Circuit board golden finger processing method

Abstract

The invention discloses a circuit board golden finger processing method which comprises the following steps: providing circuit board precursors which comprise a circuit area, a golden finger area and a lead area, the circuit area is provided with a metal circuit, the golden finger area comprises a plurality of golden finger precursors, the lead area comprises a plurality of leads, and the leads are connected with the golden finger precursors; the gold finger precursor is connected with the metal circuit, a solder mask layer covering the circuit area is formed, a wet film covering the lead area is formed, a first dry film covering the lead area is formed on the wet film, a gold layer is formed on the gold finger precursor in an electroplating mode, the first dry film and the wet film are removed, and the lead is removed in an etching mode. The first dry film can completely cover the lead in the lead area, the problem that the edge of the lead is exposed does not exist, the problem that the edge of the lead is plated with gold in the gold plating process, consequently, the edge of the lead cannot be etched and removed subsequently, and then the connection stability of the circuit board is affected is solved, and the connection stability and quality of the circuit board are improved.

Description

Technical Field

[0001] The invention relates to circuit board processing technology, in particular to a circuit board gold finger processing method. Background Art

[0002] Gold Finger (or Edge Connector) refers to a row of golden conductive contacts on computer memory sticks and graphics cards. In the circuit board design and manufacturing industry, gold fingers serve as interfaces for circuit boards to connect to the outside.

[0003] In the process of preparing gold fingers for circuit boards, a wet film is usually used to cover the lead area, wherein the gold finger area is provided with a plurality of gold finger precursors, and the lead area is provided with a plurality of leads connected to the gold finger precursors, and then the leads are energized and electroplated, and gold is plated on the gold finger precursors to obtain gold fingers. Finally, the leads are removed by etching.

[0004] In the process of using wet film to cover the gold finger area and lead area, the wet film has fluidity, and the lead is protruding from the substrate surface of the circuit board, so the edge of the lead will be exposed. This situation is more obvious when the lead is at the edge of the circuit board or the lead is close to the groove edge on the circuit board, because the wet film will flow to the edge of the circuit board or into the groove. The exposed part of the lead is plated with gold during the subsequent gold plating process, which makes it impossible to be etched and removed later, thereby affecting the connection stability of the circuit board. Summary of the invention

[0005] The present invention provides a method for processing gold fingers of a circuit board, which can avoid the problem that the edge of the lead is plated with gold during the gold plating process, resulting in the inability to be subsequently etched and removed, thereby affecting the connection stability of the circuit board, thereby improving the connection stability and quality of the circuit board.

[0006] A method for processing gold fingers of a circuit board, comprising:

[0007] A circuit board precursor is provided, the circuit board precursor comprising a circuit area, a gold finger area and a lead area, the circuit area is provided with a metal circuit, the gold finger area comprises a plurality of gold finger precursors, the lead area comprises a plurality of leads, the leads are connected to the gold finger precursors, and the gold finger precursors are connected to the metal circuit;

[0008] forming a solder resist layer covering the circuit area;

[0009] forming a wet film covering the lead area;

[0010] forming a first dry film covering the lead area on the wet film;

[0011] The gold finger precursor is electrified through the lead wire and electroplated to form a gold layer on the gold finger precursor;

[0012] The first dry film and the wet film are removed, and the leads are removed by etching to obtain a circuit board with gold fingers.

[0013] Optionally, forming a solder resist layer covering the circuit area includes:

[0014] Forming a solder resist layer covering the circuit area, the gold finger area and the lead area;

[0015] The solder resist layer in the gold finger area and the lead area is removed to form a solder resist layer covering the circuit area.

[0016] Optionally, removing the solder resist layer in the gold finger area and the lead area to form a solder resist layer covering the circuit area includes:

[0017] The solder resist layer in the circuit area is exposed, and the solder resist layers in the gold finger area and the lead area are shielded from light;

[0018] The solder resist layer is cleaned by using a developing solution, and the solder resist layer in the gold finger area and the lead area is removed to form a solder resist layer covering the circuit area.

[0019] Optionally, forming a wet film covering the lead area includes:

[0020] forming a wet film covering the gold finger area and the lead area;

[0021] baking the wet film;

[0022] The wet film on the gold finger area is removed to form a wet film covering the lead area.

[0023] Optionally, removing the wet film in the gold finger area to form a wet film covering the lead area includes:

[0024] The wet film in the lead area is exposed, and the wet film in the gold finger area is shielded from light;

[0025] The wet film is cleaned with a developer to remove the wet film in the gold finger area, thereby forming a wet film covering the lead area.

[0026] Optionally, forming a first dry film covering the lead area on the wet film includes:

[0027] Forming a first dry film covering the circuit area, the gold finger area and the lead area;

[0028] The first dry film in the gold finger area is removed, and a first dry film covering the lead area is formed on the wet film.

[0029] Optionally, removing the first dry film in the gold finger area and forming a first dry film covering the lead area on the wet film includes:

[0030] The first dry film in the circuit area and the lead area is exposed, and the first dry film in the gold finger area is shielded from light;

[0031] The first dry film is cleaned with a developer to remove the first dry film in the gold finger area, and a first dry film covering the lead area is formed on the wet film.

[0032] Optionally, removing the first dry film and the wet film, and removing the lead by etching to obtain a circuit board with gold fingers includes:

[0033] removing the first dry film and the wet film;

[0034] forming a second dry film covering the circuit area and the gold finger area, exposing the lead area;

[0035] Removing the lead wire by etching;

[0036] The second dry film is removed to obtain a circuit board with gold fingers.

[0037] Optionally, forming a second dry film covering the circuit area and the gold finger area to expose the lead area includes:

[0038] forming a second dry film covering the circuit area, the gold finger area and the lead area;

[0039] The second dry film in the lead area is removed to expose the lead area.

[0040] Optionally, removing the second dry film in the lead area to expose the lead area includes:

[0041] The second dry film in the lead area is exposed to light, and the second dry film in the gold finger area and the circuit area is shielded from light;

[0042] The second dry film is cleaned with a developer to remove the second dry film in the lead area, thereby exposing the lead area.

[0043] The circuit board gold finger processing method provided by the present invention comprises: providing a circuit board precursor, the circuit board precursor comprises a circuit area, a gold finger area and a lead area, the circuit area is provided with a metal circuit, the gold finger area comprises a plurality of gold finger precursors, the lead area comprises a plurality of leads, the leads are connected to the gold finger precursors, the gold finger precursors are connected to the metal circuits, a solder resist layer covering the circuit area is formed, a wet film covering the lead area is formed, a first dry film covering the lead area is formed on the wet film, the gold finger precursor is energized through the leads, and electroplating is performed to form a gold layer on the gold finger precursor, the first dry film and the wet film are removed, and the leads are removed by etching to obtain a circuit board with gold fingers. The first dry film can completely cover the leads in the lead area, and the leads do not have the problem of edge exposure, so as to avoid the edges of the leads being plated with gold during the gold plating process, resulting in the inability to be etched and removed later, thereby affecting the connection stability of the circuit board, thereby improving the connection stability and quality of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0045] Figure 1 A schematic diagram of a partial structure of a circuit board precursor provided by the present invention;

[0046] Figure 2 A flow chart of a circuit board gold finger processing method provided by the present invention;

[0047] Figure 3 A schematic diagram of the structure of a circuit board provided by the present invention;

[0048] Figure 4 The present invention is a flowchart of another circuit board gold finger processing method provided by the present invention. DETAILED DESCRIPTION

[0049] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0050] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] In the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature. In addition, the terms "first" and "second" are only used to distinguish in description and have no special meaning.

[0052] Figure 1 A schematic diagram of a partial structure of a circuit board precursor provided by the present invention, such as Figure 1 As shown, the circuit board precursor 110 includes a circuit area A1, a gold finger area A2 and a lead area A3, the circuit area A1 is provided with a metal circuit 111, the gold finger area A2 includes a plurality of gold finger precursors 112, the lead area A3 includes a plurality of leads 113, the leads 113 are connected to the gold finger precursors 112, and the gold finger precursors 112 are connected to the metal circuit 111. The precursor described in the embodiment of the present invention is the precursor of the final product, and the final product is processed on the basis of the precursor. For example, the circuit board precursor is the precursor of the final circuit board, and the gold finger precursor is the precursor of the final gold finger.

[0053] Figure 2 A flowchart of a circuit board gold finger processing method provided by the present invention, the flowchart is based on Figure 1 The cross section shown by the CC section line is exemplified. Figure 2 As shown, the circuit board gold finger processing method includes:

[0054] S101. Provide a circuit board precursor.

[0055] like Figure 1 , 2As shown, the circuit board precursor 110 includes a circuit area A1, a gold finger area A2 and a lead area A3, the circuit area A1 is provided with a metal circuit 111, the gold finger area A2 includes a plurality of gold finger precursors 112, the lead area A3 includes a plurality of leads 113, the leads 113 are connected to the gold finger precursors 112, and the gold finger precursors 112 are connected to the metal circuit 111. The metal circuit 111, the gold finger precursors 112 and the leads 113 are provided on a carrier substrate 114.

[0056] S102, forming a solder resist layer covering the circuit area.

[0057] like Figure 2 As shown, a solder resist layer 120 covering the circuit area A1 is formed on the circuit board precursor 110, and the gold finger area A2 and the lead area A3 are not covered by the solder resist layer 120. The solder resist layer 120 is used to protect the metal circuit 111 of the circuit area A1 to avoid damage or contamination to the metal circuit 111 of the circuit area A1 during subsequent processing.

[0058] S103 , forming a wet film covering the lead area.

[0059] like Figure 2 As shown, a wet film 130 covering the lead area A3 is formed on the circuit board precursor 110, and the circuit area A1 and the gold finger area A2 are not covered by the wet film 130. The wet film 130 is a liquid ink with a certain fluidity, which is used to protect the lead 113 in the lead area A3 to prevent the formation of a gold layer on the surface of the lead 113 during the subsequent gold plating process, resulting in the problem that the lead 113 cannot be removed by etching in the subsequent process.

[0060] S104 , forming a first dry film covering the lead area on the wet film.

[0061] like Figure 2 As shown, a first dry film 140 covering the lead area A3 is formed on the wet film 130. In the embodiment of the present invention, since the wet film 130 has a certain adhesion effect, the first dry film 140 can be well attached to the wet film 130. The first dry film 140 can completely cover the lead 113 in the lead area A3, and there is no problem of edge exposure of the lead 113, which avoids the problem that the edge of the lead 113 is plated with gold during the gold plating process, resulting in the inability to be etched and removed later, thereby affecting the connection stability of the circuit board, thereby improving the connection stability and quality of the circuit board.

[0062] S105 , electrifying the gold finger precursor through the lead wire and performing electroplating to form a gold layer on the gold finger precursor.

[0063] In the embodiment of the present invention, the gold finger precursor 112 is energized through the end of the lead 113, and the entire circuit board precursor 110 is immersed in the electroplating solution for electroplating. Figure 2 As shown, a gold layer 115 is formed on the gold finger precursor 112, thereby obtaining a gold finger including the gold finger precursor 112 and the gold layer 115. Since the lead 113 in the lead area A3 is completely covered by the first dry film 140, no gold layer is formed on the surface of the lead 113.

[0064] S106, removing the first dry film and the wet film, and removing the leads by etching to obtain a circuit board with gold fingers.

[0065] Figure 3 A schematic diagram of the structure of a circuit board provided by the present invention, such as Figure 2 , 3 As shown, the first dry film 140 and the wet film 130 are removed, and the lead 113 is removed by etching to obtain a circuit board with gold fingers.

[0066] The circuit board gold finger processing method provided by the present invention comprises: providing a circuit board precursor, the circuit board precursor comprises a circuit area, a gold finger area and a lead area, the circuit area is provided with a metal circuit, the gold finger area comprises a plurality of gold finger precursors, the lead area comprises a plurality of leads, the leads are connected to the gold finger precursors, the gold finger precursors are connected to the metal circuits, a solder resist layer covering the circuit area is formed, a wet film covering the lead area is formed, a first dry film covering the lead area is formed on the wet film, the gold finger precursor is energized through the leads, and electroplating is performed to form a gold layer on the gold finger precursor, the first dry film and the wet film are removed, and the leads are removed by etching to obtain a circuit board with gold fingers. The first dry film can completely cover the leads in the lead area, and the leads do not have the problem of edge exposure, so as to avoid the edges of the leads being plated with gold during the gold plating process, resulting in the inability to be etched and removed later, thereby affecting the connection stability of the circuit board, thereby improving the connection stability and quality of the circuit board.

[0067] Figure 4 This is a flow chart of another circuit board gold finger processing method provided by the present invention. This embodiment describes the steps of the above embodiment in detail. Figure 4 As shown, the circuit board gold finger processing method includes:

[0068] S201. Provide a circuit board precursor.

[0069] like Figure 1 , 4As shown, the circuit board precursor 110 includes a circuit area A1, a gold finger area A2 and a lead area A3, the circuit area A1 is provided with a metal circuit 111, the gold finger area A2 includes a plurality of gold finger precursors 112, the lead area A3 includes a plurality of leads 113, the leads 113 are connected to the gold finger precursors 112, and the gold finger precursors 112 are connected to the metal circuit 111. The metal circuit 111, the gold finger precursors 112 and the leads 113 are provided on a carrier substrate 114.

[0070] In some embodiments of the present invention, the circuit board precursor 110 may also be subjected to automatic optical inspection, solder mask pre-treatment, plugging and other processes. Automatic optical inspection is to detect whether there are defects in the circuit area A1, the gold finger area A2 and the lead area A3, such as circuit breakage. The solder mask pre-treatment is to clean and roughen the surface of the circuit board precursor 110. The plugging is to plug some holes (if necessary) on the circuit board precursor 110 to prevent the plating of the hole wall of the circuit board precursor 110 from being damaged and causing breakage after subsequent treatment.

[0071] S202, forming a solder resist layer covering the circuit area, the gold finger area and the lead area.

[0072] like Figure 4 As shown, a solder resist layer 120 covering the circuit area A1, the gold finger area A2 and the lead area A3 is formed on the circuit board precursor 110. Exemplarily, in an embodiment of the present invention, the solder resist layer 120 covering the circuit area A1, the gold finger area A2 and the lead area A3 can be formed on the circuit board precursor 110 by solder resist silk screen printing or low-pressure spraying.

[0073] S203, removing the solder resist layer in the gold finger area and the lead area to form a solder resist layer covering the circuit area.

[0074] like Figure 4 As shown, the solder resist layer 120 of the gold finger area A2 and the lead area A3 is removed to form a solder resist layer 120 covering the circuit area A1. The solder resist layer 120 is used to protect the metal circuit 111 of the circuit area A1 to avoid damage or contamination to the metal circuit 111 of the circuit area A1 during subsequent processing.

[0075] Exemplarily, in some embodiments of the present invention, the solder resist layer 120 is a wet ink, therefore, the solder resist layer 120 may be pre-baked first, and the solder resist layer 120 may be preliminarily cured to prepare for subsequent exposure. After pre-baking, the solder resist layer 120 of the circuit area A1 is exposed, and the solder resist layer 120 of the gold finger area A2 and the lead area A3 is shielded from light. After exposure, the solder resist layer 120 is cleaned with a developer, the unexposed solder resist layer 120 of the gold finger area A2 and the lead area A3 is removed, and the exposed solder resist layer 120 of the circuit area A1 is retained, thereby forming a solder resist layer 120 covering the circuit area A1.

[0076] In the embodiment of the present invention, after the solder resist layer 120 covering the circuit area A1 is formed by exposure and development, the solder resist layer 120 may be post-baked and exposed a second time to finally solidify the solder resist layer 120 .

[0077] S204, forming a wet film covering the gold finger area and the lead area.

[0078] like Figure 4 As shown, a wet film 130 covering the gold finger area A2 and the lead area A3 is formed on the circuit board precursor 110. Exemplarily, in an embodiment of the present invention, before forming the wet film 130 covering the gold finger area A2 and the lead area A3, the circuit board precursor 110 may be cleaned to clean the gold finger area A2 and the lead area A3 to avoid poor coverage of the wet film 130. Exemplarily, in an embodiment of the present invention, the wet film 130 may be screen-printed on the gold finger area A2 and the lead area A3 by screen printing.

[0079] S205, baking the wet film.

[0080] The wet film 130 is liquid ink with a certain fluidity. In the embodiment of the present invention, the wet film 130 can be baked to be initially cured to prepare for subsequent processes.

[0081] S206, removing the wet film in the gold finger area to form a wet film covering the lead area.

[0082] like Figure 4 As shown, the wet film 130 in the gold finger area A2 is removed to form a wet film 130 covering the lead area A3. The wet film 130 is used to protect the lead 113 in the lead area A3 to prevent the formation of a gold layer on the surface of the lead 113 during the subsequent gold plating process, which results in the problem that the lead 113 cannot be removed by etching in the subsequent process.

[0083] Illustratively, in some embodiments of the present invention, the wet film 130 of the lead area A3 is exposed, the wet film 130 of the gold finger area A2 is shielded, the wet film 130 is cleaned with a developer, the unexposed wet film 130 of the gold finger area A2 is removed, and the exposed wet film 130 of the lead area A3 is retained, thereby forming a wet film 130 covering the lead area A3.

[0084] S207 , forming a first dry film covering the circuit area, the gold finger area and the lead area.

[0085] For example, before forming the first dry film covering the circuit area, the gold finger area and the lead area on the circuit board precursor, the board surface may be cleaned and deoxidized to avoid poor coverage of the first dry film. Figure 4 As shown, a first dry film 140 covering the circuit area A1, the gold finger area A2 and the lead area A3 is formed on the circuit board precursor 110. For example, a vacuum laminating machine can be used to attach the first dry film 140 to the circuit board precursor 110.

[0086] S208, removing the first dry film in the gold finger area, and forming a first dry film covering the lead area on the wet film.

[0087] like Figure 4 As shown, the first dry film 140 in the gold finger area A2 is removed, and the first dry film 140 in the circuit area A1 and the lead area A3 is retained, so that the first dry film 140 covering the lead area A3 is formed on the wet film 130. In the embodiment of the present invention, since the wet film 130 has a certain adhesion effect, the first dry film 140 can be well attached to the wet film 130. The first dry film 140 can completely cover the lead 113 in the lead area A3, and there is no problem of the edge of the lead 113 being exposed, thereby avoiding the problem that the edge of the lead 113 is plated with gold during the gold plating process, resulting in the inability to be etched and removed later, thereby affecting the connection stability of the circuit board, thereby improving the connection stability and quality of the circuit board.

[0088] In some embodiments of the present invention, the first dry film 140 in the circuit area A1 and the lead area A3 can be exposed, the first dry film 140 in the gold finger area A2 can be shielded, and then the first dry film 140 can be cleaned with a developer to remove the unexposed first dry film 140 in the gold finger area A2, and retain the exposed first dry film 140 in the circuit area A1 and the lead area A3, thereby forming a first dry film 140 covering the lead area A3 on the wet film 130.

[0089] S209, energizing the gold finger precursor through the lead wire and performing electroplating to form a gold layer on the gold finger precursor.

[0090] In the embodiment of the present invention, the gold finger precursor 112 is energized through the end of the lead 113, and the entire circuit board precursor 110 is immersed in the electroplating solution for electroplating. Figure 4 As shown, a gold layer 115 is formed on the gold finger precursor 112, thereby obtaining a gold finger including the gold finger precursor 112 and the gold layer 115. Since the lead 113 in the lead area A3 is completely covered by the first dry film 140, no gold layer is formed on the surface of the lead 113.

[0091] S210, removing the first dry film and the wet film.

[0092] like Figure 4 As shown, the first dry film 140 and the wet film 130 on the circuit board precursor 110 are removed. For example, a chemical solution can be used to clean and remove the first dry film 140 and the wet film 130. For example, the first dry film 140 and the wet film 130 can be removed in steps or in the same process, which is not limited in the embodiment of the present invention.

[0093] S211, forming a second dry film covering the circuit area and the gold finger area, exposing the lead area.

[0094] For example, before forming the second dry film, the board surface may be cleaned and deoxidized to avoid poor coverage of the second dry film. Figure 4 As shown, a second dry film 150 is formed on the circuit board precursor 110 to cover the circuit area A1 and the gold finger area A2, and the lead area A3 is exposed.

[0095] Exemplarily, a vacuum laminator may be used to attach the second dry film 150 to the circuit board precursor 110, the second dry film 150 covers the circuit area A1, the gold finger area A2 and the lead area A3, and then the second dry film 150 of the lead area A3 is removed to expose the lead area A3. Exemplarily, the second dry film 150 of the lead area A3 may be exposed, the second dry film 150 of the gold finger area A2 and the circuit area A1 is shielded from light, and then the second dry film 150 is cleaned with a developer, and the exposed second dry film of the lead area A3 is removed to expose the lead area A3.

[0096] S212, removing the leads by etching.

[0097] In the embodiment of the present invention, an etching solution may be used to etch the leads 113 in the lead area A3, thereby removing 113.

[0098] S213, removing the second dry film to obtain a circuit board with gold fingers.

[0099] In the embodiment of the present invention, the remaining second dry film 150 on the board surface can be removed by using a liquid medicine, and the board surface can be cleaned, baked, etc. to obtain a circuit board with gold fingers. The structure of the circuit board can refer to the present invention. Figure 3 , I will not go into details here.

[0100] In the embodiment of the present invention, the solder resist layer 120 may be retained to protect the metal circuits in the circuit area A1 in subsequent processes.

[0101] The present invention also provides a circuit board, which is prepared by using the circuit board gold finger processing method provided by any of the aforementioned embodiments of the present invention.

[0102] The present invention further provides an electronic device, comprising the circuit board provided by the aforementioned embodiment of the present invention.

[0103] In the description of this article, it is necessary to understand that the terms "up", "down", "left", "right", and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0104] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0105] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0106] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A method for processing gold fingers of a circuit board, characterized in that: include: A circuit board precursor is provided, the circuit board precursor comprising a circuit area, a gold finger area and a lead area, the circuit area is provided with a metal circuit, the gold finger area comprises a plurality of gold finger precursors, the lead area comprises a plurality of leads, the leads are connected to the gold finger precursors, and the gold finger precursors are connected to the metal circuit; forming a solder resist layer covering the circuit area; forming a wet film covering the lead area; forming a first dry film covering the lead area on the wet film; The gold finger precursor is electrified through the lead wire and electroplated to form a gold layer on the gold finger precursor; The first dry film and the wet film are removed, and the leads are removed by etching to obtain a circuit board with gold fingers.

2. The circuit board gold finger processing method according to claim 1, characterized in that: Forming a solder resist layer covering the circuit area, comprising: Forming a solder resist layer covering the circuit area, the gold finger area and the lead area; The solder resist layer in the gold finger area and the lead area is removed to form a solder resist layer covering the circuit area.

3. The circuit board gold finger processing method according to claim 2, characterized in that: Removing the solder resist layer in the gold finger area and the lead area to form a solder resist layer covering the circuit area, comprising: The solder resist layer in the circuit area is exposed, and the solder resist layers in the gold finger area and the lead area are shielded from light; The solder resist layer is cleaned by using a developing solution, and the solder resist layer in the gold finger area and the lead area is removed to form a solder resist layer covering the circuit area.

4. The method for processing circuit board gold fingers according to any one of claims 1 to 3, characterized in that: forming a wet film covering the lead area, comprising: forming a wet film covering the gold finger area and the lead area; baking the wet film; The wet film on the gold finger area is removed to form a wet film covering the lead area.

5. The circuit board gold finger processing method according to claim 4, characterized in that: Removing the wet film in the gold finger area to form a wet film covering the lead area includes: The wet film in the lead area is exposed, and the wet film in the gold finger area is shielded from light; The wet film is cleaned with a developer to remove the wet film in the gold finger area, thereby forming a wet film covering the lead area.

6. The method for processing circuit board gold fingers according to any one of claims 1 to 3, characterized in that: Forming a first dry film covering the lead area on the wet film, comprising: Forming a first dry film covering the circuit area, the gold finger area and the lead area; The first dry film in the gold finger area is removed, and a first dry film covering the lead area is formed on the wet film.

7. The circuit board gold finger processing method according to claim 6, characterized in that: Removing the first dry film in the gold finger area and forming a first dry film covering the lead area on the wet film, comprising: The first dry film in the circuit area and the lead area is exposed, and the first dry film in the gold finger area is shielded from light; The first dry film is cleaned with a developer to remove the first dry film in the gold finger area, and a first dry film covering the lead area is formed on the wet film.

8. The method for processing circuit board gold fingers according to any one of claims 1 to 3, characterized in that: Removing the first dry film and the wet film, and removing the lead by etching to obtain a circuit board with gold fingers, comprising: removing the first dry film and the wet film; forming a second dry film covering the circuit area and the gold finger area, exposing the lead area; Removing the lead wire by etching; The second dry film is removed to obtain a circuit board with gold fingers.

9. The circuit board gold finger processing method according to claim 8, characterized in that: Forming a second dry film covering the circuit area and the gold finger area to expose the lead area, comprising: forming a second dry film covering the circuit area, the gold finger area and the lead area; The second dry film in the lead area is removed to expose the lead area.

10. The circuit board gold finger processing method according to claim 9, characterized in that: Removing the second dry film in the lead area to expose the lead area includes: The second dry film in the lead area is exposed to light, and the second dry film in the gold finger area and the circuit area is shielded from light; The second dry film is cleaned with a developer to remove the second dry film in the lead area, thereby exposing the lead area.

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