A modular production line for semiconductor refrigeration chips

Abstract

The present invention discloses a modular production line of semiconductor refrigeration sheets, which specifically relates to the technical field of semiconductor refrigeration sheets, including a feeding plate device, a glue dispensing device, a crystal plate device, a glue dispensing flap attachment device and a reflow soldering belt furnace which are sequentially arranged along the material conveying direction, and the feeding plate device, the glue dispensing device, the crystal plate device, the glue dispensing flap attachment device and the reflow soldering belt furnace are all connected to feed materials through a line body. The present invention adopts a flexible feeding method to feed crystal grains through the setting of a mounting mechanism, and the flexible feeding can complete the material collection by vibrating the bulk material and cooperating with the visual system, without the need for additional blue film packaging equipment, which can effectively reduce material consumption and reduce production costs, and can also avoid the performance degradation caused by residual glue on the back of the crystal grain product. On the other hand, a suction nozzle is used for flexible material collection and placement, and the flexible material collection can maintain a soft landing, which can reduce damage to the crystal grain, thereby improving product performance.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor refrigeration sheets, and more specifically, to a modular production line of semiconductor refrigeration sheets. Background Art

[0002] Semiconductor cooling chip, also called thermoelectric cooling chip, is a heat pump. Its advantage is that it has no sliding parts and is used in some places where space is limited, reliability is high, and there is no refrigerant pollution. Using the Peltier effect (second thermoelectric effect) of semiconductor materials, when direct current passes through a couple made of two different semiconductor materials in series, heat can be absorbed and released at both ends of the couple respectively, achieving the purpose of cooling. It is a refrigeration technology that produces negative thermal resistance, which is characterized by no moving parts and relatively high reliability.

[0003] The main body of the cooling plate consists of three parts: the upper substrate, the middle crystal grain and the lower substrate. The three are soldered together in pairs through solder paste. The upper and lower substrates are coated with solder paste through a dispensing machine, and then the N (negative electrode) / P (positive electrode) crystal grains are placed through a plate placing machine. The flipping mechanism completes the alignment and bonding, and finally the whole piece flows into the reflow soldering furnace for welding and curing.

[0004] The traditional method of feeding grains generally adopts the method of blue film feeding, but the blue film feeding requires additional blue film packaging equipment, which will greatly increase the production cost. The blue film packaging process also has the phenomenon of residual glue on the back of the grain and grain falling off, which will cause product performance degradation and material waste. In addition, during the traditional crystal fixing and crystal removal, the grain is ejected by the bottom ejector, which can easily cause defects to the grain, thereby affecting product performance.

[0005] The present invention provides a modular production line for semiconductor refrigeration sheets, aiming to solve the problems that the traditional grain feeding method increases production costs, there are residual glue and grain shedding on the back of the product, resulting in reduced product performance and material waste, and the traditional crystal fixing and crystal extraction process easily causes defects in the grains, affecting product performance. Summary of the invention

[0006] The object of the present invention is to provide a modular production line for semiconductor refrigeration plates, so as to solve the problems proposed in the above-mentioned background technology that the traditional grain feeding method increases production costs, there are residual glue and grain shedding on the back of the product, resulting in reduced product performance and material waste, and the traditional crystal fixing and crystal extraction is prone to cause defects in the grains, affecting product performance.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a modular production line of semiconductor refrigeration plates, comprising a loading and unloading plate device, a glue dispensing device, a grain unloading plate device, a glue dispensing flap attachment device and a reflow soldering belt furnace which are sequentially arranged along the material conveying direction, wherein the loading and unloading plate device, the glue dispensing device, the grain unloading plate device, the glue dispensing flap attachment device and the reflow soldering belt furnace are all connected by a line body for feeding materials, the grain unloading plate device comprises a machine platform, and two groups of grain unloading plate devices are arranged on the machine platform, and the two groups of grain unloading plate devices are respectively used for N-pole grain unloading plate and P-pole grain unloading plate; the grain unloading plate The device includes a feeding mechanism, a mounting mechanism and a moving mechanism. The feeding mechanism is used for loading crystal grains, and the mounting mechanism is used to cooperate with the moving mechanism to pick up and mount the crystal grains on the feeding mechanism; the mounting mechanism includes a mounting head, and a plurality of motors are evenly arranged below the mounting head. A suction nozzle for picking up and mounting the crystal grains is arranged below each of the motors. A camera for visual inspection is installed on the mounting head, and an adjustment mechanism is arranged below each of the motors. The adjustment mechanism is used to adjust the position between the suction nozzle and the crystal grain when the suction nozzle picks up the crystal.

[0008] Preferably, the adjustment mechanism includes an adjustment cylinder fixedly connected to the output end of the motor, an adjustment cavity is provided in the adjustment cylinder, the adjustment cavity is connected to an external air source, an adjustment plug is slidably connected to the inside of the adjustment cavity, a mounting hole is provided at the center of the adjustment plug, the suction nozzle is fixedly connected in the mounting hole and connected to the adjustment cavity, and an elastic member is connected between the top of the adjustment plug and the adjustment cavity.

[0009] Preferably, an adjustment groove is provided at the bottom of the adjustment cylinder, and a sliding member sleeved on the outer peripheral side of the suction nozzle is slidably connected inside the adjustment groove. The bottom of the sliding member is flat, and a telescopic hole for telescoping the suction nozzle is provided at the bottom of the sliding member. A contour groove for placing grains is provided concentrically with the telescopic hole, and the edge of the contour groove is a wedge-shaped structure.

[0010] Preferably, the interior of the adjustment cylinder is provided with a plurality of telescopic channels and a plurality of adjustment channels connecting the adjustment groove and the adjustment cavity, the top of the sliding member is fixedly connected with telescopic rods having the same number and corresponding positions as the telescopic channels, each of the telescopic rods is slidably connected in the corresponding telescopic channel, the interior of the sliding member is provided with adsorption channels having the same number and corresponding positions as the telescopic rods, each of the adsorption channels is connected with the corresponding telescopic channel through the telescopic rod, and each of the adsorption channels is connected with the contoured groove.

[0011] Preferably, the adjusting plug is provided with first adjusting holes whose number is the same as that of the telescopic channels and whose positions correspond to each other, and the adjusting plug is provided with second adjusting holes whose number is the same as that of the telescopic channels and whose positions correspond to each other.

[0012] Preferably, when the adjusting plug is in the initial position under the thrust of the elastic member, the adjusting plug can block the plurality of telescopic channels and the plurality of adjusting channels; when the adjusting plug drives the suction nozzle to adsorb the grains corresponding to the position of the contoured groove, the plurality of the first adjusting holes all correspond to the positions of the corresponding telescopic channels, and the adjusting plug can block the plurality of adjusting channels.

[0013] Preferably, when the adjusting plug drives the suction nozzle to be higher than the position of the contoured groove, the plurality of first adjusting holes all correspond to the positions of the corresponding telescopic channels, and the plurality of second adjusting holes all correspond to the positions of the corresponding adjusting channels; when the adjusting plug compresses the elastic part to be in the top limit position, the adjusting plug can block the plurality of telescopic channels, and the plurality of second adjusting holes all correspond to the positions of the corresponding adjusting channels.

[0014] Preferably, the feeding mechanism comprises a feeder and a flexible vibration plate, the feeder is used to transport the grains to the flexible vibration plate, and the flexible vibration plate is used to vibrate and disperse the grains.

[0015] Preferably, the moving mechanism includes a first screw module installed on the top of the machine table for adjusting the Y-direction position of the placement mechanism, a second screw module for adjusting the X-direction position of the placement mechanism is installed on the first screw module, the placement head is installed on the second screw module, and the first screw module is a gantry structure arranged above the wire body.

[0016] Preferably, the loading and oscillating plate device is used for loading the lower substrate stack and loading the jig oscillating plate, the glue dispensing device is used for glue dispensing the copper clad sheet of the lower substrate, the glue dispensing flip cover attachment device is used for glue dispensing the copper clad sheet of the upper cover and for aligning and attaching the flip cover, the reflow soldering belt furnace is used for reflow soldering, and the loading and oscillating plate device, glue dispensing device, grain oscillating plate device, glue dispensing flip cover attachment device, reflow soldering belt furnace and wire body are all electrically connected to the controller.

[0017] Technical effects and advantages of the present invention:

[0018] 1. The present invention adopts a flexible feeding method to feed the die through the arrangement of the mounting mechanism. Compared with the traditional blue film feeding method, the flexible feeding method can complete the material picking by vibrating the bulk material and cooperating with the visual system. No additional blue film packaging equipment is required, which can effectively reduce material consumption and production costs, and can also avoid the performance degradation caused by residual glue on the back of the die product. On the other hand, the flexible material picking and placement by the suction nozzle can maintain soft landing compared with the traditional solid crystal picking method, which can reduce the damage to the die, thereby improving the product performance;

[0019] 2. The present invention sets an adjustment mechanism so that when the suction nozzle sucks and takes the grains on the flexible vibration disk, negative pressure can be generated in the profiling groove, and the suction nozzle can simultaneously suck the grains, driving the grains to be completely embedded in the profiling groove, thereby fine-tuning the position of the grains. The sliding part can drive the grains to move upward and contact and absorb with the suction nozzle again, thereby completing the position adjustment between the suction nozzle and the grains, ensuring that the grains are accurately placed in the predetermined position, reducing position errors, improving the overall accuracy of the product, and improving the product qualification rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0021] Figure 2 It is a schematic diagram of the internal structure of the grain panning device of the present invention.

[0022] Figure 3 It is a schematic diagram of the structure of the grain panning device of the present invention.

[0023] Figure 4 It is a schematic diagram of the structure of the regulating mechanism of the present invention.

[0024] Figure 5 It is an exploded view of the adjustment mechanism of the present invention.

[0025] Figure 6 It is a partial cross-sectional view of the adjustment mechanism of the present invention.

[0026] Figure 7 It is a schematic diagram of the corresponding position of the suction nozzle and the contoured groove of the present invention.

[0027] Figure 8 It is a schematic diagram of the corresponding state of the positions of the second adjustment hole and the adjustment channel of the present invention.

[0028] Fig. 9 This is a schematic diagram of the state in which the regulating plug compresses the elastic member to the limit position of the present invention.

[0029] Fig.10 It is a partial structural schematic diagram of the regulating plug of the present invention.

[0030] Fig.11It is a partial structural schematic diagram of the sliding part of the present invention.

[0031] Fig.12 It is a bottom view of the sliding member of the present invention.

[0032] The accompanying drawings are marked as follows: 1. feeding and swinging device; 11. wire body; 2. dispensing device; 3. grain swinging device; 30. machine table; 31. grain swinging device; 32. feeding mechanism; 321. feeder; 322. flexible vibration plate; 33. mounting mechanism; 330. mounting head; 331. motor; 332. nozzle; 333. camera; 34. moving mechanism; 341. first screw module; 342. second screw module ; 4. Glue dispensing flap attaching equipment; 5. Reflow soldering belt furnace; 6. Adjustment mechanism; 61. Adjustment cylinder; 62. Adjustment cavity; 63. Adjustment plug; 64. Mounting hole; 65. Elastic member; 66. Adjustment slot; 67. Sliding member; 68. Telescopic hole; 69. Contour slot; 610. Telescopic channel; 611. Adjustment channel; 612. Telescopic rod; 613. Adsorption channel; 614. First adjustment hole; 615. Second adjustment hole. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Embodiment 1

[0035] The traditional method of feeding grains generally adopts the method of blue film feeding, but the blue film feeding requires additional blue film packaging equipment, which will greatly increase the production cost. The blue film packaging process also has the phenomenon of residual glue on the back of the grain and grain falling off, which will cause product performance degradation and material waste. In addition, during the traditional crystal fixing and crystal removal, the grain is ejected by the bottom ejector, which can easily cause defects to the grain, thereby affecting product performance.

[0036] refer to Figures 1 to 12A modular production line for a semiconductor refrigeration plate according to an embodiment of the present invention comprises a loading and unloading plate device 1, a glue dispensing device 2, a crystal plate device 3, a glue dispensing flap attaching device 4 and a reflow soldering belt furnace 5 which are sequentially arranged along a material conveying direction. The loading and unloading plate device 1, the glue dispensing device 2, the crystal plate device 3, the glue dispensing flap attaching device 4 and the reflow soldering belt furnace 5 are all connected for feeding via a line body 11. The loading and unloading plate device 1 is used for loading a lower substrate stack and loading a jig plate. The glue dispensing device 2 is used for glue dispensing on a copper-clad sheet of a lower substrate. The glue dispensing flap attaching device 4 is used for glue dispensing on a copper-clad sheet of an upper cover and for aligning and attaching a flap. The reflow soldering belt furnace 5 is used for reflow soldering. The loading and unloading plate device 1, the glue dispensing device 2, the crystal plate device 3, the glue dispensing flap attaching device 4, the reflow soldering belt furnace 5 and the line body 11 are all electrically connected to a controller.

[0037] refer to Figure 1 and Figure 2 The grain oscillating device 3 includes a machine table 30, on which two groups of grain oscillating devices 31 are arranged. The two groups of grain oscillating devices 31 are used for N-pole grain oscillating and P-pole grain oscillating respectively. The grain oscillating device 31 includes a feeding mechanism 32, a mounting mechanism 33 and a moving mechanism 34. The feeding mechanism 32 is used for loading grains, and the mounting mechanism 33 is used to cooperate with the moving mechanism 34 to take and mount the grains on the feeding mechanism 32.

[0038] refer to Figure 2 and Figure 3 The placement mechanism 33 includes a placement head 330, and a plurality of motors 331 are evenly arranged below the placement head 330. The placement head 330 is equipped with driving devices with the same number and corresponding positions as the motors 331. The driving devices are used to drive the corresponding motors 331 to move up and down. The driving devices can be cylinders. A suction nozzle 332 for picking up and placing grains is arranged below each motor 331. A camera 333 for visual inspection is installed on the placement head 330.

[0039] refer to Figure 2 and Figure 3 The feeding mechanism 32 includes a feeder 321 and a flexible vibration plate 322. The feeder 321 is used to transport the grains to the flexible vibration plate 322. The flexible vibration plate 322 is used to vibrate and disperse the grains. The moving mechanism 34 includes a first screw module 341 installed on the top of the machine table 30 for adjusting the Y direction position of the mounting mechanism 33. The first screw module 341 is installed with a second screw module 342 for adjusting the X direction position of the mounting mechanism 33. The mounting head 330 is installed on the second screw module 342. The first screw module 341 is a gantry structure arranged above the linear body 11.

[0040] In actual use, the loading jig is first placed on the wire body 11 by stacking automatic loading, and the loading jig is sent into the loading and panning device 1 through the wire body 11. The lower ceramic substrate is placed on the loading jig through the loading and panning device 1. After the placement is completed, the loading jig with the lower ceramic substrate is sent into the dispensing device 2 through the wire body 11, and the copper-clad sheet is dispensed on the lower ceramic substrate through the dispensing device 2. After the dispensing is completed, the loading jig with the lower ceramic substrate is sent into the grain panning device 3 through the wire body 11, and the first group of grain panning devices is used. 31 places the N-pole crystal grains on the lower ceramic substrate, and then places the P-pole crystal grains on the lower ceramic substrate through the second group of crystal grain swaying devices 31. After the crystal grain swaying is completed, the loading jig equipped with the lower ceramic substrate is sent into the glue dispensing flap attaching device 4 through the wire body 11, and the upper cover plate is loaded and the copper cladding is glued through the glue dispensing flap attaching device 4, and then the upper cover plate and the lower substrate are flip-aligned and fitted through the glue dispensing flap attaching device 4, and finally the loading jig equipped with the overall product is sent into the reflow soldering belt furnace 5 through the wire body 11 for welding and curing.

[0041] When the grain swinging device 31 is used to place the grains on the lower ceramic substrate, the grains are first transported to the flexible vibration disk 322 by the feeder 321, and the grains are scattered by the vibration of the flexible vibration disk 322. Then, the position of the mounting mechanism 33 in the X and Y directions is adjusted by the first screw module 341 and the second screw module 342, thereby driving the camera 333 to perform visual inspection on the grains on the flexible vibration disk 322. The camera 333 transmits the visual inspection data to the controller. The controller controls the moving mechanism 34 to move in coordination with the mounting mechanism 33 according to the inspection data, and uses the suction nozzle 332 to adsorb and pick up the grains on the flexible vibration disk 322 that meet the inspection requirements. After the picking is completed, the controller controls the motor 331 to drive the suction nozzle 332 to adjust the angle of the grains through the visual inspection data of the camera 333. After the angle adjustment is completed, the controller controls the moving mechanism 34 to cooperate with the mounting mechanism 33 to place the grains on the lower ceramic substrate.

[0042] To sum up, through the setting of the mounting mechanism 33, on the one hand, a flexible feeding method is adopted to load the grains. Compared with the traditional blue film feeding, the flexible feeding can complete the material picking by vibrating the bulk material and cooperating with the visual system. No additional blue film packaging equipment is required, which can effectively reduce material consumption and reduce production costs, and can also avoid the performance degradation caused by residual glue on the back of the grain product. On the other hand, the suction nozzle 332 is used for flexible material picking and placement. Compared with the traditional solid crystal picking method, the flexible picking can maintain a soft landing, which can reduce damage to the grain, thereby improving product performance.

[0043] Embodiment 2

[0044] In actual use, since the suction nozzle 332 is made of flexible material, during the process of crystal picking and solidifying by the suction nozzle 332, due to the characteristics of the flexible material, factors such as the degree of material descent of the suction nozzle 332 and the mechanical vibration of the equipment may cause the suction nozzle 332 to shift in position when sucking the grains, thereby affecting the overall accuracy and pass rate of the product. Therefore, this embodiment improves the device described in the above embodiment.

[0045] refer to Figure 3-Figure 12 An adjusting mechanism 6 is provided under each motor 331. The adjusting mechanism 6 is used to adjust the position between the suction nozzle 332 and the grain when the suction nozzle 332 takes the crystal. The adjusting mechanism 6 includes an adjusting cylinder 61 fixedly connected to the output end of the motor 331. An adjusting cavity 62 is provided in the adjusting cylinder 61. The adjusting cavity 62 is connected to an external air source. An adjusting plug 63 is slidably connected inside the adjusting cavity 62. A mounting hole 64 is provided at the center of the adjusting plug 63. The suction nozzle 332 is fixedly connected in the mounting hole 64 and is connected to the adjusting cavity 62. An elastic member 65 is connected between the top of the adjusting plug 63 and the adjusting cavity 62.

[0046] refer to Figure 4 and Fig.12 The bottom of the adjusting cylinder 61 is provided with an adjusting groove 66, and a sliding member 67 sleeved on the outer peripheral side of the suction nozzle 332 is slidably connected inside the adjusting groove 66. The bottom of the sliding member 67 is arranged in a plane, and a telescopic hole 68 for telescopic expansion of the suction nozzle 332 is provided at the bottom of the sliding member 67. A profiling groove 69 for placing grains is provided at the bottom of the sliding member 67 and is concentric with the telescopic hole 68. The edge of the profiling groove 69 is a wedge-shaped structure. A plurality of telescopic channels 610 and a plurality of adjusting channels 611 connecting the adjusting groove 66 and the adjusting cavity 62 are provided inside the adjusting cylinder 61. The top of the sliding member 67 is fixedly connected to the telescopic channel 610. The same number of telescopic rods 612 and corresponding positions are provided, and each telescopic rod 612 is slidably connected in the corresponding telescopic channel 610. The interior of the sliding member 67 is provided with adsorption channels 613 which are the same number and corresponding positions as the telescopic rods 612. Each adsorption channel 613 is connected to the corresponding telescopic channel 610 through the telescopic rod 612, and each adsorption channel 613 is connected to the contoured groove 69. The same number of first adjustment holes 614 and corresponding positions as the telescopic channels 610 are provided on the adjusting plug 63, and the same number of second adjustment holes 615 and corresponding positions as the adjusting channels 611 are provided on the adjusting plug 63.

[0047] refer to Figure 6 When the adjusting plug 63 is in the initial position under the thrust of the elastic member 65 , the adjusting plug 63 can block the multiple telescopic channels 610 and the multiple adjusting channels 611 .

[0048] refer to Figure 7When the adjusting plug 63 drives the suction nozzle 332 to absorb the grains corresponding to the position of the profiling groove 69 , the multiple first adjusting holes 614 all correspond to the positions of the corresponding telescopic channels 610 , and the adjusting plug 63 can block the multiple adjusting channels 611 .

[0049] refer to Figure 8 When the adjustment plug 63 drives the suction nozzle 332 to be higher than the position of the contoured groove 69 , the plurality of first adjustment holes 614 all correspond to the positions of the corresponding telescopic channels 610 , and the plurality of second adjustment holes 615 all correspond to the positions of the corresponding adjustment channels 611 .

[0050] refer to Fig. 9 When the adjusting plug 63 compresses the elastic member 65 and is at the top limit position, the adjusting plug 63 can block the multiple telescopic channels 610 , and the multiple second adjusting holes 615 all correspond to the positions of the corresponding adjusting channels 611 .

[0051] During actual use, when the moving mechanism 34 cooperates with the mounting mechanism 33 to move, and the grains on the flexible vibration disk 322 are adsorbed and taken out through the suction nozzle 332, a negative pressure is generated in the adjustment chamber 62 through an external air source, and the negative pressure in the adjustment chamber 62 is transmitted to the suction nozzle 332, thereby adsorbing and taking out the grains on the flexible vibration disk 322 through the suction nozzle 332.

[0052] When the suction nozzle 332 completely absorbs the crystal grain, the suction nozzle 332 is in a blocked state. At this time, the continuous negative pressure in the regulating chamber 62 will drive the regulating plug 63 to compress the elastic member 65 and gradually move upward in the regulating chamber 62. The regulating plug 63 will drive the suction nozzle 332 and the crystal grain to gradually move upward. Figure 7 When the adjusting plug 63 drives the suction nozzle 332 and the grain to move upward to correspond to the position of the profiling groove 69, the multiple first adjusting holes 614 correspond to the positions of the corresponding telescopic channels 610. At this time, the negative pressure in the adjusting chamber 62 will enter the profiling groove 69 through the first adjusting holes 614, the telescopic channel 610, the telescopic rod 612 and the adsorption channel 613, so that negative pressure is generated in the profiling groove 69, and the suction nozzle 332 is cooperated to adsorb the grain at the same time, driving the grain to be completely embedded in the profiling groove 69, thereby fine-tuning the position of the grain.

[0053] Since the adjustment plug 63 blocks multiple adjustment channels 611 at this time, the adjustment groove 66 is in a sealed state, and the sliding member 67 cannot slide in the adjustment groove 66 at this time. The suction nozzle 332 continues to drive the grain to move upward, causing the grain to be limited by the sliding member 67, and the grain will be confined in the contoured groove 69 and detached from the suction nozzle 332.

[0054] refer to Figure 8 and Fig. 9When the suction nozzle 332 is separated from the crystal grain and the adjustment plug 63 continues to drive the suction nozzle 332 to move upward, the multiple first adjustment holes 614 all correspond to the positions of the corresponding telescopic channels 610, so that the contoured groove 69 can adsorb the crystal grain, and the multiple second adjustment holes 615 all correspond to the positions of the corresponding adjustment channels 611, so that the negative pressure in the adjustment chamber 62 enters the adjustment groove 66 through the second adjustment holes 615 and the adjustment channel 611, and the negative pressure drives the sliding member 67 to gradually move upward in the adjustment groove 66, thereby driving the crystal grain to move upward and contact with the suction nozzle 332 again for adsorption, thereby completing the position adjustment between the suction nozzle 332 and the crystal grain.

[0055] When the sliding member 67 drives the crystal grain to move upward and contact and adsorb with the suction nozzle 332 again, the adjusting plug 63 will compress the elastic member 65 to the top limit position, and the adjusting plug 63 will block the multiple telescopic channels 610 to make the negative pressure in the contoured groove 69 disappear. The multiple second adjusting holes 615 all correspond to the positions of the corresponding adjusting channels 611, so that the sliding member 67 can continue to move gradually upward in the adjusting groove 66, so that the end of the suction nozzle 332 and the crystal grain are below the sliding member 67, avoiding affecting the placement of the crystal grain.

[0056] To sum up, through the setting of the adjustment mechanism 6, when the suction nozzle 332 adsorbs the grains on the flexible vibration disk 322 to take materials, a negative pressure can be generated in the profiling groove 69, and the suction nozzle 332 can simultaneously adsorb the grains, driving the grains to be completely embedded in the profiling groove 69, thereby fine-tuning the position of the grains, and the sliding member 67 can drive the grains to move upward and contact and adsorb with the suction nozzle 332 again, thereby completing the position adjustment between the suction nozzle 332 and the grains, which can ensure that the grains are accurately placed in the predetermined position, reduce position errors, improve the overall accuracy of the product, and improve the product qualification rate.

[0057] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A modular production line for semiconductor refrigeration sheets, comprising a feeding plate device, a glue dispensing device, a grain plate device, a glue dispensing flap attaching device and a reflow soldering belt furnace sequentially arranged along the material conveying direction, characterized in that: The feeding plate swinging device, the glue dispensing device, the grain plate swinging device, the glue dispensing flap attaching device and the reflow soldering belt furnace are all connected to feed materials through a line body, and the grain plate swinging device includes a machine platform, and two groups of grain plate swinging devices are arranged on the machine platform, and the two groups of grain plate swinging devices are used for N-pole grain swinging and P-pole grain swinging respectively; The crystal grain swinging device comprises a feeding mechanism, a mounting mechanism and a moving mechanism, wherein the feeding mechanism is used for loading crystal grains, and the mounting mechanism is used for cooperating with the moving mechanism to take and mount the crystal grains on the feeding mechanism; The placement mechanism includes a placement head, a plurality of motors are evenly arranged below the placement head, a suction nozzle for picking up and placing the crystal grains is arranged below each of the motors, a camera for visual inspection is installed on the placement head, and an adjustment mechanism is arranged below each of the motors, and the adjustment mechanism is used to adjust the position between the suction nozzle and the crystal grain when the suction nozzle picks up the crystal; The regulating mechanism comprises an regulating cylinder fixedly connected to the output end of the motor, an regulating cavity is provided in the regulating cylinder, the regulating cavity is communicated with an external air source, an regulating plug is slidably connected inside the regulating cavity, a mounting hole is provided at the center of the regulating plug, the suction nozzle is fixedly connected in the mounting hole and communicated with the regulating cavity, and an elastic member is connected between the top of the regulating plug and the regulating cavity; The bottom of the adjusting cylinder is provided with an adjusting groove, the inside of the adjusting groove is slidably connected with a sliding member sleeved on the outer peripheral side of the suction nozzle, the bottom of the sliding member is arranged in a plane, the bottom of the sliding member is provided with a telescopic hole for the suction nozzle to be telescopic, the bottom of the sliding member is provided with a profiling groove for placing the grains concentrically with the telescopic hole, and the edge of the profiling groove is a wedge-shaped structure; The adjusting cylinder is provided with a plurality of telescopic channels and a plurality of adjusting channels connecting the adjusting groove and the adjusting cavity, the top of the sliding member is fixedly connected with telescopic rods having the same number and corresponding positions as the telescopic channels, each of the telescopic rods is slidably connected in the corresponding telescopic channel, the sliding member is provided with adsorption channels having the same number and corresponding positions as the telescopic rods, each of the adsorption channels is connected with the corresponding telescopic channel through the telescopic rod, and each of the adsorption channels is connected with the contoured groove; The adjusting plug is provided with first adjusting holes of the same number and corresponding positions as the telescopic channels, and the adjusting plug is provided with second adjusting holes of the same number and corresponding positions as the adjusting channels; When the adjusting plug is in the initial position under the thrust of the elastic member, the adjusting plug can block the plurality of telescopic channels and the plurality of adjusting channels; When the adjusting plug drives the suction nozzle to absorb the grains corresponding to the position of the profiling groove, the plurality of the first adjusting holes all correspond to the positions of the corresponding telescopic channels, and the adjusting plug can block the plurality of the adjusting channels; When the adjusting plug drives the suction nozzle to be higher than the position of the profiling groove, the first adjusting holes all correspond to the positions of the corresponding telescopic channels, and the second adjusting holes all correspond to the positions of the corresponding adjusting channels; When the adjusting plug compresses the elastic member to be in the top limit position, the adjusting plug can block the plurality of telescopic channels, and the plurality of the second adjusting holes all correspond to the positions of the corresponding adjusting channels.

2. The modular production line of semiconductor refrigeration sheet according to claim 1 is characterized in that: The feeding mechanism comprises a feeder and a flexible vibration plate, wherein the feeder is used to transport the crystal grains to the flexible vibration plate, and the flexible vibration plate is used to vibrate and disperse the crystal grains.

3. The modular production line of semiconductor refrigeration sheet according to claim 2 is characterized in that: The moving mechanism includes a first screw module installed on the top of the machine platform for adjusting the Y-direction position of the placement mechanism, a second screw module for adjusting the X-direction position of the placement mechanism is installed on the first screw module, the placement head is installed on the second screw module, and the first screw module is a gantry structure arranged above the wire body.

4. The modular production line of semiconductor refrigeration sheet according to claim 3 is characterized in that: The loading and oscillating plate equipment is used for loading the lower substrate stack and loading the jig oscillating plate, the glue dispensing equipment is used for glue dispensing the copper clad sheet of the lower substrate, the glue dispensing and flap attaching equipment is used for glue dispensing the copper clad sheet of the upper cover and for aligning and attaching the flap, the reflow soldering belt furnace is used for reflow soldering, and the loading and oscillating plate equipment, glue dispensing equipment, grain oscillating plate equipment, glue dispensing and flap attaching equipment, reflow soldering belt furnace and wire body are all electrically connected to the controller.

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