Connector detection method and device, computer equipment and storage medium

Abstract

The invention relates to a connector detection method and device, computer equipment and a storage medium. The method comprises the following steps: acquiring historical detection data of a connector, and performing standard detection parameter analysis to obtain a connector standard detection parameter qualification domain; measuring the connector to obtain connector size measurement data and connector offset measurement data; performing size qualification judgment based on the connector size measurement data in combination with the connector size standard inspection parameter qualification domain; based on the connector offset measurement data, in combination with the connector offset calibration parameter qualification domain, performing offset qualification judgment; and if the result of one or more of the size qualification judgment and the offset qualification judgment is unqualified, judging that the connector is in poor contact. By adopting the method, misjudgment can be reduced, fault reasons can be quickly positioned, the problem of poor contact caused by offset of a plurality of assemblies can be found, and the detection precision is remarkably improved.

Description

Technical Field

[0001] The present application relates to the technical field of connector detection, and in particular to a connector detection method, device, computer equipment and storage medium. Background Art

[0002] In the assembly and testing process of modern servers, the performance of PCIE devices such as network interface cards and memory cards is crucial to the overall efficiency of the system. Especially in high-performance computing and data center environments, PCIE devices undertake the key tasks of high-speed data transmission and network connection, and their importance is becoming increasingly prominent. However, PCIE devices are connected through connectors, and connectors are prone to poor contact problems, which often lead to reduced bandwidth, reduced data transmission rate and increased transmission error rate, seriously affecting the stability of the system and the interoperability of network devices. Therefore, in order to ensure the normal operation of the equipment and user experience, it is necessary to quickly and effectively detect whether the connector has poor contact problems.

[0003] However, existing methods for detecting poor connector contact often rely on a single detection dimension, such as electrical signals or physical connections, which results in an inability to fully capture potential problems with the device and a high rate of misjudgment. In addition, traditional detection standards and tolerance ranges are usually statically set and lack the ability to dynamically adjust according to different equipment batches and historical data, resulting in some devices being misjudged as qualified or unqualified. More importantly, existing methods are difficult to effectively identify poor contact caused by offset of multiple components, especially in complex equipment, and it is difficult to accurately locate the root cause of the fault, thereby affecting the efficiency of troubleshooting and the level of automation of the production line. Summary of the invention

[0004] Based on this, it is necessary to provide a connector detection method, device, computer equipment and storage medium that can reduce misjudgment, quickly locate the cause of the fault, and determine the poor contact problem caused by the offset of multiple components, thereby significantly improving the detection accuracy.

[0005] In one aspect, a connector detection method is provided, the method comprising:

[0006] Acquire historical inspection data of the connector, perform standard inspection parameter analysis, and obtain a connector standard inspection parameter qualified domain, wherein the connector standard inspection parameter qualified domain includes a connector size standard inspection parameter qualified domain and a connector offset standard inspection parameter qualified domain;

[0007] Measuring the connector to obtain connector size measurement data and connector offset measurement data of the connector;

[0008] Based on the connector size measurement data and in combination with the connector size inspection parameter qualification domain, a size qualification judgment is performed;

[0009] Based on the connector offset measurement data, combined with the connector offset inspection parameter qualified domain, an offset qualified judgment is performed, wherein the offset qualified judgment includes at least one of the following: independent offset qualified judgment, composite offset qualified judgment;

[0010] In response to the result of one or more of the size qualification judgment and the offset qualification judgment being unqualified, it is determined that the connector has poor contact.

[0011] In one embodiment, the connector includes at least one component, and the at least one component corresponds to a component size inspection parameter and a component offset inspection parameter. The acquiring of historical inspection data of the connector, performing standard inspection parameter analysis, and obtaining a connector inspection parameter qualified domain includes:

[0012] Acquire the connector historical detection data to obtain the historical detection data corresponding to the at least one component, wherein the historical detection data corresponding to the at least one component includes: a historical data set of component size inspection parameters and a historical data set of component offset inspection parameters;

[0013] Calculating a mean value and a standard deviation of the component size inspection parameter corresponding to the at least one component according to the component size inspection parameter historical data set;

[0014] Obtaining a tolerance range of the component size inspection parameter corresponding to the at least one component according to the component size inspection parameter mean and the component size inspection parameter standard deviation;

[0015] According to the tolerance range of the component size inspection parameter, a qualified domain of the component size inspection parameter of the at least one component is obtained, and then the qualified domain of the connector size inspection parameter is obtained;

[0016] Calculating a component offset calibration parameter mean and a component offset calibration parameter standard deviation corresponding to the at least one component according to the component offset calibration parameter historical data set;

[0017] According to the component offset calibration parameter historical data set, based on correlation analysis, obtain the correlation strength between the component offset calibration parameter and the component size calibration parameter corresponding to the at least one component;

[0018] According to the mean value of the component offset calibration parameter and the standard deviation of the component offset calibration parameter, combined with the correlation strength between the component offset calibration parameter and the component size calibration parameter, a component offset calibration parameter tolerance range corresponding to the at least one component is obtained;

[0019] According to the component offset inspection parameter tolerance range, a component offset inspection parameter qualified domain corresponding to the at least one component is obtained, and then the connector offset inspection parameter qualified domain is obtained.

[0020] In one embodiment, obtaining the tolerance range of the component dimension inspection parameter corresponding to the at least one component according to the component dimension inspection parameter mean and the component dimension inspection parameter standard deviation includes:

[0021] Obtaining a component size calibration parameter standard deviation and a component offset calibration parameter standard deviation corresponding to the at least one component;

[0022] Obtaining a mean value of a component size calibration parameter and a mean value of a component offset calibration parameter corresponding to the at least one component;

[0023] According to the mean value of the component dimension inspection parameter and the standard deviation of the component dimension inspection parameter, a component dimension inspection parameter tolerance range corresponding to the at least one component is obtained, wherein the component dimension inspection parameter tolerance range is expressed as:

[0024]

[0025] Among them, w i,spec represents the tolerance range of the component size inspection parameter corresponding to the i-th component, represents the standard deviation of the component size inspection parameter corresponding to the i-th component, represents the mean value of the component size inspection parameter corresponding to the i-th component;

[0026] According to the component offset calibration parameter mean and the component offset calibration parameter standard deviation, combined with the correlation strength between the component offset calibration parameter and the component size calibration parameter, a component offset calibration parameter tolerance range corresponding to the at least one component is obtained, including:

[0027] Selecting a number of historical samples from the component size calibration parameter historical data set and the component offset calibration parameter historical data set respectively;

[0028] According to the plurality of historical samples, the dimension offset correlation coefficient corresponding to the at least one component is calculated according to the component dimension calibration parameter standard deviation and the component offset calibration parameter standard deviation, wherein the dimension offset correlation coefficient is obtained based on the following formula:

[0029]

[0030] in, represents the kth historical sample of the component size inspection parameter corresponding to the i-th component, p jrepresents the kth historical sample of the component size inspection parameter corresponding to the jth component, n represents the number of selected historical samples, represents the dimension offset correlation coefficient between the component dimension inspection parameter corresponding to the i-th component and the component offset inspection parameter corresponding to the j-th component, It represents the standard deviation of the component offset inspection parameter corresponding to the jth component. represents the mean value of the component offset calibration parameter corresponding to the jth component;

[0031] The size offset correlation coefficient is obtained, and a dynamic adjustment coefficient corresponding to the at least one component is generated, wherein the dynamic adjustment coefficient is obtained based on the following formula:

[0032]

[0033] Among them, δ j represents the dynamic adjustment coefficient of the component offset calibration parameter corresponding to the jth component, α represents the adjustment factor, represents the absolute value of the dimension offset correlation coefficient between the component dimension inspection parameter corresponding to the i-th component and the component offset inspection parameter corresponding to the j-th component, and m represents the number of the component dimension inspection parameters;

[0034] According to the component offset calibration parameter mean and the component offset calibration parameter standard deviation, combined with the dynamic adjustment coefficient, the component offset calibration parameter tolerance range corresponding to the at least one component is obtained, wherein the component offset calibration parameter tolerance range is expressed as: Among them, p j,spec Indicates the component offset inspection parameter tolerance range corresponding to the j-th component.

[0035] In one embodiment, measuring the connector to obtain connector size measurement data and connector offset measurement data of the connector includes:

[0036] According to at least one component included in the connector, obtaining a component size inspection parameter and a component offset inspection parameter corresponding to the at least one component;

[0037] According to the component dimension inspection parameters, set the corresponding dimension measurement dimensions;

[0038] According to the component offset calibration parameter, a corresponding offset measurement dimension is set;

[0039] According to the size measurement dimension and the offset measurement dimension, a corresponding measuring tool is selected to measure and record the connector to obtain connector size measurement data and connector offset measurement data of the connector.

[0040] In one embodiment, based on the connector size measurement data and in combination with the connector size inspection parameter qualification domain, a size qualification judgment is performed, including:

[0041] Obtaining component size measurement data corresponding to at least one component included in the connector according to the connector size measurement data;

[0042] Extracting the component size measurement data according to the component size inspection parameter corresponding to the at least one component to obtain a component size inspection parameter measurement value corresponding to the at least one component;

[0043] Obtain a qualified domain of component dimension inspection parameters corresponding to the at least one component;

[0044] In response to the component dimension inspection parameter measurement value corresponding to the at least one component being within the component dimension inspection parameter qualified domain, the at least one component is a dimension qualified component;

[0045] In response to the fact that all components in the connector are qualified in size, the result of the size qualification judgment is qualified, otherwise, the result of the size qualification judgment is unqualified.

[0046] In one embodiment, based on the connector offset measurement data and in combination with the connector offset inspection parameter qualified domain, performing offset qualified judgment includes:

[0047] Obtaining component information of the connector to determine whether there are multiple similar deflectable components;

[0048] In response to the absence of a plurality of similar deflectable components, performing the independent deflection qualification determination, wherein the independent deflection qualification determination comprises:

[0049] Obtaining component offset measurement data corresponding to at least one component included in the connector according to the connector offset measurement data;

[0050] Extracting the component offset measurement data according to the component offset calibration parameter corresponding to the at least one component to obtain a component offset calibration parameter measurement value corresponding to the at least one component;

[0051] Obtain a component offset calibration parameter qualified domain corresponding to the at least one component;

[0052] In response to the component offset calibration parameter measurement value corresponding to the at least one component being within the component offset calibration parameter qualified domain, the at least one component is an independent offset qualified component;

[0053] In response to the components in the connector being all independent offset qualified components, the offset qualified judgment result is qualified, otherwise, the offset qualified judgment result is unqualified;

[0054] In response to the presence of a plurality of similar deflectable components, performing the composite deflection qualification judgment to obtain the composite deflection qualification judgment result;

[0055] In response to the composite offset qualified judgment result being qualified, the offset qualified judgment result is qualified, otherwise, the offset qualified judgment result is unqualified.

[0056] In one embodiment, the offset calibration parameter qualified domain includes a component superposition offset qualified domain, and in response to the presence of multiple similar offsettable components, the composite offset qualified judgment is performed to obtain the composite offset qualified judgment result, including:

[0057] According to the component information in the connector and in combination with the corresponding component offset measurement data, the independent offset judgment is performed on all components in the connector respectively;

[0058] In response to any component in the connector being an independent offset qualified component, a similar offset superposition judgment is performed, including:

[0059] Acquire the types of the multiple similar deflectable components, and classify and group the component deflection measurement data according to the types of the multiple similar deflectable components to obtain a classified and grouped measurement form, wherein the classified and grouped measurement form at least includes: component type, component number, and component deflection calibration parameter measurement value;

[0060] Calibrate the offset direction of the component offset calibration parameter measurement value in the classification and grouping measurement form to obtain the component offset;

[0061] According to the component type and the component number, the component offsets of the multiple similar shiftable components are counted respectively, and based on the component offset superposition formula, the component superposition offsets of the multiple similar shiftable components of the same component type are calculated respectively, wherein the component offset superposition formula is: in, represents the component stacking offset of the jth component type, represents the component offset of the i-th component number of the j-th component type, Indicates the offset direction of the component offset of the i-th component number of the j-th component type, represents the absolute value of the component offset of the i-th component number of the j-th component type, and N represents the number of multiple similar offsettable components of the j-th component type;

[0062] According to the component stacking offsets corresponding to the multiple similar shiftable components of the same component type, a comparison is performed in combination with the component stacking offset qualified domain corresponding to the same component type, and in response to the component stacking offsets being within the component stacking offset qualified domain, it is determined that the multiple similar shiftable components of the same component type are all stacking offset qualified components;

[0063] In response to the multiple similar deflectable components in the connector being all superimposed deflection qualified components, the composite deflection qualified judgment result of the connector is qualified.

[0064] In another aspect, a connector detection device is provided, the device comprising:

[0065] A standard inspection parameter qualified domain generation module is used to obtain the historical inspection data of the connector, perform standard inspection parameter analysis, and obtain the connector standard inspection parameter qualified domain, wherein the connector standard inspection parameter qualified domain includes the connector size standard inspection parameter qualified domain and the connector offset standard inspection parameter qualified domain;

[0066] A device measurement module, used to obtain connector size measurement data and connector offset measurement data of the connector;

[0067] A size qualification judgment module, used to make a size qualification judgment based on the connector size measurement data and the connector size inspection parameter qualification domain;

[0068] An offset qualified judgment module is used to perform offset qualified judgment based on the connector offset measurement data and the connector offset inspection parameter qualified domain, wherein the offset qualified judgment includes at least one of the following: independent offset qualified judgment and composite offset qualified judgment;

[0069] The poor contact judgment module is used to judge that the connector has poor contact in response to one or more of the results of the size qualification judgment and the offset qualification judgment being unqualified.

[0070] In another aspect, a computer device is provided, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the following steps are implemented:

[0071] Acquire historical inspection data of the connector, perform standard inspection parameter analysis, and obtain a connector standard inspection parameter qualified domain, wherein the connector standard inspection parameter qualified domain includes a connector size standard inspection parameter qualified domain and a connector offset standard inspection parameter qualified domain;

[0072] Measuring the connector to obtain connector size measurement data and connector offset measurement data of the connector;

[0073] Based on the connector size measurement data and in combination with the connector size inspection parameter qualification domain, a size qualification judgment is performed;

[0074] Based on the connector offset measurement data, combined with the connector offset inspection parameter qualified domain, an offset qualified judgment is performed, wherein the offset qualified judgment includes at least one of the following: independent offset qualified judgment, composite offset qualified judgment;

[0075] In response to the result of one or more of the size qualification judgment and the offset qualification judgment being unqualified, it is determined that the connector has poor contact.

[0076] In another aspect, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented:

[0077] Acquire historical inspection data of the connector, perform standard inspection parameter analysis, and obtain a connector standard inspection parameter qualified domain, wherein the connector standard inspection parameter qualified domain includes a connector size standard inspection parameter qualified domain and a connector offset standard inspection parameter qualified domain;

[0078] Measuring the connector to obtain connector size measurement data and connector offset measurement data of the connector;

[0079] Based on the connector size measurement data and in combination with the connector size inspection parameter qualification domain, a size qualification judgment is performed;

[0080] Based on the connector offset measurement data, combined with the connector offset inspection parameter qualified domain, an offset qualified judgment is performed, wherein the offset qualified judgment includes at least one of the following: independent offset qualified judgment, composite offset qualified judgment;

[0081] In response to the result of one or more of the size qualification judgment and the offset qualification judgment being unqualified, it is determined that the connector has poor contact.

[0082] The above-mentioned connector detection method, device, computer equipment and storage medium, by performing multi-faceted measurements of the connector and analyzing standard detection parameters based on historical detection data, combine the two important dimensions of connector size and connector offset, and can comprehensively capture problems caused by poor contact, reduce the probability of misjudgment, improve fault tolerance, and make the detection results more accurate; at the same time, the qualified domain dynamically generated based on historical data can be adjusted according to different equipment batches and production conditions, further reducing the risk of misjudgment caused by static standards; in addition, it can also effectively help identify the cause of poor contact, assist in locating the root cause of poor connector contact, and provide an important basis for troubleshooting. BRIEF DESCRIPTION OF THE DRAWINGS

[0083] Figure 1 A diagram showing an application environment of a connector detection method in an embodiment;

[0084] Figure 2 A schematic diagram of a flow chart of a connector detection method in one embodiment;

[0085] Figure 3 is a structural block diagram of a connector detection device in one embodiment;

[0086] Figure 4 FIG. 4 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0087] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0088] The present application provides a connector detection method which can be applied to Figure 1 In the application environment shown. Among them, the terminal 102 communicates with the server 104 through the network. The user sends a connector poor contact detection request to the server 104 through the terminal 102. The server 104 obtains the connector measurement data measured by the corresponding connector measurement tool based on a connector detection method provided by the present application, and judges the connector poor contact according to the connector standard inspection parameter qualified domain obtained by pre-storage or real-time calculation, and finally returns the judgment result to the terminal 102. Among them, the terminal 102 can be but not limited to various personal computers, laptops, smart phones, tablet computers and portable wearable devices, and the server 104 can be implemented with an independent server or a server cluster composed of multiple servers.

[0089] In one embodiment, Figure 2 As shown, a connector detection method is provided, which is applied to Figure 1 The server 104 in the example is used as an example to illustrate, and the following steps are included:

[0090] Step 201, obtain the historical inspection data of the connector, perform standard inspection parameter analysis, and obtain a connector standard inspection parameter qualified domain, wherein the connector standard inspection parameter qualified domain includes a connector size standard inspection parameter qualified domain and a connector offset standard inspection parameter qualified domain.

[0091] Among them, the connector is an important component used to achieve connection between devices in hardware devices designed based on the PCI Express (Peripheral Component Interconnect Express) standard, and usually includes: gold fingers, slots, and pins (PIN needles).

[0092] Specifically, the connector includes at least one component, and the at least one component corresponds to a component size inspection parameter and a component offset inspection parameter. The historical inspection data of the connector is acquired to obtain the historical inspection data corresponding to the at least one component; based on the historical inspection data corresponding to the at least one component, a qualified domain of component size inspection parameters corresponding to the at least one component is obtained, and then the qualified domain of connector size inspection parameters is obtained; based on correlation analysis, the correlation strength between the component offset inspection parameters and the component size inspection parameters corresponding to the at least one component is obtained; combined with the correlation strength between the component offset inspection parameters and the component size inspection parameters, the qualified domain of component offset inspection parameters corresponding to the at least one component is obtained, and then the qualified domain of connector offset inspection parameters is obtained.

[0093] Step 202: measure the connector to obtain connector size measurement data and connector offset measurement data of the connector.

[0094] Specifically, according to at least one component included in the connector, component size inspection parameters and component offset inspection parameters corresponding to the at least one component are obtained; according to the component size inspection parameters, corresponding size measurement dimensions are set; according to the component offset inspection parameters, corresponding offset measurement dimensions are set; according to the size measurement dimensions and the offset measurement dimensions, connector size measurement data and connector offset measurement data of the connector are obtained.

[0095] Step 203: Based on the connector size measurement data and in combination with the connector size inspection parameter qualification domain, a size qualification judgment is performed.

[0096] Specifically, based on the connector size measurement data, a component size inspection parameter measurement value corresponding to the at least one component is obtained; a component size inspection parameter qualified domain corresponding to the at least one component is obtained; in response to the component size inspection parameter measurement value corresponding to the at least one component being in the component size inspection parameter qualified domain, the at least one component is a size-qualified component; in response to the components in the connector being all size-qualified components, the result of the size qualification judgment is qualified, otherwise, the result of the size qualification judgment is unqualified.

[0097] Step 204, based on the connector offset measurement data and in combination with the connector offset inspection parameter qualification domain, an offset qualification judgment is performed, wherein the offset qualification judgment includes at least one of the following: an independent offset qualification judgment and a composite offset qualification judgment.

[0098] Specifically, the component information of the connector is obtained to determine whether there are multiple similar shiftable components; in response to the absence of multiple similar shiftable components, the independent shift qualified judgment is performed, wherein the independent shift qualified judgment includes: obtaining a component shift inspection parameter measurement value corresponding to the at least one component according to the connector shift measurement data; obtaining a component shift inspection parameter qualified domain corresponding to the at least one component; in response to the component shift inspection parameter measurement value corresponding to the at least one component being in the component shift inspection parameter qualified domain, the at least one component is an independent shift qualified component; in response to the components in the connector being all independent shift qualified components, the result of the shift qualified judgment is qualified; in response to the presence of multiple similar shiftable components, the composite shift qualified judgment is performed to obtain the composite shift qualified judgment result; in response to the composite offset qualified judgment result being qualified, the result of the offset qualified judgment is qualified, otherwise, the offset qualified judgment result is unqualified.

[0099] Step 205: In response to one or more of the size qualification judgment and the offset qualification judgment being unqualified, it is determined that the connector has poor contact.

[0100] In the above connector detection method, by performing multi-faceted measurements on the connector and analyzing standard detection parameters based on historical detection data, the two important dimensions of connector size and connector offset are combined, which can comprehensively capture problems caused by poor contact, reduce the probability of misjudgment, improve fault tolerance, and make the detection results more accurate; at the same time, the qualified domain dynamically generated based on historical data can be adjusted according to different equipment batches and production conditions, further reducing the risk of misjudgment caused by static standards; in addition, it can also effectively help identify the cause of poor contact, assist in locating the root cause of poor connector contact, and provide an important basis for troubleshooting.

[0101] In one embodiment, the connector includes at least one component, and the at least one component corresponds to a component size inspection parameter and a component offset inspection parameter. The acquiring of historical inspection data of the connector, performing standard inspection parameter analysis, and obtaining a connector inspection parameter qualified domain includes:

[0102] Acquire the connector historical detection data to obtain the historical detection data corresponding to the at least one component, wherein the historical detection data corresponding to the at least one component includes: a historical data set of component size inspection parameters and a historical data set of component offset inspection parameters;

[0103] Calculating a mean value and a standard deviation of the component size inspection parameter corresponding to the at least one component according to the component size inspection parameter historical data set;

[0104] Obtaining a tolerance range of the component size inspection parameter corresponding to the at least one component according to the component size inspection parameter mean and the component size inspection parameter standard deviation;

[0105] According to the tolerance range of the component size inspection parameter, a qualified domain of the component size inspection parameter of the at least one component is obtained, and then the qualified domain of the connector size inspection parameter is obtained;

[0106] Calculating a component offset calibration parameter mean and a component offset calibration parameter standard deviation corresponding to the at least one component according to the component offset calibration parameter historical data set;

[0107] According to the component offset calibration parameter historical data set, based on correlation analysis, obtain the correlation strength between the component offset calibration parameter and the component size calibration parameter corresponding to the at least one component;

[0108] According to the mean value of the component offset calibration parameter and the standard deviation of the component offset calibration parameter, combined with the correlation strength between the component offset calibration parameter and the component size calibration parameter, a component offset calibration parameter tolerance range corresponding to the at least one component is obtained;

[0109] According to the component offset inspection parameter tolerance range, a component offset inspection parameter qualified domain corresponding to the at least one component is obtained, and then the connector offset inspection parameter qualified domain is obtained.

[0110] Specifically, this embodiment is based on the mean and standard deviation calculated using historical data and combined with the correlation between size and offset parameters to effectively adjust the tolerance range and obtain a more accurate and reliable qualified domain of standard inspection parameters, thereby improving the accuracy of detection; at the same time, it can optimize the qualified domain of standard inspection parameters according to the actual conditions of different equipment, avoiding overly loose or overly strict settings, reducing the misjudgment rate, and thus greatly improving the accuracy of connector poor contact detection, which is especially suitable for complex and highly variable production environments.

[0111] 9. In one embodiment, obtaining the tolerance range of the component size inspection parameter corresponding to the at least one component according to the component size inspection parameter mean and the component size inspection parameter standard deviation includes:

[0112] Obtaining a component size calibration parameter standard deviation and a component offset calibration parameter standard deviation corresponding to the at least one component;

[0113] Obtaining a mean value of a component size calibration parameter and a mean value of a component offset calibration parameter corresponding to the at least one component;

[0114] According to the mean value of the component dimension inspection parameter and the standard deviation of the component dimension inspection parameter, a component dimension inspection parameter tolerance range corresponding to the at least one component is obtained, wherein the component dimension inspection parameter tolerance range is expressed as:

[0115]

[0116] Among them, w i,spec represents the tolerance range of the component size inspection parameter corresponding to the i-th component, represents the standard deviation of the component size inspection parameter corresponding to the i-th component, represents the mean value of the component size inspection parameter corresponding to the i-th component;

[0117] According to the component offset calibration parameter mean and the component offset calibration parameter standard deviation, combined with the correlation strength between the component offset calibration parameter and the component size calibration parameter, a component offset calibration parameter tolerance range corresponding to the at least one component is obtained, including:

[0118] Selecting a number of historical samples from the component size calibration parameter historical data set and the component offset calibration parameter historical data set respectively;

[0119] According to the plurality of historical samples, the dimension offset correlation coefficient corresponding to the at least one component is calculated according to the component dimension calibration parameter standard deviation and the component offset calibration parameter standard deviation, wherein the dimension offset correlation coefficient is obtained based on the following formula:

[0120]

[0121] in, represents the kth historical sample of the component size inspection parameter corresponding to the i-th component, p j represents the kth historical sample of the component size inspection parameter corresponding to the jth component, n represents the number of selected historical samples, represents the dimension offset correlation coefficient between the component dimension inspection parameter corresponding to the i-th component and the component offset inspection parameter corresponding to the j-th component, It represents the standard deviation of the component offset inspection parameter corresponding to the jth component. represents the mean value of the component offset calibration parameter corresponding to the jth component;

[0122] The size offset correlation coefficient is obtained, and a dynamic adjustment coefficient corresponding to the at least one component is generated, wherein the dynamic adjustment coefficient is obtained based on the following formula:

[0123]

[0124] Among them, δ j represents the dynamic adjustment coefficient of the component offset calibration parameter corresponding to the jth component, α represents the adjustment factor, represents the absolute value of the dimension offset correlation coefficient between the component dimension inspection parameter corresponding to the i-th component and the component offset inspection parameter corresponding to the j-th component, and m represents the number of the component dimension inspection parameters;

[0125] According to the component offset calibration parameter mean and the component offset calibration parameter standard deviation, combined with the dynamic adjustment coefficient, the component offset calibration parameter tolerance range corresponding to the at least one component is obtained, wherein the component offset calibration parameter tolerance range is expressed as: Among them, p j,spec Indicates the component offset inspection parameter tolerance range corresponding to the j-th component.

[0126] Specifically, this embodiment provides a specific calculation method for the tolerance range of the calibration parameter, wherein by introducing the correlation analysis and dynamic adjustment coefficient between the size and offset parameters, the accuracy of the component offset calibration parameter tolerance range can be further enhanced, which is beneficial in connectors with multiple components or complex structures where the size and offset may affect each other, avoiding the limitation that the detection of a single parameter is not sufficient to reflect the true state of the device, improving the ability to identify poor contact problems in complex equipment, reducing misjudgments, and providing a more reliable basis for high-precision detection.

[0127] In one embodiment, measuring the connector to obtain connector size measurement data and connector offset measurement data of the connector includes:

[0128] According to at least one component included in the connector, obtaining a component size inspection parameter and a component offset inspection parameter corresponding to the at least one component;

[0129] According to the component dimension inspection parameters, set the corresponding dimension measurement dimensions;

[0130] According to the component offset calibration parameter, a corresponding offset measurement dimension is set;

[0131] According to the size measurement dimension and the offset measurement dimension, a corresponding measuring tool is selected to measure and record the connector to obtain connector size measurement data and connector offset measurement data of the connector.

[0132] Specifically, compared with the traditional single measurement method, this embodiment can combine different measurement dimensions and tools to perform comprehensive measurements according to the specific needs of the connector components, ensuring that potential poor contact problems are captured from multiple angles, significantly improving fault diagnosis efficiency and accuracy, and providing strong support for subsequent automated processing and troubleshooting.

[0133] In one embodiment, based on the connector size measurement data and in combination with the connector size inspection parameter qualification domain, a size qualification judgment is performed, including:

[0134] Obtaining component size measurement data corresponding to at least one component included in the connector according to the connector size measurement data;

[0135] Extracting the component size measurement data according to the component size inspection parameter corresponding to the at least one component to obtain a component size inspection parameter measurement value corresponding to the at least one component;

[0136] Obtain a qualified domain of component dimension inspection parameters corresponding to the at least one component;

[0137] In response to the component dimension inspection parameter measurement value corresponding to the at least one component being within the component dimension inspection parameter qualified domain, the at least one component is a dimension qualified component;

[0138] In response to the fact that all components in the connector are qualified in size, the result of the size qualification judgment is qualified, otherwise, the result of the size qualification judgment is unqualified.

[0139] Specifically, this embodiment classifies and extracts component size measurement data, and makes independent qualification judgments for different components, thereby reducing the impact of redundant data on the judgment process, and can quickly identify components with unqualified dimensions, avoid missing problematic components, and improve the efficiency of fault location.

[0140] In one embodiment, based on the connector offset measurement data and in combination with the connector offset inspection parameter qualified domain, performing offset qualified judgment includes:

[0141] Obtaining component information of the connector to determine whether there are multiple similar deflectable components;

[0142] In response to the absence of a plurality of similar deflectable components, performing the independent deflection qualification determination, wherein the independent deflection qualification determination comprises:

[0143] Obtaining component offset measurement data corresponding to at least one component included in the connector according to the connector offset measurement data;

[0144] Extracting the component offset measurement data according to the component offset calibration parameter corresponding to the at least one component to obtain a component offset calibration parameter measurement value corresponding to the at least one component;

[0145] Obtain a component offset calibration parameter qualified domain corresponding to the at least one component;

[0146] In response to the component offset calibration parameter measurement value corresponding to the at least one component being within the component offset calibration parameter qualified domain, the at least one component is an independent offset qualified component;

[0147] In response to the components in the connector being all independent offset qualified components, the offset qualified judgment result is qualified, otherwise, the offset qualified judgment result is unqualified;

[0148] In response to the presence of a plurality of similar deflectable components, performing the composite deflection qualification judgment to obtain the composite deflection qualification judgment result;

[0149] In response to the composite offset qualified judgment result being qualified, the offset qualified judgment result is qualified, otherwise, the offset qualified judgment result is unqualified.

[0150] Specifically, this embodiment can effectively identify the offset problem of a single component based on independent offset qualified judgment, and can consider the offset effects of multiple components and make a comprehensive judgment based on composite offset qualified judgment. This application enhances the detection capability of multiple similar offset components by combining independent offset qualified judgment and composite offset qualified judgment, and can more accurately identify poor contact problems caused by multiple offset components, improve the comprehensiveness and accuracy of detection, reduce the risk of missed judgment, and provide a reliable basis for connector fault location.

[0151] In one embodiment, the offset calibration parameter qualified domain includes a component superposition offset qualified domain, and in response to the presence of multiple similar offsettable components, the composite offset qualified judgment is performed to obtain the composite offset qualified judgment result, including:

[0152] According to the component information in the connector and in combination with the corresponding component offset measurement data, the independent offset judgment is performed on all components in the connector respectively;

[0153] In response to any component in the connector being an independent offset qualified component, a similar offset superposition judgment is performed, including:

[0154] Acquire the types of the multiple similar deflectable components, and classify and group the component deflection measurement data according to the types of the multiple similar deflectable components to obtain a classified and grouped measurement form, wherein the classified and grouped measurement form at least includes: component type, component number, and component deflection calibration parameter measurement value;

[0155] Calibrate the offset direction of the component offset calibration parameter measurement value in the classification and grouping measurement form to obtain the component offset;

[0156] According to the component type and the component number, the component offsets of the multiple similar shiftable components are counted respectively, and based on the component offset superposition formula, the component superposition offsets of the multiple similar shiftable components of the same component type are calculated respectively, wherein the component offset superposition formula is: in, represents the component stacking offset of the jth component type, represents the component offset of the i-th component number of the j-th component type, Indicates the offset direction of the component offset of the i-th component number of the j-th component type, represents the absolute value of the component offset of the i-th component number of the j-th component type, and N represents the number of multiple similar offsettable components of the j-th component type;

[0157] According to the component stacking offsets corresponding to the multiple similar shiftable components of the same component type, a comparison is performed in combination with the component stacking offset qualified domain corresponding to the same component type, and in response to the component stacking offsets being within the component stacking offset qualified domain, it is determined that the multiple similar shiftable components of the same component type are all stacking offset qualified components;

[0158] In response to the multiple similar deflectable components in the connector being all superimposed deflection qualified components, the composite deflection qualified judgment result of the connector is qualified.

[0159] It is worth noting that, in one embodiment, the component stacking offset qualified domain corresponding to the same component type can be obtained based on the component offset inspection parameter qualified domain corresponding to the same type of offsettable component based on a statistical analysis method, including:

[0160] Get the component offset inspection parameter qualified domain corresponding to the type of the same type of offsettable component, recorded as Among them, p a,spec Indicates the component offset inspection parameter tolerance range corresponding to the type A offset component. is the standard deviation of the component offset inspection parameter corresponding to the type A offset component, is the mean value of the component offset calibration parameter corresponding to the type a offset component, δ a Indicates the dynamic adjustment coefficient of the component offset inspection parameter corresponding to the type A offset component;

[0161] According to the standard deviation of the component offset inspection parameters corresponding to the Class A offsettable components, the superimposed standard deviation of the component offset inspection parameters corresponding to the Class A offsettable components is calculated based on the following formula: Among them, σ total,a It represents the superimposed standard deviation of the component offset inspection parameters corresponding to the type a offset component, and NUM represents the number of type a offset components;

[0162] According to the superposition standard deviation of the component offset inspection parameters corresponding to the class A shiftable component, the confidence interval of the normal distribution is used to represent the component superposition offset qualified domain corresponding to the class A shiftable component, wherein the 95% confidence interval, i.e., 2 times the standard deviation range, is preferred to obtain the component superposition offset qualified domain corresponding to the class A shiftable component, which is recorded as: [-2·σ total,a ,2·σ total,a ]; By analogy, the component superposition offset qualified domain corresponding to any type of shiftable component can be obtained, which can be used for the same type of offset superposition judgment of the corresponding type of shiftable components.

[0163] Specifically, this embodiment fully considers the offset effect of each component through the superposition calculation of component offsets; at the same time, through classification and grouping measurement and offset superposition formula, the composite offset of multiple components can be effectively identified, avoiding the misjudgment that may be caused by judging the offset individually, thereby not only improving the ability to identify poor contact problems caused by multiple components, but also improving the accuracy and stability of offset judgment, ensuring that the overall performance of the equipment is effectively guaranteed.

[0164] It is worth noting that, in one embodiment, the qualified domain of connector inspection parameters obtained based on a connector detection method specifically includes: the qualified domain of connector tin foot width, which is 0.22±0.03mm; the qualified domain of connector PIN needle width, which is 0.1-0.15mm; the qualified domain of connector PIN needle spring height alignment, which is 0-0.15mm; the qualified domain of connector positioning column diameter, which is 0.1±0.03mm; the qualified domain of the center distance between the connector positioning column and the mainboard positioning hole, which is 20.025±0.05mm; the qualified domain of the positioning hole width size required for the connector to be connected, which is 1.76±0.03mm; the qualified domain of gold finger offset alignment, which is 0-0.075mm; the qualified domain of the pad offset connected to the connector, which is 0.35±0.05mm; the qualified domain of the stamped end bullet height alignment of the connector, which is 0-0.06mm; the qualified domain of the finished connector spring height alignment, which is 0-0.15mm.

[0165] It should be understood that although Figure 2 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Figure 2 At least part of the steps may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least part of the sub-steps or stages of other steps.

[0166] In one embodiment, Figure 3 As shown, a connector detection device is provided, including: a standard inspection parameter qualified domain generation module, a device measurement module, a size qualified judgment module, a displacement qualified judgment module and a poor contact judgment module, wherein:

[0167] A standard inspection parameter qualified domain generation module is used to obtain the historical inspection data of the connector, perform standard inspection parameter analysis, and obtain the connector standard inspection parameter qualified domain, wherein the connector standard inspection parameter qualified domain includes the connector size standard inspection parameter qualified domain and the connector offset standard inspection parameter qualified domain;

[0168] A device measurement module, used to obtain connector size measurement data and connector offset measurement data of the connector;

[0169] A size qualification judgment module, used to make a size qualification judgment based on the connector size measurement data and the connector size inspection parameter qualification domain;

[0170] An offset qualified judgment module is used to perform offset qualified judgment based on the connector offset measurement data and the connector offset inspection parameter qualified domain, wherein the offset qualified judgment includes at least one of the following: independent offset qualified judgment and composite offset qualified judgment;

[0171] The poor contact judgment module is used to judge that the connector has poor contact in response to one or more of the results of the size qualification judgment and the offset qualification judgment being unqualified.

[0172] The inspection parameter qualified domain generation module is also used to obtain the connector historical inspection data to obtain the historical inspection data corresponding to the at least one component, wherein the historical inspection data corresponding to the at least one component includes: a component size inspection parameter historical data set, a component offset inspection parameter historical data set; based on the component size inspection parameter historical data set, the mean value of the component size inspection parameter and the standard deviation of the component size inspection parameter corresponding to the at least one component are calculated; based on the component size inspection parameter mean and the standard deviation of the component size inspection parameter, the component size inspection parameter tolerance range corresponding to the at least one component is obtained; based on the component size inspection parameter tolerance range, the component size inspection parameter qualified domain of the at least one component is obtained, and then the connector size inspection parameter qualified domain is obtained ; According to the component offset inspection parameter historical data set, the mean value of the component offset inspection parameters and the standard deviation of the component offset inspection parameters corresponding to the at least one component are calculated; According to the component offset inspection parameter historical data set, based on correlation analysis, the correlation strength between the component offset inspection parameters and the component size inspection parameters corresponding to the at least one component is obtained; According to the component offset inspection parameter mean value and the component offset inspection parameter standard deviation, combined with the correlation strength between the component offset inspection parameters and the component size inspection parameters, the component offset inspection parameter tolerance range corresponding to the at least one component is obtained; According to the component offset inspection parameter tolerance range, the component offset inspection parameter qualified domain corresponding to the at least one component is obtained, and then the connector offset inspection parameter qualified domain is obtained.

[0173] The equipment measurement module is also used to obtain component size inspection parameters and component offset inspection parameters corresponding to at least one component included in the connector; set corresponding size measurement dimensions according to the component size inspection parameters; set corresponding offset measurement dimensions according to the component offset inspection parameters; select corresponding measurement tools according to the size measurement dimensions and the offset measurement dimensions, measure and record the connector, and obtain connector size measurement data and connector offset measurement data of the connector.

[0174] The size qualification judgment module is also used to obtain component size measurement data corresponding to at least one component included in the connector according to the connector size measurement data; extract the component size measurement data according to the component size inspection parameters corresponding to the at least one component to obtain the component size inspection parameter measurement value corresponding to the at least one component; obtain the component size inspection parameter qualification domain corresponding to the at least one component; in response to the component size inspection parameter measurement value corresponding to the at least one component being in the component size inspection parameter qualification domain, the at least one component is a size-qualified component; in response to the components in the connector being all size-qualified components, the result of the size qualification judgment is qualified, otherwise, the result of the size qualification judgment is unqualified.

[0175] The offset qualified judgment module is also used to obtain component information of the connector to determine whether there are multiple similar offsettable components; in response to the absence of multiple similar offsettable components, the independent offset qualified judgment is performed, wherein the independent offset qualified judgment includes: obtaining component offset measurement data corresponding to at least one component included in the connector according to the connector offset measurement data; extracting the component offset measurement data according to the component offset inspection parameter corresponding to the at least one component to obtain the component offset inspection parameter measurement value corresponding to the at least one component; obtaining the component offset inspection parameter qualified domain corresponding to the at least one component; in response to the component offset inspection parameter measurement value corresponding to the at least one component being in the component offset inspection parameter qualified domain, the at least one component is an independent offset qualified component; in response to the components in the connector being all independent offset qualified components, the result of the offset qualified judgment is qualified, otherwise, the result of the offset qualified judgment is unqualified; in response to the existence of multiple similar offsettable components, the composite offset qualified judgment is performed to obtain the composite offset qualified judgment result; in response to the composite offset qualified judgment result being qualified, the result of the offset qualified judgment is qualified, otherwise, the offset qualified judgment result is unqualified.

[0176] The specific definition of the connector detection device can be found in the definition of the connector detection method above, which will not be repeated here. Each module in the above connector detection device can be implemented in whole or in part by software, hardware and a combination thereof. The above modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0177] In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as follows: Figure 4As shown. The computer device includes a processor, a memory, a network interface and a database connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store connector detection data. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a connector detection method is implemented.

[0178] Those skilled in the art will understand that Figure 4 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0179] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the following steps when executing the computer program:

[0180] Acquire historical inspection data of the connector, perform standard inspection parameter analysis, and obtain a connector standard inspection parameter qualified domain, wherein the connector standard inspection parameter qualified domain includes a connector size standard inspection parameter qualified domain and a connector offset standard inspection parameter qualified domain;

[0181] Measuring the connector to obtain connector size measurement data and connector offset measurement data of the connector;

[0182] Based on the connector size measurement data and in combination with the connector size inspection parameter qualification domain, a size qualification judgment is performed;

[0183] Based on the connector offset measurement data, combined with the connector offset inspection parameter qualified domain, an offset qualified judgment is performed, wherein the offset qualified judgment includes at least one of the following: independent offset qualified judgment, composite offset qualified judgment;

[0184] In response to the result of one or more of the size qualification judgment and the offset qualification judgment being unqualified, it is determined that the connector has poor contact.

[0185] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented:

[0186] Acquire historical inspection data of the connector, perform standard inspection parameter analysis, and obtain a connector standard inspection parameter qualified domain, wherein the connector standard inspection parameter qualified domain includes a connector size standard inspection parameter qualified domain and a connector offset standard inspection parameter qualified domain;

[0187] Measuring the connector to obtain connector size measurement data and connector offset measurement data of the connector;

[0188] Based on the connector size measurement data and in combination with the connector size inspection parameter qualification domain, a size qualification judgment is performed;

[0189] Based on the connector offset measurement data, combined with the connector offset inspection parameter qualified domain, an offset qualified judgment is performed, wherein the offset qualified judgment includes at least one of the following: independent offset qualified judgment, composite offset qualified judgment;

[0190] In response to the result of one or more of the size qualification judgment and the offset qualification judgment being unqualified, it is determined that the connector has poor contact.

[0191] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0192] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0193] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A connector detection method, characterized in that: The method comprises: Acquire historical inspection data of the connector, perform standard inspection parameter analysis, and obtain a connector standard inspection parameter qualified domain, wherein the connector standard inspection parameter qualified domain includes a connector size standard inspection parameter qualified domain and a connector offset standard inspection parameter qualified domain; Measuring the connector to obtain connector size measurement data and connector offset measurement data of the connector; Based on the connector size measurement data and in combination with the connector size inspection parameter qualification domain, a size qualification judgment is performed; Based on the connector offset measurement data, combined with the connector offset inspection parameter qualified domain, an offset qualified judgment is performed, wherein the offset qualified judgment includes at least one of the following: independent offset qualified judgment, composite offset qualified judgment; In response to the result of one or more of the size qualification judgment and the offset qualification judgment being unqualified, it is determined that the connector has poor contact.

2. A connector detection method according to claim 1, characterized in that: The connector includes at least one component, and the at least one component corresponds to a component size inspection parameter and a component offset inspection parameter. The acquiring of historical inspection data of the connector, performing standard inspection parameter analysis, and obtaining a connector inspection parameter qualified domain includes: Acquire the connector historical detection data to obtain the historical detection data corresponding to the at least one component, wherein the historical detection data corresponding to the at least one component includes: a component size inspection parameter historical data set and a component offset inspection parameter historical data set; Calculating a mean value and a standard deviation of the component size inspection parameter corresponding to the at least one component according to the component size inspection parameter historical data set; Obtaining a tolerance range of the component size inspection parameter corresponding to the at least one component according to the component size inspection parameter mean and the component size inspection parameter standard deviation; According to the tolerance range of the component size inspection parameter, a qualified domain of the component size inspection parameter of the at least one component is obtained, and then the qualified domain of the connector size inspection parameter is obtained; Calculating a component offset calibration parameter mean and a component offset calibration parameter standard deviation corresponding to the at least one component according to the component offset calibration parameter historical data set; According to the component offset inspection parameter historical data set, based on correlation analysis, obtain the correlation strength between the component offset inspection parameter and the component size inspection parameter corresponding to the at least one component; According to the mean value of the component offset calibration parameter and the standard deviation of the component offset calibration parameter, combined with the correlation strength between the component offset calibration parameter and the component size calibration parameter, a component offset calibration parameter tolerance range corresponding to the at least one component is obtained; According to the component offset inspection parameter tolerance range, a component offset inspection parameter qualified domain corresponding to the at least one component is obtained, and then the connector offset inspection parameter qualified domain is obtained.

3. A connector detection method according to claim 2, characterized in that: Obtaining a tolerance range of the component size inspection parameter corresponding to the at least one component according to the component size inspection parameter mean and the component size inspection parameter standard deviation, including: Obtaining a component size calibration parameter standard deviation and a component offset calibration parameter standard deviation corresponding to the at least one component; Obtaining a mean value of a component size calibration parameter and a mean value of a component offset calibration parameter corresponding to the at least one component; According to the mean value of the component dimension inspection parameter and the standard deviation of the component dimension inspection parameter, a component dimension inspection parameter tolerance range corresponding to the at least one component is obtained, wherein the component dimension inspection parameter tolerance range is expressed as: Among them, w i,spec represents the tolerance range of the component size inspection parameter corresponding to the i-th component, represents the standard deviation of the component size inspection parameter corresponding to the i-th component, represents the mean value of the component size inspection parameter corresponding to the i-th component; According to the component offset calibration parameter mean and the component offset calibration parameter standard deviation, combined with the correlation strength between the component offset calibration parameter and the component size calibration parameter, a component offset calibration parameter tolerance range corresponding to the at least one component is obtained, including: Selecting a number of historical samples from the component size calibration parameter historical data set and the component offset calibration parameter historical data set respectively; According to the plurality of historical samples, the dimension offset correlation coefficient corresponding to the at least one component is calculated according to the component dimension calibration parameter standard deviation and the component offset calibration parameter standard deviation, wherein the dimension offset correlation coefficient is obtained based on the following formula: in, represents the kth historical sample of the component size inspection parameter corresponding to the i-th component, p j represents the kth historical sample of the component size inspection parameter corresponding to the jth component, n represents the number of selected historical samples, represents the dimension offset correlation coefficient between the component dimension inspection parameter corresponding to the i-th component and the component offset inspection parameter corresponding to the j-th component, It represents the standard deviation of the component offset inspection parameter corresponding to the jth component. represents the mean value of the component offset calibration parameter corresponding to the jth component; The size offset correlation coefficient is obtained, and a dynamic adjustment coefficient corresponding to the at least one component is generated, wherein the dynamic adjustment coefficient is obtained based on the following formula: Among them, δ j represents the dynamic adjustment coefficient of the component offset calibration parameter corresponding to the jth component, α represents the adjustment factor, represents the absolute value of the dimension offset correlation coefficient between the component dimension inspection parameter corresponding to the i-th component and the component offset inspection parameter corresponding to the j-th component, and m represents the number of the component dimension inspection parameters; According to the component offset calibration parameter mean and the component offset calibration parameter standard deviation, combined with the dynamic adjustment coefficient, the component offset calibration parameter tolerance range corresponding to the at least one component is obtained, wherein the component offset calibration parameter tolerance range is expressed as: Among them, p j,spec Indicates the component offset inspection parameter tolerance range corresponding to the j-th component.

4. A connector detection method according to claim 2, characterized in that: Measuring the connector to obtain connector size measurement data and connector offset measurement data of the connector includes: According to at least one component included in the connector, obtaining a component size inspection parameter and a component offset inspection parameter corresponding to the at least one component; According to the component dimension inspection parameters, set the corresponding dimension measurement dimensions; According to the component offset calibration parameter, a corresponding offset measurement dimension is set; According to the size measurement dimension and the offset measurement dimension, a corresponding measuring tool is selected to measure and record the connector to obtain connector size measurement data and connector offset measurement data of the connector.

5. A connector detection method according to claim 2, characterized in that: Based on the connector size measurement data and in combination with the connector size inspection parameter qualification domain, a size qualification judgment is performed, including: Obtaining component size measurement data corresponding to at least one component included in the connector according to the connector size measurement data; Extracting the component size measurement data according to the component size inspection parameter corresponding to the at least one component to obtain a component size inspection parameter measurement value corresponding to the at least one component; Obtain a qualified domain of component dimension inspection parameters corresponding to the at least one component; In response to the component dimension inspection parameter measurement value corresponding to the at least one component being within the component dimension inspection parameter qualified domain, the at least one component is a dimension qualified component; In response to the fact that all components in the connector are qualified in size, the result of the size qualification judgment is qualified, otherwise, the result of the size qualification judgment is unqualified.

6. A connector detection method according to claim 2, characterized in that: Based on the connector offset measurement data and in combination with the connector offset inspection parameter qualified domain, an offset qualified judgment is performed, including: Obtaining component information of the connector to determine whether there are multiple similar deflectable components; In response to the absence of a plurality of similar deflectable components, performing the independent deflection qualification determination, wherein the independent deflection qualification determination comprises: Obtaining component offset measurement data corresponding to at least one component included in the connector according to the connector offset measurement data; Extracting the component offset measurement data according to the component offset calibration parameter corresponding to the at least one component to obtain a component offset calibration parameter measurement value corresponding to the at least one component; Obtain a component offset calibration parameter qualified domain corresponding to the at least one component; In response to the component offset calibration parameter measurement value corresponding to the at least one component being within the component offset calibration parameter qualified domain, the at least one component is an independent offset qualified component; In response to the components in the connector being all independent offset qualified components, the offset qualified judgment result is qualified, otherwise, the offset qualified judgment result is unqualified; In response to the presence of a plurality of similar deflectable components, performing the composite deflection qualification judgment to obtain the composite deflection qualification judgment result; In response to the composite offset qualified judgment result being qualified, the offset qualified judgment result is qualified, otherwise, the offset qualified judgment result is unqualified.

7. A connector detection method according to claim 6, characterized in that: The offset calibration parameter qualified domain includes a component superposition offset qualified domain. In response to the presence of multiple similar offsettable components, the composite offset qualified judgment is performed to obtain the composite offset qualified judgment result, including: According to the component information in the connector and in combination with the corresponding component offset measurement data, the independent offset judgment is performed on all components in the connector respectively; In response to any component in the connector being an independent offset qualified component, a similar offset superposition judgment is performed, including: Acquire the types of the multiple similar deflectable components, and classify and group the component deflection measurement data according to the types of the multiple similar deflectable components to obtain a classified and grouped measurement form, wherein the classified and grouped measurement form at least includes: component type, component number, and component deflection calibration parameter measurement value; Calibrate the offset direction of the component offset calibration parameter measurement value in the classification and grouping measurement form to obtain the component offset; According to the component type and the component number, the component offsets of the multiple similar shiftable components are counted respectively, and based on the component offset superposition formula, the component superposition offsets of the multiple similar shiftable components of the same component type are calculated respectively, wherein the component offset superposition formula is: in, represents the component stacking offset of the jth component type, represents the component offset of the i-th component number of the j-th component type, Indicates the offset direction of the component offset of the i-th component number of the j-th component type, represents the absolute value of the component offset of the i-th component number of the j-th component type, and N represents the number of multiple similar offsettable components of the j-th component type; According to the component stacking offsets corresponding to the multiple similar shiftable components of the same component type, a comparison is performed in combination with the component stacking offset qualified domain corresponding to the same component type, and in response to the component stacking offsets being within the component stacking offset qualified domain, it is determined that the multiple similar shiftable components of the same component type are all stacking offset qualified components; In response to the multiple similar deflectable components in the connector being all superimposed deflection qualified components, the composite deflection qualified judgment result of the connector is qualified.

8. A connector detection device, characterized in that: The device comprises: A standard inspection parameter qualified domain generation module is used to obtain the historical inspection data of the connector, perform standard inspection parameter analysis, and obtain the connector standard inspection parameter qualified domain, wherein the connector standard inspection parameter qualified domain includes the connector size standard inspection parameter qualified domain and the connector offset standard inspection parameter qualified domain; A device measurement module, used to obtain connector size measurement data and connector offset measurement data of the connector; A size qualification judgment module, used to make a size qualification judgment based on the connector size measurement data and the connector size inspection parameter qualification domain; An offset qualified judgment module is used to perform offset qualified judgment based on the connector offset measurement data and the connector offset inspection parameter qualified domain, wherein the offset qualified judgment includes at least one of the following: independent offset qualified judgment and composite offset qualified judgment; The poor contact judgment module is used to judge that the connector has poor contact in response to one or more of the results of the size qualification judgment and the offset qualification judgment being unqualified.

9. A computer device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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