A processing technique for axial diodes

Abstract

The application relates to a processing technology of an axial diode and the axial diode and relates to the technical field of diodes; the processing technology of the axial diode comprises the following steps: one lead wire is heated in a first tunnel type track, a solder wire is used to feed to the nail head of the lead wire, after melting, shaping is performed through a shaping rod, and a first tin layer is formed; a chip is placed on the first tin layer, and after being pressed down, cooling is performed; another lead wire is heated in a second tunnel type track, a solder wire is used to feed to the nail head of the lead wire, after melting, shaping is performed through a shaping rod to form a second tin layer; the lead wire in the second tunnel type track is placed above the lead wire in the first tunnel type track, the second tin layer on the lead wire in the second tunnel type track is contacted with the chip, and after being pressed down, cooling is performed; the excess part of the lead wire on the axial diode is cut off through a lead wire shearing device. The application has the effect of improving the heat dissipation performance of the axial diode.

Description

Technical Field

[0001] This application relates to the field of diode technology, and in particular to a fabrication process for an axial diode and an axial diode itself. Background Technology

[0002] With the continuous development of society and economy and the increasing level of science and technology, my country's semiconductor industry is also booming. Diodes, as electronic devices made of semiconductor materials such as silicon, selenium, and germanium, have unidirectional conductivity; that is, when a forward voltage is applied to the anode and cathode of a diode, the diode conducts, and when a reverse voltage is applied, the diode is cut off. Therefore, diodes play an important role in various electronic circuits.

[0003] An existing axial diode includes two leads, a chip, and a body. The chip is located between the two leads and abuts against the ends of the leads, and is fixedly connected to the ends of the two leads by soldering. The body is sleeved on the chip and the two leads, thereby encapsulating the ends of the chip and the leads.

[0004] Regarding the aforementioned technologies, since the leads of existing axial diodes are all thin leads of the same diameter, the heat dissipation performance of the axial diode is reduced, thereby reducing the safety performance and service life of the axial diode, and therefore needs to be improved. Summary of the Invention

[0005] To improve the heat dissipation performance of axial diodes, this application provides a fabrication process for an axial diode and an axial diode itself.

[0006] This application provides an axial diode, which adopts the following technical solution:

[0007] An axial diode includes a chip, a body, and two leads. The chip is located between the two leads and is connected to the end of each lead. The body encapsulates the end of the chip connected to the two leads. Each lead has a protrusion extending from the side away from the chip. The diameter of the protrusion is larger than the diameter of the remaining portion of the lead outside the body.

[0008] By adopting the above technical solution, compared with the prior art where all leads are set to be thin leads of the same diameter, resulting in a reduction in the heat dissipation performance of the axial diode, and thus a reduction in the safety performance and service life of the axial diode, this application increases the cross-sectional area of ​​the lead segment by setting the protrusion, making the diameter of the protrusion larger than the diameter of the mounting part, thereby increasing the heat dissipation capacity of the axial diode during operation, effectively ensuring the safety performance and service life of the axial diode. At the same time, the presence of the protrusion can also help to fix the axial diode in special cases.

[0009] Preferably, the number of protrusions on each lead is set to several, and the protrusions on the same lead are spaced apart.

[0010] By adopting the above technical solution, the number of protrusions is increased, thereby increasing the average cross-sectional area of ​​the lead and further improving the heat dissipation performance of the axial diode of this application, thus further ensuring the safety performance and service life of the axial diode of this application.

[0011] Preferably, each lead wire is provided with a plurality of anti-torsion portions on one end sidewall of the main body, the plurality of anti-torsion portions being distributed in the axial direction of the lead wire, and each anti-torsion portion being embedded in the inner sidewall of the main body.

[0012] By adopting the above technical solution, the anti-torsion part is set so that it can be embedded in the inner wall of the main body, reducing the probability of the lead rotating relative to the main body under external force, thereby increasing the connection stability between the lead and the main body, reducing the probability of gaps forming between the lead and the main body under external force, and ensuring the stability of the axial diode of this application.

[0013] On the other hand, the processing technology for axial diodes provided in this application adopts the following technical solution:

[0014] A processing method for manufacturing axial diodes includes the following steps:

[0015] One lead assembly: One lead is placed in the first tunnel-type track and heated, and solder wire is fed to the nail head of the lead. After melting, it is shaped by the shaping rod and the first tin layer is formed.

[0016] Chip assembly: Place the chip on the first tin layer, press down, and then cool;

[0017] Another lead assembly: The other lead is placed in the second tunnel-type track and heated. Solder wire is fed to the nail head of the lead. After melting, it is shaped by the shaping rod to form the second tin layer.

[0018] Two lead bonding: Place the lead in the second tunnel track above the lead in the first tunnel track, and make the second tin layer on the lead in the second tunnel track contact the chip, press down and then cool;

[0019] Cutting excess leads: Remove excess parts of the leads on the axial diode using a lead cutting device.

[0020] Preferably, the lead wire cutting device includes a device body, a cutting roller, a rotating component, and a transport mechanism. The cutting roller is rotatably connected to the device body, the rotating component is used to drive the cutting device to rotate, and the transport mechanism is used to displace the axial diodes that are transported in a direction closer to the cutting roller.

[0021] By adopting the above technical solution and specifically configuring the lead wire cutting device, when it is necessary to cut the lead wire of the axial diode of this application, the transport mechanism can move the axial diode towards the direction of the cutting roller, so that when the cutting roller rotates, it can cut the lead wire of the axial diode that is close to itself, thereby realizing the cutting of excess lead wire and effectively facilitating the operation of relevant personnel.

[0022] Preferably, the transport mechanism includes a guide assembly, a transport roller, and a transport component. The transport roller is located on one side of the shearing roller and is rotatably connected to the equipment body. Several transport grooves are formed on the side wall of the transport roller, and the lead portion of the axial diode extends outward through the transport groove. The guide assembly is used to transport the lead portion of the axial diode into the transport groove. The transport component is used to drive the transport roller to rotate, thereby bringing the axial diode closer to the shearing roller.

[0023] By adopting the above technical solution and specifically setting the transport mechanism, after the guide component delivers the lead wire of the axial diode to the transport groove on the transport roller, the transport roller rotates, thereby driving the axial diode in the transport groove to move. This causes the axial diode to approach the shearing roller and be sheared by the shearing roller, realizing the automatic transport of the axial diode and effectively facilitating the operation of relevant personnel.

[0024] Preferably, the transport mechanism further includes a reinforcement component, a drive roller, and a drive element. The number of reinforcement components is set to several, and each corresponds to a transport trough. Each reinforcement component includes a reinforcement frame and a linkage element. Each reinforcement frame is rotatably connected to the transport roller and is located on the side of the corresponding axial diode away from the transport trough, and abuts against the axial diode. The transport roller is sleeved on the drive roller and is rotatably connected to the drive roller. The drive element is used to drive the drive roller to rotate relative to the transport roller. The drive roller drives the reinforcement frame to rotate through the linkage element.

[0025] By adopting the above technical solution and setting the reinforcement components, when the lead of the axial diode falls into the drive roller in the transport trough, the drive roller can drive the corresponding reinforcement frame to rotate through the linkage component, so that the reinforcement frame is in contact with the lead. Thus, this application can fix the lead under the joint action of the reinforcement frame and the inner wall of the transport trough, reducing the probability of the axial diode moving accidentally during transportation and shearing, and ensuring the shearing effect of the lead.

[0026] Preferably, each of the linkage components includes a linkage frame, one end of which is rotatably connected to the drive roller, and the rotation point is offset from the axis of the drive roller; the other end of which is rotatably connected to the corresponding reinforcement frame, and the rotation point is offset from the rotation point of the corresponding reinforcement frame itself.

[0027] By adopting the above technical solution and setting the linkage frame, the drive roller can drive each reinforcement frame to rotate through several linkage frames, realizing the drive of each reinforcement frame, effectively facilitating the fixing of the lead wire, and at the same time ensuring that after the previous lead wire is cut, the next reinforcement frame can properly fix the next lead wire, thus ensuring the fixing effect of the lead wire.

[0028] Preferably, an inclined frame is provided below the shearing roller. The end of the inclined frame near the shearing roller is rotatably connected to the equipment body. The equipment body is also provided with a rotating assembly. The transport roller drives the inclined frame to rotate through the rotating assembly.

[0029] By adopting the above technical solution, the tilting frame is designed so that after the shearing roller cuts the excess lead wire, it can fall onto the tilting frame and roll out of the equipment body. At the same time, the presence of the rotating component can also cause the tilting frame to rotate during the downward fall of the axial diode, thereby reducing the distance between the top of the tilting frame and the axial diode, reducing the impact on the axial diode, and effectively protecting the axial diode.

[0030] Preferably, the rotating assembly includes an extension frame, an abutment frame, and a transmission frame. The extension frame is disposed on the transport roller, the abutment frame is slidably connected to the equipment body and located on the displacement path of the extension frame, and one end of the transmission frame is rotatably connected to the abutment frame and the other end is rotatably connected to the tilting frame.

[0031] By adopting the above technical solution and configuring the rotating component, the conveyor roller can drive the additional frame to rotate together when it rotates, so that the additional frame gradually approaches the abutment frame and eventually abuts against the abutment frame, thereby pushing the abutment frame to slide. This causes the abutment frame to drive the tilting frame to rotate through the transmission frame, thus driving the tilting frame. At the same time, it also realizes the linkage between the conveyor roller and the tilting frame, which facilitates the operation of relevant personnel.

[0032] In summary, this application includes at least one of the following beneficial technical effects:

[0033] 1. The protrusion is designed such that its diameter is larger than that of the mounting portion, thereby increasing the cross-sectional area of ​​the lead at that location and thus increasing the heat dissipation capacity of the axial diode during operation. This effectively ensures the safety performance and service life of the axial diode. In addition, the presence of the protrusion also helps to fix the axial diode in special circumstances.

[0034] 2. The specific configuration of the lead wire cutting device enables the transport mechanism to move the axial diode closer to the cutting roller when it is necessary to cut the lead wire of the axial diode of this application. This allows the cutting roller to cut the lead wire of the axial diode that is close to itself when it rotates, thereby cutting the excess lead wire and effectively facilitating the operation of relevant personnel.

[0035] 3. The specific design of the transport mechanism allows the guide assembly to deliver the lead wire of the axial diode to the transport trough on the transport roller. The transport roller then rotates, causing the axial diode in the transport trough to move. This brings the axial diode closer to the shearing roller, where it is sheared, thus achieving automatic transport of the axial diode and effectively facilitating the operation of relevant personnel. Attached Figure Description

[0036] Figure 1 This is a schematic diagram illustrating the overall axial diode in Embodiment 1 of this application.

[0037] Figure 2 This is a schematic diagram of the anti-torsion part in Embodiment 1 of this application.

[0038] Figure 3 This is a schematic diagram illustrating the overall structure of the lead wire cutting device in Embodiment 2 of this application.

[0039] Figure 4 This is a schematic diagram illustrating the structure of the transport roller in Embodiment 2 of this application.

[0040] Figure 5 This is a schematic diagram illustrating the overall structure of the lead wire cutting device in Embodiment 3 of this application.

[0041] Figure 6 This is a schematic diagram of the tilting frame used in Embodiment 3 of this application.

[0042] Figure 7 This is a structural schematic diagram of the reinforcement component used in Embodiment 3 of this application.

[0043] Figure 8 This is a schematic diagram illustrating the structure of the transmission frame in Embodiment 3 of this application.

[0044] Explanation of reference numerals in the attached drawings: 1. Chip; 2. Body; 3. Lead wire; 31. Protrusion; 32. Nail head; 33. Anti-torsion part; 4. Equipment body; 5. Shearing roller; 51. Shearing blade; 6. Rotating component; 7. Transport mechanism; 71. Guide assembly; 711. Guide frame; 7111. Guide groove; 72. Transport roller; 721. Roller body; 722. Transport piece; 7221. Transport groove; 73. Transport component; 74. Reinforcing assembly; 741. Reinforcing frame; 742. Linkage component; 7421. Linkage frame; 75. Drive roller; 76. Drive component; 8. Inclined frame; 9. Rotating assembly; 91. Additional frame; 911. Abutment part; 92. Abutment frame; 93. Transmission frame; 94. Return spring. Detailed Implementation

[0045] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0046] Example 1:

[0047] Embodiment 1 of this application discloses an axial diode. (Refer to...) Figure 1 and Figure 2 The axial diode includes a chip 1, a body 2, and two leads 3. The chip 1 is located between the two leads 3 and is connected to the end of each lead 3. The body 2 is used to encapsulate the end of the chip 1 connected to the two leads 3. Each lead 3 has a protrusion 31 extending from the side away from the chip 1. The diameter of the protrusion 31 is larger than the diameter of the rest of the lead 3.

[0048] Reference Figure 1 and Figure 2 Each lead 3 has a pin head 32 at one end near the other lead 3, and the pin head 32 is integrally formed with the lead 3. Each pin head 32 is frustum-shaped, and each pin head 32 has several anti-torsion portions 33 on its sidewall, which are arranged at equal angles around the axis of the pin head 32. Each anti-torsion portion 33 protrudes from the pin head 32. The chip 1 is located between two pin heads 32 and is fixedly connected to both pin heads 32.

[0049] Reference Figure 1 and Figure 2The main body 2 is sleeved on the two nail heads 32 and a chip 1, and is fixedly connected to each nail head 32. The main body 2 is cylindrical, and the anti-torsion part 33 on each lead wire 3 is embedded in the inner wall of the main body 2.

[0050] Reference Figure 1 and Figure 2 Each lead wire 3 has several protrusions 31, all located on the side of the lead wire 3 away from the nail head 32. Each protrusion 31 is integrally formed with the lead wire 3. In this embodiment, each lead wire 3 has two protrusions 31, which are spaced apart along the axial direction of the lead wire 3.

[0051] The implementation principle of an axial diode in Embodiment 1 of this application is as follows: the presence of the protrusion 31 makes the diameter of the protrusion 31 larger than the diameter of other positions of the lead 3, thereby increasing the cross-sectional area of ​​the lead 3 at that position, and thus increasing the heat dissipation capacity of the axial diode during operation, effectively ensuring the safety performance and service life of the axial diode. At the same time, the presence of the protrusion 31 can also help with the installation and fixation of the axial diode in special circumstances.

[0052] On the other hand, this application also provides a processing technology for manufacturing axial diodes, comprising the following steps:

[0053] S1. One of the lead wires is assembled: one of the lead wires 3 is placed in the first tunnel track and heated to the process temperature. Then, solder wire is fed to the nail head 32 of the lead wire 3. The solder wire melts into a liquid state due to the heat conduction of the lead wire 3. After being shaped and solidified by the shaping rod, the first tin layer is formed.

[0054] S2, Chip Assembly: Place chip 1 on the first tin layer, press down and then cool;

[0055] S3, Another lead assembly: The other lead 3 is placed in the second tunnel track and heated to the process temperature. Then, solder wire is fed to the nail head 32 of the lead 3. The solder wire melts into a liquid state due to the heat conduction of the lead 3. After being shaped and solidified by the shaping rod, a second tin layer is formed.

[0056] S4. Two lead wires are bonded together: The lead wire 3 in the second tunnel track is placed above the lead wire 3 in the first tunnel track, and the second tin layer on the lead wire 3 in the second tunnel track is brought into contact with the chip 1, then pressed down and cooled.

[0057] S5. Cut off excess leads: Remove the excess portion of the axial diode's upper lead 3 using a lead cutting device.

[0058] Example 2:

[0059] Embodiment 2 of this application discloses a lead wire cutting device, which is the lead wire cutting device in Embodiment 1. (Refer to...) Figure 3 and Figure 4 The lead wire cutting device includes a device body 4, a cutting roller 5, a rotating component 6, and a transport mechanism 7. The device body 4 is placed on the ground. The transport mechanism 7 includes a guide assembly 71, a transport roller 72, and a transport component 73. The guide assembly 71 includes two guide frames 711, the bottom end of which is fixedly installed on the top of the device body 4 and extends upward. The two guide frames 711 are distributed along the length of the device body 4.

[0060] Reference Figure 3 and Figure 4 Each guide frame 711 has a guide groove 7111 extending through its side wall. One end of each guide groove 7111 extends upward and beyond the guide frame 711, while the other end meanders downward and extends vertically downward at the bottom, beyond the bottom of the guide frame 711. The body of the axial diode is placed in the space between the two guide frames 711, and the two lead portions are respectively placed in the two guide grooves 7111, with the ends of the lead portions extending beyond the corresponding guide grooves 7111.

[0061] Reference Figure 3 and Figure 4 The transport roller 72 is located directly below the bottom end of the guide groove 7111. The transport roller 72 includes a roller body 721 and a plurality of transport plates 722. Both ends of the roller body 721 are rotatably connected to the equipment body 4 via bearings. In this embodiment, the transport component 73 is configured as a geared motor, which is fixedly mounted on the equipment body 4, and its output shaft is fixedly connected to one end of the roller body 721 via a coupling to drive the rotation of the roller body 721.

[0062] Reference Figure 3 and Figure 4 In this embodiment, each transport roller 72 has two transport plates 722 at both ends, spaced apart, and each transport plate 722 is bolted to the end of the transport roller 72. Each transport plate 722 has a plurality of transport grooves 7221 extending through its sidewall, evenly distributed at equal angles along the axis of the transport plate 722. Each transport groove 7221 is located on the side of the transport plate 722 furthest from the center of the roller body 721, allowing the lead wire portion to fall directly into the corresponding transport groove 7221.

[0063] Reference Figure 3 and Figure 4The shearing roller 5 is located on one side of the conveying roller 72. The axis of the shearing roller 5 is parallel to the axis of the roller body 721 and is higher than the axis of the roller body 721. Both ends of the shearing roller 5 are rotatably connected to the equipment body 4 through bearings. In this embodiment, the driving component 76 is a geared motor, which is fixedly installed on the equipment body 4, and its output shaft is fixedly connected to one end of the shearing roller 5 through a coupling to drive the rotation of the roller body 721.

[0064] Reference Figure 3 and Figure 4 Two shearing blades 51 are provided at both ends of the shearing roller 5, and both shearing blades 51 are fixedly installed on the shearing roller 5. Each shearing blade 51 is located between two transport plates 722 on the corresponding end of the roller body 721, and the sum of the radius of the shearing blade 51 and the radius of the transport plate 722 is greater than the straight-line distance between the axis of the shearing blade 51 and the axis of the transport plate 722, so that the shearing blade 51 can cut the lead wire portion.

[0065] Reference Figure 3 and Figure 4 The equipment body 4 is also provided with an inclined frame 8, which is located directly below the shearing roller 5 and is fixedly installed on the equipment body 4. The end of the inclined frame 8 away from the shearing roller 5 is inclined downward so that the sheared axial diode can fall onto the inclined frame 8 and roll out of the equipment body 4 via the inclined frame 8.

[0066] The implementation principle of the lead shearing device in Embodiment 2 of this application is as follows: When it is necessary to shear the lead portion of an axial diode, the lead portion of the axial diode is placed at the top of the guide groove 7111. Under the guidance of the guide groove 7111, the lead portion of the axial diode is displaced downward and falls into the transport groove 7221 on the corresponding transport piece 722. Subsequently, the transport roller 72 rotates under the drive of the transport member 73, thereby transporting the axial diode on the transport roller 72 and gradually approaching the shearing roller 5. When the shearing blade 51 on the shearing roller 5 contacts the lead portion of the axial diode, the shearing blade 51 shears the lead portion. The sheared axial diode falls onto the tilting frame 8 and rolls out of the device body 4 via the tilting frame 8.

[0067] Example 3:

[0068] The difference between Embodiment 3 and Embodiment 2 in this application is that: (Refer to...) Figure 5 , Figure 6 and Figure 7The transport mechanism 7 also includes a reinforcing component 74, a drive roller 75, and a drive element 76. The roller body 721 is hollow inside. In this embodiment, the number of roller bodies 721 is set to two, and the interior of both roller bodies 721 is hollow. Each roller body 721 is sleeved on the drive roller 75 and is located at both ends of the drive roller 75, and is rotatably connected to the drive roller 75 through bearings.

[0069] Reference Figure 5 , Figure 6 and Figure 7 In this embodiment, the number of transport components 73 is set to two, with each transport component 73 corresponding to one of the two rollers 721. Each transport component 73 is a combination structure of a reduction motor and a gear set. Each reduction motor is fixedly mounted on the equipment body 4. One gear in the gear set is fixedly sleeved on the output shaft of the reduction motor, and the other gear drives the reduction motor and is fixedly sleeved on the corresponding roller 721 to drive the rotation of the roller 721.

[0070] Reference Figure 6 and Figure 7 In this embodiment, the reinforcing components 74 are configured in two groups, each corresponding to one of the two rollers 721 and the other corresponding to the transport piece 722 on the roller 721 closest to the guide frame 711, and located on the side of the transport piece 722 closest to the other roller 721. Each group contains a plurality of reinforcing components 74, and the number of reinforcing components 74 in each group is the same as the number of transport grooves 7221 on the corresponding transport piece 722.

[0071] Reference Figure 6 and Figure 7 Each reinforcing component 74 includes a reinforcing frame 741 and a linkage 742, and each linkage 742 includes a linkage frame 7421. The middle part of each reinforcing frame 741 is rotatably connected to the corresponding transport piece 722 via a pin. Each reinforcing frame 741 is located on the side of the axial diode lead portion away from the transport groove 7221, and abuts against the corresponding axial diode to increase the stability of the axial diode during movement.

[0072] Reference Figure 6 and Figure 7 One end of each linkage frame 7421 is rotatably connected to the end of the corresponding reinforcing frame 741 away from the corresponding lead wire via a pin. The other end of each linkage frame 7421 is rotatably connected to the outer wall of the drive roller 75 via a pin, and the axis of the rotatable connection is not the same as the axis of the drive roller 75 itself.

[0073] Reference Figure 5 , Figure 6 and Figure 7Initially, the drive roller 75 and the roller body 721 rotate in the same direction and at the same angular velocity, and the reinforcing frame 741 is in the open state. When the lead wire falls into the transport groove 7221 via the guide groove 7111, the rotation speed of the drive roller 75 changes, causing the drive roller 75 to rotate relative to the roller body 721. At this time, the drive roller 75 drives each linkage frame 7421 to rotate, which in turn drives the corresponding reinforcing frame 741 to rotate, thus driving each reinforcing frame 741 to come into contact with one side of the lead wire and reinforce the lead wire.

[0074] Reference Figure 5 , Figure 6 and Figure 7 Subsequently, the rotational speed of the drive roller 75 changes and becomes the same as that of the roller body 721. After the shearing blade 51 on the shearing roller 5 has finished shearing the lead wire, the rotational speed of the drive roller 75 changes again, causing the drive roller 75 to rotate in the opposite direction relative to the roller body 721. At this time, the drive roller 75 drives the reinforcing frame 741 to rotate in the opposite direction through the linkage frame 7421, causing the reinforcing frame 741 to open again, thereby allowing the axial diode to fall onto the tilting frame 8. Then, the next axial diode falls into the next transport groove 7221.

[0075] Reference Figure 5 , Figure 7 and Figure 8 The tilting frame 8 is rotatably connected to the equipment body 4 at one end near the shearing roller 5. The equipment body 4 is also provided with a rotating assembly 9. In this embodiment, two rotating assemblies 9 are provided, located on opposite sides of the tilting frame 8. Each rotating assembly 9 includes an extension frame 91, an abutment frame 92, and a transmission frame 93. Each extension frame 91 is fixedly sleeved on the corresponding roller body 721, and each extension frame 91 extends outward with several abutment portions 911. The number of abutment portions 911 is the same as the number of transport grooves 7221 on the transport piece 722.

[0076] Reference Figure 5 and Figure 8 Each abutment frame 92 is slidably connected to the equipment body 4, and each abutment frame 92 is located on the displacement path of each abutment part 911 on the corresponding additional frame 91. One end of each transmission frame 93 is rotatably connected to the corresponding abutment frame 92 by a pin, and the other end of each transmission frame 93 is rotatably connected to the tilting frame 8 by a pin.

[0077] Reference Figure 5 and Figure 8Each abutment frame 92 is also fitted with a return spring 94. Each return spring 94 is located on the side of the corresponding abutment frame 92 away from the tilt frame 8, and one end of each abuts against the corresponding abutment frame 92, and the other end abuts against the equipment body 4, so as to realize the reset of the abutment frame 92 by its own elastic force.

[0078] Reference Figure 5 , Figure 7 and Figure 8 Initially, the end of the tilting frame 8 furthest from the shearing roller 5 is at its lowest position. After the shearing roller 5 has finished shearing the lead wire, the reinforcing frame 741 rotates relative to the transport piece 722, gradually opening. At this point, the abutting part 911 on the additional frame 91 abuts against the abutting frame 92, gradually pushing the abutting frame 92 to slide. This causes the abutting frame 92 to drive the tilting frame 8 upwards via the transmission frame 93. When the reinforcing frame 741 is fully opened, the abutting frame 92 is at the end of its sliding path, with the end of the abutting frame 92 furthest from the shearing roller 5 at the top of its displacement path. Afterward, the axial diode falls onto the abutting frame 92.

[0079] The implementation principle of the lead wire cutting device in Embodiment 3 of this application is as follows: When the lead wire part falls into the transport groove 7221 via the guide groove 7111, the rotation speed of the drive roller 75 changes, thereby causing the drive roller 75 to rotate relative to the roller body 721. At this time, the drive roller 75 drives each linkage frame 7421 to rotate, thereby causing the linkage frame 7421 to drive the corresponding reinforcement frame 741 to rotate, thereby driving each reinforcement frame 741, so that the reinforcement frame 741 is in contact with one side of the lead wire part to reinforce the lead wire part.

[0080] Subsequently, the rotational speed of the drive roller 75 changes and becomes the same as that of the roller body 721. After the shearing blade 51 on the shearing roller 5 has finished shearing the lead wire, the rotational speed of the drive roller 75 changes again, causing the drive roller 75 to rotate in the opposite direction relative to the roller body 721. At this time, the drive roller 75 drives the reinforcing frame 741 to rotate in the opposite direction through the linkage frame 7421, causing the reinforcing frame 741 to open again, thereby allowing the axial diode to fall onto the tilting frame 8. Subsequently, the next axial diode falls into the next transport groove 7221.

[0081] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A fabrication process for an axial diode, characterized in that: Includes the following steps: One lead assembly: one lead (3) is placed in the first tunnel track and heated, and solder wire is used to feed the lead (3) to the nail head. After melting, it is shaped by the shaping rod and the first tin layer is formed. Chip assembly: Place the chip (1) on the first tin layer, press down and then cool; Another lead assembly: The other lead (3) is placed in the second tunnel track and heated. Solder wire is fed to the nail head of the lead (3). After melting, the second tin layer is formed by shaping with a shaping rod. Two leads are bonded together: the lead (3) in the second tunnel track is placed above the lead (3) in the first tunnel track, and the second tin layer on the lead (3) in the second tunnel track contacts the chip (1), and is then pressed down and cooled. Cutting excess leads: Remove the excess part of the axial diode lead (3) using a lead cutting device; The lead wire cutting device includes a device body (4), a cutting roller (5), a rotating component (6) and a transport mechanism (7). The cutting roller (5) is rotatably connected to the device body (4). The rotating component (6) is used to drive the cutting device to rotate. The transport mechanism (7) is used to move the axial diode that has been transported to a direction closer to the cutting roller (5). The transport mechanism (7) includes a guide assembly (71), a transport roller (72), and a transport component (73). The transport roller (72) is located on one side of the shearing roller (5) and is rotatably connected to the equipment body (4). A plurality of transport grooves (7221) are provided on the side wall of the transport roller (72), and the lead portion of the axial diode extends outward through the transport groove (7221). The guide assembly (71) is used to transport the lead portion of the axial diode into the transport groove (7221). The transport component (73) is used to drive the transport roller (72) to rotate, thereby bringing the axial diode closer to the shearing roller (5). The transport mechanism (7) further includes a reinforcing component (74), a drive roller (75), and a drive member (76). The number of the reinforcing components (74) is set to several, and they correspond one-to-one with the transport trough (7221). Each reinforcing component (74) includes a reinforcing frame (741) and a linkage member (742). Each reinforcing frame (741) is rotatably connected to the transport roller (72) and is located on the side of the corresponding axial diode away from the transport trough (7221), and is abutting against the axial diode. The transport roller (72) is sleeved on the drive roller (75) and is rotatably connected to the drive roller (75). The drive member (76) is used to drive the drive roller (75) to rotate relative to the transport roller (72). The drive roller (75) drives the reinforcing frame (741) to rotate through the linkage member (742).

2. The processing technology for an axial diode according to claim 1, characterized in that: Each of the linkage components (742) includes a linkage frame (7421). One end of each linkage frame (7421) is rotatably connected to the drive roller (75), and the rotation point is offset from the axis of the drive roller (75). The other end is rotatably connected to the corresponding reinforcement frame (741), and the rotation point is offset from the rotation point of the corresponding reinforcement frame (741) itself.

3. The processing technology for an axial diode according to claim 1, characterized in that: Below the shearing roller (5) is an inclined frame (8). The inclined frame (8) is rotatably connected to the equipment body (4) at one end near the shearing roller (5). The equipment body (4) is also provided with a rotating component (9). The transport roller (72) drives the inclined frame (8) to rotate through the rotating component (9).

4. The processing technology for an axial diode according to claim 3, characterized in that: The rotating assembly (9) includes an extension frame (91), an abutment frame (92), and a transmission frame (93). The extension frame (91) is mounted on the transport roller (72). The abutment frame (92) is slidably connected to the equipment body (4) and located on the displacement path of the extension frame (91). One end of the transmission frame (93) is rotatably connected to the abutment frame (92), and the other end is rotatably connected to the tilting frame (8).

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