Sorting mechanism of silicon wafer sorting machine

Abstract

The invention discloses a sorting mechanism of a silicon wafer sorting machine, which relates to the technical field of silicon wafer production, and comprises a support unit, which comprises a support frame, a shaft sleeve arranged on the end surface of the support frame, a rotating shaft arranged on the inner side of the shaft sleeve, a fixed sleeve arranged on the outer wall of the rotating shaft, a sliding sleeve rod arranged in the fixed sleeve, and a fixed rod arranged on the inner side of the sliding sleeve rod, and the bearing plate is arranged at the end part of the fixed rod. The silicon wafer conveying device has the beneficial effects that through a linkage mechanism of the sliding block and the connecting piece, effective conveying of silicon wafers and automatic discharging of unqualified products are achieved; when vertically moving, the sliding block drives the bearing plate to protrude out of the surface of the conveying belt; further movement enables the bearing plate to turn over along an arc-shaped track, and bad silicon wafers are stably removed; and the device adopts a single control unit, so that the production line structure can be simplified, the hardware investment and the maintenance cost can be reduced, and the space utilization rate and the production efficiency can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer production, in particular to a sorting mechanism of a silicon wafer sorting machine. Background Art

[0002] Silicon wafers, as an important raw material for solar cells, are widely used in the production of solar cells, circuit boards and other products. In the production process of silicon wafers, silicon wafer sorters, as terminal equipment for quality control, detect and grade silicon wafers in terms of size, dirt, hidden cracks, holes, resistivity, etc., to ensure the quality of solar cells, circuit boards and other products made from silicon wafers.

[0003] In the silicon wafer sorting process, the main problems currently faced are the increase in detection production line costs and the decrease in equipment manufacturing efficiency. After the screening process is completed, multiple sets of transmission equipment are needed to control and push unqualified or defective silicon wafers off the production line. This not only complicates the production process, but also increases unnecessary hardware investment and maintenance costs, thereby affecting the overall production efficiency and economic benefits. Summary of the invention

[0004] In view of the above problems or problems existing in the prior art, the present invention is proposed.

[0005] Therefore, an object of the present invention is to provide a sorting mechanism for a silicon wafer sorter, which solves the problem of the existing need for multiple sets of transmission equipment to increase costs in order to push unqualified silicon wafers out of the production line.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: A sorting mechanism of a silicon wafer sorting machine, comprising: a supporting unit, including a supporting frame, a shaft sleeve arranged on the end surface of the supporting frame, a rotating shaft arranged on the inner side of the shaft sleeve, a fixing sleeve arranged on the outer wall of the rotating shaft, a sliding sleeve rod arranged inside the fixing sleeve, a fixing rod arranged on the inner side of the sliding sleeve rod, and a bearing plate arranged on the end of the fixing rod;

[0007] The unloading unit comprises a cross frame arranged inside the supporting frame, a sliding block arranged inside the cross frame, a connecting piece linked with the sliding block, and a hinge seat arranged on the surface of the bearing plate.

[0008] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: the rotating shaft is connected to the fixed sleeve;

[0009] The fixing sleeve includes a waist hole opened on its side wall;

[0010] The sliding sleeve rod comprises a guide rod arranged on a side wall thereof;

[0011] The waist hole is adapted to the guide rod, and the waist hole penetrates the guide rod and extends to the outside thereof;

[0012] The fixed sleeve is slidably connected to the sliding sleeve rod.

[0013] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: the fixing rod is connected to the carrying plate;

[0014] The fixed rod is slidably connected to the sliding sleeve rod;

[0015] The rotating shaft flips along the axis of the sleeve, thereby enabling the angle of the bearing plate to change.

[0016] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: the horizontal frame is connected to the supporting frame;

[0017] The cross frame includes a through hole extending through the surface thereof;

[0018] The sliding block is adapted to the through hole, and the outer wall of the sliding block is in conflict with the inner wall of the through hole.

[0019] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: the connecting member comprises a hinged plate, and a connecting plate arranged at the end of the hinged plate;

[0020] The sliding block includes a groove formed inside the sliding block and a guide rail formed on a side wall of the sliding block;

[0021] The connecting plate is adapted to the guide rail, and the connecting plate penetrates the guide rail and extends outwards.

[0022] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: the end of the hinged plate protrudes from the surface of the sliding block;

[0023] The hinge plate is hinged to the hinge seat.

[0024] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: the connecting member further comprises guide pillars arranged at both ends of the connecting plate;

[0025] The guide post protrudes from the side wall of the sliding block;

[0026] The side wall of the through hole is provided with a displacement groove;

[0027] The guide column is matched with the displacement groove.

[0028] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: the displacement slot includes a vertical portion;

[0029] The sliding block moves along the inner wall of the through hole, and the guide column moves along the inside of the vertical portion, thereby pushing the carrying plate to move along the vertical direction.

[0030] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: the displacement slot further includes an inclined portion;

[0031] The sliding block moves along the inner wall of the through hole, and the guide column moves along the inside of the inclined portion, thereby being able to push the carrying plate to flip over a certain angle.

[0032] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: a driving unit, the output end of the driving unit is connected to the sliding block;

[0033] The transmission unit is installed inside the transmission unit.

[0034] The beneficial effects of the present invention are as follows: the present invention utilizes the linkage mechanism between the connecting member and the sliding block to realize the effective transportation of silicon wafers; when the sliding block moves in the vertical direction, it drives the connecting member to move up and down synchronously, so that the supporting plate connected to the connecting member protrudes from the surface of the conveyor belt; as the sliding block moves further, the connecting member moves along a preset arc trajectory, so that the supporting plate can be flipped at a certain angle, and unqualified silicon wafers can be smoothly transported out of the production line; and the device can adopt a single control unit to realize the transportation of silicon wafers, which can not only simplify the production line structure, reduce hardware investment and maintenance costs, but also improve space utilization and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0036] Figure 1 It is a schematic diagram of the structure of the support unit and the transmission unit of the present invention.

[0037] Figure 2 It is a schematic diagram of the support unit structure of the present invention.

[0038] Figure 3 It is a schematic diagram of the explosion structure of the unloading unit of the present invention.

[0039] Figure 4 It is a partial cross-sectional view of the carrying plate of the present invention.

[0040] Figure 5 For the present invention Figure 4 A partial enlarged view of point A.

[0041] Figure 6 It is a schematic diagram of the structure of the sorting device of the present invention. DETAILED DESCRIPTION

[0042] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0043] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0044] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments.

[0045] Example 1

[0046] Reference Figure 1 to Figure 3 , which is the first embodiment of the present invention, and this embodiment provides a sorting mechanism of a silicon wafer sorting machine, which includes a support unit 1, including a support frame 11, a shaft sleeve 12 arranged on the end surface of the support frame 11, a rotating shaft 13 arranged on the inner side of the shaft sleeve 12, a fixed sleeve 14 arranged on the outer wall of the rotating shaft 13, a sliding sleeve rod 15 arranged inside the fixed sleeve 14, a fixed rod 16 arranged on the inner side of the sliding sleeve rod 15, and a bearing plate 17 arranged at the end of the fixed rod 16.

[0047] In this embodiment, the support plate 17 can play a certain supporting role on the silicon wafer, so that the silicon wafer can be set on the surface of the support plate 17; the sleeve 12 is installed on the surface of the support frame 11, and the rotating shaft 13 passes through the sleeve 12 and can rotate along its axial direction.

[0048] The support frame 11 is a rectangular frame structure, and support columns are installed at the four corners of the bottom thereof to ensure that there is a certain movement space between the support frame 11 and the ground.

[0049] The shaft sleeve 12 is connected to the support frame 11 by bolts, and the shaft sleeve 12 is installed at a position on one side of the frame of the support frame 11.

[0050] The fixed sleeve 14 is welded and fixed to the rotating shaft 13, and the fixed sleeve 14 is slidably connected to the sliding sleeve rod 15; the rotating shaft 13 and the fixed sleeve 14 rotate synchronously;

[0051] The sliding sleeve rod 15 is slidably connected to the fixed rod 16, and one end of the fixed rod 16 is welded and fixed to the bearing plate 17; through the linkage between the fixed rod 16 and the fixed sleeve 14, the rotation of the rotating shaft 13 can drive the bearing plate 17 to flip and move at an angle.

[0052] Specifically, a limit block is disposed on the side wall of the sliding sleeve rod 15 , and a limit groove matched with the limit block is provided inside the fixed sleeve 14 , so that the sliding sleeve rod 15 and the fixed sleeve 14 will not be completely separated.

[0053] It should be noted that the cooperation mode between the fixed rod 16 and the sliding sleeve rod 15 may refer to the cooperation mode between the fixed sleeve 14 and the sliding sleeve rod 15 .

[0054] Specifically, the fixing rod 16 is disposed at a position close to an edge of the carrying plate 17 , and the fixing rod 16 and the carrying plate 17 are fixed by welding.

[0055] Furthermore, the unloading unit 2 includes a cross frame 21 arranged inside the support frame 11, a sliding block 22 arranged inside the cross frame 21, a connecting piece 23 linked to the sliding block 22, and a hinge seat 24 arranged on the surface of the bearing plate 17.

[0056] In this embodiment, the welding machine is fixed between the cross frame 21 and the support frame 11, and the cross frame 21 is arranged at the center of the support frame 11; a through slide groove is opened on the surface of the cross frame 21; and the sliding block 22 is located inside the cross frame 21 to slide.

[0057] The sliding block 22 and the connecting member 23 are linked to each other, and the sliding block 22 can drive the connecting member 23 to move when it moves in the vertical direction. The sliding block 22 can drive the connecting member 23 to move in two motion states when it moves in the vertical direction.

[0058] The sliding block 22 moves along the vertical direction and can drive the connecting member 23 to move along the vertical direction, and then the sliding block 22 continues to move to drive the connecting member 23 to move along an inclined track, so that the connecting member 23 can move along a certain arc track.

[0059] The hinge seat 24 is welded and fixed to the bearing plate 17 , and the hinge seat 24 is located in the center of the bearing plate 17 . The hinge seat 24 is close to the middle of the bearing plate 17 , so as to ensure that the sliding block 22 moves in the vertical direction and pushes the bearing plate 17 to move in the vertical direction.

[0060] The articulated seat 24 and the connecting member 23 are hinged and rotated; when the connecting member 23 moves along an arc trajectory, it can drive the articulated seat 24 to move, and then cooperate with the linkage between the rotating shaft 13 and the fixed rod 16, so as to drive the supporting plate 17 to flip a certain angle; thereby, the silicon wafer located on the surface of the supporting plate 17 can be transported.

[0061] In summary, the present invention utilizes the linkage mechanism between the connecting member and the sliding block to realize the effective transportation of silicon wafers; when the sliding block moves in the vertical direction, it drives the connecting member to move up and down synchronously, so that the supporting plate connected to the connecting member protrudes from the surface of the conveyor belt; as the sliding block moves further, the connecting member moves along a preset arc trajectory, so that the supporting plate can be flipped at a certain angle, and unqualified silicon wafers can be smoothly transported out of the production line; and the present device can adopt a single control unit to realize the transportation of silicon wafers, which can not only simplify the production line structure, reduce hardware investment and maintenance costs, but also improve space utilization and production efficiency.

[0062] Example 2

[0063] Reference Figure 1 to Figure 6 , which is the second embodiment of the present invention, and is different from the first embodiment in that: it also includes: the rotating shaft 13 is connected to the fixed sleeve 14; the fixed sleeve 14 includes a waist hole 141 opened on its side wall; the sliding sleeve rod 15 includes a guide rod 151 arranged on its side wall; the waist hole 141 is adapted to the guide rod 151, and the waist hole 141 penetrates the guide rod 151 and extends to the outside thereof.

[0064] In this embodiment, there are two groups of shaft sleeves 12, which are symmetrically arranged on both sides of the support frame 11; and the rotating shafts 13 are arranged in one group, which pass through the two groups of shaft sleeves 12 and extend outwards.

[0065] There are two sets of fixing sleeves 14 , which are sleeved on the outside of the rotating shaft 13 . The fixing sleeves 14 and the rotating shaft 13 are connected by bolts. The two sets of fixing sleeves 14 are symmetrically arranged at both ends of the rotating shaft 13 .

[0066] The number of the sliding sleeve rods 15 corresponds to the number of the fixed sleeves 14 , and the fixed sleeves 14 and the sliding sleeve rods 15 can slide relative to each other, and ensure that the fixed sleeves 14 and the sliding sleeve rods 15 will not be completely separated.

[0067] Specifically, a guide rod 151 is provided on the outer side of the sliding sleeve rod 15, and a waist hole 141 is opened on the inner wall of the fixed sleeve 14; the guide rod 151 cooperates with the waist hole 141 to ensure that the fixed sleeve 14 and the sliding sleeve rod 15 can slide without completely separating.

[0068] Furthermore, the fixing rod 16 is connected to the bearing plate 17; the fixing rod 16 is slidably connected to the sliding sleeve rod 15; the rotating shaft 13 is turned over along the axis of the sleeve 12, thereby enabling the angle of the bearing plate 17 to change.

[0069] In this embodiment, the number of the fixed rods 16 corresponds to the number of the sliding sleeve rods 15, and the two groups of fixed rods 16 are symmetrically arranged on both sides of the bearing plate 17; the bearing plate 17 can be well supported by the linkage between the fixed sleeve 14 and the fixed rods 16, thereby ensuring that the bearing plate 17 maintains a stable motion state during the movement or flipping process;

[0070] Specifically, the fixing sleeve 14 and the fixing rod 16 cooperate to form a double-stage telescopic mechanism, which can increase the distance between the supporting plate 17 and the rotating shaft 13, thereby ensuring that the rotating shaft 13 and the supporting plate 17 always maintain a linkage state during the flipping process of the supporting plate 17.

[0071] Furthermore, the cross frame 21 is connected to the support frame 11 ; the cross frame 21 includes a through hole 211 penetrating the surface thereof; the sliding block 22 is adapted to the through hole 211 , and the outer wall of the sliding block 22 is in conflict with the inner wall of the through hole 211 .

[0072] In this embodiment, the cross frame 21 and the support frame 11 are fixed by bolt connection, and the cross frame 21 is installed at the center of the support frame 11.

[0073] The through hole 211 is opened at the center of the cross frame 21 , and the through hole 211 is adapted to the sliding block 22 . The sliding block 22 can reciprocate in the vertical direction along the inner wall of the through hole 211 .

[0074] Specifically, the inner wall of the through hole 211 contacts the outer wall of the sliding block 22 , and the sliding block 22 is limited by the through hole 211 , so that the sliding block 22 can move along the vertical direction.

[0075] Furthermore, the connecting member 23 includes a hinge plate 231 and a connecting plate 232 arranged at the end of the hinge plate 231; the sliding block 22 includes a groove 221 opened therein and a guide rail 222 opened on the side wall of the sliding block 22; the connecting plate 232 is adapted to the guide rail 222, and the connecting plate 232 passes through the guide rail 222 and extends outward.

[0076] In this embodiment, the hinge plate 231 includes a head and a rod; and the connecting plate 232 is welded and fixed to the rod; the head of the hinge plate 231 is connected to the hinge seat 24; the groove 221 is opened at the center position of the sliding block 22, and the guide rail 222 passes through the side wall of the sliding block 22, and the guide rail 222 and the groove 221 are connected.

[0077] The rod portion of the hinge plate 231 is disposed inside the groove 221 , and the groove 221 provides a corresponding movement space for the movement of the rod portion of the hinge plate 231 .

[0078] The connecting plate 232 penetrates the guide rail 222 and extends outward, and the connecting plate 232 is disposed so as to be slidable inside the guide rail 222 .

[0079] Furthermore, the end of the hinge plate 231 protrudes from the surface of the sliding block 22 ; the hinge plate 231 is hinged to the hinge seat 24 .

[0080] Specifically, the hinge plate 231 is hinged and rotated with the hinge seat 24 , and the head of the hinge plate 231 is arranged to protrude from the surface of the sliding block 22 , so that there is enough space for the hinge plate 231 to be connected with the hinge seat 24 .

[0081] Furthermore, the connecting member 23 further includes guide posts 233 disposed at both ends of the connecting plate 232 ; the guide posts 233 protrude from the side wall of the sliding block 22 ; a displacement groove 212 is formed on the side wall of the through hole 211 ; and the guide posts 233 are adapted to the displacement groove 212 .

[0082] It should be noted that the guide posts 233 are arranged at both ends of the connecting plate 232, and the guide posts 233 penetrate the guide rail 222 and extend to its outside; the guide posts 233 are adapted to the displacement groove 212, and the guide posts 233 can move along the track inside the displacement groove 212, and the movement track of the hinge plate 231 can be limited by the cooperation between the guide posts 233 and the displacement groove 212.

[0083] Furthermore, the displacement groove 212 includes a vertical portion 2121 ; the sliding block 22 moves along the inner wall of the through hole 211 , and the guide column 233 moves along the inside of the vertical portion 2121 , thereby being able to push the supporting plate 17 to move along the vertical direction.

[0084] It should be noted that the displacement groove 212 includes a vertical portion 2121. When the guide column 233 slides inside the vertical portion 2121, the sliding block 22 moves along the inner wall of the through hole 211. At this time, the guide column 233 slides along the inside of the vertical portion 2121; thereby, the sliding block 22 moves in the vertical direction and can drive the connecting member 23 to move in the vertical direction; thereby, it can drive the supporting plate 17 connected to the connecting member 23 and the hinge seat 24 to move; thereby, the supporting plate 17 can move a certain distance in the vertical direction.

[0085] Furthermore, 212 further includes an inclined portion 2122 ; the sliding block 22 moves along the inner wall of the through hole 211 , and the guide column 233 moves along the inside of the inclined portion 2122 , thereby being able to push the carrying plate 17 to flip to a certain angle.

[0086] It should be noted that the vertical portion 2121 is also provided with an inclined portion 2122 near the upper portion, and the vertical portion 2121 and the inclined portion 2122 are connected to each other; and a certain angle is formed between the vertical portion 2121 and the inclined portion 2122, and the angle is greater than ninety degrees;

[0087] When the guide column 233 moves to the top position along the vertical portion 2121, the sliding block 22 continues to move along the through hole 211; at this time, the guide column 233 moves to the inner side of the inclined portion 2122, and as the sliding block 22 moves upward, the connecting member 23 is subjected to an upward extrusion force, and since the inclined portion 2122 is an inclined structure, the guide column 233 is squeezed by the inner wall of the inclined portion 2122 during the movement, so that the guide column 233 is subjected to a horizontal force, so that the connecting plate 232 can move along the track inside the guide rail 222.

[0088] Specifically, the hinge plate 231 is subjected to the upward force of the sliding block 22 to move upward, and at the same time, it is subjected to the reverse force of the inner wall of the inclined portion 2122 to enable the hinge plate 231 to move in the horizontal direction, thereby making the movement trajectory of the hinge plate 231 arc-shaped; and the hinge plate 231 is hinged to the hinge seat 24, and the hinge plate 231 can drive the hinge seat 24 to move along its movement trajectory during the movement, and the movement of the hinge seat 24 can drive the supporting plate 17 connected thereto to move, thereby causing the supporting plate 17 to flip along the axial direction of the rotating shaft 13.

[0089] When in use, when the inspection equipment detects unqualified silicon wafers, the control system is used to transport the silicon wafers to the surface of the carrier plate 17; then the actuator can be used to push the carrier plate 17 to move, so that the carrier plate 17 moves a certain distance and then flips to send the defective silicon wafers out of the production line; specifically, the sliding block 22 is pushed to move along the inner wall of the through hole 211, so that the sliding block 22 moves along the vertical direction. At this time, the guide column 233 is located on the inner side of the vertical portion 2121, and the cooperation between the guide column 233 and the vertical portion 2121 makes the connecting member 23 and the sliding block 22 move synchronously; as the connecting member 23 continues to move, the carrier plate 17 is subjected to an upward force, and as the carrier plate 17 moves, the fixed rod 16 and the sliding sleeve rod 15 can be driven to slide relative to each other, so that the distance between the fixed rod 16 and the sliding sleeve rod 15 increases; then the carrier plate 17 can be lifted to a certain height in the vertical direction; then the sliding The moving block 22 continues to move along the inner wall of the through hole 211. At this time, the guide column 233 moves to the inside of the inclined portion 2122. Through the cooperation between the guide column 233 and the inclined portion 2122, when the sliding block 22 continues to move upward, the guide column 233 is squeezed by the inner wall of the inclined portion 2122, so that the height of the hinge plate 231 is increased, and the connecting plate 232 slides along the inner wall of the guide rail 222. In this state, the movement trajectory of the hinge plate 231 is an arc structure; and the hinge plate 231 is hinged to the hinge seat 24, so that the hinge seat 24 drives the carrying plate 17 to move along the movement trajectory of the hinge plate 231; and the carrying plate 17 flips along the axial direction of the rotating shaft 13. When the carrying plate 17 flips, it can drive the cooperation between the fixing rod 16 and the fixing sleeve 14 to gradually increase, so that the telescopic member is in an open state; and then the flipping of the carrying plate 17 can transport the silicon wafer placed on its surface out.

[0090] In summary, by cooperating with the connecting member 23 and the sliding block 22 with the displacement groove 212, it is possible to drive the carrier plate 17 to flip over after the upward movement angle, so that the silicon wafers can be efficiently transported out of the production line. By using a single actuator, the working process is more efficient and faster, which can save costs to a certain extent.

[0091] Example 3

[0092] Reference Figure 1 to Figure 3 and Figure 6 The third embodiment of the present invention is different from the first two embodiments in that it includes a driving unit 3 , the output end of the driving unit 3 is connected to the sliding block 22 ; and a transmission unit 4 , the driving unit 3 is installed inside the transmission unit 4 .

[0093] In this embodiment, the transmission unit 4 uses a rotating wheel to drive a conveyor belt to transport silicon wafers; the transmission unit 4 is installed on a silicon wafer production line, and a corresponding silicon wafer detection unit M is installed on the production line; the silicon wafer detection unit M can quickly identify defective or unqualified silicon wafers.

[0094] It should be noted that the output end of the drive unit 3 is connected to the sliding block 22; the drive unit 3 adopts a pneumatic telescopic rod, and its output end can push the sliding block 22 to move along the inner wall of the through hole 211 in the vertical direction, thereby achieving the purpose of first moving the supporting plate 17 upward in the vertical direction, and then flipping the supporting plate 17 along the axis of the rotating shaft 13.

[0095] Specifically, a large number of displacement sensors and control elements are installed on the silicon wafer, and their cooperation can ensure efficient and stable movement of the silicon wafer.

[0096] Under normal conditions, the height of the carrier plate 17 is lower than the surface of the transmission unit 4 , so that the silicon wafers will not be disturbed by the carrier plate 17 during transportation, thereby ensuring efficient and stable transportation of the silicon wafers.

[0097] When it is necessary to push unqualified silicon wafers out of the production line, the drive unit 3 can control the carrier plate 17 to move a certain distance in the vertical direction, so that the carrier plate 17 can protrude from the surface of the transmission unit 4, and then as the output end of the drive unit 3 continues to move, the carrier plate 17 is flipped along the axial direction of the rotating shaft 13, so that the silicon wafer can be transported to the outside of the production line.

[0098] When unqualified silicon wafers are detected, the output end of the drive unit 3 is connected to the sliding block 22. The pneumatic telescopic rod can be used to push the sliding block 22 in the vertical direction, so that the carrier plate 17 first moves upward and then flips along the axis of the rotating shaft 13, thereby removing the unqualified silicon wafers from the production line. This mechanism ensures that even during the transportation of silicon wafers, the carrier plate 17 will not interfere with the normal transmission process, ensuring the efficiency and stability of silicon wafer transmission.

[0099] It is important to note that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A sorting mechanism of a silicon wafer sorting machine, characterized in that: include, A support unit (1), comprising a support frame (11), a shaft sleeve (12) arranged on the end surface of the support frame (11), a rotating shaft (13) arranged on the inner side of the shaft sleeve (12), a fixing sleeve (14) arranged on the outer wall of the rotating shaft (13), a sliding sleeve rod (15) arranged inside the fixing sleeve (14), a fixing rod (16) arranged on the inner side of the sliding sleeve rod (15), and a bearing plate (17) arranged on the end of the fixing rod (16); The unloading unit (2) comprises a cross frame (21) arranged inside the support frame (11), a sliding block (22) arranged inside the cross frame (21), a connecting piece (23) linked to the sliding block (22), and a hinge seat (24) arranged on the surface of the carrying plate (17).

2. The sorting mechanism of the silicon wafer sorting machine according to claim 1, characterized in that: The rotating shaft (13) is connected to the fixing sleeve (14); The fixing sleeve (14) comprises a waist hole (141) opened on its side wall; The sliding sleeve rod (15) comprises a guide rod (151) arranged on a side wall thereof; The waist hole (141) is adapted to the guide rod (151), and the waist hole (141) penetrates the guide rod (151) and extends to the outside thereof; The fixed sleeve (14) is slidably connected to the sliding sleeve rod (15).

3. The sorting mechanism of the silicon wafer sorting machine according to claim 1 or 2, characterized in that: The fixing rod (16) is connected to the carrying plate (17); The fixed rod (16) is slidably connected to the sliding sleeve rod (15); The rotating shaft (13) turns over along the axis of the shaft sleeve (12), thereby enabling the angle of the bearing plate (17) to change.

4. The sorting mechanism of the silicon wafer sorting machine according to claim 3, characterized in that: The cross frame (21) is connected to the support frame (11); The cross frame (21) comprises a through hole (211) penetrating the surface thereof; The sliding block (22) is adapted to the through hole (211), and the outer wall of the sliding block (22) is in conflict with the inner wall of the through hole (211).

5. The sorting mechanism of the silicon wafer sorting machine according to claim 4, characterized in that: The connecting member (23) comprises a hinge plate (231) and a connecting plate (232) arranged at the end of the hinge plate (231); The sliding block (22) comprises a groove (221) formed inside the sliding block, and a guide rail (222) formed on a side wall of the sliding block (22); The connecting plate (232) is adapted to the guide rail (222), and the connecting plate (232) penetrates the guide rail (222) and extends outward.

6. The sorting mechanism of the silicon wafer sorting machine according to claim 5, characterized in that: The end of the hinge plate (231) protrudes from the surface of the sliding block (22); The hinge plate (231) is hinged to the hinge seat (24).

7. The sorting mechanism of the silicon wafer sorting machine according to claim 6, characterized in that: The connecting member (23) further comprises guide pillars (233) arranged at both ends of the connecting plate (232); The guide column (233) protrudes from the side wall of the sliding block (22); The side wall of the through hole (211) is provided with a displacement groove (212); The guide column (233) is adapted to the displacement groove (212).

8. The sorting mechanism of the silicon wafer sorting machine according to claim 7, characterized in that: The displacement groove (212) comprises a vertical portion (2121); The sliding block (22) moves along the inner wall of the through hole (211), and the guide column (233) moves along the inside of the vertical portion (2121), thereby being able to push the supporting plate (17) to move along the vertical direction.

9. The sorting mechanism of the silicon wafer sorting machine according to claim 7, characterized in that: The displacement groove (212) further includes an inclined portion (2122); The sliding block (22) moves along the inner wall of the through hole (211), and the guide column (233) moves along the inside of the inclined portion (2122), thereby being able to push the supporting plate (17) to flip at a certain angle.

10. The sorting mechanism of the silicon wafer sorting machine according to any one of claims 1, 2, 4, 6-9, characterized in that: Also includes, A driving unit (3), wherein an output end of the driving unit (3) is connected to the sliding block (22); A transmission unit (4), wherein the driving unit (3) is installed inside the transmission unit (4).

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