Testing method and device for residual resistivity of composite copper coating

Abstract

The present application relates to the field of material testing technology and provides a method and device for testing the residual resistivity of a copper coating on a composite material. The method comprises performing a microstructure scanning process on a composite material to obtain a microstructure image of the composite material, and inputting the microstructure image into a preset copper coating extraction model to obtain a three-dimensional model of the copper coating of the composite material; performing a finite element segmentation process on the three-dimensional model to obtain a finite element model; performing a residual resistivity test on each finite element unit of the finite element model to obtain an initial residual resistivity corresponding to the finite element unit; and determining a target residual resistivity of the copper coating based on each of the initial residual resistivities. This method overcomes the defect that traditional methods for testing the residual resistivity of copper coatings on composite materials are easily affected by interference from the base material, resulting in large measurement errors.

Description

Technical Field

[0001] The present application relates to the technical field of material detection, and in particular to a method and device for testing the residual resistivity of a copper coating on a composite material. Background Art

[0002] With the development of modern industry, composite materials are widely used in aerospace, electronics, automobile manufacturing and other fields due to their advantages such as light weight, high strength and corrosion resistance. In order to improve the conductivity and anti-electromagnetic interference ability of composite materials, metal coating is often applied to their surface.

[0003] In practical applications, understanding the residual resistivity of copper coatings is crucial for evaluating the electrical conductivity, reliability, and service life of composite materials. Residual resistivity, the ratio of a material's resistance at room temperature to its resistance at 4.2K, is a key parameter that reflects the impact of microscopic factors such as internal defects, impurities, and grain boundaries on conductivity.

[0004] Traditional methods for testing the residual resistivity of copper coatings on composite materials include the four-probe method, the Hall effect method, and the AC impedance method. However, these methods are easily affected by the interference of the substrate material during testing, resulting in large measurement errors. Summary of the Invention

[0005] The present application provides a method and device for testing the residual resistivity of a composite copper coating to solve the problems raised by the above background technology.

[0006] In a first aspect, the present application provides a method for testing the residual resistivity of a composite copper coating, comprising:

[0007] Performing microstructural scanning on the composite material to obtain a microstructural image of the composite material, and inputting the microstructural image into a preset copper plating layer extraction model to obtain a three-dimensional model of the copper plating layer of the composite material; wherein the copper plating layer extraction model is a pre-trained convolutional neural network;

[0008] Performing finite element segmentation processing on the three-dimensional model to obtain a finite element model;

[0009] For each finite element unit of the finite element model, perform a residual resistivity test on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit;

[0010] A target residual resistivity of the copper plating layer is determined based on the respective initial residual resistivities.

[0011] In a possible implementation, performing a residual resistivity test on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit includes:

[0012] extracting the finite element unit from the finite element model;

[0013] Performing a multi-point residual resistivity test on the finite element unit to obtain a plurality of residual resistivities corresponding to the finite element unit;

[0014] An initial residual resistivity of the finite element unit is determined based on a plurality of residual resistivities corresponding to the finite element unit.

[0015] In a possible implementation, performing a multi-point residual resistivity test on the finite element unit to obtain multiple residual resistivities corresponding to the finite element unit includes:

[0016] Determine a first point pair on the surface of the finite element unit; the two points of the first point pair are the two points on the finite element unit that are farthest apart;

[0017] Decreasing the distance between the two points of the first point pair based on a preset distance decreasing index to obtain multiple target distances;

[0018] For each target distance, determining a second point pair corresponding to the target distance on the surface of the finite element unit; wherein the distance between two points in the second point pair is the target distance;

[0019] The residual resistivity corresponding to each of the point pairs is tested respectively to obtain a plurality of residual resistivities corresponding to the finite element units.

[0020] In a possible implementation, respectively testing the residual resistivity corresponding to each of the point pairs to obtain multiple residual resistivities corresponding to the finite element unit includes:

[0021] For each of the point pairs, a virtual current lead and a virtual voltage sensor are provided at two points of the point pair, and the residual resistivity corresponding to the point pair is obtained based on the virtual current lead and the virtual voltage sensor;

[0022] Wherein, obtaining the residual resistivity corresponding to the point pair based on the virtual current lead and the virtual voltage sensor includes:

[0023] At room temperature, a virtual constant current source is used to pass current through the virtual current leads. 1A current, and obtain the two ends of the point pair through the virtual voltage sensor. a first voltage value corresponding to the 1A condition, and an average of the absolute values of the two first voltage values as the first target voltage;

[0024] At a low temperature of 4.2K, a virtual constant current source is used to pass current through the virtual current leads. 1A current, and obtain the two ends of the point pair through the virtual voltage sensor. a second voltage value corresponding to the 1A condition, and taking the average of the absolute values of the two second voltage values as the second target voltage;

[0025] The ratio of the first target voltage to the second target voltage is used as the residual resistivity corresponding to the point pair.

[0026] In a possible implementation, determining the target residual resistivity of the copper plating layer based on each of the initial residual resistivities includes:

[0027] Obtaining a standard deviation between each of the initial residual resistivities, and comparing the standard deviation with a preset standard deviation;

[0028] If the standard deviation is less than the preset standard deviation, taking the average value of the initial residual resistivities as the target residual resistivity;

[0029] If the standard deviation is not less than the preset standard deviation, determining the median of each of the initial residual resistivities;

[0030] For each of the initial residual resistivities, calculating the difference between the initial residual resistivity and the median, and comparing the absolute value of the difference with a preset absolute value; if the absolute value of the difference is less than the preset absolute value, determining the initial residual resistivity to be a target initial residual resistivity;

[0031] The average value of the target initial residual resistivities is taken as the target residual resistivity.

[0032] In a possible implementation, the method further includes:

[0033] The microstructure image is bound to the target residual resistivity to obtain a binding result, and the binding result is stored in a preset database.

[0034] In a possible implementation, binding the microstructure image with the target residual resistivity to obtain a binding result includes:

[0035] Performing matrix coding on the microstructure based on a preset matrix coding method to obtain a coding matrix; wherein each row vector of the coding matrix includes letters and numbers;

[0036] Constructing a geometric progression with the numerical value corresponding to the target residual resistivity as the first term; the number of numerical values in the geometric progression is consistent with the number of row vectors in the encoding matrix;

[0037] For each row vector of the encoding matrix, determine a target value corresponding to the row vector in the geometric progression, and multiply the target value by the row vector to obtain a target row vector corresponding to the row vector; wherein the value corresponding to the row number corresponding to the row vector in the encoding matrix is consistent with the value corresponding to the sequence corresponding to the target value in the geometric progression;

[0038] The target row vectors are arranged in order from top to bottom based on the positions of the row vectors corresponding to the target row vectors in the encoding matrix to obtain a target encoding matrix; the target encoding matrix is the binding result.

[0039] In a second aspect, the present application provides a device for testing the residual resistivity of a composite copper coating, comprising:

[0040] an extraction module for performing microstructural scanning on the composite material to obtain a microstructural image of the composite material, and inputting the microstructural image into a preset copper plating layer extraction model to obtain a three-dimensional model of the copper plating layer of the composite material; wherein the copper plating layer extraction model is a pre-trained convolutional neural network;

[0041] a segmentation processing module, configured to perform finite element segmentation processing on the three-dimensional model to obtain a finite element model;

[0042] A testing module, configured to perform a residual resistivity test on each finite element unit of the finite element model to obtain an initial residual resistivity corresponding to the finite element unit;

[0043] A determination module is configured to determine a target residual resistivity of the copper plating layer based on each of the initial residual resistivities.

[0044] The present application provides a method and device for testing the residual resistivity of a copper coating on a composite material. The method comprises: performing microstructural scanning on a composite material to obtain a microstructural image of the composite material, and inputting the microstructural image into a preset copper coating extraction model to obtain a three-dimensional model of the copper coating of the composite material; wherein the copper coating extraction model is a pre-trained convolutional neural network; performing finite element segmentation on the three-dimensional model to obtain a finite element model; performing residual resistivity testing on each finite element unit of the finite element model to obtain an initial residual resistivity corresponding to the finite element unit; and determining a target residual resistivity of the copper coating based on each initial residual resistivity. This method, on the one hand, overcomes the defect that traditional methods for testing the residual resistivity of copper coatings on composite materials are easily affected by the interference of the base material, resulting in large measurement errors, and helps to improve the accuracy of the test results. On the other hand, it realizes non-contact measurement and can protect the integrity of the material. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0046] Figure 1 A schematic flow chart of a method for testing the residual resistivity of a composite copper coating provided in an embodiment of the present application;

[0047] Figure 2 A schematic block diagram of the structure of a device for testing the residual resistivity of a composite copper coating provided in an embodiment of the present application;

[0048] Figure 3 A schematic block diagram of the structure of a terminal device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0049] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0050] The flowcharts shown in the accompanying drawings are for illustrative purposes only and do not necessarily include all contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may be decomposed, combined, or partially merged, so the actual execution order may vary depending on the actual situation.

[0051] It should also be understood that the terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit the present application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0052] It should be further understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0053] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0054] See also Figure 1 , Figure 1 A flow chart of a method for testing the residual resistivity of a composite copper coating provided in an embodiment of the present application is shown in FIG. Figure 1 As shown, the method for testing the residual resistivity of the composite material copper plating layer provided in the embodiment of the present application includes steps S1 to S4.

[0055] Step S1: performing microstructure scanning on the composite material to obtain a microstructure image of the composite material, and inputting the microstructure image into a preset copper plating layer extraction model to obtain a three-dimensional model of the copper plating layer of the composite material; wherein the copper plating layer extraction model is a pre-trained convolutional neural network.

[0056] Specifically, a synchrotron radiation X-ray microscope or a focused ion beam scanning electron microscope is used to perform a global scan on the composite material to obtain the microstructure image.

[0057] Step S2: performing finite element segmentation processing on the three-dimensional model to obtain a finite element model.

[0058] Specifically, a preset adaptive mesh partitioning algorithm is used to perform finite element segmentation processing on the three-dimensional model to obtain a finite element model.

[0059] Step S3: performing a residual resistivity test on each finite element unit of the finite element model to obtain an initial residual resistivity corresponding to the finite element unit.

[0060] Specifically, performing a residual resistivity test on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit includes the following steps:

[0061] extracting the finite element unit from the finite element model;

[0062] Performing a multi-point residual resistivity test on the finite element unit to obtain a plurality of residual resistivities corresponding to the finite element unit;

[0063] The initial residual resistivity of the finite element unit is determined based on the multiple residual resistivities corresponding to the finite element unit. Specifically, the average value of the multiple residual resistivities corresponding to the finite element unit is determined as the residual resistivity of the finite element unit.

[0064] The multi-point residual resistivity test of the finite element unit is performed to obtain a plurality of residual resistivities corresponding to the finite element unit, comprising the following steps:

[0065] Determine a first point pair on the surface of the finite element unit; the two points of the first point pair are the two points on the finite element unit that are farthest apart;

[0066] The distance between the two points of the first point pair is decremented based on a preset distance decrement index to obtain multiple target distances; for example, if the distance between the two points of the first point pair is 10 μm and the distance decrement index is 2 μm, the target distances include 8 μm, 6 μm, 4 μm, and 2 μm;

[0067] For each target distance, determining a second point pair corresponding to the target distance on the surface of the finite element unit; wherein the distance between two points in the second point pair is the target distance;

[0068] The residual resistivity corresponding to each of the point pairs is tested respectively to obtain a plurality of residual resistivities corresponding to the finite element unit; it can be understood that the point pairs include the above-mentioned first point pair and each second point pair.

[0069] The step of respectively testing the residual resistivity corresponding to each of the point pairs to obtain a plurality of residual resistivities corresponding to the finite element unit comprises the following steps:

[0070] For each of the point pairs, a virtual current lead and a virtual voltage sensor are provided at two points of the point pair, and the residual resistivity corresponding to the point pair is obtained based on the virtual current lead and the virtual voltage sensor;

[0071] Wherein, obtaining the residual resistivity corresponding to the point pair based on the virtual current lead and the virtual voltage sensor includes:

[0072] At room temperature, a virtual constant current source is used to pass current through the virtual current leads. 1A current, and obtain the two ends of the point pair through the virtual voltage sensor. a first voltage value corresponding to the 1A condition, and an average of the absolute values of the two first voltage values as the first target voltage;

[0073] At a low temperature of 4.2K, a virtual constant current source is used to pass current through the virtual current leads. 1A current, and obtain the two ends of the point pair through the virtual voltage sensor. a second voltage value corresponding to the 1A condition, and taking the average of the absolute values of the two second voltage values as the second target voltage;

[0074] The ratio of the first target voltage to the second target voltage is used as the residual resistivity corresponding to the point pair.

[0075] It can be understood that step S3 helps to improve the test accuracy and the reliability of the test results by determining multiple point pairs on the finite element unit and performing residual resistivity tests on each of the point pairs.

[0076] Step S4: determining a target residual resistivity of the copper plating layer based on each of the initial residual resistivities.

[0077] Specifically, step S4 includes the following steps:

[0078] Obtaining a standard deviation between each of the initial residual resistivities, and comparing the standard deviation with a preset standard deviation;

[0079] If the standard deviation is less than the preset standard deviation, taking the average value of the initial residual resistivities as the target residual resistivity;

[0080] If the standard deviation is not less than the preset standard deviation, determining the median of each of the initial residual resistivities;

[0081] For each of the initial residual resistivities, calculating the difference between the initial residual resistivity and the median, and comparing the absolute value of the difference with a preset absolute value; if the absolute value of the difference is less than the preset absolute value, determining the initial residual resistivity to be a target initial residual resistivity;

[0082] The average value of the target initial residual resistivities is taken as the target residual resistivity.

[0083] It can be understood that step S4 can effectively eliminate the influence of abnormal values and improve the accuracy of the target residual resistivity.

[0084] The method provided in this embodiment, on the one hand, overcomes the defect that the traditional composite copper plating residual resistivity test method is easily affected by the interference of the base material, resulting in large measurement errors, and helps to improve the accuracy of the test results. On the other hand, it realizes non-contact measurement and can protect the integrity of the material.

[0085] In some embodiments, the method further comprises the following steps:

[0086] The microstructure image is bound to the target residual resistivity to obtain a binding result, and the binding result is stored in a preset database.

[0087] The step of binding the microstructure image with the target residual resistivity to obtain a binding result comprises the following steps:

[0088] Performing matrix coding on the microstructure based on a preset matrix coding method to obtain a coding matrix; wherein each row vector of the coding matrix includes letters and numbers;

[0089] Constructing a geometric progression with the numerical value corresponding to the target residual resistivity as the first term; the number of numerical values in the geometric progression is consistent with the number of row vectors in the encoding matrix;

[0090] For each row vector of the encoding matrix, determine a target value corresponding to the row vector in the geometric progression, and multiply the target value by the row vector to obtain a target row vector corresponding to the row vector; wherein the value corresponding to the row number corresponding to the row vector in the encoding matrix is consistent with the value corresponding to the sequence corresponding to the target value in the geometric progression;

[0091] The target row vectors are arranged in order from top to bottom based on the positions of the row vectors corresponding to the target row vectors in the encoding matrix to obtain a target encoding matrix; the target encoding matrix is the binding result.

[0092] The method provided in this embodiment, on the one hand, facilitates data management and traceability by storing the binding relationship in a preset database, and provides a theoretical basis for automating the test method of the residual resistivity of the composite material copper plating. On the other hand, when the microstructure image is bound to the target residual resistivity, the microstructure image and the target residual resistivity are automatically encrypted, thereby improving data security.

[0093] See also Figure 2 , Figure 2 This is a schematic block diagram of the structure of the test device 100 for the residual resistivity of the composite copper coating provided in an embodiment of the present application, as shown in FIG. Figure 2 As shown, the test device 100 for the residual resistivity of a composite copper coating provided in an embodiment of the present application includes:

[0094] The extraction module 110 is used to perform microstructure scanning on the composite material to obtain a microstructure image of the composite material, and input the microstructure image into a preset copper plating extraction model to obtain a three-dimensional model of the copper plating of the composite material; wherein the copper plating extraction model is a pre-trained convolutional neural network.

[0095] The segmentation processing module 120 is used to perform finite element segmentation processing on the three-dimensional model to obtain a finite element model.

[0096] The testing module 130 is configured to perform a residual resistivity test on each finite element unit of the finite element model to obtain an initial residual resistivity corresponding to the finite element unit.

[0097] The determination module 140 is configured to determine a target residual resistivity of the copper plating layer based on each of the initial residual resistivities.

[0098] It should be noted that, those skilled in the art will clearly understand that, for the sake of convenience and brevity in description, the specific working processes of the above-described device and each module can refer to the corresponding processes in the aforementioned embodiment of the test method for the residual resistivity of the composite material copper plating, and will not be repeated here.

[0099] The test device 100 for the residual resistivity of the composite copper coating provided in the above embodiment can be implemented in the form of a computer program. The computer program can be used in Figure 3 The system runs on the terminal device 200 shown.

[0100] See also Figure 3 , Figure 3 This is a schematic block diagram of the structure of a terminal device 200 provided in an embodiment of the present application. The terminal device 200 includes a processor 201 and a memory 202. The processor 201 and the memory 202 are connected via a device bus 203, wherein the memory 202 may include a non-volatile storage medium and an internal memory.

[0101] The non-volatile storage medium can store a computer program including program instructions, which, when executed by the processor 201 , can enable the processor 201 to execute any of the above-mentioned methods for testing the residual resistivity of a composite material copper plating layer.

[0102] The processor 201 is used to provide computing and control capabilities to support the operation of the entire terminal device 200.

[0103] The internal memory provides an environment for running the computer program in the non-volatile storage medium. When the computer program is executed by the processor 201, the processor 201 can execute any of the above-mentioned methods for testing the residual resistivity of the composite material copper plating layer.

[0104] Those skilled in the art will understand that Figure 3 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the terminal device 200 involved in the solution of the present application. The specific terminal device 200 may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0105] It should be understood that the processor 201 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor.

[0106] In some embodiments, the processor 201 is configured to execute a computer program stored in the memory to implement the following steps:

[0107] Performing microstructural scanning on the composite material to obtain a microstructural image of the composite material, and inputting the microstructural image into a preset copper plating layer extraction model to obtain a three-dimensional model of the copper plating layer of the composite material; wherein the copper plating layer extraction model is a pre-trained convolutional neural network;

[0108] Performing finite element segmentation processing on the three-dimensional model to obtain a finite element model;

[0109] For each finite element unit of the finite element model, perform a residual resistivity test on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit;

[0110] A target residual resistivity of the copper plating layer is determined based on the respective initial residual resistivities.

[0111] It should be noted that, those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the terminal device 200 described above can refer to the corresponding process of the aforementioned test method for the residual resistivity of the composite material copper plating layer, and will not be repeated here.

[0112] An embodiment of the present application also provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by one or more processors, the one or more processors implement the method for testing the residual resistivity of the composite material copper plating layer as provided in the embodiment of the present application.

[0113] The computer-readable storage medium may be an internal storage unit of the terminal device 200 in the aforementioned embodiment, such as a hard disk or memory of the terminal device 200. The computer-readable storage medium may also be an external storage device of the terminal device 200, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped with the terminal device 200.

[0114] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present application, and such modifications or substitutions should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A method for testing the residual resistivity of a composite copper coating, characterized in that: include: Performing microstructural scanning on the composite material to obtain a microstructural image of the composite material, and inputting the microstructural image into a preset copper plating layer extraction model to obtain a three-dimensional model of the copper plating layer of the composite material; wherein the copper plating layer extraction model is a pre-trained convolutional neural network; Performing finite element segmentation processing on the three-dimensional model to obtain a finite element model; For each finite element unit of the finite element model, perform a residual resistivity test on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit; determining a target residual resistivity of the copper plating layer based on each of the initial residual resistivities; The performing of a residual resistivity test on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit includes: extracting the finite element unit from the finite element model; Performing a multi-point residual resistivity test on the finite element unit to obtain a plurality of residual resistivities corresponding to the finite element unit; determining an initial residual resistivity of the finite element unit based on a plurality of residual resistivities corresponding to the finite element unit; The performing of a multi-point residual resistivity test on the finite element unit to obtain a plurality of residual resistivities corresponding to the finite element unit includes: Determine a first point pair on the surface of the finite element unit; the two points of the first point pair are the two points on the finite element unit that are farthest apart; Decreasing the distance between the two points of the first point pair based on a preset distance decreasing index to obtain multiple target distances; For each target distance, determining a second point pair corresponding to the target distance on the surface of the finite element unit; wherein the distance between two points in the second point pair is the target distance; respectively testing the residual resistivity corresponding to each of the point pairs to obtain a plurality of residual resistivities corresponding to the finite element unit; The determining of the target residual resistivity of the copper plating layer based on the respective initial residual resistivities comprises: Obtaining a standard deviation between each of the initial residual resistivities, and comparing the standard deviation with a preset standard deviation; If the standard deviation is less than the preset standard deviation, taking the average value of the initial residual resistivities as the target residual resistivity; If the standard deviation is not less than the preset standard deviation, determining the median of each of the initial residual resistivities; For each of the initial residual resistivities, calculating the difference between the initial residual resistivity and the median, and comparing the absolute value of the difference with a preset absolute value; if the absolute value of the difference is less than the preset absolute value, determining the initial residual resistivity to be a target initial residual resistivity; The average value of the target initial residual resistivities is taken as the target residual resistivity.

2. The method for testing the residual resistivity of a composite copper coating according to claim 1, wherein: The step of respectively testing the residual resistivity corresponding to each of the point pairs to obtain a plurality of residual resistivities corresponding to the finite element unit includes: For each of the point pairs, a virtual current lead and a virtual voltage sensor are provided at two points of the point pair, and the residual resistivity corresponding to the point pair is obtained based on the virtual current lead and the virtual voltage sensor; Wherein, obtaining the residual resistivity corresponding to the point pair based on the virtual current lead and the virtual voltage sensor includes: At room temperature, a virtual constant current source is used to pass current through the virtual current leads. 1A current, and obtain the two ends of the point pair through the virtual voltage sensor. a first voltage value corresponding to the 1A condition, and an average of the absolute values of the two first voltage values as the first target voltage; At a low temperature of 4.2K, a virtual constant current source is used to pass current through the virtual current leads. 1A current, and obtain the two ends of the point pair through the virtual voltage sensor. a second voltage value corresponding to the 1A condition, and taking the average of the absolute values of the two second voltage values as the second target voltage; The ratio of the first target voltage to the second target voltage is used as the residual resistivity corresponding to the point pair.

3. The method for testing the residual resistivity of a composite copper coating according to claim 1, wherein: The method further comprises: The microstructure image is bound to the target residual resistivity to obtain a binding result, and the binding result is stored in a preset database.

4. The method for testing the residual resistivity of a composite copper coating according to claim 3, wherein: Binding the microstructure image with the target residual resistivity to obtain a binding result includes: Performing matrix coding on the microstructure based on a preset matrix coding method to obtain a coding matrix; wherein each row vector of the coding matrix includes letters and numbers; Constructing a geometric progression with the numerical value corresponding to the target residual resistivity as the first term; the number of numerical values in the geometric progression is consistent with the number of row vectors in the encoding matrix; For each row vector of the encoding matrix, determine a target value corresponding to the row vector in the geometric progression, and multiply the target value by the row vector to obtain a target row vector corresponding to the row vector; wherein the value corresponding to the row number corresponding to the row vector in the encoding matrix is consistent with the value corresponding to the sequence corresponding to the target value in the geometric progression; The target row vectors are arranged in order from top to bottom based on the positions of the row vectors corresponding to the target row vectors in the encoding matrix to obtain a target encoding matrix; the target encoding matrix is the binding result.

5. A test device for residual resistivity of composite copper coating, characterized in that: include: an extraction module for performing microstructural scanning on the composite material to obtain a microstructural image of the composite material, and inputting the microstructural image into a preset copper plating layer extraction model to obtain a three-dimensional model of the copper plating layer of the composite material; wherein the copper plating layer extraction model is a pre-trained convolutional neural network; a segmentation processing module, configured to perform finite element segmentation processing on the three-dimensional model to obtain a finite element model; A testing module, configured to perform a residual resistivity test on each finite element unit of the finite element model to obtain an initial residual resistivity corresponding to the finite element unit; a determination module, configured to determine a target residual resistivity of the copper plating layer based on each of the initial residual resistivities; The performing of a residual resistivity test on the finite element unit to obtain an initial residual resistivity corresponding to the finite element unit includes: extracting the finite element unit from the finite element model; Performing a multi-point residual resistivity test on the finite element unit to obtain a plurality of residual resistivities corresponding to the finite element unit; determining an initial residual resistivity of the finite element unit based on a plurality of residual resistivities corresponding to the finite element unit; The performing of a multi-point residual resistivity test on the finite element unit to obtain a plurality of residual resistivities corresponding to the finite element unit includes: Determine a first point pair on the surface of the finite element unit; the two points of the first point pair are the two points on the finite element unit that are farthest apart; Decreasing the distance between the two points of the first point pair based on a preset distance decreasing index to obtain multiple target distances; For each target distance, determining a second point pair corresponding to the target distance on the surface of the finite element unit; wherein the distance between two points in the second point pair is the target distance; respectively testing the residual resistivity corresponding to each of the point pairs to obtain a plurality of residual resistivities corresponding to the finite element unit; The determining of the target residual resistivity of the copper plating layer based on the respective initial residual resistivities comprises: Obtaining a standard deviation between each of the initial residual resistivities, and comparing the standard deviation with a preset standard deviation; If the standard deviation is less than the preset standard deviation, taking the average value of the initial residual resistivities as the target residual resistivity; If the standard deviation is not less than the preset standard deviation, determining the median of each of the initial residual resistivities; For each of the initial residual resistivities, calculating the difference between the initial residual resistivity and the median, and comparing the absolute value of the difference with a preset absolute value; if the absolute value of the difference is less than the preset absolute value, determining the initial residual resistivity to be a target initial residual resistivity; The average value of the target initial residual resistivities is taken as the target residual resistivity.

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