An integrated wavelength division device with built-in QSFP-DD module quad heat sink

Abstract

The present application provides a QSFP‑DD module quad heat sink with integrated wavelength division equipment, which relates to the technical field of heat sinks for wavelength division equipment, including a heat-conducting base and a heat sink assembly, wherein the heat sink assembly is provided with a plurality of heat sink assemblies, and the plurality of heat sink assemblies are provided on the heat-conducting base; the heat sink assembly includes a top plate, a bottom plate and a side plate, the heat-conducting base is used to connect with a cage assembly, the bottom plate is connected with the heat-conducting base, the side plates are respectively connected with the top plate and the bottom plate, and a heat dissipation channel is formed between the top plate, the bottom plate and the side plates; an evaporation chamber is provided inside the bottom plate, and a heat-conducting liquid is contained in the evaporation chamber, a liquefaction chamber is provided inside the top plate, and a flow chamber is provided inside the side plate, and the flow chamber is respectively connected with the evaporation chamber and the liquefaction chamber. The present application can improve the heat dissipation efficiency of the optical module.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation devices for wavelength division equipment, and in particular to a quadruple heat dissipation device for a QSFP-DD module built into an integrated wavelength division equipment. Background Art

[0002] Integrated wavelength division equipment is a device used in optical communication systems. Its core function is to implement wavelength division multiplexing technology. Wavelength division multiplexing is a technology that transmits multiple optical signals of different wavelengths on a single optical fiber at the same time, which can greatly increase the transmission capacity of optical fiber. There are multiple cage components fixedly connected inside the integrated wavelength division equipment. The cage components are used to install fixed optical modules, such as QSFP-DD modules. QSFP-DD modules are optical modules used for high-speed network communications and support 400GbE transmission rates.

[0003] The optical module generates heat when working. In the related technology, a heat sink is generally provided to dissipate heat from the optical module, and one heat sink corresponds to one optical module. The heat sink includes a heat sink, which is connected to the cage assembly. A fan is installed in the integrated wavelength division device. Heat dissipation holes are provided on the front and rear sides of the integrated wavelength division device. An air duct is formed between the heat dissipation holes on the front and rear sides of the integrated wavelength division device. The heat sink and the fan are located in the air duct. The heat of the optical module is transferred to the heat sink through the cage assembly. The fan allows external air to enter the air duct and then be discharged, thereby taking away the heat of the heat sink.

[0004] The heat sink in the related art is a metal sheet with a certain distance between each other, so that the top side of the heat sink is an open structure. When the airflow flows through the top side of the heat sink, the airflow is prone to turbulence, affecting the heat dissipation efficiency. In addition, the positions of multiple optical modules in the integrated wavelength division device are close to each other, which makes it easy for heat to concentrate. The heat dissipation capacity of the heat dissipation device in the related art is poor. If the heat cannot be discharged in time, the temperature of the optical module will be too high. Exceeding the operating temperature range of the optical module will cause the device to stop working, and even damage the optical module. Summary of the invention

[0005] In order to improve the heat dissipation efficiency of the optical module, the present application provides a QSFP-DD module quadruple heat dissipation device with an integrated wavelength division device.

[0006] The present application provides a QSFP-DD module quad heat sink device with integrated wavelength division equipment, which adopts the following technical solution:

[0007] A QSFP-DD module quad heat sink with integrated wavelength division equipment includes a heat-conducting base and a heat-dissipating assembly, wherein the heat-dissipating assembly is provided in plurality and the plurality of heat-dissipating assemblies are arranged on the heat-conducting base; the heat-dissipating assembly includes a top plate, a bottom plate and a side plate, the heat-conducting base is used to be connected to a cage assembly, the bottom plate is connected to the heat-conducting base, the side plates are respectively connected to the top plate and the bottom plate, and a heat-dissipating channel is formed between the top plate, the bottom plate and the side plates;

[0008] An evaporation chamber is arranged inside the bottom plate, and heat transfer liquid is contained in the evaporation chamber. A liquefaction chamber is arranged inside the top plate. A flow chamber is arranged inside the side plate, and the flow chamber is communicated with the evaporation chamber and the liquefaction chamber respectively.

[0009] By adopting the above technical solution, the heat-conducting base is connected to the cage assembly, and the heat generated by the optical module is transferred to the heat-conducting base, which then transfers the heat to the bottom plate. The heat-conducting liquid in the evaporation chamber in the bottom plate absorbs the heat and evaporates to form steam. The steam enters the liquefaction chamber in the top plate through the circulation chamber. During this process, the heat is released and carried away by the airflow, thereby achieving an efficient heat exchange process. After the steam condenses, it flows back into the evaporation chamber to form a closed circulation system, ensuring continuous and stable heat dissipation performance. This design not only improves the heat dissipation effect, but also reduces the risk of optical module failure caused by high temperature and extends the service life of the optical module. The heat dissipation channel formed between the top plate, the bottom plate and the side plate can reduce the turbulence of the airflow when passing through the heat dissipation channel, thereby improving the heat dissipation efficiency compared to related technologies.

[0010] Optionally, one of the heat dissipation components includes two side panels, and the two side panels are spaced apart.

[0011] By adopting the above technical solution, the two side plates can improve the connection stability between the top plate and the bottom plate. The two side plates also increase the area of ​​the flow cavity, which is conducive to the heat transfer liquid entering the liquefaction cavity from the flow cavity after evaporation, and is conducive to timely taking away the heat.

[0012] Optionally, an intermediate plate is provided between the top plate and the bottom plate, the intermediate plate is located between the two side plates, a return cavity is provided inside the intermediate plate, and the return cavity is respectively connected to the liquefaction cavity and the evaporation cavity.

[0013] By adopting the above technical solution, the setting of the return cavity ensures that the condensed heat transfer liquid can smoothly flow back to the evaporation cavity, ensuring the circulation of heat transfer liquid and steam between the evaporation cavity and the liquefaction cavity, thereby improving the heat dissipation effect. The middle plate is located between the two side plates, and when the airflow passes between the middle plate and the side plates, it can take away the heat of the middle plate and the side plates, thereby improving the heat dissipation efficiency.

[0014] Optionally, a first one-way conductive member is disposed in the fall-back chamber, and the first one-way conductive member allows the condensed heat-conducting liquid to flow from the liquefaction chamber to the evaporation chamber through the fall-back chamber.

[0015] By adopting the above technical solution, the first unidirectional conductive component ensures that the condensed heat-conducting liquid can only flow from the liquefaction chamber through the return chamber to the evaporation chamber, thereby reducing the situation where steam enters the liquefaction chamber from the return chamber, ensuring the stability and efficiency of the gas-liquid circulation, and improving the overall heat dissipation performance of the heat dissipation device.

[0016] Optionally, the first one-way conductive member includes two guide flaps, which are arranged opposite to each other, one end of the guide flap is connected to the inner wall of the return cavity, and the two guide flaps are close to each other at the other end.

[0017] By adopting the above technical solution, the two guide flaps are arranged opposite to each other and close to each other at one end, forming a unidirectional conductive structure, ensuring that the heat transfer liquid can only flow from the liquefaction chamber to the evaporation chamber, reducing the problem of reduced heat dissipation efficiency caused by steam backflow, and allowing the vapor-liquid phase change cycle of the heat transfer liquid to proceed in an orderly manner.

[0018] Optionally, a second one-way conducting member is disposed in the circulation chamber, and the second one-way conducting member allows the vapor of the heat transfer liquid to flow from the evaporation chamber to the liquefaction chamber through the circulation chamber.

[0019] By adopting the above technical solution, the setting of the second guide conductive member can ensure that the vapor of the heat transfer liquid flows smoothly from the evaporation chamber through the flow chamber to the liquefaction chamber, so that the vapor-liquid phase change cycle of the heat transfer liquid can proceed in an orderly manner, further improving the overall heat dissipation performance of the heat dissipation device.

[0020] Optionally, a liquid collecting ball is arranged on the top of the liquefaction chamber, and the projection of the liquid collecting ball covers the middle plate; a liquid separation ridge is connected to the bottom wall of the evaporation chamber, and the projection of the liquid separation ridge covers the projection of the middle plate, and the cross-sectional area of ​​the liquid separation ridge is gradually reduced in the direction from the middle plate to the side plate.

[0021] By adopting the above technical solution, the liquid collecting ball can effectively collect the liquefied thermal liquid and guide the thermal liquid to drip into the return cavity, thereby improving the recovery efficiency of condensed water. The liquid separation ribs allow the thermal liquid to be located on both sides of the evaporation cavity close to the side plates, which is conducive to the thermal liquid entering the liquefaction cavity from the flow cavity of the side plates after evaporation. The heat of the bottom plate is transferred to the liquid separation ribs, and the liquid separation ribs can transfer the heat to the thermal liquid, thereby increasing the heat exchange area of ​​the thermal liquid and improving the heat dissipation efficiency.

[0022] Optionally, a first guide wall is provided on the inner top wall of the evaporation chamber, and a second guide wall is provided on the inner bottom wall of the liquefaction chamber; in the direction from the side plate to the middle plate, the cross-sectional area of ​​the first guide wall is gradually expanded, and the cross-sectional area of ​​the second guide wall is gradually contracted.

[0023] By adopting the above technical solution, the first guide wall can guide the flow direction of the steam so that the steam enters the circulation chamber from the evaporation chamber, and the second guide wall can guide the condensed heat-transfer liquid from the liquefaction chamber into the return chamber, so that the steam and the condensed heat-transfer liquid flow in an orderly manner, thereby improving the heat dissipation efficiency.

[0024] Optionally, the top plate and the bottom plate are both connected with connecting plates, the connecting plates of adjacent heat dissipation components are connected, and a heat dissipation gap groove is formed between the connecting plates and the side plates of adjacent heat dissipation components.

[0025] By adopting the above technical solution, the design of the connecting plate enables adjacent heat dissipation components to be firmly connected, thereby improving the structural stability of the entire heat dissipation device. When the airflow passes through the heat dissipation gap groove, it can take away the heat of the connecting plate and the side plate, thereby improving the heat dissipation efficiency between adjacent heat dissipation components.

[0026] Optionally, the heat-conducting base includes a heat-conducting plate, a contact bottom plate, a heat-conducting strip and a heat-conducting pipe, the contact bottom plate is connected to the heat-conducting plate, and the contact bottom plate is in contact with the cage assembly; the heat-conducting strip is connected to the heat-conducting plate, the heat-conducting strip is provided with an installation groove, the heat-conducting pipe is installed in the installation groove, and the bottom plate is connected to the heat-conducting pipe.

[0027] By adopting the above technical solution, the heat generated by the optical module is transferred to the cage assembly, and the cage assembly transfers it to the heat conducting plate by contacting the bottom plate, and further conducts it to the heat dissipation assembly through the heat conducting strips and heat conducting pipes. This design not only improves the heat transfer efficiency, but also ensures uniform heat dissipation of the entire heat dissipation device, reducing local overheating problems. The connection between the heat conducting pipe and the bottom plate allows the heat to quickly enter the evaporation chamber, causing the thermal fluid to evaporate, improving the overall heat dissipation performance.

[0028] In summary, the present application includes at least one of the following beneficial effects:

[0029] 1. The heat transfer liquid in the evaporation chamber evaporates and absorbs heat. After the steam is liquefied in the liquefaction chamber, it flows back to the evaporation chamber through the return chamber, forming a stable circulation flow, which significantly improves the heat dissipation efficiency;

[0030] 2. The first one-way conducting member ensures that the condensed heat transfer liquid flows back to the evaporation chamber through the return chamber, and the second one-way conducting member allows the steam to flow to the liquefaction chamber through the flow chamber, so that the vapor-liquid phase change cycle of the heat transfer liquid can proceed in an orderly manner;

[0031] 3. Multiple heat dissipation components are connected to heat pipes, which transfer heat evenly to each heat dissipation component to ensure uniform heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the overall structure of a quadruple heat sink for a QSFP-DD module built into an integrated wavelength division device in Example 1 of the present application;

[0033] Figure 2 This is a schematic diagram of the structure of the heat conducting plate viewed from above in Example 1 of the present application;

[0034] Figure 3 is a schematic structural diagram of the heat-conducting base after removing the heat dissipation component in Example 1 of the present application;

[0035] Figure 4 yes Figure 1 A schematic diagram of the enlarged structure of part A;

[0036] Figure 5 This is a schematic diagram of the overall structure of a heat dissipation device of an optical module built into an integrated wavelength division device in Example 2 of the present application;

[0037] Figure 6 is a front view structural schematic diagram of the heat dissipation assembly of Example 2 of the present application;

[0038] Figure 7 It is a schematic diagram of the cross-sectional structure of the heat dissipation assembly of Example 2 of the present application.

[0039] Explanation of the reference numerals: 1. heat-conducting base; 11. heat-conducting plate; 12. contact bottom plate; 13. heat-conducting strip; 14. heat-conducting pipe; 15. mounting ear plate; 2. heat-dissipating assembly; 21. bottom plate; 211. evaporation chamber; 212. heat-dissipating channel; 213. first guide wall; 22. top plate; 221. liquefaction chamber; 222. second guide wall; 23. side plate; 231. circulation chamber; 24. middle plate; 241. return chamber; 25. first one-way conducting member; 251. guide flap; 26. second one-way conducting member; 27. liquid-collecting ball; 28. liquid-separating convex strip; 29. ​​connecting plate; 291. heat-dissipating gap groove. DETAILED DESCRIPTION

[0040] The following combination Figures 1 to 7 This application is described in further detail.

[0041] Embodiment 1:

[0042] Embodiment 1 of the present application provides a quadruple heat dissipation device for QSFP-DD modules integrated with a wavelength division device.

[0043] refer to Figure 1 and Figure 2The QSFP-DD module quad heat sink device built into the integrated wavelength division device includes a heat-conducting base 1 and a heat-dissipating assembly 2. The heat-conducting base 1 includes a heat-conducting plate 11, a contact bottom plate 12, a heat-conducting strip 13, a heat-conducting pipe 14 and a mounting ear plate 15. The contact bottom plate 12 is fixedly connected to the bottom side of the heat-conducting plate 11, and the contact bottom plate 12 is in contact with the top side of the cage assembly. The optical module is installed in the cage assembly, and the heat generated by the optical module is transferred to the cage assembly, and then the heat is transferred to the heat-conducting plate 11 through the contact bottom plate 12. In this embodiment, one heat-conducting plate 11 can cover four QSFP-DD modules, so that the four QSFP-DD modules can be cooled at the same time, thereby forming a quad heat dissipation.

[0044] refer to Figure 1 and Figure 3 The heat conducting strip 13 is fixedly connected to the top side of the heat conducting plate 11. A plurality of heat conducting strips 13 are arranged at intervals. The heat conducting strip 13 is provided with a mounting groove. The heat conducting pipe 14 is located in the mounting groove. The heat conducting pipe 14 is in contact with and fixedly connected to the heat conducting plate 11. The mounting ear plates 15 are fixedly connected to both sides of the heat conducting plate 11. A plurality of mounting ear plates 15 are arranged. Bolts are used to pass through the mounting ear plates 15 so that the heat conducting base 1 can be installed on the cage assembly. The mounting ear plates 15 on both sides of the heat conducting plate 11 are staggered. For adjacent heat conducting bases 1, the mounting ear plates 15 of one heat conducting base 1 can be located between the two mounting ear plates 15 of another heat conducting base 1, so that the adjacent heat conducting bases 1 are arranged more compactly.

[0045] refer to Figure 3 and Figure 4 The heat dissipation assembly 2 includes a bottom plate 21, a side plate 23 and a top plate 22. The bottom plate 21 is in contact with and fixedly connected to the heat pipe 14. The top plate 22 is parallel to the bottom plate 21 and is spaced apart. The side plates 23 are fixedly connected to the top plate 22 and the bottom plate 21, respectively. The heat dissipation assembly 2 is provided with multiple, adjacent heat dissipation assemblies 2 are connected. The heat of the heat-conducting plate 11 is transferred to the heat-conducting pipe 14, and the heat-conducting pipe 14 transfers the heat to the bottom plate 21, and the bottom plate 21 then transfers the heat to the top plate 22 through the side plates 23. A heat dissipation channel 212 is formed between the bottom plate 21, the side plates 23 and the top plate 22. When the airflow passes through the heat dissipation channel 212, it can take away the heat of the bottom plate 21, the side plates 23 and the top plate 22.

[0046] The implementation principle of the quadruple heat dissipation device of the QSFP-DD module built into an integrated wavelength division device in Example 1 of the present application is as follows: the heat of the optical module is transferred to the cage assembly, the cage assembly transfers the heat to the heat conducting plate 11 by contacting the bottom plate 12, the heat conducting plate 11 transfers the heat to the bottom plate 21 through the heat conducting pipe 14, and the bottom plate 21 transfers the heat to the top plate 22 through the side plate 23. When the airflow passes through, it can take away the heat of the bottom plate 21, the side plate 23 and the top plate 22, thereby effectively dissipating the heat of the optical module.

[0047] Embodiment 2:

[0048] Embodiment 2 of the present application provides a quadruple heat dissipation device for QSFP-DD modules integrated with a wavelength division device. The difference between Embodiment 2 of the present application and Embodiment 1 is that:

[0049] refer to Figure 5 and Figure 6 In this embodiment, a heat dissipation component 2 is provided with two side plates 23, and the two side plates 23 are arranged at intervals. The heat dissipation component 2 also includes an intermediate plate 24 and a connecting plate 29, and the intermediate plate 24 is fixedly connected to the top plate 22 and the bottom plate 21 respectively, and the intermediate plate 24 is located between the two side plates 23. For a heat dissipation component 2, four connecting plates 29 are provided, two of which are fixedly connected to the two sides of the top plate 22 respectively, and the other two connecting plates 29 are fixedly connected to the two sides of the bottom plate 21 respectively. The connecting plates 29 of adjacent heat dissipation components 2 are connected, and a heat dissipation gap groove 291 is formed between the side plates 23 and the connecting plates 29 of adjacent heat dissipation components 2, which is conducive to improving the heat dissipation efficiency between adjacent heat dissipation components 2.

[0050] refer to Figure 6 and Figure 7 The bottom plate 21 has an evaporation chamber 211, the top plate 22 has a liquefaction chamber 221, the side plate 23 has a circulation chamber 231, the middle plate 24 has a fallback chamber 241, the evaporation chamber 211 is connected to the circulation chamber 231, the circulation chamber 231 is connected to the liquefaction chamber 221, and the fallback chamber 241 is connected to the evaporation chamber 211 and the liquefaction chamber 221 respectively. The evaporation chamber 211 is filled with a heat transfer liquid, which evaporates under heat to form steam, which enters the liquefaction chamber 221 through the circulation chamber 231, and falls back to the evaporation chamber 211 through the fallback chamber 241 after liquefaction.

[0051] refer to Figure 6 and Figure 7 A first one-way conducting member 25 is disposed in the return chamber 241. The first one-way conducting member 25 includes two guide flaps 251. One end of the two guide flaps 251 is fixedly connected to the inner wall of the return chamber 241, and the other ends of the two guide flaps 251 are close to each other. The height of one end of the guide flaps 251 close to each other is lower than the height of the other end. The guide flaps 251 have a certain flexibility, so that the liquefied heat transfer liquid can be allowed to flow from the liquefaction chamber 221 to the evaporation chamber 211 through the return chamber 241, and the steam can be prevented from entering the return chamber 241 from the evaporation chamber 211.

[0052] refer to Figure 6 and Figure 7A second one-way conducting member 26 is disposed in the circulation chamber 231. The structure of the second one-way conducting member 26 is the same as that of the first one-way conducting member 25. The conduction direction of the second one-way conducting member 26 is opposite to that of the first one-way conducting member 25. The second one-way conducting member 26 allows the steam to enter the liquefaction chamber 221 from the evaporation chamber 211 through the circulation chamber 231, and can also prevent the steam from entering the circulation chamber 231 from the liquefaction chamber 221 after liquefaction. The arrangement of the first one-way conducting member 25 and the second one-way conducting member 26 enables the vapor-liquid phase change cycle of the heat transfer liquid to proceed in an orderly manner.

[0053] refer to Figure 6 and Figure 7 The heat dissipation assembly 2 further includes a liquid collecting ball 27, which is fixedly connected to the inner top wall of the liquefaction chamber 221. A plurality of liquid collecting balls 27 are provided, and the projection of the liquid collecting balls 27 covers the middle plate 24. The steam is liquefied in the liquefaction chamber 221, and the liquefied heat transfer liquid gathers on the liquid collecting ball 27 and drips into the return chamber 241, which is conducive to the reflux of the liquefied heat transfer liquid.

[0054] refer to Figure 6 and Figure 7 The heat dissipation assembly 2 further includes a liquid separation rib 28, which is fixedly connected to the inner bottom wall of the evaporation chamber 211. The middle of the liquid separation rib 28 is high and the two sides are low, that is, the cross-sectional area of ​​the liquid separation rib 28 is gradually reduced in the direction from the middle plate 24 to the side plate 23. The heat transfer liquid in the return cavity 241 drips to the middle of the liquid separation rib 28, and the liquid separation rib 28 guides the heat transfer liquid to the two sides of the evaporation chamber 211, which is conducive to the steam entering the flow cavity 231.

[0055] refer to Figure 6 and Figure 7 The inner top wall of the evaporation chamber 211 is provided with a first guide wall 213, and the inner bottom wall of the liquefaction chamber 221 is provided with a second guide wall 222. In the direction from the side plate 23 to the middle plate 24, the cross-sectional area of ​​the first guide wall 213 is gradually expanded, and the cross-sectional area of ​​the second guide wall 222 is gradually reduced. The first guide wall 213 is conducive to guiding the steam in the evaporation chamber 211 to the circulation chamber 231, and the second guide wall 222 is conducive to guiding the liquefied heat transfer liquid in the liquefaction chamber 221 to the fall-back chamber 241.

[0056] The implementation principle of the quadruple heat sink of a QSFP-DD module built into an integrated wavelength division device in Example 2 of the present application is as follows: the heat transfer liquid in the evaporation chamber 211 is heated and evaporated, and the steam enters the liquefaction chamber 221 from the evaporation chamber 211 through the circulation chamber 231. The steam condenses and liquefies in the liquefaction chamber 221, and after liquefaction, the heat transfer liquid is formed and enters the evaporation chamber 211 from the liquefaction chamber 221 through the return chamber 241. The first unidirectional conductive member 25 allows the liquefied heat transfer liquid to flow unidirectionally from the liquefaction chamber 221 through the return chamber 241 to the evaporation chamber 211, and the second unidirectional conductive member 26 allows the steam to flow from the evaporation chamber 211 through the circulation chamber 231 to the liquefaction chamber 221, so that the vapor-liquid phase change cycle of the heat transfer liquid can be carried out in an orderly manner.

[0057] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A QSFP-DD module quad heat sink with integrated wavelength division equipment, characterized in that: The invention comprises a heat-conducting base (1) and a heat-dissipating assembly (2), wherein a plurality of the heat-dissipating assemblies (2) are provided, and the plurality of the heat-dissipating assemblies (2) are arranged on the heat-conducting base (1); the heat-dissipating assembly (2) comprises a top plate (22), a bottom plate (21) and a side plate (23); the heat-conducting base (1) is used to be connected to a cage assembly, the bottom plate (21) is connected to the heat-conducting base (1), and the side plate (23) is respectively connected to the top plate (22) and the bottom plate (21); a heat-dissipating channel (212) is formed between the top plate (22), the bottom plate (21) and the side plate (23); An evaporation chamber (211) is provided inside the bottom plate (21), and a heat transfer liquid is contained in the evaporation chamber (211); a liquefaction chamber (221) is provided inside the top plate (22); a circulation chamber (231) is provided inside the side plate (23), and the circulation chamber (231) is respectively connected to the evaporation chamber (211) and the liquefaction chamber (221); An intermediate plate (24) is provided between the top plate (22) and the bottom plate (21), the intermediate plate (24) being located between the two side plates (23), a return cavity (241) being provided inside the intermediate plate (24), the return cavity (241) being respectively connected to the liquefaction cavity (221) and the evaporation cavity (211); A first one-way conducting member (25) is arranged in the return chamber (241), and the first one-way conducting member (25) allows the condensed heat transfer liquid to flow from the liquefaction chamber (221) to the evaporation chamber (211) through the return chamber (241); A second one-way conducting member (26) is arranged in the circulation chamber (231), and the second one-way conducting member (26) allows the vapor of the heat transfer liquid to flow from the evaporation chamber (211) to the liquefaction chamber (221) through the circulation chamber (231); A liquid collecting ball (27) is arranged at the top of the liquefaction chamber (221), and the projection of the liquid collecting ball (27) covers the middle plate (24); a liquid separation convex strip (28) is connected to the bottom wall of the evaporation chamber (211), and the projection of the liquid separation convex strip (28) covers the projection of the middle plate (24); and in a direction from the middle plate (24) to the side plate (23), the cross-sectional area of ​​the liquid separation convex strip (28) is gradually reduced.

2. The QSFP-DD module quad heat sink device built into an integrated wavelength division device according to claim 1, characterized in that: One of the heat dissipation components (2) comprises two side panels (23), and the two side panels (23) are arranged at an interval.

3. The QSFP-DD module quad heat sink device with built-in integrated wavelength division device according to claim 1, characterized in that: The first one-way conducting member (25) comprises two guide flaps (251), the two guide flaps (251) are arranged opposite to each other, one end of the guide flap (251) is connected to the inner wall of the return cavity (241), and the two guide flaps (251) are close to each other at the other end.

4. The QSFP-DD module quad heat sink device with built-in integrated wavelength division device according to claim 1, characterized in that: The inner top wall of the evaporation chamber (211) is provided with a first guide wall (213), and the inner bottom wall of the liquefaction chamber (221) is provided with a second guide wall (222); in a direction from the side plate (23) to the middle plate (24), the cross-sectional area of ​​the first guide wall (213) is gradually expanded, and the cross-sectional area of ​​the second guide wall (222) is gradually contracted.

5. The QSFP-DD module quad heat sink device with built-in integrated wavelength division device according to claim 2, characterized in that: The top plate (22) and the bottom plate (21) are both connected to a connecting plate (29), the connecting plates (29) of adjacent heat dissipation components (2) are connected, and a heat dissipation gap groove (291) is formed between the connecting plates (29) of adjacent heat dissipation components (2) and the side plates (23).

6. The QSFP-DD module quad heat sink device with built-in integrated wavelength division device according to claim 1, characterized in that: The heat-conducting base (1) comprises a heat-conducting plate (11), a contact bottom plate (12), a heat-conducting strip (13) and a heat-conducting pipe (14); the contact bottom plate (12) is connected to the heat-conducting plate (11), and the contact bottom plate (12) is in contact with the cage assembly; the heat-conducting strip (13) is connected to the heat-conducting plate (11), the heat-conducting strip (13) is provided with a mounting groove, the heat-conducting pipe (14) is mounted in the mounting groove, and the bottom plate (21) is connected to the heat-conducting pipe (14).

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