of the chip 13.

[0038] The working process of a semiconductor chip sealing device according to this embodiment during operation is as follows: The side of the chip 13 connected with the metal balls 12 is covered above the substrate 11. Then, the clamping plate 17 is controlled to limit the substrate 11, and the heating block 14 is controlled to start releasing heat. After the metal balls 12 are liquefied, the heating block 14 stops releasing heat. After cooling, the metal balls 12 solidify again, and the metal balls 12 become arc-shaped objects. Then, the chip 13 and the substrate 11 are connected through the metal balls 12, and current and signals can be transmitted between the chip 13 and the substrate 11 through the metal balls 12. Through the positioning telescopic rod, the lateral moving block, and the radial moving block of the transmission block 3, the position of the spraying block 4 can be moved according to the specifications of different chips 13, so that the position of the spraying block 4 matches the positions of the chip 13 and the substrate 11;

[0039] The booster pump connected to the device sprays the adhesive material inside the adhesive material bottle 5 through the spraying block 4 onto the surface of the metal balls 12 between the chip 13 and the substrate 11. The splash guard 18 located outside the spraying block 4 can prevent the adhesive material from splashing to other positions of the substrate 11. When the adhesive material is sprayed into the area of the metal balls 12, the adhesive material can continuously fill the gaps between the metal balls 12 between the chip 13 and the substrate 11 through the capillary phenomenon between the metal balls 12. During filling, it is possible that due to the high viscosity of the adhesive material, too high or too low spraying pressure, and too fast spraying rate, bubbles may be generated in the gaps between the metal balls 12;

[0040] After the adhesive material sprayed by the spraying block 4 basically covers the metal balls 12 inside the chip 13 and the substrate 11, the second telescopic rod 28 controls the telescopic displacement block 22 to slide in the arc-shaped slide rail 21, and then slides to face the side of the chip 13 away from the spraying block 4. Then, the rotation of the gear 232 is controlled through the rotating shaft 25, and then the toothed belt 231 moves accordingly. Subsequently, the adjustment plate 26 starts to generate a certain offset relative to the horizontal plane. The third telescopic rod 61 controls the partition piece 6 to move close to the side of the chip 13 away from the spraying block 4 through telescopic control. Then, when the first telescopic rod 27 inside the adjustment plate 26 controls the position of the defoaming needle 24 through telescopic control, it can pass through the partition piece 6 while avoiding some electronic devices on the substrate 11, and defoam the gaps between the metal balls 12;

[0041] When the defoaming needle 24 and the auxiliary defoaming fork 241 penetrate into the gap between the metal balls 12, the symmetrically arranged auxiliary defoaming forks 241 will contact the metal balls 12. Then, as the defoaming needle 24 continues to penetrate, the auxiliary defoaming forks 241 will bend until they pass through the gap between the metal balls 12. When the defoaming needle 24 moves in the direction away from the chip 13, the auxiliary defoaming forks 241 will also bend, but the bending amplitude will be relatively small. Until the auxiliary defoaming forks 241 contact the partition piece 6, the glue attached to the surfaces of the defoaming needle 24 and the auxiliary defoaming forks 241 will be scraped off by the partition piece 6. Then, the scraped-off glue will contact the surface of the outermost metal ball 12 because the partition piece 6 is close to the side of the chip 13 away from the spraying block 4. Thus, the side of the originally outermost metal ball 12 that was not covered with glue by capillary action will also be covered with glue.

[0042] After completion, the second telescopic rod 28 controls the telescopic displacement block 22 to slide on the arc-shaped slide rail 21 through telescoping until the telescopic displacement block 22 stays opposite to the other two surfaces of the chip 13 that are not docked with the spraying block 4. Then, the defoaming needle 24 and the auxiliary defoaming forks 241 repeat the above operations. In addition to defoaming the gap between the metal balls 12 and making the glue between the metal balls 12 more uniform, it can also apply glue to other metal balls 12 that are connected to the edge of the chip 13 but do not directly contact the glue sprayed by the spraying block 4, covering the surfaces of the metal balls 12 that have not been coated with glue, thereby effectively improving the heat dissipation performance of the chip 13 and the substrate 11.

[0043] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip packaging device, characterized in that: It comprises a base (1), a substrate (11) is mounted on the top of the base (1), a plurality of linear array metal balls (12) and a flip-chip (13) are arranged above the substrate (11), a heating block (14) is arranged below the substrate (11), and the heating block (14) is connected to the substrate (11) by controlling the metal balls (12) above the substrate (11) to release heat; An auxiliary block (2) is arranged above the base (1), a transmission block (3) is arranged above the auxiliary block (2), a power supply (15) is arranged between the base (1) and the transmission block (3), the transmission block (3) is movably connected to a spray block (4), the spray block (4) is connected to a glue bottle (5), and the spray block (4) controls the glue in the glue bottle (5) to be sprayed between the chip (13) and the substrate (11); The auxiliary block (2) comprises an arc slide rail (21), a telescopic displacement block (22), a displacement belt (23), and a bubble removal needle (24). The telescopic displacement block (22) is slidably connected inside the arc slide rail (21). The displacement belt (23) is arranged inside the telescopic displacement block (22). The displacement belt (23) comprises a toothed belt (231) and two gears (232). Both ends of each gear (232) are hinged with a rotating shaft (25). The telescopic displacement block (22) is hinged with a positioning plate (26). One end of a plurality of first telescopic rods (27) is movably connected inside the positioning plate (26). The other end of each first telescopic rod (27) is hinged with a bubble removal needle (24). The first telescopic rod (27) controls the bubble removal needle (24) to extend into the gap between the metal balls (12) by telescoping.

2. The semiconductor chip packaging device according to claim 1, characterized in that: A plurality of clamping slide rails (16) are arranged in the heating block (14), each of the clamping slide rails (16) is slidably connected to a clamping plate (17), and the clamping plate (17) is connected to the base platform (1) through a sliding control substrate (11).

3. The semiconductor chip packaging device according to claim 1, characterized in that: The auxiliary block (2) is connected to a plurality of second telescopic rods (28), the second telescopic rods (28) being symmetrically arranged with the telescopic displacement block (22) as the center, the second telescopic rods (28) controlling the telescopic displacement block (22) to slide on the arc slide rail (21) by telescoping, and when the telescopic displacement block (22) moves on the arc slide rail, the telescopic displacement block (22) itself can maintain its connection with the second telescopic rods (28) and the arc slide rail (21) by telescoping.

4. The semiconductor chip packaging device according to claim 1, characterized in that: The outer side of each of the debubble needles (24) is connected to a symmetrically arranged auxiliary debubble fork (241), and the first telescopic rod (27) controls the auxiliary debubble fork (241) to enter the gap between the metal balls (12) by telescoping.

5. The semiconductor chip packaging device according to claim 1, characterized in that: One end of a third telescopic rod (61) is also arranged in the telescopic displacement block (22), and the other end of the third telescopic rod (61) is connected to a connecting block (62). A plurality of partition pieces (6) are hingedly connected to the connecting block (62), and the partition pieces (6) are movably connected to the connecting block (62). Each of the bubble removal needles (24) passes through the partition piece (6) and enters the gap between the metal balls (12). The auxiliary bubble removal fork (241) connected to each bubble removal needle (24) contacts the partition piece (6) when passing through the partition piece (6).

6. The semiconductor chip packaging device according to claim 1, characterized in that: A splash plate (18) is hingedly connected to the spray block (4), and the splash plate (18) is located outside the spray block (4) and away from the chip (13).

7. The semiconductor chip packaging device according to claim 4, characterized in that: The auxiliary debubble fork (241) has an arc shape, and the center of the auxiliary debubble fork (241) is arranged toward a side close to the chip (13).

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