A high-throughput test method for bond strength

Abstract

This invention belongs to the technical field of adhesive strength testing methods, specifically relating to a high-throughput adhesive strength testing method, comprising the following steps: 3D printing is used to prepare a test component, which includes two rectangular strips with multiple test specimens placed between them. Each test specimen includes two test structures, each including a first substrate, a second substrate, and a force measurement module. The first substrate has an adhesive surface, and the two adhesive surfaces are connected by an adhesive to form a joint; a force is applied to the rectangular strips until adhesive failure occurs; a video recording module records the changes in the test component throughout the process, obtaining images of the initial test and the point of adhesive failure; an image processing module processes the images to obtain the strain of the force measurement module; and a force-displacement curve is used to obtain the corresponding maximum load. This invention combines 3D printing technology and a high-throughput testing platform to provide an efficient, accurate, and systematic method for adhesive performance evaluation.

Description

Technical Field

[0001] This invention belongs to the technical field of adhesive strength testing methods, specifically relating to a high-throughput adhesive strength testing method. Background Technology

[0002] Adhesives are widely used in various industrial fields, such as automotive manufacturing, aerospace, construction engineering, and electronic assembly. The performance of adhesives directly affects the quality and safety of the final product. To ensure that the performance of adhesives meets the requirements of specific applications, rigorous performance testing is essential. These tests not only need to evaluate the basic physical and chemical properties of the adhesive, such as viscosity, curing time, and chemical stability, but also its mechanical properties under actual application conditions, such as tensile strength, shear strength, and fatigue resistance. As industrial requirements for adhesive performance continue to increase, the systematic and comprehensive evaluation and optimization of adhesive performance has become crucial.

[0003] Traditional adhesive performance testing often requires significant manual labor and time to prepare and test individual samples. This greatly limits test throughput and prolongs product development cycles. Due to inherent uncertainties in manually prepared samples, such as slight differences in adhesive coating thickness and curing conditions, test results are often difficult to reproduce, affecting data reliability and consistency. Most existing testing equipment can only evaluate single mechanical loading conditions (such as pure tension or pure shear) and cannot simulate complex multiaxial loading conditions that may be encountered in real-world applications. These factors limit the efficiency and accuracy of adhesive performance testing, slowing down the R&D and quality control processes for adhesives and related products. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a high-throughput testing method for adhesive strength, combining 3D printing technology and a high-throughput testing platform. This solution aims to overcome the limitations of existing technologies and provide a novel, efficient, accurate, and systematic method for evaluating adhesive performance, thereby accelerating the research and development and quality control process of adhesives and related products.

[0005] The present invention is achieved through the following technical solution.

[0006] A high-throughput test method for adhesive strength includes the following steps:

[0007] A test component is prepared using 3D printing technology. The test component includes two rectangular strips, and multiple test specimens are arranged in parallel between the two rectangular strips. Each test specimen includes two test structures. Each test structure includes a first substrate, a second substrate, and a force measurement module. The force measurement module is fixed between the first substrate and the second substrate. The first substrate has an adhesive surface, and the two adhesive surfaces are connected by an adhesive to form a joint.

[0008] The test component is placed in the test environment, and a force is applied to the rectangular strip to stretch the force measurement module and generate strain until the joint fails to bond. During the test, a video recording module records the changes of the test component throughout the process and obtains images of the initial test and the point of bonding failure.

[0009] The image processing module is used to process the initial test image and the image at the point of adhesive failure, respectively, to obtain the length of each force measurement module at the initial test and at the point of adhesive failure, and to calculate the strain of the force measurement module when the joint reaches the maximum load.

[0010] By substituting the strain into the force-displacement curve of the force measurement module, the corresponding maximum load is obtained, and then the bonding strength of the joint is obtained.

[0011] Preferably, the adhesive is a material used for 3D printing or a material not used for 3D printing.

[0012] When the adhesive is a material used for 3D printing, the test component is prepared as a whole by 3D printing in one step.

[0013] When the adhesive is a non-3D printing material, a first assembly and a second assembly are prepared using 3D printing technology. The first assembly and the second assembly each include one rectangular strip and multiple test structures. In the first assembly, the first substrate of each test structure has a first adhesive surface. In the second assembly, the first substrate of each test structure has a second adhesive surface. The first assembly and the second assembly are assembled using an assembly plate, and the first adhesive surface and the second adhesive surface are connected with an adhesive to form a joint.

[0014] Preferably, the assembly plate includes a base plate, and a plurality of first positioning strips are arranged parallel to each other along the length direction on the surface of the base plate, and the two adjacent first positioning strips are used to limit the position of a test structure in the first assembly.

[0015] The base plate surface is also provided with a plurality of second positioning strips arranged in parallel along the length direction. The second positioning strips correspond one-to-one with the first positioning strips, and the two adjacent second positioning strips are used to limit the position of one of the test structures in the second assembly.

[0016] A plurality of positioning protrusions arranged along the length of the base plate are disposed between the first positioning strip and the second positioning strip. The plurality of positioning protrusions are arranged closer to the first positioning strip, and the space between two adjacent positioning protrusions is used to limit a first adhesive surface. A limiting strip is also disposed between the first positioning strip and the second positioning strip. The limiting strip is disposed closer to the second positioning strip and is used to adjust the adhesive thickness between the second adhesive surface and the first adhesive surface.

[0017] The base plate has a first limiting groove on one side of the first positioning strip at both ends, and the two first limiting grooves are used to limit the rectangular strip in the first assembly. The base plate has a second limiting groove on one side of the second positioning strip at both ends, and the two second limiting grooves are used to limit the rectangular strip in the second assembly.

[0018] Preferably, the assembly method of the first assembly and the second assembly includes the following steps:

[0019] After the first adhesive surface is dipped in adhesive, the test structures in the first assembly are respectively inserted between the first positioning strips. When the rectangular strip in the first assembly is limited by the two first limiting grooves, the first adhesive surface is inserted between the adjacent positioning protrusions.

[0020] After the second bonding surface is dipped in adhesive, the test structures in the second assembly are respectively inserted between the second positioning strips. When the rectangular strip in the second assembly is limited by the two second limiting grooves, the bottom surface of the second bonding surface is placed on the limiting strip and contacts the first bonding surface for bonding.

[0021] Preferably, the test background is black, and the first and second substrates are white. The processing method of the image processing module includes the following steps:

[0022] The video was captured frame by frame using screenshot software. Taking a 4K photo as an example, each image was processed into a 3840×2160 matrix using MATLAB. Each element in the matrix represents the gray level of a pixel. Then, the elements of the matrix were binarized: 255 represents a gray level pixel that is close to white, and 0 represents a gray level pixel that is close to black.

[0023] Based on a white first substrate and a white second substrate, all pixels with a grayscale value lower than 200 are set to 0. The first substrate image is extracted, and the left and right boundaries of each test sample are located. The method for locating the left and right boundaries of each test sample is as follows: the grayscale image is summed column by column to obtain the total grayscale pixel value of each column. In two adjacent columns, from left to right, when the total grayscale pixel value increases from small to large, it is the left boundary of a sample, and when the total grayscale pixel value decreases from large to small, it is the right boundary of a sample.

[0024] The white second base image is extracted, and the upper and lower boundaries of each test sample are located. The method for obtaining the upper and lower boundaries of each test sample is as follows: the grayscale image is summed row by row to obtain the total grayscale pixel value of each row. In two adjacent rows, from top to bottom, when the total grayscale pixel value increases from small to large, it is the upper boundary of a sample, and when the total grayscale pixel value decreases from large to small, it is the lower boundary of a sample.

[0025] By obtaining the left and right boundaries and top and bottom boundaries of each test specimen, the positional information of each test specimen is determined. Based on the positional information of each test specimen, the image of each test specimen is extracted and placed in a matrix. This allows the upper and lower boundaries of the force measurement module in each test specimen to be obtained, and the length of the force measurement module in each test specimen can be calculated. For example, taking the first specimen as an example, its image is extracted based on its positional information and placed in a small matrix. By analyzing this small matrix, the upper and lower boundaries of the force measurement module can be found, and the length of the force measurement module can be calculated in real time. By performing this process on multiple images, the changes in the force measurement module of multiple specimens throughout the entire experiment can be obtained.

[0026] Preferably, the first and second substrates are prepared by 3D printing from the rigid resin material VeroPureWhite, and the force measurement module is made of 3D-printed linear elastic material.

[0027] Preferably, the test method is used to optimize adhesive preparation parameters, in which case the adhesives in the multiple test samples are prepared with different parameters; or:

[0028] The test method described herein is used to investigate the effects of adhesive layer thickness and different stress modes on the adhesive failure strength and failure mode. Multiple test specimens are grouped so that the adhesive thickness varies between groups, while the adhesive within the same group has the same thickness but different bonding angles at the joints. For example, if there are 180 test specimens, they are divided into 12 groups according to thickness (0.1 mm to 1.6 mm), with 15 test specimens in each group, and the bonding angles of the 15 test specimens in each group are set from 0° to 90°.

[0029] It should be noted that during the test, the temperature of the test environment was controlled at -20℃ to 60℃; the humidity was controlled at 0 to 100%.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] Compared with existing adhesive strength testing technologies, this invention uses 3D printing technology to prepare test samples, enabling the simultaneous testing of a large number of samples in one test, ensuring the consistency and repeatability of the testing process. Furthermore, by utilizing automated data acquisition and analysis methods, it improves both testing efficiency and accuracy.

[0032] Because it can test a large number of samples simultaneously, samples with different test conditions can be prepared according to test needs. For example, by changing the joint angle, the adhesive can be subjected to different stress modes, simulating multiaxial load conditions that may be encountered in complex real-world applications, changing the adhesive thickness to test the effect of thickness, and screening adhesive preparation process parameters. This can not only greatly improve the efficiency and reliability of adhesive performance testing, but also accelerate the research and development and quality control process of adhesives and related products. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the test component structure.

[0034] Figure 2 This is a schematic diagram of the test specimen structure.

[0035] Figure 3 This is a photo showing the initial state of the high-throughput test.

[0036] Figure 4 State photographs taken for high-throughput bonding testing.

[0037] Figure 5 This is a schematic diagram of the high-throughput adhesive strength characterization process, where (a) shows the state of the sample before and during the experiment, and (b) shows the force-displacement curve of the force measurement module.

[0038] Figure 6 This is a schematic diagram of the assembly panel structure.

[0039] Figure 7 A schematic diagram illustrating the assembly of the first assembly component.

[0040] Figure 8 A schematic diagram illustrating the assembly of the second assembly component.

[0041] Figure 9 The following diagram illustrates the adjustment of the tensile-shear coupling stress ratio of the adhesive layer in Example 1. (a) shows the thickness distribution of 12 different adhesives; (b) shows the arrangement of different joint angles at point C in (a) with a thickness of 0.4 mm; (c) is a schematic diagram of the lap shear test at θ = 0°; (d) is a schematic diagram of the pull-out test at θ = 90°; (e) is a schematic diagram at θ = 45°; and (f) is a schematic diagram of tensile-shear stress decomposition. In the above diagrams, h represents the adhesive thickness, and F represents the load.

[0042] Figure 10The results are from a single high-throughput experiment in Example 1. Detailed Implementation

[0043] To enable those skilled in the art to better understand and implement the technical solutions of the present invention, the present invention will be further described below in conjunction with specific embodiments and accompanying drawings. However, the embodiments described are not intended to limit the present invention.

[0044] This invention designs a corresponding high-throughput bonding test specimen based on the lap shear bonding test method. To facilitate the mass production of high-throughput test specimens, this invention combines 3D printing technology, using the printable rigid resin material VeroPureWhite as the specimen body and the substrate. A single row of high-throughput bonding specimens can contain 30 to 60 independent bonding test joints, where the geometric features of each independent joint (such as adhesive layer thickness, joint deflection angle, etc.) can be independently designed during the modeling process; all independent joints in a single row are connected in parallel during the printing process, which facilitates the simultaneous loading of these joints in subsequent steps.

[0045] For each individual joint, the bond failure strength is determined using a shear test principle. Both ends of the joint are connected to the clamped end via a force measurement module made of 3D-printed linear elastic material. During loading, the maximum strain of the force measurement module is recorded, and the force-displacement curve of the material is compared to determine the maximum failure load borne by the entire bonded joint during loading, thus calculating the bond failure strength of the joint.

[0046] Based on the above design concept, this invention provides a high-throughput testing method for adhesive strength, specifically including the following steps:

[0047] Step 1: Prepare test component 4 using 3D printing technology. Its structure is as follows: Figure 1 and Figure 2 As shown, the test component 4 includes two rectangular bars 1, and multiple test specimens 2 are arranged in parallel between the two rectangular bars 1. Each test specimen 2 includes two test structures. Each test structure includes a first substrate 3-1, a second substrate 3-2, and a force measurement module 3-3. The force measurement module 3-3 is fixed between the first substrate 3-1 and the second substrate 3-2. The first substrate 3-1 has an adhesive surface, and the two adhesive surfaces are connected by an adhesive 3-4 to form a joint.

[0048] Step 2: Place the test component 4 on a high-throughput bonding test stage for testing. Clamp the high-throughput sample to be tested on a high-precision displacement stage, and apply overall loading to the sample by uniformly moving the displacement stage, wherein the loading speed is adjustable. Apply a force to the rectangular strip 1, causing the force measurement module 3-3 to tensile and generate strain until the joint bonding fails. During the test, a video recording module records the changes of the test component throughout the process, and obtains images of the initial test and the bonding failure.

[0049] It should be noted that the aforementioned adhesive failure refers to the phenomenon where the adhesive interface or adhesive loses its original adhesive properties under the action of external forces (such as tensile, shear, or peel forces). Adhesive failure is not only related to the properties of the adhesive materials, but also affected by various factors such as the bonding process, the treatment of the adhesive interface, and the usage environment (such as temperature and humidity). Adhesive failure can be divided into several different types, mainly including: Adhesive interface failure: Failure occurs between the adhesive and the surface of the bonded materials, and insufficient adhesion between the adhesive and the material surface leads to separation. Adhesive cohesive failure: Failure occurs inside the adhesive, manifested as the destruction of the adhesive itself, rather than separation from the interface with the bonded materials. Mixed failure: This type of failure combines both of the above failure modes and is the most common type.

[0050] Taking the simultaneous testing of 30 test samples as an example, the initial state photograph of the test is as follows: Figure 3 As shown, the status photos during the test are as follows: Figure 4 As shown. Figure 3 and Figure 4 In the diagram, the arrow points in the direction of the load.

[0051] Step 3: The image processing module is used to process the initial test image and the image at the point of adhesive failure, respectively, to obtain the length of each force measurement module 3-3 at the initial test and at the point of adhesive failure, and to calculate the strain of the force measurement module 3-3 when the joint reaches its maximum load. Some images are shown below. Figure 5 As shown in (a), the length of the force measurement module 3-3 before the experiment is L, and the length when the adhesion fails during the experiment is λL. The strain ΔL is calculated.

[0052] Step 4: Substitute the strain into the force-displacement curve of the force measurement module 3-3, to... Figure 5 Taking the curve shown in (b) as an example, the corresponding maximum load is obtained, and then the bonding strength of the joint is obtained.

[0053] The method provided by this invention has the following advantages:

[0054] 1. Large-scale sample testing capability: Through 3D printing technology and automated equipment, this invention can prepare dozens to hundreds of test samples in a short time and test these samples simultaneously in one experiment, which greatly improves experimental efficiency.

[0055] 2. Diverse stress modes: Unlike existing technologies that can only test a single stress mode of bonded specimens, this invention can simultaneously test the bonding performance under tensile, shear, and coupled stress modes, providing important experimental evidence for comprehensively evaluating the performance of adhesives under different working conditions.

[0056] 3. High precision and high consistency: Through automated control and precise 3D printing technology, this invention achieves precise control over the thickness of the adhesive layer, the stress mode, and the curing conditions, ensuring the consistency of sample preparation and the high repeatability of experimental results, and solving the problem of large errors in traditional manual operation.

[0057] 4. Efficient data acquisition and analysis: This invention integrates advanced image processing technology, which can automatically acquire data on the failure intensity and failure mode of each sample, and perform rapid processing and analysis, significantly improving the efficiency and accuracy of data acquisition.

[0058] In summary, this invention not only solves the problems of low efficiency, inconsistent sample preparation, and difficulty in data acquisition in the prior art, but also expands the dimensions of adhesive performance testing, providing a more comprehensive and systematic solution for the design and optimization of adhesives.

[0059] It should be further explained that the adhesive 3-4 is a material for 3D printing or a material not used for 3D printing; when the adhesive 3-4 is a material for 3D printing, the test component 4 is prepared as a whole by one 3D printing; when the adhesive 3-4 is a material not used for 3D printing, the first assembly 4-1 and the second assembly 4-2 are prepared by 3D printing technology, and the first assembly 4-1 and the second assembly 4-2 respectively include one rectangular strip 1 and multiple test structures; in the first assembly 4-1, the first base 3-1 of each test structure has a first adhesive surface A; in the second assembly 4-2, the first base 3-1 of each test structure has a second adhesive surface B; the first assembly 4-1 and the second assembly 4-2 are assembled by an assembly plate, and the first adhesive surface A and the second adhesive surface B are connected by the adhesive 3-4 to form a joint. The first substrate 3-1 and the second substrate 3-2 are prepared by 3D printing of the rigid resin material VeroPureWhite, and the force measurement module 3-3 is made of 3D printed linear elastic material.

[0060] To facilitate assembly, in a preferred embodiment of the present invention, the assembly plate is structurally designed as follows, specifically as follows: Figures 6-8As shown, the assembly plate includes a base plate 5, and a plurality of first positioning strips 5-1 are arranged parallel to each other along the length direction on the surface of the base plate 5. The first positioning strips 5-1 adjacent to each other are used to limit the position of a test structure in the first assembly 4-1.

[0061] The base plate 5 also has a plurality of second positioning strips 5-2 arranged in parallel along the length direction. The second positioning strips 5-2 correspond one-to-one with the first positioning strips 5-1. The two adjacent second positioning strips 5-2 are used to limit the position of one of the test structures in the second assembly 4-2.

[0062] A plurality of positioning protrusions 5-3 arranged along the length of the base plate are disposed between the first positioning strip 5-1 and the second positioning strip 5-2. The plurality of positioning protrusions 5-3 are arranged closer to the first positioning strip 5-1, and the space between two adjacent positioning protrusions 5-3 is used to limit a first bonding surface A. A limiting strip 5-6 is also disposed between the first positioning strip 5-1 and the second positioning strip 5-2. The limiting strip 5-6 is disposed closer to the second positioning strip 5-2 and is used to adjust the bonding thickness between the second bonding surface B and the first bonding surface A.

[0063] The bottom plate 5 has a first limiting groove 5-4 on one side of the first positioning strip 5-1 at both ends, and the two first limiting grooves 5-4 are used to limit the rectangular strip 1 in the first assembly 4-1; the bottom plate 5 has a second limiting groove 5-5 on one side of the second positioning strip 5-2 at both ends, and the two second limiting grooves 5-5 are used to limit the rectangular strip 1 in the second assembly 4-2.

[0064] In specific operation, the assembly method of the first assembly 4-1 and the second assembly 4-2 includes the following steps:

[0065] After the first adhesive surface A is dipped in adhesive 3-4, the test structure in the first assembly 4-1 is respectively inserted between the first positioning strips 5-1. When the rectangular strip 1 in the first assembly 4-1 is limited by the two first limiting grooves 5-4, the first adhesive surface A is inserted between the adjacent positioning protrusions 5-3.

[0066] After the second bonding surface B is dipped in adhesive 3-4, the test structure in the second assembly 4-2 is inserted between the second positioning strips 5-2. When the rectangular strip 1 in the second assembly 4-2 is limited by the two second limiting grooves 5-5, the bottom surface of the second bonding surface B is placed on the limiting strip 5-6 and contacts the first bonding surface A for bonding.

[0067] In a preferred embodiment of the present invention, for ease of image processing, the test background is set to black, and the first substrate 3-1 and the second substrate 3-2 are white. The processing method of the image processing module includes the following steps:

[0068] (1) Use screenshot software to capture the video frame by frame. Taking a 4K photo as an example, use MATLAB to process each image into a 3840×2160 matrix. Each element in the matrix represents the gray level of a pixel. Then binarize the elements of the matrix: 255 represents a gray level pixel that is close to white, and 0 represents a gray level pixel that is close to black.

[0069] (2) Based on the white first base 3-1 and the white second base 3-2, set all pixels with gray values ​​below 200 to 0.

[0070] (3) Extract the image of the first substrate 3-1 and locate the left and right boundaries of each test sample 2. The method for locating the left and right boundaries of each test sample 2 is as follows: sum the columns of the grayscale image to obtain the total grayscale pixel value of each column. In two adjacent columns, from left to right, when the total grayscale pixel value increases from small to large, it is the left boundary of a sample 2. When the total grayscale pixel value decreases from large to small, it is the right boundary of a sample 2.

[0071] (4) Extract the white second substrate 3-2 image and locate the upper and lower boundaries of each test sample 2. The method to obtain the upper and lower boundaries of each test sample 2 is as follows: sum the rows of the grayscale image to obtain the total grayscale pixel value of each row. In two adjacent rows, from top to bottom, when the total grayscale pixel value increases from small to large, it is the upper boundary of a sample 2. When the total grayscale pixel value decreases from large to small, it is the lower boundary of a sample 2.

[0072] (5) By obtaining the left and right boundaries and the upper and lower boundaries of each test specimen 2, determine the position information of each test specimen 2, extract the image of the test specimen 2 according to the position information of each test specimen 2, place it in a matrix, obtain the upper and lower boundaries of the force measurement module 3-3 in each test specimen 2, and calculate the length of the force measurement module 3-3 in each test specimen 2.

[0073] The testing method provided by this invention is used to optimize adhesive preparation parameters, in which the adhesives in multiple test samples are prepared with different parameters. The testing method of this invention can also be used to investigate the influence of adhesive layer thickness and different stress modes on the adhesive failure strength and failure mode. In this case, multiple test samples 2 are grouped so that the adhesives in each group have different thicknesses, while the adhesives in the same group have the same thickness, but the joints have different bonding angles. During the test, the temperature of the test environment is controlled at -20℃ to 60℃; the humidity environment is controlled at 0% to 100%.

[0074] The invention will now be described in detail through the following embodiments.

[0075] Example 1

[0076] The adhesive used in this embodiment is a 3D printing adhesive, TangoblackPlus.

[0077] This embodiment studies the effect of adhesive layer thickness and stress mode on adhesive performance by measuring 180 joint samples in a single measurement. We divided the adhesive layer thickness into 12 groups within the range of 0.1 mm to 1.6 mm, and each group was further divided into 15 different tensile-shear coupled stress modes. Specifically, we adjusted the tensile-shear coupled stress ratio of the adhesive layer by changing the joint angle θ0°–90°. Figure 9 As shown, (a) shows the thickness distribution of 12 adhesives, (b) shows the arrangement of different joint angles at point C in (a) with a thickness of 0.4 mm, (c) is a schematic diagram of the lap shear test at θ = 0°, (d) is a schematic diagram of the pull-out test at θ = 90°, (e) is a schematic diagram of the test at θ = 45°, and (f) is a schematic diagram of tensile and shear stress decomposition. In the above figures, h is the adhesive thickness and F is the load.

[0078] Experimental results are as follows Figure 10 As shown, the bonding strength of the same adhesive increases as the thickness of the adhesive layer decreases, and the increase increases as the proportion of normal stress increases.

[0079] As can be seen, the method of this invention can test hundreds of test samples in a short time, and can test these samples simultaneously in one experiment. It can test the bonding performance under multiple stress modes at the same time. Through automated control and precise 3D printing technology, it achieves precise control over the thickness of the adhesive layer, stress mode and curing conditions, ensuring the consistency of sample preparation and high repeatability of experimental results. It integrates advanced image processing technology, which can automatically collect data on the failure strength and failure mode of each sample, and perform rapid processing and analysis, significantly improving the efficiency and accuracy of data acquisition.

[0080] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, it is intended to include any modifications and variations that fall within the scope of the claims and their equivalents.

Claims

1. A high-throughput test method for adhesive strength, characterized in that, Includes the following steps: A test component (4) is prepared using 3D printing technology. The test component (4) includes two rectangular strips (1). Multiple test specimens (2) are arranged in parallel between the two rectangular strips (1). Each test specimen (2) includes two test structures. Each test structure includes a first substrate (3-1), a second substrate (3-2), and a force measurement module (3-3). The force measurement module (3-3) is fixed between the first substrate (3-1) and the second substrate (3-2). The first substrate (3-1) has an adhesive surface. The two adhesive surfaces are connected by an adhesive (3-4) to form a joint. The test component (4) is placed in the test environment, and a force is applied to the rectangular strip (1) to stretch the force measurement module (3-3) and generate strain until the joint fails to bond. During the test, the video recording module records the changes of the test component (4) throughout the process and obtains the initial test image and the image when the bonding fails. The image processing module is used to process the initial test image and the image at the time of adhesive failure, respectively, to obtain the length of each force measurement module (3-3) at the initial test and at the time of adhesive failure, and to calculate the strain of the force measurement module (3-3) when the joint reaches the maximum load; Substituting the strain into the force-displacement curve of the force measurement module (3-3), the maximum load applied to the joint is obtained, and then the bonding strength of the joint is obtained.

2. The high-throughput test method for adhesive strength according to claim 1, characterized in that, The adhesive (3-4) is a material used for 3D printing or a material not used for 3D printing; When the adhesive (3-4) is a material for 3D printing, the test component (4) is prepared as a whole by one 3D printing process; When the adhesive (3-4) is a non-3D printing material, a first assembly (4-1) and a second assembly (4-2) are prepared using 3D printing technology. The first assembly (4-1) and the second assembly (4-2) each include a rectangular strip (1) and a plurality of test structures. In the first assembly (4-1), the first base (3-1) of each test structure has a first adhesive surface (A). In the second assembly (4-2), the first base (3-1) of each test structure has a second adhesive surface (B). The first assembly (4-1) and the second assembly (4-2) are assembled by an assembly plate, and the first adhesive surface (A) and the second adhesive surface (B) are connected by the adhesive (3-4) to form a joint.

3. The high-throughput test method for adhesive strength according to claim 2, characterized in that, The assembly plate includes a base plate (5), and a plurality of first positioning strips (5-1) are arranged parallel to each other along the length direction on the surface of the base plate (5). The first positioning strips (5-1) adjacent to each other are used to limit one of the test structures in the first assembly (4-1). The base plate (5) also has a plurality of second positioning strips (5-2) arranged in parallel along the length direction. The second positioning strips (5-2) correspond one-to-one with the first positioning strips (5-1). The two adjacent second positioning strips (5-2) are used to limit one of the test structures in the second assembly (4-2). A plurality of positioning protrusions (5-3) arranged along the length of the base plate (5) are also provided between the first positioning strip (5-1) and the second positioning strip (5-2). The plurality of positioning protrusions (5-3) are arranged close to the side of the first positioning strip (5-1), and the two adjacent positioning protrusions (5-3) are used to limit a first bonding surface (A). A limiting strip (5-6) is also provided between the first positioning strip (5-1) and the second positioning strip (5-2). The limiting strip (5-6) is set close to the side of the second positioning strip (5-2) and is used to adjust the bonding thickness of the second bonding surface (B) and the first bonding surface (A). The bottom plate (5) has a first limiting groove (5-4) on one side of the first positioning strip (5-1) at both ends, and the two first limiting grooves (5-4) are used to limit the rectangular strip (1) in the first assembly (4-1); the bottom plate (5) has a second limiting groove (5-5) on one side of the second positioning strip (5-2) at both ends, and the two second limiting grooves (5-5) are used to limit the rectangular strip (1) in the second assembly (4-2).

4. The high-throughput test method for adhesive strength according to claim 3, characterized in that, The assembly method of the first assembly (4-1) and the second assembly (4-2) includes the following steps: After the first bonding surface (A) is dipped in adhesive (3-4), the test structure in the first assembly (4-1) is respectively inserted between the first positioning strips (5-1). When the rectangular strip (1) in the first assembly (4-1) is limited by the two first limiting grooves (5-4), the first bonding surface (A) is inserted between the adjacent positioning protrusions (5-3). After the second bonding surface (B) is dipped in adhesive (3-4), the test structure in the second assembly (4-2) is inserted between the second positioning strips (5-2). When the rectangular strip (1) in the second assembly (4-2) is limited by the two second limiting grooves (5-5), the bottom surface of the second bonding surface (B) is placed on the limiting strip (5-6) and contacts the first bonding surface (A) for bonding.

5. The high-throughput test method for adhesive strength according to claim 1, characterized in that, The test background is black, and the first substrate (3-1) and the second substrate (3-2) are white. The processing method of the image processing module includes the following steps: The video obtained by the recording module was captured frame by frame using screenshot software. Each image was processed into a matrix using MATLAB, where each element of the matrix represents the gray level of a pixel. Then, the elements of the matrix were binarized: 255 represents a gray level pixel that is close to white, and 0 represents a gray level pixel that is close to black. Based on the white first substrate (3-1) and the white second substrate (3-2), all pixels with a gray value lower than 200 are set to 0; the image of the first substrate (3-1) is extracted, and the left and right boundaries of each test sample (2) are located; the image of the white second substrate (3-2) is extracted, and the upper and lower boundaries of each test sample (2) are located. By obtaining the left and right boundaries and the top and bottom boundaries of each test specimen (2), the position information of each test specimen (2) is determined. Based on the position information of each test specimen (2), the image of the test specimen (2) is extracted and placed in a matrix. The top and bottom boundaries of the force measurement module (3-3) in each test specimen (2) are obtained, and the length of the force measurement module (3-3) in each test specimen (2) is calculated.

6. The high-throughput test method for adhesive strength according to claim 5, characterized in that, The method for locating the left and right boundaries of each test specimen (2) is as follows: sum the columns of the grayscale image to obtain the total grayscale pixel value of each column. In two adjacent columns, from left to right, when the total grayscale pixel value increases from small to large, it is the left boundary of a specimen (2), and when the total grayscale pixel value decreases from large to small, it is the right boundary of a specimen (2).

7. The high-throughput test method for adhesive strength according to claim 5, characterized in that, The method for obtaining the upper and lower boundaries of each test sample (2) is as follows: sum the rows of the grayscale image to obtain the total grayscale pixel value of each row. In two adjacent rows, from top to bottom, when the total grayscale pixel value increases from small to large, it is the upper boundary of a sample (2). When the total grayscale pixel value decreases from large to small, it is the lower boundary of a sample (2).

8. The high-throughput test method for adhesive strength according to claim 1, characterized in that, The first substrate (3-1) and the second substrate (3-2) are made of rigid resin material by 3D printing, and the force measurement module (3-3) is made of 3D printed linear elastic material.

9. The high-throughput test method for adhesive strength according to claim 1, characterized in that, The test method is used to optimize the adhesive preparation parameters, in which the adhesives in the multiple test samples (2) are prepared with different parameters; or: The test method is used to investigate the influence of adhesive thickness and different stress modes on adhesive failure strength and failure mode. At this time, multiple test specimens (2) are grouped so that the adhesive in each group has different thicknesses, the adhesive in the same group has the same thickness, but the joint has different bonding angles.

10. The high-throughput test method for adhesive strength according to claim 1, characterized in that, During the test, the temperature of the test environment was controlled at -20℃ to 60℃; the humidity was controlled at 0 to 100%.

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