A novel semiconductor wafer-specific film-coating device and its coating method

Abstract

This invention relates to the field of wafer equipment technology, and provides a novel semiconductor wafer-specific film-coating device and method. The film-coating device includes an uncut film-coating separation device, which includes a film-coating separation plate that abuts against the lower uncut bottom film, providing the bottom film with a material that effectively overcomes the adhesive force between the film-coating and the bottom film. This invention uses a cutting blade to cut the special film-coating into a pre-cut shape, with the upper bottom film and the middle special film cut through, while the lower uncut bottom film is retained. Subsequently, the lower uncut bottom film is peeled off as a whole. This method abandons the prior art method of pre-cutting and then continuously pasting adhesive film onto the surface of the first film layer. On the one hand, it can ensure the integrity of the lower uncut bottom film, avoid adhesive residue, and improve subsequent utilization rate. On the other hand, since the upper bottom film and the middle special film are cut through, there is no edge re-adhesion phenomenon of the cutting marks, avoiding film tearing or bottom film residue during peeling.

Description

Technical Field

[0001] This invention relates to the field of wafer equipment technology, and specifically to a novel semiconductor wafer-specific film-coating device and its coating method. Background Technology

[0002] According to publication number CN118342775A, patent title: Film application device and film application method, a pre-cutting unit pre-cuts a composite film roll with a first film layer, a second film layer and a third film layer into a circular structure consistent with the wafer, forming a cutting mark that penetrates the first film layer and the second film layer. In subsequent operations, the first region on the first film layer, the second region on the second film layer and the third region on the second film layer are bonded together and then torn off together. The film layers of the first region and the second region on the first film layer are connected by an adhesive film, leaving adhesive residue on its surface. These residues are difficult to remove and affect subsequent use.

[0003] In this circular structure, the adhesive force between different film layers at the cut marks may cause edge re-adhesion. If the adhesive force is too great, the re-adhesion at the cut marks between the film layers may easily cause the film paper to tear or the bottom film to remain during the subsequent film removal process.

[0004] The entire film application process involves multiple steps, requiring precision and high standardization. The operation is relatively complex and demands a high level of skill from the operators. Any deviation can lead to poor film application. Therefore, we propose a novel film application device and method specifically for semiconductor wafers. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this invention provides a novel semiconductor wafer-specific film-coating device and its coating method, which overcomes the deficiencies of existing technologies, has a reasonable design, a compact structure, and solves the problems mentioned in the background art.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] A novel semiconductor wafer-specific film-paper lamination equipment includes a pre-cutting supply device, a film-paper processing device, a wafer lamination platform, a wafer lamination device, and a film head positioning device. The pre-cutting supply device and the film-paper processing device are located on the same side of the wafer lamination platform. The wafer lamination device and the film head positioning device are slidably mounted on the wafer lamination platform via two parallel guide rails.

[0010] The pre-cutting supply device includes a cutting blade. The cutting blade is located on the surface of the roller and is also provided with flanges that extend horizontally to both sides. The flanges smoothly transition with the surface of the roller. The special film paper is cut into a pre-cut shape by the cutting blade. The special film paper has a three-layer structure. The adhesion between the upper bottom film and the middle special film is relatively small, while the adhesion between the middle special film and the lower uncut bottom film is relatively large. The upper bottom film and the middle special film are cut through, while the lower uncut bottom film is retained in its pre-cut shape.

[0011] The membrane paper processing device includes an uncut membrane paper separation device, which includes a front membrane paper separation plate and a rear lower bottom film recycling device. The membrane paper separation plate abuts against the uncut membrane paper, causing the lower uncut bottom film to bend. The membrane paper separation plate provides pressure to the bottom film that can effectively overcome the adhesive force between the membrane paper and the bottom film without causing the bottom film to tear due to excessive pressure, so as to prevent the bottom film from being left behind or torn while separating. The membrane paper separation plate can also make the lower uncut bottom film conveyed and recycled in the reverse direction along the dedicated membrane paper conveying direction.

[0012] The film paper processing device also includes a film head height adjustment device and an end roller device that works in conjunction with the film head positioning device, so that the special film paper is maintained at the height of the film application platform installed on the wafer film application platform, and the film application roller pressing device on the wafer film application device presses the special film paper onto the wafer on the film application platform.

[0013] (III) Beneficial Effects

[0014] This invention provides a novel semiconductor wafer-specific film-coating device and method. It offers the following advantages:

[0015] 1. This invention uses a cutting blade to cut a special film paper into a pre-cut shape, with the upper bottom film and middle special film cut through, while the lower uncut bottom film is retained. Subsequently, the lower uncut bottom film is peeled off as a whole. This method abandons the previous technique of pre-cutting and then continuously pasting adhesive film onto the surface of the first film layer. On the one hand, it can ensure the integrity of the lower uncut bottom film, avoid adhesive residue, and improve subsequent usability. On the other hand, since the upper bottom film and middle special film are cut through, there is no edge re-adhesion phenomenon of the cutting marks, which avoids film paper tearing or bottom film residue during peeling.

[0016] 2. This invention can realize a fully automated production process from raw material feeding to finished product unloading. It is easy to operate and has a low threshold for use by enterprises.

[0017] 3. This invention enables the cutting of the film paper to be completed simultaneously with the supply of the film paper, eliminating the need for a dedicated film paper cutting tool like most similar equipment. This can greatly improve production efficiency and effectively reduce the production costs of user companies or lower the cost and threshold of equipment maintenance.

[0018] 4. The entire set of functional mechanisms of this invention is designed to be very compact, allowing the equipment to be arranged in a relatively small space.

[0019] 5. Through the precise design of the inter-roller combination, this invention can achieve targeted and precise control at the cutting nodes such as the film paper supply end, film tearing end, film application end, and recycling end, and can be applied to more types of film paper, making it very versatile. Attached Figure Description

[0020] Figure 1 It is a schematic diagram of the structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the overall structure of the present invention;

[0022] Figure 3 This is a schematic diagram of the pre-cutting supply device of the present invention;

[0023] Figure 4 This is a schematic diagram of the material roll motor of the present invention;

[0024] Figure 5 This is a schematic diagram of the roller drive motor of the present invention;

[0025] Figure 6 This is a schematic diagram of the special film paper for this invention;

[0026] Figure 7 For the present invention Figure 6 A cross-sectional schematic diagram;

[0027] Figure 8 This is a schematic diagram of the film paper processing device of the present invention;

[0028] Figure 9 This is a schematic diagram of the film paper supply device of the present invention;

[0029] Figure 10 This is a schematic diagram of the film paper leveling device of the present invention;

[0030] Figure 11 This is a schematic diagram of the uncut film-paper separation device of the present invention;

[0031] Figure 12 This is a schematic diagram of the membrane head height adjustment device of the present invention;

[0032] Figure 13 This is a schematic diagram of the pre-cut film bottom film winding device of the present invention;

[0033] Figure 14 This is a schematic diagram of the film application platform of the present invention;

[0034] Figure 15This is a schematic diagram of the film-applying roller pressing device and the end roller device of the present invention;

[0035] Figure 16 This is a schematic diagram of the film-applying roller pressing device of the present invention;

[0036] Figure 17 This is a schematic diagram of the end roller device of the present invention;

[0037] Figure 18 This is a schematic diagram of the active drive device of the present invention;

[0038] Figure 19 This is a schematic diagram of the upper bottom film recycling device of the present invention;

[0039] Figure 20 This is a schematic diagram of the film-stretching device of the present invention;

[0040] Figure 21 This is a schematic diagram of the upper bottom film recycling reel of the present invention;

[0041] Figure 22 This is a schematic diagram of the process of the present invention.

[0042] In the diagram: 1. Pre-cutting supply device; 101. Raw material roll fixing device; 10101. Vacuum generator; 10102. Raw material roll fixing shaft; 10103. Reference ring; 103. Special film paper; 104. Film paper roller; 105. Cutting knife; 106. Thin cylinder; 107. Film paper guide shaft; 108. Material roll motor; 109. Roller drive motor;

[0043] 2. Film paper processing device; 201. Film paper supply device; 20101. Film paper drive roller; 20102. Film paper driven roller; 20103. Supply motor; 20104. Supply cylinder;

[0044] 202. Film paper leveling device; 20201. Lower leveling roller; 20202. Upper leveling roller; 20203. Leveling cylinder;

[0045] 203. Uncut film-paper separation device; 20301. Bottom film separation motor; 20302. Film-paper separation plate; 20303. Film-paper separation drive roller; 20304. Film-paper separation driven roller; 20305. Lower layer uncut bottom film;

[0046] 204. Bottom film recycling device; 205. Bottom film recycling reel; 206. Film head height adjustment device; 20601. Pre-cut film paper; 207. Film paper processing substrate;

[0047] 208. Pre-cut film backing film winding device; 20801. Pre-cut film backing film motor; 20802. Pre-cut film backing film roll; 20804. Pre-cut film backing film bonding shaft; 20805. Pre-cut film cylinder; 20806. Pre-cut film backing film;

[0048] 3. Wafer lamination platform; 30101. Negative pressure suction nozzle; 30102. Wafer tray; 30103. Lifting platform bottom plate; 30104. Lifting platform linear guide rail; 30105. Lifting platform bottom plate; 302. Lamination platform; 303. Main substrate;

[0049] 4. Wafer lamination device; 401. Lamination roller pressing device; 40101. Lamination roller shaft; 40102. Roller shaft support; 40103. Lamination cylinder; 40104. Heating rod; 402. Guide rail;

[0050] 5. Film head positioning device; 501. End roller device; 50101. Three-section roller; 50102. End bracket; 50105. Flattening cylinder;

[0051] 502. Active drive device; 50201. Film application roller motor; 50204. Film application roller lead screw; 50205. Positioning roller lead screw; 50206. Positioning roller motor;

[0052] 6. Upper bottom film recovery device; 601. Film pulling device; 60101. Recovery drive roller; 60102. Recovery driven roller; 60103. Recovery cylinder; 60104. Recovery driven synchronous pulley; 60105. Bottom film recovery drive synchronous pulley; 60106. Bottom film recovery synchronous belt; 60107. Recovery motor; 602. Upper bottom film guide shaft;

[0053] 603. Upper bottom film recovery reel; 60301. Remaining bottom film recovery shaft; 60302. Bottom film fixing clamp; 60303. Bottom film recovery shaft connecting seat; 60304. Recovery reel motor; 60305. Reel motor drive synchronous pulley; 60306. Reel motor synchronous belt; 60307. Recovery shaft synchronous pulley; 60308. Damper synchronous belt; 60309. Damper synchronous pulley; 604. Remaining bottom film recovery device bracket; 605. Remaining bottom film. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0055] See attached document Figure 1-22 A novel semiconductor wafer-specific film paper laminating equipment includes a pre-cutting supply device 1, which includes a raw material roll fixing device 101 for placing the film paper raw material roll. The film paper roll is fixed by generating negative pressure adsorption through a vacuum generator 10101 embedded in the raw material roll fixing shaft 10102. A reference ring 10103 is sleeved on the end of the raw material roll fixing shaft 10102 to measure the installation reference.

[0056] In order to drive the raw material roll fixing shaft 10102, a material roll motor 108 is also included. Through the active synchronous pulley installed on its output shaft, the power of the material roll motor 108 is transmitted to the driven synchronous pulley through the synchronous belt. The driven synchronous pulley and the raw material roll fixing shaft 10102 are coaxially fixedly engaged, thereby transmitting the power of the material roll motor 108 to the raw material roll to realize the supply of raw material film paper.

[0057] It also includes a guide shaft, which is used to limit and guide the direction of the special film paper 103, and a low-damping bearing is built into the guide shaft to avoid relative sliding friction between the guide shaft and the special film paper 103.

[0058] See attached document Figure 6 The special film paper 103 is a special film paper for wafer bonding. It consists of three layers. The first and third layers are used to protect the bottom film of the middle layer. The middle layer is the bonding layer that needs to be bonded. When the special film paper 103 is conveyed to the cutting blade 105 for pre-cutting, the adhesion between the upper bottom film and the middle special film is relatively small, while the adhesion between the middle special film and the lower uncut bottom film 20305 is relatively large.

[0059] See attached document Figure 7 The cutting blade 105 is a specially designed cutting blade with a pre-shaped cutting edge on its roller surface. The cutting edge is also provided with a flange extending horizontally to both sides on the roller surface. The flange and the roller surface are smoothly transitioned. When the special film paper 103 is squeezed and cut by the cutting blade 105 and the film paper roller 104, the upper bottom film and the middle special film of the special film paper 103 are cut through, while the lower bottom film is retained. The special film paper 103 continues to be conveyed to the next process with the pre-cut marks and still in the form of three-layer film paper.

[0060] The film paper roller 104 set on the upper part of the dicing blade 105 has the function of ensuring that the special film paper 103 does not slide relative to the dicing blade 105 when the special film paper 103 is cut, ensuring that the cutting marks are consistent with the preset pattern. After the film is applied to the wafer, it is cut into shape by the subsequent film cutting device. It can be a circle, a square or other irregular shape, and the pre-cut pattern can completely cover the wafer.

[0061] The pre-cutting supply device 1 also uses a thin cylinder 106, the output end of which is connected to the mounting bracket of the dedicated cutting blade 105. Its function is to control the lifting and lowering of the cutting blade 105. Roller adjusting bolts 10502 are installed on both sides of the mounting bracket of the film paper roller 104 to control the height of the film paper roller 104. The roller adjusting bolts 10502, together with the thin cylinder 106, can adjust the distance between the film paper roller 104 and the cutting blade 105 to ensure that the force on the left and right ends of the dedicated film paper 103 is consistent and to ensure that the film paper does not slip.

[0062] A roller drive motor 109 is connected to the end of the cutting blade 105 to control its rotation. The speed of the roller drive motor 109 is matched with that of the material roll motor 108 to ensure that the special film paper 103 remains straight while being conveyed without external force, thus ensuring that the pre-cutting of the special film paper 103 achieves the preset effect.

[0063] The pre-cutting supply device 1 also includes a film paper guide shaft 107 with a low-damping bearing, which is used to position and guide the direction of the special film paper 103 while avoiding sliding friction with the special film paper 103. A bushing is sleeved on the film paper guide shaft 107 and the bushing is fixed on the film paper guide shaft 107 by bolts. The spacing control size can be adjusted by moving the bushing according to different products.

[0064] The pre-cutting supply device 1 also includes a device substrate 110, which serves as a substrate for mounting all the above functional units and is also the assembly basis for each functional unit.

[0065] It also includes a film paper processing device 2, which includes a film paper supply device 201. The film paper supply device 201 includes a drive unit and a pressing unit. The drive unit includes, specifically, a film paper active roller 20101 driven to rotate by a supply motor 20103, wherein a film paper driven roller 20102 that moves relative to the film paper active roller 20101 is driven to rise and fall by a supply cylinder 20104, and is guided by a linear guide rail and its movement and tracking are restricted.

[0066] The pressing unit includes two supply cylinders 20104 whose output ends are connected to the mounting bracket of the film paper driven roller 20102 to control the pressure between the film paper driven roller 20101 and the film paper active roller 20101, so that the film paper active roller 20101, the film paper driven roller 20102, and the special film paper 103 have no relative sliding friction, ensuring that the film paper will not slide and rub on the roller and supplying the pre-cut special film paper 103 to the next process;

[0067] The surfaces of both the active roller 20101 and the driven roller 20102 of the film paper can be made of silicone rubber to increase the friction between them and the film paper.

[0068] The film paper processing device 2 also includes a film paper leveling device 202, which re-presses and leveles the pre-cut special film paper 103 before the bottom film is separated. The purpose is to correct the deformation problem during the conveying process and make the holding force of the adhesive layer uniform, which is beneficial to the subsequent bottom film tearing process. Specifically, the leveling upper roller 20202 serves as the driven wheel of the film paper supply device 201, guiding and positioning the direction of the film paper. The leveling lower roller 20201 is controlled by two leveling cylinders 20203. In automatic operation, the leveling cylinders 20203 level the contact between the lower roller 20201 and the leveling upper roller 20202 and generate a certain pressure. Through the pressure between the rollers, this pressure can force the film paper to stick tightly to the surface of the rollers, which can achieve uniform tension on the film paper. This uniform tension helps to maintain the straightness of the film paper and prevent deformation caused by uneven tension, thereby eliminating wrinkles, ripples or other irregular deformations that may occur in the film paper during the conveying process.

[0069] The membrane paper processing device 2 also includes an uncut membrane paper separation device 203 and a lower bottom film recycling device 204, which separate the lower uncut bottom film 20305 of the special membrane paper 103. The uncut membrane paper separation device 203 includes a front membrane paper separation plate 20302 and a rear lower bottom film recycling device 204. The membrane paper separation plate 20302 abuts against the uncut membrane paper, causing the lower uncut bottom film 20305 to bend, while the lower bottom film recycling device 204 and the membrane paper are flattened. The structure of device 202 is consistent with its function of clamping and transferring the lower uncut bottom film 20305, so that the lower uncut bottom film 20305 can be separated from the uncut film paper and placed into the lower bottom film recycling device 204. The film paper separation plate 20302 applies appropriate pressure to the bottom film, which can effectively overcome the adhesive force between the film paper and the bottom film, and will not cause the bottom film to tear due to excessive pressure. While achieving separation, it prevents the bottom film from being left behind or torn, ensuring the quality of the special film paper 103.

[0070] The lower layer bottom film recycling device 204 includes a bottom film recycling reel 205, which is used to recycle the lower layer uncut bottom film 20305 separated from the previous process. Specifically, the bottom film recycling motor drives the active synchronous pulley, synchronous belt, and driven synchronous pulley to synchronize the output of the motor to the uncut bottom film recycling roller shaft, thereby completing the recycling of the lower layer uncut bottom film 20305.

[0071] Reference Appendix Figure 12 The film paper processing device 2 also includes a film head height adjustment device 206, whose structure is the same as the pressing unit in the film paper supply device 201. Its function is to control the height position of the pre-cut film paper 20601 during wafer lamination. Specifically, when laminating in the subsequent process, the film head on the film paper supply side needs to be kept as consistent as possible with the height of the lamination platform. Its function is to ensure that the position of the film does not change during the wafer lamination process, thereby improving the lamination quality.

[0072] See attached document Figure 13 The film paper processing device 2 also includes a pre-cut film paper bottom film winding device 208, whose structure is the same as that of the material roll motor 108 of the raw material roll fixing device 101. A front mechanism is set in front of the pre-cut film paper bottom film winding device 208. The difference between the front mechanism and the film paper leveling device 202 is that a pre-cut film bottom film bonding shaft 20804 is sleeved on the roller. The pre-cut film bottom film bonding shaft 20804 sticks the pre-cut film bottom film 20806 and completes the process of peeling off the pre-cut film bottom film 20806. After peeling off the film, the pre-cut film bottom film 20806 is stuck together with the peeled special film paper 103.

[0073] The membrane paper processing device 2 also includes a membrane paper processing substrate 207, which serves as the substrate for mounting all the above functional units and is also the assembly basis for each functional unit.

[0074] It also includes a wafer bonding platform 3, including a bonding platform 302 mounted on the main substrate 303;

[0075] The film application platform 302 includes a lifting platform bottom plate 30103 fixed on the bottom of 303. The lifting platform bottom plate 30103 is connected to the lower bottom plate 30105 of the lifting platform through the lifting platform linear guide rail 30104 to form a fixed frame. A lifting motor 30107 is connected to the bottom of the lower bottom plate 30105. The lead screw connected to the output end of the lifting motor 30107 drives the wafer tray 30102 to rise and fall. The lead screw drives the wafer tray 30102 to be equipped with a negative pressure suction nozzle 30101 for adsorbing wafers.

[0076] The surface of the film application platform 302 has anti-stick properties to prevent the film from sticking to devices other than the wafer during the film application process.

[0077] A wafer bonding device 4 and a film head positioning device 5 are slidably disposed on the main substrate 303;

[0078] The wafer lamination apparatus 4 includes a lamination roller pressing device 401, which is used to apply special film paper to the wafer. This device includes two parallel guide rails 402 mounted on the main substrate 303. A roller support 40102 is slidably mounted on the guide rails 402, rolling the special film paper 103 from the left side of the wafer to the right side, fully covering the entire area of ​​the wafer, thus completing one film paper lamination roller pressing process. The roller support 40102 is connected to a mounting frame for the lamination roller 40101, and the mounting frame is equipped with a lamination cylinder 40103 for pressing the lamination roller 40101 and a linear guide rail for guiding the direction. The lamination roller 40101 is used to roll and apply the film paper after the wafer comes into contact with it. The two guide rails 402 support the lamination roller pressing device 401 and guide its linear reciprocating motion in the left-right direction.

[0079] To further improve the film application quality, a heating rod 40104 is also provided so that the film application roller 40101 is heated to a certain temperature when rolling the film paper.

[0080] The film head positioning device 5 includes an end roller device 501 with the same structure as the wafer laminating device 4. Its purpose is to press the film paper down to the height of the laminating platform 302. The difference is that the laminating roller 40101 is replaced with a three-section roller 50101, which is formed by three sections of rollers sleeved on the same shaft and can slide along its axis. A pair of flattening cylinders 50105 are installed on its mounting frame to drive the two end rollers of the three-section roller 50101 to push outwards. Specifically, a sliding roller is slidably sleeved on the shaft, and an outward-pushing roller is sleeved on the sliding roller. The flattening cylinders 50105 drive the sliding roller to move laterally on the shaft, achieving lateral movement while the roller rotates. After pushing, the wafer laminating device 4 rolls the film, achieving the effect of flattening the special film paper to be laminating, thus completing the laminating process and ensuring the flatness of the film paper during lamination.

[0081] Under the action of the end roller device 501 and the film head height adjustment device 206, the film paper is stretched and flattened so that the film application roller pressing device 401 can ensure the stability of the film paper when applying the film.

[0082] It also includes an active drive device 502, which serves as the power source for driving the film-applying roller pressing device 401 and the end roller device 501.

[0083] The device includes a film-applying roller screw 50204 and a positioning roller screw 50205 mounted above the guide rail 402, as well as a film-applying roller motor 50201 and a positioning roller motor 50206. The film roller motor 50201 is connected to the two film-applying roller screws 50204 via a synchronous belt to drive the film-applying roller pressing device 401 to slide along the guide rail 402. Similarly, the positioning roller motor 50206 drives the roller screw 50205 to drive the end roller device 501 to slide along the guide rail 402, so that the force is evenly distributed.

[0084] The upper bottom film recycling device 6 includes a film pulling device 601 that automatically recycles the remaining bottom film 605 after film application. The active recycling roller 60101 pulls the remaining bottom film 605 back to the subsequent recycling mechanism by rotation. The driven recycling roller 60102 works in conjunction with the active recycling roller 60101 to clamp and recycle the remaining bottom film 605 to the subsequent recycling mechanism. The recycling cylinder 60103, when its piston rod extends, drives the driven recycling roller 60102 to generate a certain squeezing force between it and the active recycling roller 60101, thereby clamping the remaining bottom film 605. The recycling motor 60107... Its function is to drive the active recycling roller 60101 to rotate, and cooperate with the driven recycling roller 60102 to recycle the remaining bottom film 605. Specifically, it drives the active recycling synchronous wheel 60105, which is coaxially connected to the output shaft of the recycling motor 60107, to rotate. This drives the cooperating bottom film recycling synchronous belt 60106 to transmit the output of the recycling motor 60107 to the driven recycling synchronous wheel 60104. The driven recycling synchronous wheel 60104 and the active recycling roller 60101 are coaxially and fixedly connected. Ultimately, this drives the active recycling roller 60101 to rotate, cooperating with the driven recycling roller 60102 to recycle the clamped remaining bottom film 605.

[0085] The structure of the upper bottom film guide shaft 602 is the same as that of the film paper guide shaft 107, so as to control the conveying trajectory of the recycled guide remaining bottom film 605.

[0086] The upper bottom film recycling reel 603 is a device for the final recycling and temporary storage of the remaining bottom film 605. The remaining bottom film recycling shaft 60301 is used to wind up the remaining bottom film 605 to be recycled. The remaining bottom film fixing clamp 60302 is a mechanism for fixing the remaining bottom film 605 wound on the remaining bottom film recycling shaft 60301. Specifically, it tightly presses the film head of the remaining bottom film 605 onto the remaining bottom film recycling shaft 60301 to prevent it from falling off during subsequent recycling processes.

[0087] The function of the bottom film recovery shaft connector 60303 is to connect and fix the upper bottom film recovery reel 603 to the mounting base. The function of the recovery reel motor 60304 is to drive the remaining bottom film recovery shaft 60301 to rotate and complete the recovery of the remaining bottom film 605. The reel motor drive synchronous pulley 60305 is coaxially fixed to the output shaft of the recovery reel motor 60304, and the recovery shaft synchronous pulley 60307 is coaxially fixed to one end of the remaining bottom film recovery shaft 60301. The reel motor synchronous belt 60306 is a mechanism that transmits the output generated by the recovery reel motor 60304 to the remaining bottom film recovery shaft 60301. Rotation damper 603... The function of 10 is to provide a certain degree of stability to the rotation. The damper synchronous wheel 60309 is a synchronous wheel coaxially fixed to the shaft of the rotation damper 60310. The function of the damper synchronous belt 60308 is to connect the damper synchronous wheel 60309 and the recovery shaft synchronous wheel 60307. Specifically, it is to prevent the residual bottom film recovery shaft 60301 from rotating in the opposite direction during the recovery of the residual bottom film 605, thereby avoiding problems such as the residual bottom film 605 falling off. The residual bottom film recovery device bracket 604 serves as the mounting base for the above-mentioned functional devices and is also a device for connecting the bottom film recovery device and the main base plate 303.

[0088] A novel method for applying a film-paper coating specifically for semiconductor wafers includes the following steps:

[0089] S1. Install the raw material film paper on the raw material roll fixing shaft 10102, press the inner side of the raw material film paper roll tightly against the reference ring 10103, turn on the vacuum generator 10101 to adsorb and fix the raw material film paper, and fix the film head on the raw material film paper roll between each roller as required. Each functional unit is in standby state as required.

[0090] S2. The material roll motor 108 rotates according to the controller's instructions, driving the active synchronous pulley, synchronous belt, and driven synchronous pulley to rotate synchronously, thereby causing the raw material roll fixed shaft 10102 and the raw material film roll fixed on the bearing to rotate, and start supplying film to the equipment.

[0091] S3. After the film paper passes around the guide shaft, the roller drive motor 109 drives the cutting knife 105 to rotate, which drives the film paper roller 104 to move along with it, thereby driving the film paper pressed between the two to be conveyed forward. During the process, the special cutting blades on the surface of the cutting knife 105 pre-cut the film paper to be used later, and convey the cut film paper to the next process. During the process, the special film paper continues to be conveyed in the form of a three-layer film.

[0092] S4. After bypassing the film paper guide shaft 107, the pre-cut special film paper is conveyed to the film paper supply device 201. The supply motor 20103 rotates according to the controller command and transmits the output to the film paper drive roller 20101 through the coupling. At this time, the piston rod of the supply cylinder 20104 is in the extended state, that is, the film paper driven roller 20102 is pressed tightly on the film paper drive roller 20101, thereby transmitting the rotation state on the film paper drive roller 20101 to the film paper driven roller 20102, and then driving the special film paper passing between the two to continue to be conveyed to the next stage.

[0093] S5. At the position of the pre-cut film paper bottom film winding device 208, the piston rod extending from the pre-cut film cylinder 20805 causes the pre-cut film bottom film bonding shaft 20804 to adhere to the pre-cut film paper. The pre-cut film bottom film motor 20801 rotates according to the controller command and transmits the output to the pre-cut film bottom film roll 20802 through the synchronous belt pulley mechanism. The vacuum generator is turned on and adsorbs the pre-cut film bottom film 20806, thereby peeling the pre-cut film bottom film 20806 from the three layers of pre-cut film paper, completing the automatic recycling of the pre-cut bottom film.

[0094] S6. The special film paper with the pre-cut lower bottom film peeled off is positioned at the film paper leveling device 202. The leveling cylinder 20203 extends and presses the lower leveling roller 20201 and the upper leveling roller 20202 together. Both the lower leveling roller 20201 and the upper leveling roller 20202 are coated with an anti-stick coating. The special film paper with the pre-cut lower bottom film peeled off passes between them, improving the overall flatness of the film paper in the subsequent film application process.

[0095] S7. After completing the previous process, the special film paper, from which the pre-cut lower bottom film has been peeled off, passes through the film paper separation plate 20302, which has an anti-stick coating on its surface. The lower bottom film is separated. Specifically, the bottom film separation motor 20301 rotates according to the controller's command, driving the coupling coaxially connected to it, which in turn drives the coaxially connected film paper separation active roller 20303 to rotate. The piston rod of the bottom film separation cylinder 20306 pushes out, causing the film paper separation driven roller 20304 connected to it to press against the film paper separation active roller 20303, thereby causing the film paper separation driven roller 20304 to... 04. As they rotate together, the peeled lower bottom film passing between them is conveyed to the next process. The film head of the peeled lower bottom film is pressed by the fixing mechanism onto the uncut bottom film recycling roller. The bottom film recycling motor rotates according to the controller's instructions, driving the active synchronous pulley connected to it on the same axis, driving the synchronous belt, and driving the driven synchronous pulley. The driven synchronous pulley is coaxially and fixedly connected to the uncut bottom film recycling roller, thereby transmitting the output of the bottom film recycling motor to the uncut bottom film recycling roller that has fixed the peeled lower bottom film film head, completing the fully automatic recycling of the peeled lower bottom film.

[0096] S8. The peeled-off lower layer film is pressed down and fixed by the film head height adjustment device 206. Specifically, the piston rod of the adjustment cylinder extends and drives the film head height roller connected to it to descend to the height of the film application platform 302. At the same time, the end roller device 501 is pressed down and fixed. Specifically, the piston rod of the cylinder extends and drives the three-section roller 50101 connected to it to descend to the height of the film application platform 302. At the same time, the piston rod of the flattening cylinder 50105 extends, causing the outer ends of the three-section roller 50101 to be pushed outward, thereby flattening the special film paper. The film paper to be applied is flattened and fixed at all ends of the film application platform 302.

[0097] S9. When the two ends of the film paper are flattened and fixed and spread out on the film application platform 302, the wafer is loaded into the concentric position of the wafer tray 30102 by the mechanical fingers. The vacuum generator module is turned on and the negative pressure nozzle 30101 generates negative pressure through the air passage to fix the wafer position. The film application platform lifting motor 30107 rotates according to the controller command. The output of the film application platform lifting motor 30107 is transmitted to the wafer fixed on the wafer tray 30102 through the ball screw module 30106 via the synchronous belt module 30108, so that its height is raised to the film application platform 302.

[0098] S10. After the wafer reaches the height of the film-coating platform 302, the film-coating roller motor 50201 drives the film-coating roller screw 50204, causing the film-coating roller pressing device 401 to move to the set position. The piston rod of the film-coating cylinder 40103 extends, driving the film-coating roller 40101 connected to it to move downwards to the height of the film-coating platform 302. At this time, the temperature of the heating rod 40104 has risen to the set temperature. The film-coating roller 40101 contacts the upper layer of the special film paper. The left and right ends of the special film paper are pressed to the height of the film-coating platform 302 by the end roller device 501 and the film head height adjustment device 206 and fixed flat. The film-coating roller motor 50201 rotates, and transmits the output to the two film-coating roller screws 50204 through the synchronous belt pulley mechanism, pushing the film-coating roller pressing device 401 to move from left to right, completing the film paper coating process with the wafer.

[0099] S11. After the wafer is coated, the rollers of the end roller device 501 and the film head height adjustment device 206 rise, the wafer fixing platform 301 descends with the coated wafer, and the robot arm takes it away.

[0100] S12. The recycling motor 60107 rotates according to the controller's instructions, driving the recycling driven synchronous wheel 60104, the bottom film recycling synchronous belt 60106, and the bottom film recycling active synchronous wheel 60105 connected to it, transmitting the output to the recycling active roller 60101. At the same time, the piston rod of the recycling cylinder 60103 extends and drives the recycling driven roller 60102 connected to it, making it close to the recycling active roller 60101, thereby transmitting the output to the recycling driven roller 60102 to make it rotate, so that the remaining film paper sandwiched between the two is transported to the next process.

[0101] S13. Guided by the upper bottom film guide shaft 602, the remaining film paper is automatically recycled by the upper bottom film recycling reel 603. Specifically, the recycling reel motor 60304 rotates according to the controller command, driving the reel motor drive synchronous wheel 60305, reel motor synchronous belt 60306, and recycling shaft synchronous wheel 60307 connected to it to transmit the output to the remaining bottom film recycling shaft 60301. The remaining film paper with the film head fixed by the remaining bottom film fixing clamp 60302 is wound on the recycling drive roller 60101 to complete the recycling.

[0102] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0103] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A novel semiconductor wafer-specific film-paper laminating equipment, comprising a pre-cutting supply device (1), a film-paper processing device (2), a wafer laminating platform (3), a wafer laminating device (4), and a film head positioning device (5). The pre-cutting supply device (1) and the film-paper processing device (2) are disposed on the same side of the wafer laminating platform (3). The wafer laminating device (4) and the film head positioning device (5) are slidably disposed on the wafer laminating platform (3) via two parallel guide rails (402). Its features are: The pre-cutting supply device (1) includes a cutting blade (105). The blade of the cutting blade (105) is located on the surface of the roller and is also provided with a flange extending horizontally to both sides. The flange and the surface of the roller are smoothly transitioned. The special film paper (103) is cut into a pre-cut shape by the cutting blade (105). The special film paper (103) has a three-layer structure. The adhesion between the upper bottom film and the middle special film is relatively small. The adhesion between the middle special film and the lower uncut bottom film (20305) is relatively large. The upper bottom film and the middle special film are cut through. The lower uncut bottom film (20305) is retained in a pre-cut shape. The membrane paper processing device (2) includes an uncut membrane paper separation device (203), which includes a front membrane paper separation plate (20302) and a rear lower bottom film recycling device (204). The membrane paper separation plate (20302) presses against the uncut membrane paper to bend the lower uncut bottom film (20305). The membrane paper separation plate (20302) provides pressure to the bottom film that can effectively overcome the adhesive force between the membrane paper and the bottom film without causing the bottom film to tear due to excessive pressure, so that the bottom film is separated while preventing the bottom film from being left behind or torn. The membrane paper separation plate (20302) can also make the lower uncut bottom film (20305) transported and recycled in the reverse direction along the conveying direction of the special membrane paper (103). The film paper processing device (2) also includes a film head height adjustment device (206) and an end roller device (501) that works with the film head positioning device (5) to keep the special film paper (103) at the height of the film application platform (302) installed on the wafer film application platform (3), and the film application roller pressing device (401) on the wafer film application device (4) presses the special film paper (103) onto the wafer on the film application platform (302) by the film application roller pressing device (4).

2. The novel semiconductor wafer-specific film-paper laminating equipment as described in claim 1, characterized in that: The end roller device (501) includes a three-section roller (50101) fixed by a mounting frame, and a pair of counter-arranged flattening cylinders (50105) fixed on the mounting frame. The two end rollers of the three-section roller (50101) are driven by the flattening cylinders (50105) to push them outward, flattening the special film paper (103) to be applied.

3. The novel semiconductor wafer-specific film-paper lamination equipment as described in claim 1, characterized in that: The film head positioning device (5) further includes an active drive device (502). The active drive device (502) includes a film application roller screw (50204) and a positioning roller screw (50205) installed above the guide rail (402), as well as a film application roller motor (50201) and a positioning roller motor (50206). The film application roller motor (50201) is connected to the two film application roller screws (50204) through a synchronous belt to drive the film application roller pressing device (401) to slide along the guide rail (402). Similarly, the positioning roller motor (50206) drives the positioning roller screw (50205) to drive the end roller device (501) to slide along the guide rail (402), so that the force is uniform.

4. The novel semiconductor wafer-specific film-paper laminating equipment as described in claim 1, characterized in that: The film-applying roller device (401) includes a film-applying roller (40101) connected by a mounting frame and a roller bracket (40102) connected to the bottom of the mounting frame. The roller bracket (40102) is slidably engaged with the guide rail (402).

5. The novel semiconductor wafer-specific film-paper lamination equipment as described in claim 1, characterized in that: The film paper processing device (2) also includes a lower bottom film recycling device (204). The lower bottom film recycling device (204) includes a bottom film recycling reel (205) and a bottom film recycling motor. The bottom film recycling motor drives the active synchronous wheel, the synchronous belt, and the driven synchronous wheel to synchronize the output of the motor to the uncut bottom film recycling roller shaft, thereby completing the recycling of the lower uncut bottom film (20305).

6. The novel semiconductor wafer-specific film-paper laminating equipment as described in claim 1, characterized in that: The film head height adjustment device (206) includes a mounting frame and an adjustment cylinder mounted on the mounting frame. The adjustment cylinder controls the film head height adjustment roller to drive up and down, thereby controlling the height of the special film paper (103).

7. The novel semiconductor wafer-specific film-paper laminating equipment as described in claim 1, characterized in that: The end roller device (501) includes an end bracket (50102) and a three-section roller (50101) connected by a mounting frame. A pair of flattening cylinders (50105) are mounted on the mounting frame and their output ends are connected to the rotating shafts at both ends of the three-section roller (50101). The end roller cylinders mounted on the end bracket (50102) are connected to the mounting frame to control the height increase and decrease of the roller.

8. The novel semiconductor wafer-specific film-paper laminating equipment as described in claim 1, characterized in that: The wafer lamination platform (3) includes a lamination platform (302) with anti-stick properties installed on the main substrate (303). The lamination platform (302) includes a lifting platform bottom plate (30103) fixed on the bottom of the main substrate (303). The lifting platform bottom plate (30103) is connected to the lifting platform bottom plate (30105) through the lifting platform linear guide rail (30104) to form a fixed frame. A lifting motor (30107) is connected to the bottom of the lifting platform bottom plate (30105). The lead screw connected to the output end of the lifting motor (30107) drives the wafer tray (30102) to rise and fall. The lead screw drives the wafer tray (30102) to be provided with a negative pressure suction nozzle (30101) for adsorbing wafers.

9. The novel semiconductor wafer-specific film-paper laminating equipment as described in claim 1, characterized in that: It also includes an upper bottom film recycling device (6), which includes a film pulling device (601). The film pulling device (601) includes a recycling active roller (60101) and a recycling driven roller (60102) that work together to recycle the remaining bottom film (605) of the special film paper (103). The upper bottom film recycling device (6) also includes an upper bottom film recycling reel (603) for storing the remaining bottom film (605), and a rotation damper (60310) that cooperates with the upper bottom film recycling reel (603) to prevent the upper bottom film recycling reel (603) from rotating in the opposite direction.

10. The method for applying a novel semiconductor wafer-specific film paper according to claim 1, comprising the following steps: S1. Feeding: The film heads on the raw material film paper roll are inserted and fixed between the rollers as required, and the film paper is then fed into the equipment. S2, pre-cut material, the special cutting blade preset on the surface of the cutting knife (105) pre-cuts the film paper to be used later into a three-layer film and continues to be conveyed; S3, feeding, film paper feeding device (201), feeding motor (20103) rotates according to controller command, film paper driven roller (20102) is pressed tightly on film paper active roller (20101); S4. Film peeling and recycling: At the position of the pre-cut film paper bottom film winding device (208), the vacuum generator adsorbs the pre-cut film bottom film (20806), thereby peeling the pre-cut film bottom film (20806) from the three layers of film paper that have been pre-cut, and completing the recycling. S5. Leveling: The special film paper with the pre-cut lower layer film peeled off is placed at the film paper leveling device (202) to improve the overall flatness of the film paper in the subsequent film application process. S6. After completing the previous process, the special film paper with the pre-cut lower bottom film peeled off passes through the film paper separation plate (20302) with an anti-stick coating on its surface. The lower bottom film is separated, and the piston rod of the bottom film separation cylinder (20306) is pushed out, so that the film paper separation driven roller (20304) connected to it and the film paper separation active roller (20303) are pressed together. The peeled lower bottom film is conveyed backward and pressed by the fixing mechanism on the uncut bottom film recycling roller. The bottom film recycling motor completes the fully automatic recycling of the peeled lower bottom film. S7. The peeled lower bottom film paper is lowered to the height of the film application platform (302) by the extension of the piston rod of the adjusting cylinder; the end roller device (501) drives the three-section roller (50101) connected to it to lower to the height of the film application platform (302), and at the same time, the piston rod of the flattening cylinder (50105) extends, causing the outer ends of the three-section roller (50101) to be pushed outward by the adhesive-coated shaft, thereby flattening the special film paper; S8. When the two ends of the film paper are flattened and fixed and laid flat on the film application platform (302), the wafer is loaded into the concentric position of the wafer tray (30102) by the mechanical fingers. The negative pressure suction nozzle (30101) generates negative pressure to fix the position of the wafer. The film application platform lifting motor (30107) lifts the wafer fixed on the wafer tray (30102) to the film application platform (302). S9. After the wafer reaches the height of the film application platform (302), the film application roller motor (50201) drives the film application roller screw (50204) to move the film application roller pressing device (401) to the height of the film application platform (302). At this time, the temperature of the heating rod (40104) has risen to the set temperature. The film application roller (40101) contacts the upper layer of the special film paper. The left and right ends of the special film paper are pressed to the height of the film application platform (302) and fixed flat by the end roller device (501) and the film head height adjustment device (206). The film application roller motor (50201) rotates to push the film application roller pressing device (401) to move from left to right to complete the film paper and wafer application process. S10. After the wafer is coated, the rollers of the end roller device (501) and the film head height adjustment device (206) rise, the wafer fixing platform (301) lowers with the coated wafer, and the robot takes it away. S11. The recycling motor (60107) transmits its output to the recycling drive roller (60101). At the same time, the recycling cylinder (60103) drives the recycling driven roller (60102) to fit tightly against the recycling drive roller (60101), thereby conveying the remaining film paper sandwiched between the two to the next process. S12. After being guided by the upper bottom film guide shaft (602), the remaining film paper is automatically recycled by the upper bottom film recycling reel (603).

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