A low-temperature signal line connection component for quantum computing

Abstract

The present invention relates to the field of low temperature signal lines for quantum computing, and includes: a heat sink plate, on which a plurality of mounting holes are arranged in an array; a low temperature attenuator is arranged in some or all of the mounting holes, and the signal line can be electrically connected to the low temperature attenuator; an extrusion piece is also arranged in some or all of the mounting holes, and the extrusion piece can move between a first position and a second position relative to the mounting hole; in the first position, a gap is formed between the left extrusion groove and the right extrusion groove for the signal line to pass freely; in the second position, the left extrusion groove and the right extrusion groove squeeze the signal line to deform it. The present invention can effectively reduce the influence of the triboelectric effect, and at the same time, the extrusion piece can be used as a heat conduction piece for the signal line to achieve efficient heat conduction.

Description

Technical Field

[0001] The present invention relates to the field of low temperature, and in particular to a low temperature signal line connection component for quantum computing. Background Art

[0002] The dilution refrigerator is an important component of the superconducting quantum computer. Superconducting quantum chips and various low-temperature electronic devices are installed on the cold plate of the dilution refrigerator. The quantum chip control signals and measurement signals of the superconducting quantum chips and various low-temperature electronic devices require a large number of ultra-low temperature signal lines for transmission.

[0003] Dilution refrigerators are often pre-cooled using pulse tube refrigerators or GM refrigerators. The cold head of the pulse tube refrigerator or GM refrigerator is thermally coupled with the cold plate of the dilution refrigerator. The pulse tube refrigerator or GM refrigerator will generate noise and vibration when working, and the above vibration will be transmitted to the low temperature signal line through the cold plate.

[0004] The internal stratification temperature of the dilution refrigerator is between mK and tens of K. The low-temperature signal line will undergo continuous heat conversion with the extremely low temperature environment around it due to the heat generated by the signal line itself or the heat brought by the outside world. Since the signal line itself is a multi-layer structure, due to the different materials, various materials will be misaligned during the hot-cold conversion process. The above-mentioned misalignment of the low-temperature signal line and the influence of the above-mentioned vibration will produce a "triboelectric" effect, and the surface of the signal line will accumulate electric charges, thereby affecting the transmission of the signal. Foreign scholars "Rachpon Kalra" and others have studied the above phenomenon and proposed through experiments that the signal line can be partially squeezed and deformed to keep the layers fixed, thereby significantly reducing the "triboelectric" effect.

[0005] In actual applications, although the squeezed and deformed signal lines will reduce the impact of the "frictional electric" effect, there is still the following problem: after long-term use, the new squeezed signal lines will be deformed again and will still produce the "frictional electric" effect due to the influence of vibration.

[0006] Therefore, how to effectively reduce the "triboelectric" effect in the long term is still a problem that needs to be solved. Summary of the invention

[0007] The present invention is proposed to alleviate or solve at least one aspect or at least one point of the above problems.

[0008] A low-temperature signal line connection assembly for quantum computing of the present invention comprises: a heat sink plate, on which a plurality of mounting holes are arranged in an array;

[0009] A cryogenic attenuator is arranged in part or all of the mounting holes, and the signal line is electrically connected to the cryogenic attenuator;

[0010] An extrusion piece is also arranged in part or all of the mounting holes, and the extrusion piece includes a left extrusion block and a right extrusion block;

[0011] The left extrusion block includes a left inner surface and a left outer surface, the left inner surface is formed with a left extrusion groove, and the left outer surface includes a left guide surface and a left locking surface; the right extrusion block includes a right inner surface and a right outer surface, the right inner surface is formed with a right extrusion groove, and the right outer surface includes a right guide surface and a right locking surface;

[0012] The extrusion member is movable between a first position and a second position relative to the mounting hole;

[0013] In the first position, a gap is formed between the left extrusion groove and the right extrusion groove for the signal line to pass freely;

[0014] In the second position, the left extrusion groove and the right extrusion groove squeeze the signal line to deform it.

[0015] Preferably, in the first position, the left extrusion block and the right extrusion block are separately arranged, and the lower part of the left guide surface and the lower part of the right guide surface are both in contact with the inner wall of the mounting hole; in the second position, the left extrusion block and the right extrusion block are abutted together, and the left locking surface and the right locking surface are tightly fitted with the inner wall of the mounting hole.

[0016] Preferably, the left guide surface and the right guide surface are both formed into a structure that is smaller at the bottom and larger at the top.

[0017] Preferably, in the second position, the left extrusion block and the right extrusion block protrude above a predetermined height of the mounting hole.

[0018] Preferably, in the second position, the space between the left extrusion groove and the right extrusion groove is filled with thermal conductive adhesive.

[0019] Preferably, the left locking surface is a semi-cylindrical surface, and the right locking surface is a semi-cylindrical surface; the left guide surface is a frustum surface, and the right guide surface is a frustum surface.

[0020] Preferably, the cross-section of the left extrusion groove is a "["-shaped structure, and the cross-section of the right extrusion groove is a "]"-shaped structure.

[0021] Preferably, the signal line comprises a three-layer structure, the innermost layer is a conductor layer, the middle layer is an insulating layer, and the outermost layer is a covering layer; in the second position, at least the middle layer and the outermost layer are deformed.

[0022] Preferably, a connecting edge is further provided on the heat sink plate, and a fastening hole is formed on the connecting edge.

[0023] Preferably, the extrusion is made of oxygen-free copper.

[0024] The present invention effectively combines the extrusion part with the heat sink plate, and through the cooperation between the extrusion part and the mounting hole, the signal line can be kept in an extruded state for a long time, thereby effectively reducing the influence of friction electricity for a long time. In addition, the extrusion part can be used as a heat sink for the signal line to better achieve the heat dissipation of the cable and prevent the heat brought from the outside or generated by the cable from entering the shielding layer of the next cold plate. The cold plate in the present invention can also be called a cold plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A three-dimensional schematic diagram of a low-temperature signal line connection assembly for quantum computing according to an exemplary embodiment of the present invention.

[0026] Figure 2 A schematic top view of a low-temperature signal line connection assembly for quantum computing according to an exemplary embodiment of the present invention.

[0027] Figure 3 for Figure 2 Schematic diagram of the AA section view.

[0028] Figure 4 for Figure 3 An enlarged schematic diagram of point I.

[0029] Figure 5 It is a front view schematic diagram of a low-temperature signal line connection assembly for quantum computing according to an exemplary embodiment of the present invention.

[0030] Figure 6 A schematic side view of a low-temperature signal line connection assembly for quantum computing according to an exemplary embodiment of the present invention.

[0031] Figure 7 This is one of the schematic diagrams of the cooperation between the extrusion piece and the mounting hole of an exemplary embodiment of the present invention.

[0032] Figure 8 This is the second schematic diagram of the cooperation between the extrusion part and the mounting hole of an exemplary embodiment of the present invention.

[0033] Fig. 9 FIG. 1 is a schematic diagram of signal lines according to an exemplary embodiment of the present invention.

[0034] Fig.10 Schematic diagram of a signal line of an exemplary embodiment of the present invention (after extrusion).

[0035] Fig.11 This is a schematic diagram of the cooperation between a low-temperature signal line connection assembly for quantum computing and a cold plate according to an exemplary embodiment of the present invention.

[0036] Fig.12 A schematic diagram of a low-temperature signal line connection assembly for quantum computing according to another exemplary embodiment of the present invention.

[0037] Among them: 10-heat sink plate, 11-mounting hole, 12-fastening hole; 20-left extrusion block, 21-left guide surface, 22-left locking surface, 23-left extrusion groove; 30-right extrusion block, 31-right guide surface, 32-right locking surface, 33-right extrusion groove; 40-signal line, 41-conducting layer, 42-insulating layer, 43-coating layer; 50-attenuator; 60-cold plate, 61-incision. DETAILED DESCRIPTION

[0038] The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention, and should not be construed as a limitation of the present invention. In the present invention, the same reference numerals represent the same or similar components.

[0039] The features described herein can be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided to illustrate only some of the many possible ways to implement the methods, devices, and / or systems described herein, which will be clear after understanding the disclosure of the present invention.

[0040] Although terms such as "first", "second", and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions should not be limited by these terms. Instead, these terms are only used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion.

[0041] In the specification, when an element (such as a layer, a region, or a substrate) is described as being “on”, “connected to”, or “coupled to” another element, the element may be directly “on”, “connected to”, or “coupled to” another element, or one or more other elements may be present therebetween. Conversely, when an element is described as being “directly on”, “directly connected to”, or “directly coupled to” another element, there may be no other elements present therebetween.

[0042] The terms used herein are only used to describe various examples and are not intended to limit the disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms "comprise", "include" and "have" indicate the presence of the described features, quantities, operations, components, elements and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements and / or combinations thereof.

[0043] In order to enable those skilled in the art to use the contents of the present invention, the following exemplary embodiments may be provided in combination with specific application scenarios, specific systems, parameters of devices and components, and specific connection methods. However, for those skilled in the art, these embodiments are only examples, and the general principles defined herein may be applied to other embodiments and application scenarios without departing from the spirit and scope of the present invention.

[0044] According to an exemplary embodiment of the present invention: Figure 1-Figure 8 As shown, the low-temperature signal line connection assembly for quantum computing of the present invention comprises: a heat sink plate 10, and a plurality of mounting holes 11 are arranged in an array on the heat sink plate 10. Figure 1 , Figure 2 As shown, 15 columns and 9 rows of holes are schematically provided, through which 135 signal lines 40 can be connected.

[0045] Each mounting hole 11 is provided with an attenuator 50, and the signal line 40 can be electrically connected to the attenuator 50, thereby improving the accuracy of signal transmission. Preferably, the attenuator 50 is a low-temperature attenuator, which is an existing component and is fixed in the mounting hole 11 by means of threads or clamping. The attenuator 50 can be connected to the signal line 40 by means of a connector such as SMA. Figure 3 , Figure 4 As shown, schematically, the upper and lower signal lines 40 are both connected to the attenuator 50. Schematically, the main body of the attenuator 50 is located in the mounting hole 11, and the lower joint protrudes from the heat sink plate 10. Of course, the joint part can also be located inside the mounting hole 11, which is within the protection scope of the present invention.

[0046] like Figure 1-Figure 4 , Figure 7 and Figure 8 As shown, Figure 7 , Figure 8 For the sake of clarity, schematically, an extrusion piece is provided in only one mounting hole 11, and the extrusion piece includes a left extrusion block 20 and a right extrusion block 30. The left extrusion block 20 and the right extrusion block 30 are mirror-symmetrical structures, and the structures and shapes of the two are exactly the same; Figure 1-Figure 4 , schematically, an extrusion piece is installed in each mounting hole 11.

[0047] like Figure 4 , Figure 7 and Figure 8As shown, the left extrusion block 20 includes a left inner surface and a left outer surface, the left inner surface is formed with a left extrusion groove 23, and the left outer surface includes a left guide surface 21 and a left locking surface 22. The left locking surface 22 is formed as a semi-cylindrical surface, and its diameter is substantially the same as the diameter of the mounting hole 11. The left guide surface 21 is formed as a semi-conical surface, and its cross-sectional area gradually increases from bottom to top. The right extrusion block 30 includes a right inner surface and a right outer surface, the right inner surface is formed with a right extrusion groove 33, and the right outer surface includes a right guide surface 31 and a right locking surface 32; the right locking surface 32 is formed as a semi-cylindrical surface, and its diameter is substantially the same as the diameter of the mounting hole 11. The right guide surface 31 is formed as a semi-conical surface, and its cross-sectional area gradually increases from bottom to top. Both the left guide surface 21 and the right guide surface 31 are formed into a structure that is small at the bottom and large at the top.

[0048] like Figure 4 , Figure 7 and Figure 8 As shown, the extrusion member can move between a first position and a second position relative to the mounting hole 11; Figure 7 As shown, in the first position, a gap is formed between the left extrusion groove 23 and the right extrusion groove 33 for the signal line 40 to pass freely. In the first position, the left extrusion block 20 and the right extrusion block 30 are in a separated state, and the lower parts of the left guide surface 21 and the right guide surface 31 are close to the inner surface of the mounting hole 11, so that the left extrusion groove 23 and the right extrusion groove 33 can form a larger gap.

[0049] like Figure 4 , Figure 7 and Figure 8 As shown, in the first position, the left extrusion block 20 and the right extrusion block 30 are separately arranged, and the lower part of the left guide surface 21 and the lower part of the right guide surface 31 are in contact with the inner wall of the mounting hole 11; in the second position, the left extrusion block 20 and the right extrusion block 30 are in contact with each other, and the left locking surface 22 and the right locking surface 32 are in tight fit with the inner wall of the mounting hole 11. In the second position, the left extrusion block 20 and the right extrusion block 30 are in contact with each other, which produces extrusion deformation on the signal line 40 and keeps it in an extrusion state.

[0050] like Fig. 9 As shown, it is a common structure of a signal line 40 in a dilution refrigerator for quantum computing, which usually includes a three-layer structure, the inner layer is a conductor layer 41, which is usually made of copper (Cu), the middle layer is an insulating layer 42, which is usually made of polytetrafluoroethylene (PTFE) material, and the outer layer is a coating layer 43, which is also made of copper (Cu). The outer layer is a ground layer, which is usually connected to a heat sink and a cold plate 60 to better transfer heat.

[0051] like Fig.10As shown, it is the structure of the signal line 40 after extrusion, wherein schematically, after extrusion, the outer layer and the middle layer are deformed, so that the three-layer structure is more tightly combined together to prevent relative displacement caused by vibration, thereby reducing the triboelectric effect. Although schematically, the outer layer and the middle layer are deformed, it is obvious that the inner layer may also be deformed. However, deformation of the inner layer usually requires greater pressure, which may improperly cause damage to the signal line 40. Therefore, a better way is that the outer layer and the middle layer are deformed, while the inner layer is not deformed or is slightly deformed. However, the above-mentioned different ways are all within the scope of protection of the present invention.

[0052] like Figure 3 , Fig.11 As shown, Fig.11 The figure is a schematic diagram of the cooperation between the low-temperature signal line connection assembly for quantum computing and the cold plate of the dilution refrigerator, wherein a cutout 61 is provided on the cold plate 60 for installing the signal line 40 connection assembly, and a fixing hole is provided on the cutout 61 to cooperate with the fastening hole 12, so that it is firmly fixed on the cold plate 60.

[0053] like Figure 1 , Fig.11 and Fig.12 As shown, Fig.12 This is a schematic diagram of another deformable embodiment of a low-temperature signal line connection assembly for quantum computing, which differs from the aforementioned exemplary embodiment only in that the vertical lengths of the left extrusion block 20 and the right extrusion block 30 are extended, and other structures remain unchanged. That is, the vertical lengths of the left extrusion block 20 and the right extrusion block 30 can be extended to 1 / 5, 1 / 4 or more of the height between the upper and lower cold plates 60, thereby achieving a better effect.

[0054] The following is combined with Figure 1-Figure 12 , briefly describe the use process of the present invention:

[0055] Connect the signal line 40 to the attenuator 50 and install them in the mounting hole 11; place the extrusion piece in the first position, press down the left extrusion block 20 and the right extrusion block 30 until the left locking surface 22 and the right locking surface 32 are tightly fitted with the mounting hole 11.

[0056] Although, in the present invention, the cross-section of the left extrusion groove 23 is a "["-shaped structure, and the cross-section of the right extrusion groove 33 is a "]"-shaped structure, and the shape of the left extrusion groove 23 and the right extrusion groove 33 after being combined is a rectangle, it is obvious that other shapes can also be used, such as the left extrusion groove 23 and the right extrusion groove 33 are respectively semi-elliptical shapes, etc., all of which are within the protection scope of the present invention.

[0057] Although the present invention schematically implements the deformation of the signal line 40 through an extrusion, it is obvious that the signal line 40 can also be pre-deformed before installation. The pre-deformation of the signal line 40 can be a section or the entire length. As long as the extrusion of the present invention can maintain the deformation of a section of the signal line 40, the relative fixation of the three-layer structure can be achieved, and the present invention can be implemented. The above-mentioned various methods are all within the protection scope of the present invention.

[0058] The present invention can effectively complete the extrusion of the signal line 40 through the cooperation between the extrusion piece and the mounting hole 11, and can keep the signal line 40 in an extrusion holding state, thereby effectively reducing the influence of friction electricity for a long time.

[0059] When the left locking piece and the right locking piece of the extrusion piece of the present invention are locked, they protrude from the mounting hole 11 by a predetermined height. They can be made of high heat conductive materials such as oxygen-free copper, and the lower part of the outer surface of the left locking piece and the right locking piece is tightly matched with the inner surface of the mounting hole 11, so that they can replace the heat sink component of the signal line 40 and play the role of heat dissipation of the signal line 40.

[0060] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes may be made to the embodiments and combinations of elements may be made without departing from the principles and spirit of the invention, the scope of the invention being defined by the appended claims and their equivalents.

Claims

1. A low-temperature signal line connection assembly for quantum computing, characterized in that: include: A heat sink plate, wherein a plurality of mounting holes are arranged in an array on the heat sink plate; A cryogenic attenuator is arranged in part or all of the mounting holes, and the signal line is electrically connected to the cryogenic attenuator; An extrusion piece is also arranged in part or all of the mounting holes, and the extrusion piece includes a left extrusion block and a right extrusion block; The left extrusion block includes a left inner surface and a left outer surface, the left inner surface is formed with a left extrusion groove, and the left outer surface includes a left guide surface and a left locking surface; the right extrusion block includes a right inner surface and a right outer surface, the right inner surface is formed with a right extrusion groove, and the right outer surface includes a right guide surface and a right locking surface; The extrusion member is movable between a first position and a second position relative to the mounting hole; In the first position, a gap is formed between the left extrusion groove and the right extrusion groove for the signal line to pass freely; In the second position, the left extrusion groove and the right extrusion groove squeeze the signal line to deform it; In the first position, the left extrusion block and the right extrusion block are separately arranged, and the lower part of the left guide surface and the lower part of the right guide surface are both in contact with the inner wall of the mounting hole; in the second position, the left extrusion block and the right extrusion block are in contact with each other, and the left locking surface and the right locking surface are in tight fit with the inner wall of the mounting hole; The cross section of the left extrusion slot is a "["-shaped structure, and the cross section of the right extrusion slot is a "]"-shaped structure; The signal line consists of a three-layer structure, the innermost layer is the conductor layer, the middle layer is the insulation layer, and the outermost layer is the covering layer; In the second position, at least the middle layer and the outermost layer are deformed.

2. The low-temperature signal line connection assembly for quantum computing according to claim 1, characterized in that: The left guide surface and the right guide surface are both formed into a structure that is small at the bottom and large at the top.

3. The low-temperature signal line connection assembly for quantum computing according to claim 1, characterized in that: In the second position, the left extrusion block and the right extrusion block protrude above a predetermined height of the mounting hole.

4. The low-temperature signal line connection assembly for quantum computing according to claim 1, characterized in that: In the second position, the space between the left extrusion groove and the right extrusion groove is filled with thermal conductive adhesive.

5. The low-temperature signal line connection assembly for quantum computing according to claim 1, characterized in that: The left locking surface is a semi-cylindrical surface, and the right locking surface is a semi-cylindrical surface; the left guide surface is a frustum surface, and the right guide surface is a frustum surface.

6. The low-temperature signal line connection assembly for quantum computing according to claim 1, characterized in that: The heat sink plate is also provided with a connecting edge, and a fastening hole is formed on the connecting edge.

7. The low-temperature signal line connection assembly for quantum computing according to claim 1, characterized in that: The extrusions are made of oxygen-free copper.

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