Multilayer flexible printed circuit board and electronic device including same

Abstract

The multilayer flexible printed circuit board of the present disclosure may include: a first flexible printed circuit board (FPCB) including a first bending region in which a conductive layer for signal transmission is disposed, where the first flexible printed circuit board includes a first dummy region extending from the first bending region; a second flexible printed circuit board including a second bending region in which a conductive layer for signal transmission is disposed, in which the second flexible printed circuit board includes a second dummy region extending from the second bending region; and a bonding layer, wherein the first dummy region and the second dummy region are bonded to each other at the bonding layer.

Description

Technical Field

[0001] The present disclosure relates to a multi-layer flexible printed circuit board and an electronic device including the same. Background Art

[0002] Electronic devices are becoming thinner and stronger, with enhanced designs and improvements to differentiate their functional elements. Electronic devices are evolving from a uniform rectangular shape to a variety of shapes. Electronic devices may have a deformable structure that is easy to carry and can use a large-screen display. Large-screen displays are evolving from flexible displays to fully foldable displays.

[0003] In a foldable electronic device having a foldable display, since a large area of ​​the display can be used in an unfolded state and the overall volume of the electronic device can be reduced in a folded state, both usability and portability can be improved. Summary of the invention

[0004] Technical issues The electronic device of the present disclosure may include a foldable housing, and each housing may include a board.

[0005] In the electronic device of the present disclosure, boards included in respective housings may be electrically connected using a multi-layered flexible printed circuit board (FPCB).

[0006] The present disclosure bonds at least a portion of a multi-layer flexible printed circuit board.

[0007] Technical solutions to the problem The multilayer flexible printed circuit board of the present disclosure may include a first flexible printed circuit board (FPCB) and a second flexible printed circuit board, the first flexible printed circuit board including a first bending area in which a conductive layer for signal transmission is disposed, and the second flexible printed circuit board including a second bending area in which a conductive layer for signal transmission is disposed. The first flexible printed circuit board may include a first dummy area extending from the first bending area, and the second flexible printed circuit board may include a second dummy area extending from the second bending area. The multilayer flexible printed circuit board may include a bonding layer, and the first dummy area and the second dummy area are bonded to the bonding layer.

[0008] An electronic device according to the present disclosure may include a hinge, a first housing connected to the hinge, and a second housing connected to the hinge and configured to be folded with the first housing around the hinge.

[0009] The electronic device of the present disclosure may include: a first printed circuit board, which is included in a first housing; a second printed circuit board, which is included in a second housing; a battery, which is included in the second housing and is arranged in a direction perpendicular to the second printed circuit board; and a multi-layer flexible printed circuit board (FPCB), which is placed on the battery in a manner that connects the first printed circuit board and the second printed circuit board.

[0010] The multilayer flexible printed circuit board of the present disclosure may include: a first flexible printed circuit board, the first flexible printed circuit board includes a first bending area in which a conductive layer for signal transmission is disposed; a second flexible printed circuit board, the second flexible printed circuit board includes a second bending area in which a conductive layer for signal transmission is disposed. The first flexible printed circuit board may include a first dummy area extending from the first bending area, and the second flexible printed circuit board may include a second dummy area extending from the second bending area. The first flexible printed circuit board may include a bonding layer, and the first dummy area and the second dummy area are bonded to the bonding layer.

[0011] Beneficial Effects of the Invention In the multi-layer flexible printed circuit board of the present disclosure, since at least some regions are bonded, interlayer separation can be prevented.

[0012] Since interlayer separation is prevented, the multi-layered flexible printed circuit board of the present disclosure can be protected from external impact.

[0013] The multi-layered flexible printed circuit board of the present disclosure can ensure a space for a battery provided therewith by bonding at least some regions using a dummy region having a thin layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure.

[0015] Figure 2a and Figure 2b 2 are front and rear views of an electronic device in an unfolded state according to an embodiment of the present disclosure.

[0016] Figure 3a and Figure 3b 2 are front and rear views of an electronic device in a folded state according to an embodiment of the present disclosure.

[0017] Figure 4a is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0018] Figure 4b is a view illustrating an arrangement structure of a hinge device in an electronic device according to an embodiment of the present disclosure.

[0019] Figure 5 is a view illustrating an example of implementing a multi-layer flexible printed circuit board in an electronic device according to an embodiment of the present disclosure.

[0020] Figure 6 is a view showing an example of implementing arrangement of a multi-layer flexible printed circuit board and other components in an electronic device according to an embodiment of the present disclosure.

[0021] Figure 7 is a front view of a multilayer flexible printed circuit board according to an embodiment of the present disclosure.

[0022] Figure 8 is a view schematically illustrating a bending area and a dummy area according to an embodiment of the present disclosure.

[0023] Fig. 9 is a view specifically illustrating a bending area and a dummy area according to an embodiment of the present disclosure.

[0024] Fig.10 The present invention schematically illustrates an embodiment of the present invention. Figure 7 A view of a cross section of a multilayer flexible printed circuit board cut along line AB.

[0025] Fig.11 The embodiment according to the present disclosure is specifically shown. Figure 7 A view of a cross section of a multilayer flexible printed circuit board cut along line AB. DETAILED DESCRIPTION

[0026] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0027] Reference Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0028] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0029] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0030] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0031] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0032] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0033] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0034] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0035] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0036] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or a value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0037] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly with an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0038] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0040] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0041] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0042] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0044] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0045] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiation element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation element may be additionally formed as a part of the antenna module 197.

[0046] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high frequency band.

[0047] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0048] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0049] Figure 2a and Figure 2b 2 are front and rear views of an electronic device in an unfolded state according to an embodiment of the present disclosure. Figure 3a and Figure 3b 2 are front and rear views of an electronic device in a folded state according to an embodiment of the present disclosure.

[0050] refer to Figures 2a to 3b The electronic device 200 may include a first housing 210 and a second housing 220 (eg, a foldable housing structure), the first housing 210 and the second housing 220 being connected via at least one hinge device (eg, Figure 4aThe hinge devices 400 and 400-1 (e.g., hinge modules or hinges) are connected to be rotatable relative to the folding axis F, and a first display 230 (e.g., a flexible display, a foldable display or a main display) provided on the first shell 210 and the second shell 220 and / or a second display 300 (e.g., a sub-display) provided on the second shell 220.

[0051] According to an embodiment, the first shell 210 and the second shell 220 may be arranged on opposite sides of the folding axis F, may have shapes that are substantially symmetrical to each other relative to the folding axis F, and may be folded to match each other. According to an embodiment, the first shell 210 and the second shell 220 may be folded asymmetrically relative to the folding axis F. According to an embodiment, the angle or distance between the first shell 210 and the second shell 220 may vary depending on the state of the electronic device. For example, the angle or distance between the first shell 210 and the second shell 220 may vary depending on whether the electronic device is in an unfolded state, a folded state, or an intermediate state. The folded state may be a state in which the first shell (210) and the second shell (220) are completely folded so that the first display (230) is not exposed to the outside. The intermediate state may be a state in which the first shell (210) and the second shell (220) are bent at a certain angle. The unfolded state may be a state in which the first shell (210) and the second shell (220) are completely unfolded.

[0052] According to an embodiment, the first housing 210 may be connected to at least one hinge device (eg, Figure 4a The second housing 220 may include hinge devices 400 and 400-1 in the unfolded state, and may include a first surface 211 disposed to face the front of the electronic device 200 when the electronic device 200 is in the unfolded state, a second surface 212 facing away from the first surface 211, and a first side surface frame 213 surrounding at least a portion of a first space 2101 between the first surface 211 and the second surface 212. According to an embodiment, the second housing 220 may be connected to at least one hinge device (e.g., Figure 4a400 and 400-1 in the folded state), and may include a third surface 221 arranged to face the front of the electronic device 200 when the electronic device 200 is in the unfolded state, a fourth surface 222 facing away from the third surface 221, and a second side surface frame 223 surrounding at least a portion of the second space 2201 between the third surface 221 and the fourth surface 222. According to an embodiment, when the electronic device 200 is in the unfolded state, the first surface 211 may be oriented in substantially the same direction as the third surface 221, and when the electronic device 200 is in the folded state, the first surface 211 may at least partially face the third surface 221. According to an embodiment, the electronic device 200 may include a recess 201 arranged to accommodate the first display 230 through a structural connection between the first shell 210 and the second shell 220. According to an embodiment, the first housing 210 may include a first protective frame 213a (e.g., a first decorative member or a first protective cover), the first protective frame 213a being arranged to overlap with an edge of the first display 230 when the first display 230 is observed from above, thereby covering the edge of the first display 230 so as not to be visible from the outside. According to an embodiment, the first protective frame 213a may be coupled to the first side surface frame 213. According to an embodiment, the first protective frame 213a may be formed integrally with the first side surface frame 213. According to an embodiment, the second housing 220 may include a second protective frame 223a (e.g., a second decorative member or a second protective cover), the second protective frame 223a being arranged to overlap with an edge of the first display 230 when the first display 230 is observed from above, thereby covering the edge of the first display 230 so as not to be visible from the outside. According to an embodiment, the second protective frame 223a may be coupled to the second side surface frame 223. According to an embodiment, the second protective frame 223a may be formed integrally with the second side surface frame 223. According to an embodiment, the first case 210 and the second case 220 may not include the first protective frame 213 a and the second protective frame 223 a , respectively.

[0053] According to various embodiments, the hinge housing 310 (eg, a hinge cover) may be disposed between the first housing 210 and the second housing 220 to hide at least one hinge device (eg, Figure 4aAccording to an embodiment, the hinge housing 310 may be hidden or exposed to the outside by a part of the first housing 210 and the second housing 220, depending on the state of the electronic device 200 (e.g., the unfolded state, the folded state, or the intermediate state). For example, when the electronic device 200 is in the unfolded state, at least a part of the hinge housing 310 may be substantially invisible from the outside by being set to be hidden by the first housing 210 and the second housing 220. According to an embodiment, when the electronic device 200 is in the folded state, at least a part of the hinge housing 310 may be set between the first housing 210 and the second housing 220 to be visible from the outside. According to an embodiment, when the electronic device 200 is in the intermediate state in which the first housing 210 and the second housing 220 are folded at a certain angle, the hinge housing 310 may be at least partially visible from the outside between the first housing 210 and the second housing 220. According to an embodiment, the hinge housing 310 may include a curved surface.

[0054] According to an embodiment, the electronic device 200 may include at least one of the following components: an input device 215, sound output devices 227 and 228, sensor modules 217a, 217b, and 226, camera modules 216a, 216b, and 225, a key input device 219, an indicator (not shown), or a connector port 229, wherein the above components are disposed on or in the first housing 210 and / or the second housing 220. In an embodiment, at least one of the above components may be omitted from the electronic device 200, or other one or more components may be additionally included in the electronic device 200.

[0055] According to an embodiment, the one or more displays 230 and 300 may include a first display 230 (eg, a flexible display) and a second display 300, the first display 230 being disposed across at least one hinge device (eg, Figure 4a The hinge device 400 and 400-1 in the electronic device 200 are supported from the first surface 211 of the first housing 210 to the third surface 221 of the second housing 220, and the second display 300 is disposed in the internal space of the second housing 220 to be at least partially visible from the outside through the fourth surface 222. In an embodiment, the second display 300 may be disposed in the internal space of the first housing 210 to be visible from the outside through the second surface 212. According to an embodiment, when the electronic device 200 is in the intermediate state, the electronic device 200 may be controlled so that the first display 230 and / or the second display 300 may be used based on the angle (folding angle) between the first housing 210 and the second housing 220.

[0056] According to an embodiment, the first display 230 may include a flexible display, at least a portion of which may be deformed into a flat shape or a curved shape. According to an embodiment, the first display 230 may include a first area 230a corresponding to the first housing 210 and a second area 230b corresponding to the second housing 220. According to an embodiment, the first display 230 may include a folding area 230c, the folding area 230c including a portion of the first area 230a and a portion of the second area 230b relative to the folding axis F. According to an embodiment, at least a portion of the folding area 230c may include a hinge corresponding to at least one hinge device (e.g., Figure 4a According to an embodiment, the division of the area of ​​the first display 230 may be based on a pair of housings 210 and 220 and at least one hinge device (eg, Figure 4a According to an embodiment, the first display 230 may be illustrated as substantially passing through a pair of housings 210 and 220 and at least one hinge device (eg, Figure 4a According to an embodiment, the first region 230a and the second region 230b may have an overall symmetrical shape or a partially asymmetrical shape with respect to the folding region 230c.

[0057] According to an embodiment, when the electronic device 200 is in the unfolded state (eg, Figure 2a and Figure 2b In the folded state (e.g., in the folded state), the first housing 210 and the second housing 220 form an angle of about 180 degrees therebetween, and the first area 230a, the second area 230b, and the folding area 230c of the first display 230 may be oriented in substantially the same direction (e.g., the z-axis direction) while substantially forming the same plane. According to an embodiment, when the electronic device 200 is in the folded state (e.g., Figure 3a and Figure 3b ), the first display 230 may be folded so that the first area 230a and the second area 230b face each other (inner folding type). According to an embodiment, when the electronic device 200 is in a folded state, the first housing 210 may be rotated at an angle of about 360 degrees relative to the second housing 220 to be folded so that the second surface 212 and the fourth surface 222 face each other. In this case, the first display 230 may be provided to be visible from the outside (outer folding type).

[0058] According to an embodiment, when the electronic device 200 is in a folded state (eg, Figure 3a and Figure 3bAccording to an embodiment, when the electronic device 200 is in a folded state (for example, Figure 3a and Figure 3b In the state of the electronic device 200, the angle formed by the first housing 210 and the second housing 220 may be in the range of about 0 degrees to about 10 degrees. In this case, the folding area 230c of the first display 230 may be bent into a curved shape (e.g., a "U" shape or a water drop shape) in the internal space of the electronic device 200.

[0059] In an embodiment, when the electronic device 200 is in the intermediate state, the first housing 210 and the second housing 220 can be connected by at least one hinge device (eg, Figure 4a In an embodiment, the first housing 210 and the second housing 220 may be connected via at least one hinge device (eg, Figure 4a The hinge devices 400 and 400 - 1 ) in the embodiment continuously move in an unfolding direction or a folding direction based on a predetermined folding angle (eg, 45 degrees).

[0060] According to an embodiment, the electronic device 200 may include a first rear surface cover 240 disposed on the second surface 212 of the first housing 210, and a second rear surface cover 250 disposed on the fourth surface 222 of the second housing 220. In an embodiment, at least a portion of the first rear surface cover 240 may be formed integrally with the first side surface frame 213. In an embodiment, at least a portion of the second rear surface cover 250 may be formed integrally with the second side surface frame 223. According to an embodiment, at least one of the first rear surface cover 240 and the second rear surface cover 250 may be made of a substantially transparent plate (e.g., a glass plate including various coatings, or a polymer plate) or an opaque plate. According to an embodiment, the first rear surface cover 240 may be made of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or an opaque plate such as a combination of two or more of the above materials. According to an embodiment, the second rear surface cover 250 may be made of a substantially transparent plate, such as glass or a polymer. In this case, the second display 300 may be provided in the inner space of the second housing 220 to be visible from the outside through the second rear surface cover 250 .

[0061] According to an embodiment, the input device 215 may include at least one microphone. According to various embodiments, the sound output devices 227 and 228 may include at least one speaker. According to an embodiment, the sound output devices 227 and 228 may include a call receiver 227 provided through the fourth surface 222 of the second housing 220, and an external speaker 228 provided through at least a portion of the second side surface frame 223 of the second housing 220. In an embodiment, the input device 215, the sound output devices 227 and 228, and the connector port 229 may be provided in a space of the first housing 210 and / or the second housing 220, and may be exposed to the outside through one or more holes provided in the first housing 210 and / or the second housing 220. In an embodiment, one or more holes provided in the first housing 210 and / or the second housing 220 may be commonly used for the input device 215 and the sound output devices 227 and 228. In an embodiment, the sound output devices 227 and 228 may include a speaker (e.g., a piezoelectric speaker) that is not exposed through one or more holes provided in the first housing 210 and / or the second housing 220.

[0062] According to an embodiment, the camera modules 216a, 216b, and 225 may include a first camera module 216a disposed on the first surface 211 of the first housing 210, a second camera module 216b disposed on the second surface 212 of the first housing 210, and / or a third camera module 225 disposed on the fourth surface 222 of the second housing 220. In an embodiment, the electronic device 200 may include a flash 218 located near the second camera module 216b. According to an embodiment, the camera modules 216a, 216b, and 225 may include one or more lenses, image sensors, and / or image signal processors. In an embodiment, at least one of the camera modules 216a, 216b, and 225 may include two or more lenses (e.g., a wide-angle lens and a telephoto lens) and two or more image sensors, and may be disposed together on one surface of the first housing 210 and / or the second housing 220.

[0063] According to an embodiment, the sensor modules 217a, 217b, and 226 may generate an electrical signal or a data value corresponding to an internal operation state or an external environment state of the electronic device 200. According to an embodiment, the sensor modules 217a, 217b, and 226 may include a first sensor module 217a disposed on the first surface 211 of the first housing 210, a second sensor module 217b disposed on the second surface 212 of the first housing 210, and / or a third sensor module 226 disposed on the fourth surface 222 of the second housing 220. In an embodiment, the sensor modules 217a, 217b, and 226 may include at least one of a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, an illumination sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (e.g., a time of flight (TOF) sensor or a light detection and ranging (Li DAR) sensor).

[0064] According to an embodiment, the electronic device 200 may further include at least one of a sensor module (not shown) such as an air pressure sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a fingerprint recognition sensor. In an embodiment, the fingerprint recognition sensor may be provided through at least one of the first side surface frame 213 of the first housing 210 and / or the second side surface frame 223 of the second housing 220.

[0065] According to an embodiment, the key input device 219 may be provided to be exposed to the outside through the first side surface frame 213 of the first housing 210. In an embodiment, the key input device 219 may be provided to be exposed to the outside through the second side surface frame 223 of the second housing 220. In an embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 219, and the key input device 219 not included may be implemented in other forms, such as soft keys, on at least one display 230 or 300. As an embodiment, the key input device 219 may be implemented by using a pressure sensor included in at least one display 230 or 300.

[0066] According to an embodiment, the connector port 229 may include a connector (e.g., a USB connector or an interface connector port module (IF module)) configured to transmit power and / or data to and receive power and / or data from an external electronic device. In an embodiment, the connector port 229 may also include a separate connector port (e.g., a headphone jack) for performing a function of transmitting and receiving audio signals to and from an external electronic device, or performing an audio signal transmission / reception function.

[0067] According to an embodiment, one or more camera modules 216a and 225 and / or one or more sensor modules 217a and 226 may be disposed in an inner space of at least one of the first housing 210 and the second housing 220 and located below an active area (display area) of the one or more displays 230 and 300. According to an embodiment, the one or more camera modules 216a and 225 and / or the one or more sensor modules 217a and 226 may be optically exposed to the outside through an opening or a transmission area formed in the one or more displays 230 and 300.

[0068] According to an embodiment, a region where the one or more displays 230 and 300 and the one or more camera modules 216a and 225 face each other may be provided as a transmissive region having a predetermined transmittance as part of the content display region.

[0069] According to an embodiment, the transmission area may have a transmittance ranging from about 5% to about 20%.

[0070] According to an embodiment, the transmissive regions may each include an area overlapping with an effective area (e.g., a viewing angle area) of one or more camera modules 216a and 225, through which light imaged by an image sensor to generate an image passes. For example, the transmissive regions of one or more displays 230 and 300 may each include an area having a lower pixel density than the periphery. For example, one or more camera modules 216a and 225 may include an under-screen camera (UDC) or an under-panel camera (UPC).

[0071] In an embodiment, one or more camera modules 216a and 225 and / or one or more sensor modules 217a and 226 may be disposed so as not to be visually exposed through a display.

[0072] Figure 4a is an exploded perspective view of an electronic device 200 according to an embodiment of the present disclosure. Figure 4b is a view illustrating an arrangement structure of a hinge device in an electronic device according to an embodiment of the present disclosure.

[0073] According to an embodiment, the electronic device 200 may include a first display 230 (e.g., a flexible display), a second display 300, one or more hinge devices 400-1 and 400-2, a pair of support frames 261 and 262, one or more boards 270 (e.g., a printed circuit board PCB), a first shell 210, a second shell 220, a first rear surface cover 240 and / or a second rear surface cover 250.

[0074] According to an embodiment, the first display 230 may include a display panel 235 (e.g., a flexible display panel) and a support plate 236 disposed below the display panel 235. According to an embodiment, the first display 230 may include a pair of reinforcing plates 237 and 238 disposed below the support plate 236. In an embodiment, the first display 230 may not include the pair of reinforcing plates 237 and 238. According to an embodiment, the display panel 235 may include a first area corresponding to the first display 230 (e.g., Figure 2a a first panel area 235a extending from the first panel area 235a and corresponding to the second area of ​​the first display 230 (eg, Figure 2a The second panel area 235b of the second display 230b) and the folding area (eg, Figure 2a According to an embodiment, the support plate 236 may be disposed between the display panel 235 and a pair of support frames 261 and 262, and may be configured to have a material and shape having a flat support structure for providing a flat support structure for the first panel area 235a and the second panel area 235b, and a bendable structure for providing bendability support for the third panel area 235c. According to an embodiment, the support plate 236 may be made of a conductive material (e.g., metal) or a non-conductive material (e.g., polymer or fiber reinforced plastic (FRP)). According to an embodiment, a pair of reinforcing plates 237 and 238 may include a first reinforcing plate 237 disposed between the support plate 236 and a pair of support frames 261 and 262 corresponding to at least a portion of the first panel area 235a and / or the third panel area 235c, and / or a second reinforcing plate 238 disposed corresponding to at least a portion of the second panel area 235b and / or the third panel area 235c. According to an embodiment, the pair of reinforcement plates 237 and 238 may be made of a metal material (eg, SUS) to help reinforce the ground connection structure and rigidity of the first display 230 .

[0075] According to an embodiment, the second display 300 may be disposed in the space between the second housing 220 and the second rear surface cover 250. According to an embodiment, the second display 300 may be disposed in the space between the second housing 220 and the second rear surface cover 250 to be visible from the outside through substantially the entire area of ​​the second rear surface cover 250.

[0076] According to an embodiment, at least a portion of the first support frame 261 may be foldably coupled to the second support frame 262 via one or more hinge devices 400 and 400-1. According to an embodiment, the electronic device 200 may include one or more wiring members 263 (e.g., a flexible printed circuit board (FPCB)) extending from at least a portion of the first support frame 261 to a portion of the second support frame 262 across the one or more hinge devices 400 and 400-1. In an embodiment, at least one wiring member 263 may be a flexible printed circuit board (FPCB).

[0077] According to an embodiment, the first supporting frame 261 may extend from the first side surface frame 213, or may be provided in a manner of being structurally coupled to the first side surface frame 213. According to an embodiment, the electronic device 200 may include a first space (e.g., Figure 2a According to an embodiment, the first housing 210 (e.g., the first housing structure) may be configured by coupling the first side surface frame 213, the first supporting frame 261, and the first rear surface cover 240. According to an embodiment, the second supporting frame 262 may extend from the second side surface frame 223, or may be provided in a manner of being structurally coupled to the second side surface frame 223. According to an embodiment, the electronic device 200 may include a second space (e.g., Figure 2a According to an embodiment, the second shell 220 (e.g., the second shell structure) may be configured by coupling the second side surface frame 223, the second support frame 262, and the second rear surface cover 250. According to an embodiment, one or more wiring members 263 and / or one or more hinge devices 400 and 400-1 may be configured to be at least partially supported by at least a portion of a pair of support frames 261 and 262. According to an embodiment, at least one wiring member 263 may be arranged in a direction spanning the first support frame 261 and the second support frame 262 (e.g., in the x-axis direction). According to an embodiment, at least one wiring member 263 may be arranged in a direction substantially perpendicular to the folding axis (e.g., Figure 2a It has a length in the direction of the y-axis or folding axis F) (e.g., the x-axis direction).

[0078] According to an embodiment, the one or more boards 270 may include a first printed circuit board 271 disposed in the first housing 210 and a second printed circuit board 272 disposed in the second housing 220. According to an embodiment, the first printed circuit board 271 and the second printed circuit board 272 may include a plurality of electronic components disposed thereon to implement various functions of the electronic device 200. According to an embodiment, the first printed circuit board 271 and the second printed circuit board 272 may be electrically connected to each other via at least one wiring member 263.

[0079] According to an embodiment, the electronic device 200 may include one or more batteries 291 and 292. According to an embodiment, the one or more batteries 291 and 292 may include a first battery 291 disposed in the first housing 210 and electrically connected to the first printed circuit board 271, and a second battery 292 disposed in the second housing 220 and electrically connected to the second printed circuit board 272. According to an embodiment, the first supporting frame 261 and the second supporting frame 262 may further include one or more expansion holes for the first battery 291 and the second battery 292.

[0080] According to an embodiment, the electronic device 200 may include one or more antennas 276 disposed in the first housing 210. According to an embodiment, the one or more antennas 276 may be disposed in an inner space (eg, Figure 2a In the first space 2101 in the battery 291, between the first battery 291 and the first rear surface cover 240. According to an embodiment, one or more antennas 276 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. In an embodiment, the antenna structure may be configured by at least a portion of the first side surface frame 213 or the second side surface frame 223, and / or a portion of the first support frame 261 and the second support frame 262, or a combination thereof.

[0081] According to an embodiment, the electronic device 200 may further include at least one electronic component assembly 274 or 275 and / or an additional support frame 263 disposed in the first space 2101 and / or the second space 2201. For example, the at least one electronic component assembly may include an interface connector port assembly 274 or a speaker assembly 275.

[0082] According to an embodiment, the electronic device 200 may include a first waterproof gasket WP1 disposed between the first display 230 and the first supporting frame 261 and a second waterproof gasket WP2 disposed between the first display 230 and the second supporting frame 262. According to an embodiment, the first waterproof gasket WP1 may provide at least one first waterproof space between the first display 230 and the first supporting frame 261. According to an embodiment, the at least one first waterproof space may accommodate an area corresponding to at least one electronic component (e.g., a camera module or a sensor module) that is provided to be supported by the first supporting frame 261. According to an embodiment, the second waterproof gasket WP2 may provide a second waterproof space between the first display 230 and the second supporting frame 262. According to an embodiment, the second waterproof space may accommodate at least a portion of a bent portion folded to the rear surface of the first display 230. For example, the second waterproof space may be provided to extend from the display panel of the first display 230 and surround at least a portion of the bent portion folded to the rear surface. In an embodiment, a control circuit (eg, a display driver IC (DDI)) and a plurality of electronic components disposed in the bent portion may be disposed in the second waterproof space, thereby protecting the control circuit from external moisture and / or foreign matter.

[0083] According to an embodiment, the electronic device 200 may include a waterproof tape 241 provided between the first rear surface cover 240 and the first housing 210. According to an embodiment, the electronic device 200 may include a joining member 251 provided between the second rear surface cover 250 and the second housing 220. In an embodiment, the joining member 251 may be provided between the second display 300 and the second housing 220. In an embodiment, the waterproof tape 241 may be replaced with the joining member 251, and the joining member 251 may be replaced with the waterproof tape 241.

[0084] According to an embodiment, one or more hinge devices 400 and 400-1 may include a first hinge device 400 disposed at one end in a direction parallel to the folding axis F and a second hinge device 400-1 disposed at the other end. According to an embodiment, the first hinge device 400 and the second hinge device 400-1 may have substantially the same configuration. According to an embodiment, the electronic device 200 may include a connection module 400-2 disposed between the first hinge device 400 and the second hinge device 400-1. According to an embodiment, the connection module 400-2 may be provided by a combination of one or more gears and / or a combination of one or more chains. In an embodiment, the connection module 400-2 may be replaced with the first hinge device 400. In an embodiment, one or more hinge devices 400 and 400-1 may be provided at one position, or at three or more positions spaced apart at predetermined intervals along a direction parallel to the folding axis F. According to an embodiment, the electronic device 200 may include a first hinge plate 311 and a second hinge plate 312 connected via one or more hinge devices 400 and 400-1. According to an embodiment, when the electronic device 200 is in the unfolded state, the first hinge plate 311 may form the same plane with the first housing 210, and when the electronic device 200 is in the unfolded state, the second hinge plate 312 may form the same plane with the second housing 220. According to an embodiment, when the electronic device 200 is in the folded state, the first display 230 may be deformed into a shape having a predetermined curved surface (e.g., a "U" shape or a teardrop shape) and accommodated in the internal space of the electronic device 200 through one or more hinge devices 400 and 400-1. According to an embodiment, when the electronic device 200 is in the folded state, the first hinge plate 311 and the second hinge plate 312 may be moved to support the folding area of ​​the first display 230 that is deformed into a shape having a curved surface (e.g., a "U" shape or a teardrop shape). Figure 2a In an embodiment, when the electronic device 200 is in the folded state, the first housing 210 and the second housing 220 may be moved to support a substantially undeformed flat portion of the first display 230 (eg, Figure 2a In an embodiment, when the electronic device 200 is in a folded state, the first hinge plate 311 may not form the same plane with the first housing 210, and the second hinge plate 312 may not form the same plane with the second housing 220.

[0085] Figure 5 is a view showing an example of implementing a multi-layer flexible printed circuit board 500 in the electronic device 200 according to an embodiment of the present disclosure.

[0086] refer to Figure 4a and Figure 5As shown in the exploded perspective view of the electronic device 200 , the electronic device 200 may include a first printed circuit board (PCB) 271 , a second printed circuit board 272 , a wiring member 263 , and a multi-layer flexible printed circuit board (multi-layer FPCB) 500 .

[0087] In an embodiment, a first printed circuit board 271 may be disposed in the first housing 210 .

[0088] In an embodiment, the second printed circuit board 272 may be disposed in the second housing 220 .

[0089] In an embodiment, the first printed circuit board 271 and the second printed circuit board 272 may include a plurality of electronic components disposed thereon to implement various functions of the electronic device 200 .

[0090] In an embodiment, the first printed circuit board 271 and the second printed circuit board 272 may be electrically connected via the wiring member 263 and the multilayer flexible printed circuit board 500 .

[0091] In an embodiment, the wiring member 263 may have a linear shape. The wiring member 263 may connect the first printed circuit board 271 and the second printed circuit board 272 in a first direction (eg, an x-axis direction).

[0092] In embodiments, the multilayer flexible printed circuit board 500 may be electrically connected to the first printed circuit board 271 in a first direction (eg, along the x-axis direction) and electrically connected to the second printed circuit board 272 in a second direction (eg, along the y-axis direction).

[0093] In an embodiment, the multi-layer flexible printed circuit board 500 may have a bending to connect the first printed circuit board 271 and the second printed circuit board 272 .

[0094] In an embodiment, the multi-layer flexible printed circuit board 500 may have a bend or curve to connect the first printed circuit board 271 and the second printed circuit board 272 .

[0095] In an embodiment, the multi-layer flexible printed circuit board 500 may have an “L” shape.

[0096] In an embodiment, the first and second bending regions 503a and 503b are bent in the multilayer flexible printed circuit board 500, and the first and second dummy regions 504a and 504b may be disposed within right angle corners circumscribed by the bends of the first and second bending regions 503a and 503b.

[0097] In an embodiment, the first dummy region 504a may be included in the first bending region 503a. The second dummy region 504b may be included in the second bending region 503b.

[0098] In an embodiment, the multilayer flexible printed circuit board 500 may include an area (e.g., a bent area) that changes direction to electrically connect a printed circuit board (e.g., the second printed circuit board 272) disposed in a second direction (e.g., the y-axis direction) and a printed circuit board (e.g., the first printed circuit board 271) disposed in a first direction (e.g., the x-axis direction).

[0099] Figure 6 is a view showing an example of an arrangement of a multi-layer flexible printed circuit board 500 and other components implemented in the electronic device 200 according to an embodiment of the present disclosure.

[0100] Figure 7 is a front view of a multilayer flexible printed circuit board 500 according to an embodiment of the present disclosure.

[0101] refer to Figure 4a , Figure 5 , Figure 6 and Figure 7 , the electronic device 200 may include a first printed circuit board 271 , a second printed circuit board 272 , a wiring member 263 , a multilayer flexible printed circuit board 500 , a battery (eg, a second battery 292 ), and hinge plates 311 and 312 .

[0102] refer to Figure 6 and Figure 7 , the multi-layer flexible printed circuit board 500 may include a first transmission region 501a, a second transmission region 502a, a first bending region 503a, and a first dummy region 504a.

[0103] refer to Figure 6 , Figure 7 and Fig.10 The first flexible printed circuit board 1001 may include a first transmission area 501a, a second transmission area 502a, a first bending area 503a, and a first dummy area 504a. The second flexible printed circuit board 1002 disposed below the first flexible printed circuit board 1001 may include a third transmission area (not shown), a fourth transmission area (not shown), a second bending area 503b, and a second dummy area 504b.

[0104] In an embodiment, the first transmission area 501a may meet the second transmission area 502b at a specified angle (eg, 90 degrees).Alternatively, the first transmission area 501a may intersect the second transmission area 502b at a specified angle (eg, 90 degrees).

[0105] In an embodiment, the first bending region 503 a and the first dummy region 504 a may be disposed in a region where the first transmission region 501 a meets the second transmission region 502 b .

[0106] In an embodiment, in the multi-layered flexible printed circuit board 500, the second flexible printed circuit board 1002 may be disposed on a lower layer of the first flexible printed circuit board 1001. The first flexible printed circuit board 1001 and the second flexible printed circuit board 1002 may be spaced apart from each other.

[0107] In an embodiment, the multilayer flexible printed circuit board 500 may include a third transmission region (not shown) on a lower layer of the first transmission region 501a, the third transmission region having the same shape as the first transmission region 501a and spaced apart from the first transmission region 501a.

[0108] In an embodiment, the multilayer flexible printed circuit board 500 may include a fourth transmission region (not shown) on a lower layer of the second transmission region 502a, the fourth transmission region having the same shape as the second transmission region 502a and spaced apart from the second transmission region 502a.

[0109] In an embodiment, the multilayer flexible printed circuit board 500 may include a second bending region 503b on a lower layer of the first bending region 503a, the second bending region 503b having the same shape as the first bending region 503a and spaced apart from the first bending region 503a.

[0110] In an embodiment, the multilayer flexible printed circuit board 500 may include a second dummy region 504b on a lower layer of the first dummy region 504a, the second dummy region 504b having the same shape as the first dummy region 504a and spaced apart from the first dummy region 504a.

[0111] In an embodiment, the first dummy region 504a and the second dummy region 504b may not include an electromagnetic interference shielding film (eg, Fig.11 The first electromagnetic interference shielding film 1101a or Fig.11 The second electromagnetic interference shielding film 1101b) and the conductive layer (eg, Fig.11 The first conductive layer 1104a or Fig.11 The second conductive layer 1104b in the embodiment of the present invention.

[0112] In an embodiment, the first dummy region 504a and the second dummy region 504b may not include a conductive layer (eg, Fig.11 The first conductive layer 1104a or Fig.11 The second conductive layer 1104b in the embodiment of the present invention.

[0113] In an embodiment, the first dummy region 504a may be thinner than the first bending region 503a because, unlike the first bending region 503a, the first dummy region 504a does not include an electromagnetic interference shielding film (eg, Fig.11 The first electromagnetic interference shielding film 1101a) and the conductive layer (eg, Fig.11 The first conductive layer 1104a in the embodiment of the present invention.

[0114] In an embodiment, the second dummy region 504b may be thinner than the second bending region 503b because, unlike the second bending region 503b, the second dummy region 504b does not include an electromagnetic interference shielding film (eg, Fig.11 The second electromagnetic interference shielding film 1101b) and the conductive layer (eg, Fig.11 The second conductive layer 1104b in the embodiment of the present invention.

[0115] In an embodiment, the first dummy region 504a may include a cover layer (eg, Fig.11 The first covering layer 1102a in the embodiment of the present invention), the film bonding layer (for example, Fig.11 The first film bonding layer 1103a) and the insulating layer (eg, Fig.11 The first insulating layer 1105a in the embodiment of the present invention.

[0116] In an embodiment, the second dummy region 504b may include a cover layer (eg, Fig.11 The second covering layer 1102b in the film bonding layer (eg, Fig.11 The second film bonding layer 1103b) and the insulating layer (eg, Fig.11 The second insulating layer 1105b in the embodiment of the present invention.

[0117] In an embodiment, the first and second bending regions 503a and 503b are bent in the multilayer flexible printed circuit board 500, and the first and second dummy regions 504a and 504b may be disposed within right angle corners circumscribed by curves of the first and second bending regions 503a and 503b.

[0118] In an embodiment, the first dummy region 504a and the second dummy region 504b are connected to a bonding layer (eg, Fig.11 The bonding layer 1010 in the bonding layer 1010 is bonded to form a bonding region (eg, Fig.11 The bonding area 1020 in the middle), and the first bending area 503a and the second bending area 503b can be combined or formed to have a small thickness.

[0119] refer to Figure 6, a bonding region bonding the first dummy region 504a and the second dummy region 504b is provided on a battery (e.g., the second battery 292). Since the bonding thickness of the first dummy region 504a and the second dummy region 504b is smaller than the bonding thickness of the first bending region 503a and the second bending region 503b, a sufficient installation space for the battery (e.g., the second battery 292) can be ensured.

[0120] In an embodiment, the third transmission area (not shown) may meet the fourth transmission area (not shown) at a specified angle (e.g., 90 degrees). Alternatively, the third transmission area (not shown) may intersect the fourth transmission area (not shown) at a specified angle (e.g., 90 degrees).

[0121] In an embodiment, the second bending region 503 b and the second dummy region 504 b may be disposed in a region where the third transmission region (not shown) meets the fourth transmission region (not shown).

[0122] In an embodiment, the multi-layer flexible printed circuit board 500 may be at least partially disposed over a battery (eg, the second battery 292 ).

[0123] In an embodiment, the multi-layer flexible printed circuit board 500 may be disposed such that the bending regions 503 a and 503 b or the dummy regions 504 a and 504 b may be disposed above a battery (eg, the second battery 292 ).

[0124] In an embodiment, the second printed circuit board 272 may be disposed in parallel to the battery (e.g., the second battery 292) in a first direction (e.g., the y-axis direction) or a vertical direction (e.g., the y-axis direction) in the second housing 220. The second printed circuit board 272 may be disposed on top of the battery (e.g., the second battery 292), and the battery (e.g., the second battery 292) may be disposed on the bottom of the second printed circuit board 272.

[0125] In an embodiment, the multi-layer flexible printed circuit board 500 may have at least a portion passing under the hinge plates 311 and 312 to be connected to the first printed circuit board 271 .

[0126] In an embodiment, the multilayer flexible printed circuit board 500 may allow at least a portion of a transmission region (eg, the first transmission region 501 a or a third transmission region (not shown)) to pass under the hinge plates 311 and 312 to be connected to the first printed circuit board 271 .

[0127] In an embodiment, the multi-layer flexible printed circuit board 500 may be at least partially fixed by the hinge plates 311 and 312 .

[0128] In an embodiment, at least a portion of a transmission region (eg, the first transmission region 501 a or the third transmission region (not shown)) of the multilayer flexible printed circuit board 500 may be fixed by the hinge plates 311 and 312 .

[0129] In embodiments, the multilayer flexible printed circuit board 500 may be electrically connected to the first printed circuit board 271 in a first direction (eg, along the x-axis direction) and electrically connected to the second printed circuit board 272 in a second direction (eg, along the y-axis direction).

[0130] In an embodiment, the multi-layer flexible printed circuit board 500 may have a bend to connect the first printed circuit board 271 and the second printed circuit board 272 .

[0131] In an embodiment, the multi-layer flexible printed circuit board 500 may have a bend or curve to connect the first printed circuit board 271 and the second printed circuit board 272 .

[0132] In an embodiment, the multi-layer flexible printed circuit board 500 may have an “L” shape.

[0133] In an embodiment, the first and second bending regions 503a and 503b are bent in the multilayer flexible printed circuit board 500, and the first and second dummy regions 504a and 504b may be disposed within right angle corners circumscribed by curves of the first and second bending regions 503a and 503b.

[0134] In an embodiment, the multilayer flexible printed circuit board 500 may include an area (e.g., a bent area) that changes direction to electrically connect a printed circuit board (e.g., the second printed circuit board 272) disposed in a second direction (e.g., the y-axis direction) and a printed circuit board (e.g., the first printed circuit board 271) disposed in a first direction (e.g., the x-axis direction).

[0135] refer to Figure 7 and Fig.11 The first transmission area 501a, the second transmission area 502a, the third transmission area (not shown), the fourth transmission area (not shown), the first bending area 503a and the second bending area 503b of the multilayer flexible printed circuit board 500 can be at least partially covered with an electromagnetic interference shielding film (or electromagnetic interference shielding layer) 1101a or 1101b.

[0136] The first dummy region 504 a and the second dummy region 504 b may not include the electromagnetic interference shielding film (or electromagnetic interference shielding layer) 1101 a or 1101 b , and the cover layer 1102 a or 1102 b may be exposed to the outside.

[0137] Figure 81 is a view schematically illustrating bending regions (eg, first and second bending regions 503 a and 503 b ) and dummy regions (eg, first and second dummy regions 504 a and 504 b ) according to an embodiment of the present disclosure.

[0138] Fig. 9 is a view specifically illustrating bending regions (eg, first and second bending regions 503 a and 503 b ) and dummy regions (eg, first and second dummy regions 504 a and 504 b ) according to an embodiment of the present disclosure.

[0139] refer to Figure 8 and Fig. 9 , the first bending region 503 a and the second bending region 503 b of the multilayer flexible printed circuit board 500 may be covered with an electromagnetic interference shielding film (or electromagnetic interference shielding layer) 1101 a or 1101 b .

[0140] In an embodiment, the first dummy region 504 a and the second dummy region 504 b may not include the electromagnetic interference shielding film (or electromagnetic interference shielding layer) 1101 a or 1101 b , and the cover layer 1102 a or 1102 b may be exposed to the outside.

[0141] In an embodiment, the first bending region 503 a and the second bending region 503 b may include a signal line 901 and / or a ground line 903 that electrically interconnects the first printed circuit board 271 and the second printed circuit board 272 by including a conductive layer.

[0142] In an embodiment, the first dummy region 504a and the second dummy region 504b may not have a conductive layer. A conductive layer may not exist in the first dummy region 504a and the second dummy region 504b.

[0143] In an embodiment, the first dummy region 504 a and the second dummy region 504 b may include a bonding layer 1010 therebetween, and the first dummy region 504 a and the second dummy region 504 b may be bonded to each other due to the bonding layer 1010 .

[0144] Fig.10 The present invention schematically illustrates an embodiment of the present invention. Figure 7 FIG. 5 is a cross-sectional view of the multilayer flexible printed circuit board 500 cut along line AB.

[0145] Fig.11 The embodiment according to the present disclosure is specifically shown. Figure 7 FIG. 5 is a cross-sectional view of the multilayer flexible printed circuit board 500 cut along line AB.

[0146] refer to Fig.10 and Fig.11The multi-layer flexible printed circuit board 500 may include a first flexible printed circuit board 1001 and a second flexible printed circuit board 1002 .

[0147] In an embodiment, the multilayer flexible printed circuit board 500 may include a bonding area 1020 where the first flexible printed circuit board 1001 and the second flexible printed circuit board 1002 are coupled. The bonding area 1020 may be an area where the first dummy area 504a and the second dummy area 504b are bonded by the bonding layer 1010.

[0148] In an embodiment, in the multi-layered flexible printed circuit board 500, the second flexible printed circuit board 1002 may be disposed on a lower layer of the first flexible printed circuit board 1001. The first flexible printed circuit board 1001 and the second flexible printed circuit board 1002 may be spaced apart from each other.

[0149] In an embodiment, the first flexible printed circuit board 1001 may include a first transmission area 501a, a second transmission area 502a, a first bending area 503a, and a first dummy area 504a. The second flexible printed circuit board 1002 disposed below the first flexible printed circuit board 1001 may include a third transmission area (not shown), a fourth transmission area (not shown), a second bending area 503b, and a second dummy area 504b.

[0150] In an embodiment, the first flexible printed circuit board 1001 may include a first bending area 503a and a first dummy area 504a. The second flexible printed circuit board 1002 may include a second bending area 503b and a second dummy area 504b.

[0151] In an embodiment, the first flexible printed circuit board 1001 may include a first electromagnetic interference (EMI) shielding film (or EMI shielding layer) 1101a, a first cover film (or cover layer) 1102a, a first film bonding layer 1103a, a first conductive layer 1104a, and a first insulating layer 1105a.

[0152] In an embodiment, in the first flexible printed circuit board 1001 , the first electromagnetic interference shielding film 1101 a , the first cover film 1102 a , the first film bonding layer 1103 a , the first conductive layer 1104 a , and the first insulating layer 1105 a may be coupled to each other.

[0153] In an embodiment, the first film bonding layer 1103 a may allow the first cover film 1102 a and the first conductive layer 1104 a to be attached thereto.

[0154] In an embodiment, the first conductive layer 1104a may be a thin copper layer.

[0155] In an embodiment, the first insulating layer 1105a may be made of polyimide.

[0156] In an embodiment, the first dummy region 504 a of the first flexible printed circuit board 1001 may include a first cover film (or cover layer) 1102 a extending from the first bending region 503 a , a first film bonding layer 1103 a , and a first insulating layer 1105 a .

[0157] In an embodiment, the second flexible printed circuit board 1002 may include a second EMI shielding film (or EMI shielding layer) 1101b, a second cover film (or cover layer) 1102b, a second film bonding layer 1103b, a second conductive layer 1104b, and a second insulating layer 1105b.

[0158] In an embodiment, in the second flexible printed circuit board 1002 , the second electromagnetic interference shielding film 1101 b , the second cover film 1102 b , the second film bonding layer 1103 b , the second conductive layer 1104 b , and the second insulating layer 1105 b may be coupled to each other.

[0159] In an embodiment, the second film bonding layer 1103b may allow the second cover film 1102b and the second conductive layer 1103b to be attached thereto.

[0160] In an embodiment, the second conductive layer 1104b may be a thin copper layer.

[0161] In an embodiment, the second insulating layer 1105b may be made of polyimide.

[0162] In an embodiment, the second dummy region 504 b of the second flexible printed circuit board 1002 may include a second cover film (or cover layer) 1102 b extending from the second bending region 503 b , a second film bonding layer 1103 b , and a second insulating layer 1105 b .

[0163] In an embodiment, the first insulating layer 1105 a and the second insulating layer 1105 b may be bonded with the bonding layer 1010 .

[0164] The thickness of the first flexible printed circuit board 1001 may be a first length T1, and the thickness of the second flexible printed circuit board 1002 may be a second length T2.

[0165] A thickness of a bonding region 1020 where the first dummy region 504 a and the second dummy region 504 b are coupled may be a third length T3 .

[0166] The first dummy region 504a and the second dummy region 504b are connected to the bonding layer 1010, but do not include the first electromagnetic interference shielding film (or electromagnetic interference shielding layer) 1101a, the second electromagnetic interference shielding film (or electromagnetic interference shielding layer) 1101b, the first conductive layer 1104a and the second conductive layer 1104b. Therefore, the thickness T3 of the first dummy region 504a and the second dummy region 504b can be less than the sum of the thickness T1 of the first flexible printed circuit board 1001 and the thickness T2 of the second flexible printed circuit board 1002.

[0167] The electronic device 200 may include a hinge (eg, Figure 4a 400 and 400-1), connected to the hinge (eg, Figure 4a The hinge device 400 and 400-1 in the embodiment of the present invention comprises a first housing (eg, the first housing 210) and a hinge device (eg, Figure 4a The hinge device 400 and 400-1 in the embodiment is configured to surround the hinge (eg, Figure 4a The second housing (eg, the second housing 220) is folded by the hinge device 400 and 400-1.

[0168] The electronic device 200 may include: a first printed circuit board 271 included in a first shell (e.g., the first shell 210); a second printed circuit board 272 included in a second shell (e.g., the second shell 220); a battery (e.g., the second battery 292) included in the second shell (e.g., the second shell 220) and arranged in a direction perpendicular to the second printed circuit board 272; and a multilayer flexible printed circuit board 500 placed on the battery (e.g., the second battery 292) to connect the first printed circuit board 271 and the second printed circuit board 272.

[0169] The multilayer flexible printed circuit board 500 may include a first flexible printed circuit board (FPCB) (e.g., the first flexible printed circuit board 1001) and a second FPCB (e.g., the second flexible printed circuit board 1002), the first flexible printed circuit board including a first bending area 503a in which a conductive layer for signal transmission is disposed, and the second flexible printed circuit board including a second bending area 503b in which a conductive layer for signal transmission is disposed. The first FPCB (e.g., the first flexible printed circuit board 1001) may include a first dummy area 504a extending from the first bending area 503a, the second FPCB (e.g., the second flexible printed circuit board 1002) may include a second dummy area 504b extending from the second bending area 503b, and may include a bonding layer bonding the first dummy area 504a and the second dummy area 504b.

[0170] The first FPCB (eg, the first flexible printed circuit board 1001 ) may include a first transmission region 501 a extending in a first direction and a second transmission region 502 a extending in a second direction perpendicular to the first direction, and a first bending region 503 a may be included in a region where the first transmission region 501 a and the second transmission region 502 a meet.

[0171] The first bending region 503 a may include a first electromagnetic interference shielding layer 1101 a , a first cover layer 1102 a , a first conductive layer 1104 a , and a first insulating layer 1105 a .

[0172] The first dummy region 504 a may include a first capping layer 1102 a extending from the first bending region 503 a and a first insulating layer 1105 a extending from the first bending region 503 a .

[0173] The second FPCB (eg, the second flexible printed circuit board 1002 ) may include a third transmission region (not shown) extending in the first direction and a fourth transmission region (not shown) extending in a second direction perpendicular to the first direction.

[0174] The second bending region 503 b may be included in a region where the third transmission region (not shown) and the fourth transmission region (not shown) meet.

[0175] In the electronic device 200 , the first transmission region 501 a and the third transmission region (not shown) may be connected to the first printed circuit board 271 , and the second transmission region 502 a and the fourth transmission region (not shown) may be connected to the second printed circuit board 272 .

[0176] The second bending region 503b may include a second electromagnetic interference shielding layer 1101b, a second cover layer 1102b, a second conductive layer 1104b and a second insulating layer 1105b.

[0177] The second dummy region 504b may include a second capping layer 1102b extending from the second bending region 503b and a second insulating layer 1105b extending from the second bending region 503b.

[0178] The first bending region 503 a and the second bending region 503 b may be placed on a battery (eg, the second battery 292 ).

[0179] The first dummy region 504 a and the second dummy region 504 b may be placed on a battery (eg, the second battery 292 ).

[0180] The multilayer flexible printed circuit board 500 may include a first flexible printed circuit board (FPCB) (e.g., the first flexible printed circuit board 1001) and a second FPCB (e.g., the second flexible printed circuit board 1002), the first flexible printed circuit board including a first bending area 503a in which a conductive layer for signal transmission is disposed, and the second flexible printed circuit board including a second bending area 503b in which a conductive layer for signal transmission is disposed. The first FPCB (e.g., the first flexible printed circuit board 1001) may include a first dummy area 504a extending from the first bending area 503a, the second FPCB (e.g., the second flexible printed circuit board 1002) may include a second dummy area 504b extending from the second bending area 503b, and may include a bonding layer bonding the first dummy area 504a and the second dummy area 504b.

[0181] The first FPCB (eg, the first flexible printed circuit board 1001 ) may include a first transmission region 501 a extending in a first direction and a second transmission region 502 a extending in a second direction perpendicular to the first direction.

[0182] The first bending region 503a may be included in a region where the first transmission region 501a and the second transmission region 502a meet.

[0183] The first bending region 503 a may include a first electromagnetic interference (EMI) shielding layer, a first cover layer 1102 a , a first conductive layer 1104 a , and a first insulating layer 1105 a .

[0184] The first dummy region 504 a may include a first capping layer 1102 a extending from the first bending region 503 a and a first insulating layer 1105 a extending from the first bending region 503 a .

[0185] The second FPCB (e.g., the second flexible printed circuit board 1002) may include a third transmission region (not shown) extending in the first direction and a fourth transmission region (not shown) extending in a second direction perpendicular to the first direction, and the second bending region 503b may be included in a region where the third transmission region (not shown) and the fourth transmission region (not shown) meet.

[0186] In the multilayer flexible printed circuit board 500 , the first transmission region 501 a and the third transmission region (not shown) may form an interlayer structure in the first direction, and the second transmission region 502 a and the fourth transmission region (not shown) may form an interlayer structure in the second direction.

[0187] The second bending region 503b may include a second electromagnetic interference shielding layer 1101b, a second cover layer 1102b, a second conductive layer, and a second insulating layer.

[0188] The first transmission region 501a and the second transmission region 502a may include a first EMI shielding layer 1101a extending from the first bending region 503a, a first cover layer 1102a extending from the first bending region 503a, a first conductive layer 1104a extending from the first bending region 503a, and a first insulating layer 1105a extending from the first bending region 503a.

[0189] The third transmission region (not shown) and the fourth transmission region (not shown) may include a second electromagnetic interference shielding layer 1101b extending from the second bending region 503b, a second cover layer 1102b extending from the second bending region 503b, a second conductive layer extending from the second bending region 503b, and a second insulating layer extending from the second bending region 503b.

[0190] The second dummy region 504b may include a second cover layer 1102b extending from the second bending region 503b and a second insulating layer extending from the second bending region 503b.

[0191] The electronic device according to the various embodiments set forth herein may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. The electronic device according to the embodiments of the present disclosure is not limited to those described above.

[0192] It should be understood that the embodiments and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, and the present disclosure includes various changes, equivalents or substitutions of the corresponding embodiments. Regarding the description of the accompanying drawings, similar reference numerals may be used to represent similar or related elements. The noun corresponding to the singular form of the project may include one or more of the project, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include all possible combinations of the project listed together in the corresponding phrase in the phrase. Terms such as "1st", "2nd", "first" and "second" may be used to simply distinguish the corresponding element from another element, and do not limit the element in other aspects (e.g., importance or order). If an element (e.g., a first element) is referred to as being “coupled to”, “coupled to”, or “connected to”, “connected to”, with or without the term “operably” or “communicatively”, this means that the element may be coupled / connected to the other element directly (e.g., wired), wirelessly, or via a third element, or coupled / connected to the other element directly (e.g., wired), wirelessly, or via a third element.

[0193] As used herein, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A "module" may be a single integrated component or its smallest unit or portion adapted to perform one or more functions. For example, according to an embodiment, a "module" may be implemented in the form of an application specific integrated circuit (ASIC).

[0194] Various embodiments of the present disclosure may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of a machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the instruction. This allows the machine to be operated to perform at least one function according to at least one instruction called. One or more instructions may each include a code generated by a compiler or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. In this document, the term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between a location where data is semi-permanently stored in the storage medium and a location where data is temporarily stored in the storage medium.

[0195] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store TM), or distributed directly between two user devices (e.g., smart phones). If distributed online, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or a relay server.

[0196] According to various embodiments, each element (e.g., module or program) of the above-mentioned elements may include a single entity or multiple entities, and some of the multiple entities may be individually arranged in any other element. According to various embodiments, one or more of the above-mentioned elements or operations may be omitted, or one or more other elements or operations may be added. Alternatively or additionally, multiple elements (e.g., module or program) may be integrated into a single element. In this case, according to various embodiments, the integrated element may still perform one or more functions of each of the multiple elements in the same or similar manner as that performed by a corresponding one of the multiple elements before integration. According to various embodiments, the operations performed by a module, program or another element may be performed sequentially, in parallel, repeatedly or heuristically, or one or more operations may be performed or omitted in a different order, or one or more other operations may be added.

Claims

1. An electronic device, comprising: Hinges; a first housing connected to the hinge; a second housing connected to the hinge and configured to fold relative to the first housing about the hinge; a first printed circuit board, the first printed circuit board being included in the first housing; a second printed circuit board, the second printed circuit board being included in the second housing; a battery included in the second housing and disposed in a direction perpendicular to the second printed circuit board; a multi-layer flexible printed circuit board, the multi-layer flexible printed circuit board being placed on the battery in a manner connecting the first printed circuit board and the second printed circuit board, The multi-layer flexible printed circuit board comprises: a first flexible printed circuit board, the first flexible printed circuit board comprising a first bending area in which a conductive layer for signal transmission is disposed, and the first flexible printed circuit board comprising a first dummy area extending from the first bending area; a second flexible printed circuit board, the second flexible printed circuit board comprising a second bending region in which a conductive layer for signal transmission is disposed, the second flexible printed circuit board comprising a second dummy region extending from the second bending region; and A bonding layer to which the first dummy region and the second dummy region are bonded.

2. The electronic device according to claim 1, wherein: The first flexible printed circuit board comprises: a first transmission region extending in a first direction; and a second transmission region extending in a second direction perpendicular to the first direction, and The first bending area is included in an area where the first transmission area and the second transmission area meet.

3. The electronic device according to claim 2, wherein: The first bending region comprises: a first electromagnetic interference shielding layer; The first covering layer, a first conductive layer; and A first insulating layer.

4. The electronic device according to claim 3, wherein: The first dummy area includes: the first cover layer extending from the first bending region; and The first insulating layer extends from the first bending region.

5. The electronic device according to claim 2, wherein: The second flexible printed circuit board comprises: a third transmission area extending in the first direction; and a fourth transmission region extending in the second direction perpendicular to the first direction, and Wherein, the second bending area is included in the area where the third transmission area and the fourth transmission area meet.

6. The electronic device according to claim 5, wherein: The first transmission region and the third transmission region are connected to the first printed circuit board.

7. The electronic device according to claim 5, wherein: The second bending region comprises: a second electromagnetic interference shielding layer; a second covering layer; a second conductive layer; and Second insulating layer.

8. The electronic device according to claim 7, wherein: The second dummy area includes: the second cover layer extending from the second bending region; and The second insulating layer extends from the second bending region.

9. The electronic device according to claim 1, wherein: The first bending area and the second bending area are located on the battery.

10. The electronic device according to claim 1, wherein: The first dummy region and the second dummy region are located on the battery.

11. A multi-layer flexible printed circuit board, comprising: a first flexible printed circuit board, the first flexible printed circuit board comprising a first bending area in which a conductive layer for signal transmission is disposed, and the first flexible printed circuit board comprising a first dummy area extending from the first bending area; a second flexible printed circuit board, the second flexible printed circuit board comprising a second bending area in which a conductive layer for signal transmission is disposed, the second flexible printed circuit board comprising a second dummy area extending from the second bending area; as well as A bonding layer to which the first dummy region and the second dummy region are bonded.

12. The multi-layer flexible printed circuit board according to claim 11, wherein The first flexible printed circuit board comprises: a first transmission region extending in a first direction; and a second transmission region extending in a second direction perpendicular to the first direction, and The first bending area is included in the area where the first transmission area and the second transmission area meet.

13. The multi-layer flexible printed circuit board according to claim 12, wherein: The first bending region comprises: a first electromagnetic interference shielding layer; a first covering layer; a first conductive layer; and A first insulating layer.

14. The multi-layer flexible printed circuit board according to claim 13, wherein: The first dummy region includes the first cover layer extending from the first bending region and the first insulating layer extending from the first bending region.

15. The multi-layer flexible printed circuit board according to claim 12, wherein: The second flexible printed circuit board comprises: a third transmission area extending in the first direction; and a fourth transmission region extending in the second direction perpendicular to the first direction, and Wherein, the second bending area is included in the area where the third transmission area and the fourth transmission area meet.

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