Wafer coating equipment and process

Abstract

The invention provides wafer coating equipment and a wafer coating process, and the wafer coating equipment comprises a rack, a driving assembly, a stop lever, a rotating seat and a wafer clamp, a limiting block is arranged on the rack, and a first limiting groove and a second limiting groove are formed in the limiting block; the driving assembly comprises a driving device and a transmission shaft; the gear rod is connected to the transmission shaft in a penetrating mode, a first limiting protruding block and a second limiting protruding block are arranged at the two ends of the gear rod respectively, the first limiting protruding block is provided with a first limiting face used for abutting against the first limiting groove, the second limiting protruding block is provided with a second limiting face, and the second limiting face is used for abutting against the second limiting groove after the transmission shaft rotates by 180 degrees. The second limiting surface and the first limiting surface are coplanar, and the axis of the transmission shaft is located in the second limiting surface; the rotating seat is respectively connected with the transmission shaft and the wafer clamp; the wafer clamp is used for placing a wafer. According to the wafer coating equipment, limiting is carried out through a mechanical structure, adjustment is convenient, the positioning precision is high, the structural rigidity is high, and the reliability is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer coating, and in particular to a wafer coating device and process. Background Art

[0002] In the process of processing the wafer, it is necessary to evaporate a certain thickness of metal conductive film on the cleaned wafer by vacuum plating. Before coating, the wafer needs to be double-sided inspected and the front and back sides adjusted. Some wafers need double-sided coating, so the wafer needs to be accurately flipped 180 degrees.

[0003] There are two main solutions for flipping the wafer in the wafer coating equipment in the prior art: one is to flip the wafer manually, and there is no corresponding limit structure, so the wafer flipping angle cannot be accurately controlled and the efficiency is low; the other is to flip the wafer automatically and use sensors to control the wafer flipping angle. However, if the sensor fails or the data is not transmitted in time, the flipping angle may not be controlled or the control accuracy is low, and the reliability is low. Summary of the invention

[0004] In view of this, the present invention proposes a chip coating equipment and process to solve the problem of using a sensor proposed in the above background technology to control the chip flip angle. However, if the sensor fails or the data transmission is not timely, it may lead to the technical problem that the flip angle control cannot be achieved or the control accuracy is low and the reliability is low.

[0005] The technical solution of the present invention is achieved in this way:

[0006] In a first aspect, the present invention provides a wafer coating device, comprising a frame, a driving assembly, a gear lever, a rotating seat and a wafer clamp, wherein:

[0007] A limit block is arranged on the frame, and a first limit slot and a second limit slot are arranged on the limit block;

[0008] The driving assembly includes a driving device and a transmission shaft, wherein the driving device is mounted on the frame and is drivingly connected to the transmission shaft;

[0009] The shift lever is connected to the transmission shaft, and the two ends of the shift lever are symmetrical about the axis of the transmission shaft. The two ends of the shift lever are respectively provided with a first limiting protrusion and a second limiting protrusion, the first limiting protrusion is provided with a first limiting surface, the first limiting surface is used to abut against the first limiting groove, the second limiting protrusion is provided with a second limiting surface, the second limiting surface is used to abut against the second limiting groove after the transmission shaft rotates 180 degrees, the second limiting surface is coplanar with the first limiting surface, and the axis of the transmission shaft is located in the second limiting surface;

[0010] The rotating seat is connected to the transmission shaft and the wafer fixture respectively;

[0011] The wafer holder is used for placing a wafer.

[0012] On the basis of the above technical solution, preferably, the cross-section of the limit block is provided with a first center line and a second center line, the first center line is parallel to the axial direction of the transmission shaft, the first center line and the axis of the transmission shaft are located in the same vertical plane, the first limit groove and the second limit groove are respectively formed by extending from the first center line to the edges on both sides, and the first limit groove and the second limit groove are located on both sides of the second center line.

[0013] On the basis of the above technical solution, preferably, the wafer clamp comprises an intermediate disk, a first pressing plate, a second pressing plate and a pressing plate moving assembly, the intermediate disk is connected to the rotating seat, a placement hole is provided on the intermediate disk, the first pressing plate and the second pressing plate are respectively slidably connected to two sides of the intermediate disk; the pressing plate moving assembly is used to drive the first pressing plate and the second pressing plate to move;

[0014] In an initial state, the first pressing sheet is located inside the placement hole and forms a placement area for placing a wafer with the placement hole, and the second pressing sheet is located outside the placement hole;

[0015] During the process of the transmission shaft driving the rotating seat to rotate, the pressing plate moving assembly is used to drive the first pressing plate to move away from the placement hole, and drive the second pressing plate to move toward the placement hole, until the rotating seat rotates 180 degrees, the second pressing plate is located on the inner side of the placement hole, and the first pressing plate is located on the outer side of the placement hole.

[0016] On the basis of the above technical solution, preferably, the intermediate plate is provided with a first guide groove and a second guide groove parallel to each other;

[0017] The first pressing sheet includes a first pressing portion and a first connecting sheet, the first pressing portion is an arc-shaped ring, the outer diameter of the wafer is between the inner diameter of the first pressing portion and the diameter of the placement hole, and the first connecting sheet is provided with a first sliding column, which is slidably arranged in the first guide groove;

[0018] The second pressing sheet includes a second pressing portion and a second connecting sheet, the second pressing portion is an arc-shaped ring, the outer diameter of the wafer is between the inner diameter of the second pressing portion and the diameter of the placement hole, the first connecting sheet is provided with a second sliding column, and the second sliding column is slidably arranged in the second guide groove;

[0019] The pressing piece moving assembly is connected to the first connecting piece and the second connecting piece respectively.

[0020] On the basis of the above technical solution, preferably, the tablet moving assembly includes a guide rail block, a first slider, a second slider, a connecting rope, a first driving member and a second driving member;

[0021] The guide rail block is installed on the rotating seat, the bottom surface and the top surface of the guide rail block are respectively provided with a first guide rail and a second guide rail, and the side surface of the guide rail block is provided with a hanging column at one end away from the placement hole;

[0022] The first sliding block is slidably mounted on the first guide rail and connected to the first connecting piece;

[0023] The second sliding block is slidably mounted on the second guide rail and connected to the second connecting piece;

[0024] The connecting rope is wound around the hanging column, and two ends thereof are respectively connected to the first sliding block and the second sliding block;

[0025] The first driving member is installed on the rotating seat, and is used to push the first sliding block to move toward the placement hole, and drive the second sliding block to move away from the placement hole through the connecting rope;

[0026] The second driving member is installed on the rotating seat, and is used to push the second sliding block to move toward the placement hole, and drive the first sliding block to move away from the placement hole through the connecting rope;

[0027] In an initial state, the second driving member is in abutting connection with the second sliding block, and a distance is set between the first driving member and the first sliding block.

[0028] On the basis of the above technical solution, preferably, the bottom surface and the top surface of the guide rail block are respectively provided with a first stopper and a second stopper at one end close to the placement hole.

[0029] On the basis of the above technical solution, preferably, the first sliding block is provided with a first contact portion for contacting the first driving member, and the second sliding block is provided with a second contact portion for contacting the second driving member.

[0030] On the basis of the above technical solution, preferably, the pressing plate moving assembly also includes a first connecting rod and a second connecting rod; one end of the first connecting rod is connected to the first interference portion, and the other end is connected to the first connecting piece; one end of the second connecting rod is connected to the second interference portion, and the other end is connected to the second connecting piece.

[0031] On the basis of the above technical solution, preferably, the drive assembly also includes a transmission mechanism, the transmission mechanism includes a driving gear and a driven gear, the driving gear is connected to the driving device, and the driven gear is installed on the transmission shaft and meshes with the driving gear.

[0032] In a second aspect, the present invention provides a wafer coating process, using the wafer coating device described in the first aspect, comprising:

[0033] placing a wafer on a wafer holder;

[0034] The driving device drives the transmission shaft to rotate 180 degrees in the forward direction, driving the rotating seat and the wafer clamp to rotate 180 degrees in the forward direction, and the second limiting protrusion abuts against the second limiting groove;

[0035] The driving device drives the transmission shaft to reverse 180 degrees for resetting, driving the rotating seat and the wafer clamp to rotate 180 degrees in the opposite direction, and the first limiting protrusion abuts against the first limiting groove.

[0036] The wafer coating device of the present invention has the following beneficial effects compared with the prior art:

[0037] (1) The gear lever is connected to the transmission shaft, the second limiting surface is coplanar with the first limiting surface, and the axis of the transmission shaft is located in the second limiting surface. In the initial state, the first limiting surface abuts against the first limiting groove, and the second limiting surface abuts against the second limiting groove after the transmission shaft rotates 180 degrees. The wafer coating equipment uses the principle that a straight line coincides with the original straight line after rotating 180 degrees around any point on it, and limits the position through a mechanical structure, which is convenient to adjust, has high positioning accuracy, high structural rigidity, and improves reliability.

[0038] (2) A first center line and a second center line are provided through the cross section of the limit block, the first center line is parallel to the axial direction of the transmission shaft, the first center line and the axis of the transmission shaft are located in the same vertical plane, and the first limit groove and the second limit groove are respectively formed by extending from the first center line to the edges on both sides, so as to ensure that the gear lever accurately rotates 180 degrees in the process of switching from the first limit surface abutting against the first limit groove to the second limit surface abutting against the second limit groove. By locating the first limit groove and the second limit groove on both sides of the second center line, it can be ensured that there is a certain separation thickness between the first limit groove and the second limit groove, thereby improving the strength, reliability and stability of the device;

[0039] (3) The intermediate disk is connected to the rotating seat, and a placement hole is provided on the intermediate disk. The first pressing plate and the second pressing plate are respectively slidably connected to the two sides of the intermediate disk; in the initial state, the first pressing plate is located on the inner side of the placement hole, and forms a placement area for placing the wafer with the placement hole, and the second pressing plate is located on the outer side of the placement hole; in the process of the rotating seat being driven by the transmission shaft to rotate, the pressing plate moving assembly drives the first pressing plate to move away from the placement hole, and drives the second pressing plate to move toward the placement hole, until the rotating seat is rotated 180 degrees, the second pressing plate is located on the inner side of the placement hole, and the first pressing plate is located on the outer side of the placement hole; this structure can meet the requirement that during the flipping process of the wafer clamp, there is always the first pressing plate or the second pressing plate under the wafer to support it, and after flipping into place, the top surface of the wafer is not blocked, which is convenient for coating operation and improves the coating quality;

[0040] (4) In the initial state, the second driving member is connected with the second slider in abutment with each other, and a distance is set between the first driving member and the first slider. During the process of the rotating shaft rotating 180 degrees, the second driving member pushes the second slider to move toward the placement hole, and drives the first slider to move away from the placement hole through the connecting rope until it rotates 180 degrees into place. The first slider is in abutment with the first driving member, so that the first pressing plate moves to the outside of the placement hole where the first clamping part is located, and the second pressing plate moves to the inside of the placement hole where the second clamping part is located, thereby realizing the linkage between the first pressing plate and the second pressing plate, ensuring that during the flipping process of the wafer clamp, there is always the first pressing plate or the second pressing plate under the wafer to support it, thereby improving stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 is a three-dimensional diagram of a wafer coating device in an embodiment of the present invention;

[0043] Figure 2 An exploded view of a wafer coating device in an embodiment of the present invention;

[0044] Figure 3 is a schematic structural diagram of a frame and a drive assembly in an embodiment of the present invention;

[0045] Figure 4 Schematic diagram of the structure of the transmission shaft, the limit block and the gear lever in the embodiment of the present invention;

[0046] Figure 5 is a schematic structural diagram of a limit block in an embodiment of the present invention;

[0047] Figure 6 The three-dimensional structure of the gear lever in the embodiment of the present invention is Figure 1 ;

[0048] Figure 7 The three-dimensional structure of the gear lever in the embodiment of the present invention is Figure 2 ;

[0049] Figure 8 Schematic diagram of the structure of the rotating seat and the wafer clamp in the embodiment of the present invention;

[0050] Fig. 9 Schematic diagram of the structure of the rotating seat in the embodiment of the present invention;

[0051] Fig.10 is a schematic structural diagram of a wafer clamp in an embodiment of the present invention;

[0052] Fig.11 is a structural schematic diagram of a tablet pressing and moving assembly in an embodiment of the present invention;

[0053] Fig.12 A three-dimensional diagram of the intermediate disk, the first pressing plate and the second pressing plate in an embodiment of the present invention viewed from the top;

[0054] Fig.13 A three-dimensional diagram of the middle plate, the first pressing plate and the second pressing plate in an embodiment of the present invention viewed from the bottom;

[0055] Fig.14 is a schematic structural diagram of a first connecting rod in an embodiment of the present invention;

[0056] Fig.15 Schematic diagram of the process flow of wafer coating process in an embodiment of the present invention.

[0057] Description of reference numerals: 1-frame, 2-driving assembly, 3-gear lever, 4-rotating seat, 5-wafer clamp;

[0058] 100-wafer;

[0059] 11-limiting block, 111-first limiting groove, 112-second limiting groove, X-first center line, Y-second center line;

[0060] 21-driving device, 22-transmission shaft, 221-mounting hole, 23-bearing, 24-transmission mechanism, 241-driving gear, 242-driven gear;

[0061] 31-first limiting protrusion, 311-first limiting surface, 32-second limiting protrusion, 321-second limiting surface;

[0062] 41-mounting slot, 42-threaded hole;

[0063] 51-middle plate, 511-placement hole, 512-first guide groove, 513-second guide groove, 52-first pressing plate, 521-first pressing part, 522-first connecting plate, 523-first sliding column, 53-second pressing plate, 531-first pressing part, 532-first connecting plate, 533-second sliding column, 54-pressing plate moving assembly, 541-guide rail block, 5411-first guide rail, 5412-second guide rail, 5413 -hanging column, 5414-first stop block, 5415-second stop block, 542-first sliding block, 5421-first interference portion, 543-second sliding block, 5431-second interference portion, 544-connecting rope, 545-first driving member, 546-second driving member, 547-first connecting rod, 5471-first horizontal rod, 5472-first vertical rod, 5473-first connecting portion, 5474-first mounting portion, 548-second connecting rod. DETAILED DESCRIPTION

[0064] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0065] Reference Figure 1-14 As shown, the first embodiment of the present invention provides a wafer coating device, including a frame 1, a driving assembly 2, a gear lever 3, a rotating seat 4 and a wafer clamp 5, wherein:

[0066] The frame 1 is provided with a limit block 11, and the limit block 11 is provided with a first limit groove 111 and a second limit groove 112; the limit block 11 is located on the top surface of the frame 1, and the center line of the limit block 11 and the center line of the shift lever 3 are located in the same vertical plane, and the lengths of the limit block 11 and the shift lever 3 along the diameter direction of the transmission shaft 22 are the same;

[0067] The driving assembly 2 includes a driving device 21 and a transmission shaft 22. The driving device 21 is mounted on the frame 1 and is drivingly connected to the transmission shaft 22. The transmission shaft 22 is provided with a mounting hole 221 in the radial direction. The transmission shaft 22 is rotatably mounted on a bearing 23, and the bearing 23 is fixed on the frame 1, so that the transmission shaft 22 can be rotatably mounted on the frame 1.

[0068] The shift rod 3 is connected to the transmission shaft 22, the shift rod 3 passes through the mounting hole 221 and is fixedly connected to the connecting shaft, the two ends of the shift rod 3 are symmetrical about the axis of the transmission shaft 22, and the two ends of the shift rod 3 are respectively provided with a first limiting protrusion 31 and a second limiting protrusion 32, the first limiting protrusion 31 and the second limiting protrusion 32 are located on the same side of the axis of the transmission shaft 22, and are located on both sides of the diameter direction of the transmission shaft 22, the first limiting protrusion 31 is provided with a first limiting surface 311, the first limiting surface 311 is used to abut against the first limiting groove 111, the second limiting protrusion 32 is provided with a second limiting surface 321, the second limiting surface 321 is used to abut against the second limiting groove 112 after the transmission shaft 22 rotates 180 degrees, the second limiting surface 321 and the first limiting surface 311 are coplanar, and the axis of the transmission shaft 22 is located in the second limiting surface 321;

[0069] The rotating seat 4 is connected to the transmission shaft 22 and the wafer fixture 5 respectively;

[0070] The wafer holder 5 is used to place the wafer 100 .

[0071] It should be noted that the coating equipment should also include parts for performing the coating process. These parts are conventional settings in the prior art and each coating equipment has them, so they will not be described in detail here.

[0072] The chip coating equipment proposed in this embodiment is connected to the transmission shaft 22 through the gear rod 3, the second limit surface 321 and the first limit surface 311 are coplanar, and the axis of the transmission shaft 22 is located in the second limit surface 321. In the initial state, the first limit surface 311 abuts against the first limit groove 111, and after the transmission shaft 22 rotates 180 degrees, the second limit surface 321 abuts against the second limit groove 112; the chip coating equipment uses the principle that a straight line coincides with the original straight line after rotating 180 degrees around any point on it, and limits the position through a mechanical structure, which is convenient to adjust, has high positioning accuracy, high structural rigidity, and improved reliability.

[0073] In some embodiments, the cross-section of the limit block 11 is provided with a first center line X and a second center line Y, the first center line X is parallel to the axial direction of the transmission shaft 22, the second center line Y is perpendicular to the first center line X, the first center line X and the axis of the transmission shaft 22 are located in the same vertical plane, the first limit groove 111 and the second limit groove 112 are respectively formed by extending the first center line X to the edges on both sides, and the first limit groove 111 and the second limit groove 112 are located on both sides of the second center line Y. The first limiting groove 111 and the second limiting groove 112 are respectively extended from the first center line X to the edges on both sides, thereby ensuring that the shift lever 3 accurately rotates 180 degrees during the process of switching from the first limiting surface 311 abutting against the first limiting groove 111 to the second limiting surface 321 abutting against the second limiting groove 112, thereby improving the precision and accuracy of rotation control; the first limiting groove 111 and the second limiting groove 112 are located on both sides of the second center line Y, thereby ensuring that there is a certain separation thickness between the first limiting groove 111 and the second limiting groove 112, thereby improving the strength and improving the reliability and stability of the device.

[0074] In some embodiments, the wafer clamp 5 includes an intermediate plate 51, a first pressing plate 52, a second pressing plate 53 and a pressing plate moving assembly 54. The intermediate plate 51 is connected to the rotating seat 4. A placement hole 511 is provided on the intermediate plate 51. The first pressing plate 52 and the second pressing plate 53 are respectively slidably connected to the two sides of the intermediate plate 51. The pressing plate moving assembly 54 is used to drive the first pressing plate 52 and the second pressing plate 53 to move.

[0075] The rotating seat 4 is provided with a mounting groove 41, and the rotating seat 4 is provided with a threaded hole 42 at a position corresponding to the mounting groove 41. The intermediate plate 51 is placed in the mounting groove 41, and the two sides of the intermediate plate 51 are respectively abutted and fixed by fastening bolts passing through the threaded holes 42. There is a gap between the intermediate plate 51 and the top surface and the bottom surface of the mounting groove 41 to allow the first pressing plate 52 and the second pressing plate 53 to pass through.

[0076] In the initial state, the first pressing sheet 52 is located inside the placement hole 511 and forms a placement area for placing the wafer 100 with the placement hole 511, and the second pressing sheet 53 is located outside the placement hole 511;

[0077] In the process of the transmission shaft 22 driving the rotating seat 4 to rotate, the pressing plate moving assembly 54 is used to drive the first pressing plate 52 to move away from the placement hole 511, and drive the second pressing plate 53 to move toward the placement hole 511, until the rotating seat 4 rotates 180 degrees, the second pressing plate 53 is located on the inner side of the placement hole 511, and the first pressing plate 52 is located on the outer side of the placement hole 511.

[0078] The above structure in this embodiment can satisfy that during the flipping process of the wafer clamp 5, there is always the first pressing plate 52 or the second pressing plate 53 under the wafer 100 to support it, and after flipping into place, the top surface of the wafer 100 is not blocked, which is convenient for coating operation and improves the coating quality.

[0079] In some embodiments, the intermediate plate 51 is provided with a first guide groove 512 and a second guide groove 513 which are parallel to each other. The first guide groove 512 and the second guide groove 513 have the same length and are both waist-shaped holes.

[0080] The first pressing piece 52 includes a first pressing portion 531521 and a first connecting piece 532522. The first pressing portion 531521 is an arc-shaped ring, and the central angle of the arc-shaped ring is greater than 180 degrees. The outer diameter of the wafer 100 is between the inner diameter of the first pressing portion 531521 and the diameter of the placement hole 511. The first connecting piece 532522 is provided with a first slide post 523, and the first slide post 523 is slidably arranged in the first guide groove 512. In the initial state, the first slide post 523 is inserted into the first guide groove 512 from the bottom of the intermediate plate 51. The height of the first slide post 523 is less than or equal to the depth of the first guide groove 512, and does not affect the movement of the second pressing piece 53.

[0081] The second pressing piece 53 includes a second pressing portion and a second connecting piece, the second pressing portion is an arc-shaped ring, the central angle of the arc-shaped ring is greater than 180 degrees, the outer diameter of the wafer 100 is between the inner diameter of the second pressing portion and the diameter of the placement hole 511, the first connecting piece 532522 is provided with a second slide post 533, the second slide post 533 is slidably arranged in the second guide groove 513, in the initial state, the second slide post 533 is inserted into the second guide groove 513 from above the intermediate plate 51, the height of the second slide post 533 is less than or equal to the depth of the second guide groove 513, and does not affect the movement of the first pressing piece 52;

[0082] The pressing piece moving assembly 54 is connected to the first connecting piece 532522 and the second connecting piece respectively.

[0083] The length of the first guide groove 512 can be set as follows: in the initial state, the first slide column 523 is located at the leftmost end of the first guide groove 512, and the second slide column 533 is located at the rightmost end of the second guide groove 513; the pressing plate moving assembly 54 drives the first pressing plate 52 to move away from the placement hole 511, and drives the second pressing plate 53 to move toward the placement hole 511, until the rotating seat 4 rotates 180 degrees, the second pressing plate 53 is located inside the placement hole 511, and the first pressing plate 52 is located outside the placement hole 511, at this time, the first slide column 523 is located at the rightmost end of the first guide groove 512, and the second slide column 533 is located at the leftmost end of the second guide groove 513. Through the above settings, the first guide groove 512 can limit the sliding of the first slide column 523, and the second guide groove 513 can limit the sliding of the second slide column 533, thereby improving the reliability and stability of the device.

[0084] In some embodiments, the tablet moving assembly 54 includes a guide rail block 541, a first slider 542, a second slider 543, a connecting rope 544, a first driving member 545 and a second driving member 546, and the first driving member 545 and the second driving member 546 are both cylinders;

[0085] The guide rail block 541 is installed on the rotating seat 4. The bottom surface and the top surface of the guide rail block 541 are respectively provided with a first guide rail 5411 and a second guide rail 5412. The side surface of the guide rail block 541 is provided with a hanging column 5413 at one end away from the placement hole 511.

[0086] The first sliding block 542 is slidably mounted on the first guide rail 5411 and connected to the first connecting piece 532522;

[0087] The second sliding block 543 is slidably mounted on the second guide rail 5412 and connected to the second connecting piece;

[0088] The connecting rope 544 is wound around the hanging column 5413, and two ends thereof are respectively connected to the first sliding block 542 and the second sliding block 543;

[0089] The first driving member 545 is installed on the rotating seat 4, and is used to push the first sliding block 542 to move toward the placement hole 511, and drive the second sliding block 543 to move away from the placement hole 511 through the connecting rope 544;

[0090] The second driving member 546 is installed on the rotating seat 4, and is used to push the second slider 543 to move toward the placement hole 511, and drive the first slider 542 to move away from the placement hole 511 through the connecting rope 544;

[0091] In the initial state, the second driving member 546 is in contact with the second slider 543, and a gap is set between the first driving member 545 and the first slider 542;

[0092] During the process of the rotating shaft rotating 180 degrees in the positive direction, the second driving member 546 pushes the second slider 543 to move toward the placement hole 511, and drives the first slider 542 to move away from the placement hole 511 through the connecting rope 544, until the rotation of 180 degrees is in place, the first slider 542 contacts the first driving member 545, so that the first pressing sheet 52 moves to the outside of the placement hole 511 where the first pressing portion 531521 is located, and the second pressing sheet 53 moves to the inside of the placement hole 511 where the second pressing portion is located;

[0093] During the process of the rotating shaft rotating 180 degrees in the opposite direction (i.e. resetting), the second driving member 546 retracts and resets. At this time, the first slider 542 only contacts the second driving member 546 and will not retract with the second driving member 546. The first driving member 545 pushes the first slider 542 to move toward the placement hole 511, and drives the second slider 543 to move away from the placement hole 511 through the connecting rope 544 until it rotates 180 degrees and returns to the initial state. The second driving member 546 contacts and connects with the second slider 543.

[0094] The above structure proposed in this embodiment realizes the linkage between the first pressing plate 52 and the second pressing plate 53 through the connecting rope 544, ensuring that during the flipping process of the wafer clamp 5, there is always the first pressing plate 52 or the second pressing plate 53 under the wafer 100 to support it, thereby improving stability.

[0095] In some embodiments, the bottom surface and top surface of the guide rail block 541 are respectively provided with a first stopper 5414 and a second stopper 5415 at one end close to the placement hole 511. The first stopper 5414 is provided at one end close to the placement hole 511 by the bottom surface of the guide rail block 541, and the first stopper 5414 limits the sliding of the first slider 542. When the first stopper 5414 contacts the first slider 542, the first slide column 523 moves to the leftmost end; the top surface of the guide rail block 541 is provided with a second stopper 5415 at one end close to the placement hole 511, and the second stopper 5415 limits the sliding of the second slider 543. When the second stopper 5415 contacts the second slider 543, the second slide column 533 moves to the leftmost end. The reliability and stability of the device can be improved by limiting the first stopper 5414 and the second stopper 5415.

[0096] In some embodiments, the first slider 542 is provided with a first abutting portion 5421 for abutting against the first driving member 545, and the second slider 543 is provided with a second abutting portion 5431 for abutting against the second driving member 546. The first abutting portion 5421 is a block protruding from the first slider 542 in a direction away from the first guide rail 5411, and by protruding upward for a certain distance, the longitudinal distance between the first slider 542 and the first driving member 545 can be filled, and while avoiding installation interference, the contact area between the first driving member 545 and the first abutting portion 5421 can be larger and the force application direction is parallel to the first guide rail 5411, so that the sliding of the first slider 542 can be smoother; the second abutting portion 5431 is a block protruding from the second slider 543 in a direction away from the second guide rail 5412, and its function and effect are the same as those of the first abutting portion 5421.

[0097] In some embodiments, the pressing piece moving assembly 54 further includes a first connecting rod 547 and a second connecting rod 548; one end of the first connecting rod 547 is connected to the first abutting portion 5421, and the other end is connected to the first connecting piece 532522; one end of the second connecting rod 548 is connected to the second abutting portion 5431, and the other end is connected to the second connecting piece. The first connecting rod 547 includes a first cross bar 5471 and a first vertical bar 5472, the first cross bar 5471 is provided with a first connecting portion 5473, the first connecting portion 5473 is a direction hole, and the first connecting portion 5473 is sleeved on the first abutting portion 5421 for connection, the side end of the first vertical bar 5472 is provided with a first mounting portion 5474, the first mounting portion 5474 is a slot, and the first mounting portion 5474 is clamped on the first connecting piece 532522; the second connecting rod 548 has the same structure as the first connecting rod 547, and the two are universal, and can be replaced with each other during maintenance to reduce costs.

[0098] In some embodiments, the driving assembly 2 further includes a transmission mechanism 24, and the transmission mechanism 24 includes a driving gear 241 and a driven gear 242. The driving gear 241 is connected to the driving device 21, and the driven gear 242 is mounted on the transmission shaft 22 and meshes with the driving gear 241. The driving gear 241 is driven to rotate by the driving device 21, and the driving gear 241 drives the meshed driven gear 242 to rotate, thereby driving the driven shaft to rotate. The driving device 21 uses a motor, and the driven shaft can be rotated 180 degrees forward and 180 degrees reverse through the forward and reverse rotation of the motor. Through the buffering and transfer of the transmission mechanism 24, the impact force on the gear lever 3 caused by the sudden stop of the motor when the driven shaft is directly driven can be avoided, thereby improving the service life of the device.

[0099] Of course, the transmission mechanism 24 can also be other transmission structures such as gear rack transmission, worm gear transmission, chain transmission, etc.

[0100] Based on the same concept, the second embodiment of the present invention is combined with Fig.15 As shown, a wafer coating process is provided, using the wafer coating device described in the first aspect of the embodiment, comprising:

[0101] Step S1: placing the wafer 100 on the wafer holder 5;

[0102] Step S2: The driving device 21 drives the transmission shaft 22 to rotate 180 degrees in the forward direction, driving the rotating seat 4 and the wafer clamp 5 to rotate 180 degrees in the forward direction, and the second limiting protrusion 32 abuts against the second limiting groove 112;

[0103] Step S3: The driving device 21 drives the transmission shaft 22 to reverse 180 degrees for resetting, driving the rotating seat 4 and the wafer clamp 5 to rotate 180 degrees in the opposite direction, and the first limiting protrusion 31 abuts against the first limiting groove 111 .

[0104] In step S2 and step S3, the process also includes: inspecting the surface of the wafer 100.

[0105] Between step S2 and step S3, the process further includes: performing a coating operation on the surface of the wafer 100 .

[0106] In some embodiments, for a wafer 100 that needs to be double-sided coated, after step S3 , a coating operation is further performed on the other side of the wafer 100 .

[0107] The wafer coating process proposed in this embodiment uses the principle that a straight line coincides with the original straight line after rotating 180 degrees around any point on it, and limits the position through a mechanical structure, which is convenient to adjust, has high positioning accuracy, high structural rigidity, and improves reliability.

[0108] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer coating device, characterized in that: It includes a frame, a driving assembly, a gear lever, a rotating seat and a wafer clamp, wherein: A limit block is arranged on the frame, and a first limit slot and a second limit slot are arranged on the limit block; The driving assembly includes a driving device and a transmission shaft, wherein the driving device is mounted on the frame and is drivingly connected to the transmission shaft; The shift lever is connected to the transmission shaft, and the two ends of the shift lever are symmetrical about the axis of the transmission shaft. The two ends of the shift lever are respectively provided with a first limiting protrusion and a second limiting protrusion, the first limiting protrusion is provided with a first limiting surface, the first limiting surface is used to abut against the first limiting groove, the second limiting protrusion is provided with a second limiting surface, the second limiting surface is used to abut against the second limiting groove after the transmission shaft rotates 180 degrees, the second limiting surface is coplanar with the first limiting surface, and the axis of the transmission shaft is located in the second limiting surface; The rotating seat is connected to the transmission shaft and the wafer fixture respectively; The wafer holder is used for placing a wafer.

2. The wafer coating device according to claim 1, characterized in that: The cross-section of the limit block is provided with a first center line and a second center line, the first center line is parallel to the axial direction of the transmission shaft, the first center line and the axis of the transmission shaft are located in the same vertical plane, the first limit groove and the second limit groove are respectively formed by extending the first center line to the edges on both sides, and the first limit groove and the second limit groove are located on both sides of the second center line.

3. The wafer coating device according to claim 1, characterized in that: The wafer clamp comprises an intermediate plate, a first pressing plate, a second pressing plate and a pressing plate moving assembly, wherein the intermediate plate is connected to the rotating seat, a placement hole is provided on the intermediate plate, and the first pressing plate and the second pressing plate are respectively slidably connected to two sides of the intermediate plate; the pressing plate moving assembly is used to drive the first pressing plate and the second pressing plate to move; In an initial state, the first pressing sheet is located inside the placement hole and forms a placement area for placing a wafer with the placement hole, and the second pressing sheet is located outside the placement hole; During the process of the transmission shaft driving the rotating seat to rotate, the pressing plate moving assembly is used to drive the first pressing plate to move away from the placement hole, and drive the second pressing plate to move toward the placement hole, until the rotating seat rotates 180 degrees, the second pressing plate is located on the inner side of the placement hole, and the first pressing plate is located on the outer side of the placement hole.

4. The wafer coating device according to claim 3, characterized in that: The intermediate plate is provided with a first guide groove and a second guide groove which are parallel to each other; The first pressing sheet includes a first pressing portion and a first connecting sheet, the first pressing portion is an arc-shaped ring, the outer diameter of the wafer is between the inner diameter of the first pressing portion and the diameter of the placement hole, and the first connecting sheet is provided with a first sliding column, which is slidably arranged in the first guide groove; The second pressing sheet includes a second pressing portion and a second connecting sheet, the second pressing portion is an arc-shaped ring, the outer diameter of the wafer is between the inner diameter of the second pressing portion and the diameter of the placement hole, the first connecting sheet is provided with a second sliding column, and the second sliding column is slidably arranged in the second guide groove; The pressing piece moving assembly is connected to the first connecting piece and the second connecting piece respectively.

5. The wafer coating equipment according to claim 4, characterized in that: The tablet moving assembly comprises a guide rail block, a first slider, a second slider, a connecting rope, a first driving member and a second driving member; The guide rail block is installed on the rotating seat, the bottom surface and the top surface of the guide rail block are respectively provided with a first guide rail and a second guide rail, and the side surface of the guide rail block is provided with a hanging column at one end away from the placement hole; The first sliding block is slidably mounted on the first guide rail and connected to the first connecting piece; The second sliding block is slidably mounted on the second guide rail and connected to the second connecting piece; The connecting rope is wound around the hanging column, and two ends thereof are respectively connected to the first sliding block and the second sliding block; The first driving member is installed on the rotating seat, and is used to push the first sliding block to move toward the placement hole, and drive the second sliding block to move away from the placement hole through the connecting rope; The second driving member is installed on the rotating seat, and is used to push the second sliding block to move toward the placement hole, and drive the first sliding block to move away from the placement hole through the connecting rope; In an initial state, the second driving member is in abutting connection with the second sliding block, and a distance is set between the first driving member and the first sliding block.

6. The wafer coating device according to claim 5, characterized in that: The bottom surface and the top surface of the guide rail block are respectively provided with a first stopper and a second stopper at one end close to the placement hole.

7. The wafer coating equipment according to claim 5, characterized in that: The first sliding block is provided with a first contact portion for contacting with the first driving member, and the second sliding block is provided with a second contact portion for contacting with the second driving member.

8. The wafer coating device according to claim 7, characterized in that: The tablet moving assembly also includes a first connecting rod and a second connecting rod; one end of the first connecting rod is connected to the first interference portion, and the other end is connected to the first connecting piece; one end of the second connecting rod is connected to the second interference portion, and the other end is connected to the second connecting piece.

9. The wafer coating device according to any one of claims 1 to 8, characterized in that: The driving assembly further comprises a transmission mechanism, which comprises a driving gear and a driven gear, wherein the driving gear is connected to the driving device, and the driven gear is mounted on the transmission shaft and meshes with the driving gear.

10. A wafer coating process, using the wafer coating device according to any one of claims 1 to 9, characterized in that: include: placing a wafer on a wafer holder; The driving device drives the transmission shaft to rotate 180 degrees in the forward direction, driving the rotating seat and the wafer clamp to rotate 180 degrees in the forward direction, and the second limiting protrusion abuts against the second limiting groove; The driving device drives the transmission shaft to reverse 180 degrees for resetting, driving the rotating seat and the wafer clamp to rotate 180 degrees in the opposite direction, and the first limiting protrusion abuts against the first limiting groove.

Images