Adhesive bonding tool and preparation method of low-defect adhesive film thickness controllable composite material

By using a composite bonding fixture with controllable low-defect adhesive film thickness and an ultrasonic vibration auxiliary device, the contradiction between controllable adhesive film thickness and achievable pressure was resolved, achieving low porosity and high mechanical properties in the bonded components, meeting the high standards required for aerospace and rail transportation.

CN119636095BActive Publication Date: 2026-05-15LANZHOU JIAOTONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
LANZHOU JIAOTONG UNIV
Filing Date
2024-12-23
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

In existing technologies, the controllability of adhesive film thickness and the attainment of pressure during the bonding process of composite materials cannot be simultaneously met, resulting in high porosity and failing to meet the high standards required in the aerospace and rail transportation fields.

Method used

A composite material bonding fixture with controllable low-defect adhesive film thickness is adopted, combined with a bonding jig and an ultrasonic vibration auxiliary device. Ultrasonic vibration is used to eliminate air bubbles, achieving a balance between controllable adhesive film thickness and achievable pressure.

Benefits of technology

It effectively reduces the porosity of bonded components, improves their mechanical properties, and meets the high standards required in the aerospace and rail transportation fields.

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Abstract

The application discloses a kind of low-defect adhesive film thickness controllable composite bonding tool and preparation method, wherein, bonding tool includes curing box, bonding fixture and ultrasonic vibration auxiliary device, the interface tool solves the contradiction that adhesive film thickness controllable and pressure can reach cannot be satisfied simultaneously when forming.The present application is aimed at the problem that high-performance manufacturing of composite bonding component requires high precision of adhesive film thickness controllable, and proposes a preparation method of low-defect adhesive film thickness controllable composite, by introducing ultrasonic vibration in the in-plane direction, using its resonance effect to eliminate bubbles, compensate for the porosity defects caused by pressure loss, and further enhance the adhesive film flowability and wettability during adhesive film curing process;By spatially compounded ultrasonic vibration, most of the bubbles are eliminated, further reducing the defects of the component, and enhancing the mechanical properties of the composite bonding component.
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Description

Technical Field

[0001] This invention relates to the field of adhesive bonding technology for composite material structures, specifically to an adhesive bonding fixture and preparation method for composite materials with controllable low-defect adhesive film thickness. Background Technology

[0002] With the development of aerospace and high-speed trains, the bonding of various materials has become increasingly important. Compared with traditional mechanical fastening and welding, adhesive bonding technology has advantages such as more uniform stress distribution, better fatigue and impact resistance, prevention of electrochemical corrosion, and weight reduction, especially in the field of lightweighting. Currently, composite material bonding mostly uses traditional autoclave technology, which has a wide range of applications and high flexibility in pressurization methods. However, due to the pre-control of the interlayer gaps in the composite material, the applied external pressure cannot be transmitted to the adhesive film, resulting in a lower curing pressure, which will cause an increase in porosity. If the adhesive film is filled into the interlayer gaps of the composite material first, and then pressure is applied to achieve the required curing pressure, the film thickness will be affected by the change in pressure.

[0003] In composite material bonding processes, if the interlayer gap distance of the composite material is pre-controlled using a fixture according to the required adhesive film thickness, and then the adhesive film is filled into the gap, the adhesive film thickness can be controlled. However, because the interlayer gap is pre-controlled, the pressure transmission of the fixture cannot be transmitted to the adhesive film, and the porosity within the adhesive film cannot be effectively reduced. If the adhesive film is placed in the interlayer gap before applying pressure, the porosity within the adhesive film will be effectively reduced, but this will cause deformation of the adhesive film, resulting in the adhesive film thickness of the composite material bonded under this process not meeting experimental and production requirements. In the aerospace and rail transportation fields, the porosity of the main load-bearing structural components should be less than 1%, and the porosity of the secondary load-bearing structural components should be less than 2%, with high requirements for the adhesive film thickness in the bonding area of ​​the components. Therefore, when using adhesive bonding fixture systems with controllable adhesive film thickness, resolving the contradiction between simultaneously achieving controllable adhesive film thickness and achieving achievable pressure is the main objective of adhesive bonding fixture systems with controllable adhesive film thickness, and it is also a problem that needs to be solved by those skilled in the art.

[0004] Due to the inherent contradiction between the controllability of adhesive film thickness and the inability to simultaneously achieve the required pressure at the bonding joints of composite materials, a pre-controlled adhesive film process has become a suitable approach. To address the issue of high porosity in components under pre-filled adhesive film processes, selecting appropriate methods to suppress pore defects with different morphological characteristics, improve the mechanical properties of the parts, and obtain excellent macro- and micro-interfacial properties are problems that researchers need to solve. Summary of the Invention

[0005] The purpose of this invention is to provide a bonding fixture for composite materials with controllable low-defect adhesive film thickness, so as to solve the problem that controllable adhesive film thickness and pressure cannot be achieved simultaneously in the prior art.

[0006] To achieve the above objectives, the present invention provides a bonding fixture for composite materials with controllable low-defect adhesive film thickness, comprising a curing chamber, a bonding fixture disposed within the curing chamber, and an ultrasonic vibration auxiliary device for ultrasonically vibrating the bonding joint of the composite material; the bonding fixture comprises a fixture body, a large pressure plate, and a small pressure plate, wherein the large pressure plate and the small pressure plate are two vertically parallel pieces, the distance between the two large pressure plates is adjustable within the cavity of the fixture body, and the two small pressure plates are disposed between the two large pressure plates, and the small pressure plates are... The plate is arranged parallel to the large pressure plate, and the two small pressure plates are respectively used to cooperate with the two large pressure plates to position the two pre-bonded composite material plates; the large pressure plate is equipped with at least one first adjusting rod, and the small pressure plate is equipped with at least one second adjusting rod; the ultrasonic vibration auxiliary device includes an ultrasonic rod, an ultrasonic transducer and an ultrasonic generator, the ultrasonic rod is set inside the curing chamber, the ultrasonic transducer is set at the bottom of the ultrasonic rod and above the bonding fixture, and the ultrasonic generator is set outside the curing chamber and connected to the ultrasonic rod.

[0007] Furthermore, each of the large pressure plates is equipped with two first adjusting rods. The first adjusting rods are horizontally inserted from one side of the clamp body into the interior of the clamp body from the outside to the inside, and are connected to the corresponding large pressure plate. The second adjusting rods are sequentially inserted from the outside to the inside through one side wall of the clamp body and the large pressure plate close to the side wall, and are connected to the corresponding small pressure plate.

[0008] Furthermore, the ultrasonic vibration auxiliary device includes a fixed bracket that supports the ultrasonic rod. The fixed bracket includes a bracket base, a support rod, and a connector. The bracket base is located at the bottom of the adhesive clamp, and the support rod is disposed at one end of the adhesive clamp, with its lower end connected to the bracket base.

[0009] This invention also provides a method for preparing a composite material with controllable low-defect adhesive film thickness, using the bonding fixture described above to prepare the composite material, the preparation method comprising the following steps:

[0010] Step S1: Determine the thickness of the adhesive film according to the preparation requirements;

[0011] Step S2: Use a bonding clamp to fix the two composite material plates to be bonded, and place an adhesive film that meets the thickness requirements between the bonding parts of the composite material to obtain the composite material preform;

[0012] Step S3: Place the bonding fixture and the preform of the composite material to be processed flat in the heating furnace for heating and heat preservation treatment; wherein, during a certain period of the heat preservation process, ultrasonic vibration in the in-plane direction is provided to the bonding joint of the composite material through an ultrasonic vibration auxiliary device.

[0013] Step S4: After the heat preservation is completed, the composite material preform is heated a second time and then cured to obtain a composite material with low defect film thickness controllable.

[0014] Furthermore, in step S2, the two pre-bonded composite material plates are first placed inside the two large pressure plates, and then the two small pressure plates are clamped together by adjusting the second adjusting rod. Then, the two large pressure plates are adjusted by the first adjusting rod, and the gap distance between the two composite material plates is determined with the help of a vernier caliper.

[0015] Furthermore, the specific implementation of the heating treatment in step S3 is as follows: the composite material preform to be processed is heated from room temperature to 140-150℃ in a heating platform at a heating rate of 1.5-2.5℃ / min.

[0016] Furthermore, in step S3, the power of the ultrasonic vibration is 400~600W, the amplitude percentage is 40%, the heat preservation time is 45~80min, and ultrasonic vibration is added in the first 30s~10min before the start of heat preservation.

[0017] Furthermore, in step S4, the secondary heating involves heating the composite material preform to be processed from 140-150°C to 195-205°C, and holding it at that temperature for 120-180 minutes.

[0018] Furthermore, a nickel-chromium alloy electric heating wire heater is used to heat the air, and the hot air is used to heat or keep the composite material plate or composite material preforms warm by forced convection.

[0019] Furthermore, the power adjustable range of the ultrasonic vibration auxiliary device is 0 to 900W; the ultrasonic vibration auxiliary device outputs ultrasonic waves with a constant frequency of 20kHz and an amplitude adjustable frequency of 20% to 100%.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] (1) The adhesive bonding fixture for composite materials with controllable low-defect adhesive film thickness of the present invention is a low-cost and convenient adhesive bonding tool for composite materials. Its main difference from traditional adhesive bonding tools is that it solves the contradiction that the controllable adhesive film thickness and the pressure can not be met at the same time during molding.

[0022] (2) This invention addresses the challenge of high precision control over adhesive film thickness in the high-performance manufacturing of composite adhesive components. It proposes a method for preparing composite materials with controllable adhesive film thickness and low defects. By introducing ultrasonic vibration along the in-plane direction, its resonance effect is utilized to eliminate air bubbles, compensate for porosity defects caused by pressure loss, and further enhance the fluidity and wettability of the adhesive film during curing. Through spatially composite ultrasonic vibration, most air bubbles are eliminated, further reducing component defects and enhancing the mechanical properties of the composite adhesive components.

[0023] In addition to the objectives, features, and advantages described above, the present invention has other objectives, features, and advantages. The invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0024] The accompanying drawings are provided to further illustrate embodiments of the present invention and form part of the specification. They are used together with the following detailed description to explain the embodiments of the present invention, but do not constitute a limitation thereof. In the drawings:

[0025] Figure 1 This is a schematic diagram of the adhesive bonding fixture for a composite material with controllable low-defect adhesive film thickness according to the present invention.

[0026] Figure 2 for Figure 1 A schematic diagram of the ultrasonic vibration auxiliary device.

[0027] Figure 3 for Figure 1 A top view of the structure of the bonding fixture;

[0028] Figure 4 This is a flowchart of a method for preparing a composite material with controllable low-defect film thickness according to the present invention;

[0029] Figure 5 This is a schematic diagram of the composite material sample in this invention;

[0030] Among them, 1-curing box; 2-adhesive clamp; 2.1-clamp body; 2.2-large pressure plate; 2.3-small pressure plate; 2.4-first adjusting rod; 2.5-second adjusting rod; 3-ultrasonic vibration auxiliary device; 3.1-ultrasonic rod; 3.2-ultrasonic transducer; 3.3-ultrasonic generator; 3.4-support base; 3.5-support rod; 3.6-connector; A-composite material plate; B-adhesive film; C-metal gasket. Detailed Implementation

[0031] The present invention will now be described in detail with reference to the embodiments shown in the accompanying drawings. However, it should be noted that these embodiments are not intended to limit the present invention. Equivalent transformations or substitutions in function, method, or structure made by those skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0032] Please see Figures 1 to 3 This invention provides a bonding fixture for composite materials with controllable low-defect adhesive film thickness, including a curing chamber 1, a bonding clamp 2, and an ultrasonic vibration auxiliary device 3; the specific structure is as follows:

[0033] The bonding fixture 2 is installed inside the curing chamber 1 and includes a fixture body 2.1, two large pressure plates 2.2 arranged parallel to each other in the inner cavity of the fixture body 2.1, and two small pressure plates 2.3 located between and parallel to the large pressure plates 2.2. Each large pressure plate 2.2 is equipped with at least one first adjusting rod 2.4, which passes through one side wall of the fixture body 2.1 and is connected to the corresponding large pressure plate 2.2. Each small pressure plate 2.3 is equipped with a second adjusting rod 2.5; the second adjusting rod 2.5 passes through one side wall of the fixture body 2.1 and the large pressure plate 2.2 close to that side wall from the outside to the inside, and is connected to the small pressure plate 2.3. The ultrasonic vibration auxiliary device 3 includes an ultrasonic rod 3.1, an ultrasonic transducer 3.2, and an ultrasonic generator 3.3. The ultrasonic rod 3.1 is placed inside the curing chamber 1. The ultrasonic transducer 3.2 is located at the bottom of the ultrasonic rod 3.1 and above the bonding fixture 2. The ultrasonic generator 3.3 is located outside the curing chamber 1 and is connected to the ultrasonic rod 3.1. It is used to perform ultrasonic vibration treatment on the adhesive film B at the bonding joint of the composite material to be bonded, thereby reducing the porosity. The ultrasonic vibration auxiliary device 3 includes a fixed bracket that supports the ultrasonic rod 3.1. The fixed bracket includes a bracket base 3.4, a support rod 3.5, and a connector 3.6. The bracket base 3.4 is located at the bottom of the bonding fixture 2. The support rod 3.5 is located at one end of the bonding fixture 2, and its lower end is connected to the bracket base 3.4. The support rod 3.5 is provided with several connecting holes. The connector 3.6 is adjustable up and down on the support rod 3.5 through these connecting holes. The connector 3.6 is used to clamp the ultrasonic rod 3.1. In this structure, metal gaskets C are provided between the first adjusting rod 2.4 and the large pressure plate 2.2, and between the second adjusting rod 2.5 and the small pressure plate 2.3; each large pressure plate 2.2 is equipped with two or more first adjusting rods 2.4 to apply bonding pressure evenly to the composite material plate A to be bonded.

[0034] Compared to traditional clamps that control adhesive film thickness by extrusion or by placing a metal plate between two composite material plates A, the adhesive bonding clamp of this invention effectively controls adhesive film thickness through a bolt structure and a pressure equalizing plate, avoiding the problem of processing metal plates with different thickness requirements. This not only improves production efficiency but also effectively controls production costs. The specific clamping process in this embodiment is as follows: First, fix any one composite material plate to one end of the adhesive bonding clamp (located between one of the large pressure plates 2.2 and one of the small pressure plates 2.3). Then, use a vernier caliper to determine the distance between the two composite material plates. Next, rotate the bolt structure (including: the first adjusting rod 2.4 and the second adjusting rod 2.5) to bring the other composite material plate (located between another large pressure plate 2.2 and another small pressure plate 2.3) to the predetermined position. Simultaneously, clamp the two composite material plates A to achieve fixation. Finally, fill the space between the two composite material plates A with adhesive film to complete the entire clamping process.

[0035] Please see Figure 4 The present invention also provides a method for preparing a composite material with controllable low-defect adhesive film thickness. The composite material is prepared using the bonding fixture described above, and the preparation method includes the following steps:

[0036] Step S1: Determine the thickness of adhesive film B according to the preparation requirements. When selecting the adhesive film thickness, material properties, thickness, bond strength, application environment, and economic factors must be comprehensively considered. Before practical application, some experiments should be conducted to determine the most suitable adhesive film thickness for a specific composite material based on different requirements and the characteristics of the composite material. For example, in the adhesive repair structure of carbon fiber reinforced composite materials, the adhesive area is very thin, typically only 0.1~0.2mm thick; too high or too low a thickness will affect the performance of the repaired component.

[0037] Step S2: Use the bonding clamp 2 to fix the two composite material plates A (interlaminar hybrid composite materials) to be bonded, and place the adhesive film with the required thickness in step S1 between the bonding portions of the two composite material plates A to obtain the composite material preform. In this step, first place the two pre-bonded composite material plates A inside the two large pressure plates 2.2 respectively, then adjust the second adjusting rod 2.5 to clamp the two small pressure plates 2.3 respectively, and then adjust the first adjusting rod 2.4 to adjust the two large pressure plates 2.2, and finally determine the gap distance between the two composite material plates A with the help of vernier calipers. Specifically, the unidirectional carbon fiber reinforced bismaleimide resin (ZT7H / 5429) and woven quartz fiber reinforced bismaleimide resin (QW280 / 5429) composite laminates to be processed are first placed inside the two large pressure plates 2.2. Then, by rotating the second adjusting rod 2.5, the two small pressure plates 2.3 are respectively pressed against the two composite material plates A to achieve a clamping effect. Then, by rotating the first adjusting rod 2.4 and using a vernier caliper, the gap distance between the two composite material plates A is determined to achieve controllable film thickness.

[0038] Step S3: Place the bonding fixture 2 and the composite material preform to be processed flat in a heating furnace for heating and heat preservation treatment. The heating and heat preservation treatment involves heating the composite material preform to be bonded in a curing chamber from room temperature to 140-150℃ at a heating rate of 1.5-2.5℃ / min, and holding it at this temperature for 60 minutes. Heating and heat preservation are achieved using a nickel-chromium alloy electric heating wire heater to heat the air. The heated air enters the curing chamber mainly through hot air vents, heating the preform by forced convection. During a certain period of the heat preservation process, ultrasonic vibration in the in-plane direction is provided to the composite material bonding area through an ultrasonic vibration auxiliary device. The power of this ultrasonic vibration is 400-600W, and the amplitude percentage is 40%. The heat preservation time is 60 minutes, with ultrasonic vibration added 30 seconds to 10 minutes before the start of heat preservation.

[0039] Step S4: After the heat preservation is completed, the composite material preform treated in step S3 is subjected to a second heating and subsequent curing to obtain a composite material with low-defect film thickness control. In this step, the second heating involves heating the interlayer hybrid composite material preform from 120℃ to 180℃ at a heating rate of 1.5℃ / min and holding it at that temperature for 150min. The second heating uses a nickel-chromium alloy heating wire heater and is carried out using the same heating and holding method as the first heating.

[0040] The ultrasonic generator DW-S20-1000 used in this invention is manufactured by Hangzhou Taiwei Ultrasonic Technology Co., Ltd. The ultrasonic generator has an output frequency of 20kHz, an amplitude percentage of 20%–100%, and an output power adjustment range of 0–900W. The ultrasonic transducer head of the ultrasonic vibration auxiliary device is fixed directly above the adhesive film, providing in-plane ultrasonic vibration to the interlayer hybrid composite preform. In this invention, the equivalent diameter of the pores in the composite adhesive film is mainly distributed in the range of [5–50] μm. When 20kHz ultrasonic vibration is applied during the curing process of the composite adhesive component, it accelerates the collapse of air bubbles, effectively reducing the porosity within the component and thus improving its mechanical properties.

[0041] Example:

[0042] The unidirectional carbon fiber reinforced bismaleimide resin / quartz fiber interlaminar hybrid composite material was cured using the preparation method of this invention. The unidirectional carbon fiber reinforced bismaleimide resin used was ZT7H / 5429, and the quartz fiber used was QW280 / 5429. Referring to standard ASTM D3165, the laminate was prepared with dimensions of 75mm × 160mm, and the bonding area was 30mm × 160mm. After secondary bonding, the left and right edges were removed by a metallographic abrasive wheel cutter, resulting in test samples measuring 120mm × 25.4mm. Five samples were taken. Figure 5 The image shown is a sample of the composite material. The film thickness is 0.2 mm, and the film system used is J-116B.

[0043] 1. When the film thickness is controlled at 0.2mm:

[0044] (1) Comparative analysis of porosity: When the interlayer hybrid composite preforms were subjected to ultrasonic vibration treatment at 0W, 300W, 600W and 900W during the first heating stage and cured at 0MPa pressure, the porosities were 6.78%, 2.11%, 1.08% and 2.34%, respectively. The overall porosity was less than 7%, and the porosity was the lowest at 1.08% when the vibration power was 600W. Compared with the 0MPa preforms without vibration treatment, the porosity dropped from 6.78% to 1.08%, indicating that ultrasonic vibration treatment can achieve the effect of low-defect curing and forming components.

[0045] (2) Comparative analysis of mechanical properties: Shear strength of bonded structures after different ultrasonic vibration treatments: The shear strengths of bonded parts cured by 0W, 300W, 600W and 900W power treatments were 10.89MPa, 12.58MPa, 15.45MPa and 12.03MPa, respectively. The shear strength of the bonded part treated with 600W ultrasonic vibration was 41.9% higher than that of the sample without ultrasonic vibration treatment.

[0046] 2. When the ultrasonic vibration power is controlled at 600W:

[0047] (1) Comparative analysis of porosity: When the thickness of the adhesive film in the interlayer hybrid composite preform is controlled at 0.1 mm, 0.2 mm, 0.5 mm and 0.9 mm respectively, the porosity is 1.78%, 1.06%, 1.25% and 1.43% respectively, and the difference in porosity is not obvious.

[0048] (2) Comparative analysis of mechanical properties: When the film thickness in the interlaminar composite parts is controlled at 0.1 mm, 0.2 mm, 0.5 mm, and 0.9 mm, the shear strengths are 13.37 MPa, 15.47 MPa, 12.58 MPa, and 10.78 MPa, respectively. Therefore, the shear strength is best when the film thickness is 0.2 mm.

[0049] Therefore, it can be concluded that the porosity of the interlayer hybrid composite material component after ultrasonic vibration treatment is significantly reduced compared with the porosity of the component without vibration treatment, and the mechanical properties are better.

[0050] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for preparing a composite material with controllable low-defect adhesive film thickness, characterized in that, Composite materials are prepared using an adhesive bonding fixture, which includes a curing chamber (1), an adhesive bonding clamp (2) disposed in the curing chamber (1), and an ultrasonic vibration auxiliary device (3) for ultrasonic vibration treatment of the adhesive joint of the composite material. The adhesive bonding clamp (2) includes a clamp body (2.1), a large pressure plate (2.2), and a small pressure plate (2.3). The large pressure plate (2.2) and the small pressure plate (2.3) are two vertically parallel pieces. The distance between the two large pressure plates (2.2) is adjustable in the cavity of the clamp body (2.1). The two small pressure plates (2.3) are disposed between the two large pressure plates (2.2) and are parallel to the large pressure plates (2.2). .3) respectively used to cooperate with the two large pressure plates (2.2) to position the two pre-bonded composite material plates (A); the large pressure plate (2.2) is equipped with at least one first adjusting rod (2.4), and the small pressure plate (2.3) is equipped with at least one second adjusting rod (2.5); the ultrasonic vibration auxiliary device (3) includes an ultrasonic rod (3.1), an ultrasonic transducer (3.2) and an ultrasonic generator (3.3), the ultrasonic rod (3.1) is disposed inside the curing box (1), the ultrasonic transducer (3.2) is disposed at the bottom of the ultrasonic rod (3.1) and above the bonding fixture (2), and the ultrasonic generator (3.3) is disposed outside the curing box (1) and connected to the ultrasonic rod (3.1); the preparation method includes the following steps: Step S1: Determine the thickness of the adhesive film according to the preparation requirements; Step S2: Use a bonding clamp (2) to fix the two composite material plates (A) to be bonded, and place the adhesive film that meets the thickness requirements between the bonding parts of the two composite material plates (A) to obtain the composite material preform; wherein, first place the two composite material plates (A) to be bonded on the inside of two large pressure plates (2.2), then adjust the second adjusting rod (2.5) to make the two small pressure plates (2.3) clamp the two composite material plates (A) respectively, then adjust the two large pressure plates (2.2) through the first adjusting rod (2.4), and use a vernier caliper to determine the gap distance between the two composite material plates (A); Step S3: Place the bonding fixture (2) and the preform of the composite material plate to be processed flat in the heating furnace for heating and heat preservation treatment; wherein, during a certain period of the heat preservation process, ultrasonic vibration in the in-plane direction is provided to the bonding joint of the composite material through the ultrasonic vibration auxiliary device (3); the heating method is: heat the preform of the composite material to be processed from room temperature to 140-150℃ in the heating platform at a heating rate of 1.5-2.5℃ / min; the power of ultrasonic vibration is 400~600W, and the amplitude percentage is 40%; the heat preservation time is 45~80min, and ultrasonic vibration is added in the first 30s~10min of the heat preservation. Step S4: After the heat preservation is completed, the composite material preform is heated a second time and then cured to obtain a composite material with low defect film thickness controllable. The second heating is to heat the composite material preform to be processed from 140-150℃ to 195-205℃ and keep it for 120-180 minutes.

2. The preparation method according to claim 1, characterized in that, The air is heated by a nickel-chromium alloy electric heating wire heater, and the hot air is used to heat or keep warm the composite material plate or composite material preform by forced convection.

3. The preparation method according to claim 1, characterized in that, The power adjustable range of the ultrasonic vibration auxiliary device (3) is 0~900W; the ultrasonic vibration auxiliary device (3) outputs ultrasonic waves with a constant frequency of 20kHz and an amplitude adjustable frequency of 20%~100%.

4. The preparation method according to claim 1, characterized in that, Each of the large pressure plates (2.2) is equipped with two first adjusting rods (2.4). The first adjusting rods (2.4) are inserted horizontally from one side of the clamp body (2.1) into the interior of the clamp body (2.1) from the outside to the inside and are connected to the corresponding large pressure plate (2.2). The second adjusting rods (2.5) are arranged from the outside to the inside, passing through one side wall of the clamp body (2.1) and the large pressure plate (2.2) close to the side wall, and are connected to the corresponding small pressure plate (2.3).

5. The preparation method according to claim 1, characterized in that, The ultrasonic vibration auxiliary device (3) includes a fixed bracket that supports the ultrasonic rod (3.1). The fixed bracket includes a bracket base (3.4), a support rod (3.5), and a connector (3.6). The bracket base (3.4) is located at the bottom of the adhesive clamp (2). The support rod (3.5) is located at one end of the adhesive clamp (2) and its lower end is connected to the bracket base (3.4).