A heating disc device and thin film deposition apparatus thereof for reducing oxidation of components

Abstract

This invention discloses a heating plate device for reducing component oxidation and its thin film deposition equipment. The heating plate device for reducing component oxidation includes a heating plate, a heating rod, an RF rod, and a sealing cover. The heating plate includes a heating element and a support handle connected to the center of the bottom of the heating plate. The support handle has a mounting cavity, and the heating rod and the RF rod are embedded in the mounting cavity. The sealing cover is connected to the opening of the mounting cavity, so that a sealed vacuum cavity is formed inside the mounting cavity. The heating plate device for reducing component oxidation and its thin film deposition equipment of this invention, by designing the mounting cavity of the support handle where the heating rod and the RF rod are embedded as a sealable structure, evacuates the mounting cavity during operation, thereby replacing the existing design of introducing inert gas to reduce the oxidation of the heating rod and the RF rod. This design offers higher safety, better reduction of component oxidation, and avoids localized cold spots on the heating plate, resulting in better heating performance.

Description

Technical Field

[0001] This invention relates to the field of thin film deposition equipment technology, and more particularly to a heating plate device for reducing component oxidation and a thin film deposition equipment thereof. Background Technology

[0002] In high-temperature carbon processes, the surface temperature of the heating plate can exceed 650 degrees Celsius, while the temperatures of the heating connecting rod and RF connecting rod can exceed 400 degrees Celsius. At these high temperatures, the oxidation rate of the heating rod and RF rod accelerates significantly, ultimately leading to the denaturation and damage of the RF material. Currently, a common solution is to introduce an inert gas, such as pure nitrogen, into the heating plate handle to minimize oxidation. However, this approach has the following drawbacks: the introduction of nitrogen cannot completely eliminate oxygen, and the heating plate will still be oxidized; the nitrogen introduced into the heating plate handle will contact the lower center of the heating plate, conducting heat away from the corresponding area through thermal convection, creating cold spots and affecting the temperature uniformity of the heating plate; to protect the RF connecting rod as much as possible, a large nitrogen flow rate is required, but a large nitrogen flow rate carries the risk of leakage and suffocation. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a heating plate device and its thin film deposition equipment that reduce component oxidation, so as to solve the technical problem that the heating rod and radio frequency rod are easily oxidized due to the existing heating plate structure design.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] In a first aspect, embodiments of the present invention provide a heating plate device for reducing component oxidation, comprising: a heating plate, a heating rod and an radio frequency rod, and a sealing cover plate. The heating plate includes: a heating element and a support handle connected to the bottom center of the heating plate. The support handle has an installation cavity, the heating rod and the radio frequency rod are embedded in the installation cavity, and the sealing cover plate is connected to the opening of the installation cavity, so that a sealed vacuum cavity is formed inside the installation cavity.

[0006] The heating plate device for reducing component oxidation also includes a vacuum module, which is used to evacuate the sealed mounting cavity.

[0007] The lower end of the support handle is connected to a water-cooling plate, and the bottom of the water-cooling plate is provided with a flange. The flange has a receiving cavity that communicates with the mounting cavity. The lower ends of the heating rod and the radio frequency rod extend into the receiving cavity, and the lower ends of the heating rod and the radio frequency rod are fixedly inserted into the flange.

[0008] The sealing cover is sealed to the bottom side wall of the receiving cavity, so that the mounting cavity and the receiving cavity form a connected sealed cavity.

[0009] The flange is further provided with a base at its bottom, and the base is provided with an air extraction channel. The air extraction channel is connected to the receiving cavity, and the outer port of the air extraction channel extends to the surface of the base.

[0010] The connection between the support handle and the water-cooling plate, and the connection between the water-cooling plate and the flange, are both provided with sealing rings.

[0011] The upper ends of both the heating rod and the radio frequency rod abut against the heating plate.

[0012] The mounting cavity is also equipped with a temperature sensor unit.

[0013] The heating plate device for reducing component oxidation also includes an AC filter unit connected to the radio frequency rod.

[0014] In a second aspect, embodiments of the present invention provide a thin film deposition apparatus, the thin film deposition apparatus including a heating plate device for reducing component oxidation as described in any of the above claims.

[0015] The heating plate device and thin film deposition equipment for reducing component oxidation of the present invention, by designing the mounting cavity of the support handle in which the heating rod and radio frequency rod are embedded as a sealable structure, and evacuating the mounting cavity during operation, replaces the existing design of introducing inert gas to reduce the oxidation of heating rod and radio frequency rod. It is safer, has a better effect on reducing component oxidation, and does not cause local cold spots on the heating plate. It also has a better heating effect on the wafer.

[0016] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of the present invention more obvious and understandable, preferred embodiments are described in detail below. Attached Figure Description

[0017] Figures 1 to 2 These are schematic diagrams of the heating plate device for reducing component oxidation according to an embodiment of the present invention from different perspectives.

[0018] Figure 3 This is an exploded view of a heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0019] Figure 4 This is a schematic diagram of the heating plate portion of the heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0020] Figure 5This is a schematic diagram of the AC filter unit and base portion of the heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0021] Figure 6 This is a schematic diagram of the water-cooling plate portion of the heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0022] Figure 7 This is a schematic diagram of the internal component structure of the heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0023] Figure 8 This is a schematic diagram of the internal components and AC filter unit of the heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0024] Figure 9 This is a front view of a heating plate device for reducing component oxidation according to an embodiment of the present invention.

[0025] Figure 10 for Figure 9 The DD section view is shown.

[0026] Figure 11 for Figure 10 The diagram shows a magnified view of part A.

[0027] Explanation of reference numerals in the attached figures:

[0028] The heating plate device 100 for reducing component oxidation includes a heating plate 1, a heating plate 11, a support handle 12, a mounting cavity 121, an AC filter unit 2, a water cooling plate 3, a flange 4, a receiving cavity 41, a base 5, an air passage 51, a pipe hole 52, a sealing cover 6, a heating rod 7, a temperature sensor unit 8, an RF rod 9, a vacuum hole 101, and an air extraction channel 102. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] In high-temperature carbon processes, the surface temperature of the heating plate can exceed 650 degrees Celsius, while the temperatures of the heating connecting rod and the RF connecting rod can exceed 400 degrees Celsius. At these high temperatures, the oxidation rate of the heating rod and the RF rod accelerates significantly, ultimately leading to the denaturation and damage of the RF material. Currently, a common solution is to introduce an inert gas, such as pure nitrogen, into the heating plate handle to minimize oxidation. However, this approach has the following drawbacks: the introduction of nitrogen cannot completely eliminate oxygen, and the heating plate will still be oxidized; the nitrogen introduced into the heating plate handle will contact the lower center of the heating plate, conducting heat away from the corresponding location through thermal convection, creating a cold spot and affecting the temperature uniformity of the heating plate; to protect the RF connecting rod as much as possible, a large nitrogen flow rate is required, but a large nitrogen flow rate poses a risk of suffocation. To address these problems, this embodiment discloses a heating plate device 100 for reducing component oxidation.

[0037] Please see Figures 1 to 11 In this embodiment, a heating plate device 100 for reducing component oxidation is disclosed. It is used in a thin film deposition apparatus for semiconductor processes. The heating plate device is used to support the wafer and heat the wafer to complete the surface thin film deposition of a specific process.

[0038] The heating plate device 100 for reducing component oxidation includes: a heating plate 1, a heating rod 7 and an RF rod 9, and a sealing cover plate 6. The heating plate 1 includes: a heating element 11 and a support handle 12 connected to the bottom center of the heating element 11. The support handle 12 has a mounting cavity 121. The heating rod 7 and the RF rod 9 are embedded in the mounting cavity 121, and the sealing cover plate 6 is connected to the opening of the mounting cavity 121, so that a sealed vacuum cavity is formed inside the mounting cavity 121.

[0039] Existing heating plate devices typically use a flowing inert gas to circulate through the space containing the heating rod and radio frequency (RF) rod, which are embedded within a support shank. This inert gas is used to isolate the heating rod and RF rod from oxygen, thereby slowing down their oxidation rate. However, because inert gas is used to isolate oxygen, it cannot completely eliminate it. The heating rod and RF rod still have a significant chance of contact with oxygen, further accelerating their oxidation rate during the high-temperature operation of the heating plate. Simultaneously, the temperature changes of the inert gas itself, while removing oxygen, can also carry away heat from the heating plate, leading to localized cold spots and uneven temperature distribution on the heating plate. This uneven heating of the wafer results in a decrease in thin film deposition quality. In this embodiment, the cavity inside the support handle 12 or the cavity connected to it is covered by a sealing cover plate 6, so that the space where the heating rod 7 and the radio frequency rod 9 are located can be evacuated. When the thin film deposition process is started, the interior is kept in a vacuum state. On the one hand, it can isolate the possibility of oxygen coming into contact with the heating rod or radio frequency rod. On the other hand, the heat flow is greatly reduced in the vacuum state. For the heating plate, there will be no local cold spots caused by heat loss, so the surface temperature of the heating plate is more uniform and more stable.

[0040] The heating plate device 100 for reducing component oxidation also includes a vacuum module (not shown in the figure), which is used to evacuate the sealed mounting cavity 121. The vacuum module includes a vacuum pump or other air extraction equipment.

[0041] Please refer to it again. Figure 1 and Figure 11 The lower end of the support handle 12 is connected to a water cooling plate 3. The bottom of the water cooling plate 3 is also provided with a flange 4. The flange 4 is provided with a receiving cavity 41 that communicates with the mounting cavity 12. The lower ends of the heating rod 7 and the radio frequency rod 9 both extend into the receiving cavity 41, and the lower ends of the heating rod 7 and the radio frequency rod 9 are fixedly inserted into the flange 4.

[0042] The water-cooled plate 3 has an annular liquid-cooling cavity for circulating coolant to cool the inner components. The water-cooled plate 3 has an internal mounting groove into which the upper tubular portion of the flange 4 is inserted. The lower end of the support handle 12 can be directly connected to the water-cooled plate 3, or a mating seat can be added at the joint.

[0043] The flange 4 is further provided with an external connection hole, which communicates with the receiving cavity 41. The sealing cover 6 is sealed and connected to the external connection hole. Here, the external connection hole refers to a through hole at the bottom of the receiving cavity 41 of the flange 4 that communicates with the outside. In other words, the receiving cavity 41 is a through hole that extends vertically through the flange 4. The sealing cover 6 covers the lower opening of the through hole, so that the receiving cavity 41 and the mounting cavity 121 form a connected sealed cavity.

[0044] Please refer to it again. Figure 2 and Figure 5 The flange 4 is further provided with a base 5 at its bottom. The base 5 has an air passage 51 inside, which is connected to the receiving cavity 41, and the outer port of the air passage 51 extends to the surface of the base 5. The base 5 is also provided with a tube hole 52 for threading the wires of the radio frequency rod 9 and the heating rod 7.

[0045] Please refer to it again. Figure 10 and Figure 11 Sealing rings are provided at the connection points of the support handle 12 and the water-cooling plate 3, and at the connection points of the water-cooling plate 3 and the flange 4. After the heating plate 1, the water-cooling plate 3, and the flange 4 are assembled, the corresponding cavities are connected, and sealing rings are provided at the mating positions of adjacent components to seal them, so that the sealed cavities embedded in the heating rod 7 and the radio frequency rod 9 are in a closed state, thereby improving their sealing performance.

[0046] Furthermore, the upper ends of both the heating rod 7 and the radio frequency rod 9 abut against the heating plate 11, and their lower ends are fixedly connected to the flange 4. In this embodiment, multiple heating rods 7 are provided, and the multiple heating rods 7 and radio frequency rods 9 are distributed along the length direction of the sealed cavity, and the diameters of the heating rods 7 and radio frequency rods 9 are maximized as much as possible to improve their heat dissipation efficiency.

[0047] like Figure 6 and Figure 10 As shown, a temperature sensor unit 8 is also provided in the mounting cavity 121. The temperature probe of the temperature sensor unit 8 abuts against the heating plate 11, and the signal line connected to the temperature probe passes through the mounting cavity 121 and the receiving cavity 41, and is finally led out from the base 5.

[0048] like Figure 1 As shown, the heating plate device 100 for reducing component oxidation also includes an AC filter unit 2 connected to the RF rod 9. The AC filter unit 2 is connected to the base 5 and is also externally connected to a power matching device to input the RF power supply current into the RF rod 9 at the required power. The RF rod 9 serves as the lower electrode of the process chamber and forms an electric field with the spray plate (which serves as the upper electrode) corresponding to the heating plate 1 to ionize the special gas.

[0049] Specifically, the sealing cover plate 6 is also provided with a vacuum hole 101, and the base 5 is also provided with a vacuum channel 102 that is aligned and connected to the vacuum hole 101. The outer end of the vacuum channel 102 is connected to a vacuum pump or other vacuum unit. The sealing cover plate 6 can be an independent plate assembled into the receiving cavity 41 of the flange 4, or it can be a structure integrally formed with the flange 4.

[0050] In this embodiment, the heating plate 11 of the heating plate 1 has a circular structure, and the support handle 12, integrally formed with the heating plate 11 at its bottom, has a tubular structure. The internal cavity is used to house the heating rod 7, the radio frequency rod 9, and the temperature sensor unit 8, etc. The lower end of the support handle 12 is fixedly connected to a mating seat by screws. The lower outer side of the mating seat is also connected to the water cooling plate 3. The tubular part of the flange 4 is sleeved inside the lower end of the water cooling plate 3. The lower edge of the water cooling plate 3 is also connected to the sealing cover plate 6 by screws. The flange 4 is also externally connected to other mechanisms, such as a rotary drive mechanism or a lifting mechanism to drive the overall rotation. The heating plate 1, the water cooling plate 3, the flange 4, and the base 5 are arranged approximately coaxially in the vertical direction.

[0051] An embodiment of the present invention provides a thin film deposition apparatus, the thin film deposition apparatus including a heating plate device 100 for reducing component oxidation as described in any of the above claims. The heating plate 1 of the heating plate device 100 for reducing component oxidation extends into the process chamber for heating and supporting the wafer.

[0052] The heating plate device and thin film deposition equipment for reducing component oxidation in this embodiment design the mounting cavity of the support handle in which the heating rod and radio frequency rod are embedded as a sealable structure. During operation, the mounting cavity is evacuated, thereby replacing the existing design of introducing inert gas to reduce the oxidation of the heating rod and radio frequency rod. This design is safer, has a better effect on reducing component oxidation, and does not cause local cold spots on the heating plate. It also has a better heating effect and achieves higher deposition quality when used in thin film deposition equipment.

[0053] The above examples are merely illustrative of the technical content of the present invention to facilitate easier understanding by the reader, but do not imply that the implementation of the present invention is limited to these examples. Any technical extensions or re-creations made based on the present invention are protected by the present invention. The scope of protection of the present invention is defined by the claims.

Claims

1. A heating plate device for reducing component oxidation, characterized in that, include: The heating plate includes a heating element, a heating rod, an RF rod, and a sealing cover. The heating plate includes a heating element and a support handle connected to the center of the bottom of the heating element. The support handle has an installation cavity. The heating rod and the RF rod are embedded in the installation cavity, and the sealing cover seals and covers the installation cavity, so that a sealed vacuum cavity is formed inside the installation cavity.

2. The heating plate device for reducing component oxidation according to claim 1, characterized in that, The heating plate device for reducing component oxidation also includes a vacuum module for evacuating the sealed mounting cavity.

3. The heating plate device for reducing component oxidation according to claim 2, characterized in that, The lower end of the support handle is connected to a water-cooling plate, and the bottom of the water-cooling plate is also provided with a flange. The flange has a receiving cavity that communicates with the mounting cavity. The lower ends of the heating rod and the radio frequency rod both extend into the receiving cavity, and the lower ends of the heating rod and the radio frequency rod are fixedly inserted into the flange.

4. The heating plate device for reducing component oxidation according to claim 3, characterized in that, The sealing cover is sealed to the bottom side wall of the receiving cavity, so that the mounting cavity and the receiving cavity form a connected sealed cavity.

5. The heating plate device for reducing component oxidation according to claim 3, characterized in that, The flange is also provided with a base at its bottom, and the base is provided with an air extraction channel, which is connected to the receiving cavity, and the outer port of the air extraction channel extends to the surface of the base.

6. The heating plate device for reducing component oxidation according to claim 5, characterized in that, Sealing rings are provided at the connection between the support handle and the water cooling plate, and at the connection between the water cooling plate and the flange.

7. The heating plate device for reducing component oxidation according to any one of claims 1 to 6, characterized in that, The upper ends of both the heating rod and the radio frequency rod abut against the heating plate.

8. The heating plate device for reducing component oxidation according to claim 7, characterized in that, A temperature sensor unit is also installed inside the mounting cavity.

9. The heating plate device for reducing component oxidation according to claim 7, characterized in that, The heating plate device for reducing component oxidation also includes an AC filter unit connected to the radio frequency rod.

10. A thin film deposition apparatus, characterized in that, The thin film deposition apparatus includes a heating plate device for reducing component oxidation as described in any one of claims 1 to 9.

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