Method for embedding magnetic materials in circuit boards

Abstract

The present invention discloses a method for embedding magnetic material in a circuit board, comprising the following steps: preparing a substrate, an isolation film, and a magnetic film, wherein the substrate includes two first surfaces facing each other along its thickness direction; disposing an isolation film on both first surfaces, forming a through hole in at least one of the isolation films, forming a receiving hole in the substrate, and connecting the through hole to the receiving hole; disposing a magnetic film on the surface of the isolation film having the through hole, so that the magnetic film covers the through hole; hot pressing the magnetic film to form the magnetic material into a molten state, and allowing the molten magnetic material to pass through the through hole into the receiving hole; and removing the isolation film to remove any magnetic material remaining on the surface of the isolation film. In this embodiment, the isolation film is used to separate the magnetic material from the substrate, which can prevent the magnetic material from overflowing onto the surface of the substrate during hole filling. After the hole filling is completed, the isolation film is removed to remove any magnetic material remaining on the surface of the isolation film, thereby simplifying substrate processing.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a method for embedding magnetic materials in a circuit board. Background Art

[0002] With the rapid development of electronic technology, particularly the widespread application of wireless communications, the Internet of Things, and high-frequency electronic devices, performance requirements for electronic components are increasing. In these applications, magnetic materials, due to their unique electromagnetic properties, play a vital role in signal transmission, electromagnetic shielding, energy conversion, and storage. In particular, in high-frequency, high-speed, and highly integrated electronic systems, how to effectively utilize magnetic materials to improve circuit performance, reduce size, power consumption, and lower costs has become a research hotspot in the field of electronic engineering technology.

[0003] In some technologies, in order to improve the performance of the circuit board, the substrate is fully coated or covered with magnetic material, and then hot-pressed to force the magnetic material into pre-set holes, thereby achieving the goal of embedding the magnetic material in the circuit board. However, this method has the problem of magnetic material overflowing onto the surface of the substrate, making the substrate difficult to clean and leading to difficulties in circuit board processing. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method for pre-filling a circuit board with magnetic material, which can prevent the magnetic material from overflowing onto the substrate, thereby simplifying the processing of the circuit board.

[0005] According to the first embodiment of the present invention, a method for embedding magnetic material in a circuit board includes the following steps:

[0006] Prepare materials: prepare a substrate, an isolation film, and a magnetic film, wherein the substrate includes two first surfaces facing each other along its thickness direction;

[0007] Manufacturing a film-coated substrate: providing the isolation films on both of the first surfaces, forming a through hole on at least one of the isolation films, forming a receiving hole on the substrate, and connecting the through hole to the receiving hole;

[0008] Arranging a magnetic film: arranging the magnetic film on the surface of the isolation film having the through hole, and making the magnetic film cover the through hole;

[0009] Filling the hole: hot pressing the magnetic film to form a molten magnetic material, and pressing the magnetic material into the receiving hole;

[0010] Film tearing: removing the isolation film to remove the magnetic material remaining on the surface of the isolation film.

[0011] The method for embedding magnetic material in a circuit board according to an embodiment of the present invention has at least the following beneficial effects:

[0012] In this embodiment, an isolation film is used to separate the magnetic material and the substrate, which can prevent the magnetic material from overflowing to the surface of the substrate when filling the holes. After the hole filling is completed, the isolation film can be directly torn off to take away the magnetic material remaining on the surface of the isolation film, making it easier to clean the residual magnetic material, thereby making the processing of the circuit board simpler.

[0013] According to some embodiments of the present invention, the specific step of forming a through hole on at least one of the isolation films in the step of manufacturing the film-coated substrate is: forming the through hole on both of the isolation films.

[0014] According to some embodiments of the present invention, the step of preparing the film-coated substrate includes the following steps:

[0015] First, the isolation film is arranged on the substrate to form a film-coated substrate, and then the through hole and the receiving hole are simultaneously processed and formed on the film-coated substrate.

[0016] According to some embodiments of the present invention, the through hole and the receiving hole are formed on the film-coated substrate by laser processing.

[0017] According to some embodiments of the present invention, the step of preparing the film-coated substrate includes the following steps:

[0018] First, the receiving hole is machined on the substrate, and burrs on the edge of the receiving hole are removed;

[0019] The isolation film is then arranged on the substrate, and the through hole is processed on the isolation film.

[0020] According to some embodiments of the present invention, the following steps are further included before the film-tearing step:

[0021] Cleaning the orifice: forming a separation groove on the magnetic material remaining on the surface of the isolation diaphragm to separate the magnetic material in the receiving hole from the magnetic material remaining on the surface of the isolation diaphragm.

[0022] According to some embodiments of the present invention, the following steps are further included after the film-tearing step:

[0023] Leveling: Cleaning the magnetic material so that it is flush with the surface of the substrate.

[0024] According to some embodiments of the present invention, the following steps are further included before the orifice cleaning step:

[0025] Curing: Curing the magnetic material.

[0026] According to some embodiments of the present invention, the curing step is to cure the magnetic material, specifically, to pre-cure the magnetic material;

[0027] The curing step further includes the following step: performing final curing on the magnetic material, wherein the hardness of the magnetic material after pre-curing is less than the hardness of the magnetic material after final curing.

[0028] According to some embodiments of the present invention, during the orifice cleaning step, at least a portion of the isolation film is retained.

[0029] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0031] Figure 1 This is a flow chart of a method for embedding magnetic materials in a circuit board according to an embodiment of the present invention;

[0032] Figure 2 This is a schematic structural diagram of a substrate and an isolation film in the step of manufacturing a film-coated substrate in a method for embedding magnetic materials in a circuit board according to an embodiment of the present invention;

[0033] Figure 3 This is a schematic structural diagram of the substrate, isolation film, and magnetic film in the step of providing a magnetic film in the method for embedding magnetic material in a circuit board according to an embodiment of the present invention;

[0034] Figure 4 This is a schematic structural diagram of the substrate, isolation film, and magnetic film in the hole filling step of the method for embedding magnetic material in a circuit board according to an embodiment of the present invention;

[0035] Figure 5 This is a schematic structural diagram of the substrate, isolation film, and magnetic film after the film is torn off in the method for embedding magnetic material in a circuit board according to an embodiment of the present invention;

[0036] Figure 6 This is a schematic structural diagram of a substrate, an isolation film, and a magnetic film in a step of providing a magnetic film in another method for embedding magnetic materials in a circuit board according to an embodiment of the present invention;

[0037] Figure 7 To correspond Figure 6 A schematic structural diagram of the substrate, isolation film, and magnetic film in the hole filling step of the circuit board magnetic material embedding method;

[0038] Figure 8 To correspond Figure 6 Schematic diagram of the structure of the substrate, isolation film, and magnetic film after the hole cleaning step in the circuit board magnetic material embedding method.

[0039] Reference numerals:

[0040] Substrate 100, first surface 110, receiving hole 120;

[0041] Isolation film 200, through hole 210;

[0042] Magnetic film 300 , first magnetic material 310 , second magnetic material 320 , separation groove 330 . DETAILED DESCRIPTION

[0043] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0044] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0045] In the description of the present invention, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0046] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0047] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0048] With the rapid development of electronic technology, especially the widespread application of wireless communications, the Internet of Things, and high-frequency electronic devices, the performance requirements for electronic components are increasing. In these applications, magnetic materials, due to their unique electromagnetic properties, play a vital role in signal transmission, electromagnetic shielding, energy conversion and storage. In particular, in high-frequency, high-speed, and highly integrated electronic systems, how to effectively utilize magnetic materials to improve circuit performance, reduce size, power consumption, and reduce costs has become a research hotspot in the current field of electronic engineering technology. In some technologies, in order to improve the performance of the circuit board, a magnetic film is set on the surface of the substrate, and then hot pressing is performed to melt the magnetic film and allow it to enter the preset holes, thereby realizing the pre-embedded magnetic parts in the substrate. However, this method has the problem of magnetic material overflowing onto the substrate surface, making the substrate difficult to clean and resulting in difficulties in substrate processing.

[0049] In view of this, the present invention proposes a method for pre-embedding magnetic materials on a substrate, which can prevent the magnetic components from overflowing onto the substrate 100, making the processing of the circuit board simpler. Figures 1 to 5 , Figure 1 This is a flow chart of a method for embedding magnetic materials in a circuit board according to an embodiment of the present invention. Figure 2 This is a schematic structural diagram of the substrate and the isolation film in the step of making a film-coated substrate in the method for embedding magnetic materials in a circuit board according to an embodiment of the present invention. Figure 3 This is a schematic structural diagram of the substrate, isolation film, and magnetic film in the step of providing a magnetic film in the method for embedding magnetic material in a circuit board according to an embodiment of the present invention. Figure 4 This is a schematic structural diagram of the substrate, isolation film, and magnetic film in the hole filling step of the circuit board magnetic material embedding method according to an embodiment of the present invention. Figure 5 This is a structural schematic diagram of the substrate, isolation film, and magnetic film after the film tearing step in the method for filling magnetic materials in a circuit board according to an embodiment of the present invention. The method for filling magnetic materials in a circuit board according to this embodiment includes the following steps: preparing materials, making a substrate with a film, pasting magnetic materials, filling holes, and tearing off films.

[0050] S100 , preparing materials: preparing a substrate 100 , an isolation film 200 and a magnetic film 300 , wherein the substrate 100 includes two first surfaces 110 facing each other along its thickness direction.

[0051] S200, making a film-coated substrate: setting an isolation film 200 on both first surfaces 110, and forming a through hole 210 on at least one of the isolation films 200, and forming a receiving hole 120 on the substrate 100, and making the through hole 210 communicate with the receiving hole 120 (such as Figure 2 shown).

[0052] S300, setting a magnetic film 300: setting a magnetic film 300 on the surface of the isolation film 200 having the through hole 210, and making the magnetic film 300 cover the through hole 210 (such as Figure 3 shown).

[0053] S400, hole filling: hot pressing the magnetic film 300 to make the magnetic material into a molten state, and make the magnetic material pass through the through hole 210 into the receiving hole 120 (such as Figure 4 shown).

[0054] S500, tearing the film: removing the isolation film 200 to remove the magnetic material (such as Figure 5 shown).

[0055] Specifically, in this embodiment, an isolation film 200 is provided on the surface of the substrate 100, and a magnetic film 300 is provided on the surface of the isolation film 200. Therefore, after the magnetic film 300 is hot-pressed, the isolation film 200 can prevent the magnetic material from overflowing to the surface of the substrate 100, that is, the magnetic material remaining outside the accommodating hole 120 is located on the surface of the isolation film 200. After the hole filling step is completed, the isolation film 200 is directly torn off, and the magnetic material remaining on the surface of the isolation film 200 is taken away (for the convenience of explanation, the magnetic material remaining on the surface of the diaphragm is referred to as the first magnetic material 310, unless otherwise specified, the same below), making it easier to clean the residual magnetic material, thereby making the processing of the circuit board simpler.

[0056] Specifically, the substrate 100 includes, but is not limited to, substrates 100 that need to be processed, such as copper-clad laminates and multilayer boards. It can be a flexible substrate 100 or a rigid substrate 100. The isolation film 200 is, for example, a polyvinyl chloride (PVC) film, a polyethylene naphthalate (PEN) film, or a polyethylene terephthalate (PET) film, with PET film being preferred. PET film has high-temperature resistance and ultra-low shrinkage properties, excellent dimensional stability, and chemical resistance after the thermal process. The isolation film 200 is directly stacked on the surface of the substrate 100 or adhered to the circuit board with an adhesive, thereby avoiding misalignment between the isolation film 200 and the substrate 100 during processing and improving processing accuracy. The adhesive is, for example, a special pressure-sensitive adhesive such as silicone pressure-sensitive adhesive, acrylic pressure-sensitive adhesive, or polyurethane pressure-sensitive adhesive, which is easy to peel off even after the lamination process without residual adhesive, making film removal easier. The magnetic film 300 can be directly stacked on the surface of the isolation film 200 facing away from the substrate 100, or adhered to the surface of the isolation film 200 through an adhesive. The hot pressing method of the magnetic film 300 can be but is not limited to vacuum hot pressing. The magnetic film 300 can be set on one side or on both sides, specifically, the magnetic film 300 is set on only one first surface 110, or the magnetic film 300 is set on both first surfaces 110. It is designed according to actual needs, as long as it is ensured that the magnetic film can fill the receiving hole 120 after hot pressing.

[0057] For example, refer to Figure 6 and Figure 7 , Figure 6This is a schematic structural diagram of a substrate, an isolation film, and a magnetic film in a step of providing a magnetic film in another method for embedding magnetic materials in a circuit board according to an embodiment of the present invention. Figure 7 To correspond Figure 6 Schematic diagram of the structure of the substrate, isolation film, and magnetic film in the hole filling step in the method for embedding magnetic material in the circuit board. In some embodiments, through holes 210 are formed on the isolation films 200 of the two first surfaces 110, that is, during the step of setting the magnetic film, magnetic materials (such as Figure 6 As shown). Therefore, during the hot pressing process, it is easier to fill the receiving hole 120, which not only improves the processing efficiency but also saves the amount of magnetic material used.

[0058] Specifically, in order to ensure that the receiving hole 120 is filled with magnetic material, the magnetic material needs to have a certain thickness. For example, in order to ensure that the receiving hole 120 is filled with magnetic material, the thickness of the magnetic film 300 is L. If the magnetic film 300 is set on only one first surface 110, it is necessary to ensure that the thickness of the magnetic film 300 on one surface is L. If the magnetic film is set on both first surfaces 110, the thickness of the magnetic material on the two first surfaces 110 can be L / 2. It can be seen that the thicker the magnetic film 300 is, the larger its overflow area will be during the hot pressing process. In this embodiment, the magnetic film 300 is set on both first surfaces 110, which can reduce the thickness of the magnetic film 300 on each first surface 110. It is sufficient to ensure that the total thickness of the magnetic film 300 on the two first surfaces is L, thereby reducing the area of ​​overflow of the magnetic film after hot pressing (such as Figure 7 As shown), more magnetic material can enter the receiving hole 120 to save the use of magnetic material.

[0059] It should be noted that, in the step S200 of producing a film-coated substrate in the above embodiment, the order of the three steps of setting the isolation film 200 on the substrate 100, opening the isolation film 200, and opening the substrate 100 is not limited. For example, in some embodiments, the step of producing a film-coated substrate includes the following steps: first setting the isolation film 200 on the substrate 100 to form a film-coated substrate, and then simultaneously processing the through hole 210 and the receiving hole 120 on the film-coated substrate to improve work efficiency. Specifically, during the processing, the isolation film 200 is first set on the surface of the substrate 100, and then the through hole 210 is formed on the surface of the isolation film 200, and the receiving hole 120 is further formed on the surface of the substrate 100 through the through hole 210. That is, in this embodiment, the mutually connected receiving hole 120 and the through hole 210 can be simultaneously processed and formed through one processing step, thereby improving the processing efficiency, and the processed through hole 210 has a higher coaxiality with the receiving hole 120, thereby improving the position accuracy between the receiving hole 120 and the through hole 210, thereby improving the quality of the magnetic material buried in the substrate 100.

[0060] Based on the above embodiment, the specific steps for forming the through hole 210 and the receiving hole 120 on the film-coated substrate are as follows: simultaneously forming the through hole 210 and the receiving hole 120 on the film-coated substrate using a laser. Specifically, laser processing can prevent burrs from forming at the edge of the hole when the substrate 100 is opened. On the one hand, it can prevent burrs from entering between the isolation film 200 and the substrate 100, thereby preventing a gap from forming between the isolation film 200 and the substrate 100. This can reduce the risk of molten magnetic material overflowing into the gap between the isolation film 200 and the substrate 100, that is, it can reduce the risk of magnetic material contacting the surface of the substrate 100, thereby reducing the difficulty of cleaning the substrate 100, thereby reducing the difficulty of processing the circuit board and saving manufacturing costs. On the other hand, it can improve the connection strength between the isolation film 200 and the substrate 100, thereby reducing the risk of the isolation film 200 falling off, thereby further reducing the risk of magnetic material contacting the surface of the substrate 100.

[0061] It is understandable that laser processing has certain requirements for the thickness of the substrate 100. When the substrate 100 is thick, it is difficult for the laser to penetrate the substrate 100. Based on this, when the substrate 100 is thick, in some embodiments, the steps of making the film-coated substrate include the following steps: first, machining the receiving hole 120 on the substrate 100 by machining, such as drilling with a drill bit, and then cleaning the burrs at the edge of the receiving hole 120 after the hole is opened. Then, the isolation film 200 is placed on the substrate 100, and the through hole 210 is machined in the isolation film 200. The reason why burrs need to be removed is that burrs will be generated on the edge of the receiving hole 120 during the machining process, so there is a risk that the burrs will enter between the isolation membrane 200 and the substrate 100. The present embodiment can effectively improve this problem. By using the processing method of the present embodiment, not only can the processing of thicker circuit boards be completed, but burrs can also be prevented from entering between the isolation membrane 200 and the substrate 100, thereby avoiding the generation of a gap between the isolation membrane 200 and the substrate 100. This can reduce the risk of the melted magnetic material overflowing into the space between the isolation membrane 200 and the substrate 100, that is, it can reduce the risk of the magnetic material contacting the surface of the substrate 100, thereby reducing the difficulty of cleaning the substrate 100, thereby reducing the difficulty of processing the circuit board and saving manufacturing costs.

[0062] It should be noted that the processing method of this embodiment is not limited to processing thicker circuit boards. Depending on actual needs, it can also be used for processing thinner circuit boards, as long as burrs can be avoided between the isolation film 200 and the surface of the substrate 100 during processing. In this embodiment, the hole opening process of the isolation film 200 can be formed by either machining or laser processing. When formed by machining, since the through hole 210 of the isolation film 200 and the receiving hole 120 on the substrate 100 have the same diameter, there is no need to replace other processing equipment, resulting in lower processing costs and less equipment space. When using laser processing, the hole opening efficiency can be improved, thereby improving the processing efficiency of the circuit board.

[0063] Reference Figure 8 , Figure 8 To correspond Figure 6 Schematic diagram of the structure of the substrate, isolation film, and magnetic film after cleaning the hole in the circuit board magnetic material embedding method. In some embodiments, the following steps are also included before the film tearing step: Cleaning the hole: Processing a separation groove 330 in the magnetic material (first magnetic material 310) remaining on the surface of the isolation film 200 to separate the magnetic material located inside the receiving hole 120 (the magnetic material located inside the receiving hole 120 is referred to as the second magnetic material 320, the same below unless otherwise specified) from the first magnetic material 310. Specifically, during the actual processing process, after the magnetic material is hot-pressed into the receiving hole 120, a certain amount of magnetic material will remain on the surface of the isolation film 200. Therefore, there is a risk of removing the second magnetic material 320 during the film tearing process. Based on this, in this embodiment, a groove is dug in the first magnetic material 310 to separate the first magnetic material 310 and the second magnetic material 320, thereby reducing the risk of the second magnetic material 320 detaching during the film tearing step. For example, in some embodiments, the opening of the through hole 210 is drilled or laser processed to the isolation film 200, or in some embodiments, the opening of the through hole 210 is drilled or laser processed to the copper layer of the substrate 100, or in some embodiments, the opening of the through hole 210 is drilled or laser processed to the isolation film 200, and the magnetic material is flush with the surface of the isolation film 200. Furthermore, in some embodiments, the opening of the through hole 210 is drilled or laser processed to the surface of the substrate 100, and the magnetic material is flush with the surface of the substrate 100. Therefore, the subsequent process does not require the circuit board to be leveled again, which makes the circuit board processing more efficient.

[0064] In some embodiments, the following steps are further included after the film tearing step: Leveling: cleaning the magnetic material so that the surface of the magnetic material is flush with the substrate 100 (eg Figure 5Specifically, after the film-tearing step, the magnetic material may protrude from the surface of the substrate 100, resulting in an uneven surface of the circuit board. Therefore, in this embodiment, after the film-tearing step, the surface of the magnetic material is cleaned to make it flush with the surface of the substrate 100, thereby improving the quality of the circuit board.

[0065] In some embodiments, the following steps are also included before the hole cleaning step: solidification: solidifying the molten magnetic material to improve the adhesion between the magnetic material and the wall of the receiving hole 120 and the stability of the shape of the magnetic material, which can further reduce the risk of the magnetic material detaching from the receiving hole 120, thereby improving the quality of the circuit board.

[0066] Based on the above embodiment, the curing step solidifies the magnetic material, specifically pre-curing the magnetic material. Following the leveling step, the following step is also included: final curing the magnetic material. The hardness of the magnetic material after pre-curing is less than the hardness of the magnetic material after final curing. Specifically, after the magnetic material is fully cured (finally cured), the magnetic material is relatively hard, which increases the difficulty of processing the magnetic material. In this embodiment, the curing of the magnetic material is divided into pre-curing before cleaning the hole and final curing after leveling. The pre-cured magnetic material not only ensures a certain degree of bonding with the hole wall and a fixed shape, but also facilitates drilling, milling, brushing, and laser processing, making hole cleaning and leveling easier and more convenient. Final curing also ensures that the magnetic material within the receiving hole 120 has sufficient hardness, thereby improving the quality of the circuit board.

[0067] In short, the staged curing in this embodiment ensures that the magnetic material is cured under optimal temperature conditions, thereby improving its magnetic properties and stability. Furthermore, performing the final curing step after leveling further eliminates surface irregularities and internal stresses, resulting in a smoother surface finish and higher precision for the final circuit board.

[0068] In some embodiments, during the orifice cleaning step, at least a portion of the isolation film 200 is retained, thereby preventing the substrate 100 from being accidentally damaged during the orifice cleaning step, thereby improving the quality of the processed circuit board.

[0069] While the embodiments of the present invention have been described in detail above with reference to the accompanying drawings, the present invention is not limited to the embodiments described above. Various modifications may be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof may be combined with one another unless there is a conflict.

Claims

1. A method for embedding magnetic materials in a circuit board, characterized in that: The steps include: Prepare materials: prepare a substrate, an isolation film, and a magnetic film, wherein the substrate includes two first surfaces facing each other along its thickness direction; Manufacturing a film-coated substrate: providing the isolation films on both of the first surfaces, forming a through hole on at least one of the isolation films, forming a receiving hole on the substrate, and connecting the through hole to the receiving hole; Arranging a magnetic film: arranging the magnetic film on the surface of the isolation film having the through hole, and making the magnetic film cover the through hole; Filling the hole: hot pressing the magnetic film to form a molten magnetic material, and pressing the magnetic material into the receiving hole; Film tearing: removing the isolation film to remove the magnetic material remaining on the surface of the isolation film; The following steps are also included before the film tearing step: Cleaning the orifice: forming a separation groove on the magnetic material remaining on the surface of the isolation membrane to separate the magnetic material in the receiving hole from the magnetic material remaining on the surface of the isolation membrane, and retaining at least a portion of the isolation membrane during the orifice cleaning step.

2. The method for embedding magnetic material in a circuit board according to claim 1, wherein: The specific step of forming a through hole on at least one of the isolation films in the step of manufacturing the film-coated substrate is: forming the through hole on both of the isolation films.

3. The method for embedding magnetic material in a circuit board according to claim 1 or 2, characterized in that: The step of preparing the film-coated substrate comprises the following steps: First, the isolation film is arranged on the substrate to form a film-coated substrate, and then the through hole and the receiving hole are simultaneously processed and formed on the film-coated substrate.

4. The method for embedding magnetic material in a circuit board according to claim 3, wherein: The through hole and the receiving hole are formed on the film-coated substrate by laser processing.

5. The method for embedding magnetic material in a circuit board according to claim 1 or 2, characterized in that: The step of preparing the film-coated substrate comprises the following steps: First, the receiving hole is machined on the substrate, and burrs on the edge of the receiving hole are removed; The isolation film is then arranged on the substrate, and the through hole is processed on the isolation film.

6. The method for embedding magnetic material in a circuit board according to claim 1, wherein: After the film-tearing step, the method further comprises the following steps: Leveling: Cleaning the magnetic material so that it is flush with the surface of the substrate.

7. The method for embedding magnetic material in a circuit board according to claim 1, wherein: The method further comprises the following steps before the orifice cleaning step: Curing: Curing the magnetic material.

8. The method for embedding magnetic material in a circuit board according to claim 7, characterized in that: The magnetic material is solidified in the solidification step, specifically pre-solidified; The curing step further includes the following step: performing final curing on the magnetic material, wherein the hardness of the magnetic material after pre-curing is less than the hardness of the magnetic material after final curing.

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