Evaporation device and vapor deposition furnace

Abstract

The embodiment of the invention provides an evaporation device and a vapor deposition furnace, and the evaporation device comprises an evaporator which is provided with an accommodating cavity for accommodating a solid material to be converted; the heating assembly is arranged outside the evaporator and is configured to heat the evaporator so as to convert the solid material into a gaseous material; the input pipeline is communicated with the accommodating cavity and is configured to convey carrier gas to the accommodating cavity; the weighing sensor is configured to detect the weight of the solid material converted into the gaseous material in the accommodating cavity; and the output pipeline is communicated with the accommodating cavity and is configured to enable the carrier gas carrying the gaseous material to be discharged out of the accommodating cavity.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to an evaporation device and a vapor deposition furnace. Background Art

[0002] Chemical Vapor Deposition (CVD) is a technology widely used in materials science and semiconductor manufacturing. The basic principle of vapor deposition is to introduce a gaseous reaction precursor into a reaction chamber. Under specific temperature and pressure conditions, the gaseous reaction precursor undergoes a chemical reaction on the surface of the substrate and eventually deposits to form a solid film or coating. However, when the reaction precursor is solid at room temperature and pressure, the solid reaction precursor needs to be converted into a gaseous state before it can be transported into the reaction chamber, and the reaction precursor converted into a gaseous state is difficult to be stably and accurately transported into the reaction chamber under high temperature conditions.

[0003] Therefore, it is desired to provide an evaporation device that can convert solid materials into gaseous materials and can accurately transport the gaseous materials to a specified environment while keeping the form of the gaseous materials stable. For example, when the evaporation device is applied to a vapor deposition furnace, the converted gaseous materials (i.e., reaction precursors) can be stably and accurately transported to the reaction chamber of the vapor deposition furnace. Summary of the invention

[0004] Some embodiments of the present specification provide an evaporation device, comprising: an evaporator, the evaporator having a holding cavity for holding a solid material to be converted; a heating component, disposed outside the evaporator, configured to heat the evaporator to convert the solid material into a gaseous material; an input pipeline, connected to the holding cavity, configured to transport a carrier gas to the holding cavity; a weighing sensor, configured to detect the weight of the solid material in the holding cavity converted into the gaseous material; and an output pipeline, connected to the holding cavity, configured to allow the carrier gas to carry the gaseous material out of the holding cavity.

[0005] In some embodiments, the heating assembly includes a first heating element and a first insulation layer; the first heating element is disposed outside the evaporator and is configured to heat the evaporator, and the first insulation layer is wrapped outside the evaporator and is configured to insulate the evaporator.

[0006] In some embodiments, the heating assembly further includes a temperature sensor disposed in the first insulation layer and configured to detect the temperature of the evaporator.

[0007] In some embodiments, the evaporator includes a placement port and a cover body, the placement port is connected to the accommodating cavity, the cover body is detachably and sealedly installed on the placement port, and a second insulation layer is provided on the cover body; the input pipe passes through the second insulation layer and the cover body and is connected to the accommodating cavity.

[0008] In some embodiments, the output pipe includes a hard output pipe and a flexible output pipe, one end of the hard output pipe is connected to the accommodating cavity, and the other end of the hard output pipe is connected to the flexible output pipe.

[0009] In some embodiments, a third heating element and a third insulation layer are arranged outside the output pipe. The third heating element is arranged outside the output pipe and is configured to heat the output pipe. The third insulation layer is wrapped outside the output pipe and is configured to insulate the output pipe.

[0010] In some embodiments, the evaporation device further includes a material holding component, and the evaporation device further includes a material holding component, and the material holding component can movably enter or exit the holding chamber through the placement port to transport the solid material to the holding chamber, and the material of the material holding component includes metal, graphite or ceramic.

[0011] In some embodiments, the material holding component is provided with heat conducting fins.

[0012] In some embodiments, a controller is further included, configured to adjust the heating temperature of the heating component based on the detection result of the weighing sensor.

[0013] Some embodiments of the present specification also provide a vapor deposition furnace, comprising a reaction chamber and the evaporation device described in the aforementioned embodiment, wherein the reaction chamber is connected to the output pipeline, and the reaction chamber is used for the gaseous material to undergo a vapor deposition reaction. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] This specification will be further described in the form of exemplary embodiments, which will be described in detail by the accompanying drawings. These embodiments are not restrictive, and in these embodiments, the same number represents the same structure, wherein:

[0015] Figure 1 is a schematic diagram of a module of an evaporation device according to some embodiments of this specification;

[0016] Figure 2 is a schematic diagram of the structure of an evaporation device according to some embodiments of this specification;

[0017] Figure 3 is a schematic diagram of the structure of an evaporation device according to other embodiments of this specification;

[0018] Figure 4 is a schematic diagram of the structure of a cover body according to some embodiments of this specification;

[0019] Figure 5 It is a schematic diagram of the structure of a vapor deposition furnace according to some embodiments of the present specification.

[0020] Figure numerals: evaporation device 100; evaporator 10; accommodating chamber 11; cylinder 12; placement port 13; cover body 14; heating assembly 20; first heating element 21; first thermal insulation layer 22; temperature sensor 23; second thermal insulation layer 24; second heating element 25; input pipe 30; first sealing flange 31; weighing sensor 40; output pipe 50; flexible output pipe 51; hard output pipe 52; second sealing flange 53; third sealing flange 54; three-way joint 55; sealing plate 56; third heating element 61; third thermal insulation layer 62; material holding component 70; material holding bottom plate 71; material holding side plate 72; support member 73; vapor deposition furnace 300; reaction chamber 310; vacuum pump 320; process gas delivery pipeline 330. DETAILED DESCRIPTION

[0021] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present specification. For ordinary technicians in this field, the present specification can also be applied to other similar scenarios based on these drawings without creative work. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0022] As shown in this specification and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural, unless the context clearly indicates an exception. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. The term "based on" means "at least partially based on". The term "some embodiments" means "at least one embodiment"; the term "other embodiments" means "at least one other embodiment", and the relevant definitions of other terms will be given in the description below.

[0023] The basic principle of vapor deposition is to introduce a gaseous reaction precursor into a reaction chamber. Under specific temperature and pressure conditions, the gaseous reaction precursor undergoes a chemical reaction on the surface of the substrate, and finally deposits to form a solid film or coating. In some schemes, when the reaction precursor (e.g., argon, hydrogen, and ethylene, etc.) is in a gaseous state at normal temperature (e.g., 25 degrees Celsius) and normal pressure (e.g., a standard atmospheric pressure), it can be transported into the reaction chamber more stably and accurately. In other schemes, when the reaction precursor is in a solid state at normal temperature and pressure, the reaction precursor needs to be converted into a gaseous state before it can be transported into the reaction chamber, and the reaction precursor converted into a gaseous state is difficult to be transported into the reaction chamber stably and accurately under high temperature conditions.

[0024] It should be noted that the vapor deposition method mentioned in this specification may include physical vapor deposition and chemical vapor deposition. In some embodiments, the chemical vapor deposition method may be metal organic chemical vapor deposition (MOCVD), plasma chemical vapor deposition (PCVD), laser chemical vapor deposition (LCVD), low pressure chemical vapor deposition (LPCVD), ultra vacuum chemical vapor deposition (UHVCVD), ultrasonic chemical vapor deposition (UWCVD), etc.

[0025] Figure 1 is a schematic diagram of a module of an evaporation device according to some embodiments of this specification; Figure 2 It is a schematic diagram of the structure of an evaporation device according to some embodiments of the present specification.

[0026] In some embodiments, in combination Figure 1-Figure 2 As shown, the evaporation device 100 may include an evaporator 10 , a heating assembly 20 , an input pipe 30 , a weighing sensor 40 , and an output pipe 50 .

[0027] The evaporator 10 is configured to accommodate the solid material 200 to be converted. In some embodiments, the inner wall of the evaporator 10 encloses a receiving chamber 11, and the receiving chamber 11 is used to accommodate the solid material 200 to be converted. In some embodiments, the evaporator 10 can be made of a conductor such as iridium (Ir) metal, molybdenum (Mo) metal, tungsten (W) metal, rhenium (Re) metal, graphite (C), tungsten-molybdenum alloy, ceramic, etc., to facilitate heat transfer. In some embodiments, the evaporator 10 can be a cylinder, a cube, a prism, or other feasible shape structures.

[0028] The heating component 20 is configured to heat the evaporator 10 to convert the solid material 200 in the receiving chamber 11 into a gaseous material. In some embodiments, the gaseous material can be a reaction precursor for a vapor deposition reaction, which is solid at room temperature (e.g., 25° C.) and normal pressure (e.g., standard atmospheric pressure), and is converted into a gaseous material in the receiving chamber 11 after being heated by the heating component 20. In some embodiments, the solid material 200 can include a powdered material or a block material. In some embodiments, the process of converting the solid material 200 into a gaseous material can include: melting the solid material 200 by heating, converting the solid material 200 into a liquid material, and converting the liquid material into a gaseous material by evaporating and / or vaporizing the liquid material.

[0029] The input pipe 30 is connected to the containing chamber 11, and the input pipe 30 is configured to deliver a carrier gas to the containing chamber 11. In some embodiments, the carrier gas can be used to carry the gaseous material out of the containing chamber 11. For example, when the evaporation device 100 is applied to a vapor deposition furnace (e.g., Figure 5 When the vapor deposition furnace 300 is used, the carrier gas can carry the gaseous material (ie, the reaction precursor) into the reaction chamber (eg, Figure 5 In the reaction chamber 310 in the vapor deposition reaction chamber, since the carrier gas does not participate in the vapor deposition reaction and only serves to carry the gaseous material, an inert gas or a gas with high chemical stability can be selected. In some embodiments, the carrier gas can be hydrogen, nitrogen, argon or helium. In some specific embodiments, considering the price and chemical stability, the carrier gas can be hydrogen or nitrogen.

[0030] The weighing sensor 40 is configured to detect the weight of the solid material 200 in the accommodating chamber 11 that has been converted into a gaseous material. According to the foregoing content, it can be known that the process of converting the solid material 200 into a gaseous material includes the solid material 200 melting into a liquid material, and the liquid material evaporating and / or vaporizing into a gaseous material. Therefore, during the conversion process, there may be a part of the solid material 200 that has not been melted and / or the liquid material that has not been evaporated and vaporized. This part of the solid material 200 and / or the liquid material is accumulated in the accommodating chamber 11 under the action of its own gravity, and its weight can be detected by the weighing sensor 40. By comparing it with the initial weight of the solid material 200, the weight of the solid material 200 that has been converted into a gaseous material can be determined. In some embodiments, as Figure 3As shown, the evaporator 10 can be supported on the weighing sensor 40, and the carrier gas and the converted gaseous material have little or negligible effect on the detection result of the weighing sensor 40, while the unconverted solid material 200 and the liquid material are accumulated at the bottom of the accommodating chamber 11 under the action of their own gravity, and their weight can be detected by the weighing sensor 40. In some embodiments, the weighing sensor 40 can determine the weight of the solid material 200 converted into the gaseous material between the two time nodes (i.e., the conversion amount of the solid material 200) based on the detection results of the two time nodes, and the conversion rate of the solid material 200 converted into the gaseous material between the two time nodes can be determined by combining the time difference between the two time nodes. In some embodiments, the weighing sensor 40 can collect the weight of the unconverted solid material 200 and the liquid material at a preset frequency (for example, the preset frequency can be 0.1 seconds, 0.5 seconds, 1 second, etc.), and then determine the conversion amount and conversion rate of the solid material 200 during each collection process.

[0031] The output pipe 50 is connected to the containing chamber 11, and the output pipe 50 is configured to allow the carrier gas to carry the gaseous material out of the containing chamber 11. In some embodiments, the output pipe 50 can be connected to other designated chambers to transport the gaseous material to the corresponding chamber. For example, when the evaporation device 100 is applied to a vapor deposition furnace, the output pipe 50 can connect the containing chamber 11 and the reaction chamber of the vapor deposition furnace to transport the gaseous material as a reaction precursor to the reaction chamber.

[0032] The conversion amount and conversion rate of the solid material 200 to the gaseous material are collected by the weighing sensor 40. In combination with the heating power of the heating component 20, the relationship between the conversion rate and the heating power of the heating component 20 can be established, so that a stable and controllable conversion rate can be maintained by adjusting the heating power. In addition, since no additional flow metering or measurement and control device (such as a flow sensor) is installed as a measurement and control device for high-temperature (for example, in some embodiments of this specification, a temperature above 1000°C can be referred to as high temperature) gaseous materials, the drift and deviation of the flow sensor at high temperature are avoided, and the sensor damage and blockage of the output pipeline 50 caused by the condensation point of the output pipeline 50 can also be avoided, thereby ensuring that the supply of gaseous materials is stable and controllable.

[0033] In some embodiments, the heating assembly 20 may include a first heating element 21, which may be disposed outside the evaporator 10 and configured to heat the evaporator 10. As an example only, the first heating element 21 may be a mineral insulated heating cable, which may directly contact the evaporator 10 for heating without using a heat preservation material to isolate the contact with the steam chamber, thereby reducing the total weight of the evaporation device 100, thereby avoiding the need for a large-range weighing sensor 40 and reducing the overall weighing accuracy.

[0034] In some embodiments, the heating assembly 20 may further include a first insulation layer 22, which may be wrapped around the evaporator 10 and configured to insulate the evaporator 10 so that the temperature in the receiving chamber 11 is more stable. In some embodiments, the first insulation layer 22 may be made of a material with good heat resistance so that the temperature in the receiving chamber 11 of the evaporation device 100 remains stable during operation. For example, the evaporator 10 may be made of quartz (silicon oxide), corundum (aluminum oxide), zirconium oxide, graphite, carbon fiber, ceramic or other high temperature resistant materials (e.g., borides, carbides, nitrides, silicides, phosphides, sulfides, etc. of rare earth metals).

[0035] In some embodiments, the heating assembly 20 may include a temperature sensor 23, which is disposed in the first thermal insulation layer 22, and is configured to detect the temperature of the evaporator 10. By providing the temperature sensor 23, the temperature of the evaporator 10 can be monitored in real time, ensuring that the evaporation device 100 operates within a safe range, preventing overheating or insufficient temperature, and improving the safety and stability of the evaporation device 100. In addition, since the temperature sensor 23 is disposed in the first thermal insulation layer 22 rather than directly in the accommodating chamber 11, it is possible to prevent the probe of the temperature sensor 23 from contacting with the high-temperature gas in the accommodating chamber 11 and damaging the probe.

[0036] In some embodiments, the evaporator 10 can be a split design, that is, the evaporator 10 is assembled from a plurality of parts. Before adding the solid material, the evaporator 10 can be disassembled, and after filling the solid material, the evaporator 10 can be assembled and sealed. Just as an example, the evaporator 10 is provided with a placement port 13 and a cover 14. For example, the evaporator 10 includes a cylinder 12 and a cover 14. The cylinder 12 has a receiving cavity 11 for receiving the solid material 200. One end of the cylinder 12 has an opening connected to the receiving cavity 11, and the opening is the placement port 13 of the evaporator 10. The cover 14 is detachably mounted on the placement port 13, and when the cover 14 is mounted on the placement port 13, the cover 14 can seal the placement port 13, thereby enclosing a sealed receiving cavity 11. Before the evaporation device 100 is operated, the cover 14 can be removed from the placement opening 13 , and then the solid material is transported into the receiving chamber 11 through the placement opening 13 , and finally the cover 14 is installed on the placement opening 13 to seal the receiving chamber 11 .

[0037] In some embodiments, the types of sealed connections may include mechanical seals, packing seals, flange seals, dry gas seals, labyrinth seals, oil seals, and spiral seals. In some specific embodiments, the cover 14 and the placement port 13 may be flange sealed. Exemplary flange seals may include CF (Conflat Flang) flange seals, KF flange seals, ISO flange seals, and the like. For example, the cover 14 and the placement port 13 may both be made of metal materials and may be sealed with KF flanges to prevent condensation of gaseous materials at the cover 14.

[0038] In some embodiments, the radial dimension of the cover 14 is greater than the radial dimension of the placement port 13, so that the cover 14 can completely cover the placement port 13 and improve the installation sealing. In this specification, the dimension refers to any parameter that can be used to characterize the size or shape of an object. For example, for a rectangular parallelepiped, the dimension may include length, width, height, whether to include chamfers, chamfer parameters, etc. For a cylinder, the dimension may include height, diameter, whether to include chamfers, chamfer parameters, etc. As an example only, the shape of the placement port 13 is circular, the radial dimension of the placement port 13 is the diameter of the circle, the cover 14 is a circular plate, and the radial dimension of the cover 14 is the diameter of the circular plate. In another example, the shape of the placement port 13 is rectangular, the radial dimension of the placement port 13 is the length of the diagonal of the rectangle, the cover 14 is a rectangular plate, and the radial dimension of the cover 14 is the length of the diagonal of the rectangular plate.

[0039] In some embodiments, the surface of the cover 14 may be provided with a second insulation layer 24, which can insulate the cover 14 and further prevent the gaseous material from condensing at the cover 14. In some embodiments, similar to the first insulation layer 22, the second insulation layer 24 can be made of a material with good heat resistance so that the temperature in the accommodating chamber 11 of the evaporation device 100 remains stable during operation. For example, the material of the second insulation layer 24 can be quartz (silicon oxide), corundum (aluminum oxide), zirconium oxide, graphite, carbon fiber, ceramic or other high temperature resistant materials (for example, borides, carbides, nitrides, silicides, phosphides, sulfides, etc. of rare earth metals). In some embodiments, the material of the second insulation layer 24 can be the same or similar to that of the first insulation layer 22, for example, the materials of the first insulation layer 22 and the second insulation layer 24 are both zirconium oxide. In other embodiments, the material of the second thermal insulation layer 24 may be different from the material of the first thermal insulation layer 22 . For example, the material of the first thermal insulation layer 22 is zirconia, and the material of the second thermal insulation layer 24 is corundum.

[0040] In some embodiments, the second insulation layer 24 and the first insulation layer 22 can be two parts of the same insulation layer used to wrap different components. For example, the first insulation layer 22 and the second insulation layer 24 are two parts of the same insulation layer wrapping the cylinder 12 and the cover 14 respectively.

[0041] In some embodiments, a second heating element 25 may be provided on the cover 14, and the second heating element 25 may heat the cover 14 to make the temperature distribution in the accommodating cavity 11 more uniform, and avoid condensation of gaseous materials at the cover 14. In some embodiments, the second heating element 25 may be the same as or similar to the first heating element 21. In some embodiments, the second heating element 25 and the first heating element 21 may be two parts of the same heating element for heating different components, for example, the first heating element 21 and the second heating element 25 are two parts of the same heating element disposed on the barrel 12 and the cover 14, respectively.

[0042] In some embodiments, when a second insulation layer 24 is provided on the cover body 14 , a first through hole may be opened at a position corresponding to the carrier gas input hole on the second insulation layer 24 , and the delivery pipeline may pass through the first through hole and connect with the carrier gas input hole, thereby connecting with the accommodating cavity 11 .

[0043] In other embodiments, the evaporator 10 may be of an integrated design, that is, the evaporator 10 is an inseparable whole, and the solid material may be transported to the containing chamber 11 through a hole provided on the evaporator 10 or a pipeline communicating with the containing chamber 11. As an example only, the evaporator 10 may be provided with a material input hole (not shown in the figure), which is communicated with the material input pipeline 30. Before the evaporation device 100 is operated, the solid material is transported to the containing chamber 11 through the material input pipeline 30 and the material input hole.

[0044] In some embodiments, the input pipe 30 is detachably connected to the cover body 14. In some embodiments, a carrier gas input hole (not shown in the figure) may be provided on the cover body 14, and the carrier gas input hole is adapted to the input pipe 30. Before evaporation, the carrier gas input hole can be connected to the input pipe 30. When the carrier gas input hole is connected to the input pipe 30, the carrier gas can be input into the accommodating chamber 11 via the input pipe 30 and the carrier gas input hole. The adaptation of the carrier gas input hole to the input pipe 30 can be that the shape of the carrier gas input hole is consistent or substantially consistent with the shape of the input pipe 30, and the size of the carrier gas input hole is larger than the size of the input pipe 30 and the difference between the size of the carrier gas input hole and the size of the input pipe 30 is less than a preset size threshold (for example, 2mm, the preset size threshold can be a default value, and can also be adjusted according to actual conditions). In other embodiments, the input pipe 30 is fixedly connected to the cover body 14.

[0045] In some embodiments, the input pipeline 30 is connected to an external carrier gas pumping device (not shown) via a first sealing flange 31 . For example, the first sealing flange 31 may be a CF flange seal.

[0046] In some embodiments, the input pipe 30 may include a flexible input pipe so that the flexible input pipe can be bent according to the relative position of the external carrier gas pumping device and the evaporator 10 to ensure stable delivery of the carrier gas.

[0047] In some embodiments, Figure 2 As shown, the output pipe 50 may include a flexible output pipe 51, one end of which is connected to the containing chamber 11, and the carrier gas may carry the gaseous material out of the evaporator 10 from the flexible output pipe 51. In some embodiments, the flexible output pipe 51 may include a stainless steel corrugated hose. In this embodiment, the flexible output pipe 51 is used as a connection between the evaporator 10 (for example, the containing chamber 11 of the evaporator 10) and other chambers (for example, Figure 5 When the gaseous material and the carrier gas enter the flexible output pipe 51, the flexible output pipe 51 will be deformed. When the amount of carrier gas introduced remains unchanged, the weight of the gaseous material converted by the evaporation device 100 can be directly measured according to the deformation of the flexible output pipe 51. On this basis, the weight of the gaseous material converted by the evaporation device 100 measured by the deformation of the flexible output pipe 51 can be combined with the detection result of the weighing sensor 40 in the aforementioned embodiment, thereby improving the detection accuracy of the weight of the gaseous material converted by the evaporation device 100, so as to be able to more accurately control the heating power of the heating component 20. In addition, the flexible output pipe 51 not only plays a connecting role, but also avoids increasing the weight of the evaporation device 100 too much, and avoids using a large-range weighing sensor 23, thereby improving the measurement accuracy of the weighing sensor 23.

[0048] In some embodiments, the evaporator 10 (for example, the accommodating chamber 11 of the evaporator 10) and the inlet of the flexible output pipe 51, the outlet of the flexible output pipe 51 and other chambers can be sealed to improve the airtightness during the transmission of the gaseous material and reduce the number of condensation points of the output pipe 50. In some embodiments, flange sealing can be used between the evaporator 10 and the inlet of the flexible output pipe 51, the outlet of the flexible output pipe 51 and other chambers. For example, when the evaporation device 100 is applied to a vapor deposition furnace, the outlet of the flexible output pipe 51 and the reaction chamber of the vapor deposition furnace can be connected through a second sealing flange 53, and the second sealing flange 53 can be a KF flange.

[0049] In some embodiments, Figure 4As shown, the output pipe 50 may further include a hard output pipe 52, one end of which is in communication with the accommodating chamber 11, the other end of which is in communication with one end of the flexible output pipe 51, and the other end of which is in communication with the external environment. In some embodiments, the hard output pipe 52 may include a stainless steel hard pipe. In this embodiment, by connecting the hard output pipe 52 to the accommodating chamber 11, the connection strength between the output pipe 50 and the evaporator 10 can be improved, and the disassembly and maintenance of the output pipe 50 is also convenient.

[0050] In some embodiments, the inlet of the hard output pipe 52 and the accommodating chamber 11, and the outlet of the hard output pipe 52 and the inlet of the flexible output pipe 51 can be sealed. In some embodiments, the hard output pipe 52 and the evaporator 10, and the hard output pipe 52 and the flexible output pipe 51 can be flange sealed. For example, the inlet of the hard output pipe 52 and the evaporator 10 (for example, the accommodating chamber 11 of the evaporator 10), and the outlet of the hard output pipe 52 and the inlet of the flexible output pipe 51 can be connected through a third sealing flange 54, and the third sealing flange 54 can be a KF flange.

[0051] In some embodiments, the output pipe 50 may further include a three-way joint 55, and the output pipe 50 may be connected to other chambers through the three-way joint 55. The inlet of the three-way joint 55 is connected to the other end of the flexible output pipe 51, the first outlet of the three-way joint 55 is connected to the reaction chamber 310, and the sealing plate 56 is detachably sealed and installed on the second outlet of the three-way joint 55. The first outlet and the second outlet of the three-way joint 55 are respectively arranged on both sides of the inlet. In this embodiment, since the first outlet and the second outlet are respectively arranged on both sides of the inlet, when the solid and / or liquid are discharged from the output pipe 50, they can be accumulated on the sealing plate 56 of the second outlet under the action of their own gravity, so as to avoid the solid and / or liquid directly accumulating at the outlet of the output pipe 50, causing the output pipe 50 to be blocked. In addition, by providing a detachable sealing plate 56 at the second outlet of the tee joint 55, it is convenient to inspect and repair the bend of the tee joint 55. For example, when solid and liquid are accumulated at the bend of the tee joint 55, the sealing plate 56 can be removed to dredge the tee joint 55, thereby improving the service life of the tee joint 55. In some embodiments, the sealing plate 56 and the second outlet of the tee joint 55 can be sealed by a KF flange.

[0052] In some embodiments, the evaporation device 100 may further include a second heating assembly, which is configured to control the temperature of the output pipe 50 and the temperature in the output pipe 50. In some embodiments, the second heating assembly may include a third heating element 61, which is disposed outside the output pipe 50 and is configured to heat the output pipe 50. In some embodiments, the third heating element 61 may be the same as or similar to the first heating element 21. For example, the third heating element 61 may be a mineral insulated heating cable, which may directly contact the output pipe 50 for heating without using an insulating material to isolate the contact with the output pipe 50, thereby reducing the total weight of the evaporation device 100. In some embodiments, the second heating assembly may further include a third insulating layer 62, which is wrapped outside the output pipe 50. By insulating the output pipe 50, the evaporated gaseous substance may be kept within a specific temperature range during the transmission process, effectively avoiding condensation of the gaseous substance. In addition, since the second heating assembly is disposed outside the output pipe 50 and no flow meter or measurement and control device is required, the air tightness of the output pipe 50 can be improved, and the condensation point during the gaseous material transportation process of the output pipe 50 can be reduced. In some embodiments, the third insulation layer 62 can be the same as or similar to the first insulation layer 22, and will not be described in detail herein.

[0053] In some embodiments, a temperature sensor may also be provided in the third insulation layer 62. By providing the temperature sensor, the temperature of the output pipe 50 can be monitored in real time to ensure that the output pipe 50 transports gaseous materials within an ideal temperature range, prevent the temperature of the output pipe 50 from being too high or too low, and improve the stability of the gaseous material supply.

[0054] In some embodiments, the evaporation device 100 may further include a material containing component 70 , and the material containing component 70 may movably enter or exit the containing chamber 11 through the placement opening 13 to transport the solid material 200 to the containing chamber 11 .

[0055] In some embodiments, the material holding component 70 may include a material holding bottom plate 71 and a material holding side plate 72 disposed around the edge of the material holding bottom plate 71, and the material holding side plate 72 and the material holding bottom plate 71 are enclosed to form a box-shaped (or boat-shaped) structure capable of holding the solid material 200. In some embodiments, the material holding side plate 72 may be an integral structure, for example, the material holding side plate 72 may be an annular plate surrounding the side of the material holding bottom plate 71. In other embodiments, the material holding side plate 72 may be composed of a plurality of plates stacked along the side of the material holding bottom plate 71, for example, the material holding bottom plate 71 is a circular plate, and the material holding side plate 72 may be composed of a plurality of arc-shaped plates stacked along the side of the material holding bottom plate 71.

[0056] In some embodiments, a support member is provided on the material holding bottom plate 71, and the support member is configured to support the material holding component 70 on the inner wall of the evaporator 10 (i.e., the cavity wall of the holding cavity 11), so that the material holding bottom plate 71 is spaced a certain distance from the inner wall of the evaporator 10, which facilitates the placement and removal of the material holding component 70.

[0057] In some embodiments, the material holding component 70 can be made of metal materials (for example, iridium (Ir) metal, molybdenum (Mo) metal, tungsten (W) metal, rhenium (Re) metal, etc.), alloy materials (for example, tungsten-molybdenum alloy), graphite (C), ceramics, etc., to improve the heat shock resistance and thermal conductivity of the material holding component 70.

[0058] In some embodiments, the material holding component 70 may be provided with heat-conducting fins (not shown in the figure), and the heat-conducting fins can increase the contact area between the material holding component 70 and the solid material 200 to be converted, thereby improving the heat transfer efficiency between the material holding component 70 and the solid material 200, and improving the efficiency of converting the solid material 200 into gaseous material.

[0059] In some embodiments, one or more components of the evaporation device 100 can perform corresponding functions by manual operation. For example, an operator can manually control the heating power of the heating component 20 to heat the evaporator 10 .

[0060] In some embodiments, one or more components of the evaporation device 100 can be controlled by other components to perform corresponding functions. In some embodiments, the evaporation device 100 may also include a controller, which can adjust the heating temperature of the heating component 20 (e.g., the first heating element 21) based on the detection result of the weighing sensor 40. As an example only, according to the description of other embodiments of this specification, the weighing sensor 40 can detect the weight of the solid material 200 in the accommodating chamber 11 converted into a gaseous material, and the conversion rate can be determined according to the weight of the solid material 200 in the accommodating chamber 11 converted into a gaseous material and the time of conversion. On this basis, the controller can adjust the heating power according to the detection result of the weighing sensor 40 based on the relationship between the heating power and the conversion rate of the heating component 20 to maintain a stable and controllable conversion rate. For example, when the conversion rate of the solid material 200 is detected to be too fast, the controller can reduce the heating power of the heating component 20, thereby reducing the conversion rate of the solid material 200. For another example, when the conversion rate of the solid material 200 is detected to be too slow, the controller can increase the heating power of the heating component 20, thereby reducing the conversion rate of the solid material 200.

[0061] In some embodiments, the evaporation device may further include a pressure sensor (not shown in the figure) and a humidity sensor (not shown in the figure), which may be disposed in the receiving chamber 11 and configured to detect the pressure and humidity in the receiving chamber 11, respectively. The pressure sensor and the humidity sensor may be connected to the controller for communication and transmit the detection results to the controller. The controller may adjust the heating power of the heating component 20 (e.g., the first heating element 21) in combination with the detection results of the pressure sensor, the humidity sensor, and the weighing sensor 23. For example, when the pressure in the receiving chamber 11 is too high or the humidity is too high, it may indicate that the gaseous material in the receiving chamber 11 is not discharged in time. The controller may reduce the heating power of the heating component 20 to avoid further increase of the pressure or humidity in the receiving chamber 11, thereby improving the safety and stability of the evaporation device 100. For another example, when the pressure in the receiving chamber 11 is too low or the humidity is too low, it may indicate that the conversion efficiency of the solid material is low. The controller may increase the heating power of the heating component 20 to maintain the stability of the conversion rate.

[0062] This specification also provides an operating method of the evaporation device 100, which includes but is not limited to the following steps: before operation, the evaporator (for example, Figure 2 The cover of the evaporator 10) (for example, Figure 2 The cover 14 in the embodiment is removed, and the material containing component (for example, Figure 2 The material holding part 70 in the material holding part 70) is placed through the opening (for example, Figure 2 The placement opening 13 in the housing cavity 11 is placed, and the cover body 14 is sealed and connected to the placement opening 13, and the second insulation layer (for example, Figure 2 The second insulation layer 24 in the cover 14 is installed on the cover 14; the input pipeline 30 is sealed and connected to the external carrier gas pumping device (through the first sealing flange 31); the evaporator 10 and the output pipeline 50 are heated, and the conversion rate is set; the carrier gas is introduced and the solid material 200 is started to be converted.

[0063] In order to more clearly explain the operation method of the evaporation device 100, this specification will take ZrCl4 (zirconium chloride) as the solid material 200 as an example to illustrate the process of converting ZrCl4 powder by the evaporation device 100. The process of converting ZrCl4 powder by the evaporation device 100 includes the following steps:

[0064] Step a, disassembling the cover body 14 provided with the second heat-insulating layer 24 from the placement opening 13, and taking out the material containing component 70;

[0065] Step b, placing 1000 g of ZrCl4 powder in the material holding component 70, and leveling the surface of the ZrCl4 powder in the material holding component 70;

[0066] Step c, loading the material containing component 70 into the containing cavity 11 through the placing opening 13, and sealingly installing the cover body 14 provided with the second heat-insulating layer 24 on the placing opening 13;

[0067] Step d, connecting the inlet of the input pipeline 30 to a carrier gas pumping device for conveying argon gas;

[0068] Step e, controlling the first heating element 21 and the second heating element 25 to heat the evaporator 10 at a temperature of 250° C. to 300° C., controlling the third heating element 61 to heat the output pipe 50 at a temperature of 330° C. to 350° C., and setting the conversion rate at 2 g / min;

[0069] Step f. When the temperature in the evaporator 10 (for example, the containing chamber 11 of the evaporator 10) rises to 330°C, argon gas is delivered to the containing chamber 11, and the heating powers of the first heating element 21 and the second heating element 25 are controlled so that the temperature in the containing chamber 11 is in the range of 290°C to 340°C, so as to stabilize the conversion rate in the range of 1.9 g / min to 2.1 g / min.

[0070] Some embodiments of the present specification also provide a vapor deposition furnace for performing a vapor deposition reaction. Figure 5 As shown, the vapor deposition furnace 300 may include a reaction chamber 310 and an evaporation device 100 in other embodiments of the present specification, and the reaction chamber 310 is connected to an output pipe 50. When the reaction precursor for the vapor deposition reaction is solid at room temperature (e.g., 25 degrees Celsius) and normal pressure (e.g., standard atmospheric pressure), the solid material 200 may be converted into a gaseous material by the evaporation device 100 and transported to the reaction chamber 310 of the vapor deposition furnace 300 through the output pipe 50.

[0071] In some embodiments, the reaction chamber 310 may include a kettle reaction chamber, or may be a tubular reaction chamber, a tower reaction chamber, a fluidized bed, or a fixed bed.

[0072] In some embodiments, the vapor deposition furnace 300 may further include a vacuum pump 320 connected to the reaction chamber 310 , and the vacuum pump 320 is configured to extract air from the reaction chamber 310 to form a vacuum environment in the reaction chamber 310 to facilitate vapor deposition reaction in the reaction chamber 310 .

[0073] In some embodiments, the vapor deposition furnace 300 may further include a process gas delivery pipeline 330 connected to the reaction chamber 310, and the process gas delivery pipeline 330 is configured to deliver process gas for vapor deposition reaction, such as carbonization gas (e.g., methane, propane, butane, etc.), to the reaction chamber 310.

[0074] The beneficial effects of the evaporation device and the vapor deposition furnace provided in this specification include but are not limited to: (1) The conversion amount and conversion rate of solid materials into gaseous materials are collected by weighing sensors. Combined with the heating power of the heating component, the relationship between the conversion rate and the heating power of the heating component can be established, so that a stable and controllable conversion rate can be maintained by adjusting the heating power; (2) Since no additional flow metering or measurement and control device (such as a flow sensor) is installed as a measurement and control device for high-temperature gaseous materials, the drift and deviation of the flow sensor at high temperature are avoided, and the sensor damage and blockage of the output pipeline caused by the condensation point of the output pipeline can also be avoided, thereby ensuring that the supply of gaseous materials is stable and controllable; (3) By setting a temperature sensor, the temperature of the containing chamber can be monitored in real time to ensure that the evaporation The device operates within a safe range to prevent overheating or insufficient temperature, thereby improving the safety and stability of the evaporation device; (4) Since the output pipe is connected to the reaction chamber of the vapor deposition furnace through a three-way joint, and since the first outlet and the second outlet are respectively arranged on both sides of the inlet, when the solid and / or liquid are discharged from the output pipe, they can accumulate on the sealing plate of the second outlet under the action of their own gravity, thereby preventing the solid and / or liquid from directly accumulating at the outlet of the output pipe and causing blockage of the output pipe. In addition, by providing a detachable sealing plate at the second outlet of the three-way joint, the bend of the three-way joint can be easily inspected and repaired. For example, when solid and liquid accumulate at the bend of the three-way joint, the sealing plate can be removed to clear the three-way joint, thereby improving the service life of the three-way joint.

[0075] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements and amendments to the present application. Such modifications, improvements and amendments are suggested in the present application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present application.

[0076] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0077] In addition, unless explicitly stated in the claims, the order of the processing elements and sequences described in this application, the use of alphanumeric characters, or the use of other names are not intended to limit the order of the processes and methods of this application. Although the above disclosure discusses some invention embodiments that are currently considered useful through various examples, it should be understood that such details are only for illustrative purposes, and the attached claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the essence and scope of the embodiments of this application. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing server or mobile device.

[0078] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0079] In some embodiments, numbers describing the number of components and attributes are used. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise specified, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

[0080] Each patent, patent application, patent application disclosure, and other materials, such as articles, books, instructions, publications, documents, etc., cited in this application are hereby incorporated by reference in their entirety. Except for application history documents that are inconsistent with or conflicting with the content of this application, documents that limit the broadest scope of the claims of this application (currently or later attached to this application) are also excluded. It should be noted that if the descriptions, definitions, and / or use of terms in the attached materials of this application are inconsistent or conflicting with the content described in this application, the descriptions, definitions, and / or use of terms in this application shall prevail.

[0081] Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of the present application. Other variations may also fall within the scope of the present application. Therefore, as an example and not a limitation, the alternative configurations of the embodiments of the present application may be considered to be consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly introduced and described in the present application.

Claims

1. An evaporation device, characterized in that: include: An evaporator, the evaporator having a receiving chamber for receiving solid materials to be converted; A heating component, disposed outside the evaporator, configured to heat the evaporator to convert the solid material into a gaseous material; an input pipeline, connected to the containing chamber and configured to deliver carrier gas to the containing chamber; A weighing sensor configured to detect the weight of the gaseous material converted from the solid material in the containing chamber; The output pipe is communicated with the containing chamber and is configured to allow the carrier gas to carry the gaseous material out of the containing chamber.

2. The evaporation device according to claim 1, characterized in that The heating assembly includes a first heating element and a first insulation layer; the first heating element is arranged outside the evaporator and is configured to heat the evaporator, and the first insulation layer is wrapped outside the evaporator and is configured to keep the evaporator warm.

3. The evaporation device according to claim 2, characterized in that: The heating assembly further includes a temperature sensor disposed in the first heat-insulating layer and configured to detect the temperature of the evaporator.

4. The evaporation device according to claim 1, characterized in that: The evaporator comprises a placement opening and a cover body, wherein the placement opening is communicated with the accommodating cavity, the cover body is detachably and sealedly mounted on the placement opening, and a second heat-insulating layer is provided on the cover body; The input pipe passes through the second heat-insulating layer and the cover body and is communicated with the accommodating cavity.

5. The evaporation device according to claim 1, characterized in that The output pipeline includes a hard output pipeline and a flexible output pipeline. One end of the hard output pipeline is communicated with the accommodating cavity, and the other end of the hard output pipeline is communicated with the flexible output pipeline.

6. The evaporation device according to claim 1, characterized in that A third heating element and a third thermal insulation layer are arranged outside the output pipe. The third heating element is arranged outside the output pipe and is configured to heat the output pipe. The third thermal insulation layer is wrapped outside the output pipe and is configured to insulate the output pipe.

7. The evaporation device according to claim 4, characterized in that The evaporation device further comprises a material holding component, which can movably enter or exit the holding chamber through the placement port to transport the solid material to the holding chamber. The material of the material holding component comprises metal, graphite or ceramic.

8. The evaporation device according to claim 7, characterized in that The material containing component is provided with heat conducting fins.

9. The evaporation device according to claim 1, characterized in that A controller is also included, which is configured to adjust the heating temperature of the heating component based on the detection result of the weighing sensor.

10. A vapor deposition furnace, characterized in that: It comprises a reaction chamber and the evaporation device according to any one of claims 1 to 9, wherein the reaction chamber is connected to the output pipeline, and the reaction chamber is used for the gaseous material to undergo a vapor deposition reaction.

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