LED product repair equipment and repair method

Abstract

The invention discloses LED product repair equipment and a repair method. The LED product repair equipment comprises a product bearing and moving device, a tin material supply device, a chip supply device, a spot tin removing final assembly module and a crystal taking and welding final assembly module. The product bearing and moving device comprises a workbench and a horizontal driving mechanism; the tin dispensing and removing final assembly module comprises a first moving mechanism and a first moving table, a removing mechanism and a tin dispensing mechanism are arranged on the first moving table, and the first moving mechanism is connected with the first moving table and can drive the tin dispensing mechanism to move to the position above the tin material supply device or the workbench; the crystal taking and welding general assembly module comprises a second moving mechanism and a second moving table, the second moving table is provided with a crystal taking mechanism and a laser welding mechanism, and the second moving mechanism is connected with the second moving table and can drive the crystal taking mechanism to move to the position above the chip supply device and the workbench; according to the invention, bad chips on the LED product can be removed one by one and replaced with new chips, and the repair efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED repair equipment, and in particular to an LED product repair equipment and a repair method. Background Art

[0002] In the related art, LED product rework equipment includes a product moving device, a rejection mechanism, a tinning mechanism, a crystal mounting mechanism and a welding mechanism, wherein the product moving device can drive the LED product to move along the X-axis direction, and the rejection mechanism, the tinning mechanism, the crystal mounting mechanism and the welding mechanism are arranged roughly along the X-axis direction, so that when the product moving device drives the LED product to pass through the rejection mechanism, the tinning mechanism, the crystal mounting mechanism and the welding mechanism in sequence, the rejection, tinning, mounting and welding of the defective chip can be completed respectively, so that the LED product can be effectively repaired; however, since there may be multiple defective chips in the LED product, this type of LED product rework equipment can only move to the downstream to proceed to the next step after completing the current repair step of all defective chips (for example, a new chip can only be mounted after all defective chips on the LED product are removed and tinned), so during the repair process, except for the mechanism corresponding to the current step operation, the remaining mechanisms will all be idle, so the rework efficiency is relatively low. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides an LED product repair device, which can replace defective chips on LED products with new chips one by one and is conducive to improving the repair efficiency.

[0004] The present invention also provides a repair method applied to the above LED product repair equipment.

[0005] According to the first aspect of the present invention, the LED product rework equipment includes a product carrying and moving device, a tin material supply device, a chip supply device, a tin spot removal and rejection assembly module, a crystal removal and welding assembly module and a control system; the product carrying and moving device includes a workbench and a horizontal driving mechanism, the workbench is connected to the horizontal driving mechanism, and can move along the X-axis direction and the Y-axis direction under the drive of the horizontal driving mechanism; the tin material supply device is arranged on the X-axis side of the product carrying and moving device, and is used to supply tin material; the chip supply device is arranged on the side of the product carrying and moving device away from the tin material supply device, and is used to supply chips; the tin spot removal and rejection assembly module includes a first moving mechanism and a first moving table, the first moving table is provided with a first positioning mechanism, a rejection mechanism and a tin spot mechanism, the first positioning mechanism is used to position defective chips on the LED product, and the rejection mechanism is used to reject defective chips on the LED product, the first moving mechanism is connected to the first moving table A movable table can be driven to move along the X-axis direction, so that the tinning mechanism can move to the tin material supply device to pick up the tin, and can move to the workbench to apply the tin material to the area of ​​the LED product where the chip is removed; the crystal taking and welding assembly module includes a second movable mechanism and a second movable table, the second movable table is provided with a laser welding mechanism and a crystal taking mechanism, the second movable mechanism is connected to the second movable table, and can drive the second movable table to move along the X-axis direction, so that the crystal taking mechanism can move to the chip supply device to pick up the chip, and can move to the workbench to attach the chip to the tinning area of ​​the LED product, and the laser welding mechanism is used to weld the chip attached to the tinning area by the crystal taking mechanism to the LED product; the control system is electrically connected to the horizontal driving mechanism, the tin material supply device, the chip supply device, the first movable mechanism, the first positioning mechanism, the removal mechanism, the tinning mechanism, the second movable mechanism, the laser welding mechanism and the crystal taking mechanism.

[0006] The LED product repair equipment according to the first aspect of the present invention has at least the following beneficial effects: During the process of repairing LED products, the LED product repair equipment of the present embodiment can first move the LED product to a preset position below the tinning and rejecting assembly module through the product carrying moving device, and then obtain the position information of the defective chip on the LED product through the first positioning mechanism, and then adjust the position of the LED product through the horizontal driving mechanism so that one of the defective chips moves to the rejecting position corresponding to the rejecting mechanism, and then the defective chip can be rejected by the rejecting mechanism; then the first moving mechanism drives the first moving platform to carry the tinning mechanism to move to the tin material supply device to take tin, and then the tinning mechanism is carried to move above the LED product, and then the tinning mechanism can be used to apply tin to the area where the LED product is to be rejected, so as to prepare for welding new chips; while rejecting the defective chips, taking tin and applying tin, the second moving mechanism can also be driven The second mobile platform carries the crystal retrieval mechanism and moves to the chip supply device to pick up a new chip, and then carries the crystal retrieval mechanism and the new chip to the position to be solidified located on one side of the workbench to wait for the tinning to be completed; then the second mobile mechanism drives the second mobile platform carrying the crystal retrieval mechanism to move above the tinning area of ​​the LED product, and the crystal retrieval mechanism is used to mount the new chip on the tinning area of ​​the LED product, and then the laser welding mechanism is used to weld the new chip to the LED product to complete the repair of a defective chip; then the above process is repeated multiple times to remove all defective chips and replace them with new chips; therefore, the LED product repair equipment of this embodiment can remove defective chips on the LED product one by one and replace them with new chips, and the crystal retrieval mechanism can operate synchronously with the removal mechanism and the tinning mechanism during the repair process, which is beneficial to improve the repair efficiency.

[0007] According to the LED product rework equipment of some embodiments of the first aspect of the present invention, the product carrying and moving device also includes a rotation drive mechanism, which is connected to the workbench and is used to drive the workbench to rotate in a horizontal plane, and the rotation drive mechanism is electrically connected to the control system.

[0008] According to some embodiments of the first aspect of the present invention, the LED product rework equipment further includes a product input device and a product output device, which are arranged on opposite sides of the X-axis direction of the product carrying moving device, and a product receiving mechanism is arranged on the workbench. The product receiving mechanism can be connected with the product input device or the product output device under the drive of the horizontal driving mechanism, and the product input device and the product output device are electrically connected to the control system.

[0009] According to some embodiments of the first aspect of the present invention, in the LED product repair equipment, the product receiving mechanism includes two first belt conveyor components that are spaced apart and arranged opposite to each other, the two first belt conveyor components are respectively used to carry two opposite edges of the LED product, each first belt conveyor component is provided with a product clamping mechanism, the product clamping mechanism includes a first clamping member and a lifting component, the first clamping member is connected to the frame of the first belt conveyor component, and is at least partially located above the conveying surface of the first belt conveyor component, the lifting component includes a lifting drive, a lifting synchronous member and a lifting member, the lifting member is slidably connected to the frame of the first belt conveyor component in a vertical direction, and is located below the conveying surface of the first belt conveyor component and the first clamping member, the lifting synchronous member is slidably connected to the frame of the first belt conveyor component in a horizontal direction, and a plurality of rollers spaced apart are provided on the lifting synchronous member, a plurality of oblique sliding grooves that slide in a one-to-one correspondence with the rollers are provided on the lifting member, the lifting drive is connected to the lifting synchronous member, and is used to drive the lifting synchronous member to slide horizontally.

[0010] According to the LED product repair equipment of some embodiments of the first aspect of the present invention, the product receiving mechanism is provided with a first product stopping mechanism, which is arranged between the two first belt conveyor assemblies and is used to stop the LED product to prevent the LED product from continuing to be conveyed backward.

[0011] In the LED product rework equipment of some embodiments of the first aspect of the present invention, the product output device includes a product output mechanism and a product testing mechanism, the product output mechanism includes two second belt conveyor modules that are spaced apart and relatively arranged, the two second belt conveyor modules are respectively used to carry two relative edges of the LED product, the product testing mechanism is arranged between the two second belt conveyor modules, and includes a lifting drive and a lifting platform, the upper surface of the lifting platform is provided with a test terminal, the test terminal is used to connect to the connection terminal on the LED product and supply power to the LED product.

[0012] According to the LED product repair equipment of some embodiments of the first aspect of the present invention, the product output device also includes a visual recognition mechanism, the visual recognition mechanism includes a visual recognition module arranged above the product output mechanism, the visual recognition module can obtain the image of the LED product on the product output mechanism and identify whether there are unlit chips in the LED product through the image, and the visual recognition module is electrically connected to the control system.

[0013] According to some embodiments of the LED product repair equipment of the first aspect of the present invention, the chip supply device includes a crystal plate switching platform, a crystal top mechanism and a crystal plate position adjustment mechanism. The crystal plate switching platform includes a turntable and a plurality of annular crystal plates connected to the circumference of the turntable. The annular crystal plates are used to support a diaphragm densely covered with chips. The crystal top mechanism is arranged on one side of the turntable. Each annular crystal plate can be moved to the top of the crystal top mechanism under the drive of the turntable. The crystal top mechanism includes a pin and a lifting drive module. The lifting drive module is connected to the pin and is used to drive the pin to rise and fall. When the pin is lifted, it can lift the chip on the diaphragm. The crystal plate position adjustment mechanism is connected to the crystal plate switching platform and is used to change the position of the annular crystal plate so that each chip on the annular crystal plate above the crystal top mechanism can be moved above the pin.

[0014] According to the LED product rework equipment of some embodiments of the first aspect of the present invention, the top crystal mechanism also includes a top rod assembly that can be telescopically arranged in the vertical direction, the top pin is connected to the top of the top rod assembly, the lifting drive module includes a motor and a cam connected to the motor output shaft, and the lower end of the top rod assembly abuts against the cam.

[0015] According to some embodiments of the second aspect of the present invention, the repair method is applied to the LED product repair equipment of the first aspect of the present invention, and the repair method includes the following steps: S100, controlling the horizontal driving mechanism to drive the workbench to carry the LED product to a preset position below the tinning and rejecting assembly module; S200, controlling the first positioning mechanism to obtain location information of defective chips on the LED product; S300, according to the position information of the defective chip, controlling the horizontal driving mechanism to adjust the position of the LED product, so that one of the defective chips moves to the rejection position corresponding to the rejection mechanism, and then the defective chip is rejected by the rejection mechanism; S400, controlling the first moving mechanism to drive the first moving platform to carry the tinning mechanism to move to the tin material supply device to take tin, then controlling the first moving mechanism to drive the first moving platform to carry the tinning mechanism to move above the LED product, and applying tin material to the area of ​​the LED product where the chip is removed by the tinning mechanism; S500, controlling the second moving mechanism to drive the second moving platform to carry the crystal picking mechanism to move to the chip supply device to pick up the chip, and then controlling the second moving mechanism to drive the second moving platform to carry the crystal picking mechanism to move to a position to be crystal bonded between the product carrying moving device and the chip supply device; S600, control the horizontal driving mechanism to drive the workbench to move toward the side close to the crystal taking mechanism, so that the tinning area on the LED product moves to the crystal bonding position, and synchronously control the second moving mechanism to drive the second moving platform to carry the crystal taking mechanism to move above the crystal bonding position; S700, mounting the chip on the tinning area of ​​the LED product by a crystal taking mechanism, and then welding the chip mounted on the tinning area to the LED product by a laser welding mechanism; S800, repeating the above steps S300 to S700 in a loop until all defective chips are replaced by new chips; wherein, step S500 is synchronously executed during the execution of steps S300 and S400.

[0016] The repair method according to some embodiments of the second aspect of the present invention has at least the following beneficial effects: By adopting the repair method of this embodiment, defective chips on LED products can be removed one by one and replaced with new chips, and during the repair process, the crystal removal mechanism can operate synchronously with the removal mechanism and the tinning mechanism, which is conducive to improving the repair efficiency.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the structure of an LED product repair device according to an embodiment of the present invention; Figure 2 for Figure 1 A top view of the LED product rework equipment shown; Figure 3 for Figure 2 The schematic diagram of the structure of the tin point removal assembly module after removing the first moving mechanism is shown in FIG. Figure 4 for Figure 3 The structural diagram of the rejection mechanism is shown in; Figure 5 for Figure 2 A structural schematic diagram of a tin material supply device shown in; Figure 6 for Figure 2 A schematic structural diagram of a chip supply device shown in; Figure 7 for Figure 6 The structural schematic diagram of the top crystal mechanism shown in; Figure 8 for Figure 7 A schematic diagram of the connection structure between the jacking drive module, the jacking rod assembly, the jacking seat and the jacking pin is shown in FIG; Fig. 9 for Figure 2A schematic structural diagram of the crystal extraction and welding assembly module after removing the second moving mechanism and the laser welding mechanism; Fig.10 for Figure 2 A schematic structural diagram of a chip angle detection device shown in; Fig.11 for Figure 2 A schematic diagram of the structure of the product carrying mobile device shown in FIG. Fig.12 for Fig.11 The structural diagram of the workbench shown in; Fig.13 for Fig.12 A schematic diagram of the structure of the lifting assembly shown in FIG. Fig.14 for Figure 2 A schematic diagram of the structure of the product input device shown in; Fig.15 for Figure 2 The structural schematic diagram of the product output device is shown in.

[0019] Reference numerals: Product carrying mobile device 10; workbench 11; first belt conveyor assembly 111; first clamping member 112; lifting driver 113; lifting synchronous member 114; roller 115; lifting member 116; oblique slide 117; first product stop mechanism 12; stop driver 121; stop member 123; horizontal drive mechanism 13; first X-axis driver 131; first Y-axis driver 132; rotation drive mechanism 14; tin material supply device 20; cleaning tank 2 1; slurry plate 22; chip supply device 30; crystal plate switching platform 31; turntable 311; annular crystal plate 312; crystal plate position adjustment mechanism 32; second X-axis driver 321; second Y-axis driver 322; crystal ejection mechanism 33; ejector pin 331; motor 332; cam 333; ejector assembly 334; X-axis adjustment slide 335; Y-axis adjustment slide 336; Z-axis adjustment slide 337; lifting seat 338; spot tin removal assembly module 40; first moving Mechanism 41; first moving platform 42; first camera assembly 431; height measuring assembly 432; rejection mechanism 44; rejection Y-axis driver 441; rejection lifting driver 442; rejection adsorption assembly 443; tinning mechanism 45; tinning driver 451; rubber cylinder 452; crystal retrieval welding assembly module 50; second moving mechanism 51; second moving platform 52; crystal retrieval mechanism 53; suction head 531; suction head rotation driver 532; suction head lifting driver 533; chip positioning camera 534; suction detection camera 535; chip angle detection device 60; chip angle detection camera 61; product input device 70; third belt conveyor assembly 71; barcode scanner 72; product output device 80; product output mechanism 81; second belt conveyor module 811; product testing mechanism 82; test driver 821; lifting platform 822; second product stopping mechanism 83; visual recognition mechanism 84; visual recognition module 841; beam 90. DETAILED DESCRIPTION

[0020] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0021] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, left, right, front, back, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0022] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0023] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0024] The following is the attached Figure 1 To Attachment Fig.15 , describing the LED product repair equipment of the first aspect embodiment of the present invention.

[0025] Reference Figures 1 to 3 ,as well as Fig. 9 and Fig.11The LED product rework equipment of this embodiment includes a product carrying and moving device 10, a tin material supply device 20, a chip supply device 30, a tin spot removal assembly module 40, a crystal extraction and welding assembly module 50 and a control system; the product carrying and moving device 10 includes a workbench 11 and a horizontal driving mechanism 13, the workbench 11 is connected to the horizontal driving mechanism 13, and can move along the X-axis direction and the Y-axis direction under the drive of the horizontal driving mechanism 13; the tin material supply device 20 is arranged on one side of the product carrying and moving device 10 in the X-axis direction, The chip supply device 30 is arranged on the side of the product carrying mobile device 10 away from the tin material supply device 20, and is used to supply chips; the tinning and rejecting assembly module 40 includes a first moving mechanism 41 and a first moving platform 42, and the first moving platform 42 is provided with a first positioning mechanism, a rejecting mechanism 44 and a tinning mechanism 45, the first positioning mechanism is used to locate the defective chips on the LED product, and the rejecting mechanism 44 is used to reject the defective chips on the LED product, the first moving mechanism 41 is connected to the first moving platform 42, and can The first movable table 42 can be driven to move along the X-axis direction, so that the tinning mechanism 45 can move to the tin material supply device 20 to take tin, and can move to the workbench 11 to apply the tin material to the area where the LED product chip is removed; the crystal taking welding assembly module 50 includes a second movable mechanism 51 and a second movable table 52, and the second movable table 52 is provided with a laser welding mechanism (not shown in the drawings) and a crystal taking mechanism 53. The second movable mechanism 51 is connected to the second movable table 52 and can drive the second movable table 52 to move along the X-axis direction, so that The crystal retrieval mechanism 53 can move to the chip supply device 30 to pick up the chip, and can move to the workbench 11 to mount the chip on the tinning area of ​​the LED product. The laser welding mechanism is used to weld the chip mounted by the crystal retrieval mechanism 53 to the tinning area on the LED product; the control system is electrically connected to the horizontal driving mechanism 13, the tin material supply device 20, the chip supply device 30, the first moving mechanism 41, the first positioning mechanism, the rejection mechanism 44, the tinning mechanism 45, the second moving mechanism 51, the laser welding mechanism and the crystal retrieval mechanism 53.

[0026] It should be understood that, in the process of repairing LED products, the LED product repair equipment of the present embodiment can first move the LED product to a preset position below the tinning and rejecting assembly module 40 through the product carrying moving device 10, and then obtain the position information of the defective chip on the LED product through the first positioning mechanism, and then adjust the position of the LED product through the horizontal driving mechanism 13 so that one of the defective chips moves to the rejection position corresponding to the rejection mechanism 44, and then the defective chip can be rejected by the rejection mechanism 44; then, the first moving mechanism 41 drives the first moving platform 42 to carry the tinning mechanism 45 to move to the tin material supply device 20 to take tin, and then drives the tinning mechanism 45 to move to the top of the LED product, and then the tinning mechanism 45 can be used to apply tin to the area where the LED product is to be rejected, so as to prepare for welding new chips; while rejecting the defective chips, taking tin and applying tin, the second moving mechanism 51 can be used to The second movable table 52 is driven to carry the crystal retrieval mechanism 53 to move to the chip supply device 30 to pick up a new chip, and then the crystal retrieval mechanism 53 is driven to carry the new chip to the position to be solidified located on one side of the workbench 11 to wait for the tinning to be completed; then the second movable table 52 is driven by the second movable mechanism 51 to carry the crystal retrieval mechanism 53 to move above the tinning area of ​​the LED product, and the new chip is mounted on the tinning position of the LED product by the crystal retrieval mechanism 53, and then the new chip is welded to the LED product by the laser welding mechanism, and the repair of a defective chip can be completed; then the above process is repeated many times to complete the removal of all defective chips and replace them with new chips; therefore, the LED product repair equipment of this embodiment can remove the defective chips on the LED product one by one and replace them with new chips, and the crystal retrieval mechanism 53 can work synchronously with the removal mechanism 44 and the tinning mechanism 45 during the repair process, which is beneficial to improve the repair efficiency.

[0027] It is understandable that, referring to Figure 1 and Figure 2 In some embodiments, the first moving platform 42 and the second moving platform 52 are slidably disposed on the same beam 90 extending along the X-axis direction. Similarly, the first moving mechanism 41 and the second moving mechanism 51 are also disposed on the beam 90.

[0028] It is understood that in some of these embodiments, reference Figure 3The first positioning mechanism includes a first camera component 431 and two height measuring components 432 fixedly arranged on the first moving platform 42, so as to obtain the precise position information of the height direction, X-axis direction and Y-axis direction of the LED product through the first camera component 431 and the two height measuring components 432, and the LED products are all powered on before rework and the position point information of each defective chip on the LED product is obtained, and then the precise position information of each defective chip on the LED product in the LED product rework equipment can be obtained based on the precise position information of the height direction, X-axis direction and Y-axis direction of the LED product in the rework equipment, and the position point information of each defective chip on the LED product can be converted to obtain the precise position information of each defective chip on the LED product in the LED product rework equipment.

[0029] It is understood that in some of these embodiments, reference Figure 3 The tinning mechanism 45 includes a tinning driver 451 and a rubber cylinder 452, wherein the tinning driver 451 is connected to the rubber cylinder 452 and can drive the rubber cylinder 452 to move up and down. Figure 5 The tin material supply device 20 includes a cleaning tank 21 and a slurry tray 22, wherein the slurry tray 22 stores the tin material, and the cleaning tank 21 is used to clean the dispensing head of the rubber cartridge 452, and refer to Figure 1 and Figure 2 The cleaning pool 21 and the slurry disk 22 are arranged on one side of the product carrying moving device 10 along the X-axis direction, so that the tinning mechanism 45 can pass over the cleaning pool 21 and the slurry disk 22 under the drive of the first moving mechanism 41, so that after the tinning mechanism 45 moves to the top of the cleaning pool 21, it can drive the glue cylinder 452 to move downward through the tinning driver 451, and make the glue dispensing needle of the glue cylinder 452 enter the cleaning pool 21, so as to clean the glue dispensing needle before taking the tin material, thereby preventing impurities from entering the slurry disk 22 and contaminating the tin material. When the tinning mechanism 45 moves to the top of the slurry disk 22, it can drive the glue cylinder 452 to move downward through the tinning driver 451, and make the glue dispensing needle of the glue cylinder 452 enter the slurry disk 22, so that the glue cylinder 452 can absorb the tin material in the slurry disk 22 through the glue dispensing needle.

[0030] It is understood that in some of these embodiments, reference Figure 4The reject mechanism 44 includes a reject Y-axis driver 441, a reject lifting driver 442 and a reject adsorption component 443, wherein the reject lifting driver 442 is connected to the driving end of the reject Y-axis driver 441, and the reject adsorption component 443 is connected to the driving end of the reject lifting driver 442. Before rejecting the defective chip, the horizontal driving mechanism 13 will drive the workbench 11 to move according to the position information of the defective chip to be rejected, and then adjust the position of the LED product so that the chip to be rejected can be located At the rejection position on one side of the Y-axis direction below the rejection mechanism 44, when rejecting the bad chip, the rejection adsorption component 443 first moves down to one side of the Y-axis direction of the chip to be rejected under the drive of the rejection lifting driver 442, and then the bad chip is removed from the LED product under the drive of the rejection Y-axis driver 441. At the same time, the rejection adsorption component 443 can also absorb the rejected bad chip and solder debris to avoid the bad chip and solder debris remaining on the LED product and affecting the mounting and welding of the new chip. It should be understood that since the rejection adsorption component 443 belongs to the prior art, it will not be described in detail here.

[0031] It is understood that in some of these embodiments, reference Figure 6The chip supply device 30 includes a crystal plate switching platform 31 and a crystal top mechanism 33, wherein the crystal plate switching platform 31 includes a turntable 311 and a plurality of annular crystal plates 312 connected to the circumference of the turntable 311, and the crystal top mechanism 33 is arranged on one side of the turntable 311, and each annular crystal plate 312 can be moved to the top of the crystal top mechanism 33 under the drive of the turntable 311; the crystal top mechanism 33 includes a top pin 331 and a lifting drive module, the lifting drive module is connected to the top pin 331, and is used to drive the top pin 331 to rise and fall, and the top pin 331 can lift the chip on the diaphragm when being lifted, so as to facilitate the separation of the chip from the diaphragm when the crystal retrieval mechanism 53 retrieves the crystal, so as to improve the success rate of crystal retrieval. It should be understood that LED products usually include a variety of chips for emitting light of different colors. Therefore, after removing the defective chips, it is necessary to mount the same type of chips with the same light color as the defective chips back on the LED products. Different annular crystal disks 312 are used to carry chip membranes of different light colors. Then, according to the light color of the defective chips removed, the annular crystal disk 312 with the corresponding light color chip can be switched to the top of the top crystal mechanism 33 through the turntable 311, so that the chip with the corresponding light color can be lifted by the top pin 331. In addition, since the diaphragm is densely covered with chips, in order to enable each chip on the diaphragm to be picked up by the crystal picking mechanism 53, the chip supply device 30 also includes a crystal disk position adjustment mechanism 32, which is connected to the crystal disk switching platform 31 and is used to adjust the position of the annular crystal disk 312, so that each chip on the annular crystal disk 312 located above the top crystal mechanism 33 can be moved to the top of the top pin 331, so that each chip on the diaphragm can be lifted by the top pin 331.

[0032] It should be understood that in one embodiment, reference Figure 6 The crystal disk position adjustment mechanism 32 includes a second X-axis driver 321 and a second Y-axis driver 322, wherein the second X-axis driver 321 is connected to the driving part of the second Y-axis driver 322, and the crystal disk switching platform 31 is connected to the driving part of the second Y-axis driver 322, so that the second X-axis driver 321 and the second Y-axis driver 322 can respectively drive the crystal disk switching platform 31 to move along the X-axis and the Y-axis.

[0033] It is understandable that, in some of the embodiments, the crystal ejection mechanism 33 further includes a push rod assembly 334 that can be telescopically arranged in the vertical direction, the push pin 331 is connected to the top of the push rod assembly 334, the lifting drive module includes a motor 332 and a cam 333 connected to the output shaft of the motor 332, and the lower end of the push rod assembly 334 abuts against the cam 333. It should be understood that by using the motor 332 and the cam 333 to drive the push pin 331 to lift, the consistency of each lifting stroke of the push pin 331 can be ensured, so as to improve the lifting accuracy, thereby improving the success rate of the crystal retrieval mechanism 53 in picking up the chip. For example, in some of the embodiments, refer to Figure 7 and Figure 8 The crystal ejection mechanism 33 includes an X-axis adjustment slide 335, a Y-axis adjustment slide 336, a Z-axis adjustment slide 337 and a lifting seat 338, wherein the X-axis adjustment slide 335 is connected to the driving part of the Y-axis adjustment slide 336, and the Z-axis adjustment slide 337 is connected to the driving part of the X-axis adjustment slide 335, and the lifting seat 338 is connected to the driving part of the Z-axis adjustment slide 337. The motor 332 in the lifting drive module is fixedly connected to the lifting seat 338, and the ejector rod assembly 334 can be slidably arranged in the vertical direction through the lifting seat 338, and then the X-axis, Y-axis and height directions of the ejector pin 331 can be adjusted respectively through the X-axis adjustment slide 335, the Y-axis adjustment slide 336, and the Z-axis adjustment slide 337, so that the ejector pin 331 can be accurately adjusted to a set position below the center of one of the annular crystal disks 312.

[0034] It is understood that in some of these embodiments, reference Fig. 9The crystal retrieval mechanism 53 includes a suction component, a chip positioning camera 534 and a suction detection camera 535; the suction component includes a suction head 531, a suction head rotation driver 532 and a suction head lifting driver 533, the suction head 531 is connected to the output shaft of the suction head rotation driver 532, and the suction head rotation driver 532 is connected to the driving part of the suction head lifting driver 533, so that when the crystal retrieval mechanism 53 moves to the corresponding position above the top crystal mechanism 33, the suction head 531 can be driven to move downward by the suction head lifting driver 533 to absorb the chip lifted from the diaphragm by the ejector pin 331 on the annular crystal plate 312, and when the chip sucked by the suction head 531 has an angular posture deviation, the suction head rotation driver 532 can be driven to move downward by the suction head lifting driver 533 to absorb the chip lifted from the diaphragm by the ejector pin 331. The suction head 531 is driven to rotate with the chip to adjust the angle posture; the chip positioning camera 534 is connected to one side of the suction component, and the shooting direction is downward to obtain the position of the chip in the annular crystal disk 312 located above the top crystal mechanism 33, so that the crystal disk position adjustment mechanism 32 can adjust any chip to the position above the ejector pin 331 according to the position of the chip detected by the chip positioning camera 534; the suction detection camera 535 is also arranged on one side of the suction component, and the shooting direction is toward the suction end of the suction head 531, and is used to detect whether the suction head 531 is adsorbed to the chip, and then when it is detected that the suction head 531 has not successfully adsorbed the chip, the crystal retrieval mechanism 53 can repeatedly pick up the chip again until the chip is successfully adsorbed.

[0035] It is understood that in some of these embodiments, reference Fig.10 The LED product repair equipment also includes a chip angle detection device 60, which is arranged between the product carrying mobile device 10 and the chip supply device 30. The chip angle detection device 60 includes a chip angle detection camera 61. The shooting direction of the chip angle detection camera 61 faces upward, and the crystal retrieval mechanism 53 can be moved to the position to be solidified located above the chip angle detection device 60 under the drive of the first moving mechanism 41. The chip angle detection camera 61 is used to detect the angle posture of the chip sucked by the suction head 531 when the crystal retrieval mechanism 53 is located at the position to be solidified, and the chip angle detection camera 61 is electrically connected to the control system, so that the control system can control the suction head rotation driver 532 to drive the suction head 531 to rotate according to the chip angle posture detected by the chip angle detection camera 61 to adjust the angle of the chip.

[0036] It is understandable that since the laser welding mechanism belongs to the prior art, it will not be described in detail here.

[0037] It is understandable that the chips on different LED products may have different arrangement orientations. In order to enable the LED product repair equipment to repair different LED products, in some embodiments, the product carrying mobile device 10 also includes a rotating drive mechanism 14. The rotating drive mechanism 14 is connected to the workbench 11 and is used to drive the workbench 11 to rotate in a horizontal plane. The rotating drive mechanism 14 is electrically connected to the control system, so that the control system can control the rotating drive mechanism 14 to drive the workbench 11 to rotate according to the mounting orientation of the chip in the LED product to be repaired, and then adjust the posture angle of the LED product, so that the posture and angle of the defective chip on the LED product can correspond to the rejection mechanism 44, the tinning mechanism 45, the crystal extraction mechanism 53 and the laser welding mechanism. For example, in one embodiment, refer to Fig.11 The horizontal driving mechanism 13 includes a first X-axis driver 131 arranged along the X-axis direction and a first Y-axis driver 132 arranged along the Y-axis direction, and the first X-axis driver 131 is arranged on the driving part of the first Y-axis driver 132, the rotation driving mechanism 14 is connected to the driving part of the first X-axis driver 131, and the workbench 11 is connected to the driving part of the rotation driving mechanism 14, so that the workbench 11 can be driven to move along the X-axis and the Y-axis respectively by the first X-axis driver 131 and the first Y-axis driver 132, and the workbench 11 can be driven to rotate in the horizontal plane by the rotation driving mechanism 14, so as to realize the position and posture adjustment of the LED product in three degrees of freedom in the horizontal plane.

[0038] It is understood that in some of these embodiments, reference Figure 1 and Figure 2The LED product repair equipment further includes a product input device 70 and a product output device 80, wherein the product input device 70 is used to input the LED product into the LED product repair equipment, and the product output device 80 is used to output the repaired LED product to the outside of the LED product repair equipment; specifically, the product input device 70 and the product output device 80 are arranged along the X-axis direction on the opposite sides of the product carrying and moving device 10, and a product receiving mechanism is arranged on the workbench 11, and the product receiving mechanism can be connected with the product input device 70 or the product output device 80 under the drive of the horizontal driving mechanism 13, and the product input device 70 and the product output device 80 are electrically connected to the control system; through In the above structure, when the LED product is to be repaired, the LED product can be placed on the product input device 70 first, and then the LED product will be moved to the side close to the product carrying mobile device 10 under the conveyance of the product input device 70. At the same time, the product receiving mechanism is driven by the rotary drive mechanism 14 to turn into a posture that can be docked with the product input device 70, and then the product receiving mechanism is driven by the horizontal drive mechanism 13 to dock with the product input device 70, and then receive the LED product conveyed by the product input device 70, and finally, under the drive of the horizontal drive mechanism 13 and the rotary drive mechanism 14, it moves to the preset position below the tinning and rejecting assembly module 40 in a suitable posture to wait for the rejection of defective chips. When the LED product is repaired, the product receiving mechanism is driven by the rotary drive mechanism 14 to turn into a posture that can be docked with the product output device 80, and then the product receiving mechanism is driven by the horizontal drive mechanism 13 to dock with the product output device 80, and the LED product is conveyed to the product output device 80, and the LED product is finally moved out of the LED product repair equipment under the conveyance of the product output device 80.

[0039] It should be understood that in some of these embodiments, reference Fig.14 The product input device 70 includes two third belt conveyor assemblies 71 that are spaced apart and arranged opposite to each other, and a barcode scanner 72 is also arranged above the two third belt conveyor assemblies 71. The two first belt conveyor assemblies 111 are respectively used to carry two opposite edges of the LED product. The scanner can scan the LED products conveyed by the two third belt conveyor assemblies 71, and the barcode scanner 72 is electrically connected to the control system, so as to transmit the information of the current LED product obtained by scanning (such as the coding information of the current LED product and the position point information of each defective chip detected in the upstream detection process on the LED product, etc.) to the control system.

[0040] It is understandable that before removing the defective chips on the LED products, the LED products need to be positioned to avoid the LED products moving on the product receiving mechanism, which may result in the failure to accurately remove and replace the defective chips. For example, in one embodiment, referring to Figures 11 to 13 The product receiving mechanism includes two first belt conveyor assemblies 111 that are spaced apart and arranged opposite to each other. The two first belt conveyor assemblies 111 are used to carry two opposite edges of the LED product respectively. Each first belt conveyor assembly 111 is provided with a product clamping mechanism, which includes a first clamping member 112 and a lifting assembly. The first clamping member 112 is connected to the frame of the first belt conveyor assembly 111 and is at least partially located above the conveying surface of the first belt conveyor assembly 111. The lifting assembly includes a lifting member 112. The driver 113, the lifting synchronous member 114 and the lifting member 116, the lifting member 116 is slidably connected to the frame of the first belt conveyor assembly 111 in the vertical direction, and is located below the conveying surface of the first belt conveyor assembly 111 and the first clamping member 112, the lifting synchronous member 114 is slidably connected to the frame of the first belt conveyor assembly 111 in the horizontal direction, and the lifting synchronous member 114 is provided with a plurality of rollers 115 arranged at intervals, and the lifting member 116 is provided with a plurality of sliding rollers corresponding to the rollers 115 one by one. The lifting driver 113 is connected to the lifting synchronous member 114 and is used to drive the lifting synchronous member 114 to slide horizontally. With the above structure, after the LED product is delivered to the product receiving mechanism, the lifting driver 113 pushes the lifting synchronous member 114 to slide forward (for example, the lifting synchronous member 114 slides in the direction close to the first product stopping mechanism 12), and then the lifting member 116 can be driven to lift upward with the help of the cooperation of the roller 115 and the inclined slide groove 117, so that the lifting member 116 It can cooperate with the first clamping member 112 to clamp and lock the LED product on the product receiving mechanism; and when the LED product is repaired, the lifting synchronous member 114 is pushed to slide in the opposite direction through the lifting driver 113, and then the lifting member 116 can be driven downward by the cooperation of the roller 115 and the inclined slide groove 117, so that the lifting member 116 is away from the first clamping member 112, thereby releasing the LED product on the product receiving mechanism, so that the LED product can be transported to the product output device 80 by the first belt conveyor assembly 111.

[0041] It should be understood that, compared with the method of using a vertically arranged lifting driver 113 to directly connect the lifting member 116, by using a lifting synchronization member 114, a roller 115 and an inclined slide groove 117 to cooperate with the lifting driver 113 to drive the lifting member 116, it can be ensured that the various parts of the lifting member 116 in the length direction can be lifted synchronously, so as to improve the stability of the clamping and locking of the LED product.

[0042] It can be understood that in some embodiments, the product receiving mechanism is provided with a first product stopping mechanism 12, which is provided between the two first belt conveyor assemblies 111 and is used to stop the LED product to prevent the LED product from continuing to be conveyed backward, so that the LED product can be pre-positioned at the set position of the product receiving mechanism, and then the product clamping mechanism can clamp and lock the LED product at the above set position. Fig.12 and Fig.13 In one embodiment, the first product stopping mechanism 12 includes a stopping driver 121 and a stopping member 123. The end of the lifting member 116 facing away from the product input device 70 is opposite to the stopping member 123. The stopping driver 121 is connected to the stopping member 123 and is used to drive the stopping member 123 to rise and fall between the stopping position and the avoidance position. When in the stopping position, the top of the stopping member 123 is higher than the conveying surface of the first belt conveyor assembly 111 to stop the LED product conveyed by the first belt conveyor assembly 111. When in the avoidance position, the stopping member 123 is lower than the above-mentioned conveying surface, so that the LED product can continue to be conveyed backward.

[0043] It can be understood that in order to detect whether the LED product is qualified for rework, in some embodiments, the product output device 80 includes a product output mechanism 81 and a product testing mechanism 82, wherein the product output mechanism 81 is capable of receiving the LED product delivered from the product receiving mechanism, and the product testing mechanism 82 is used to perform a power-on test on the LED product on the product output mechanism 81, so as to evaluate whether the product is qualified for rework by the lighting status of each chip on the LED product.

[0044] For example, in one embodiment, referring to Fig.15The product output mechanism 81 includes two second belt conveyor modules 811 that are spaced apart and arranged opposite to each other. The two second belt conveyor modules 811 are respectively used to carry two opposite edges of the LED product. The product testing mechanism 82 is arranged between the two second belt conveyor modules 811, and includes a test driver 821 and a lifting platform 822. The upper surface of the lifting platform 822 is provided with a test terminal (not shown in the drawings). The test terminal is used to connect to the connection terminal on the LED product and supply power to the LED product. And, similarly, a second product stopping mechanism 83 is provided on the product output mechanism 81. The second product stopping mechanism 83 has the same structure as the first product stopping mechanism 12, and is arranged between the two second belt conveyor modules 811, and is located on the side of the product output mechanism 81 away from the product carrying mobile device 10, so that the second product stopping mechanism 83 can block the LED product from continuing to be conveyed backward, and then the LED product can be pre-positioned at the set position of the product output mechanism 81, and the connection terminals on the LED product can be located above the test terminals on the lifting platform 822, so that after the test driver 821 drives the lifting platform 822 to lift, the test terminals can be correctly connected with the connection terminals of the LED product.

[0045] It is understandable that in order to automatically identify whether the LED product is qualified for repair, in some embodiments, reference is made to Fig.15 The product output device 80 also includes a visual recognition mechanism 84, and the visual recognition mechanism 84 includes a visual recognition module 841 arranged above the product output mechanism 81. The visual recognition module 841 can obtain the image of the LED product on the product output mechanism 81, and recognize whether there is an unlit chip in the LED product through the image, and obtain the position information of the unlit chip in the LED product, and the visual recognition module 841 is electrically connected to the control system. When the visual recognition module 841 recognizes that there is an unlit chip in the LED product, the coding information of the current LED product and the position information of the unlit chip in the current LED product can be transmitted to the control system, and then transmitted to the equipment of the downstream process through the control system, so that the equipment of the downstream process can distinguish and process the qualified LED products returned for repair from the unqualified LED products.

[0046] The following describes the rework methods of some embodiments of the second aspect of the present invention. The rework methods of the embodiments are applied to the LED product rework equipment of the above-mentioned first aspect embodiments. The rework methods of the embodiments include but are not limited to the following steps S100 to S800.

[0047] S100: Control the horizontal driving mechanism 13 to drive the workbench 11 to carry the LED product to a preset position below the soldering and rejecting assembly module 40.

[0048] S200: Controlling the first positioning mechanism to obtain location information of a defective chip on the LED product; S300 : According to the position information of the defective chip, the horizontal driving mechanism 13 is controlled to adjust the position of the LED product so that one of the defective chips moves to the rejection position corresponding to the rejection mechanism 44 , and then the defective chip is rejected by the rejection mechanism 44 .

[0049] S400: Control the first moving mechanism 41 to drive the first moving platform 42 to carry the tinning mechanism 45 to move to the tin material supply device 20 to take tin, then control the first moving mechanism 41 to drive the first moving platform 42 to carry the tinning mechanism 45 to move above the LED product, and use the tinning mechanism 45 to apply tin to the area of ​​the LED product where the chip is removed.

[0050] S500: Control the second moving mechanism 51 to drive the second moving platform 52 to carry the crystal picking mechanism 53 to move to the chip supply device 30 to pick up the chip, and then control the second moving mechanism 51 to drive the second moving platform 52 to carry the crystal picking mechanism 53 to move to the position to be fixed between the product carrying moving device and the chip supply device (30).

[0051] It should be understood that, regarding the above step S500, step S500 may be executed synchronously during the execution of steps S300 and S400.

[0052] S600: Control the horizontal driving mechanism 13 to drive the workbench 11 to move toward the side close to the crystal taking mechanism 53, so that the tinning area on the LED product moves to the crystal bonding position, and synchronously control the second moving mechanism 51 to drive the second moving platform 52 to carry the crystal taking mechanism 53 to move above the crystal bonding position; S700: The chip is mounted on the tinning area of ​​the LED product by the crystal taking mechanism 53, and then the chip mounted on the tinning area is welded to the LED product by the laser welding mechanism; S800: The above steps S300 to S700 are repeated cyclically until all defective chips are replaced by new chips.

[0053] It should be understood that by adopting the rework method of this embodiment, defective chips on the LED product can be removed one by one and replaced with new chips, and during the maintenance process, the crystal removal mechanism 53 can operate synchronously with the removal mechanism 44 and the tinning mechanism 45, which is beneficial to improve the rework efficiency.

[0054] It can be understood that, for the LED product repair equipment provided with a product input device 70, the following step S010 is also included before executing the above step S100: placing the LED product on the product input device 70, and then controlling the product input device 70 to transport the LED product to the side close to the product carrying mobile device 10, and at the same time, controlling the rotating drive mechanism 14 to rotate the product receiving mechanism to an angle posture that can be docked with the product input device 70, and then adjusting the position of the product receiving mechanism through the horizontal drive mechanism 13, so that the product receiving mechanism docks with the product input device 70 and receives the LED product.

[0055] It can be understood that, if the product output device 80 is provided in the LED product repair equipment, the following steps S910 and S920 are also included after executing the above step S800.

[0056] S910: Control the rotary drive mechanism 14 to rotate the product receiving mechanism to an angle posture capable of docking with the product output device 80, then adjust the position of the product receiving mechanism through the horizontal drive mechanism 13 so that the product receiving mechanism docks with the product output device 80, and control the product receiving mechanism to transport the LED product to the product output device 80.

[0057] S920: Control the product output device 80 to output the LED product to the outside of the LED product repair equipment.

[0058] It should be understood that, for the product output device 80 including a product testing mechanism 82 and a visual recognition mechanism 84, the above step S920 also includes the following sub-steps.

[0059] S921: Control the test driver 821 to drive the lifting platform 822 to rise and connect the test terminals on the lifting platform 822 to the connection terminals on the LED product, and then supply power to the LED product through the test terminals; S922: Control the visual recognition module 841 to obtain the image of the LED product on the product output mechanism 81, and identify whether there are any unlit chips in the LED product through the image, and obtain the position information of the unlit chips in the LED product. When the visual recognition module 841 identifies that there are unlit chips in the LED product, the coding information of the current LED product and the position information of the unlit chips in the current LED product are transmitted to the control system, and then transmitted to the equipment in the downstream process through the control system.

[0060] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An LED product repair equipment, characterized in that: include: The product carrying and moving device comprises a workbench and a horizontal driving mechanism, wherein the workbench is connected to the horizontal driving mechanism and can move along the X-axis direction and the Y-axis direction under the drive of the horizontal driving mechanism; A tin material supply device is arranged on one side of the product carrying moving device in the X-axis direction and is used to supply tin material; A chip supply device is disposed on a side of the product carrying and moving device away from the tin material supply device and is used to supply chips; The tinning and rejecting assembly module includes a first moving mechanism and a first moving platform. The first moving platform is provided with a first positioning mechanism, the rejecting mechanism and the tinning mechanism. The first positioning mechanism is used to position defective chips on LED products, and the rejecting mechanism is used to reject defective chips on LED products. The first moving mechanism is connected to the first moving platform and can drive the first moving platform to move along the X-axis direction, so that the tinning mechanism can move to the tin material supply device to take tin, and can move to the workbench to apply tin material to the area of ​​the LED product where the chips are to be rejected; The crystal taking welding assembly module includes a second moving mechanism and a second moving table. The second moving table is provided with a laser welding mechanism and a crystal taking mechanism. The second moving mechanism is connected to the second moving table and can drive the second moving table to move along the X-axis direction, so that the crystal taking mechanism can move to the chip supply device to pick up the chip, and can move to the workbench to mount the chip on the tinning area of ​​the LED product. The laser welding mechanism is used to weld the chip mounted by the crystal taking mechanism to the tinning area on the LED product. A control system is electrically connected to the horizontal driving mechanism, the tin material supply device, the chip supply device, the first moving mechanism, the first positioning mechanism, the rejecting mechanism, the tinning mechanism, the second moving mechanism, the laser welding mechanism and the crystal taking mechanism.

2. The LED product repair equipment according to claim 1, characterized in that: The product carrying and moving device also includes a rotation driving mechanism, which is connected to the workbench and is used to drive the workbench to rotate in a horizontal plane. The rotation driving mechanism is electrically connected to the control system.

3. The LED product repair equipment according to claim 2, characterized in that: It also includes a product input device and a product output device, which are arranged on opposite sides of the product carrying mobile device in the X-axis direction. A product receiving mechanism is arranged on the workbench, and the product receiving mechanism can be connected with the product input device or the product output device under the drive of the horizontal driving mechanism. The product input device and the product output device are electrically connected to the control system.

4. The LED product repair equipment according to claim 3, characterized in that: The product receiving mechanism includes two first belt conveyor assemblies that are spaced apart and arranged opposite to each other, and the two first belt conveyor assemblies are respectively used to carry two opposite edges of the LED product. A product clamping mechanism is arranged on each of the first belt conveyor assemblies, and the product clamping mechanism includes a first clamping member and a lifting assembly. The first clamping member is connected to the frame of the first belt conveyor assembly and is at least partially located above the conveying surface of the first belt conveyor assembly. The lifting assembly includes a lifting drive, a lifting synchronous member and a lifting member. The lifting member is slidably connected to the frame of the first belt conveyor assembly in a vertical direction and is located below the conveying surface of the first belt conveyor assembly and the first clamping member. The lifting synchronous member is slidably connected to the frame of the first belt conveyor assembly in a horizontal direction, and a plurality of rollers arranged at intervals are arranged on the lifting synchronous member. The lifting member is provided with a plurality of oblique sliding grooves that slide in a one-to-one correspondence with the rollers. The lifting drive is connected to the lifting synchronous member and is used to drive the lifting synchronous member to slide horizontally.

5. The LED product repair equipment according to claim 4, characterized in that: The product receiving mechanism is provided with a first product stopping mechanism, which is arranged between the two first belt conveying assemblies and is used to stop the LED product to prevent the LED product from continuing to be conveyed backwards.

6. The LED product repair equipment according to claim 3, characterized in that: The product output device includes a product output mechanism and a product testing mechanism. The product output mechanism includes two second belt conveyor modules that are spaced apart and arranged opposite to each other. The two second belt conveyor modules are respectively used to carry two opposite edges of the LED product. The product testing mechanism is arranged between the two second belt conveyor modules and includes a lifting drive and a lifting platform. The upper surface of the lifting platform is provided with a test terminal, which is used to connect to the connection terminal on the LED product and supply power to the LED product.

7. The LED product repair equipment according to claim 6, characterized in that: The product output device also includes a visual recognition mechanism, which includes a visual recognition module arranged above the product output mechanism. The visual recognition module can obtain an image of the LED product on the product output mechanism and identify whether there is an unlit chip in the LED product through the image. The visual recognition module is electrically connected to the control system.

8. The LED product repair equipment according to claim 1, characterized in that: The chip supply device includes a crystal plate switching platform, a crystal top mechanism and a crystal plate position adjustment mechanism. The crystal plate switching platform includes a turntable and a plurality of annular crystal plates connected to the circumference of the turntable. The annular crystal plates are used to support a diaphragm densely covered with chips. The crystal top mechanism is arranged on one side of the turntable. Each of the annular crystal plates can be moved to the top of the crystal top mechanism driven by the turntable. The crystal top mechanism includes a top pin and a lifting drive module. The lifting drive module is connected to the top pin and is used to drive the top pin to rise and fall. When the top pin is lifted, it can lift the chip on the diaphragm. The crystal plate position adjustment mechanism is connected to the crystal plate switching platform and is used to change the position of the annular crystal plate so that each chip on the annular crystal plate located above the crystal top mechanism can be moved above the top pin.

9. The LED product repair equipment according to claim 8, characterized in that: The crystal lifting mechanism also includes a push rod assembly that can be telescopically arranged in the vertical direction, the push pin is connected to the top of the push rod assembly, the lifting drive module includes a motor and a cam connected to the motor output shaft, and the lower end of the push rod assembly abuts against the cam.

10. The LED product repair method is characterized by: Applied to the LED product repair equipment according to any one of claims 1 to 9, the method comprises the following steps: S100, controlling the horizontal driving mechanism to drive the workbench to carry the LED product to a preset position below the tinning and removing assembly module; S200, controlling the first positioning mechanism to obtain location information of defective chips on the LED product; S300, according to the position information of the defective chip, controlling the horizontal driving mechanism to adjust the position of the LED product so that one of the defective chips moves to a rejection position corresponding to the rejection mechanism, and then the defective chip is rejected by the rejection mechanism; S400, controlling the first moving mechanism to drive the first moving platform to carry the tinning mechanism to move to the tin material supply device to take tin, then controlling the first moving mechanism to drive the first moving platform to carry the tinning mechanism to move above the LED product, and using the tinning mechanism to apply tin to the area of ​​the LED product where the chip is to be removed; S500, controlling the second moving mechanism to drive the second moving platform to carry the crystal retrieval mechanism to move to the chip supply device to pick up the chip, and then controlling the second moving mechanism to drive the second moving platform to carry the crystal retrieval mechanism to move to a position to be crystal bonded between the product carrying moving device and the chip supply device; S600, controlling the horizontal driving mechanism to drive the workbench to move toward the side close to the crystal taking mechanism, so that the tinning area on the LED product moves to the crystal bonding position, and synchronously controlling the second moving mechanism to drive the second moving platform to carry the crystal taking mechanism to move above the crystal bonding position; S700, mounting the chip on the tinning area of ​​the LED product by the crystal taking mechanism, and then welding the chip mounted on the tinning area to the LED product by the laser welding mechanism; S800, repeating the above steps S300 to S700 in a loop until all defective chips are replaced with new chips; Wherein, step S500 is synchronously executed during the execution of steps S300 and S400.

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