Compact distributed transmitter high-voltage power supply structure

Abstract

The invention discloses a compact distributed transmitter high-voltage power supply structure, which comprises a miniaturized high-voltage power supply module, an auxiliary power supply module, a high-voltage power supply mother board combination, a high-voltage power supply box body, a guide rail support plate, a cover plate combination and a self-locking handle, the miniaturized high-voltage power supply modules are arranged in parallel, and mirror symmetry design is adopted in the interior of each module; the auxiliary power supply module adopts a step structure and is spliced and formed; the high-voltage power supply mother board combination is composed of a power supply mother board and a mother board reinforcing board, and connectors on the power supply mother board are arranged in a bilateral symmetry mode. The uniform high-voltage power supply box body is spliced and formed, seam allowance matching is adopted at joints, and a uniform heating plate is adopted as a bottom plate; the cover plate combination is composed of a guide rail cover plate, a maintenance cover plate and a mother board shielding cover, and a guide rail groove is designed in the guide rail cover plate. The compact distributed transmitter high-voltage power supply structure has the advantages of being compact in structure, convenient to maintain and use, high in heat dissipation efficiency, high in environmental adaptability, good in safety and the like.

Description

Technical Field

[0001] The present application relates to the technical field of radar electronic equipment structures, and in particular to a compact distributed transmitter high-voltage power supply structure. Background Art

[0002] In electronic warfare, the traveling wave tube system broadband array transmitter applies beam space power synthesis technology to improve the effective radiation power of the transmitter, and the beam switching is fast, which can interfere with multiple targets at the same time. The parameters of each electrode of the traveling wave tube array of the broadband array transmitter are the same, and the traditional equipment uses centralized high-voltage power supply to power the traveling wave tube array.

[0003] When a single non-voltage-withstand fault such as spiral overcurrent occurs in a single traveling wave tube, the centralized high-voltage power supply can be controlled by the high-voltage relay to cut off the cathode power supply of the traveling wave tube to cut off the fault point, without affecting the array transmission of other units. However, when the traveling wave tube leaks and the multi-electrode voltage resistance is insufficient, the fault point cannot be cut off. In addition, when a single traveling wave tube ignites or other interference occurs, it will affect the array transmission of other units. Often, the voltage resistance failure of a single traveling wave tube transmitting unit will cause the entire transmitting array to fail, resulting in a decrease in mission reliability. At present, the transmitter high-voltage power supply mainly adopts a centralized high-voltage power supply design, and there is no transmitter high-voltage power supply product that adopts a distributed power supply design. The centralized high-voltage power supply has the following disadvantages: (1) The internal modules are interconnected by cables, which has low space utilization and complex wiring; (2) The internal high-voltage distribution module adopts a centralized output design, and the failure of a single output unit may affect the use of the entire module, resulting in low reliability. Summary of the invention

[0004] The present application provides a compact distributed transmitter high-voltage power supply structure, which can be used to solve the technical problem that a single output unit failure affects the use of the entire module.

[0005] The present application proposes a compact distributed transmitter high-voltage power supply structure. The modules adopt a standardized structural design and are interconnected through a motherboard. The overall layout is simple and compact, and the wiring is concise. The internal high-voltage distribution output unit adopts a distributed design, which can effectively avoid the failure of a single output unit affecting the use of the entire module and has high reliability.

[0006] The present application provides a compact distributed transmitter high-voltage power supply structure, which includes a miniaturized high-voltage power supply module, an auxiliary power supply module, a high-voltage power supply motherboard assembly, a high-voltage power supply box body, a guide rail support plate, a cover plate assembly and a self-locking handle;

[0007] Among them, a plurality of neatly arranged miniaturized high-voltage power modules are arranged inside the high-voltage power supply box; a high-voltage power motherboard assembly is arranged on one side of the plurality of miniaturized high-voltage power modules, and an auxiliary power module is arranged on the other side; a guide rail support plate is arranged between the miniaturized high-voltage power modules;

[0008] The self-locking handle is arranged on the outer surface of the high-voltage power supply box body.

[0009] Furthermore, the miniaturized high-voltage power supply modules are arranged in parallel, with one input and two outputs. The modules are filled with thermal conductive adhesive and installed vertically. The top is fixed with a locking strip and thermal conductive grease is applied to the bottom. Every two miniaturized high-voltage power supply modules fit tightly together. Each miniaturized high-voltage power supply module is arranged in the same direction.

[0010] Furthermore, the auxiliary power supply module adopts a stepped structure, with a multi-layer structure arranged inside and spliced ​​into shape.

[0011] Furthermore, the high-voltage power motherboard combination includes a power motherboard and a motherboard reinforcement board, and the connectors on the power motherboard are arranged in a left-right symmetrical manner; the power motherboard and the motherboard reinforcement board are in full-surface contact.

[0012] Furthermore, the high-voltage power supply box body is spliced ​​and formed, the joints of each mounting plate are matched with stoppers, and the bottom plate is a heat spreader.

[0013] Furthermore, the cover assembly includes a guide rail cover, a maintenance cover and a motherboard shielding cover, and a guide rail groove is designed inside the guide rail cover; the position of the guide rail groove matches the limit interface on the top of the miniaturized high-voltage power supply module.

[0014] Compared with the existing transmitter high voltage power supply, the present invention has the following significant advantages:

[0015] (1) Compact structure and easy maintenance and use: The internal module layout of the transmitter high-voltage power supply is neat and the module shape is regular. The space is used to the maximum extent while ensuring wiring, and the overall structure is compact. The miniaturized high-voltage power supply module is fixed with a locking strip structure, without the need for fastening screws, and its input and output electrical interfaces use blind-plug connectors, which are easy to install and disassemble. The maintenance cover of the miniaturized high-voltage power supply module, auxiliary power supply module, and high-voltage power supply motherboard combination adopts a split-type design, so that each module does not interfere with each other during maintenance, making maintenance convenient.

[0016] (2) High heat dissipation efficiency and strong environmental adaptability: The interior of the miniaturized high-voltage power supply module is filled with thermal conductive glue, which can effectively improve the heat dissipation capacity of the module; the bottom mounting surfaces of all heating components are coated with thermal conductive silicone grease, which effectively reduces the contact thermal resistance and improves the heat dissipation efficiency; the heat dissipation base plate adopts a vacuum cavity-type temperature plate design to greatly reduce the surface temperature gradient and avoid the high power consumption module from overheating. In addition, the external water-cooled heat sink in contact with the base plate does not require complex flow channel design. While ensuring the heat dissipation amount, only ordinary flow channels are required to achieve overall heat dissipation, and it has strong environmental adaptability.

[0017] (3) Good safety: All high-voltage modules adopt a closed design to prevent the equipment from causing harm to personnel when the power is not turned off, which is safe. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is one of the schematic diagrams of the high voltage power supply structure of a compact distributed transmitter;

[0019] Figure 2 This is the second schematic diagram of the high voltage power supply structure of a compact distributed transmitter;

[0020] Figure 3 It is a diagram of the internal arrangement of the high voltage power supply structure of a compact distributed transmitter;

[0021] Figure 4 It is an exploded diagram of the high voltage power supply structure of a compact distributed transmitter;

[0022] Figure 5 It is a schematic diagram of the interior of a miniaturized high-voltage power supply module;

[0023] Figure 6 This is the internal schematic diagram of the auxiliary power module.

[0024] Figure 7 It is a schematic diagram of the high voltage power supply motherboard assembly structure.

[0025] Figure 8 It is a schematic diagram of the high voltage power supply box structure.

[0026] Fig. 9 It is a schematic diagram of the guide rail cover structure.

[0027] Among them: 1-miniaturized high-voltage power supply module; 2-auxiliary power supply module; 3-high-voltage power supply motherboard assembly, 3-1-power supply motherboard, 3-2-motherboard reinforcement plate; 4-high-voltage power supply box; 5-guide rail support plate; 6-cover assembly, 6-1-guide rail cover, 6-2-maintenance cover, 6-3-motherboard shielding cover; 7-self-locking handle. DETAILED DESCRIPTION

[0028] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0029] The following first introduces the embodiments of the present application in conjunction with the accompanying drawings.

[0030] like Figure 1 , Figure 2 , Figure 3 as well as Figure 4As shown, a compact distributed transmitter high-voltage power supply structure includes a miniaturized high-voltage power supply module 1, an auxiliary power supply module 2, a high-voltage power supply motherboard assembly 3, a high-voltage power supply box body 4, a guide rail support plate 5, a cover assembly 6 and a self-locking handle 7; the miniaturized high-voltage power supply modules 1 are arranged in parallel, and a single module adopts a mirror-symmetrical design inside, with one input and two outputs, the module is filled with thermal conductive glue inside, the top is fixed with a locking strip, and the bottom is coated with thermal conductive grease; the auxiliary power supply module 2 adopts a stepped structure and is spliced ​​into shape; the high-voltage power supply motherboard assembly 3 consists of a power supply motherboard 3-1 and a motherboard reinforcement plate 3-2, and the connector on the power supply motherboard 3-1 is arranged symmetrically on the left and right; the high-voltage power supply box body 4 is spliced ​​into shape, the joints are matched with stoppers, and the bottom plate adopts a heat spreader; the cover assembly 6 consists of a guide rail cover 6-1 and a maintenance cover 6-2, and a guide rail groove is designed inside the guide rail cover. The present invention adopts a distributed structure design, splits the main power supply module unit into multiple independent power supply units, and the cable connection between the modules is realized through the motherboard. The internal layout of the entire power supply module is simple, the internal wiring is concise, the heat dissipation path is clear, and the heat dissipation is efficient and reliable. It can avoid the failure of the entire array transmission caused by insufficient withstand voltage of a single traveling wave tube, and has high reliability.

[0031] In a further embodiment, Figure 3 , Figure 4 As shown, the interior of the transmitter high-voltage power supply is mainly composed of a miniaturized high-voltage power supply module 1, an auxiliary power supply module 2 and a high-voltage power supply motherboard assembly 3. All modules have regular structural shapes, and the space is utilized to the maximum extent while ensuring wiring. The overall layout is compact and the space utilization rate is high. All modules have corresponding maintenance covers, and maintenance and use do not interfere with each other. All high-voltage modules adopt a closed design to prevent the equipment from causing harm to personnel when the power is not turned off, and the safety is good.

[0032] In a further embodiment, Figure 3 , Figure 4 and Figure 5 As shown, the miniaturized high-voltage power supply module 1 is arranged in parallel inside the transmitter high-voltage power supply module, and is blindly mated with the high-voltage power supply motherboard assembly 3. It is installed vertically, a locking strip is designed on the top for fixation, and threaded holes and limit interfaces are reserved for pulling out. No fastening screws are required, and installation and disassembly are convenient. Thermal grease is applied to the bottom of the module to effectively reduce the contact thermal resistance and improve the heat dissipation efficiency of the module. The module adopts a mirror-symmetrical design inside, and the two power supply units share the input connector, communication board and structural mounting board, with two outputs to the outside, a compact structure and high space utilization. The module is potted with thermal conductive glue inside, which can not only effectively conduct the internal heat to the heat dissipation cold plate, but also solve the problem of fixing components without fastening interfaces and improve the impact and vibration resistance of components.

[0033] In a further embodiment, Figure 4 , Figure 6 As shown, the auxiliary power module 2 has a stepped shape, is formed by splicing as a whole, and has a multi-layer structure design with internal partitions. It has low manufacturing cost, simple assembly, and high space utilization. The connector is arranged at the step of the lower layer, and there is sufficient wiring space. High heat consumption components are arranged on the heat dissipation base plate to ensure reliable heat dissipation of the module.

[0034] In a further embodiment, Figure 4 , Figure 7 As shown, the high-voltage power supply motherboard combination 3 consists of a power supply motherboard 3-1 and a motherboard reinforcement plate 3-2. The connectors on the power supply motherboard 3-1 are arranged symmetrically on the left and right. Except for the connector installation position, the power supply motherboard 3-1 and the motherboard reinforcement plate 3-2 are in full contact with each other, and the overall strength is high, ensuring that the power supply motherboard 3-1 will not be deformed or damaged during use.

[0035] In a further embodiment, Figure 4 , Figure 8 As shown, the high-voltage power supply box body 4 is spliced ​​and formed, and each mounting plate on the side adopts a thin-walled multi-rib structure design, which effectively reduces the weight of the module while ensuring the structural strength; the joints of each mounting plate adopt a stopper, which not only improves the connection strength between the mounting plates inside the box body, but also reduces the impact of the electrical signals inside the module on external equipment, and improves the electromagnetic compatibility performance of the entire module; the bottom plate of the box body adopts a vacuum chamber-type temperature-averaging plate design, which greatly reduces the surface temperature gradient and avoids the high power consumption module from overheating, and the external water-cooled heat sink in contact with the bottom plate does not need to be designed with a complex flow channel. While ensuring the heat dissipation, only an ordinary flow channel is required to achieve overall heat dissipation, and it has strong environmental adaptability.

[0036] In a further embodiment, as shown in FIG4, Fig. 9 The cover assembly 6 consists of a guide rail cover 6-1, a maintenance cover 6-2 and a motherboard shielding cover 6-3. The installation interfaces of the frequently disassembled guide rail cover 6-1 and the maintenance cover 6-2 are designed to be loose and not to be taken off, which is convenient to use. A guide rail groove is designed inside the guide rail cover 6-1, and the guide rail groove cooperates with the limit interface on the top of the miniaturized high-voltage power supply module 1 to ensure that the miniaturized high-voltage power supply module 1 is accurately installed in the internal position of the high-voltage power supply.

[0037] In summary, the above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0038] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. A compact distributed transmitter high voltage power supply structure, characterized in that: The structure comprises a miniaturized high-voltage power module (1), an auxiliary power module (2), a high-voltage power motherboard assembly (3), a high-voltage power box body (4), a guide rail support plate (5), a cover assembly (6) and a self-locking handle (7); A plurality of neatly arranged miniaturized high-voltage power modules (1) are arranged inside the high-voltage power supply box (4); a high-voltage power supply motherboard assembly (3) is arranged on one side of the plurality of parallel miniaturized high-voltage power modules (1), and an auxiliary power module (2) is arranged on the other side; and a guide rail support plate (5) is arranged between the miniaturized high-voltage power modules (1); The self-locking handle (7) is arranged on the outer surface of the high-voltage power supply box body (4).

2. A compact distributed transmitter high voltage power supply structure according to claim 1, characterized in that: The miniaturized high-voltage power supply modules (1) are arranged in parallel, with one input and two outputs. The modules are filled with thermal conductive glue and installed vertically. The top is fixed with a locking strip and the bottom is coated with thermal conductive grease. Every two miniaturized high-voltage power supply modules (1) fit tightly together. The orientation of each miniaturized high-voltage power supply module (1) is consistent.

3. A compact distributed transmitter high voltage power supply structure according to claim 1, characterized in that: The auxiliary power supply module (2) adopts a stepped structure, and a multi-layer structure is arranged inside and spliced ​​into shape.

4. A compact distributed transmitter high voltage power supply structure according to claim 1, characterized in that: The high-voltage power motherboard assembly (3) comprises a power motherboard (3-1) and a motherboard reinforcement plate (3-2); the connectors on the power motherboard (3-1) are arranged in a left-right symmetrical manner; and the power motherboard (3-1) and the motherboard reinforcement plate (3-2) are in full-surface contact.

5. A compact distributed transmitter high voltage power supply structure according to claim 1, characterized in that: The high-voltage power supply box body (4) is spliced ​​and formed, the joints of the various mounting plates are matched with stoppers, and the bottom plate is a heat spreader.

6. A compact distributed transmitter high voltage power supply structure according to claim 1, characterized in that: The cover plate assembly (6) comprises a guide rail cover plate (6-1), a maintenance cover plate (6-2) and a motherboard shielding cover (6-3); a guide rail groove is designed inside the guide rail cover plate (6-1); the position of the guide rail groove matches the limit interface at the top of the miniaturized high-voltage power supply module (1).

Images