Detachable BGA optical device coupling device and assembling method

Abstract

The invention provides a detachable BGA optical device coupling device and an assembling method, an optical chip and a first lens assembly corresponding to the optical chip are arranged on a main substrate assembly, an optical fiber array assembly and a second lens assembly corresponding to the optical fiber array assembly are arranged on a tail tube, and the main substrate assembly is used for being mounted on an optical module device. The tail pipe is detachably butted with the main substrate assembly; when the main substrate assembly is connected with the tail tube, a coupling optical path is formed among the optical chip, the first lens assembly, the second lens assembly and the optical fiber array assembly. Through detachable butt joint between the main substrate assembly and the tail tube, optical path coupling between the optical chip and the optical fiber array assembly is completed before device mounting, the main substrate assembly is mounted on the optical module after the main substrate assembly and the tail tube are separated, the influence of high-temperature backflow on the optical fiber array assembly in mounting is avoided, and the mounting efficiency is improved. And the coiling problem of the tail fibers in the optical fiber array assembly does not need to be considered in the mounting process.

Description

Technical Field

[0001] The invention relates to the technical field of optical communication, and in particular to a detachable BGA optical component coupling device and an assembly method. Background Art

[0002] In recent years, with the increase of optical communication capacity, the data transmission rate between optical communication equipment has become higher and higher. Ball Grid Array (BGA) devices based on flip chip (FC) technology have been widely used in high-speed optical modules, especially in the field of coherent optical communication.

[0003] For this type of FC-packaged optical chip, a fiber array (FA) end-face coupled optical path structure is usually used. However, BGA optical devices based on FA end-face coupling face several difficulties when mounting BGA optical devices on a module circuit board using surface mount technology (SMT): First, the conventional packaging process usually requires optical chip and fiber array to be optically coupled, and the coupled overall optical device to be mounted on the optical module. However, since the fiber array has pigtails, the pigtails need to be coiled up with a specially designed fiber coiling rack during mounting. The design of the fiber coiling rack is very particular. It should not be too small to cause excessive fiber stress, nor too large to cause interference with other devices, which increases the difficulty of packaging the entire device. Secondly, the mounting process of the coupled overall optical device needs to undergo high-temperature reflow at a temperature of more than 250°. The coupled fiber array cannot withstand such a high temperature. After reflow, there is a high probability that the insertion loss of the optical path will increase and the return loss will deteriorate.

[0004] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in the field of this technology. Summary of the invention

[0005] The technical problem to be solved by the present invention is how to avoid the fiber coiling problem caused by the fiber pigtail of the fiber array assembly itself in the BGA optical device when mounting the BGA optical device, and the influence of the coupled optical path caused by the high temperature during mounting.

[0006] The present invention adopts the following technical solution:

[0007] In a first aspect, a detachable BGA optical device coupling device is provided, comprising: a main substrate assembly 1, an optical chip 2, a tail pipe 3 and an optical fiber array assembly 4, wherein:

[0008] The optical chip 2 is disposed on the main substrate assembly 1, and the optical port of the optical chip 2 extends to the first docking end 111 of the main substrate assembly 1;

[0009] The optical fiber array assembly 4 is disposed on the tail pipe 3, and the optical port of the optical fiber array assembly 4 faces the second docking end 311 of the tail pipe 3;

[0010] The main substrate assembly 1 is used to be mounted on an optical module device; the first docking end 111 of the main substrate assembly 1 is detachably docked with the second docking end 311 of the tail pipe 3, and when the first docking end 111 and the second docking end 311 are connected, a coupling optical path is formed between the optical chip 2 and the optical fiber array assembly 4.

[0011] Preferably, the main substrate assembly 1 specifically comprises: a substrate 11 and a cover plate 12, wherein:

[0012] The first docking end 111 is one end of the substrate 11. The substrate 11 is provided with a first avoidance opening 112. The optical chip 2 is provided on the substrate 11. The optical port of the optical chip 2 extends to the first avoidance opening 112.

[0013] A docking platform 121 is provided at the peripheral edge of the cover plate 12, and the docking platform 121 is connected to the substrate 11. A second avoidance opening 122 is provided on the end of the cover plate 12 facing the same direction as the first docking end 111, and the position of the second avoidance opening 122 corresponds to the optical chip 2. The optical chip 2 is located between the substrate 11 and the cover plate 12, and the docking platform 121 is located at the peripheral side of the optical chip 2;

[0014] The cover plate 12 is provided with one end of a second avoidance opening 122 for detachably docking with the tail pipe 3 .

[0015] Preferably, the tail pipe 3 includes a docking portion 31 and a supporting portion 32, wherein:

[0016] The docking portion 31 is disposed on one side of the supporting portion 32, the second docking end 311 is the outer end surface of the docking portion 31, the docking portion 31 and the supporting portion 32 are located at the same axial position, and the width of the docking portion 31 is smaller than the width of the supporting portion 32;

[0017] The optical fiber array assembly 4 is disposed on the supporting portion 32 . When the tail pipe 3 is detachably docked with the cover plate 12 , the docking portion 31 is located in the second avoidance opening 122 .

[0018] Preferably, a first assembly pin 312 is provided on the outer end surface of the docking portion 31, and a second assembly pin 321 is provided on the end surface of each of the supporting portions 32;

[0019] A first assembly hole 123 is provided on the inner end surface of the second avoidance opening 122, and second assembly holes 124 are provided on the end surfaces of the docking platforms 121 on both sides of the second avoidance opening 122;

[0020] The first assembly pin 312 is detachably connected to the first assembly hole 123 , and the second assembly pin 321 is detachably connected to the second assembly hole 124 at a corresponding position.

[0021] Preferably, an adapter plate 5 is provided on the surface of the optical chip 2 facing the cover plate 12, the adapter plate 5 extends toward the first avoidance opening 112, a first lens assembly 6 is provided on the adapter plate 5, and the first lens assembly 6 is opposite to the optical port of the optical chip 2;

[0022] When the tail pipe 3 is detachably docked with the cover plate 12 , the first lens assembly 6 is located between the optical chip 2 and the optical fiber array assembly 4 ; the first lens assembly 6 is used to collimate the optical signal between the optical chip 2 and the optical fiber array assembly 4 .

[0023] Preferably, a second lens assembly 7 is also provided on the support portion 32, and the second lens assembly 7 is opposite to the optical port of the optical fiber array assembly 4. When the tail pipe 3 is detachably docked with the cover plate 12, the second lens assembly 7 is located between the first lens assembly 6 and the optical fiber array assembly 4.

[0024] Preferably, both sides of the support portion 32 and one end facing away from the docking portion 31 are provided with limiting steps 33, the optical fiber array 41 of the optical fiber array assembly 4 is provided on the support portion 32, and the limiting steps 33 are located at the peripheral side of the optical fiber array 41;

[0025] A limiting groove 331 is provided on the limiting step 33 on one end of the supporting portion 32 facing away from the docking portion 31. The optical fiber array assembly 4 also includes a pigtail 42, which is connected to the optical fiber array 41 and extends from the limiting groove 331 to the outside of the supporting portion 32. The limiting groove 331 is used to limit the pigtail 42.

[0026] In a second aspect, a method for assembling a detachable BGA optical device coupling device is provided, and is used for application on the detachable BGA optical device coupling device, comprising:

[0027] Soldering the optical chip 2 onto the main substrate assembly 1;

[0028] The first butt joint end 111 of the main substrate assembly 1 is detachably butt jointed with the second butt joint end 311 of the tail pipe 3;

[0029] Placing the optical fiber array assembly 4 on the tail tube 3, debugging the optical fiber array assembly 4 to couple the optical port of the optical chip 2, and solidifying the optical fiber array assembly 4 on the tail tube 3;

[0030] Pair the main substrate assembly 1 with the tail pipe 3, and remove the tail pipe 3 from the main substrate assembly 1;

[0031] After the main substrate assembly 1 is mounted on the optical module, the tail pipe 3 matched with the main substrate assembly 1 is assembled on the corresponding main substrate assembly 1 .

[0032] Preferably, the step of welding the optical chip 2 onto the main substrate assembly 1 further includes:

[0033] An adapter plate 5 is bonded to the back side of the welding side of the optical chip 2, a first lens assembly 6 is placed on the side of the adapter plate 5 facing the optical chip 2, the optical port of the optical chip 2 is coupled and aligned with the first lens assembly 6, and the first lens assembly 6 is solidified on the adapter plate 5.

[0034] Preferably, placing the optical fiber array assembly 4 on the tail tube 3, debugging the optical fiber array assembly 4 to couple the optical port of the optical fiber array assembly 4 with the optical port of the optical chip 2, and curing the optical fiber array assembly 4 on the tail tube 3 specifically includes:

[0035] Place the second lens assembly 7 and the optical fiber array assembly 4 on the tail tube 3, adjust the positions of the second lens assembly 7 and the optical fiber array assembly 4 on the tail tube 3 so that the optical port of the optical fiber array assembly 4 is coupled with the optical port of the optical chip 2, and solidify the second lens assembly 7 and the optical fiber array assembly 4 on the tail tube 3.

[0036] The present invention provides a detachable BGA optical device coupling device and an assembly method, wherein: an optical chip and a first lens assembly corresponding thereto are arranged on a main substrate assembly, an optical fiber array assembly and a second lens assembly corresponding thereto are arranged on a tail tube, the main substrate assembly is used for mounting on an optical module device, and the tail tube and the main substrate assembly are detachably connected; when the main substrate assembly is connected to the tail tube, a coupling optical path is formed between the optical chip, the first lens assembly, the second lens assembly and the optical fiber array assembly; through the detachable connection between the main substrate assembly and the tail tube, the optical path coupling between the optical chip and the optical fiber array assembly is completed before the device is mounted, and after the main substrate assembly and the tail tube are separated, the main substrate assembly is mounted on the optical module, thereby avoiding the influence of high-temperature reflow on the optical fiber array assembly during mounting, and there is no need to consider the fiber coiling problem of the pigtail in the optical fiber array assembly during mounting. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0038] Figure 1 It is a structural schematic diagram of a detachable BGA optical device coupling device provided by an embodiment of the present invention;

[0039] Figure 2 It is a structural schematic diagram of a main substrate assembly in a detachable BGA optical device coupling device provided by an embodiment of the present invention;

[0040] Figure 3 It is a structural schematic diagram of a tail pipe with an optical fiber array assembly in a detachable BGA optical device coupling device provided by an embodiment of the present invention;

[0041] Figure 4 It is a structural schematic diagram of a main substrate assembly with an optical chip in a detachable BGA optical device coupling device provided by an embodiment of the present invention;

[0042] Figure 5 It is a structural schematic diagram of another detachable BGA optical device coupling device provided by an embodiment of the present invention;

[0043] Figure 6 It is a structural schematic diagram of a cover plate in a detachable BGA optical device coupling device provided by an embodiment of the present invention;

[0044] Figure 7 It is a structural schematic diagram of another detachable BGA optical device coupling device provided by an embodiment of the present invention, in which a tail pipe has an optical fiber array assembly;

[0045] Figure 8 It is a structural schematic diagram of a main substrate assembly with an optical chip in another detachable BGA optical device coupling device provided by an embodiment of the present invention;

[0046] Fig. 9 It is a structural schematic diagram of another detachable BGA optical device coupling device provided by an embodiment of the present invention, in which a substrate has an optical chip;

[0047] Fig.10 It is a structural schematic diagram of another detachable BGA optical device coupling device provided by an embodiment of the present invention, in which a tail pipe has an optical fiber array assembly;

[0048] Fig.11 It is a method flow chart of an assembly method of a detachable BGA optical device coupling device provided by an embodiment of the present invention;

[0049] Fig.12 It is a relationship curve between the displacement deviation between the first lens assembly and the second lens assembly and the optical path coupling efficiency in an assembly method of a detachable BGA optical device coupling device provided by an embodiment of the present invention;

[0050] The diagram numbers are as follows:

[0051] Main substrate assembly 1; substrate 11; first docking end 111; first avoidance opening 112; cover plate 12; docking platform 121; second avoidance opening 122; first assembly hole 123; second assembly hole 124; optical chip 2; tail pipe 3; docking portion 31; second docking end 311; first assembly pin 312; support portion 32; second assembly pin 321; limiting step 33; limiting groove 331; optical fiber array assembly 4; optical fiber array 41; pigtail 42; adapter plate 5; first lens assembly 6; second lens assembly 7; pad 8. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0053] In the description of the present invention, it is necessary to understand that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0054] In the description of the present invention, the terms "first" and "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "multiple" is two or more. In addition, for example, the same type of nouns may be described as two independent individuals by adding "A" and "B" at the end. In this case, the corresponding features defined as "A" and "B" are only used to distinguish the same type of individuals for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.

[0055] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity, i.e., the limitations of the measurement system.

[0056] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the embodiments or examples of the above terms due to reasons such as the order and position of appearance, it is not limited to that they can be carried in combination by one embodiment or example.

[0057] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0058] Embodiment 1:

[0059] Embodiment 1 of the present invention provides a detachable BGA optical device coupling device, such as Figure 1-Figure 3 As shown, it includes: a main substrate assembly 1, an optical chip 2, a tail pipe 3 and an optical fiber array assembly 4, wherein:

[0060] The optical chip 2 is arranged on the main substrate assembly 1, and the optical port of the optical chip 2 extends to the first docking end 111 of the main substrate assembly 1; the optical fiber array assembly 4 is arranged on the tail tube 3, and the optical port of the optical fiber array assembly 4 faces the second docking end 311 of the tail tube 3; the main substrate assembly 1 is used to be mounted on the optical module device; the first docking end 111 of the main substrate assembly 1 and the second docking end 311 of the tail tube 3 are detachably docked, and when the first docking end 111 and the second docking end 311 are connected, a coupling optical path is formed between the optical chip 2 and the optical fiber array assembly 4.

[0061] In this embodiment, the optical chip 2 can be rectangular in shape, and a plurality of optical ports are arranged on the optical chip 2, all of which are arranged on the end face of the same end of the optical chip 2, and the optical ports on the optical chip 2 are used to emit or receive optical signals; the main substrate assembly 1 is used to carry the optical chip 2 and to be subsequently mounted on the optical module; the tail tube 3 is used to carry the optical fiber array assembly 4, and the optical fiber array assembly 4 includes an optical fiber array 41 and a pigtail 42, and the optical fiber array 41 and the pigtail 42 are connected, and the optical fiber array 41 also has an optical port, and the optical fiber array 41 is used to receive optical signals from the optical chip 2 and output them through the pigtail 42, and is also used to transmit the optical signals received by the pigtail 42 to the optical chip 2, and the optical fiber array 41 is not limited to a single channel. When the optical fiber array 41 is multi-channel, the number of channels and the spacing between adjacent channels are consistent with the optical ports on the optical chip 2.

[0062] In the present embodiment, the detachable docking means that the main substrate assembly 1 and the tail pipe 3 can be repeatedly detachably docked, and repeated detachable docking will not affect the docking quality between the components, and the disassembly process is convenient and will not cause a significant impact on the main substrate assembly 1 and the related components on the tail pipe 3. In the present embodiment, corresponding assembly pins and assembly holes can be set on the main substrate assembly 1 and the tail pipe 3 to achieve detachable docking between the main substrate assembly 1 and the tail pipe 3 while ensuring stable docking.

[0063] Through the above structural design, the optical chip 2 is first flip-chip soldered to the substrate 11 of the main substrate assembly 1, the cover plate 12 of the main substrate assembly 1 is installed and fixed, the adapter block 2 is attached, and the first lens assembly 6 is aligned and coupled with the optical chip 2 and fixed; then the main substrate assembly 1 is detachably docked with the tail pipe 3, the fixed pad 8 is attached, the optical fiber array assembly 4 and the second lens assembly 7 are debugged, and the optical fiber array assembly 4 and the second lens assembly 7 are fixed after the coupling optical path performance is optimized; the main substrate assembly 1 is disassembled from the tail pipe 3, and the main substrate assembly 1 is attached to the optical module. Since the main substrate assembly 1 is fixed with the tail pipe 3 in a detachable docking form, the optical path coupling between the optical chip 2 and the optical fiber array assembly 4 can still be guaranteed when they are docked again later. Since the tail tube 3 is not brought in during this process, there is no need to consider the fiber coiling problem of the pigtail 42 on the optical fiber array assembly 4 during mounting, and there is no need to be troubled by the space required for coiling the fibers. On the other hand, the high-temperature reflux generated during the mounting process will not affect the optical fiber array assembly 4 on the tail tube 3, and will not affect the coupling and docking between the optical chip 2 and the optical fiber array assembly 4, thereby reducing the possibility of subsequent optical path failure. After the main substrate assembly 1 is mounted, the corresponding tail tube 3 is detachably docked to the main substrate assembly 1 to complete the packaging, and a good optical path coupling effect between the optical chip 2 and the optical fiber array assembly 4 can be obtained.

[0064] In this embodiment, since the main substrate assembly 1 needs to be used as a mounting and welding carrier to mount the optical module on the one hand, and the optical chip 2 needs to be isolated from the outside world on the other hand, this embodiment also involves the following designs:

[0065] like Figure 2 , Figure 4-Figure 6 As shown, the main substrate assembly 1 specifically includes: a substrate 11 and a cover plate 12, wherein: the first docking end 111 is one end of the substrate 11, a first avoidance opening 112 is provided on the substrate 11, the optical chip 2 is provided on the substrate 11, and the optical port of the optical chip 2 extends to the first avoidance opening 112; a docking platform 121 is provided on the peripheral edge of the cover plate 12, the docking platform 121 is connected to the substrate 11, and a second avoidance opening 122 is provided on the end of the cover plate 12 facing the same direction as the first docking end 111, and the position of the second avoidance opening 122 corresponds to the optical chip 2, the optical chip 2 is located between the substrate 11 and the cover plate 12, and the docking platform 121 is located on the peripheral side of the optical chip 2; one end of the cover plate 12 provided with the second avoidance opening 122 is used for detachable docking with the tail pipe 3.

[0066] In this embodiment, the substrate 11 may be a ceramic substrate, an organic substrate, a silicon substrate or a glass substrate. The substrate 11 may be provided with a plurality of positioning holes on its circumference, and the docking platform 121 of the cover plate 12 may be provided with a plurality of positioning pins. The docking platform 121 and the substrate 11 may be docked with each other through the cooperation between the positioning holes and the corresponding positioning pins; the docking platform 121 ensures the docking between the substrate 11 and the cover plate 12, and separates a corresponding space between the substrate 11 and the cover plate 12 for accommodating the optical chip 2. Furthermore, since the optical port of the optical chip 2 is located on the side end surface of the optical chip 2, and the optical chip 2 usually needs to be fixed on the substrate 11 by welding, but the position of the optical port cannot be welded, a first avoidance opening 112 is provided on the substrate 11, and when the optical chip 2 is provided on the substrate 11, the optical port position of the optical chip 2 extends to the first avoidance opening 112, so as to avoid the welding between the substrate 11 and the optical chip 2 affecting the optical port position of the optical chip 2.

[0067] Furthermore, the assembly process of the device is generally as follows: after the optical chip 2 is mounted on the substrate 11, the cover plate 12 is placed on the substrate 11. At this time, the optical chip 2 is located between the substrate 11 and the cover plate 12. However, since a corresponding adapter plate 5 (such as Figure 8 and Fig. 9As shown), a first lens assembly 6 is arranged on the adapter plate 5 to realize optical path coupling, and the optical chip 2 is used to set one side of the adapter plate 5 toward the cover plate 12, so a second avoidance opening 122 needs to be arranged on the cover plate 12 to expose the optical chip 2 for subsequent setting of the adapter plate 5, and to set the first lens assembly 6 on the adapter plate 5 for coupling and debugging of the optical path; it should be noted that in this embodiment, a docking platform 121 is not arranged at the second avoidance opening 122.

[0068] Furthermore, since the optical fiber array assembly 4 needs to be provided on the tail pipe 3, and the tail pipe 3 also needs to be detachably connected with the end of the cover plate 12 provided with the second avoidance opening 122, the tail pipe 3 needs to be designed accordingly, as follows: Figure 7 As shown, the tail pipe 3 includes a docking portion 31 and a supporting portion 32, wherein: the docking portion 31 is arranged on one side of the supporting portion 32, the second docking end 311 is the outer end face of the docking portion 31, the docking portion 31 and the supporting portion 32 are located at the same axial position, and the width of the docking portion 31 is smaller than the width of the supporting portion 32; the optical fiber array assembly 4 is arranged on the supporting portion 32, and when the tail pipe 3 is detachably docked with the cover plate 12, the docking portion 31 is located in the second avoidance opening 122.

[0069] like Figure 6 and Figure 7 As shown, a first assembly pin 312 is provided on the outer end face of the docking portion 31, and a second assembly pin 321 is provided on the end face of each support portion 32; a first assembly hole 123 is provided on the inner end face of the second avoidance opening 122, and second assembly holes 124 are provided on the end faces of the docking platform 121 on both sides of the second avoidance opening 122; the first assembly pin 312 forms a detachable connection with the first assembly hole 123, and the second assembly pin 321 forms a detachable connection with the second assembly hole 124 at the corresponding position.

[0070] In this embodiment, the size of the docking portion 31 matches the size of the second avoidance opening 122, the width of the docking portion 31 is slightly smaller than the width of the second avoidance opening 122, and the length of the docking portion 31 is slightly larger than the length of the second avoidance opening 122. At least one first assembly pin 312 is provided on the end surface of the docking portion 31, and at least one first assembly hole 123 is provided on the inner end surface of the corresponding second avoidance opening 122. The first assembly pin 312 cooperates with the first assembly hole 123 at the corresponding position. At least one second assembly pin 321 is provided on the support portion 32 at both sides of the docking portion 31, and at least one second assembly hole 124 is provided on the end surface of the cover plate 12 at both sides of the second avoidance opening 122. The second assembly pin 321 cooperates with the second assembly hole 124 at the corresponding position. In this embodiment, the docking portion 31 is used to cooperate with the second avoidance opening 122, so as to improve the docking stability between the tail pipe 3 and the cover plate 12.

[0071] Furthermore, in order to achieve optical path coupling between the optical chip 2 and the optical fiber array assembly 4, improve the coupling tolerance, and lengthen the Z-axis working distance, a corresponding lens needs to be provided between the optical chip 2 and the optical fiber array assembly 4. Therefore, this embodiment also involves the following designs:

[0072] like Figure 8 and Fig. 9 As shown, an adapter plate 5 is provided on the side of the optical chip 2 facing the cover plate 12, and the adapter plate 5 extends toward the first avoidance opening 112. A first lens assembly 6 is provided on the adapter plate 5, and the first lens assembly 6 is opposite to the optical port of the optical chip 2; when the tail pipe 3 is detachably docked with the cover plate 12, the first lens assembly 6 is located between the optical chip 2 and the optical fiber array assembly 4; the first lens assembly 6 is used to collimate the optical signal between the optical chip 2 and the optical fiber array assembly 4.

[0073] The expansion coefficient of the material of the adapter plate 5 is similar to that of the optical chip 2, and the material of the adapter plate 5 can be glass, ceramic or silicon substrate. The first lens assembly 6 is arranged on the portion of the adapter plate 5 extending from the first avoidance opening 112. The first lens assembly 6 can be a single lens or a lens array. When the first lens assembly 6 is a lens array, the number of lenses and the spacing between adjacent lenses match the optical port on the optical chip 2. The actual position of the first lens assembly 6 on the adapter plate 5 needs to be based on the coupling adjustment of the optical path.

[0074] like Fig.10As shown, a second lens assembly 7 is also provided on the support portion 32 , and the second lens assembly 7 is opposite to the optical port of the optical fiber array assembly 4 . When the tail pipe 3 is detachably docked with the cover plate 12 , the second lens assembly 7 is located between the first lens assembly 6 and the optical fiber array assembly 4 .

[0075] The second lens assembly 7 may be a single lens or a lens array. When the second lens assembly 7 is a lens array, the number of lenses and the spacing between adjacent lenses match the optical port on the optical chip 2 .

[0076] Furthermore, since the optical chip 2 is arranged on the substrate 11, the optical fiber array assembly 4 is arranged on the tail pipe 3, and the tail pipe 3 and the cover plate 12 are located on the same horizontal plane, there is a difference in horizontal height between the tail pipe 3 and the substrate 11. In order to ensure the coupling of the optical path between the optical chip 2 and the optical fiber array assembly 4, it is necessary to cushion the optical fiber array assembly 4 and the second lens assembly 7. Therefore, a cushion block 8 is also arranged on the support portion 32 of the tail pipe 3, and the optical fiber array assembly 4 and the second lens assembly 7 are both arranged on the cushion block 8; the material expansion coefficient of the cushion block 8 is close to that of the optical chip 2, and the material of the cushion block 8 can be glass, ceramic or silicon substrate. In this embodiment, the center of the optical port of the optical chip 2, the center of the first lens assembly 6, the center of the second lens assembly 7 and the center of the optical fiber array assembly 4 are all located on the same line.

[0077] like Fig.10 As shown, limiting steps 33 are provided on both sides of the support portion 32 and one end facing away from the docking portion 31, the optical fiber array 41 of the optical fiber array assembly 4 is provided on the support portion 32, and the limiting steps 33 are located at the peripheral side of the optical fiber array 41; a limiting slot 331 is provided on the limiting step 33 on one end of the support portion 32 facing away from the docking portion 31, the optical fiber array assembly 4 also includes a pigtail 42, the pigtail 42 is connected to the optical fiber array 41, and the pigtail 42 extends from the limiting slot 331 to the outside of the support portion 32, and the limiting slot 331 is used to limit the pigtail 42.

[0078] Embodiment 2:

[0079] This embodiment provides a method for assembling a detachable BGA optical device coupling device based on the embodiment 1, which is used for being applied to the detachable BGA optical device coupling device described in the embodiment 1. Fig.11 As shown, the method flow includes:

[0080] In step 101 , the optical chip 2 is soldered onto the main substrate assembly 1 .

[0081] Among them, the optical chip 2 is first welded on the substrate 11, and then the cover plate 12 is fixed on the substrate 11, the adapter plate 5 is adhered to the back side of the welding side of the optical chip 2, and the first lens assembly 6 is placed on the adapter plate 5. The optical port of the optical chip 2 is coupled and aligned with the first lens assembly 6 through an external collimator, and the first lens assembly 6 is solidified on the adapter plate 5.

[0082] In step 102 , the first docking end 111 of the main substrate assembly 1 is detachably docked with the second docking end 311 of the tail pipe 3 .

[0083] In step 103 , the optical fiber array assembly 4 is placed on the tail tube 3 , the optical fiber array assembly 4 is debugged to couple the optical port of the optical fiber array assembly 4 with the optical port of the optical chip 2 , and the optical fiber array assembly 4 is solidified on the tail tube 3 .

[0084] Before performing step 103, a pad 8 can be bonded to the support portion 32 of the tail pipe 3, and then the second lens assembly 7 and the optical fiber array assembly 4 can be placed on the pad 8, and the positions of the second lens assembly 7 and the optical fiber array assembly 4 on the tail pipe 3 can be adjusted so that the optical port of the optical fiber array assembly 4 is coupled with the optical port of the optical chip 2, and the second lens assembly 7 and the optical fiber array assembly 4 can be cured on the pad 8.

[0085] In step 104 , the main substrate assembly 1 is paired with the tail pipe 3 , and the tail pipe 3 is removed from the main substrate assembly 1 .

[0086] In this embodiment, pairing the main substrate assembly 1 with the tail pipe 3 means associating the main substrate assembly 1 and the tail pipe 3 after coupling, and the associating means may be a number pairing record, so that after the main substrate assembly 1 and the tail pipe 3 are disassembled from each other, the matching tail pipe 3 number can be found according to the number of the main substrate assembly 1 itself, thereby finding the corresponding tail pipe 3.

[0087] In step 105 , after the main substrate assembly 1 is mounted on the optical module, the tail pipe 3 matched with the main substrate assembly 1 is assembled on the main substrate assembly 1 .

[0088] In summary, this embodiment can achieve the following beneficial effects:

[0089] (1) Providing a double lens between the optical chip 2 and the optical fiber array assembly 4 can improve the coupling tolerance in each direction and extend the Z-axis working distance.

[0090] (2) The process of assembling first and coupling later can effectively avoid optical path deviation caused by mechanical processing and initial assembly deviation.

[0091] (3) The disassembly docking position between the main substrate assembly 1 and the tail pipe 3 is located between the first lens assembly 6 and the second lens assembly 7, so that the parallel light tolerance is large and the deviation loss caused by repeated disassembly can be alleviated. Fig.12 As shown, it is a relationship curve between the displacement deviation between the first lens assembly 6 and the second lens assembly 7 and the optical path coupling efficiency. It can be seen that when the displacement deviation between the first lens assembly 6 and the second lens assembly 7 is smaller, the optical path coupling efficiency is higher.

[0092] (4) Since the main substrate assembly 1 and the tail tube 3 are detachably connected, when the main substrate assembly 1 carrying the optical chip 2 is mounted, there is no need to carry the tail tube 3 carrying the optical fiber array assembly 4. Therefore, during the mounting and transportation process, there is no need to consider the fiber coiling problem of the pigtail 42 on the optical fiber array assembly 4, thereby reducing the complicated process of gluing the fiber coiling frame, coiling the fibers, and disassembling the fiber coiling frame.

[0093] (5) During the patch process of the main substrate assembly 1, since the optical fiber array assembly 4 is not involved, the influence of high temperature reflux on the optical fiber array assembly 4 during the patch process can be avoided.

[0094] (6) The main substrate assembly 1 and the tail pipe 3 that have been optically coupled in advance are paired, and the consistency of the front and rear optical paths can be ensured when they are subsequently re-matched and docked.

[0095] (7) There is no glue on the entire optical path. When the optical path is damaged, the entire optical path can be disassembled and recoupled. It can also avoid the problem of optical path failure caused by long-term high-power light during module application.

[0096] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A detachable BGA optical device coupling device, characterized in that: include: A main substrate assembly (1), an optical chip (2), a tail pipe (3) and an optical fiber array assembly (4), wherein: The optical chip (2) is arranged on the main substrate assembly (1), and the optical port of the optical chip (2) extends to the first docking end (111) of the main substrate assembly (1); The optical fiber array component (4) is arranged on the tail pipe (3), and the optical port of the optical fiber array component (4) faces the second butt end (311) of the tail pipe (3); The main substrate assembly (1) is used for mounting on an optical module device; the first butt joint end (111) of the main substrate assembly (1) and the second butt joint end (311) of the tail pipe (3) are detachably butt jointed, and when the first butt joint end (111) and the second butt joint end (311) are connected, a coupling optical path is formed between the optical chip (2) and the optical fiber array assembly (4).

2. The detachable BGA optical device coupling device according to claim 1, characterized in that: The main substrate assembly (1) specifically comprises: a substrate (11) and a cover plate (12), wherein: The first docking end (111) is one end of the substrate (11), a first avoidance opening (112) is provided on the substrate (11), the optical chip (2) is provided on the substrate (11), and the optical port of the optical chip (2) extends to the first avoidance opening (112); A docking platform (121) is provided on the peripheral edge of the cover plate (12), the docking platform (121) is connected to the substrate (11), a second avoidance opening (122) is provided on the end of the cover plate (12) facing the same direction as the first docking end (111), the position of the second avoidance opening (122) corresponds to the optical chip (2), the optical chip (2) is located between the substrate (11) and the cover plate (12), and the docking platform (121) is located on the peripheral side of the optical chip (2); One end of the cover plate (12) is provided with a second avoidance opening (122) for detachably docking with the tail pipe (3).

3. The detachable BGA optical device coupling device according to claim 2, characterized in that: The tail pipe (3) comprises a docking portion (31) and a supporting portion (32), wherein: The docking portion (31) is arranged on one side of the supporting portion (32); the second docking end (311) is an outer end surface of the docking portion (31); the docking portion (31) and the supporting portion (32) are located at the same axial position; and the width of the docking portion (31) is smaller than the width of the supporting portion (32); The optical fiber array assembly (4) is arranged on the supporting portion (32), and when the tail pipe (3) and the cover plate (12) are detachably docked, the docking portion (31) is located in the second avoidance opening (122).

4. The detachable BGA optical device coupling device according to claim 3, characterized in that: A first assembly pin (312) is provided on the outer end surface of the docking portion (31), and a second assembly pin (321) is provided on the end surface of each of the supporting portions (32); A first assembly hole (123) is provided on the inner end surface of the second avoidance opening (122), and second assembly holes (124) are provided on the end surfaces of the docking platforms (121) on both sides of the second avoidance opening (122); The first assembly pin (312) is detachably connected to the first assembly hole (123), and the second assembly pin (321) is detachably connected to the second assembly hole (124) at a corresponding position.

5. The detachable BGA optical device coupling device according to claim 3, characterized in that: An adapter plate (5) is provided on the surface of the optical chip (2) facing the cover plate (12), the adapter plate (5) extends towards the first avoidance opening (112), a first lens assembly (6) is provided on the adapter plate (5), and the first lens assembly (6) is opposite to the optical opening of the optical chip (2); When the tail pipe (3) is detachably connected to the cover plate (12), the first lens assembly (6) is located between the optical chip (2) and the optical fiber array assembly (4); the first lens assembly (6) is used to collimate the optical signal between the optical chip (2) and the optical fiber array assembly (4).

6. The detachable BGA optical device coupling device according to claim 5, characterized in that: A second lens assembly (7) is also provided on the support portion (32), the second lens assembly (7) being opposite to the optical port of the optical fiber array assembly (4); when the tail pipe (3) and the cover plate (12) are detachably connected, the second lens assembly (7) is located between the first lens assembly (6) and the optical fiber array assembly (4).

7. The detachable BGA optical device coupling device according to claim 3, characterized in that: Limiting steps (33) are provided at both sides of the support portion (32) and at one end facing away from the docking portion (31); the optical fiber array (41) of the optical fiber array assembly (4) is provided on the support portion (32), and the limiting steps (33) are located at the peripheral side of the optical fiber array (41); A limiting notch (331) is provided on a limiting step (33) on one end of the support portion (32) facing away from the docking portion (31); the optical fiber array assembly (4) further comprises a pigtail (42); the pigtail (42) is connected to the optical fiber array (41), and the pigtail (42) extends from the limiting notch (331) to outside the support portion (32); the limiting notch (331) is used to limit the pigtail (42).

8. A method for assembling a detachable BGA optical device coupling device, used for being applied to the detachable BGA optical device coupling device as claimed in any one of claims 1 to 7, characterized in that: include: Soldering the optical chip (2) onto the main substrate assembly (1); Removably docking the first docking end (111) of the main substrate assembly (1) with the second docking end (311) of the tail pipe (3); Placing the optical fiber array assembly (4) on the tail tube (3), debugging the optical fiber array assembly (4) to couple the optical port of the optical fiber array assembly (4) with the optical port of the optical chip (2), and solidifying the optical fiber array assembly (4) on the tail tube (3); Pairing the main substrate assembly (1) with the tail pipe (3), and removing the tail pipe (3) from the main substrate assembly (1); After the main substrate assembly (1) is mounted on the optical module, the tail pipe (3) matched with the main substrate assembly (1) is assembled on the corresponding main substrate assembly (1).

9. The assembly method of the detachable BGA optical component coupling device according to claim 8, characterized in that: The method of welding the optical chip (2) onto the main substrate assembly (1) further comprises: An adapter plate (5) is bonded to the back side of the welding side of the optical chip (2), a first lens assembly (6) is placed on the side of the adapter plate (5) facing the optical chip (2), the optical port of the optical chip (2) is coupled and aligned with the first lens assembly (6), and the first lens assembly (6) is solidified on the adapter plate (5).

10. The assembly method of the detachable BGA optical component coupling device according to claim 8, characterized in that: Placing the optical fiber array assembly (4) on the tail tube (3), debugging the optical fiber array assembly (4) to couple the optical port of the optical fiber array assembly (4) with the optical port of the optical chip (2), and solidifying the optical fiber array assembly (4) on the tail tube (3) specifically includes: The second lens assembly (7) and the optical fiber array assembly (4) are placed on the tail tube (3), the positions of the second lens assembly (7) and the optical fiber array assembly (4) on the tail tube (3) are adjusted so that the optical port of the optical fiber array assembly (4) is coupled with the optical port of the optical chip (2), and the second lens assembly (7) and the optical fiber array assembly (4) are solidified on the tail tube (3).

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