Display panel, preparation method of display panel and display device

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display device, and relates to the technical field of display, the display panel comprises a driving backboard, the driving backboard comprises a substrate, a conductive layer and a plurality of driving electrodes, the conductive layer is arranged on the substrate, and the plurality of driving electrodes are arranged on the substrate. The plurality of driving electrodes are arranged on one side, far away from the substrate, of the conductive layer at intervals; wherein the upper surface, far away from the substrate, of the conductive layer is at least partially provided with a reflection structure; through the design, laser damage is avoided, and the display quality is improved.

Description

Technical Field

[0001] The present application relates to the field of electronic paper display technology, and in particular to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] In the existing Micro LED display panel technology, the common mass transfer technology is laser transfer technology, which uses laser to release the micro light-emitting devices from the carrier substrate and then transfer them to the display panel in batches. Laser transfer technology has high transfer efficiency and a flexible single transfer area.

[0003] Since laser stripping is performed after binding, during this process, when the laser irradiation position is offset, the laser is likely to irradiate the conductive layer on the display panel, causing damage to the metal circuits in the display panel and affecting the display quality of the display panel.

[0004] Therefore, this is an issue that needs to be addressed urgently. Summary of the invention

[0005] The purpose of the present application is to provide a display panel, a method for preparing a display panel, and a display device that avoid laser damage and improve display quality.

[0006] The present application discloses a display panel, wherein the driving backplane comprises a substrate, a conductive layer and a plurality of driving electrodes, wherein the conductive layer is arranged on the substrate, and the plurality of driving electrodes are arranged at intervals on a side of the conductive layer away from the substrate; wherein the conductive layer is away from the upper surface of the substrate, and at least part of it is provided with a reflective structure.

[0007] Optionally, the reflective structure is formed integrally with the conductive layer, and the reflective structure includes at least one concave structure and at least one convex structure connected to each other, and the horizontal plane at which the upper surface of the concave portion is located is lower than the horizontal plane at which the upper surface of the convex structure is located.

[0008] Optionally, the driving backplane also includes an insulating layer, the concave structure includes a plurality of first connectors and a plurality of concave portion parts, the convex structure includes a plurality of second connectors and a plurality of convex portion parts, the first connector and the second connector are arranged on the substrate at intervals, the concave portion part is arranged on a side of the first connector away from the substrate, the convex portion part is arranged on a side of the second connector away from the substrate, and the concave portion part is connected to the convex portion part; the height of the first connector is equal to the height of the second connector, the insulating layer is arranged between the first connector and the second connector, the upper surfaces of the plurality of concave portion parts are combined with the upper surfaces of the plurality of convex portion parts to form a first wavy structure, the thickness of the concave portion part is denoted as H1, and the thickness of the convex portion part is denoted as H2, wherein 1 / 2H1<H2<H1.

[0009] Optionally, the upper surface of the conductive layer is divided into a plurality of spacing areas and a plurality of connection areas, the plurality of driving electrodes are arranged in one-to-one correspondence with the plurality of connection areas, the spacing area is formed between two adjacent connection areas, and the reflective structure is arranged in the spacing area.

[0010] Optionally, the display panel also includes a plurality of light-emitting devices, and the plurality of light-emitting devices are arranged in a one-to-one correspondence with the plurality of driving electrodes; the upper surface of the conductive layer is divided into a plurality of spacing areas and a plurality of connection areas, and the plurality of driving electrodes are arranged in a one-to-one correspondence with the plurality of connection areas, and the spacing area is formed between two adjacent connection areas, and the upper surfaces of the spacing areas and the upper surfaces of the connection areas both form the reflective structure; the driving electrode includes a driving electrode body and a second wavy structure, and the second wavy structure is arranged on a side of the driving electrode body close to the reflective structure, and the second wavy structure is fixed to the reflective structure; wherein the second wavy structure is formed integrally with the driving electrode body.

[0011] Optionally, the driving electrode includes a first driving electrode and a second driving electrode, the first driving electrode includes a first driving electrode body, a first binding part, a first non-binding part and a first connecting material piece, the first binding part and the first non-binding part are both arranged on a side of the first driving electrode body away from the conductive layer, the first non-binding part is arranged around the first binding part, and the upper surface of the first non-binding part protrudes from the upper surface of the first binding part, the first non-binding part cooperates with the first binding part to form a first matching groove, and the first connecting material piece is arranged in the first matching groove; the second driving electrode includes a second driving electrode body, a second binding part, a second non-binding part and a second connecting material piece, the second binding part and the second non-binding part are both arranged on a side of the second driving electrode body away from the conductive layer, the second non-binding part is arranged around the second binding part, and the second non The upper surface of the binding part protrudes from the upper surface of the second binding part, the second non-binding part cooperates with the second binding part to form a second matching groove, and the second connecting material piece is arranged in the second matching groove; wherein, the surfaces of the first binding part and the second binding part away from the conductive layer form a third wavy structure, and the surfaces of the first non-binding part and the second non-binding part away from the conductive layer form a fourth wavy structure; the light-emitting device comprises a first connecting electrode, a second connecting electrode and a light-emitting chip, and the light-emitting chip is arranged on the side of the first connecting electrode and the second connecting electrode away from the driving electrode body, the first connecting electrode is fixed by the first connecting material piece and the first matching groove, and the second connecting electrode is fixed by the second connecting material piece and the second matching groove; wherein, the first connecting material piece and the second connecting material piece are made of the same material.

[0012] Optionally, at least one guide structure is provided on the side of the first non-binding part and the second non-binding part away from the conductive layer; among the two adjacent driving electrodes, the first connecting material piece and the second connecting material piece of the first driving electrode and the first connecting material piece and the second connecting material piece of the second driving electrode are made of different anisotropic materials; wherein, the height of the guide structure is higher than the height of the first binding part and the second binding part, and the guide structure forms an open groove body on the side of the first non-binding part or the second non-binding part away from the conductive layer in a direction perpendicular to the substrate, or, the guide structure penetrates the first non-binding part or the second non-binding part in a horizontal direction to form a through groove.

[0013] The present application also discloses a method for preparing a display panel, which is used to prepare the display panel as described above, comprising the steps of:

[0014] providing a substrate;

[0015] forming a conductive layer on the substrate;

[0016] Processing a portion of the upper surface of the conductive layer by a process to form a reflective structure on the upper surface of the conductive layer;

[0017] forming a plurality of drive electrodes spaced apart from each other on the conductive layer to form a drive backplane;

[0018] Using a transfer substrate to move a plurality of light-emitting devices to above the driving backplane, and the light-emitting devices are bound to the driving electrodes in a one-to-one correspondence;

[0019] The positions of the light emitting devices are irradiated with laser light, so that the light emitting devices fall off the transfer substrate and are bound and connected with the driving electrodes, so as to form a display panel with a large number of light emitting devices transferred.

[0020] Optionally, the step of forming a conductive layer on the substrate comprises the steps of:

[0021] coating a metal material on the substrate to form a metal layer;

[0022] Performing patterning on the metal layer to form a first connector and a second connector that are spaced apart;

[0023] Applying insulating material above the first connector and the second connector and between the first connector and the second connector to form an insulating layer;

[0024] Patterning the insulating layer to form an insulating layer disposed only between the first connector and the second connector;

[0025] A metal material is coated on the first connector, the second connector and the insulating layer to form a conductive layer.

[0026] The present application also discloses a display device, comprising the display panel as described above.

[0027] Compared with the existing laser transfer technology, when the laser irradiation position is offset, the laser irradiating the conductive layer will cause damage to the metal circuit in the display panel, thereby affecting the display quality. The display panel of the present application includes a substrate, a conductive layer and a plurality of driving electrodes, wherein the conductive layer is arranged on the substrate, and the plurality of driving electrodes are arranged at intervals on the side of the conductive layer away from the substrate; wherein the conductive layer is away from the upper surface of the substrate, and at least part of it is provided with a reflective structure; when the laser irradiates the conductive layer, it can be reflected by the reflective structure, so that part of the laser light is reflected, so that the light transmitted into the conductive layer is weakened, thereby avoiding damage to the metal circuit in the substrate, thereby ensuring the display quality of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0029] Figure 1 It is a schematic diagram of the block diagram structure of the display device provided by the present application;

[0030] Figure 2 It is a schematic diagram of the cross-sectional structure of the display panel provided by the present application during the transfer and binding of the light-emitting devices;

[0031] Figure 3 It is a schematic diagram of the cross-sectional structure of a portion of the driving backplane provided by the present application;

[0032] Figure 4 is a schematic cross-sectional structural diagram of a driving backplane provided in the first embodiment of the present application;

[0033] Figure 5 is a schematic diagram of the shape structure of the reflection structure provided in the first embodiment of the present application;

[0034] Figure 6 It is a schematic diagram of the process steps of the method for preparing a display panel provided in the present application;

[0035] Figure 7 This is a schematic diagram of the process for preparing the reflective structure of the first embodiment of the present application;

[0036] Figure 8 yes Figure 6 Schematic diagram of the process steps for preparing the conductive layer;

[0037] Fig. 9 is a schematic cross-sectional structural diagram of a driving backplane provided in a second embodiment of the present application;

[0038] Fig.10 It is a schematic diagram of the process for preparing a reflective structure provided in the second embodiment of the present application;

[0039] Fig.11 is a schematic diagram of the process steps for preparing a conductive layer provided in the second embodiment of the present application;

[0040] Fig.12 is a schematic cross-sectional structure diagram of a display panel provided in a fourth embodiment of the present application;

[0041] Fig.13yes Fig.12 Schematic diagram of the cross-sectional structure of the driving electrode;

[0042] Fig.14 yes Fig.13 A schematic diagram of a three-dimensional structure of a first driving electrode or a second driving electrode;

[0043] Fig.15 is a schematic cross-sectional structural diagram of a driving backplane provided in a fifth embodiment of the present application;

[0044] Fig.16 is a schematic diagram of a process for preparing a driving electrode provided in a fifth embodiment of the present application;

[0045] Fig.17 is a schematic diagram of the three-dimensional structure of the first driving electrode or the second driving electrode provided in the sixth embodiment of the present application;

[0046] Fig.18 is a schematic diagram of the matching structure of the light emitting device and the driving backplane provided in the seventh embodiment of the present application;

[0047] Fig.19 yes Fig.18 Schematic diagram of the three-dimensional structure of the mid-drive backplane.

[0048] Among them, 10, display device; 100, display panel; 110, driving backplane; 111, substrate; 112, conductive layer; 113, driving electrode; 114, driving electrode body; 115, second wavy structure; 116, reflective structure; 117, concave structure; 118, convex structure; 119, first connector; 120, concave portion; 121, second connector; 122, convex portion; 123, first driving electrode; 124, second driving electrode; 125, first driving electrode body; 126, first binding portion; 127, first non-binding portion; 128, first connecting material; 129, first matching groove; 130, second driving electrode body; 131, second binding portion; 132, second non-binding portion; 133 , second connecting material piece; 134, second matching groove; 135, third wavy structure; 136, fourth wavy structure; 137, fifth wavy structure; 140, insulating layer; 150, spacing area; 160, connecting area; 170, guide structure; 180, light-emitting device; 181, first connecting electrode; 182, second connecting electrode; 183, light-emitting chip; 200, transfer substrate; 300, first horizontal plane; 311, first inclined plane; 312, second horizontal plane; 313, first vertical plane; 314, first side plane; 315, second side plane; 316, third horizontal plane; 317, second inclined plane; 318, fourth horizontal plane; 319, second vertical plane; 320, third side plane; 321, fourth side plane; 322, raised portion. DETAILED DESCRIPTION

[0049] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative, but the present application can be implemented in many alternative forms and should not be construed as being limited to only the embodiments described herein.

[0050] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; "multiple" means two or more. In addition, the terms "upper", "lower", "left", "right", "second direction", "first direction", etc. indicating the orientation or position relationship are described based on the orientation or relative position relationship shown in the accompanying drawings, and are only for the convenience of describing the simplified description of the present application, rather than indicating that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0051] Figure 1 is a schematic diagram of the block diagram of the display device provided by the present application, Figure 2 is a schematic cross-sectional structure diagram of the display panel provided by the present application during transfer and binding of the light emitting device 1, Figure 3 is a schematic diagram of the cross-sectional structure of the drive backplane provided in this application, Figure 3 The arrows in the figure indicate the situation where the laser is reflected. Figure 1-Figure 3 As shown, the present application discloses a display device 10, including a display panel 100, wherein the display panel 100 includes a driving backplane 110, wherein the driving backplane 110 includes a substrate 111, a conductive layer 112 and a plurality of driving electrodes 113, wherein the conductive layer 112 is arranged on the substrate 111, and the plurality of driving electrodes 113 are arranged at intervals on a side of the conductive layer 112 away from the substrate; wherein the conductive layer 112 is away from the upper surface of the substrate 111, and at least partially formed with a connected reflective structure 116; the reflective structure 116 is formed integrally with the conductive layer 112.

[0052] Compared with the existing laser transfer technology, when the laser irradiation position is offset, the laser irradiation to the conductive layer 112 will cause damage to the metal circuit in the display panel 100, thereby affecting the display quality. The display panel 100 of the present application includes a substrate 111, a conductive layer 112 and a plurality of drive electrodes 113, wherein the conductive layer 112 is arranged on the substrate 111, and the plurality of drive electrodes 113 are arranged at intervals on the side of the conductive layer 112 away from the substrate; wherein the conductive layer 112 is away from the upper surface of the substrate 111, and at least part of it is provided with a reflective structure 116; when the laser irradiates the conductive layer 112, it can be reflected by the reflective structure 116, and part of the laser light is reflected, so that the light transmitted to the inside of the conductive layer 112 is weakened, thereby avoiding damage to the metal circuit in the substrate 111, thereby ensuring the display quality of the display panel 100.

[0053] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0054] First embodiment

[0055] like Figure 2 As shown, the display panel 100 further includes a plurality of light emitting devices 180, and the plurality of light emitting devices 180 are arranged one by one corresponding to the plurality of driving electrodes 113, and are bound to the driving electrodes 113. Before the light emitting devices 180 are bound, a transfer substrate 200 is required to absorb the plurality of light emitting devices 180 for mass transfer, and a laser is required to be used to irradiate the positions of the corresponding light emitting devices 180 so that the light emitting devices 180 are bound to the driving electrodes 113 after they fall off the transfer substrate 200. Figure 2 The arrows in the figure indicate the laser irradiation.

[0056] Combination Figure 2 The upper surface of the conductive layer 112 is divided into a plurality of spacing areas 150 and a plurality of connection areas 160. The plurality of driving electrodes 113 are arranged one by one with the plurality of connection areas 160. The spacing area 150 is formed between two adjacent connection areas 160. The reflective structure 116 is arranged in the spacing area 150. The reflective structure 116 is formed integrally with the conductive layer 112. In this way, the reflective structure 116 can be manufactured together when the conductive layer 112 is patterned without adding additional process steps, thus saving process costs. The reflective structure 116 includes at least one concave structure 117 and at least one convex structure 118 connected to each other. The horizontal plane of the upper surface of the concave structure 117 is lower than the horizontal plane of the upper surface of the convex structure 118. That is, the concave structure 117 and the convex structure 118 are connected to form an uneven surface. Since the conductive layer 112 itself is made of metal, this is conducive to the reflection of the irradiated laser.

[0057] Specifically, Figure 4 is a schematic diagram of the cross-sectional structure of the driving backplane provided in the first embodiment of the present application, such as Figure 4 As shown, the display panel 100 further includes an insulating layer 140, the concave structure 117 includes a plurality of first connectors 119 and a plurality of concave portions 120, the convex structure 118 includes a plurality of second connectors 121 and a plurality of convex portions 122, the first connectors 119 and the second connectors 121 are arranged on the substrate 111 at intervals, the concave portions 120 are arranged on a side of the first connector 119 away from the substrate 111, the convex portions 122 are arranged on a side of the second connector 121 away from the substrate 111, and the concave portions 120 are connected to the convex portions 122;

[0058] The height of the first connector 119 is equal to the height of the second connector 121. The insulating layer 140 is arranged between the first connector 119 and the second connector 121 for insulation. The upper surfaces of the plurality of concave portions 120 and the upper surfaces of the plurality of convex portions 122 are combined to form a wavy structure, so that a plurality of reflective structures 116 capable of reflecting lasers are formed on the upper surface of the conductive layer 112. In this way, when the laser irradiation is offset, on the one hand, more laser light can be reflected and dispersed, and on the other hand, the probability of the offset laser light being reflected is increased. As long as the laser light is irradiated to the reflective structure 116 of the partial wavy structure, it can be reflected and dispersed, thereby reducing the laser light entering the conductive layer 112.

[0059] like Figure 4 As shown, let the thickness of the concave portion 120 be H1, let the thickness of the convex portion 122 be H2, wherein 1 / 2H1<H2

[0060] Assume that the arc formed by the concave portion 120 or the convex portion 122 is a, where 45°≦a≦135°, so that the arcs of the concave portion 120 and the convex portion 122 formed on the upper surface of the conductive layer 112 reflect the most laser. Figure 3 The reflected laser light will not reach the adjacent concave portion 120 or convex portion 122 and be blocked, but will be reflected again, thereby further reducing the laser light entering the conductive layer 112 .

[0061] Figure 5 is a schematic diagram of the shape structure of the reflection structure provided in the first embodiment of the present application, such as​ Figure 5 As shown, combined Figure 4 The wavy reflective structure 116 may be formed by a combination of a triangular convex structure 118 and a triangular concave structure 117, or may be formed by a combination of an arc-shaped convex structure 118 and an arc-shaped concave structure 117. Of course, it may also be formed by a combination of a plurality of triangular protrusions to form a convex structure 118 and a combination of a plurality of triangular grooves to form a concave structure 117. The specific design depends on the actual application and is not limited here.

[0062] Figure 6 is a schematic diagram of the process steps of the method for preparing a display panel provided in this application, Figure 7 Schematic diagram of the process of preparing the reflective structure of the first embodiment of the present application. Figure 6 As shown, combined Figure 7 It can be seen that the present application also discloses a method for preparing a display panel 100, which is used for preparing the display panel 100 as described above, and comprises the following steps:

[0063] S1: Provide substrate;

[0064] S2: forming a conductive layer on the substrate;

[0065] S3: processing a portion of the upper surface of the conductive layer by a process to form a reflective structure on the upper surface of the conductive layer;

[0066] S4: forming a plurality of drive electrodes arranged at intervals above the conductive layer to form a drive backplane;

[0067] S5: using a transfer substrate to move a plurality of light-emitting devices to above the driving backplane, and the light-emitting devices are bound to the driving electrodes in a one-to-one correspondence;

[0068] S6: using laser to irradiate the position corresponding to the light emitting device, so that the light emitting device falls off from the transfer substrate and is bound and connected with the driving electrode to form a bound display panel.

[0069] In this way, the reflective structure 116 can be formed on the upper surface of the conductive layer 112 without adding additional process technology, so as to reduce the damage of the laser irradiation to the metal circuit inside the display panel 100 .

[0070] Figure 8 yes Figure 6 Schematic diagram of the process steps for preparing the conductive layer, such as Figure 8 As shown, the step of forming a conductive layer on the substrate comprises the steps of:

[0071] S21: coating a metal material on the substrate to form a metal layer;

[0072] S22: performing patterning on the metal layer to form a first connector and a second connector that are spaced apart;

[0073] S23: applying an insulating material corresponding to the upper part of the first connector and the second connector and between the first connector and the second connector to form an insulating layer;

[0074] S24: patterning the insulating layer to form an insulating layer disposed only between the first connector and the second connector;

[0075] S25: coating a metal material on the first connector, the second connector, and the insulating layer to form a conductive layer.

[0076] Among them, in the process of forming the reflective structure, a mask can be used to make the light transmittance at different positions different, and the process can be completed using exposure and development technology, which will not be described in detail here.

[0077] Second embodiment:

[0078] Fig. 9 is a schematic diagram of the cross-sectional structure of the driving backplane provided in the second embodiment of the present application, such as Fig. 9 As shown, as the second embodiment of the present application, this embodiment is different from the first embodiment in that the height of the first connector 119 is less than the height of the second connector 121, the insulating layer 140 cooperates with the first connector 119 to form a concave matching portion, the insulating layer 140 cooperates with the second connector 121 to form a convex matching portion, each concave matching portion is connected to each convex matching portion, and a second wavy structure 115 is formed on the upper surface of the insulating layer 140 away from the substrate 111, the concave portion 120 cooperates with the concave matching portion, and the second wavy structure 115 is formed on the upper surface of the insulating layer 140 away from the substrate 111. The convex portion 122 cooperates with the convex mating portion, so that the conductive layer 112 forms the reflective structure 116 of the first wavy structure away from the upper surface of the insulating layer 140, wherein the thickness of the concave portion 120 is equal to the thickness of the convex portion 122, that is, H3=H4, and along the extension direction of the first wavy structure and the second wavy structure 115, the width of the concave portion 120 is equal to the width of the convex portion 122, so that the thickness and width of the conductive layer 112 above the insulating layer 140 are equal, and the conductivity can be almost consistent.

[0079] Fig.10 is a schematic diagram of the process for preparing a reflective structure provided in the second embodiment of the present application, Fig.11 is a schematic diagram of the process steps for preparing the conductive layer provided in the second embodiment of the present application, combined with Figure 9-11In the case of adopting the above design, in the steps of preparing the display panel 100, the step of forming a conductive layer on the substrate includes the following steps:

[0080] S21: coating a metal material on the substrate to form a metal layer;

[0081] S22: performing patterning on the metal layer to form a first connector and a second connector that are spaced apart;

[0082] S23: applying an insulating material corresponding to the upper part of the first connector and the second connector and between the first connector and the second connector to form an insulating layer;

[0083] S24: performing a patterning process on the insulating layer to remove the insulating layer on the upper surface of the first connector, so that a second wavy structure is formed on the upper surface of the insulating layer;

[0084] S25: coating a metal material on the first connector, the second connector, and the insulating layer to form a conductive layer having a reflective structure.

[0085] Third embodiment:

[0086] As the third embodiment of the present application, this embodiment is different from the first and second embodiments in that the upper surface of the spacer area 150 and the upper surface of the connection area 160 both form the reflective structure 116;

[0087] The driving electrode 113 includes a driving electrode body 114 and a second wavy structure 115. The second wavy structure 115 is arranged on a side of the driving electrode body 114 close to the reflective structure 116. The second wavy structure 115 is fixedly matched with the reflective structure 116, that is, the shape of the second wavy structure 115 is the same as that of the reflective structure 116, and they match each other, wherein the second wavy structure 115 is formed integrally with the driving electrode body 114.

[0088] Since the driving electrode 113 is connected and bound to the light-emitting device 180, when the light-emitting device 180 is transferred in large quantities, the laser is mainly irradiated at the position corresponding to the adsorbed light-emitting device 180. Therefore, at the position corresponding to the driving electrode 113, the conductive layer 112 is also made to have a reflective structure 116. In this way, through the cooperation of the driving electrode 113 and the reflective structure 116 of the entire conductive layer 112, a reflective effect can be played at the position where the laser is irradiated, so as to better reduce the laser from entering the conductive layer 112 and avoid damaging the internal metal circuit.

[0089] At the same time, the design of the second wavy structure 115 also increases the surface area of ​​the connection between the driving electrode 113 and the conductive layer 112 , thereby enhancing the adhesion between the two and ensuring the reliability of the display panel 100 .

[0090] In this embodiment, after forming the reflective structure 116 on the upper surface of the conductive layer 112 , a metal material is coated on the conductive layer 112 , and then a mask is used to expose and develop the different light transmittances at different positions to form a wavy driving electrode 113 .

[0091] Fourth embodiment:

[0092] Fig.12 is a schematic cross-sectional structure diagram of a display panel provided in a fourth embodiment of the present application, Fig.13 yes Fig.12 Schematic diagram of the cross-sectional structure of the driving electrode. Fig.14 yes Fig.13 A schematic diagram of the three-dimensional structure of the first driving electrode or the second driving electrode, such as Figure 12-14 As shown, as the fourth embodiment of the present application, this embodiment is different from the first, second and third embodiments in that the driving electrode 113 includes a first driving electrode body 125, a first driving electrode 123 and a second driving electrode 124, the first binding portion 126 and the first non-binding portion 127 are both arranged on a side of the first driving electrode body 125 away from the conductive layer 112, the first driving electrode 123 includes a first binding portion 126, a first non-binding portion 127 and a first connecting material piece 128, the first non-binding portion 127 is arranged around the first binding portion 126, and the upper surface of the first non-binding portion 127 protrudes from the upper surface of the first binding portion 126, the first non-binding portion 127 cooperates with the first binding portion 126 to form a first matching groove 129, and the first connecting material piece 128 is arranged in the first matching groove 129;

[0093] The second driving electrode 124 includes a second driving electrode body 130, a second binding portion 131, a second non-binding portion 132, and a second connecting material piece 133. The second binding portion 131 and the second non-binding portion 132 are both arranged on a side of the second driving electrode body 130 away from the conductive layer 112. The second non-binding portion 132 is arranged around the second binding portion 131, and the upper surface of the second non-binding portion 132 protrudes from the upper surface of the second binding portion 131. The second non-binding portion 132 cooperates with the second binding portion 131 to form a second matching groove 134. The second connecting material piece 133 is arranged in the second matching groove 134.

[0094] The first binding portion 126 and the second binding portion 131 form a third wavy structure 135 on a surface away from the conductive layer 112, and the first non-binding portion 127 and the second non-binding portion 132 form a fourth wavy structure 136 on a surface away from the conductive layer 112.

[0095] The light-emitting device 180 includes a first connecting electrode 181, a second connecting electrode 182 and a light-emitting chip 183. The light-emitting chip 183 is arranged on the side of the first connecting electrode 181 and the second connecting electrode 182 away from the driving electrode body 114. The first connecting electrode 181 is embedded and fixed in the first matching groove 129, and the second connecting electrode 182 is embedded and fixed in the second matching groove 134. In this way, the first connecting electrode 181 is bound and connected to the first driving electrode 123 through the first connecting material piece 128, and the second connecting electrode 182 is bound and connected to the second driving electrode 124 through the second connecting material piece 133. In addition, the surroundings of the first connecting electrode 181 and the surroundings of the second connecting electrode 182 are surrounded and fixed by the non-binding part having the fourth wavy structure 136, so as to further enhance the stability of the binding of the connecting electrodes.

[0096] Fifth embodiment:

[0097] Fig.15 is a schematic cross-sectional structural diagram of a driving backplane provided in the fifth embodiment of the present application, Fig.16 is a schematic diagram of the process flow of manufacturing the driving electrode provided in the fifth embodiment of the present application, combined with Figure 15-16 As the fifth embodiment of the present application, this embodiment is different from the second, third and fourth embodiments in that a fifth wavy structure 137 is formed on the surface where the substrate 111 is in contact with the insulating layer 140, the first connector 119 and the second connector 121, so that when the first connector 119, the second connector 121 and the insulating layer 140 are subsequently prepared, they can be directly formed by coating without the need for graphic processing, which can save process steps.

[0098] The fifth wavy structure 137 on the substrate 111 can be formed by irradiating the glass substrate 111 with a laser to form an uneven fifth wavy structure 137 on the upper surface of the glass substrate 111; then, insulating material and metal material are successively coated on the substrate 111 to form an insulating layer 140 and a conductive layer 112 of uniform thickness and both having a wavy structure; then, metal material is coated on the conductive layer 112 to form a driving electrode 113 layer; finally, the upper surface of the driving electrode 113 layer is processed by a process to form a first driving electrode 123 and a second driving electrode 124 having a fourth wavy structure 136.

[0099] It should be noted in the above steps that the height of the insulating layer 140 between two adjacent driving electrodes 113 is almost the same as the height of the conductive layer 112 , that is, no patterning is required and the insulating layer 140 can be used to isolate two adjacent driving electrodes 113 .

[0100] The conductive layer 112 between the first connector 119 and the second connector 121 increases the contact area with the binding connection material and the connection electrode to ensure the electrical connection of the light emitting chip 183 . The setting of the driving electrode 113 increases the contact area and protects the conductive layer 112 .

[0101] Of course, when the upper surface of the conductive layer 112 is made into a wavy structure, the wavy structure can be used as a driving electrode 113. At this time, it is only necessary to form a first connector 119 and a second connector 121 that penetrate the insulating layer 140, and then directly connect the first connector 119 and the second connector 121 to the pins of the light-emitting chip 183 by coating a layer of connecting materials such as welding materials on the first connector 119 and the second connector 121. This can further save process.

[0102] Sixth embodiment:

[0103] During binding, high temperature and high pressure will reduce the thickness of the binding connection material, and the excess connection material will be squeezed out, while the remaining connection material plays a role of bonding and electrical connection. Fig.17 is a schematic diagram of the three-dimensional structure of the first driving electrode or the second driving electrode provided in the sixth embodiment of the present application, such as Fig.17 As shown, as the sixth embodiment of the present application, this embodiment is different from the fourth embodiment in that at least one guide structure 170 is provided on the side of the first non-binding part 127 and the second non-binding part 132 away from the driving electrode body 114, which is used for timely discharge of unnecessary connecting materials in the first matching groove 129 and the second matching groove 134 when the first binding part 126 and the first connecting electrode 181 are bound, and when the second binding part 131 and the second connecting electrode 182 are bound, so as to avoid accumulation between the connecting electrode and the driving electrode 113, thereby affecting the electrical connection between the two, and the height of the guide structure 170 is higher than the height of the first binding part 126 and the second binding part 131, so that the connecting material in the first matching groove 129 or the second matching groove 134 is discharged at a slower speed to ensure that there is enough connecting material to adhere to the connecting electrode.

[0104] In addition, in two adjacent driving electrodes 113, the first connecting material piece 128 and the second connecting material piece 133 of the first driving electrode 113 and the first connecting material piece 128 and the second connecting material piece 133 of the second driving electrode 113 are made of different anisotropic materials to avoid the accumulated connecting material from causing a short circuit to the two adjacent light-emitting chips 183.

[0105] Among them, the guide structure 170 can form an open groove on the side of the first non-binding part 127 or the second non-binding part 132 away from the conductive layer 112 along a direction perpendicular to the substrate 111, or the guide structure 170 can penetrate the first non-binding part 127 or the second non-binding part 132 in a horizontal direction to form a through groove.

[0106] Seventh embodiment:

[0107] Fig.18 is a schematic diagram of the matching structure of the light emitting device and the driving backplane provided in the seventh embodiment of the present application, Fig.19 yes Fig.18 Schematic diagram of the three-dimensional structure of the mid-drive backplane, combined with Figure 18-Figure 19 As the seventh embodiment of the present application, this embodiment is different from the fourth embodiment in that, along the direction in which the first driving electrode 123 and the second driving electrode 124 are arranged, the first driving electrode 123 includes a first transverse surface 300, a first inclined surface 311, a second transverse surface 312, a first vertical surface 313, a first side surface 314 and a second side surface 315; the first transverse surface 300 is arranged in contact with the conductive layer 112, the second transverse surface 312 is arranged opposite to the first transverse surface 300, the first inclined surface 311 is arranged opposite to the first vertical surface 313, and are respectively connected to the first transverse surface 300 and the second transverse surface 312; the first side surface 314 is arranged opposite to the second side surface 315, and are respectively connected to the first transverse surface 300, the second transverse surface 312, the first inclined surface 311 and the first vertical surface 313; the first transverse surface 300, the first inclined surface 311, the second transverse surface 312, the first vertical surface 313, the first side surface 314 and the second side surface 315 cooperate to form a first trapezoidal structure;

[0108] The second driving electrode 124 includes a third transverse surface 316, a second inclined surface 317, a fourth transverse surface 318, a second vertical surface 319, a third side surface 320 and a fourth side surface 321. The third transverse surface 316 is arranged adjacent to the conductive layer 112, the fourth transverse surface 318 is arranged opposite to the third transverse surface 316, the second inclined surface 317 is arranged opposite to the second vertical surface 319, and are respectively connected to the third transverse surface 316 and the fourth transverse surface 318, the third side surface 320 is arranged opposite to the fourth side surface 321, and are respectively connected to the third transverse surface 316, the fourth transverse surface 318, the second inclined surface 317 and the second vertical surface 319; the third transverse surface 316, the second inclined surface 317, the fourth transverse surface 318, the second vertical surface 319, the third side surface 320 and the fourth side surface 321 cooperate to form a second trapezoidal structure;

[0109] The shape of the first connecting electrode 181 matches the first trapezoidal structure, and the shape of the second connecting electrode 182 matches the second trapezoidal structure. In this way, the contact area where the binding connecting material can flow is increased. When the connecting electrode is bound to the driving electrode 113, it will not be affected by the fluidity of the binding connecting material, thereby improving the quality and reliability of the product.

[0110] In addition, if Fig.19 As shown, one or more protrusions 322 may be provided above the first inclined surface 311 and the second inclined surface 317, and grooves may be provided on the first connecting electrode 181 and the second connecting electrode 182 to cooperate with the protrusions 322, so as to facilitate identification and accurately transfer different types of light-emitting chips 183, thereby avoiding abnormalities of the display panel 100 caused by incorrect transfer positions.

[0111] The protrusion 322 can be arranged on the first connecting electrode or the second connecting electrode 182, and the groove can also be arranged on the first inclined surface 311 or the second inclined surface 317 accordingly. Moreover, the shape of the protrusion 322 can be rectangular or triangular, etc., which can be designed according to the specific situation and is not limited here.

[0112] It should be noted that the limitations on the various steps involved in this solution, without affecting the implementation of the specific solution, are not deemed to limit the order of the steps. The steps written in front can be executed first, or later, or even simultaneously. As long as this solution can be implemented, it should be deemed to fall within the scope of protection of this application.

[0113] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0114] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. A display panel, comprising a driving backplane, characterized in that: The driving backplane comprises a substrate, a conductive layer and a plurality of driving electrodes, wherein the conductive layer is arranged on the substrate, and the plurality of driving electrodes are arranged at intervals on a side of the conductive layer away from the substrate; in The conductive layer is away from the upper surface of the substrate and at least partially provided with a reflective structure.

2. The display panel according to claim 1, wherein: The reflective structure is formed integrally with the conductive layer, and includes at least one concave structure and at least one convex structure connected to each other, wherein the upper surface of the concave structure is located at a level lower than the upper surface of the convex structure.

3. The display panel according to claim 2, wherein: The driving backplane further includes an insulating layer, the concave surface structure includes a plurality of first connectors and a plurality of concave surface portions, the convex surface structure includes a plurality of second connectors and a plurality of convex surface portions, the first connectors and the second connectors are arranged on the substrate at intervals, the concave surface portions are arranged on a side of the first connector away from the substrate, the convex surface portions are arranged on a side of the second connector away from the substrate, and the concave surface portions are connected to the convex surface portions; The height of the first connector is equal to the height of the second connector, the insulating layer is arranged between the first connector and the second connector, the upper surfaces of the plurality of concave portions and the upper surfaces of the plurality of convex portions are combined to form a first wavy structure, the thickness of the concave portion is set to H1, and the thickness of the convex portion is set to H2, wherein 1 / 2H1<H2<H1.

4. The display panel according to claim 2, wherein: The upper surface of the conductive layer is divided into a plurality of spacing areas and a plurality of connection areas. The plurality of driving electrodes are arranged in one-to-one correspondence with the plurality of connection areas. The spacing area is formed between two adjacent connection areas. The reflective structure is arranged in the spacing area.

5. The display panel according to claim 2, wherein: The display panel further comprises a plurality of light emitting devices, wherein the plurality of light emitting devices are arranged in one-to-one correspondence with the plurality of driving electrodes; The upper surface of the conductive layer is divided into a plurality of spacing areas and a plurality of connection areas, the plurality of driving electrodes are arranged in one-to-one correspondence with the plurality of connection areas, the spacing area is formed between two adjacent connection areas, and the upper surfaces of the spacing areas and the upper surfaces of the connection areas both form the reflective structure; The driving electrode comprises a driving electrode body and a second wavy structure, wherein the second wavy structure is arranged on a side of the driving electrode body close to the reflective structure, and the second wavy structure is fixedly matched with the reflective structure; Wherein, the second wave-shaped structure is formed integrally with the driving electrode body.

6. The display panel according to claim 5, wherein: The driving electrode comprises a first driving electrode and a second driving electrode, the first driving electrode comprises a first driving electrode body, a first binding portion, a first non-binding portion and a first connecting material piece, the first binding portion and the first non-binding portion are both arranged on a side of the first driving electrode body away from the conductive layer, the first non-binding portion is arranged around the first binding portion, and the upper surface of the first non-binding portion protrudes from the upper surface of the first binding portion, the first non-binding portion cooperates with the first binding portion to form a first matching groove, and the first connecting material piece is arranged in the first matching groove; The second driving electrode comprises a second driving electrode body, a second binding portion, a second non-binding portion, and a second connecting material piece, wherein the second binding portion and the second non-binding portion are both arranged at a side of the second driving electrode body away from the conductive layer, the second non-binding portion is arranged around the second binding portion, and the upper surface of the second non-binding portion protrudes from the upper surface of the second binding portion, the second non-binding portion cooperates with the second binding portion to form a second matching groove, and the second connecting material piece is arranged in the second matching groove; Wherein, the surfaces of the first binding portion and the second binding portion away from the conductive layer form a third wavy structure, and the surfaces of the first non-binding portion and the second non-binding portion away from the conductive layer form a fourth wavy structure; The light emitting device comprises a first connecting electrode, a second connecting electrode and a light emitting chip, wherein the light emitting chip is arranged on a side of the first connecting electrode and the second connecting electrode away from the driving electrode body, the first connecting electrode is fixedly engaged with the first matching groove by the first connecting material piece, and the second connecting electrode is fixedly engaged with the second matching groove by the second connecting material piece; Wherein, the first connecting material piece and the second connecting material piece are made of the same material.

7. The display panel according to claim 6, wherein: At least one flow-guiding structure is provided on the side of the first non-binding portion and the second non-binding portion away from the conductive layer; in two adjacent driving electrodes, the first connecting material piece and the second connecting material piece of the first driving electrode and the first connecting material piece and the second connecting material piece of the second driving electrode are made of different anisotropic materials; The height of the guide structure is higher than the height of the first binding portion and the second binding portion, and the guide structure forms an open slot on the side of the first non-binding portion or the second non-binding portion away from the conductive layer in a direction perpendicular to the substrate, or The guide structure passes through the first non-binding portion or the second non-binding portion in a horizontal direction to form a through groove.

8. A method for preparing a display panel, used for preparing the display panel according to any one of claims 1 to 7, characterized in that: Includes steps: providing a substrate; forming a conductive layer on the substrate; Processing a portion of the upper surface of the conductive layer by a process to form a reflective structure on the upper surface of the conductive layer; forming a plurality of drive electrodes spaced apart from each other on the conductive layer to form a drive backplane; Using a transfer substrate to move a plurality of light-emitting devices to above the driving backplane, and the light-emitting devices are bound to the driving electrodes in a one-to-one correspondence; The positions of the light emitting devices are irradiated with laser light, so that the light emitting devices fall off the transfer substrate and are bound and connected with the driving electrodes, so as to form a display panel with a large number of light emitting devices transferred.

9. The method for preparing a display panel according to claim 8, wherein: The step of forming a conductive layer on the substrate comprises the steps of: coating a metal material on the substrate to form a metal layer; Performing patterning on the metal layer to form a first connector and a second connector that are spaced apart; Applying insulating material above the first connector and the second connector and between the first connector and the second connector to form an insulating layer; Patterning the insulating layer to form an insulating layer disposed only between the first connector and the second connector; A metal material is coated on the first connector, the second connector and the insulating layer to form a conductive layer.

10. A display device, comprising the display panel according to any one of claims 1 to 7.

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