Film hole precision monitoring and machining system and working method thereof

Abstract

The invention discloses a film hole precision monitoring and processing system and a working method thereof. The film hole precision monitoring and processing system comprises a femtosecond laser, a first beam splitter, a working laser assembly, a detection laser assembly, a first semi-transparent mirror and a monitoring assembly. Wherein the first beam splitting sheet is used for splitting laser emitted by the femtosecond laser into a first light beam and a second light beam; the first light beam enters the working laser assembly to be subjected to delay processing. The first light beam and the second light beam pass through the first semi-transparent mirror and are projected to the surface of a material in sequence. The monitoring assembly detects the surface of the material based on the reflected second light beam. The first beam splitting piece is used for splitting the same laser into the first light beam for laser processing and the second light beam for detection, the first light beam is delayed through the delay mechanism, it is ensured that the second light beam reaches the surface of a material in one step to complete surface detection, then the first light beam processes the material, and mutual interference of the two light beams is avoided. The invention relates to the field of femtosecond laser micromachining.

Description

Technical Field

[0001] The present application relates to the field of femtosecond laser micromachining, and in particular to an air film hole precision monitoring and processing system and a working method thereof. Background Art

[0002] During femtosecond laser processing, due to the high energy of the laser and the existence of Rayleigh length, the processed laser usually has a certain depth, and within a certain defocus distance range, it has a destructive effect on the material. In equipment that requires air film holes, the upper layer of the air film holes is usually a thermal conductive material, and the lower surface is a sealing material for various circuits and other modules in the equipment. If the distance between the two layers of material is close, when using femtosecond laser to process multi-layer materials, the problem of destroying the lower layer of material while processing the upper layer of material will occur, so a means of processing and detecting at the same time is needed.

[0003] In order to detect the processing status of the material surface, during the processing, the detection light should reach the sample surface before the processing light for detection and provide feedback. In this way, before the next pulse arrives, it can be determined whether processing needs to be continued, or the laser energy can be adjusted to prevent breakdown of the underlying material. Summary of the invention

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a precision monitoring and processing system for air film holes, which can detect the processing state of the material surface, thereby performing closed-loop control on the laser processing process.

[0005] The present application also proposes a working method for the above-mentioned air film hole precision monitoring and processing system.

[0006] According to the first aspect of the present application, the air film hole precision monitoring and processing system includes:

[0007] Femtosecond lasers;

[0008] A first beam splitter, used for splitting the laser light emitted by the femtosecond laser into a first light beam and a second light beam, wherein the energy of the first light beam is higher than the energy of the second light beam;

[0009] A working laser assembly, comprising a delay mechanism, wherein the delay mechanism comprises a first delay reflector group, a second delay reflector group and a linear motor, wherein the first light beam is sequentially reflected by the first delay reflector group and the second delay reflector group, wherein the linear motor is connected to the second delay reflector group, and wherein the linear motor drives the second delay reflector group to move so as to adjust the distance between the second delay reflector group and the first delay reflector group;

[0010] A detection laser assembly, comprising a BBO chip, wherein the BBO chip is used to adjust the output power of the second light beam;

[0011] a first semi-transparent mirror, used for reflecting the first light beam to a material surface and allowing the second light beam to pass through so as to irradiate the material surface;

[0012] Monitoring component, the second light beam is reflected by the material surface to the monitoring component.

[0013] According to the air film hole precision monitoring and processing system of the embodiment of the present application, there are at least the following beneficial effects: a first beam splitter is used to split the same laser into a first beam for laser processing and a second beam for detection, the first beam is delayed by a delay mechanism to ensure that the second beam reaches the material surface first to complete the surface detection, and then the first beam processes the material to avoid mutual interference between the two beams.

[0014] According to some embodiments of the present application, the ratio of the energy of the first light beam to the energy of the second light beam is 9:1.

[0015] According to some embodiments of the present application, the first delay reflector group includes a first reflector and a second reflector, the second delay reflector group includes a third reflector and a fourth reflector, and the first light beam passes through the first reflector, the third reflector, the fourth reflector and the second reflector in sequence.

[0016] According to some embodiments of the present application, a beam reduction component is provided in the working laser component and the detection laser component. The beam reduction component includes a biconvex lens and a plano-concave-convex mirror. The light beam passes through the biconvex lens and the plano-concave-convex mirror in sequence to reduce the beam spot.

[0017] According to some embodiments of the present application, the working laser assembly and the detection laser assembly are both provided with a first half-wave plate and a Glan prism, the first half-wave plate is mounted on a rotating motor, and the light beam passes through the first half-wave plate and the Glan prism in sequence.

[0018] According to some embodiments of the present application, the detection laser assembly is further provided with a second half-wave plate, which is arranged before the BBO chip and is used to adjust the energy of the second light beam incident on the BBO chip.

[0019] According to some embodiments of the present application, the detection laser assembly also includes a second semi-transparent mirror and a light baffle, the second semi-transparent mirror reflects the second light beam to the first semi-transparent mirror, and the light baffle is mounted on one side of the second semi-transparent mirror to absorb the light passing through the second semi-transparent mirror.

[0020] According to some embodiments of the present application, the air film hole precision monitoring and processing system further includes a focusing mirror, which focuses both the first light beam and the second light beam on the material surface.

[0021] According to some embodiments of the present application, the monitoring component includes a second beam splitter, a photodetector and a variable-focus monitoring CCD. The second light beam reflected by the surface of the material passes through the second beam splitter, and the second beam splitter splits the second light beam into two light beams that are incident on the photodetector and the variable-focus monitoring CCD.

[0022] According to the working method of the second aspect of the present application, the working method is performed on the above-mentioned air film hole precision monitoring processing system, and includes the following steps:

[0023] The femtosecond laser emits laser light and projects it onto the first beam splitter;

[0024] The first beam splitter splits the laser into the first beam and the second beam, wherein the first beam is emitted into the working laser assembly, and the second beam is emitted into the detection laser assembly;

[0025] The first light beam passes through the first delay reflector group and the second delay reflector group in sequence, and the linear motor adjusts the distance between the first delay reflector group and the second delay reflector group, thereby changing the propagation time of the first light beam;

[0026] The second light beam passes through the BBO chip to adjust the output power;

[0027] The second light beam reaches the first semi-transparent mirror before the first light beam, and is projected onto the surface of the material through the first semi-transparent mirror;

[0028] The second light beam is reflected by the surface of the material to the monitoring component to detect the current condition of the surface of the material;

[0029] The first light beam reaches the first semi-transparent mirror and is reflected by the first semi-transparent mirror to the surface of the material, and the first light beam performs laser processing on the material.

[0030] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings are used to provide further understanding of the technical solution disclosed in the present application and constitute a part of the specification. Together with the embodiments disclosed in the present application, they are used to explain the technical solution disclosed in the present application and do not constitute a limitation on the technical solution disclosed in the present application.

[0032] Figure 1 This is a structural schematic diagram of the air film hole precision monitoring and processing system according to the first aspect of the present application;

[0033] Figure 2 This is a schematic diagram of the time delay of the first light beam and the second light beam in the air film hole precision monitoring processing system in the first aspect of the embodiment of the present application.

[0034] Figure numerals: 100-femtosecond laser, 200-first beam splitter, 210-first light beam, 220-second light beam, 310-delay mechanism, 311-first delay mirror group, 312-second delay mirror group, 313-first mirror, 314-second mirror, 315-third mirror, 316-fourth mirror, 317-linear motor, 410-BBO chip, 420-second half-wave plate, 430-second semi-transparent mirror, 440-light baffle, 500-first semi-transparent mirror, 600-monitoring component, 610-second beam splitter, 620-photodetector, 630-variable focus monitoring CCD, 700-beam reduction component, 710-double convex lens, 720-plano-concave-convex mirror, 800-first half-wave plate, 900-Glan prism, 1000-focusing mirror. DETAILED DESCRIPTION

[0035] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0036] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0037] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0038] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0039] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0040] During femtosecond laser processing, due to the high energy of the laser and the existence of Rayleigh length, the processed laser usually has a certain depth, and within a certain defocus distance range, it has a destructive effect on the material. In equipment that requires air film holes, the upper layer of the air film holes is usually a thermal conductive material, and the lower surface is a sealing material for various circuits and other modules in the equipment. If the distance between the two layers of material is close, when using femtosecond laser to process multi-layer materials, the problem of destroying the lower layer of material while processing the upper layer of material will occur, so a means of processing and detecting at the same time is needed.

[0041] In order to detect the processing status of the material surface, during the processing, the detection light should reach the sample surface before the processing light for detection and provide feedback. In this way, before the next pulse arrives, it can be determined whether processing needs to be continued, or the laser energy can be adjusted to prevent breakdown of the underlying material.

[0042] In this regard, the present application proposes a precise monitoring and processing system for air film holes, which uses a first beam splitter 200 to split the same laser into a first beam 210 for laser processing and a second beam 220 for detection. The first beam 210 is delayed by a delay mechanism 310 to ensure that the second beam 220 reaches the material surface first to complete surface detection, and then the first beam 210 processes the material to avoid mutual interference between the two beams.

[0043] In addition, the present application also proposes a working method for the above-mentioned air film hole precision monitoring and processing system.

[0044] Reference Figure 1The air film hole precision monitoring and processing system in the embodiment of the first aspect of the present application includes a femtosecond laser 100, a first beam splitter 200, a working laser component, a detection laser component, a first semi-transparent mirror 500 and a monitoring component 600. The femtosecond laser 100 is used to generate laser light, and the first beam splitter 200 is used to split the laser light emitted by the femtosecond laser 100 into a first light beam 210 and a second light beam 220. The first light beam 210 is injected into the working laser component, and is delayed by the delay mechanism 310 therein, and the second light beam 220 is injected into the detection laser component to adjust the laser power. Both the first light beam 210 and the second light beam 220 pass through the first semi-transparent mirror 500 and are successively projected onto the surface of the material. The second light beam 220 is reflected from the surface of the material to the monitoring component 600, and is detected by the monitoring component 600; the first light beam 210 performs laser processing on the surface of the material.

[0045] Specifically, the energy of the first light beam 210 is higher than that of the second light beam 220, and the energy ratio between the two is 9:1, which ensures that the first light beam 210 has higher energy than the second light beam 220 to complete the laser processing work, and avoids the second light beam 220 from causing damage to the material surface during the detection process due to excessive energy.

[0046] The working laser assembly includes a delay mechanism 310, and the delay mechanism 310 includes a first delay mirror group 311, a second delay mirror group 312 and a linear motor 317. The first light beam 210 is reflected by the first delay mirror group 311 and the second delay mirror group 312 in sequence. The linear motor 317 is connected to the second delay mirror group 312, and the linear motor 317 drives the second delay mirror group 312 to move to adjust the distance between it and the first delay mirror group 311. When the distance between the first delay mirror group 311 and the second delay mirror group 312 increases, the propagation distance of the first light beam 210 becomes longer to enhance its delay effect; when the distance between the first delay mirror group 311 and the second delay mirror group 312 decreases, the propagation distance of the first light beam 210 becomes shorter to weaken its delay effect. Refer to Figure 2 , which can realize the delay control of the first light beam 210.

[0047] The detection laser assembly includes a BBO chip 410, which is used to adjust the output power of the second light beam 220 to prevent the energy from being too high and damaging the material.

[0048] The first semi-transparent mirror 500 is used to reflect the first light beam 210 to the surface of the material, and to allow the second light beam 220 to pass through and illuminate the surface of the material. After passing through the first semi-transparent mirror 500, the first light beam 210 and the second light beam 220 merge and maintain the same optical path to be projected onto the surface of the material. Since the surface of the material is relatively smooth, the second light beam 220 can be reflected, and the reflected second light beam 220 enters the monitoring component 600 and is sensed by the sensor therein.

[0049] Further, for the delay mechanism 310, the first delay reflector group 311 includes a first reflector 313 and a second reflector 314, and the second delay reflector group 312 includes a third reflector 315 and a fourth reflector 316. The first light beam 210 passes through the first reflector 313, the third reflector 315, the fourth reflector 316 and the second reflector 314 in sequence, and is finally projected from the second reflector. The optical path of the first light beam 210 in the delay mechanism 310 is "U"-shaped, and the first light beam 210 propagates back and forth between the first delay reflector group 311 and the second delay reflector group 312, so that when the linear motor 317 changes the spacing between the first delay reflector group 311 and the second delay reflector group 312, the delay effect on the first light beam 210 is more obvious.

[0050] Furthermore, both the working laser assembly and the detection laser assembly are provided with a beam reduction assembly 700, which includes a biconvex lens 710 and a plano-concave-convex mirror 720. The light beam passes through the biconvex lens 710 and the plano-concave-convex mirror 720 in sequence to reduce the light beam spot.

[0051] Furthermore, the working laser assembly and the detection laser assembly are both provided with a first half-wave plate 800 and a Glan prism 900, the first half-wave plate 800 is mounted on the rotating motor, and the light beam sequentially passes through the first half-wave plate 800 and the Glan prism 900. The processing light energy can be infinitely adjusted from 0 to 100% to realize controllable detection light energy.

[0052] Furthermore, the detection laser assembly is further provided with a second half-wave plate 420 , which is arranged before the BBO chip 410 and is used to adjust the energy of the second light beam 220 incident on the BBO chip 410 .

[0053] Furthermore, the detection laser assembly also includes a second semi-transparent mirror 430 and a light blocking plate 440. The second semi-transparent mirror 430 reflects the second light beam 220 to the first semi-transparent mirror 500. The light blocking plate 440 is mounted on one side of the second semi-transparent mirror 430 to absorb the light passing through the second semi-transparent mirror 430 to prevent the transmitted laser from damaging other components.

[0054] Furthermore, the air film hole precision monitoring and processing system also includes a focusing lens 1000, which focuses both the first light beam 210 and the second light beam 220 on the material surface.

[0055] Furthermore, the monitoring component 600 includes a second beam splitter 610, a photodetector 620 and a variable focus monitoring CCD 630. The second light beam 220 reflected by the surface of the material passes through the second beam splitter 610, and the second beam splitter 610 splits the second light beam 220 into two light beams incident on the photodetector 620 and the variable focus monitoring CCD 630. The photodetector is used to detect the light amplitude of the second light beam 220, and the intensity information of the reflection of the material surface can be obtained. Another beam of light split by the second beam splitter 610 is used as a light source to illuminate the variable focus monitoring CCD 630, and the surface state of the material can be observed.

[0056] It is worth noting that the present air film hole precision monitoring and processing system also includes a controller, which can receive monitoring data from the monitoring component 600, provide feedback to the femtosecond laser 100 by observing the degree of surface processing of the material, adjust the energy and spot, reduce the energy and shorten the Rayleigh distance, and perform low-energy precision processing.

[0057] It is easy to understand that the air film hole precision monitoring and processing system is also provided with a number of reflectors to adjust the optical path, thereby adapting to the internal structure of the equipment, which will not be elaborated here.

[0058] A working method for the above-mentioned air film hole precision monitoring processing system in the second embodiment of the present application includes the following steps:

[0059] S100. The femtosecond laser 100 emits laser light and projects it onto the first beam splitter 200;

[0060] S200. The first beam splitter 200 splits the laser into a first beam 210 and a second beam 220, wherein the first beam 210 is injected into the working laser assembly, and the second beam 220 is injected into the detection laser assembly;

[0061] S300. The first light beam 210 passes through the first delay mirror group 311 and the second delay mirror group 312 in sequence, and the linear motor 317 adjusts the distance between the first delay mirror group 311 and the second delay mirror group 312, thereby changing the propagation time of the first light beam 210;

[0062] S400. The second light beam 220 passes through the BBO chip 410 to adjust the output power;

[0063] S500. The second light beam 220 reaches the first semi-transparent mirror 500 before the first light beam 210, and is projected onto the surface of the material through the first semi-transparent mirror 500;

[0064] S600. The second light beam 220 is reflected by the material surface to the monitoring component 600 to detect the current condition of the material surface;

[0065] S700. The first light beam 210 reaches the first semi-transparent mirror 500 and is reflected by it to the surface of the material. The first light beam 210 performs laser processing on the material.

[0066] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A precision monitoring and processing system for air film holes, characterized in that: include: Femtosecond lasers; A first beam splitter, used for splitting the laser light emitted by the femtosecond laser into a first light beam and a second light beam, wherein the energy of the first light beam is higher than the energy of the second light beam; A working laser assembly, comprising a delay mechanism, wherein the delay mechanism comprises a first delay reflector group, a second delay reflector group and a linear motor, wherein the first light beam is sequentially reflected by the first delay reflector group and the second delay reflector group, wherein the linear motor is connected to the second delay reflector group, and wherein the linear motor drives the second delay reflector group to move so as to adjust the distance between the second delay reflector group and the first delay reflector group; A detection laser assembly, comprising a BBO chip, wherein the BBO chip is used to adjust the output power of the second light beam; a first semi-transparent mirror, used for reflecting the first light beam to a material surface and allowing the second light beam to pass through so as to irradiate the material surface; Monitoring component, the second light beam is reflected by the material surface to the monitoring component.

2. The air film hole precision monitoring and processing system according to claim 1 is characterized by: The ratio of the energy of the first light beam to the energy of the second light beam is 9:

1.

3. The air film hole precision monitoring and processing system according to claim 1 is characterized in that: The first delay reflector group includes a first reflector and a second reflector, the second delay reflector group includes a third reflector and a fourth reflector, and the first light beam passes through the first reflector, the third reflector, the fourth reflector and the second reflector in sequence.

4. The air film hole precision monitoring and processing system according to claim 1 is characterized by: The working laser assembly and the detection laser assembly are both provided with a beam reduction assembly, which includes a biconvex lens and a plano-concave-convex mirror. The light beam passes through the biconvex lens and the plano-concave-convex mirror in sequence to reduce the light beam spot.

5. The air film hole precision monitoring and processing system according to claim 1 is characterized in that: The working laser assembly and the detection laser assembly are both provided with a first half-wave plate and a Glan prism. The first half-wave plate is mounted on a rotating motor, and the light beam passes through the first half-wave plate and the Glan prism in sequence.

6. The air film hole precision monitoring and processing system according to claim 5 is characterized in that: The detection laser assembly is further provided with a second half-wave plate, which is arranged before the BBO chip and is used to adjust the energy of the second light beam incident on the BBO chip.

7. The air film hole precision monitoring and processing system according to claim 1 is characterized by: The detection laser assembly also includes a second semi-transparent mirror and a light-blocking plate. The second semi-transparent mirror reflects the second light beam to the first semi-transparent mirror. The light-blocking plate is mounted on one side of the second semi-transparent mirror to absorb the light transmitted through the second semi-transparent mirror.

8. The air film hole precision monitoring and processing system according to claim 1 is characterized by: The air film hole precision monitoring and processing system also includes a focusing mirror, which focuses both the first light beam and the second light beam on the material surface.

9. The air film hole precision monitoring and processing system according to claim 1 is characterized by: The monitoring component includes a second beam splitter, a photodetector and a variable-focus monitoring CCD. The second light beam reflected by the surface of the material passes through the second beam splitter, and the second beam splitter splits the second light beam into two light beams that enter the photodetector and the variable-focus monitoring CCD.

10. A working method for the air film hole precision monitoring and processing system according to any one of claims 1 to 9, characterized in that: include: The femtosecond laser emits laser light and projects it onto the first beam splitter; The first beam splitter splits the laser into the first beam and the second beam, wherein the first beam is emitted into the working laser assembly, and the second beam is emitted into the detection laser assembly; The first light beam passes through the first delay reflector group and the second delay reflector group in sequence, and the linear motor adjusts the distance between the first delay reflector group and the second delay reflector group, thereby changing the propagation time of the first light beam; The second light beam passes through the BBO chip to adjust the output power; The second light beam reaches the first semi-transparent mirror before the first light beam, and is projected onto the surface of the material through the first semi-transparent mirror; The second light beam is reflected by the surface of the material to the monitoring component to detect the current condition of the surface of the material; The first light beam reaches the first semi-transparent mirror and is reflected by the first semi-transparent mirror to the surface of the material, and the first light beam performs laser processing on the material.

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