Radio frequency aging test system of semiconductor integrated circuit

Abstract

The invention relates to the technical field of circuits, and particularly discloses a radio frequency aging test system of a semiconductor integrated circuit, which comprises a multi-channel signal source device and an aging test box, a plurality of radio frequency signal sources are arranged in the multi-channel signal source device; a heating module and a plurality of test plates are arranged in the aging test box, the plurality of test plates are in one-to-one correspondence with the plurality of radio frequency signal sources, and each test plate is connected with the corresponding radio frequency signal source through a radio frequency cable; the heating module is used for heating the aging test box so as to form a test environment in the aging test box; the test board is used for setting a to-be-tested semiconductor integrated circuit so as to carry out a radio frequency aging test on the to-be-tested semiconductor integrated circuit based on a signal emitted by the radio frequency signal source in a test environment. According to the radio frequency aging test system of the semiconductor integrated circuit provided by the invention, the radio frequency aging of the semiconductor integrated circuit can be efficiently tested.

Description

Technical Field

[0001] The invention relates to the field of circuit technology, and in particular to a radio frequency aging test system for a semiconductor integrated circuit. Background Art

[0002] With the development of semiconductor technology, more and more semiconductor integrated circuits such as filters and ICs are widely used. Among them, the reliability of semiconductor integrated circuits such as RF aging and life has a vital impact on the application of semiconductor integrated circuits. However, there is currently no relevant solution to efficiently test the reliability of semiconductor integrated circuits such as RF aging and life. Summary of the invention

[0003] In view of this, an object of the present invention is to provide a radio frequency aging test system for a semiconductor integrated circuit to overcome the current problem that the radio frequency aging of a semiconductor integrated circuit cannot be tested efficiently.

[0004] To achieve the above objectives, the present invention adopts the following technical solutions:

[0005] The embodiment of the present application provides a radio frequency aging test system for a semiconductor integrated circuit, comprising: a multi-channel signal source device and an aging test box;

[0006] The multi-channel signal source device is provided with a plurality of radio frequency signal sources;

[0007] The aging test box is provided with a heating module and a plurality of test boards, the plurality of test boards correspond to the plurality of RF signal sources one by one, and each of the test boards is connected to the corresponding RF signal source through a RF cable;

[0008] The heating module is used to heat the aging test box to form a test environment in the aging test box;

[0009] The test board is used to set the semiconductor integrated circuit to be tested, so as to perform a radio frequency aging test on the semiconductor integrated circuit to be tested based on the signal sent by the radio frequency signal source in the test environment.

[0010] Furthermore, in some embodiments of the present application, an industrial control display module is also included;

[0011] The industrial control display module includes an industrial computer and a display;

[0012] The industrial computer is connected to the multi-channel signal source device and the test board respectively, and is used to control the frequency or power of the radio frequency signal source in the multi-channel signal source device and receive the test data of the test board;

[0013] Wherein, the industrial computer can independently control the frequency of each of the radio frequency signal sources.

[0014] Furthermore, in some embodiments of the present application, the industrial computer is also used to receive user instructions, and control the heating module to heat based on the user instructions to increase the temperature inside the aging test box.

[0015] Furthermore, in some embodiments of the present application, an air conditioning and air supply device is also included on the aging test box;

[0016] The air conditioning and air supply device is used to circulate the air in the aging test box through a preset guide plate.

[0017] Furthermore, in some embodiments of the present application, a temperature sensor is also included;

[0018] The temperature sensor is arranged in the aging test box, and is used to detect the temperature in the aging test box, and transmit the temperature data to the industrial computer;

[0019] The industrial computer is also used to compensate for heat dissipation losses inside the aging test box through the heating module based on the temperature data and the preset temperature.

[0020] Furthermore, in some embodiments of the present application, the semiconductor integrated circuit to be tested includes a filter and an IC.

[0021] Furthermore, in some embodiments of the present application, the RF aging test of the semiconductor integrated circuit to be tested based on the signal emitted by the RF signal source includes: acquiring frequency and power data of a channel corresponding to the semiconductor integrated circuit to be tested; and determining aging information of the semiconductor integrated circuit to be tested based on the frequency and power data.

[0022] Furthermore, in some embodiments of the present application, a plurality of the test boards are arranged in layers in the aging test box.

[0023] The present invention relates to the field of circuit technology, and specifically discloses a radio frequency aging test system for semiconductor integrated circuits, the system comprising a multi-channel signal source device and an aging test box; a plurality of radio frequency signal sources are arranged in the multi-channel signal source device; a heating module and a plurality of test boards are arranged in the aging test box, the plurality of test boards correspond to the plurality of radio frequency signal sources one by one, and each test board is connected to the corresponding radio frequency signal source through a radio frequency cable; the heating module is used to heat the aging test box to form a test environment in the aging test box; the test board is used to set a semiconductor integrated circuit to be tested, so as to perform a radio frequency aging test on the semiconductor integrated circuit to be tested in the test environment based on a signal emitted by the radio frequency signal source. The radio frequency aging test system for semiconductor integrated circuits provided by the present application can efficiently test the radio frequency aging of semiconductor integrated circuits. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 It is a structural schematic diagram of a radio frequency aging test system for a semiconductor integrated circuit provided by an embodiment of the present invention.

[0026] Figure 2 It is a structural schematic diagram of a radio frequency aging test system for a semiconductor integrated circuit provided by another embodiment of the present invention.

[0027] Figure 3 The figure is a hardware stereoscopic diagram of a radio frequency aging test system for a semiconductor integrated circuit provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0028] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0029] Figure 1 This is a schematic diagram of the structure of the radio frequency aging test system for semiconductor integrated circuits provided by an embodiment of the present invention. Figure 1 , this embodiment may include a multi-channel signal source device and an aging test box; wherein, a plurality of RF signal sources are arranged in the multi-channel signal source device; a heating module and a plurality of test boards are arranged in the aging test box, the plurality of test boards correspond to the plurality of RF signal sources one by one, and each test board is connected to the corresponding RF signal source through an RF cable; the heating module is used to heat the aging test box to form a test environment in the aging test box; the test board is used to set a semiconductor integrated circuit to be tested, so as to perform an RF aging test on the semiconductor integrated circuit to be tested in the test environment based on the signal emitted by the RF signal source.

[0030] Specifically, in the present application, the frequencies of multiple RF signal sources in the multi-channel signal source device can cover the range of 15MHz-6GHz (frequency stability 10ppm), and the power range can cover -40dBm-+10dBm. Each channel (corresponding to an RF signal source) can output signals independently, thereby achieving uninterrupted output.

[0031] In practical applications, each of the multiple RF signal sources in the multi-channel signal source device of the present application is connected to a test board in the aging test box through an RF cable, so that when the semiconductor integrated circuit needs to be tested, it is only necessary to set the semiconductor integrated circuit to be tested on the test board, and then turn on the corresponding RF signal source, and collect the test data through the test board at the same time to realize the RF aging test. In practical applications, a DC-6G low-loss and high-temperature resistant RF cable can be used, and a quick plug-in connector can be used at the aging test box end.

[0032] It can be understood that in the present application, the semiconductor integrated circuit may include filters and ICs, etc., to implement reliability tests such as RF aging and life span tests under a target environment (mainly a target temperature).

[0033] like Figure 1 As shown, in some embodiments of the present application, the test system also includes an industrial control display module; the industrial control display module includes an industrial computer and a display; the industrial computer is respectively connected to the multi-channel signal source device and the test board, and is used to control the frequency or power of the RF signal source in the multi-channel signal source device, and receive test data from the test board; wherein the industrial computer can independently control the frequency of each RF signal source.

[0034] Specifically, the industrial computer can adopt a module or device with an I5 processor. In actual applications, the user can set parameters such as the power and frequency of the signal source through the display and the industrial computer. During the test, the test board can transmit the acquired test data to the industrial computer for calculation and analysis, and display the process data and the final test results through the display.

[0035] In addition, the industrial computer can also be used to receive user instructions and control the heating module to heat based on the user instructions to increase the temperature inside the aging test box.

[0036] The RF aging test system for semiconductor integrated circuits provided by the present application is based on a general architecture design and can meet various filter testing requirements (in actual applications, the corresponding test board can be replaced according to actual needs to achieve testing of different circuits); it can simultaneously meet multiple uninterrupted RF aging tests; and the user can customize the output frequency and power of any channel to load different test devices for simultaneous testing; and each channel can perform fixed frequency output or fixed power output, and a swept frequency output can also be set for specific needs; at the same time, the temperature of the aging test box can be flexibly set according to needs; and it can also be set to record the temperature of the aging test box in real time at a preset frequency, as well as the frequency and power of each channel, such as the reading time interval can be set according to needs from 1s to 1 hour.

[0037] In practical applications, the multi-channel signal source device mentioned above in this application can independently set the signal output frequency and power of each channel, and can realize simultaneous testing scenarios of different devices with a multiple of 8 according to actual test requirements, wherein the RF interface can be SMA-K and the communication interface can be LAN.

[0038] Furthermore, in some embodiments of the present application, the aging test box can adopt a unique air duct structure design (such as Figure 2 As shown), the working area is evenly ventilated, the temperature is stable, and the temperature field is uniform. The aging test chamber can be set as a single-door structure, and high-density glass fiber insulation is used to achieve heat insulation and heat preservation effects. The door seal uses high-temperature resistant silicone rubber sealing strips to protect the health of users.

[0039] In some embodiments of the present application, a touch screen program controller (used together with the above industrial computer and display, or directly replacing the above industrial computer and display) can be set for the aging test box, so that users can perform temperature increase, constant temperature, and timing control by touching the screen. Among them, the controller can be set to dialogue mode, and Chinese display can be displayed through the controller menu bar to facilitate operations such as digital input.

[0040] In addition, a temperature sensor and an alarm device can be installed in the aging test box to give it a self-diagnosis function. When it encounters faults such as overtemperature and overload, a buzzer alarm will be sounded.

[0041] Furthermore, in some embodiments of the present application, the temperature inside the aging test box can be detected by the above-mentioned temperature sensor, and the temperature data can be transmitted to an industrial computer or a separate control system or module of the aging test box, so that it can compensate for the heat dissipation loss inside the aging test box through a heating module based on the temperature data and preset temperature.

[0042] Specifically, the BTC balanced temperature control method can be adopted, in which the control system controls the output of the heater in the heating module according to the result of the PID automatic calculation output according to the set temperature point to compensate for the heat dissipation loss and finally achieve dynamic balance.

[0043] Furthermore, in some embodiments of the present application, the radio frequency aging test system also includes an air conditioning and air supply device disposed on the aging test box; the air conditioning and air supply device is used to circulate the air in the aging test box through a preset guide plate.

[0044] In some embodiments of the present application, the multi-channel signal source device, the aging test box, the heating module, the air conditioning device, and the control and display parts mentioned above can be integrated to form an integrated device, such as Figure 2 and Figure 3As shown, the air-conditioning air supply device includes a circulation motor and a wind plate (which can be disassembled according to actual needs) or a preset guide plate. In actual application, a centrifugal multi-blade fan can be set in the air conditioning area, and the air supply device can be configured as follows: Figure 2 The unique air duct forced closed circulation method shown in the figure pushes the circulating airflow through the heater of the heating module to the working area for uniform air supply and heating without dead corners, ensuring temperature uniformity.

[0045] Specifically, in some embodiments of the present application, the outer shell of the overall device can be formed by electrostatic spraying of the outer surface of the cold-rolled steel plate. It should be noted that in this embodiment, the interior of the above-mentioned shell, except for the area where specific components (such as a multi-channel signal source device, etc.) are set, can be directly used as the space of the aging test box, that is, part of the shell of the overall device is the shell of the aging test box. Of course, an insulation layer can also be set to form an aging test box after isolation. For example, a heat-insulating layer can be formed by high-temperature resistant ultra-fine centrifugal glass wool. Stainless steel plates can be used for the inner wall of the overall device and the insulation box, and all seams can be continuously TIG welded to ensure that there is no leakage after long-term testing. In this way, the box of the equipment can be assembled on site and connected to the power supply before use.

[0046] On this basis, if Figure 2 As shown, for the above-mentioned air-conditioning air supply device, the air-conditioning box can be set at the rear of the working area (i.e., the area where the circuit to be tested is tested), and the motor and fan impeller are installed on the top of the air-conditioning box. The air is evenly supplied through the fixed ventilation outlet guide plate inside the equipment to meet the temperature uniformity requirements. The specific space flow is as follows Figure 2 Indicated by the arrow.

[0047] In addition, in the embodiment of the present application, the door body of the above-mentioned overall equipment can be set as a single-opening door, specifically a rotary hinge, so as to ensure that the opening angle of the door body is not less than 120°, and the equipment door body can be sealed with double high and low temperature resistant silicone rubber sealing strips; and a high-temperature resistant tempered glass observation window can be installed in the upper middle part of the door body; for the electrical control cabinet, the electrical box can be installed with a control panel that is uniformly molded with the overall equipment, and a distribution board can be installed in the front of the interior; and 4 legs can be set at the bottom of the equipment box, with a ground clearance of 10 cm, so as to facilitate the movement of the equipment by forklift or ground bull.

[0048] In practical applications, based on PID, PWM and SSR, the solid-state relay can be used to drive the heater to work through contactless zero-crossing triggering, thereby achieving contact-free sparks and noise and extending the service life; and for the above-mentioned heating module, a forced blowing method can be adopted, and a stainless steel spiral fin heater can be used, which is connected by a bracket and wires and distributed in the air duct to regulate stable and uniform heat dissipation.

[0049] In some embodiments of the present application, an aging rack can be set in the aging test box to fix the test board. For example, a quick-plug drawer-type aging rack is used, with 8 test boards set on each layer, and a total of 10 layers. Moreover, the test board is fixed on the aging rack by plugging and unplugging, so that the test board can be replaced based on actual needs and tested quickly. And in some embodiments, test boards with the same function can be fixed on a substrate, and the substrate is fixedly connected to the aging rack to achieve the replacement of multiple test boards at the same time, further improving efficiency.

[0050] In the embodiment of the present application, the power supply in the RF aging test system can adopt a derating design to ensure that 90% of the rated power can meet the power consumption requirements, avoiding equipment safety problems caused by tripping due to overload power supply, or fire caused by burning of insulation due to overheating of the power cord; the AC power supply design adopts the principle that the socket is energized and the plug is not energized, so as to prevent safety problems of electric shock to operators during use; for connections such as voltage and power input that are likely to cause device burning, different models of connections are used, and different key positions are used for connectors of the same specification; the working devices on the surface of module parts in the equipment chassis are at the same potential; all test boards or modules are connected to the surface of the equipment casing through the substrate, and ground wires are laid on both sides of the cabinet to connect the chassis casing to the cabinet ground wire.

[0051] On this basis, the actual use process of this system is introduced:

[0052] First, after powering on, the system self-checks whether the related controlled units are communicating normally. After the frequency measurement part is controlled, the relevant setting parameters are input. After confirmation, the system self-verifies whether the settings are correct. After the communication self-check, the output power and frequency of each channel are set. The frequency and power of all channels can also be set with one key. Among them, each channel can reserve a power compensation dialog box to compensate for the loss of test cables of different lengths (control range 0-3dBm). After the communication self-check, the working temperature of the aging test box is set, and the temperature in the aging test box is read back. The industrial computer records the output power, frequency and temperature values ​​of each channel with a timestamp. The reading time interval can be customized to 1s-3600s. The storage file is in CSV format, and the aging of the semiconductor integrated circuit to be tested is determined by comparative analysis.

[0053] The radio frequency aging test system for semiconductor integrated circuits provided in the present application uses a multi-channel signal source device to provide the required frequency and power to semiconductor integrated circuits such as filters. Each channel is independently controllable, and the cable compensation power value (within 3dbm) can be set to improve test efficiency and flexibility; a heating module and an air conditioning device on the aging test box are used to provide a test environment, which can quickly achieve a test environment and maintain temperature uniformity; the test board and the aging rack are fixed by plugging and unplugging, which can achieve quick plugging and unplugging, improving work efficiency; the test board is used to install the device under test, which can provide good rigidity, and the test board for installing the circuit under test based on a universal modular design can be replaced according to actual needs, increasing test flexibility.

[0054] It should be noted that, in the description of the present invention, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "plurality" refers to at least two.

[0055] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code that includes one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present invention includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present invention belong.

[0056] It should be understood that the various parts of the present invention can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, a plurality of steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0057] A person skilled in the art may understand that all or part of the steps in the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiment.

[0058] In addition, each functional unit in each embodiment of the present invention may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0059] The storage medium mentioned above can be a read-only memory, a magnetic disk or an optical disk, etc.

[0060] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0061] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A radio frequency aging test system for semiconductor integrated circuits, characterized in that: include: Multi-channel signal source device and aging test chamber; The multi-channel signal source device is provided with a plurality of radio frequency signal sources; The aging test box is provided with a heating module and a plurality of test boards, the plurality of test boards correspond to the plurality of RF signal sources one by one, and each of the test boards is connected to the corresponding RF signal source through a RF cable; The heating module is used to heat the aging test box to form a test environment in the aging test box; The test board is used to set the semiconductor integrated circuit to be tested, so as to perform a radio frequency aging test on the semiconductor integrated circuit to be tested based on the signal sent by the radio frequency signal source in the test environment.

2. The radio frequency aging test system for semiconductor integrated circuits according to claim 1, characterized in that: It also includes industrial control display module; The industrial control display module includes an industrial computer and a display; The industrial computer is connected to the multi-channel signal source device and the test board respectively, and is used to control the frequency or power of the radio frequency signal source in the multi-channel signal source device and receive the test data of the test board; Wherein, the industrial computer can independently control the frequency of each of the radio frequency signal sources.

3. The radio frequency aging test system for semiconductor integrated circuits according to claim 2, characterized in that: The industrial computer is also used to receive user instructions and control the heating module to heat based on the user instructions to increase the temperature inside the aging test box.

4. The radio frequency aging test system for semiconductor integrated circuits according to claim 1, characterized in that: It also includes an air conditioning and air supply device arranged on the aging test box; The air conditioning and air supply device is used to circulate the air in the aging test box through a preset guide plate.

5. The radio frequency aging test system for semiconductor integrated circuits according to claim 2, characterized in that: Also includes a temperature sensor; The temperature sensor is arranged in the aging test box, and is used to detect the temperature in the aging test box, and transmit the temperature data to the industrial computer; The industrial computer is also used to compensate for heat dissipation losses inside the aging test box through the heating module based on the temperature data and the preset temperature.

6. The radio frequency aging test system for semiconductor integrated circuits according to claim 1, characterized in that: The semiconductor integrated circuit to be tested includes a filter and an IC.

7. The radio frequency aging test system for semiconductor integrated circuits according to claim 1, characterized in that: The radio frequency aging test of the semiconductor integrated circuit to be tested based on the signal emitted by the radio frequency signal source includes: acquiring frequency and power data of a channel corresponding to the semiconductor integrated circuit to be tested; and determining aging information of the semiconductor integrated circuit to be tested based on the frequency and power data.

8. The radio frequency aging test system for semiconductor integrated circuits according to claim 1, characterized in that: A plurality of the test boards are arranged in layers in the aging test box.

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