Substrate processing apparatus with flow control ring and method of use thereof

Abstract

A substrate processing apparatus includes an upper chamber space, a lower chamber space, a susceptor, and a flow control ring assembly including a sealing ring and a flow control ring having a shape surrounding the susceptor, the flow control ring assembly sealing or substantially sealing the upper chamber space relative to the lower chamber space when the susceptor is in a first position.

Description

Technical Field

[0001] Examples related to flow control ring assemblies and substrate processing apparatus having flow control ring assemblies, and methods of using the flow control ring assemblies and substrate processing apparatus are described. Background Art

[0002] Substrate processing equipment such as gas phase reactors can generally include an upper chamber space for processing substrates and a lower chamber space for loading and unloading substrates. During processing, if there is no basic seal between the upper chamber space and the lower chamber space, the reaction gas may flow between the upper chamber space and the lower chamber space undesirably. The undesired flow of reaction gas between the chamber spaces can lead to particle contamination and / or slower processing of the substrate.

[0003] In some cases, a flow control ring assembly can be used to separate the upper chamber space from the lower chamber space. However, such a flow control ring assembly may not provide the desired isolation between the chambers. Therefore, there is generally a need for an improved flow control ring assembly. Summary of the invention

[0004] This summary is provided to introduce some concepts in a simplified form. These concepts are further described in detail in the detailed description of the example embodiments disclosed below. This summary is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0005] The examples described herein provide substrate processing equipment and substrate processing methods. Various examples of substrate processing equipment and substrate processing methods provide reduced airflow between the upper chamber space and the lower chamber space during substrate processing. Additional aspects will be described in part in the following description, and in part will become apparent from the description, or can be understood by practicing the presented embodiments of the present disclosure.

[0006] According to one or more embodiments, a substrate processing device is provided. An exemplary substrate processing device includes an upper chamber, a lower chamber, a base, a flow control ring and a partition. The exemplary substrate processing device also includes a sealing ring or at least one gasket. The base can be configured to hold a substrate. The base can include a top surface and a flange protruding from one side of the base. The flow control ring can include an annular central area, a first portion disposed on the top surface, a second portion disposed on the flange, and a third portion including a recess. The sealing ring can be disposed in the recess. In other examples, the flow control ring may include one or more recesses. In some examples, one or more gaskets may be disposed in one or more recesses. In some examples, the flow control ring may include two recesses. In this case, a gasket can be placed in each recess. The gasket can be made of a mica-based material, such as Micatherm S0 or Micatherm S15.

[0007] According to examples of these embodiments, the substrate processing apparatus may include a pedestal motor configured to raise and lower the pedestal from at least a first position to a second position. According to additional examples, when the pedestal is in the first position, the sealing ring contacts the diaphragm, and when the pedestal is in the first position, the sealing ring seals or substantially seals the upper chamber relative to the lower chamber. According to other additional examples, when the pedestal is in the first position, at least one gasket contacts the diaphragm, and when the pedestal is in the first position, at least one gasket seals or substantially seals the upper chamber relative to the lower chamber.

[0008] According to further examples, the sealing ring is annular, and the sealing ring includes a body and at least two compressible members extending from the body. According to one or more examples, the at least two compressible members of the sealing ring extend horizontally from the body (e.g., substantially along a plane parallel to the top surface). According to one or more examples, when the base is in the first position, the at least two compressible members can be compressed.

[0009] According to yet another example, the sealing ring is annular, and a cross section of the sealing ring is substantially U-shaped, having a middle portion and two arms extending from the middle portion of the U. In some embodiments, when the base is in the first position, the middle portion contacts the diaphragm.

[0010] According to a further example, the substrate processing apparatus includes an annular recess ring interposed between the sealing ring and the flow control ring in a recess of the flow control ring. In some embodiments, the annular recess ring includes a metal.

[0011] According to further examples, the flow control ring comprises ceramic. In some embodiments, the flow control ring comprises quartz. In some embodiments, the flow control ring comprises alumina.

[0012] According to a further example, the substrate processing apparatus includes a stepped annular ring. The stepped annular ring may contact a top surface of the flow control ring and a bottom of a recess of the flow control ring. In some embodiments, the stepped annular ring is or includes a metal.

[0013] According to yet another example, the substrate processing apparatus includes a controller connected to a pedestal motor. The pedestal motor may include a measuring device configured to measure a load on the pedestal motor. In this case, the controller may be configured to adjust the torque on the pedestal motor based on the load measured when the pedestal is in the first position.

[0014] According to yet another example, a flow control ring assembly is provided. An exemplary flow control ring assembly includes a flow control ring and a sealing ring. The flow control ring may include an annular central region and a top including a recess. The annular central region may include a stepped structure, the stepped structure including a first flat flange portion and a second flat flange portion and a vertical wall spanning therebetween. The second flat flange portion may extend further toward the center of the flow control ring than the first flat flange portion. The sealing ring may be disposed in the recess.

[0015] According to yet another example, the flow control ring assembly may include an annular recess ring, which is between the sealing ring and the flow control ring in the recess. According to an example, the sealing ring is annular. The sealing ring may include a body and at least two compressible members extending from the body. In some examples, the cross-section of the sealing ring is substantially U-shaped, having a middle portion and two arms extending from the middle portion of the U-shape. According to one or more examples, the flow control ring assembly includes a stepped annular ring. The stepped annular ring can be configured to contact the top surface of the flow control ring and the bottom of the recess of the flow control ring.

[0016] According to one or more embodiments, a method for substantially sealing an upper chamber relative to a lower chamber is provided. An exemplary method includes providing a substrate processing device, starting a pedestal motor to move the pedestal from a lower position to an upper position, contacting a sealing ring with a partition, and substantially sealing the upper chamber relative to the lower chamber. The substrate processing device may include an upper chamber, a lower chamber, a pedestal, a pedestal motor, a flow control ring, a partition, and a sealing ring. The pedestal may be configured to hold a substrate. The pedestal may include a top surface and a flange protruding from one side of the pedestal. The flow control ring may include an annular central area, a first portion disposed on the top surface, a second portion disposed on the flange, and a third portion including a recess. The sealing ring may be disposed in the recess. The step of contacting the sealing ring with the partition may thereby deform the sealing ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 shows a cross-sectional view of a substrate processing apparatus according to one or more examples of the present disclosure;

[0018] Figure 2 One or more examples of the present disclosure are shown. Figure 1 A cross-sectional view of a substrate processing apparatus;

[0019] Figure 3 is a plan view showing an example of a base and a flow control ring according to one or more examples of the present disclosure;

[0020] Figure 4 is an enlarged partial cross-sectional view showing an example of a flow control ring according to an example of the present disclosure;

[0021] Figures 5 to 7is an enlarged partial cross-sectional schematic diagram of a flow control ring assembly according to an example of the present disclosure;

[0022] Figure 8 is a partial cross-sectional view of a flow control ring assembly according to an additional example of the present disclosure;

[0023] Fig. 9 is a partial cross-sectional view of a flow control ring assembly according to an additional example of the present disclosure; and

[0024] Fig.10 A method according to one or more embodiments of the present disclosure is shown.

[0025] It should be understood that the elements in the drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the size of some elements in the drawings may be exaggerated relative to other elements to help improve the understanding of the illustrated embodiments of the present disclosure. DETAILED DESCRIPTION

[0026] Reference will now be made in detail to the embodiments shown in the accompanying drawings, wherein reference numerals refer to the same elements throughout. In this regard, the examples may have different forms and should not be construed as being limited to the descriptions set forth herein. Therefore, exemplary embodiments are described below with reference to the accompanying drawings to explain various aspects of this specification.

[0027] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of" when preceding a list of elements modify the entire list of elements and do not modify the individual elements of the list.

[0028] The terms used herein are intended to describe specific embodiments, not to limit the present disclosure. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the terms "comprises", "comprising", and variations thereof used herein specify the presence of stated features, integers, steps, processes, components, parts, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integers, steps, processes, components, parts, and / or groups thereof.

[0029] Figure 1 and Figure 2 1 is a cross-sectional view of a substrate processing apparatus 10 according to at least one embodiment. In the illustrative example, the substrate processing apparatus 10 is configured as a film deposition apparatus that can perform a cyclic deposition cycle, such as chemical vapor deposition, to deposit a material on a substrate. In some embodiments, the substrate processing apparatus 10 can be configured to perform a thermal chemical vapor deposition process. In some embodiments, the substrate processing apparatus 10 can be configured to perform a plasma enhanced chemical vapor deposition process.

[0030] In some examples, substrate processing apparatus 10 may be configured to process substrates at a temperature greater than 600° C. In some examples, substrate processing apparatus 06 may be configured to process substrates at a temperature greater than 900° C.

[0031] In the illustrated example, the substrate processing apparatus 10 includes an upper chamber 12, a lower chamber 14, and at least one chamber wall 11. The substrate processing apparatus 10 may include a partition 28 between the upper chamber 12 and the lower chamber 14. In some embodiments, the partition 28 is attached to the chamber wall 11. In some embodiments, the partition 28 is an integral part of the chamber wall 11. A gas distribution device such as a showerhead 16 may be provided in the upper chamber 12. The showerhead 16 may be provided with a plurality of holes 16a from which gas may enter the upper chamber 12.

[0032] In the exemplary substrate processing apparatus 10, the pedestal 18 is disposed opposite to the showerhead 16. The pedestal 18 includes a top surface 18a configured to receive and support a substrate. In some embodiments, the pedestal 18 has a substantially cylindrical shape. In some embodiments, the pedestal 18 also includes a flange 18b protruding from one side of the pedestal 18. The flange 18b may include a flat top surface 18c. The pedestal 18 may be made of a ceramic material, such as aluminum nitrate (AlN). In some embodiments, the showerhead 16 and the pedestal 18 may be electrodes to form a parallel plate structure capable of forming a plasma.

[0033] In the substrate processing apparatus 10, a flow control ring assembly 13 is provided. The flow control ring assembly 13 may separate the upper chamber 12 from the lower chamber 14. The flow control ring assembly 13 may surround the side of the susceptor 18 and be disposed on the top surface 18a of the susceptor 18. In the illustrated example, the flow control ring assembly 13 includes a flow control ring 20 and a sealing ring 22.

[0034] In one example, the flow control ring 20 has an annular central region, and a first portion 20a is disposed on the top surface 18a of the susceptor 18. The annular central region of the flow control ring 20 provides space for a substrate placed on the top surface 18a of the susceptor 18. In some examples, the flow control ring 20 has a second portion 20b of the annular central region, which is disposed on the flange 18b of the susceptor 18. In some examples, the top surface of the flow control ring 20 may include a recess 24. The recess 24 may be located below the diaphragm 28.

[0035] like Figure 1 and 2As shown, the flow control ring 20 includes an outer diameter (OD), a first inner diameter (ID1), a second inner diameter (ID2), and a third inner diameter (ID3), wherein ID1 is smaller than ID2, and ID2 is smaller than ID3. For example, ID1 can be about 300 mm to about 310 mm. For example, ID2 can be about 320 mm to about 330 mm. For example, ID3 can be about 330 mm to about 340 mm. Figure 5 , the height (H1) of the first portion 20a may be about 2 mm to about 5 mm. The height (H2) of the second portion 20b may be about 10 mm to about 15 mm. The height (H3) of the third portion 20c may be about 1 mm to about 5 mm.

[0036] The first portion 20a of the flow control ring may have a top surface 20d. The flow control ring may include a fourth portion 20e having a top surface 20f. The top surface 20f of the fourth portion 20e may be located at a lower height (H4) than the top surface 20d. The height (H4) may be about 3 mm to about 7 mm.

[0037] The recess 24 may be formed on the top surface 20e of the flow control ring 20. The recess 24 may be radially outside the first portion 20a and the second portion 20b. The depth (D) of the recess 24 may be about 5 mm to about 10 mm. The recess may be substantially annular.

[0038] The flow control ring 20 can be made of a material that can withstand the forces on the flow control ring 20 and the processing temperatures. In some examples, the flow control ring 20 includes a ceramic material. In some examples, the flow control ring 20 includes quartz. In other examples, the flow control ring 20 can include alumina.

[0039] Figure 3 1 is a plan view showing an example of a susceptor 18 and a flow control ring 20. The flow control ring 20 surrounds and is disposed on a top surface 18a of the susceptor 18. The flow control ring 20 is not disposed at the center of the top surface 18a of the susceptor 18 to allow the susceptor 18 to hold a substrate. A top surface 20d of the flow control ring is radially inward of a top surface 20f of the flow control ring. A recess 24 may be disposed in the top surface 20f of the control ring.

[0040] Figure 42 is an enlarged partial cross-sectional view showing an example of the flow control ring 20. In some examples, the top surface 20d of the flow control ring 20 may include an inclined surface 20g. The inclined surface 20g may increase the thickness of the first portion 20a from the inner radial direction of the flow control ring 20 to the outer diameter of the flow control ring 20. The inclined surface 20g may be inclined upward from the inner diameter of the flow control ring 20 toward the outer diameter of the flow control ring 20. The inclined surface 20g may help guide the flow in the chamber. The inclined surface may help guide the exhaust gas from the chamber to the exhaust port.

[0041] Back to Figure 1 and Figure 2 , the sealing ring 22 can be disposed in the recess 24. The sealing ring 22 can include any material suitable for forming a seal, such as a material that can be compressed and withstand high forces. The sealing ring 22 can be made of a material that can deform when compressed. The sealing ring 22 can be made of, for example, INCONEL® X-750 manufactured by Ulbrich Stainless Steel and Special Metals.

[0042] In some examples, an annular recess ring 26 may be disposed within the recess 24 below the sealing ring 22. The recess ring 26 may have substantially the same annular shape as the annular recess 24. Figure 4 As shown, the height (H5) of the recess ring 26 can be 1 mm to 5 mm. The recess ring 26 can be made of any material suitable for withstanding the temperature and force in the substrate processing equipment 10. In some examples, the recess ring 26 can be made of metals and metal alloys, such as titanium, Hastelloy C-22, Hastelloy C-276. In some examples, the recess ring 26 can be made of ceramics, such as alumina and aluminum nitrate (AlN).

[0043] In the exemplary substrate processing apparatus 10, the susceptor 18 may be configured to move vertically. The susceptor 18 may be supported by a slide shaft 30. The susceptor 18 and the flow control ring assembly may be raised and lowered by a susceptor motor 32.

[0044] In some examples, base 18 may be moved by base motor 32 to at least two positions. Figure 1 The pedestal is depicted in a first position. In the first position, the sealing ring 22 contacts the diaphragm 28. In the first position, the sealing ring 22 can be deformed by the force of the diaphragm 28 provided by the pedestal motor 32. In the first position, the upper chamber 12 can be sealed or substantially sealed relative to the lower chamber 14. In some examples, the substrate processing apparatus 10 can process the substrate when the substrate is in the first position.

[0045] In the first position, there will be a downward force from the diaphragm 28 to the seal ring 22. In some examples, the recess ring 26 receives the downward force of the seal ring 22 and distributes the force (e.g., uniformly) to the flow control ring 10. In some examples, the force from the seal ring 22 is received by the flow control ring 20. The force on the flow control ring 20 will then be transferred to the base 18. The flow control ring 20 distributes the downward force to the base 18. In some examples, the downward force from the flow control ring 20 can be distributed to the base 18 substantially uniformly, for example, around the perimeter of the top surface 18a. In some examples, the downward force from the flow control ring 20 can be distributed to the base 18 substantially uniformly, for example, through the peripheral area 18d of the top surface 18a and the flange 18b.

[0046] Figure 2 The substrate processing apparatus 10 is shown when the susceptor 18 is in the second position. In the second position, the susceptor 18 is lowered so that the sealing ring 22 does not contact the diaphragm 18. In the second position, the upper chamber 12 is not sealed relative to the lower chamber 14. Figure 2 In the embodiment, the upper chamber 12 and the lower chamber 14 are in fluid communication with each other.

[0047] Continue to refer Figure 1 and Figure 2 In some examples, the pedestal motor 32 may include a load sensor 35 to measure the load on the pedestal motor 32. When the seal ring 22 contacts the diaphragm 28, the seal ring 22 deforms and the flow control assembly 13 applies a downward force to the pedestal 18, which places a load on the pedestal motor 32 that is measured by the load sensor 35. The pedestal motor 32 may increase its output, causing the seal ring to deform further and the load on the pedestal motor 32 to increase. In some examples, the pedestal motor may also sense the height of the pedestal 18 using a height sensor 36. In some examples, the height sensor 36 or another sensor is used to measure the height of the pedestal 18, such as the height (H6) relative to the diaphragm 28.

[0048] In some examples, the controller 34 is connected to the base motor 32. In some embodiments, the controller 34 is connected to a separate height sensor 38 to measure the height of the base 18. In other examples, the controller 34 is connected to a height sensor 36 to measure the height of the base 18. The controller 34 includes electronic circuitry and software to selectively operate the base motor 32. The controller 34 may include modules that perform specific tasks, such as software or hardware components, such as FPGAs or ASICs. The modules may be advantageously configured to reside on an addressable storage medium of the controller 34 and configured to perform one or more processes.

[0049] The controller 34 may be configured to control the position of the base 32 by controlling the output of the base motor 32. In some examples, the controller 34 is configured to move the base 18 between the first position and the second position. In some examples, the controller 34 may be configured to move the base 18 to other positions. In some examples, the controller 34 may be configured to move the base 28 to a predetermined height. In some examples, the controller 34 may be configured to move the base 18 to the first position by controlling the base motor 32 to move the base 18 upward until the sealing ring 22 contacts the diaphragm 28 and exerts sufficient force on the sealing ring 22 so that a predetermined load set point is measured on the sensor. The predetermined load set point may indicate that there is sufficient downward force on the sealing ring 22 so that the upper chamber 12 is sealed or substantially sealed relative to the lower chamber 14.

[0050] In some examples, when in the first position, controller 34 is configured to maintain sufficient output of pedestal motor 32 to maintain sufficient force between seal ring 22 and diaphragm 28 such that upper chamber 12 is sealed or substantially sealed relative to lower chamber 14 during substrate processing.

[0051] In some examples, the controller 34 can be configured to use a feedback loop from the load on the pedestal motor 32 and / or the height of the pedestal 18 to adjust the output of the pedestal motor 32. In one example, the compression of the sealing ring 22 can be such that the amount of compression of the sealing ring 22 is proportional to the force on the sealing ring 22 and the spring constant of the sealing ring 22. The spring constant of the sealing ring 22 may change over time due to fatigue or other changes in the sealing ring 22. Based on the measured load on the pedestal motor 32 and the measured height of the pedestal 18, the controller 34 can adjust the output of the pedestal motor 32 to maintain sufficient force on the sealing ring 22 so that the upper chamber 12 remains sealed or substantially sealed relative to the lower chamber 14 in real time.

[0052] Figure 5 is an enlarged partial cross-sectional schematic diagram of an example of a flow control ring assembly 500 according to one or more examples of the present disclosure. Figure 5 Depicted are a pedestal 18, a flow control ring 20, and other components of the substrate processing apparatus 10. The pedestal 18 includes a top surface 18a configured to receive and support a substrate. The pedestal 18 also includes a flange 18b protruding from one side of the pedestal 16. The flange may include a flat top surface 18c. The flow control ring 20 may be as described above.

[0053] In some examples, the sealing ring 122 may include a body 122a and at least two compressible members 122b extending from the body 122. The sealing ring 122 may be disposed within the recess 24 such that the at least two compressible members 122b extend horizontally. When the base 18 is in the first position, the at least two compressible members 122b are compressed.

[0054] Figure 6 is an enlarged partial cross-sectional schematic diagram of another example of a flow control ring assembly 600 suitable for use as the flow control ring assembly 13 . Figure 6 Another example of a sealing ring 222 suitable for use as the sealing ring 22 is depicted. The sealing ring 222 can be substantially U-shaped, having a middle portion 222a and two arms 222b extending from the middle portion 222a of the U. As shown, when the base 18 is in the first position, the middle portion can contact the diaphragm 28. When the base 18 is in the first position, the middle portion of the sealing ring 222 contacts the diaphragm 28, causing the two arms to deform and press against the sidewall 24a of the recess 24.

[0055] exist Figure 6 In the example shown, the sealing ring 222 does not have any deep or narrow spaces between the arms 222b. As the base 18 moves in and out of the first position, the sealing ring 222 is compressed and relaxed, and any deposits on the sealing ring 222 may flake off and generate particles. The sealing ring 222 can be easily cleaned using an in-situ process. The shape of the sealing ring 222 is such that there are no deep grooves or contours that the in-situ process cannot reach. In this way, the sealing ring 222 can generate fewer particles.

[0056] Figure 7 FIG. 7 is an enlarged partial cross-sectional schematic diagram of yet another example of a flow control ring assembly 700 suitable for use as the flow control ring assembly 13 . Figure 7 Yet another example of a sealing ring 322 suitable for use as the sealing ring 22 is depicted. The sealing ring 322 may be substantially U-shaped, having a middle portion 322a and two arms 322b extending from the middle portion 322a of the U, and a member 322c extending from the end of each arm 322b. As shown, when the base is in the first position, the middle portion 322a contacts the diaphragm 28. When the base 18 is in the first position, the middle portion 322a of the sealing ring 322 contacts the diaphragm 28, causing the two arms 322b to deform and press against the sidewall 24a of the recess 24. The member 322c is further pressed into the bottom of the recess 24 or the recess ring 26. In addition, when the sealing ring 322 is compressed, the sealing ring 322 will deform to occupy more volume of the recess 24 and result in a reduced need for in-situ cleaning.

[0057] exist Figure 7 In the example shown, the sealing ring 322 does not have any deep or narrow spaces between the arms 322b. As the base 18 moves in and out of the first position, the sealing ring 322 is compressed and relaxed, and any deposits on the sealing ring 322 may flake off and generate particles. The sealing ring 322 can be easily cleaned using an in-situ process. The shape of the sealing ring 322 is such that there are no deep grooves or contours that the in-situ process cannot reach. In this way, the sealing ring 322 can generate fewer particles.

[0058] Figure 8 is a partial cross-sectional view of a flow control ring assembly 800 suitable for use as the flow control ring assembly 13 according to an additional example of the present disclosure. In some examples, the flow control ring assembly 800 includes a step annular ring 36. The step annular ring 36 can be disposed on the top surface of the flow control ring 20 and the bottom of the recess 24 of the flow control ring 20. The step annular ring 36 can distribute the downward force from the seal ring 22 and / or the recess ring 26 over a larger surface of the flow control ring 20.

[0059] The stepped annular ring 36 may be made of any suitable material. In some examples, the stepped annular ring 36 includes metals and alloys such as titanium, Hastelloy C-22, and Hastelloy C-276. Figure 8 As shown, the stepped annular ring may include a first portion 36a, a second portion 36b, and a third portion 36c. The first portion 36a may be disposed in the recess 24 of the flow control ring. The second portion 36b may be disposed on the top surface 20f of the flow control ring 20. The third portion 36c may be disposed on the top surface 20d of the flow control ring 20.

[0060] Fig. 9 is a partial cross-sectional view of a flow control ring assembly 900 suitable for use as a flow control ring assembly 13 according to an additional example of the present disclosure. In some examples, the flow control ring assembly 900 includes a flow control ring 20, a diaphragm 28, and at least one gasket 29 in contact with the flow control ring 20 and the diaphragm 28. In some examples, the flow control ring may include two recesses (24b, 24c). In some examples, the diaphragm 28 may include protrusions 28a and 28b. The gasket 29a may be disposed in one recess 24b, and the other gasket 29b may be disposed in the other recess 29c. Each gasket 29a, 29b may be made of a mica-based material, such as Micatherm S0 or Micatherm S15 manufactured by SRL Planichem.

[0061] Fig.10 A method according to one or more embodiments of the present disclosure is shown. Method 1000 can be used to seal or substantially seal an upper chamber relative to a lower chamber. A substrate can be processed in an upper chamber that is desirably sealed or substantially sealed relative to a lower chamber. Without a substantial seal, process gases may leak between the upper chamber and the lower chamber and may cause contamination or particles. Method 1000 includes the following steps: providing a substrate processing apparatus (step 1010), starting a pedestal motor to move a pedestal from a lower position to an upper position (step 1020), making or forming a seal or substantially seal between a sealing ring and a diaphragm (step 1030), and adjusting the output of the pedestal motor to maintain a seal or substantially seal between the sealing ring and the diaphragm (step 1040).

[0062] The step 1010 of providing a substrate processing apparatus includes providing a substrate processing apparatus, which includes an upper chamber, a lower chamber, a pedestal configured to hold a substrate, wherein the pedestal includes a top surface and a flange protruding from one side of the pedestal, a pedestal motor, a flow control ring, wherein the flow control ring includes an annular central area, a first portion disposed on the top surface, a second portion disposed on the flange, and a third portion including a recess; a partition and a sealing ring, wherein the sealing ring is disposed in the recess. The flow control ring and the partition may be disposed between the upper chamber and the lower chamber. The pedestal motor may be configured to vertically move the pedestal, the flow control ring, and the sealing ring. The pedestal motor may be connected to a controller. The pedestal motor may include a sensor to measure the load on the motor. The pedestal motor may include a height sensor to measure the position of the pedestal. A separate height sensor may be used to measure the pedestal height, as disclosed above.

[0063] The processing device can be configured so that the base has at least a lower position and an upper position. In the lower position, the sealing ring does not contact the partition. In the upper position, the sealing ring contacts the partition.

[0064] Step 1020 includes activating the pedestal motor. The pedestal motor can move the pedestal (and flow control ring assembly) from a down position to an up position.

[0065] Step 1030 includes creating a seal or a substantial seal between the sealing ring and the diaphragm. After the sealing ring contacts the diaphragm, the output of the pedestal motor may be increased to increase the force between the sealing ring and the diaphragm. The sealing ring may deform and create a seal or a substantial seal between the sealing ring and the flow control ring.

[0066] In some embodiments, method 1000 includes a step 1040 of maintaining a seal or a substantially seal between the sealing ring and the diaphragm. For example, during substrate processing, the controller can use a feedback loop from the load on the pedestal motor and the pedestal height to adjust the output of the pedestal motor. In one example, the compression of the sealing ring can be such that the amount of compression of the sealing ring is proportional to the force on the sealing ring and the spring constant of the sealing ring. The spring constant of the sealing ring may change over time due to fatigue or other changes in the sealing ring. Based on the measured load on the pedestal motor and the measured pedestal height, the controller can adjust the output of the pedestal motor, such as using closed-loop control, to maintain sufficient force on the sealing ring so that the upper chamber remains sealed or substantially sealed relative to the lower chamber in real time. In some cases, an indication can be provided to a user or user interface when the spring constant is determined to be above or below a threshold (e.g., based on the force on the pedestal motor and the measured height of the pedestal).

[0067] The exemplary embodiments disclosed above do not limit the scope of the present invention, as these embodiments are merely examples of embodiments of the present invention, and the scope of the present invention is defined by the appended claims and their legal equivalents. Any equivalent embodiments are within the scope of the present invention. In fact, various modifications of the present disclosure, such as alternative useful combinations of the described elements, in addition to those shown and described herein, will become apparent to those skilled in the art from the description. Such modifications and embodiments are also intended to fall within the scope of the appended claims.

Claims

1. A substrate processing device, comprising: upper chamber; Lower room; a susceptor configured to hold a substrate, wherein the susceptor includes a top surface and a flange protruding from a side of the susceptor; a flow control ring, wherein the flow control ring includes an annular central region, a first portion disposed on the top surface, a second portion disposed on the flange, and a third portion including a recess; Partitions; and Sealing ring, The sealing ring is arranged in the recess. 2 . The substrate processing apparatus of claim 1 , further comprising a pedestal motor configured to raise and lower the pedestal from at least a first position to a second position.

3. The substrate processing apparatus according to claim 2, wherein: The sealing ring contacts the diaphragm when the base is in the first position, and wherein the sealing ring substantially seals the upper chamber relative to the lower chamber when the base is in the first position.

4. The substrate processing apparatus according to claim 2, wherein: The sealing ring is annular, and wherein the sealing ring includes a body and at least two compressible members extending from the body.

5. The substrate processing apparatus according to claim 4, wherein: The at least two compressible members extend horizontally, and wherein the at least two compressible members are compressed when the base is in the first position.

6. The substrate processing apparatus according to claim 2, wherein: The sealing ring is annular, wherein a cross section of the sealing ring is substantially U-shaped with a middle portion and two arms extending from the middle portion of the U-shape, and wherein the middle portion contacts the diaphragm when the base is in the first position.

7. The substrate processing apparatus of claim 1, further comprising an annular recess ring interposed between the seal ring and the flow control ring in the recess of the flow control ring.

8. The substrate processing apparatus according to claim 7, wherein: The annular recess ring comprises metal.

9. The substrate processing apparatus according to claim 1, wherein: The flow control ring comprises ceramic.

10. The substrate processing apparatus according to claim 9, wherein: The flow control ring comprises quartz.

11. The substrate processing apparatus according to claim 9, wherein: The flow control ring comprises alumina. 12 . The substrate processing apparatus of claim 1 , further comprising a stepped annular ring configured to contact a top surface of the flow control ring and a bottom of a recess of the flow control ring.

13. The substrate processing apparatus according to claim 12, wherein: The stepped annular ring comprises metal.

14. The substrate processing apparatus of claim 1, further comprising a controller connected to the pedestal motor, in, The pedestal motor includes a measuring device configured to measure a load on the pedestal motor, and Wherein the controller is configured to adjust the torque on the base motor based on the load measured when the base is in the first position.

15. A flow control ring assembly comprising: a flow control ring, wherein the flow control ring includes an annular central region and a top portion including a recessed portion, wherein the annular central region includes a stepped structure, the stepped structure including a first flat flange portion and a second flat flange portion and a vertical wall spanning therebetween, wherein the second flat flange portion extends further toward the center of the flow control ring than the first flat flange portion; as well as A sealing ring is disposed in the recess.

16. The flow control ring assembly of claim 15 further comprising an annular recess ring interposed between the seal ring and the flow control ring in the recess.

17. The flow control ring assembly of claim 15, wherein: The sealing ring is annular in shape, and wherein the sealing ring includes a body and at least two compressible members extending from the body.

18. The flow control ring assembly of claim 15, wherein: The sealing ring is annular, wherein a cross section of the sealing ring is substantially U-shaped, having a middle portion and two arms extending from the middle portion of the U-shape.

19. The flow control ring assembly of claim 15, further comprising a stepped annular ring configured to contact a top surface of the flow control ring and a bottom of a recess of the flow control ring.

20. A method of substantially sealing an upper chamber relative to a lower chamber, the method comprising: Provide a substrate processing device, the substrate processing device comprising: upper room, Lower room, a susceptor configured to hold a substrate, wherein the susceptor includes a top surface and a flange protruding from a side of the susceptor, Base motor, a flow control ring, wherein the flow control ring comprises an annular central region, a first portion disposed on the top surface, a second portion disposed on the flange, and a third portion comprising a recess, Partitions, and a sealing ring, wherein the sealing ring is disposed in the recess; activating a base motor to move the base from a lower position to an upper position; and The sealing ring is brought into contact with the diaphragm, thereby deforming the sealing ring and substantially sealing the upper chamber relative to the lower chamber.

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