Display panel, manufacturing method thereof and display device

Abstract

The invention discloses a display panel (000), a manufacturing method thereof and a display device, and belongs to the technical field of display. A display panel (000) includes a substrate (100), a driving layer (200), a first light emitting unit (300), and a second light emitting unit (400). A plurality of first light-emitting units (300) arranged in an array are arranged on the side, away from a driving layer (200), of a substrate (100), and under the condition that each first light-emitting unit (300) emits light, the side, away from the driving layer (200), of the substrate (100) can display a corresponding picture. A plurality of second light-emitting units (400) arranged in an array are arranged on the side, away from the substrate (100), of the driving layer (200), and under the condition that the second light-emitting units (400) emit light, the side, away from the substrate (100), of the driving layer (200) can display a corresponding picture. Therefore, the display panel (000) not only can display a picture through the first light-emitting unit (300) on one side, but also can display a picture through the second light-emitting unit (400) on the other side, and the display panel (000) can perform double-sided display without using a mode of combining a backlight module and two liquid crystal display panels.

Description

Display panel, manufacturing method thereof, and display device Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display technology, people generally need double-sided display devices that can display images on both sides of the display. Such double-sided display devices are used in the communications industry, government service centers, the financial industry, the transportation industry, and business halls of service centers, such as airports, train stations, subway stations, cafeterias and other public places with large traffic flows. Therefore, double-sided display devices have broad application prospects.

[0003] Currently, a double-sided display device generally includes a backlight module and two liquid crystal display panels located on both sides of the backlight module. The backlight module can emit light to both sides to provide light sources for the two liquid crystal display panels.

[0004] However, the light transmittance of the liquid crystal display panel is usually low, which requires the backlight module to emit light with higher brightness in order to allow both liquid crystal display panels to present a clear display image. This results in higher power consumption of the double-sided display device.

[0005] Summary of the Invention

[0006] The present invention provides a display panel, a manufacturing method thereof, and a display device. The present invention can solve the problem of high power consumption of double-sided display devices in the prior art. The technical solution is as follows:

[0007] In one aspect, a display panel is provided, comprising:

[0008] substrate;

[0009] A driving layer located on one side of the substrate, the driving layer comprising: a first driving structure and a second driving structure;

[0010] a first light-emitting unit located on a side of the substrate facing away from the driving layer, and a second light-emitting unit located on a side of the driving layer facing away from the substrate;

[0011] The first light-emitting unit is electrically connected to the first driving structure, and the second light-emitting unit is electrically connected to the second driving structure; at least one conductive layer in the first driving structure and at least one conductive layer in the second driving structure are arranged on the same layer.

[0012] Optionally, the substrate has a first via hole, and the display panel further includes: a overlapping electrode, at least a portion of the overlapping electrode is located in the first via hole, the overlapping electrode is electrically connected to the first driving structure, and the side of the overlapping electrode facing away from the first driving structure is electrically connected to the first light-emitting unit.

[0013] Optionally, the side of the substrate facing away from the driving layer has a groove connected to the first via hole, and the display panel also includes: a first solder pad located in the groove, one side of the first solder pad is connected to the overlapping electrode, and the side of the first solder pad facing away from the overlapping electrode is electrically connected to the first light-emitting unit.

[0014] Optionally, the display panel further includes: a first protective layer located in the groove, the first protective layer is distributed between the substrate and the first pad, and the first protective layer has a second via hole, and the bonding electrode can be electrically connected to the first pad through the second via hole.

[0015] Optionally, the display panel further includes: a second protective layer located on a side of the substrate facing the driving layer, wherein a portion of the second protective layer extends into the first via hole and covers at least a portion of an inner wall of the first via hole;

[0016] The portion of the second protection layer extending into the first via hole has a third via hole connected to the second via hole.

[0017] Optionally, a side of the first pad facing away from the driving layer is flush with a side of the substrate facing away from the driving layer.

[0018] Optionally, the first driving structure includes a first transistor, the second driving structure includes a second transistor, the first transistor includes a first active layer, the second transistor includes a second active layer, and the first active layer and the second active layer are arranged in the same layer.

[0019] Optionally, the first transistor further includes a first source and a first drain, and the second transistor further includes a second source and a second drain; the first driving structure further includes: a first output electrode electrically connected to the first transistor, and the second driving structure further includes: a second output electrode electrically connected to the second transistor;

[0020] The first source, the first drain, the second source, the second drain, the first output electrode and the second output electrode are arranged in the same layer.

[0021] Optionally, the first transistor further includes a first gate, the first gate being insulated from the first active layer and closer to the substrate than the first active layer, the first source and the first drain both overlapping the first active layer, and the first active layer being closer to the substrate than the first source and the first drain;

[0022] The second transistor further includes a second gate, the second gate being insulated from the second active layer and closer to the substrate than the second active layer, the second source and the second drain both overlapping the second active layer, and the second active layer being closer to the substrate than the second source and the second drain;

[0023] The display panel further includes: a first switching electrode, wherein the first switching electrode, the first gate electrode and the second gate electrode are arranged in the same layer;

[0024] The first output electrode is electrically connected to the first light-emitting unit through the first switching electrode.

[0025] Optionally, the first transistor further includes a third gate, the third gate is insulated from the first active layer, and the first active layer is closer to the substrate than the third gate; the second transistor further includes a fourth gate, the fourth gate is insulated from the second active layer, and the second active layer is closer to the substrate than the fourth gate;

[0026] The display panel further includes: a second switching electrode, wherein the second switching electrode, the third gate electrode and the fourth gate electrode are arranged in the same layer;

[0027] The first output electrode is electrically connected to the first light-emitting unit through the second switching electrode and the first switching electrode in sequence.

[0028] Optionally, the display panel further includes: an insulating protection layer and a second pad located on a side of the driving layer facing away from the substrate;

[0029] The insulating protection layer has a fourth via hole corresponding to the second pad, at least a portion of the second pad extends into the fourth via hole and is electrically connected to the second output electrode, and the side of the second pad facing away from the substrate is electrically connected to the second light-emitting unit.

[0030] Optionally, the insulating protective layer includes: an organic planarizing layer and an inorganic passivation layer that are stacked, the organic planarizing layer being closer to the substrate than the inorganic passivation layer, the second pad including a portion located outside the fourth via hole, and the portion of the second pad located outside the fourth via hole being in contact with a side of the inorganic passivation layer facing away from the substrate.

[0031] Optionally, the display panel further includes: a third protective layer located on the side of the insulating protective layer facing away from the substrate, the second pad includes a portion located outside the fourth via hole, and the third protective layer covers at least part of the side surface of the portion of the second pad located outside the fourth via hole.

[0032] Optionally, a portion of the third protective layer is located on the side of the second pad facing away from the substrate, and a portion of the third protective layer located on the side of the second pad facing away from the substrate has a fifth via, and the orthographic projection of the fifth via on the plane where the substrate is located is located within the orthographic projection of the second pad on the plane where the substrate is located.

[0033] Optionally, the second pad includes a portion located outside the fourth via hole, and a thickness of the portion of the second pad located outside the fourth via hole is greater than or equal to a thickness of the third protective layer.

[0034] Optionally, the first driving structure further includes: a first connecting electrode and a second connecting electrode, wherein the first connecting electrode and the first gate are provided in the same layer and are electrically connected to the first gate, the second connecting electrode and the third gate are provided in the same layer and are electrically connected to the third gate, and the first connecting electrode and the second connecting electrode are overlapped;

[0035] The second driving structure also includes: a third connecting electrode and a fourth connecting electrode, the third connecting electrode is arranged on the same layer as the second gate, and the third connecting electrode is electrically connected to the second gate, the fourth connecting electrode is arranged on the same layer as the fourth gate, and the fourth connecting electrode is electrically connected to the fourth gate, and the third connecting electrode is overlapped with the fourth connecting electrode.

[0036] Optionally, the driving layer includes: a first metal layer and a second metal layer stacked;

[0037] The first driving structure includes: a plurality of first driving signal lines located in the first metal layer, and a second driving signal line located in the second metal layer, wherein an extension direction of the first driving signal line intersects an extension direction of the second driving signal line;

[0038] The second driving structure includes: a plurality of third driving signal lines located in the first metal layer, and a fourth driving signal line located in the second metal layer, wherein an extension direction of the third driving signal line intersects an extension direction of the fourth driving signal line;

[0039] The extending direction of the first driving signal line is parallel to the extending direction of the third driving signal line, and the extending direction of the second driving signal line is parallel to the extending direction of the fourth driving signal line.

[0040] Optionally, the plurality of first light-emitting units are arrayed into a plurality of rows and a plurality of columns, the plurality of first drive signal lines include a plurality of groups of first drive signal lines corresponding to a plurality of columns of the first light-emitting units, a group of the first drive signal lines is electrically connected to each first light-emitting unit in a corresponding column of the first light-emitting units, and a second drive signal line is electrically connected to each first light-emitting unit in a row of the first light-emitting units;

[0041] The plurality of second light-emitting units are arranged in a plurality of rows and columns, the plurality of third drive signal lines include a plurality of groups of third drive signal lines corresponding to the plurality of columns of the second light-emitting units, a group of the third drive signal lines is electrically connected to each second light-emitting unit in a corresponding column of the second light-emitting units, and one fourth drive signal line is electrically connected to each second light-emitting unit in a row of the second light-emitting units;

[0042] The plurality of first driving signal lines and the plurality of third driving signal lines are arranged alternately; and the plurality of second driving signal lines and the plurality of fourth driving signal lines are arranged alternately.

[0043] Optionally, the thickness of the first metal layer is greater than the thickness of the second metal layer.

[0044] Optionally, the first metal layer includes a stacked electroplating seed layer and a metal layer body, the electroplating seed layer is closer to the substrate than the metal layer body, and the thickness of the metal layer body is greater than that of the second metal layer.

[0045] Optionally, the display panel further comprises: a first light absorption layer located on a side of the substrate facing away from the driving layer, and a second light absorption layer located on a side of the driving layer facing away from the substrate;

[0046] The first light-emitting unit is located on a side of the first light-absorbing layer away from the substrate, and the second light-emitting unit is located on a side of the second light-absorbing layer away from the substrate.

[0047] Optionally, the first light-emitting unit and the second light-emitting unit both include: light-emitting diodes.

[0048] In another aspect, a method for manufacturing a display panel is provided, the method comprising:

[0049] forming a driving layer, a first light emitting unit and a second light emitting unit on a substrate;

[0050] In which, the driving layer is located on one side of the substrate, and the driving layer includes: a first driving structure and a second driving structure; the first light-emitting unit is located on the side of the substrate away from the driving layer, and is electrically connected to the first driving structure; the second light-emitting unit is located on the side of the driving layer away from the substrate, and is electrically connected to the second driving structure; at least one conductive layer in the first driving structure and at least one conductive layer in the second driving structure are arranged on the same layer.

[0051] Optionally, forming the driving layer, the first light-emitting unit, and the second light-emitting unit on the substrate includes:

[0052] forming a first pad on the rigid substrate;

[0053] forming the substrate on a side of the first pad facing away from the rigid substrate, the substrate having a first via hole;

[0054] forming the driving layer on a side of the substrate facing away from the rigid base plate, wherein the first driving structure in the driving layer is electrically connected to the first pad through the first via hole;

[0055] performing a peeling process on the rigid substrate;

[0056] Transferring the first light-emitting unit to a side of the substrate away from the driving layer, so that the first light-emitting unit is electrically connected to the first pad;

[0057] The second light emitting unit is transferred to a side of the driving layer away from the substrate, so that the second light emitting unit is electrically connected to the second driving structure in the driving layer.

[0058] Optionally, before forming the driving layer on the side of the substrate facing away from the rigid base, the method further includes:

[0059] A bonding electrode electrically connected to the first pad is formed in the first via hole.

[0060] Optionally, the method further includes:

[0061] Before forming the substrate on a side of the first pad facing away from the rigid substrate, forming a first protective layer on the rigid substrate on which the first pad is formed, the first protective layer having a second via hole, wherein an orthographic projection of the second via hole on the rigid substrate is located within an orthographic projection of the first pad on the rigid substrate;

[0062] Before forming a landing electrode electrically connected to the first pad in the first via, a second protective layer is formed on the side of the substrate facing away from the rigid substrate, a portion of the second protective layer extends into the first via and covers at least a portion of the inner wall of the first via, and the portion of the second protective layer extending into the first via has a third via connected to the second via.

[0063] Optionally, the substrate is made of polyimide, polyvinyl alcohol, polyester or polyethylene naphthalate.

[0064] On the other hand, a display device is provided, including: a driving component, and a display panel electrically connected to the driving component, wherein the display panel is the above-mentioned display panel.

[0065] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0066] A display panel includes: a substrate, a drive layer, a first light-emitting unit, and a second light-emitting unit. Multiple first light-emitting units are arranged in an array on a side of the substrate facing away from the drive layer. When each first light-emitting unit emits light, the side of the substrate facing away from the drive layer displays a corresponding image. Multiple second light-emitting units are arranged in an array on a side of the drive layer facing away from the substrate. When each second light-emitting unit emits light, the side of the drive layer facing away from the substrate displays a corresponding image. As a result, the display panel can display images not only on one side through the first light-emitting units, but also on the other side through the second light-emitting units. This eliminates the need for a backlight module and two liquid crystal display panels, enabling dual-sided display. Furthermore, the first drive structure of the drive layer in the display panel can drive the first light-emitting unit to emit light independently, while the second drive structure of the drive layer can drive the second light-emitting unit to emit light independently. Therefore, clear images can be displayed on both sides of the display panel without requiring each light-emitting unit to emit high-brightness light. This effectively reduces the power consumption of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0068] FIG1 is a schematic diagram of a film structure of a display panel provided in an embodiment of the present application;

[0069] FIG2 is a top view of a display panel provided in an embodiment of the present application;

[0070] FIG3 is a top view of the display panel provided in an embodiment of the present application on the other side;

[0071] FIG4 is a schematic diagram of a film structure of another display panel provided in one embodiment of the present application;

[0072] FIG5 is a schematic diagram of a film structure of a display panel provided in another embodiment of the present application;

[0073] FIG6 is a top view of a driving layer provided in an embodiment of the present application;

[0074] FIG7 is a schematic diagram of a film structure of another display panel provided in another embodiment of the present application;

[0075] FIG8 is a top view of a driving layer provided in an embodiment of the present application;

[0076] FIG9 is a top view of a driving layer on the other side provided in an embodiment of the present application;

[0077] FIG10 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present application;

[0078] FIG11 is a schematic diagram of forming a sacrificial layer on one side of a rigid substrate according to an embodiment of the present application;

[0079] FIG12 is a schematic diagram of forming a first pad on a side of a sacrificial layer facing away from a rigid substrate according to an embodiment of the present application;

[0080] FIG13 is a schematic diagram of forming a first protective layer on a rigid substrate having a first pad formed thereon according to an embodiment of the present application;

[0081] FIG14 is a schematic diagram of forming a substrate on a side of a first protective layer away from a rigid substrate, provided by an embodiment of the present application;

[0082] FIG15 is a schematic diagram of forming a second protective layer on a side of a substrate facing away from a rigid substrate according to an embodiment of the present application;

[0083] FIG16 is a schematic diagram of a bonding electrode electrically connected to a first pad formed in a first via hole according to an embodiment of the present application;

[0084] FIG17 is a schematic diagram of forming a driving layer on a rigid substrate having a bonding electrode according to an embodiment of the present application;

[0085] FIG18 is a schematic diagram of a peeling process for a rigid substrate provided in an embodiment of the present application;

[0086] 19 is a schematic diagram of an embodiment of the present application providing a method of forming a first light absorption layer on a side of a substrate facing away from a driving layer, and forming a second light absorption layer on a side of the driving layer facing away from the substrate. DETAILED DESCRIPTION

[0087] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0088] Please refer to Figure 1, which is a schematic diagram of a film structure of a display panel provided by an embodiment of the present application. The display panel 000 may include: a substrate 100, a driving layer 200, a first light-emitting unit 300, and a second light-emitting unit 400.

[0089] The driving layer 200 in the display panel 000 may be located on one side of the substrate 100 , and the driving layer 200 may include a first driving structure 201 and a second driving structure 202 .

[0090] The first light emitting unit 300 in the display panel 000 may be located on a side of the substrate 100 away from the driving layer 200. The first light emitting unit 300 may be electrically connected to the first driving structure 201, which may be used to drive the first light emitting unit 300 to emit light.

[0091] The second light-emitting unit 400 in the display panel 000 can be located on the side of the driving layer 200 away from the substrate 100. The second light-emitting unit 400 can be electrically connected to the second driving structure 201, and the second driving structure 202 can be used to drive the second light-emitting unit 300 to emit light. In an embodiment of the present application, please refer to Figure 2, which is a top view of the display panel provided in an embodiment of the present application on one side. The number of first light-emitting units 300 can be multiple, and the multiple first light-emitting units 300 can be arranged in an array on the side of the substrate 100 away from the driving layer 200, and each first light-emitting unit 300 can emit light under the drive of the corresponding first driving structure 201. In this way, by arranging a plurality of arrayed first light-emitting units 300 on the side of the substrate 100 away from the driving layer 200, and when each first light-emitting unit 300 emits light, the corresponding picture can be displayed on the side of the substrate 100 away from the driving layer 200.

[0092] Similarly, please refer to Figure 3, which is a top view of the display panel provided in an embodiment of the present application on the other side. The number of second light-emitting units 400 is also multiple, and the multiple second light-emitting units 400 can be arranged in an array on the side of the drive layer 200 facing away from the substrate 100, and each second light-emitting unit 400 can emit light under the drive of the corresponding second drive structure 202. In this way, by providing a plurality of second light-emitting units 400 arranged in an array on the side of the drive layer 200 facing away from the substrate 100, and when each second light-emitting unit 400 emits light, the corresponding image can be displayed on the side of the drive layer 200 facing away from the substrate 100.

[0093] To this end, the display panel 000 can not only display images on one side through the first light-emitting unit 300, but also display images on the other side through the second light-emitting unit 400. This allows the display panel 000 to perform double-sided display without using a backlight module and a combination of two liquid crystal display panels. In addition, the first driving structure 201 of the driving layer 200 in the display panel 000 can drive the first light-emitting unit 300 to emit light independently, and the second driving structure 202 of the driving layer 200 can drive the second light-emitting unit 400 to emit light independently. Therefore, it is not necessary for each light-emitting unit to emit high-brightness light to allow both sides of the display panel 000 to present a clear display image. In this way, the power consumption of the display panel 000 can be effectively reduced.

[0094] In the present application, the first driving structure 201 in the driving layer 200 may include multiple stacked conductive layers, and the second driving structure 202 in the driving layer 200 may also include multiple stacked conductive layers, and at least one conductive layer in the first driving structure 201 and at least one conductive layer in the second driving structure 202 are provided in the same layer. In this way, the conductive layers in the first driving structure 201 and the conductive layers in the second driving structure 202 can be formed simultaneously through the same process, which can effectively simplify the manufacturing process of the display panel 000.

[0095] Optionally, the first light-emitting unit 300 and the second light-emitting unit 400 in the display panel 000 may each include a mini light-emitting diode (LED). Since LEDs have low power consumption, when both the first light-emitting unit 300 and the second light-emitting unit 400 include LEDs, the power consumption of the display panel 000 can be further reduced.

[0096] Here, the LED can be a regular-sized LED, a mini light-emitting diode (mini-LED), or a micro-LED. It should be noted that due to the smaller size of micro-LEDs, when both the first light-emitting unit 300 and the second light-emitting unit 400 in the display panel 000 include micro-LEDs, the resolution of both sides of the display panel 000 can be high, allowing both sides of the display panel 000 to display a better display image.

[0097] In summary, the display panel provided in the embodiments of the present application includes: a substrate, a drive layer, a first light-emitting unit, and a second light-emitting unit. By providing a plurality of first light-emitting units arranged in an array on the side of the substrate facing away from the drive layer, and when each first light-emitting unit emits light, the side of the substrate facing away from the drive layer can display a corresponding image. By providing a plurality of second light-emitting units arranged in an array on the side of the drive layer facing away from the substrate, and when each second light-emitting unit emits light, the side of the drive layer facing away from the substrate can display a corresponding image. To this end, the display panel can display images not only on one side through the first light-emitting units, but also on the other side through the second light-emitting units. This allows the display panel to display images on both sides without using a backlight module and a combination of two liquid crystal display panels. Furthermore, the first drive structure of the drive layer in the display panel can drive the first light-emitting unit to emit light independently, and the second drive structure of the drive layer can drive the second light-emitting unit to emit light independently. Therefore, without requiring each light-emitting unit to emit high-brightness light, a clear display image can be presented on both sides of the display panel. This effectively reduces the power consumption of the display panel.

[0098] In an embodiment of the present application, please refer to Figure 4, which is a schematic diagram of the membrane structure of another display panel provided in an embodiment of the present application. The substrate 100 in the display panel 000 may have a first via hole V1. The display panel 000 may also include: a strapping electrode 500. Among them, at least a portion of the strapping electrode 500 may be located in the first via hole V1. In one possible implementation, the conductive electrode 500 may be entirely located in the first via hole V1; in another possible implementation, a portion of the strapping electrode 500 may be located in the first via hole V1, and another portion of the strapping electrode 500 may be located on the side of the substrate 100 close to the drive layer 200.

[0099] Here, the strapping electrode 500 can be electrically connected to the first driving structure 202 in the driving layer 200, and the side of the strapping electrode 500 facing away from the first driving structure 202 can be electrically connected to the first light-emitting unit 300. For example, the portion of the strapping electrode 500 located in the first via hole V1 can be electrically connected to the first light-emitting unit 300, and the portion of the strapping electrode 500 located on the side of the substrate 100 close to the driving layer 200 can be electrically connected to the first driving structure 202. To this end, even if the first light-emitting unit 300 is distributed on the side of the substrate 100 facing away from the driving layer 200, the first driving structure 201 in the driving layer 200 can be electrically connected to the first light-emitting unit 300 through the strapping electrode 500 by providing the first via hole V1 in the substrate 100 and providing the strapping electrode 500 in the first via hole V1.

[0100] Optionally, the substrate 100 in the display panel 000 may have a groove U on a side facing away from the drive layer 200, connected to the first via V1. The display panel 000 may further include a first pad S1 located within the groove U. Here, one side of the first pad S1 may be connected within the groove U to the bonding electrode 500 located within the first via V1; and the side of the first pad S1 facing away from the bonding electrode 500 may be electrically connected to the first light-emitting unit 300. In this case, the first driving structure 201 in the drive layer 200 may be electrically connected to the first light-emitting unit 300 via the bonding electrode 500 and the first pad S1, in sequence.

[0101] For example, the orthographic projection of the first via V1 on the plane of the substrate 100 can be located within the orthographic projection of the recess U on the plane of the substrate 100. To this end, the orthographic projection area of ​​the recess U on the plane of the substrate 100 is relatively large. When a first soldering pad S1 for connecting the bonding electrode 500 and the first light-emitting unit 300 is provided within the recess U, the orthographic projection area of ​​the first soldering pad S1 located within the recess U on the plane of the substrate 100 can be relatively large. For example, the orthographic projection of the portion of the bonding electrode 500 located within the first via V1 on the plane of the substrate 100 is located within the orthographic projection of the first soldering pad S1 on the plane of the substrate 100. Furthermore, since the first light-emitting unit 300 is connected to the first soldering pad S1 by welding, a relatively large orthographic projection area of ​​the first soldering pad S1 on the plane of the substrate 100 not only ensures easier welding of the first light-emitting unit 300 to the first soldering pad S1, but also ensures a high degree of security after welding.

[0102] It should be noted that the plane where the substrate 100 is located in the embodiment of the present application refers to: the plane where the side of the substrate 100 close to the driving layer 200 is located, or the plane where the side of the substrate 100 away from the driving layer 200 is located.

[0103] In an embodiment of the present application, the display panel 000 may further include: a first protective layer 600 located within the groove U. The first protective layer 600 may be distributed between the substrate 100 and the first pad S1 within the groove U. In this way, during the preparation of the display panel 000, the first pad S1 may be protected by the first protective layer 600, so that the first pad S1 will not be corroded by water and oxygen, thereby ensuring that the first pad S1 can subsequently be stably welded to the first light-emitting unit 300. For example, the first protective layer 600 may cover all side surfaces of the first pad S1, so that the side surfaces of the first pad S1 will not be corroded.

[0104] Here, the first protective layer 600 may have a second via V2, which may be connected to the first via V1. For example, the orthographic projection of the second via V2 on the plane of the substrate 100 may be located within the orthographic projection of the orthographic projection of the first via V1 on the plane of the substrate 100. In this way, the bonding electrode 500 located in the first via V1 can pass through the second via V2 to be electrically connected to the first pad S1.

[0105] For example, the second via hole V2 can be arranged in a portion of the first protective layer 600 located on the side of the first pad S1 facing away from the first light-emitting unit 300, and the orthographic projection of the second via hole V2 on the plane where the substrate 100 is located can be located within the orthographic projection of the first pad S1 on the plane where the substrate 100 is located, so as to ensure that the overlapping electrode 500 can overlap with the side of the first pad S1 facing away from the first light-emitting unit 300 after passing through the second via hole V2.

[0106] Optionally, the display panel 000 may further include: a second protective layer 700 located on the side of the substrate 100 facing the drive layer 200. A portion of the second protective layer 700 may extend into the first via hole V1, and the portion of the second protective layer 700 extending into the first via hole V1 may cover at least a portion of the inner wall of the first via hole V1. For example, the portion of the second protective layer 700 extending into the first via hole V1 may completely cover the inner wall of the first via hole V1 at all positions. In this case, after water vapor in the external environment penetrates into the substrate 100, the portion of the second protective layer 700 extending into the first via hole V1 may isolate the water vapor from entering, thereby ensuring that water vapor does not enter the first via hole V1, and further ensuring that the bonding electrode 500 in the first via hole V1 will not be corroded, thereby ensuring that a stable electrical connection can be established between the first driving structure 201 in the driving layer 200 and the first light-emitting unit 300.

[0107] Here, the portion of the second protective layer 700 that extends into the first via V1 may have a third via V3 that communicates with the second via V2. For example, the orthographic projection of the second via V2 on the plane of the substrate 100 may completely overlap with the orthographic projection of the third via V3 on the plane of the substrate 100. That is, the boundary of the orthographic projection of the second via V2 on the plane of the substrate 100 overlaps with the boundary of the orthographic projection of the third via V3 on the plane of the substrate 100. In this way, the bonding electrode 500 located in the first via V1 can pass through the third via V3 and the second via V2 in sequence and then bond to the first pad S1.

[0108] Optionally, both the first protective layer 600 and the second protective layer 700 in the display panel 000 are inorganic protective layers, and both are protective layers made of inorganic insulating materials. Since inorganic protective layers have good water and oxygen isolation capabilities, when both the first protective layer 600 and the second protective layer 700 are inorganic protective layers, it can be ensured that both the first protective layer 600 and the second protective layer 700 have good water and oxygen isolation capabilities, thereby further reducing the probability of corrosion of the first pad S1 and the bonding electrode 500.

[0109] It should be noted that, during the preparation process of the display panel 000, the substrate 100 in the display panel 000 and the first pad S1 located on the side of the substrate 100 facing away from the drive layer 200 are both made on a rigid substrate, and the substrate 100 and the first pad S1 can both be in direct contact with the rigid substrate. Therefore, the side of the pad S1 facing away from the drive layer 200 is flush with the side of the substrate 100 facing away from the drive layer 200. It should also be noted that before the first light-emitting unit 100 is welded to the first pad S1, the rigid substrate needs to be peeled off to ensure that the first pad S1 can be exposed from the side of the substrate 100 facing away from the drive layer 200, thereby ensuring that the first pad S1 can be normally welded to the first light-emitting unit 300.

[0110] In the embodiment of the present application, a second solder pad S2 is further provided in the display panel 000, and the second solder pad S2 can be electrically connected to the second driving structure 202 in the driving layer 200. In this way, the second light-emitting unit 400 can be connected to the second driving structure 202 by welding to the second solder pad S2. It should be noted that there are many structures of the driving layer 200 in the display panel 000. For driving layers 200 with different structures, the second solder pad S2 electrically connected to the second driving structure 202 in the driving layer 200 is also set differently. To this end, the embodiment of the present application will be schematically explained using the following two optional implementation methods as examples:

[0111] A first optional implementation is shown in FIG5 , which is a schematic diagram of a membrane structure of a display panel provided by another embodiment of the present application. The driving layer 200 in the display panel 000 may be an active driving layer. For example, the first driving structure 201 in the driving layer 200 may be a first driving circuit P1, where the driving layer 200 may include a plurality of first driving circuits P1, and the plurality of first driving circuits P1 may be electrically connected to a plurality of first light-emitting units 300 in the display panel 000 in a one-to-one correspondence, and each first driving circuit P1 is used to drive the corresponding first light-emitting unit 300 to emit light. The second driving structure 202 in the driving layer 200 may be a second driving circuit P2, where the driving layer 200 may include a plurality of second driving circuits P2, and the plurality of second driving circuits P2 may be electrically connected to a plurality of second light-emitting units 400 in the display panel 000 in a one-to-one correspondence, and each second driving circuit P2 is used to drive the corresponding second light-emitting unit 400 to emit light.

[0112] In the present application, the first driving circuit P1 and the second driving circuit P2 in the display panel 000 can be provided on the same layer. That is, the first driving circuit P1 and the second driving circuit P2 are formed using the same process. This can effectively reduce the difficulty of manufacturing the display panel 000.

[0113] It should be noted that in order to enable the multiple first drive circuits P1 and the multiple second drive circuits P2 in the display panel 000 to be evenly arranged, please refer to Figure 6, which is a top view of a drive layer provided in an embodiment of the present application. The multiple first drive circuits P1 and the multiple second drive circuits P2 in the display panel 000 can be arranged in an array into multiple rows and multiple columns. Among them, in a row of drive circuits, the multiple first drive circuits P1 and the multiple second drive circuits P2 are arranged alternately, that is, there is a second drive circuit P2 distributed between two adjacent first drive circuits P1, and there is a first drive circuit P1 distributed between two adjacent second drive circuits P2; and in a column of drive circuits, the multiple first drive circuits P1 and the multiple second drive circuits P2 are also arranged alternately, that is, there is a second drive circuit P2 distributed between two adjacent first drive circuits P1, and there is a first drive circuit P1 distributed between two adjacent second drive circuits P2.

[0114] Here, the drive layer 200 in the display panel 000 may further include a plurality of first gate lines G1 and a plurality of first data lines D1 for electrically connecting to a plurality of first drive circuits P1, and a plurality of second gate lines G2 and a plurality of second data lines D2 for electrically connecting to a plurality of second drive circuits P2. A first gate line G1 may be electrically connected to each first drive circuit P1 in a row of drive circuits, and a first data line D1 may be electrically connected to each first drive circuit P1 in a column of drive circuits; a second gate line G2 may be electrically connected to each second drive circuit P2 in a row of drive circuits, and a second data line D2 may be electrically connected to each second drive circuit P2 in a column of drive circuits. The display panel 000 may apply corresponding signals to the first gate lines G1 and the first data lines D1 so that the first drive circuits P1 can normally drive the corresponding first light-emitting units 300 to emit light; the display panel 000 may also apply corresponding signals to the second gate lines G2 and the second data lines D2 so that the second drive circuits P2 can normally drive the corresponding second light-emitting units 400 to emit light.

[0115] In order to ensure that the first gate line G1 and the first data line D1 only apply a driving signal to the first driver circuit P1 and not to the second driver circuit P2, and to ensure that the second gate line G2 and the second data line D2 only apply a driving signal to the second driver circuit P2 and not to the first driver circuit P1, in one possible scenario, as shown in Figure 6, a first gate line G1 and a second gate line G2 may be distributed between two adjacent rows of driver circuits, and this first gate line G1 may be electrically connected to each first driver circuit P1 in one row of the two adjacent rows of driver circuits, and this second gate line G2 may be electrically connected to each second driver circuit P2 in the other row of the two adjacent rows of driver circuits. A first data line D1 and a second data line D2 may be distributed between two adjacent columns of driver circuits, and this first data line D1 may be electrically connected to each first driver circuit P1 in one column of the two adjacent columns of driver circuits, and this second data line D2 may be electrically connected to each second driver circuit P2 in the other column of the two adjacent columns of driver circuits. In this case, the plurality of first gate lines G1 and the plurality of second gate lines G2 are staggered and distributed, and no interference occurs therebetween; the plurality of first data lines D1 and the plurality of second data lines D2 are also staggered and distributed, and no interference occurs therebetween.

[0116] Optionally, as shown in FIG5 , the first drive structure 202a (i.e., the first drive circuit P1) may include: a first transistor. The second drive structure 202b (i.e., the second drive circuit P2) may include: a second transistor. It should be noted that the number of first transistors included in the first drive circuit P1 is at least one, and the first drive circuit P1 can drive the corresponding first light-emitting unit 300 to emit light through the cooperation of the at least one first transistor. Similarly, the number of second transistors included in the second drive circuit P2 is at least one, and the second drive circuit P2 can drive the corresponding second light-emitting unit 400 to emit light through the cooperation of the at least one second transistor.

[0117] Here, the first transistor in the first driving structure 202a may include a first active layer A1. The second transistor in the second driving structure 202b may include a second active layer A2. The first active layer A1 and the second active layer A2 may be co-located, and the material of the first active layer A1 and the material of the second active layer A2 may be the same. In other words, the first active layer A1 and the second active layer A2 are formed through a single patterning process.

[0118] In the present application, the first transistor may further include a first source S01 and a first drain D01. The second transistor may further include a second source S02 and a second drain D02. Here, the first source S01 and the first drain D01 in the first transistor may be provided in the same layer and made of the same material as the second source S02 and the second drain D02 in the second transistor. In other words, the first source S01, the first drain D01, the second source S02, and the second drain D02 may be formed through the same patterning process.

[0119] Optionally, the first driving structure 201 may further include: a first output electrode P1' electrically connected to the first transistor. The first output electrode P1' of the first driving structure 201 may be electrically connected to the first light-emitting unit 300. For example, the first output electrode P1' of the first driving structure 201 may be electrically connected to the first light-emitting unit 300 via the strapping electrode 500 and the first pad S1 in sequence. It should be noted that the number of first output electrodes P1' of the first driving structure 201 may be two, and the two first output electrodes P1' may be electrically connected to the positive electrode and the negative electrode of the first light-emitting unit 300, respectively. Here, the first output electrode P1' electrically connected to the first transistor may be understood as: one of the two first output electrodes P1' is electrically connected to the first transistor, and the other of the two first output electrodes P1' may be electrically connected to other conductive structures in the first driving structure 201.

[0120] The second driving structure 202 may further include a second output electrode P2' electrically connected to the second transistor. The second output electrode P2' of the second driving structure 202 may be electrically connected to the second light-emitting unit 400. It should be noted that the second driving structure 202 may include two second output electrodes P2', and these two second output electrodes P2' may be electrically connected to the positive electrode and the negative electrode of the second light-emitting unit 400, respectively. Here, the second output electrode P2' electrically connected to the second transistor can be understood as: one of the two second output electrodes P2' is electrically connected to the second transistor, and the other second output electrode P2' may be electrically connected to other conductive structures in the second driving structure 202.

[0121] The first output electrode P1 ′, the second output electrode P2 ′, the first source electrode S01 , the first drain electrode D01 , the second source electrode S02 and the second drain electrode D02 may be provided in the same layer and made of the same material.

[0122] It should be noted that the first output electrode P1' can be electrically connected to the first source S01 or the first drain D01 of the first transistor. The following embodiments will be illustratively described using the electrical connection of the first output electrode P1' to the first drain D01 as an example. Since the first output electrode P1' and the first drain D01 are provided on the same layer, when the first output electrode P1' is electrically connected to the first drain D01, the first output electrode P1' can be directly electrically connected to the first drain D01 via a connecting electrode located in this conductive layer, or the first output electrode P1' and the first drain D01 can be treated as a single electrode. It should also be noted that the connection method between the second output electrode P2' and the second transistor can refer to the connection method between the first output electrode P1' and the first transistor, and will not be further described here.

[0123] In the embodiment of the present application, the first transistor may further include a first gate G01. The first gate G01 is insulated from the first active layer A1 and is closer to the substrate 100 than the first active layer A1. The orthographic projection of the first gate G01 on the plane of the substrate 000 may overlap with the orthographic projection of the first active layer A1 on the plane of the substrate 000. The first source S01 and the first drain D01 of the first transistor are both connected to the first active layer A1, and the first active layer A1 is closer to the substrate 100 than the first source S01 and the first drain D01.

[0124] The second transistor may further include a second gate G02. The second gate G02 is insulated from the second active layer A2 and is closer to the substrate 100 than the second active layer A2. The orthographic projection of the second gate G02 on the plane of the substrate 000 may overlap with the orthographic projection of the second active layer A2 on the plane of the substrate 000. The second source S02 and second drain D02 of the second transistor both overlap the second active layer A2, and the second active layer A2 is closer to the substrate 100 than the second source S02 and second drain D02.

[0125] The first gate G01 and the second gate G02 may be provided in the same layer and made of the same material, that is, the first gate G01 and the second gate G02 are formed by the same patterning process.

[0126] In the present application, the first output electrode P1' of the first driving structure 201 is disposed on the same layer as the first source S01 and first drain D01 of the first transistor, and the conductive layer containing the first source S01 and first drain D01 is relatively far from the substrate 100. Therefore, to ensure that the first output electrode P1' can properly electrically connect to the first light-emitting unit 300, the display panel 000 may further include a first transfer electrode Z1. This first transfer electrode Z1 is disposed on the same layer and made of the same material as the first gate G01. In other words, the first transfer electrode Z1 and the first gate G01 are formed through the same patterning process. In this way, the first output electrode P1' of the first driving structure 201 can be electrically connected to the first light-emitting unit 300 via the first transfer electrode Z1. For example, the first output electrode P1' of the first driving structure 201 can be electrically connected to the first transfer electrode Z1, which can then be electrically connected to the first light-emitting unit 300 via the bonding electrode 500 and the first pad S1. Therefore, even if the first output electrode P1 ′ of the first driving structure 201 is far away from the bonding electrode 500 , the two can be connected by providing the first transfer electrode Z1 therebetween.

[0127] Optionally, the first transistor may further include a third gate G03. The third gate G03 is insulated from the first active layer A1, and the first active layer A1 is closer to the substrate 100 than the third gate G03. Here, the orthographic projection of the third gate G03 on the plane of the substrate 000 may overlap with the orthographic projection of the first active layer A1 on the plane of the substrate 000, and the orthographic projection of the third gate G03 on the plane of the substrate 100 may overlap with the orthographic projection of the first gate G01 on the plane of the substrate 100. In one possible implementation, the first gate G01 and the third gate G03 may be connected to different drive signals, so that the first gate G01 and the third gate G03 can control the conduction and shutdown of the channel region in the first active layer A1. In another possible implementation, the first gate G01 and the third gate G03 may also be connected to the same drive signal. The first gate G01 and the third gate G03 in the first transistor may be electrically connected. In this case, the first transistor is a dual-gate transistor. The first active layer A1 of the first transistor can be distributed between the first gate G01 and the third gate G03. The first gate G01 and the third gate G03 are loaded with the same potential. The first gate G01 and the third gate G03 are both used to control the conduction and shutoff of the channel region in the first active layer A1. In this way, the electrical performance of the first transistor can be guaranteed to be good.

[0128] For example, since the first active layer A1 is disposed between the first gate G01 and the third gate G03, to ensure proper electrical connection between the first gate G01 and the third gate G03, the first driving structure 201 may further include a first connecting electrode L1 and a second connecting electrode L2. The first connecting electrode L1 may be provided on the same layer and made of the same material as the first gate G01, and may be electrically connected to the first gate G01. The second connecting electrode L2 may be provided on the same layer and made of the same material as the third gate G03, and may be electrically connected to the third gate G03. The orthographic projection of the first connection electrode L1 on the plane of the substrate 100 does not overlap with the orthographic projection of the first active layer A1 on the plane of the substrate 100. The orthographic projection of the second connection electrode L2 on the plane of the substrate 100 does not overlap with the orthographic projection of the first active layer A1 on the plane of the substrate 100. Furthermore, the orthographic projection of the first connection electrode L1 on the plane of the substrate 100 overlaps with the orthographic projection of the second connection electrode L2 on the plane of the substrate 100. To this end, the second connection electrode L2 can overlap with the first connection electrode L1, enabling electrical connection between the first gate G01 and the third gate G03.

[0129] Similarly, the second transistor may further include: a fourth gate G04. The fourth gate G04 is insulated from the second active layer A2, and the second active layer A2 is closer to the substrate 100 than the fourth gate G04. Here, the fourth gate G04 may be provided in the same layer and made of the same material as the third gate G03. That is, the fourth gate G04 and the third gate G03 are formed through the same patterning process. It should be noted that the effect of the second transistor including the second gate G02 and the fourth gate G04 can be referenced to the effect of the first transistor including the first gate G01 and the third gate G03, and will not be further described here.

[0130] For example, the second driving structure 202 may further include: a third connection electrode L3 and a fourth connection electrode L4. The third connection electrode L3 is disposed on the same layer as the second gate G02 and can be electrically connected to the second gate G02. The fourth connection electrode L4 is disposed on the same layer as the fourth gate G04 and can be electrically connected to the fourth gate G04. The third connection electrode L3 and the fourth connection electrode L4 are overlapped. It should be noted that the principle of the electrical connection between the second gate G02 and the fourth gate G04 via the third connection electrode L3 and the fourth connection electrode L4 is the same as the principle of the electrical connection between the first gate G01 and the third gate G03 via the first connection electrode L1 and the second connection electrode L2, and will not be further described here.

[0131] In the present application, the display panel 000 may further include a second transfer electrode Z2. This second electrode Z2 may be provided in the same layer and made of the same material as the third gate electrode G03 and the fourth gate electrode G04. That is, the second transfer electrode Z2, the third gate electrode G03, and the fourth gate electrode G04 are formed through the same patterning process. In this way, the first output electrode P1' of the first driving structure 201 may be electrically connected to the first light-emitting unit 300 via the second transfer electrode Z2 and the first transfer electrode Z1, in sequence. For example, the first output electrode P1' of the first driving structure 201 may be electrically connected to the second transfer electrode Z1, and the second transfer electrode Z2 may be electrically connected to the first light-emitting unit 300 via the first transfer electrode Z1, the bonding electrode 500, and the first pad S1, in sequence. To this end, even if the distance between the first output electrode P1' of the first driving structure 201 and the strapping electrode 500 is relatively far, the two can be connected by arranging the second transfer electrode Z2 and the first transfer electrode Z1 therebetween, which can further improve the stability of the connection between the first output electrode P1' of the first driving structure 201 and the first light-emitting unit 300.

[0132] In the embodiment of the present application, the display panel 000 may further include: a buffer layer 001 , a first gate insulating layer 002 , a second gate insulating layer 003 and an interlayer dielectric layer 004 .

[0133] The buffer layer 001 may be located on the side of the bonding electrode 500 facing away from the substrate 100, and the first conductive layer in the display panel 000 may be located on the side of the buffer layer 001 facing away from the substrate 100. The first conductive layer may include: a first gate G01, a second gate G02, a first transfer electrode Z1, a first connection electrode L1, and a third connection electrode L3.

[0134] The first gate insulating layer 002 may be located on a side of the first conductive layer facing away from the substrate 100, and both the first active layer A1 and the second active layer A2 are located on a side of the first gate insulating layer 002 facing away from the substrate 100. To this end, the first active layer A1 and the first gate G01 in the first conductive layer may be insulated by the first gate insulating layer 002, and the second active layer A2 and the second gate G02 in the first conductive layer may also be insulated by the first gate insulating layer 002.

[0135] The second gate insulating layer 003 can be located on the side of the first active layer A1 and the second active layer A2 facing away from the substrate 100, and the second conductive layer in the display panel 000 can be located on the side of the second gate insulating layer 003 facing away from the substrate 100. The second conductive layer may include: a third gate electrode G03, a fourth gate electrode G04, a second transfer electrode Z2, a second connection electrode L2, and a fourth connection electrode L4. To this end, the first active layer A1 and the third gate electrode G03 in the second conductive layer can be insulated by the second gate insulating layer 003, and the second active layer A2 and the fourth gate electrode G04 in the second conductive layer can also be insulated by the second gate insulating layer 003.

[0136] The interlayer dielectric layer 004 may be located on a side of the second conductive layer facing away from the substrate 100, and the third conductive layer in the display panel 000 may be located on a side of the interlayer dielectric layer 004 facing away from the substrate 100. The third conductive layer may include: a first source electrode S01, a first drain electrode D01, a second source electrode S02, a second drain electrode D02, a first output electrode P1', and a second output electrode P2'.

[0137] In an embodiment of the present application, as shown in FIG5 , the display panel 000 may further include: an insulating protective layer 800 located on the side of the drive layer 200 facing away from the substrate 100. By providing the insulating protective layer 800 on the side of the drive layer 200 facing away from the substrate 100, it can be ensured that the insulating protective layer 800 can better protect the drive layer 200. The second pad S2 for welding to the second light-emitting unit 400 in the display panel 000 may also be located on the side of the drive layer 200 facing away from the substrate 100. Here, the insulating protective layer 800 may have a fourth via hole V4 corresponding to the second pad S2. At least a portion of the second pad S2 may extend into the fourth via hole V2, and the portion of the second pad S2 extending into the fourth via hole V2 may be connected to the second output electrode P2' of the second drive structure 202 in the drive layer 200. The side of the second pad S2 facing away from the substrate 100 may be connected to the second light-emitting unit 400 by welding.

[0138] Optionally, the insulating protective layer 800 may include: an organic planarization layer 801 and an inorganic passivation layer 802, which are stacked. The organic planarization layer 801 is closer to the substrate 100 than the inorganic passivation layer 802. The second pad S2 may include a portion located outside the fourth via V4. That is, a portion of the second pad S2 may be located within the fourth via V4, another portion of the second pad S2 may be located outside the fourth via V4, and the portion of the second pad S2 located outside the fourth via V4 may contact the side of the inorganic passivation layer 802 facing away from the substrate 100.

[0139] Here, when the organic planarization layer 801 is provided on the side of the drive layer 200 facing away from the substrate 100, the flatness of the side of the organic planarization layer 801 facing away from the substrate 100 can be ensured to be better, thereby ensuring the stability of the film structure subsequently provided on the side of the organic planarization layer 801 facing away from the substrate. In addition, in order to ensure a stable electrical connection between the second output electrode P2' of the second drive structure 202 and the second light-emitting unit 400, the second pad S2 needs to be made of a metal material with good conductivity. For example, the second pad S2 can be made of copper. If a metal material with good conductivity is directly prepared on the organic planarization layer 801, the metal material with good conductivity is very easy to separate from the organic planarization layer 801. To this end, an inorganic passivation layer 802 can be first formed on the side of the organic planarization layer 801 facing away from the substrate 100, and then a metal material with good conductivity can be prepared on the side of the inorganic passivation layer 802 facing away from the substrate 100. In this way, it can be ensured that the second pad S2 made of a metal material with good conductivity is not easily separated from the inorganic passivation layer 802 , thereby enabling the second pad S2 to be stably disposed on the insulating protection layer 800 .

[0140] In an embodiment of the present application, the display panel 000 may further include a third protective layer 900 located on the side of the insulating protective layer 800 facing away from the substrate 100. The third protective layer 900 may cover at least a portion of the side surfaces of the portion of the second pad S2 located outside the fourth via hole V4. For example, the third protective layer 900 may completely cover the side surfaces of the portion of the second pad S2 located outside the fourth via hole V4 at all locations. In this case, the third protective layer 900 can prevent water and oxygen from the external environment from corroding the second pad S2 from its side surfaces, thereby reducing the probability of corrosion of the second pad S2 and enabling a stable electrical connection between the second output electrode P2' of the second drive structure 202 and the second light-emitting unit 400. Optionally, the third protective layer 900 in the display panel 000 may be made of an inorganic material with good water and oxygen isolation capabilities. In other words, the third protective layer 900 is an inorganic protective layer. This further reduces the probability of corrosion of the second pad S2.

[0141] In the present application, a portion of the third protective layer 900 is located on the side of the second pad S2 facing away from the substrate 100, and the portion of the third protective layer 900 located on the side of the second pad S2 facing away from the substrate 100 has a fifth via hole V5. The orthographic projection of the fifth via hole V5 on the plane of the substrate 100 is located within the orthographic projection of the second pad S2 on the plane of the substrate 100. In this way, the second light-emitting unit 400 can be soldered to the second pad S2 through the fifth via hole.

[0142] It should be noted that the boundary of the orthographic projection of the fifth via V5 on the plane of the substrate 100 does not overlap with the boundary of the orthographic projection of the second pad S2 on the plane of the back of the substrate 100. In this way, it can be ensured that the third protective layer 900 can not only completely cover the side surfaces of the second pad S2 at various positions, but also partially cover the edge area of ​​the second pad S2 facing away from the substrate 100. In this way, the probability of corrosion of the second pad S2 can be further reduced.

[0143] Optionally, the thickness of the portion of the second pad S2 located outside the fourth via hole V4 may be greater than or equal to the thickness of the third protective layer 900. Here, the thickness of the portion of the second pad S2 located outside the fourth via hole V4 refers to the distance between the side of the second pad S2 facing away from the substrate 100 and the side of the third protective layer 900 facing away from the substrate 100. In this way, the thickness of the portion of the second pad S2 located outside the fourth via hole V4 can be ensured to be greater, so that the resistance of the second pad S2 is smaller, and thus the second pad S2 has better conductivity.

[0144] It should be noted that, because the portion of the second pad S2 located outside the fourth via hole V4 is relatively thick and the third protective layer 900 is an inorganic protective layer, the side of the second pad S2 facing away from the substrate 100 can protrude beyond the side of the portion of the third protective layer 900 that contacts the insulating protective layer 800 facing away from the substrate 100. It should also be noted that, although the second pad S2 is a protruding portion on one side of the display panel 000, the second pad S2 can still be soldered to the second light-emitting unit 400. Therefore, there is no need to perform additional leveling on the protruding portion on one side of the display panel 000 through an additional process, which can effectively simplify the difficulty of manufacturing the display panel 000.

[0145] A second optional implementation is shown in FIG7 , which is a schematic diagram of the film layer structure of another display panel provided by another embodiment of the present application. The drive layer 200 in the display panel 000 can be a passive drive layer. For example, the drive layer 200 can include a first metal layer 203 and a second metal layer 204 stacked together. The first metal layer 203 is closer to the substrate 100 than the second metal layer 204.

[0146] To more clearly illustrate the structure of the first drive structure 201 in the drive layer 200 in the display panel 000, please refer to Figure 8, which is a top view of a drive layer provided in an embodiment of the present application. The first drive structure 201 in the drive layer 200 may include: a plurality of first drive signal lines 201a located in the first metal layer 203, and a second drive signal line 201b located in the second metal layer 200. The extension direction of the first drive signal line 201a may intersect with the extension direction of the second drive signal line 201b. For example, the extension direction of the first drive signal line 201a may be perpendicular to the extension direction of the second drive signal line 201b. Here, the first drive signal line 201a and the second drive signal line 201b can both be electrically connected to the first solder pad S1 via the bonding electrode 500. In this way, after the first light-emitting unit 300 is soldered to the first solder pad S1, the first light-emitting unit 300 can be driven to emit light through the cooperation of the first drive signal line 201a and the second drive signal line 201b.

[0147] It should be noted that, since the first drive signal line 201a is located within the first metal layer 203, the second drive signal line 201b is located within the second metal layer 204, and the first metal layer 203 is closer to the substrate 100 than the second metal layer 204, the first drive signal line 201a can be directly electrically connected to the first pad S1 via the bonding electrode 500. To electrically connect the second drive signal line 201b to the first pad S1, a third transfer electrode Z3 can be provided within the first metal layer 203 for connecting the second drive signal line 201b to the bonding electrode 500. In this way, the second drive signal line 201b can be electrically connected to the first pad S1 via the third transfer electrode Z3 and the bonding electrode 500.

[0148] To more clearly illustrate the structure of the second drive structure 202 in the drive layer 200 of the display panel 000, please refer to Figure 9, which is a top view of the other side of a drive layer provided in an embodiment of the present application. The second drive structure 202 in the drive layer 200 may include: a plurality of third drive signal lines 202a located within the first metal layer 203, and a fourth drive signal line 202b located within the second metal layer 205. The extension direction of the third drive signal line 202a may intersect with the extension direction of the fourth drive signal line 202b. For example, the extension direction of the third drive signal line 202a may be perpendicular to the extension direction of the fourth drive signal line 202b. Here, the third drive signal line 202a and the fourth drive signal line 202b may both be electrically connected to the second solder pad S2. Thus, after the second light-emitting unit 400 is soldered to the second solder pad S2, the cooperation between the third drive signal line 202a and the fourth drive signal line 202b can drive the second light-emitting unit 400 to emit light.

[0149] It should be noted that since the third drive signal line 202a is located within the first metal layer 203, the fourth drive signal line 202b is located within the second metal layer 204, and the first metal layer 203 is closer to the substrate 100 than the second metal layer 204, the second pad S2 can be located within the second metal layer 204, and the fourth drive signal line 202b can be directly electrically connected to the second pad S2. To electrically connect the third drive signal line 202b to the second pad S2, a transfer via V0 needs to be provided in the display panel 000 so that the third drive signal line 202b can be electrically connected to the second pad S2 through the transfer via V0.

[0150] In the present application, the first drive signal line 201a and the third drive signal line 202a are arranged in the same layer and made of the same material. Both are located within the first metal layer 203. To prevent a short circuit between the first drive signal line 201a and the third drive signal line 202a, the extension direction of the first drive signal line 201a is parallel to the extension direction of the third drive signal line 202a. Similarly, the second drive signal line 201b and the fourth drive signal line 202b are arranged in the same layer and made of the same material. Both are located within the second metal layer 204. To prevent a short circuit between the second drive signal line 201b and the fourth drive signal line 202b, the extension direction of the second drive signal line 201b is parallel to the extension direction of the fourth drive signal line 202b.

[0151] Optionally, as shown in FIG8 , the plurality of first light-emitting units 300 in the display panel 000 are arrayed into multiple rows and columns. The plurality of first drive signal lines 201a in the first metal layer 203 may include multiple groups of first drive signal lines 201a corresponding to the multiple columns of first light-emitting units 300. A group of first drive signal lines 201a may be electrically connected to each first light-emitting unit 300 in a corresponding column of first light-emitting units 300, and a second drive signal line 201b may be electrically connected to each first light-emitting unit 300 in a row of first light-emitting units 300. Here, a group of first drive signal lines 201a electrically connected to a column of first light-emitting units 300 may include: an anode or cathode drive signal line, a data signal line, and a ground line, and a second drive signal line 201b electrically connected to a row of first light-emitting units 300 may be a power signal line.

[0152] As shown in FIG9 , the plurality of second light-emitting units 400 in the display panel 000 are arrayed in multiple rows and columns. The plurality of third drive signal lines 202a in the first metal layer 203 may include multiple groups of third drive signal lines 202a corresponding to the multiple columns of second light-emitting units 400. A group of third drive signal lines 202a may be electrically connected to each second light-emitting unit 400 in a corresponding column of second light-emitting units 400, and a fourth drive signal line 202b may be electrically connected to each second light-emitting unit 400 in a row of second light-emitting units 400. Here, a group of third drive signal lines 202a electrically connected to a column of second light-emitting units 400 may include: an anode or cathode drive signal line, a data signal line, and a ground line. The fourth drive signal line 202b electrically connected to a row of second light-emitting units 400 may be a power signal line.

[0153] The plurality of first drive signal lines 201a and the plurality of third drive signal lines 202a are arranged alternately. That is, a group of third drive signal lines 202a is arranged between two groups of first drive signal lines 201a, and a group of first drive signal lines 201a is arranged between two adjacent groups of third drive signal lines 202a. The plurality of second drive signal lines 201b and the plurality of fourth drive signal lines 202b are arranged alternately. That is, a fourth drive signal line 202b is arranged between two adjacent second drive signal lines 201b, and a second drive signal line 201b is arranged between two adjacent fourth drive signal lines 202b. In this way, even if the first drive signal line 201a and the third drive signal line 202a are both within the first metal layer 203, and the second drive signal line 201b and the fourth drive signal line 202b are both within the second metal layer 204, it can be ensured that there is no mutual interference between the first drive signal line 201a and the third drive signal line 202a, and there is no mutual interference between the second drive signal line 201b and the fourth drive signal line 202b. It can also be ensured that the first light-emitting unit 300 is driven to emit light under the cooperation of the first drive signal line 201a and the second drive signal line 201b, and the second light-emitting unit 400 is driven to emit light under the cooperation of the third drive signal line 202a and the fourth drive signal line 202b.

[0154] It should be noted that when the driving layer 200 is a passive driving layer, the display panel 000 generally further includes: a plurality of first chips (not labeled in the figure) and a plurality of second chips (not labeled in the figure). The plurality of first chips can correspond to the plurality of first light-emitting units 300, and the first chips can also be soldered to the first solder pad S1. In this way, under the cooperation of the first drive signal line 201a and the second drive signal line 201b, the first chips can be controlled to work, so that the first chips can send corresponding drive signals to the corresponding first light-emitting units 300 to control the first light-emitting units 300 to emit light. Similarly, the plurality of second chips can correspond to the plurality of second light-emitting units 400, and the second chips can also be soldered to the second solder pad S2. In this way, under the cooperation of the third drive signal line 202a and the fourth drive signal line 202b, the second chips can be controlled to work, so that the second chips can send corresponding drive signals to the corresponding second light-emitting units 400 to control the second light-emitting units 400 to emit light.

[0155] Optionally, the thickness of the first metal layer 203 is greater than the thickness of the second metal layer 204. Here, the thickness of the first metal layer 203 and the thickness of the second metal layer 204 both refer to: the thickness of the portion of the metal layer located on the insulating layer. Since the drive signal line in the first metal layer 203 includes: an anode or cathode drive signal line, a data signal line and a ground line, and the anode or cathode drive signal line and the ground line are both signals loaded with a fixed potential. Therefore, in order to ensure that the potentials of the anode or cathode drive signal line and the ground line are consistent at each position, it is necessary to reduce the resistance of the anode or cathode drive signal line and the ground line. When the thickness of the first metal layer 203 is large, it can be ensured that the resistance of the anode or cathode drive signal line and the ground line in the first metal layer 203 is small.

[0156] For example, the first metal layer 203 may include a stacked electroplating seed layer 203a and a metal layer body 203b. The electroplating seed layer 203a is closer to the substrate 100 than the metal layer body 203b, and the thickness of the metal layer body 203b may be greater than the thickness of the second metal layer 204. During the preparation of the first metal layer 203, the electroplating seed layer 203a may be formed on the substrate 100, and then the electroplating process may be used to form the thicker metal layer body 203b on the side of the electroplating seed layer 203a facing away from the substrate 100.

[0157] It should be noted that, for the display panel in the second optional implementation manner described above, an insulating layer may be provided between the first metal layer 203 and the second metal layer 204 in the display panel 000, and an insulating layer may also be provided on the side of the stacked metal layer 204 facing away from the substrate 100. The structures of these insulating layers can be referred to the corresponding contents in the related art and will not be further described here.

[0158] Optionally, as shown in Figures 5 and 7, the display panel 000 may further include: a first light absorbing layer B1 located on the side of the substrate 100 facing away from the drive layer 200, and a second light absorbing layer B2 located on the side of the drive layer 200 facing away from the substrate 100. The first light emitting unit 300 may be located on the side of the first light absorbing layer B1 facing away from the substrate 100, and the second light emitting unit 400 may be located on the side of the second light absorbing layer B2 facing away from the substrate 100. In this case, the first light absorbing layer B1 can partially block the light emitted by the first light emitting unit 300, preventing the light from the first light emitting unit 300 from passing through the film structure within the display panel 000 and emitting from the side of the display panel 000 where the second light emitting unit 400 is located. Similarly, the second light absorbing layer B2 can partially block the light from the second light emitting unit 400, preventing the light from the second light emitting unit 400 from passing through the film structure within the display panel 000 and emitting from the side of the display panel 000 where the first light emitting unit 300 is located. In this way, the side of the display panel 000 where the first light-emitting unit 300 is set will only emit the light emitted by the first light-emitting unit 300, and will not emit the light emitted by the second light-emitting unit 400. The side of the display panel 000 where the second light-emitting unit 400 is set will only emit the light emitted by the second light-emitting unit 400, and will not emit the light emitted by the first light-emitting unit 300, thereby making the display panel 000 have a better effect when performing double-sided display.

[0159] It should be noted that both the first light absorbing layer B1 and the second light absorbing layer B2 are layers having a relatively high light absorption rate. For example, both the first light absorbing layer B1 and the second light absorbing layer B2 are black light absorbing layers. Here, the light absorption rates of both the first light absorbing layer B1 and the second light absorbing layer B2 can be higher than 90%.

[0160] In summary, the display panel provided in the embodiments of the present application includes: a substrate, a drive layer, a first light-emitting unit, and a second light-emitting unit. By providing a plurality of first light-emitting units arranged in an array on the side of the substrate facing away from the drive layer, and when each first light-emitting unit emits light, the side of the substrate facing away from the drive layer can display a corresponding image. By providing a plurality of second light-emitting units arranged in an array on the side of the drive layer facing away from the substrate, and when each second light-emitting unit emits light, the side of the drive layer facing away from the substrate can display a corresponding image. To this end, the display panel can display images not only on one side through the first light-emitting units, but also on the other side through the second light-emitting units. This allows the display panel to display images on both sides without using a backlight module and a combination of two liquid crystal display panels. Furthermore, the first drive structure of the drive layer in the display panel can drive the first light-emitting unit to emit light independently, and the second drive structure of the drive layer can drive the second light-emitting unit to emit light independently. Therefore, without requiring each light-emitting unit to emit high-brightness light, a clear display image can be presented on both sides of the display panel. This effectively reduces the power consumption of the display panel.

[0161] The present application also provides a method for manufacturing a display panel, which is used to manufacture the display panel in the above embodiment. The method for manufacturing a display panel may include:

[0162] A driving layer, a first light emitting unit and a second light emitting unit are formed on a substrate.

[0163] Among them, the driving layer is located on one side of the substrate, and the driving layer includes: a first driving structure and a second driving structure; the first light-emitting unit is located on the side of the substrate away from the driving layer, and is electrically connected to the first driving structure; the second light-emitting unit is located on the side of the driving layer away from the substrate, and is electrically connected to the second driving structure.

[0164] In summary, the manufacturing method of the display panel provided in the embodiment of the present application forms a plurality of first light-emitting units arranged in an array on the side of the substrate facing away from the drive layer, and when each first light-emitting unit emits light, the side of the substrate facing away from the drive layer can display the corresponding picture. By forming a plurality of second light-emitting units arranged in an array on the side of the drive layer facing away from the substrate, and when each second light-emitting unit emits light, the side of the drive layer facing away from the substrate can display the corresponding picture. To this end, the display panel can not only display the picture on one side through the first light-emitting unit, but also display the picture on the other side through the second light-emitting unit, without using a backlight module and two liquid crystal display panels in combination, the display panel can be made to perform double-sided display. In addition, the first driving structure of the driving layer in the display panel can drive the first light-emitting unit to emit light alone, and the second driving structure of the driving layer can drive the second light-emitting unit to emit light alone. Therefore, without requiring each light-emitting unit to emit high-brightness light, both sides of the display panel can present a clear display picture. In this way, the power consumption of the display panel can be effectively reduced.

[0165] Please refer to Figure 10, which is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application. The method for manufacturing a display panel is used to manufacture the display panel shown in Figures 4, 5, or 7 above. The method for manufacturing a display panel may include:

[0166] Step S101 : providing a rigid substrate and forming a sacrificial layer on one side of the rigid substrate.

[0167] Alternatively, the rigid substrate may be a glass substrate. For example, please refer to Figure 11, which is a schematic diagram of forming a sacrificial layer on one side of a rigid substrate according to an embodiment of the present application. The sacrificial layer 00b may be formed on one side of the rigid substrate 00a by any of a variety of methods, such as deposition, coating, or sputtering. The sacrificial layer may be made of a material whose adhesion is reduced under laser irradiation.

[0168] Step S102 : forming a first pad on a side of the sacrificial layer facing away from the rigid substrate.

[0169] Optionally, the first pad may be made of a metal material. For example, the first pad may be made of copper, titanium, molybdenum, or an alloy thereof. The thickness of the first pad may be in a range of 3000 angstroms to 6000 angstroms.

[0170] For example, please refer to Figure 12, which is a schematic diagram of forming a first pad on the side of the sacrificial layer facing away from the rigid substrate, according to an embodiment of the present application. A metal film can be formed on the side of the sacrificial layer 00b facing away from the rigid substrate 00a by any of a variety of methods, such as deposition, coating, or sputtering. Then, a single patterning process is performed on the metal film to form the first pad S1.

[0171] Step S103 : forming a first protection layer on the rigid substrate having the first pad formed thereon.

[0172] Optionally, the first protective layer may be made of inorganic materials such as silicon nitride, silicon oxide, or silicon oxynitride. The thickness of the first protective layer may range from 1000 angstroms to 4000 angstroms.

[0173] For example, please refer to Figure 13, which is a schematic diagram of forming a first protective layer on a rigid substrate having a first pad formed thereon, according to an embodiment of the present application. An insulating film can be formed on the rigid substrate 00a having the first pad S1 formed thereon by any of a variety of methods, such as deposition, coating, or sputtering. Then, a patterning process is performed on the insulating film to form the first protective layer 600.

[0174] Here, the orthographic projection of the first pad S1 on the rigid substrate 00a is located at the orthographic projection of the first protective layer 600 on the rigid substrate 00a, and the first protective layer 600 can cover the side of the first pad S1 and the side of the first pad S1 facing away from the rigid substrate 00a. In this way, the first protective layer 600 can protect the first pad S1, ensuring that during subsequent processes, the first protective layer 600 can isolate water and oxygen in the external environment, preventing the first pad S1 from being corroded.

[0175] Step S104 : forming a substrate on a side of the first protective layer facing away from the rigid substrate.

[0176] Optionally, the substrate material may be an organic material such as polyimide (abbreviated as PI), polyvinyl alcohol (abbreviated as PVA), polyester (abbreviated as PET) or polyethylene naphthalate (abbreviated as PEN), and the thickness of the substrate may range from 3 microns to 5 microns.

[0177] For example, please refer to Figure 14, which is a schematic diagram of a substrate formed on the side of the first protective layer facing away from the rigid substrate, according to an embodiment of the present application. A viscous PI material can be formed by coating on the side of the first protective layer 600 facing away from the rigid substrate 00a. After high-temperature curing, the substrate 100 can be obtained on the side of the first protective layer 600 facing away from the rigid substrate 00a. Subsequently, a patterning process can be performed on the substrate 100 to form the first via V1 therein.

[0178] The orthographic projection of the first via hole V1 on the rigid substrate 00a is located within the orthographic projection of the first pad S1 on the rigid substrate 00a, to ensure that the bonding electrode subsequently formed in the first via hole V1 can be bonded to the first pad S1 normally.

[0179] Step S105 : forming a second protective layer on a side of the substrate facing away from the rigid base.

[0180] Optionally, the second protective layer may be made of inorganic materials such as silicon nitride, silicon oxide, or silicon oxynitride. The thickness of the second protective layer may range from 1000 angstroms to 4000 angstroms.

[0181] For example, please refer to Figure 15, which is a schematic diagram of forming a second protective layer on the side of a substrate facing away from the rigid substrate, according to an embodiment of the present application. The second protective layer 700 can be formed on the side of the substrate 100 facing away from the rigid substrate 00a by any of a variety of methods, such as deposition, coating, or sputtering. Then, a single patterning process is performed on the second protective layer 700 to form a third via V3 in the second protective layer 700 and a second via V2 in the first protective layer 600 that communicates with the third via V3.

[0182] A portion of the second protective layer 700 may extend into the first via hole V1 and cover at least a portion of the inner wall of the first via hole V1. The portion of the second protective layer 700 extending into the first via hole V1 may include a third via hole V3. Here, the third via hole V3 is formed by etching the second protective layer 700 during the patterning process. Furthermore, after etching the second protective layer 700 during the patterning process to form the third via hole V3, the first protective layer 600 may be further etched to form a second via hole V2 in the first protective layer 600 that communicates with the third via hole V3. In this case, the orthographic projection of the second via hole V2 on the rigid substrate 00a may completely overlap with the orthographic projection of the third via hole V3 on the rigid substrate 00a, allowing the subsequent formation of a bonding electrode within the first via hole V1 to pass through the third via hole V3 and the second via hole V2 in sequence and bond to the first pad S1.

[0183] Step S106 : forming a bonding electrode in the first via hole and electrically connected to the first pad.

[0184] For example, please refer to Figure 16, which is a schematic diagram of a bonding electrode formed in a first via hole, electrically connected to a first pad, according to an embodiment of the present application. A plating seed layer can be first formed by sputtering on the side of the second protective layer 700 facing away from the substrate 100. Then, a metal conductive layer is formed on the side of the plating seed layer facing away from the substrate 100 using an electroplating process. Subsequently, a patterning process is performed on the stacked metal film consisting of the plating seed layer and the metal conductive layer to obtain the bonding electrode 500.

[0185] It should be noted that in the process of using the electroplating process to form the metal conductive layer, the metal conductive layer can fill the first via hole V1, so that the subsequently formed overlapping electrode 500 can fill the first via hole V1, and then ensure that the part of the overlapping electrode 500 located in the first via hole V1 can pass through the third via hole V3 and the second via hole V2 in sequence and then be stably overlapped with the first pad S1.

[0186] Step S107 : forming a driving layer on the rigid substrate with the bonding electrodes formed thereon.

[0187] It should be noted that the driving layer can be either an active driving layer as shown in Figure 5 or a passive driving layer as shown in Figure 7. The following embodiments will be described schematically using an active driving layer as an example.

[0188] For example, please refer to Figure 17, which is a schematic diagram of forming a driving layer on a rigid substrate with a bonding electrode, according to an embodiment of the present application. A buffer layer 001, a first conductive layer, a first gate insulating layer 002, an active layer pattern, a second gate insulating layer 003, a second conductive layer, an interlayer dielectric layer 004, a third conductive layer, an insulating protective layer 800, a second conductive pad S2, and a third protective layer 900 can be sequentially formed on the side of the bonding electrode 500 facing away from the rigid substrate 00a.

[0189] The first conductive layer may include: a first gate electrode G01, a second gate electrode G02, a first transition electrode Z1, a first connection electrode L1, and a third connection electrode L3. The active layer pattern may include: a first active layer A1 in the first transistor and a second active layer A2 in the second transistor. The second conductive layer may include: a third gate electrode G03, a fourth gate electrode G04, a second transition electrode Z2, a second connection electrode L2, and a fourth connection electrode L4. The third conductive layer may include: a first source electrode S01, a first drain electrode D01, a second source electrode S02, a second drain electrode D02, a first output electrode P1', and a second output electrode P2'. The insulating protective layer 800 may include: an organic planarization layer 801 and an inorganic passivation layer 802 arranged in a stacked arrangement. The specific structure of the display panel can be referred to in the aforementioned embodiments describing the structure of the display panel and will not be further described here.

[0190] Step S108 , performing a peeling process on the rigid substrate.

[0191] For example, please refer to Figure 18, which is a schematic diagram of a method for peeling a rigid substrate according to an embodiment of the present application. Laser irradiation can be used to irradiate sacrificial layer 00b, reducing its viscosity. This allows the rigid substrate 00a and sacrificial layer 00b to be peeled off the substrate 100 together.

[0192] Step S109 : forming a first light absorption layer on a side of the substrate facing away from the driving layer, and forming a second light absorption layer on a side of the driving layer facing away from the substrate.

[0193] For example, please refer to Figure 19, which is a schematic diagram of an embodiment of the present application, in which a first light absorption layer is formed on the side of the substrate facing away from the drive layer, and a second light absorption layer is formed on the side of the drive layer facing away from the substrate. Here, a first light absorption layer B1 can be formed on the side of the substrate 100 facing away from the drive layer 200, and the first light absorption layer B1 can have a first opening corresponding to the first solder pad S1, so that the subsequent first light-emitting unit can pass through the first opening and be soldered to the first solder pad S1. Thereafter, a second light absorption layer B2 can be formed on the side of the drive layer 200 facing away from the substrate 100, and the second light absorption layer B2 can have a second opening corresponding to the second solder pad S2, so that the subsequent second light-emitting unit can pass through the second opening and be soldered to the second solder pad S2.

[0194] Step S110: transfer the first light-emitting unit to the side of the substrate away from the driving layer, electrically connect the first light-emitting unit to the first pad, and transfer the second light-emitting unit to the side of the driving layer away from the substrate, electrically connect the second light-emitting unit to the second pad.

[0195] For example, as shown in FIG5 or FIG7, the first light-emitting unit 300 can be transferred to the side of the substrate 100 away from the driving layer 200, and the first light-emitting unit 300 can be soldered to the first solder pad S1. Thereafter, the second light-emitting unit 400 can be transferred to the side of the driving layer 200 away from the substrate 100, and the second light-emitting unit 400 can be soldered to the second solder pad S2.

[0196] In summary, the manufacturing method of the display panel provided in the embodiment of the present application forms a plurality of first light-emitting units arranged in an array on the side of the substrate facing away from the drive layer, and when each first light-emitting unit emits light, the side of the substrate facing away from the drive layer can display the corresponding picture. By forming a plurality of second light-emitting units arranged in an array on the side of the drive layer facing away from the substrate, and when each second light-emitting unit emits light, the side of the drive layer facing away from the substrate can display the corresponding picture. To this end, the display panel can not only display the picture on one side through the first light-emitting unit, but also display the picture on the other side through the second light-emitting unit, without using a backlight module and two liquid crystal display panels in combination, the display panel can be made to perform double-sided display. In addition, the first driving structure of the driving layer in the display panel can drive the first light-emitting unit to emit light alone, and the second driving structure of the driving layer can drive the second light-emitting unit to emit light alone. Therefore, without requiring each light-emitting unit to emit high-brightness light, both sides of the display panel can present a clear display picture. In this way, the power consumption of the display panel can be effectively reduced.

[0197] Those skilled in the art will clearly understand that for the convenience and brevity of description, the principles of the various film layer structures in the display panel described above can refer to the corresponding contents in the aforementioned structural embodiments of the display panel and will not be repeated here.

[0198] Embodiments of the present application also provide a display device. This display device can be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system. This display device can include a driver component and the display panel described in the above embodiments. The driver component can be electrically connected to a driver layer in the display panel, and is configured to provide a drive signal to the light-emitting unit via the driver layer.

[0199] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0200] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0201] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display panel, It is characterized in that include: substrate; A driving layer located on one side of the substrate, the driving layer comprising: a first driving structure and a second driving structure; a first light emitting unit located on a side of the substrate away from the driving layer, and a second light emitting unit located on a side of the driving layer away from the substrate; The first light-emitting unit is electrically connected to the first driving structure, and the second light-emitting unit is electrically connected to the second driving structure; at least one conductive layer in the first driving structure and at least one conductive layer in the second driving structure are arranged on the same layer.

2. The display panel according to claim 1, It is characterized in that The substrate has a first via hole, and the display panel further includes: a lap electrode, at least a portion of which is located in the first via hole, the lap electrode is electrically connected to the first driving structure, and a side of the lap electrode away from the first driving structure is electrically connected to the first light-emitting unit.

3. The display panel according to claim 2, It is characterized in that The side of the substrate facing away from the driving layer has a groove connected to the first via hole, and the display panel also includes: a first solder pad located in the groove, one side of the first solder pad is connected to the overlapping electrode, and the side of the first solder pad facing away from the overlapping electrode is electrically connected to the first light-emitting unit.

4. The display panel according to claim 3, It is characterized in that The display panel further includes: a first protective layer located in the groove, the first protective layer is distributed between the substrate and the first pad, and the first protective layer has a second via hole, and the bonding electrode can pass through the second via hole to be electrically connected to the first pad.

5. The display panel according to claim 4, It is characterized in that The display panel further includes: a second protective layer located on a side of the substrate facing the driving layer, a portion of the second protective layer extending into the first via hole and covering at least a portion of an inner wall of the first via hole; The portion of the second protection layer extending into the first via hole has a third via hole connected to the second via hole.

6. The display panel according to claim 3, It is characterized in that A side of the first pad facing away from the driving layer is flush with a side of the substrate facing away from the driving layer.

7. The display panel according to any one of claims 1 to 6, It is characterized in that The first driving structure includes a first transistor, the second driving structure includes a second transistor, the first transistor includes a first active layer, the second transistor includes a second active layer, and the first active layer and the second active layer are arranged in the same layer.

8. The display panel according to claim 7, It is characterized in that The first transistor further includes a first source and a first drain, and the second transistor further includes a second source and a second drain; The first driving structure further includes: a first output electrode electrically connected to the first transistor, and the second driving structure further includes: a second output electrode electrically connected to the second transistor; The first source, the first drain, the second source, the second drain, the first output electrode and the second output electrode are arranged in the same layer.

9. The display panel according to claim 8, It is characterized in that The first transistor further includes a first gate, the first gate is insulated from the first active layer, and the first gate is closer to the substrate than the first active layer, the first source and the first drain are both overlapped with the first active layer, and the first active layer is closer to the substrate than the first source and the first drain; The second transistor further includes a second gate, the second gate is insulated from the second active layer, and the second gate is closer to the substrate than the second active layer, the second source and the second drain are both overlapped with the second active layer, and the second active layer is closer to the substrate than the second source and the second drain; The display panel further includes: a first switching electrode, wherein the first switching electrode, the first gate electrode and the second gate electrode are arranged in the same layer; Wherein, the first output electrode is electrically connected to the first light-emitting unit through the first switching electrode.

10. The display panel according to claim 9, It is characterized in that The first transistor further includes a third gate, the third gate is insulated from the first active layer, and the first active layer is closer to the substrate than the third gate; the second transistor further includes a fourth gate, the fourth gate is insulated from the second active layer, and the second active layer is closer to the substrate than the fourth gate; The display panel further includes: a second switching electrode, wherein the second switching electrode, the third grid electrode and the fourth grid electrode are arranged in the same layer; The first output electrode is electrically connected to the first light-emitting unit through the second switching electrode and the first switching electrode in sequence.

11. The display panel according to claim 8, It is characterized in that The display panel further comprises: an insulating protection layer and a second pad located on a side of the driving layer away from the substrate; The insulating protection layer has a fourth via hole corresponding to the second pad, at least a portion of the second pad extends into the fourth via hole and is electrically connected to the second output electrode, and the side of the second pad facing away from the substrate is electrically connected to the second light-emitting unit.

12. The display panel according to claim 11, It is characterized in that The insulating protection layer includes: an organic planarizing layer and an inorganic passivation layer which are stacked, the organic planarizing layer being closer to the substrate than the inorganic passivation layer, the second pad including a portion located outside the fourth via hole, the portion of the second pad located outside the fourth via hole being in contact with a side of the inorganic passivation layer facing away from the substrate.

13. The display panel according to claim 11, It is characterized in that The display panel further includes: a third protective layer located on a side of the insulating protective layer away from the substrate, the second pad includes a portion located outside the fourth via hole, and the third protective layer covers at least part of the side surface of the portion of the second pad located outside the fourth via hole.

14. The display panel according to claim 13, It is characterized in that A portion of the third protective layer is located on the side of the second pad away from the substrate, and a portion of the third protective layer located on the side of the second pad away from the substrate has a fifth via, and the orthographic projection of the fifth via on the plane where the substrate is located is located within the orthographic projection of the second pad on the plane where the substrate is located.

15. The display panel according to claim 11, It is characterized in that The second pad includes a portion located outside the fourth via hole, and a thickness of the portion of the second pad located outside the fourth via hole is greater than or equal to a thickness of the third protection layer.

16. The display panel according to claim 10, It is characterized in that The first driving structure further includes: a first connecting electrode and a second connecting electrode, wherein the first connecting electrode and the first gate are arranged in the same layer, and the first connecting electrode is electrically connected to the first gate, the second connecting electrode and the third gate are arranged in the same layer, and the second connecting electrode is electrically connected to the third gate, and the first connecting electrode is overlapped with the second connecting electrode; The second driving structure also includes: a third connecting electrode and a fourth connecting electrode, the third connecting electrode is arranged on the same layer as the second gate, and the third connecting electrode is electrically connected to the second gate, the fourth connecting electrode is arranged on the same layer as the fourth gate, and the fourth connecting electrode is electrically connected to the fourth gate, and the third connecting electrode is overlapped with the fourth connecting electrode.

17. The display panel according to any one of claims 1 to 6, It is characterized in that The driving layer comprises: a first metal layer and a second metal layer which are stacked; The first driving structure comprises: a plurality of first driving signal lines located in the first metal layer, and a second driving signal line located in the second metal layer, wherein an extension direction of the first driving signal line intersects an extension direction of the second driving signal line; The second driving structure comprises: a plurality of third driving signal lines located in the first metal layer, and a fourth driving signal line located in the second metal layer, wherein an extension direction of the third driving signal line intersects an extension direction of the fourth driving signal line; The extending direction of the first driving signal line is parallel to the extending direction of the third driving signal line, and the extending direction of the second driving signal line is parallel to the extending direction of the fourth driving signal line.

18. The display panel according to claim 17, It is characterized in that The plurality of first light-emitting units are arranged in a plurality of rows and columns, the plurality of first drive signal lines include a plurality of groups of first drive signal lines corresponding to the plurality of columns of the first light-emitting units, a group of the first drive signal lines is electrically connected to each first light-emitting unit in a corresponding column of the first light-emitting units, and a second drive signal line is electrically connected to each first light-emitting unit in a row of the first light-emitting units; The plurality of second light-emitting units are arranged in a plurality of rows and columns, the plurality of third drive signal lines include a plurality of groups of third drive signal lines corresponding to the plurality of columns of the second light-emitting units, a group of the third drive signal lines is electrically connected to each second light-emitting unit in a corresponding column of the second light-emitting units, and one fourth drive signal line is electrically connected to each second light-emitting unit in a row of the second light-emitting units; Wherein, the plurality of groups of first driving signal lines and the plurality of groups of third driving signal lines are arranged alternately; and the plurality of second driving signal lines and the plurality of fourth driving signal lines are arranged alternately.

19. The display panel according to claim 17, It is characterized in that The thickness of the first metal layer is greater than the thickness of the second metal layer.

20. The display panel according to claim 19, It is characterized in that The first metal layer includes a stacked electroplating seed layer and a metal layer body, the electroplating seed layer is closer to the substrate than the metal layer body, and the thickness of the metal layer body is greater than that of the second metal layer.

21. The display panel according to any one of claims 1-6, 8-16, 18-20, It is characterized in that The display panel further comprises: a first light absorption layer located on a side of the substrate away from the driving layer, and a second light absorption layer located on a side of the driving layer away from the substrate; The first light-emitting unit is located on a side of the first light-absorbing layer away from the substrate, and the second light-emitting unit is located on a side of the second light-absorbing layer away from the substrate.

22. The display panel according to any one of claims 1-6, 8-16, 18-20, It is characterized in that The first light emitting unit and the second light emitting unit both include: a light emitting diode.

23. A method for manufacturing a display panel, It is characterized in that The method comprises: forming a driving layer, a first light emitting unit and a second light emitting unit on a substrate; The driving layer is located on one side of the substrate, and the driving layer includes: a first driving structure and a second driving structure; the first light-emitting unit is located on the side of the substrate away from the driving layer, and is electrically connected to the first driving structure; the second light-emitting unit is located on the side of the driving layer away from the substrate one side and is electrically connected to the second driving structure; at least one conductive layer in the first driving structure and at least one conductive layer in the second driving structure are arranged on the same layer.

24. The method according to claim 23, It is characterized in that The step of forming a driving layer, a first light emitting unit and a second light emitting unit on a substrate comprises: forming a first pad on the rigid substrate; forming the substrate on a side of the first pad away from the rigid substrate, the substrate having a first via hole; The driving layer is formed on a side of the substrate facing away from the rigid substrate, and the first driving structure in the driving layer is electrically connected to the first pad through the first via hole; performing a peeling process on the rigid substrate; Transferring the first light-emitting unit to a side of the substrate away from the driving layer, so that the first light-emitting unit is electrically connected to the first pad; The second light emitting unit is transferred to a side of the driving layer away from the substrate, so that the second light emitting unit is electrically connected to the second driving structure in the driving layer.

25. The method according to claim 24, It is characterized in that Before forming the driving layer on the side of the substrate facing away from the rigid substrate, the method further includes: A bonding electrode electrically connected to the first pad is formed in the first via hole.

26. The method according to claim 25, It is characterized in that The method further comprises: Before forming the substrate on the side of the first pad facing away from the rigid substrate, forming a first protective layer on the rigid substrate on which the first pad is formed, the first protective layer having a second via hole, the orthographic projection of the second via hole on the rigid substrate being located within the orthographic projection of the first pad on the rigid substrate; Before forming a lap electrode electrically connected to the first pad in the first via, a second protective layer is formed on a side of the substrate facing away from the rigid substrate, a portion of the second protective layer extends into the first via and covers at least a portion of the inner wall of the first via, and a portion of the second protective layer extending into the first via has a third via connected to the second via.

27. A method according to any one of claims 23 to 26, It is characterized in that The material of the substrate is polyimide, polyvinyl alcohol, polyester or polyethylene naphthalate.

28. A display device, It is characterized in that include: A driving component, and a display panel electrically connected to the driving component, wherein the display panel is the display panel according to any one of claims 1 to 22.

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