Electrolysis device for removing copper ions from dilute acid liquid and processing method

Abstract

The invention relates to the technical field of copper foil surface treatment, and discloses an electrolysis device for removing copper ions from dilute acid liquid and a processing method.The electrolysis device comprises a containing assembly forming a cavity, and the dilute acid liquid rich in copper ions is placed in the cavity; the electrolysis assembly is in contact with the dilute acid liquid, the electrified electrolysis assembly comprises at least one cathode plate, and the cathode plate provides electrons for copper ions to be reduced into metal copper; and the copper cleaning assembly is arranged in the cavity and comprises a scraper moving relative to the negative plate, and the top end of the scraper makes contact with the negative plate so as to clean the compact copper plating layer. The containing assembly and the electrolysis assembly are arranged to conduct electro-deposition treatment on dilute acid liquid rich in copper ions, the content of the copper ions is reduced, and the dilute acid liquid capable of spraying the conductive roller is formed; in the electrodeposition treatment process, a compact copper plating layer is formed on the side face of the cathode plate, the scraper moves relative to the side face of the cathode plate to scrape the compact copper plating layer, the contact area of the cathode plate and dilute acid liquid is guaranteed, and then the electrodeposition treatment efficiency of the electrolysis assembly on the dilute acid liquid is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of copper foil surface treatment, in particular to a dilute acid liquid copper ion removal electrolysis device and processing method. BACKGROUND

[0002] Electronic copper foil is the core conductive material of copper-clad plate and printed circuit board, and its surface treatment usually includes pickling, roughening, passivation, zinc plating / nickel plating, etc. The copper foil is wrapped on the side of the conductive roller. The core functions of the conductive roller in this process include current conduction and tension control. As the current carrier of the cathode or anode, it ensures that the electrochemical reaction in the surface treatment process proceeds uniformly, and also ensures stable transmission of the copper foil to avoid wrinkles or deviation, and ensures that the dilute acid liquid is uniformly sprayed on the surface of the copper foil to react with the copper oxide on the surface of the copper foil to generate copper ions. The copper ion content of the dilute acid liquid after spraying is too high, which may cause reduction reaction with the conductive roller if it is reused, and then adhere to the side of the conductive roller to reduce its conductivity. If it is not reused, it will cause waste of dilute acid liquid and increase the cost of copper foil treatment.

[0003] The disclosed Chinese patent CN119956363A discloses a method and device for removing copper ions from dilute acid liquid sprayed on a conductive roller. The method comprises the following steps: S1, conveying untreated dilute acid liquid to a dilute acid tank: conveying the dilute acid liquid containing 5-10 g / L copper in the pickling tank to the dilute acid tank through acid-resistant pipeline; S2, electrodeposition treatment: installing a conductive loop module in the dilute acid tank, and performing electrodeposition treatment on the dilute acid liquid flowing through the conductive loop module, so that the copper ions adhere to the cathode plate in the conductive loop module; S3, conveying the treated dilute acid liquid to the pickling tank: the dilute acid liquid after electrodeposition treatment is conveyed back to the pickling tank for acid spraying on the conductive roller. This method can effectively reduce the copper ion concentration in the dilute acid solution in the surface treatment process, prevent the copper ions in the dilute acid liquid from forming a copper plating layer on the surface of the conductive roller, and recycle the dilute acid solution and the deposited copper, thereby improving the copper foil yield while reducing the production energy consumption. However, this electrodeposition treatment may cause a dense copper plating layer to form on the surface of the cathode plate, which greatly reduces the electrolysis effect of the cathode plate when the dense copper plating layer covers the surface of the cathode plate. SUMMARY

[0004] The present application provides a dilute acid liquid copper ion removal electrolysis device and processing method to solve the problem of gradually declining effect of copper ion removal by electrodeposition treatment in the existing process. The specific technical solution is as follows:

[0005] The utility model provides an electrolytic device of dilute acid liquid copper ion removal, comprising: a holding assembly with a cavity formed inside, the cavity is placed dilute acid liquid rich in copper ions; electrolytic assembly is arranged in the cavity and is contacted with dilute acid liquid, the electrified electrolytic assembly includes at least one cathode plate, and the cathode plate can provide electron reduction for copper ions to be metal copper; copper removal assembly is arranged in the cavity, and the copper removal assembly includes scraper that moves relative to the cathode plate, and the top end of the scraper is contacted with the cathode plate to remove dense copper plating layer.

[0006] Further, both ends of the cathode plate are communicated with the negative pole of the direct current power supply, the surface of the cathode plate forming the dense copper plating layer is side E, the length direction of side E is consistent with the length direction of the cathode plate; the moving direction of the scraper is consistent with the length direction of side E, the top end of the scraper is contacted with side E, and the width of the scraper is not less than the width of side E.

[0007] Preferably, the electrolytic assembly further comprises: an anode plate communicated with the positive pole of the direct current power supply at both ends, the anode plate is placed in the cavity parallel to the cathode plate and is immersed in the dilute acid liquid; and a direct current power supply electrically connected with the anode plate and the cathode plate, the direct current power supply can control the current size flowing through the cathode plate, and the direct current power supply is placed outside the holding assembly.

[0008] Preferably, the electrolytic assembly further comprises a copper bar arranged at one end of the cathode plate or the anode plate, the other end of the copper bar is connected with a conductive plate, the conductive plate is connected with the negative pole or the positive pole of the direct current power supply, the conductive plate is connected with the direct current power supply through the side wall of the cavity, and the direct current power supply, the conductive plate, the copper bar, the cathode plate, the anode plate and the dilute acid liquid form a direct current loop.

[0009] Preferably, the copper removal assembly further comprises: a support vertical plate arranged at one side of the cathode plate close to side E, the length direction of the support vertical plate is consistent with the length direction of side E; a sliding horizontal plate connected with the support vertical plate, the sliding horizontal plate is connected with the scraper, and the sliding horizontal plate can drive the scraper to move along the length direction of the support vertical plate.

[0010] Preferably, the copper removal assembly further comprises a sliding groove and an open slot formed in the support vertical plate, the length direction of the sliding groove and the open slot is consistent with the length direction of the support vertical plate, and the length of the sliding groove and the open slot is not less than the length of the support vertical plate; the open slot is arranged opposite to side E, and the scraper is arranged in the open slot and moves along the length direction of the open slot.

[0011] Preferably, the copper removal assembly further comprises a material receiving plate arranged at the bottom of the cathode plate, the material receiving plate can collect all the metal copper falling from the cathode plate, the bottom of the material receiving plate forms a protrusion, the side wall of the cavity forms a long groove, the protrusion and the long groove are matched with each other, and the length direction of the protrusion and the long groove is perpendicular to the length direction of the cathode plate.

[0012] Preferably, the containing assembly includes an acid container forming a cavity, the top of the acid container forming an opening end one, the bottom of the acid container forming an opening end two, the top of the acid container connected to a cover plate covering the opening end one, the bottom of the acid container connected to a sealing plate covering the opening end two, and the side wall of the acid container forming a liquid inlet, a liquid outlet and an exhaust port connected to the cavity.

[0013] A processing method based on the above-mentioned electrolytic device includes the following steps: a dilute acid solution rich in copper ions flows into a cavity to form a processing waste liquid; an electrolytic component performs electrodeposition treatment on the processing waste liquid, so that the processing waste liquid generates metallic copper and forms a dense copper plating layer on the side of the cathode plate, and the processing waste liquid forms a spray acid solution and flows out of the cavity to process electronic copper foil; a scraper moves relative to the cathode plate and scrapes off the dense copper plating layer, thereby increasing the contact area between the cathode plate and the dilute acid solution.

[0014] Preferably, the electrodeposition treatment refers to a reduction reaction between electrons flowing through the cathode plate and copper ions in the processing waste liquid to form a dense copper plating layer.

[0015] It can be seen from the above technical solution that the present invention has the following beneficial effects:

[0016] The present invention performs an electroplating treatment on a dilute acid solution rich in copper ions by providing a holding component and an electrolytic component, thereby reducing the copper ion content thereof to form a dilute acid solution that can be sprayed on a conductive roller again; secondly, during the electroplating treatment, metallic copper is continuously generated on the side of the cathode plate to form a dense copper plating layer. The present invention provides a scraper that moves relative to the side of the cathode plate to scrape off the dense copper plating layer, thereby ensuring the contact area between the cathode plate and the dilute acid solution, and thereby ensuring the electroplating treatment efficiency of the electrolytic component on the dilute acid solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a structural diagram of embodiment 1 of the present invention;

[0018] Figure 2 Schematic diagram of the structure of embodiment 1 of the present invention without the cover plate and sealing plate

[0019] Figure 3 It is a structural diagram of the electrolytic component and the copper cleaning component.

[0020] Figure 4 for Figure 3 A magnified view of the structure at point A;

[0021] Figure 5 for Figure 3 A magnified view of the structure at point B in FIG;

[0022] Figure 6 for Figure 2 Enlarged view of the structure at point C in .

[0023] In the figure: 1. Holding component; 11. Acid container; 12. Liquid inlet; 13. Liquid outlet; 14. Exhaust port; 15. Cover plate; 16. Sealing plate; 2. Electrolytic component; 21. DC power supply; 22. Conductive plate; 23. Copper busbar; 24. Cathode plate; 25. Anode plate; 3. Copper cleaning component; 31. Support vertical plate; 32. Slide groove; 33. Opening groove; 34. Scraper; 35. Sliding horizontal plate; 36. Material receiving plate; 37. Long groove. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0026] Example 1

[0027] like Figures 1 to 4 As shown, this embodiment is an electrolytic device for removing copper ions with a dilute acid solution, which includes: a holding component 1 with a cavity formed inside, wherein a dilute acid solution rich in copper ions is placed in the cavity; an electrolytic component 2 arranged in the cavity and in contact with the dilute acid solution, the energized electrolytic component 2 includes at least one cathode plate 24, and the cathode plate 24 can provide electrons to reduce copper ions to metallic copper; a copper cleaning component 3 is arranged in the cavity, and the copper cleaning component 3 includes a scraper 34 that moves relative to the cathode plate 24, and the top of the scraper 34 contacts the cathode plate 24 to remove the dense copper plating layer.

[0028] Specifically, in the process of processing the copper foil, the dilute acid solution is uniformly sprayed on the surface of the copper foil to react with the cupric oxide on the surface of the copper foil to generate copper ions, so that the copper ion content of the dilute acid solution after spraying is too high, and the dilute acid solution rich in copper ions enters the cavity inside the containing assembly 1, which is subjected to electrodeposition treatment by the electrolysis assembly 2; wherein the electrolysis assembly 2 includes a direct current power supply 21, both ends of the cathode plate 24 are connected with the negative electrode of the direct current power supply 21, so that the cathode plate 24 has electrons that can react with copper ions, thereby generating metallic copper on the side surface of the cathode plate 24 and forming a dense copper plating layer, when the copper plating layer completely adheres to the side surface of the cathode plate 24 to form a dense layer, the copper plating layer is formed, and the copper ions in the dilute acid solution cannot continue to combine with the electrons of the cathode plate 24 to react.

[0029] Secondly, the scraper 34 is in contact with the side surface of the cathode plate 24, which moves along the length direction of the cathode plate 24, in the moving process, the top end of the scraper 34 separates the attached dense copper plating layer from the side surface of the cathode plate 24, thereby exposing the part of the cathode plate 24 covered by the dense copper plating layer, thereby increasing the contact area between the cathode plate 24 and the copper ions, thereby improving the electrodeposition treatment efficiency of the electrolysis assembly 2 on the dilute acid solution rich in copper ions.

[0030] Further, both ends of the cathode plate 24 are in communication with the negative electrode of the direct current power supply 21, the surface of the cathode plate 24 attached with the dense copper plating layer is the side surface E, the length direction of the side surface E is consistent with the length direction of the cathode plate 24; the moving direction of the scraper 34 is consistent with the length direction of the side surface E, the top end of the scraper 34 is in contact with the side surface E, and the width of the scraper 34 is not less than the width of the side surface E.

[0031] Specifically, the two side surfaces of the cathode along the length direction are in contact with the dilute acid liquid, and are positioned as side surface E. The two ends of the cathode plate 24 are in communication with the negative electrode of the direct current power supply 21, so that electrons enter the cathode plate 24 through the negative electrode of the direct current power supply 21, and then attract copper ions to move to the side surface E to react with the electrons to generate metal copper to form a dense copper plating layer. Secondly, the electrons flow from the cathode plate 24 to the anode plate 25 through the dilute acid liquid to form an electric current, the direction of the electric current is perpendicular to the length direction of the side surface E, and the length direction of the copper plating layer is consistent with the length direction of the side surface E. Thirdly, the scraper 34 includes a mounting section for fixation and a functional section for scraping the dense copper plating layer. The cross section of the functional section is a trapezoid. The upper top of the trapezoid coincides with the side surface E, and the two waists of the trapezoid form an acute angle with the side surface E. The end surface of the functional section of the scraper 34 coincides with the side surface E, and the width of the top end surface and the side surface E along the width direction is equal. The width direction is perpendicular to the length direction of the side surface E. The top end side surface of the functional section forms an acute angle with the side surface E. During the movement of the scraper 34, the top end surface of the functional section peels off the dense copper plating layer from the side surface E. The scraper 34 can peel off all the dense copper plating layer from the side surface E at one time. The top end side surface of the functional section gathers the peeled copper plating layer into a group, a strip or a block, thereby accelerating the falling of the gathered peeled copper plating layer to the bottom of the cavity, and reducing the difficulty of subsequent cleaning and collecting metal copper.

[0032] As shown in Figure 5 , the electrolysis assembly 2 further includes: an anode plate 25 connected with the positive electrode of the direct current power supply 21 at both ends. The anode plate 25 is placed in parallel with the cathode plate 24 in the cavity and is immersed in the dilute acid liquid. The direct current power supply 21 is electrically connected with the anode plate 25 and the cathode plate 24. The direct current power supply 21 can control the current size flowing through the cathode plate 24. The direct current power supply 21 is placed outside the holding assembly 1.

[0033] Specifically, the direct current power supply 21 is built-in RS485 communication module. The direct current power supply 21 is placed outside the holding assembly 1 to facilitate replacement. The positive electrode of the direct current power supply 21 is electrically connected with the anode plate 25, and the negative electrode is electrically connected with the cathode plate 24. The anode plate 25 and the cathode plate 24 are electrically connected through the dilute acid liquid to form a direct current loop. The direct current power supply 21 controls the current size of the direct current loop to control the generation rate of metal copper. Secondly, the anode plate 25 and the cathode plate 24 are arranged in parallel so that the distance between them is equal, thereby making the total amount of copper ions between them at each place be the same, and making the metal copper that can be generated in each region of the cathode plate 24 be the same, thereby ensuring that the thickness of the dense copper plating layer generated in each region of the cathode plate 24 is uniform. The thicker the dense copper plating layer, the more difficult it is to remove it by the scraper 34. Therefore, the uniform thickness of the dense copper plating layer can reduce the difficulty of removing the dense copper plating layer by the scraper 34.

[0034] Furthermore, the electrolytic assembly 2 also includes a copper busbar 23 having one end arranged at both ends of the cathode plate 24 or the anode plate 25, and the other end of the copper busbar 23 is connected to the conductive plate 22, and the conductive plate 22 is connected to the negative pole or the positive pole of the DC power supply 21. The conductive plate 22 passes through the side wall of the cavity and is connected to the DC power supply 21. The DC power supply 21, the conductive plate 22, the copper busbar 23, the cathode plate 24 or the anode plate 25, and the dilute acid form a DC circuit for transporting electrons.

[0035] Specifically, both ends of the cathode plate 24 and the anode plate 25 are connected to a copper bus 23, and the other end of the copper bus 23 is connected to the positive or negative pole of the DC power supply 21 through the conductive plate 22. The length direction of the copper bus 23 is the height direction of the holding component 1, that is, the depth direction of the dilute acid solution. The cathode plate 24 and the anode plate 25 can have a height difference with the positive or negative pole of the DC power supply 21, so that the cathode plate 24 and the anode plate 25 can be placed at the bottom of the holding component 1 to ensure the contact area with the dilute acid solution. At the same time, the DC power supply 21 can be placed on the outer top of the holding component 1 to replace and repair the DC power supply 21 at any time, thereby optimizing the installation position of each component; wherein the conductive plate 22 does not contact the dilute acid solution, it passes through the top side wall of the cavity, the end entering the cavity is connected to the copper bus 23, and the end placed outside the cavity is connected to the DC power supply 21, and it is isolated from the side wall of the cavity by an insulating plate to prevent it from being connected to the holding component 1.

[0036] like Figure 4 As shown, the copper cleaning component 3 also includes: a supporting vertical plate 31 arranged on the side of the cathode plate 24 close to the side E, and the length direction of the supporting vertical plate 31 is consistent with the length direction of the side E; a sliding horizontal plate 35 connected to the supporting vertical plate 31, the sliding horizontal plate 35 is connected to the scraper 34, and the sliding horizontal plate 35 can drive the scraper 34 to move along the length direction of the supporting vertical plate 31.

[0037] Specifically, the side E of the cathode plate 24 is opposite to the anode plates 25 on both sides respectively, and the bottom of the supporting vertical plate 31 is fixedly connected to the bottom of the holding component 1, which is placed in the gap between the cathode plate 24 and the anode plate 25, and is parallel to the cathode plate 24. The projection of the supporting vertical plate 31 on the side E can completely cover the side E; secondly, the top of the supporting vertical plate 31 is close to the conductive plate 22, and the two ends of the sliding horizontal plate 35 span the two side faces E of the same cathode plate 24, and then form a sliding connection with the top of the supporting vertical plates 31 on both sides. The two ends of the sliding horizontal plate 35 are respectively fixedly connected to the scrapers 34 on both sides. When the operator moves the sliding horizontal plate 35 along the top of the supporting vertical plate 31, the sliding horizontal plate 35 can drive the scraper 34 to move along the top of the supporting vertical plate 31, and then the top of the scraper 34 moves relative to the side E, thereby stripping off the dense copper plating attached to the side E.

[0038] Furthermore, the copper cleaning component 3 also includes a slide groove 32 and an opening groove 33 formed on the supporting vertical plate 31. The length directions of the slide groove 32 and the opening groove 33 are consistent with the length direction of the supporting vertical plate 31, and the lengths of the slide groove 32 and the opening groove 33 are not less than the length of the supporting vertical plate 31; the opening groove 33 is arranged relative to the side E, and the scraper 34 is arranged in the opening groove 33 and moves along the length direction of the opening groove 33.

[0039] The cam 33 is connected to the sliding plate 32 by the sliding groove 32, and the sliding plate 32 is in the sliding groove 33. The sliding plate 32 is fixed to the sliding plate 35 by the sliding groove 32, and the sliding plate 32 is in the sliding groove 33. The functional section contacts the side E through the opening groove 33, so that when the sliding plate 35 moves along the sliding groove 32, it can drive the scraper 34 to move along the opening groove 33 relative to the side E; wherein the lengths of the sliding groove 32 and the opening groove 33 are not less than the length of the side E, so that the sliding plate 35 can drive the scraper 34 to move from one end of the side E to the other end, and the width of the functional section of the scraper 34 is not less than the width of the side E, so that the functional section of the scraper 34 can scrape off all the dense copper plating attached to the side E in one movement, thereby improving the scraping efficiency.

[0040] like Figure 6 As shown, the copper cleaning component 3 also includes a receiving plate 36 arranged at the bottom of the cathode plate 24. The receiving plate 36 can receive all the metal copper falling from the cathode plate 24. A protrusion is formed at the bottom of the receiving plate 36, and a long groove 37 is formed on the side wall of the cavity. The protrusion and the long groove 37 cooperate with each other, and the length direction of the protrusion and the long groove 37 are both perpendicular to the length direction of the cathode plate 24.

[0041] Specifically, the receiving plate 36 can completely cover the cathode plate 24 and the anode plate 25 in the depth direction of the dilute acid solution, so that the clumped metal copper scraped from the cathode plate 24 can fall onto the receiving plate 36 under the action of gravity, thereby achieving scraping and collection of the metal copper; secondly, a long groove 37 is welded on the bottom side wall of the cavity, and protrusions that cooperate with the long groove 37 are welded at both ends of the receiving plate 36, so that the receiving plate 36 and the long groove 37 form a sliding connection. In this embodiment, the length directions of the protrusions and the long groove 37 are both perpendicular to the side E of the cathode plate 24, so that the receiving plate 36 can move perpendicular to the cathode plate 24. When the receiving plate 36 completes the collection, the operator can move the receiving plate 36 and move it out of the holding component 1 from the bottom opening position of the cavity, thereby completing the collection of the metal copper, and then reusing it, thereby improving the reuse rate of the material and reducing production costs.

[0042] like Figure 1 and Figure 2As shown, the acid-containing assembly 1 includes an acid-containing container 11 forming a cavity, a top of the acid-containing container 11 forms an open end one, a bottom of the acid-containing container 11 forms an open end two, the top of the acid-containing container 11 is connected to a cover plate 15 covering the open end one, the bottom of the acid-containing container 11 is connected to a sealing plate 16 covering the open end two, and the sidewall of the acid-containing container 11 forms a liquid inlet 12, a liquid outlet 13 and an exhaust port 14 in communication with the cavity.

[0043] Specifically, the inside of the acid-containing container 11 forms a cavity containing dilute acid liquid, the top of which forms an open end one and is movably connected to the cover plate 15, one side of the bottom of which forms an open end two and is movably connected to the sealing plate 16, one side of the top of which forms a liquid inlet 12 and an exhaust port 14 penetrating the sidewall of the cavity, and one side of the bottom of which forms a liquid outlet 13 penetrating the sidewall of the cavity; wherein the cover plate 15 is of transparent material, which can be opened relative to the open end one to facilitate the operator to operate the sliding horizontal plate 35 to move the scraper 34, and the sealing plate 16 is connected to the open end two by a sealing rubber strip, which is connected to the acid-containing container 11 at the same time as the cover plate 15, so that the acid-containing container 11 forms a sealed cavity to avoid harm to the operator caused by the sulfuric acid mist generated by the volatilization of the dilute acid liquid.

[0044] Secondly, the dilute acid liquid rich in copper ions enters the cavity through the liquid inlet 12, and then undergoes a reduction reaction with the cathode plate 24 to generate metallic copper; the sulfuric acid mist (sulfuric acid mist is sulfuric acid gas) generated by the volatilization of the dilute acid liquid enters the acid mist treatment device (this device is a commonly used device in the art, which can absorb sulfuric acid mist, not shown in the figure) through the exhaust port 14; when the cathode plate 24 no longer deposits metallic copper, the dilute acid liquid flows out of the liquid outlet 13 for recycling, thereby improving the reuse rate of the dilute acid liquid and reducing production costs.

[0045] In the first implementation, the support vertical plate 31, the sliding horizontal plate 35 and the scraper 34 in contact with the dilute acid liquid have acid resistance, and the support vertical plate 31 is preferably made of PVC material.

[0046] Embodiment two

[0047] This embodiment two is a processing method based on embodiment one, which comprises the following steps:

[0048] S1: The dilute acid liquid rich in copper ions flows into the cavity to form a processing waste liquid.

[0049] Specifically, the cover plate 15 closes the open end one, the sealing plate 16 closes the open end two, the dilute acid liquid rich in copper ions flows into the cavity inside the acid-containing container 11 through the liquid inlet 12, and immerses the cathode plate 24 and the anode plate 25 to form a processing waste liquid, and the sulfuric acid mist generated by the volatilization of the dilute acid liquid enters the external treatment device through the exhaust port 14.

[0050] S2: the electrolytic assembly 2 in power supply carries out the electrodeposition treatment on the processing waste liquid, the processing waste liquid generates the copper and adheres to the cathode plate 24 to form the dense copper plating layer, and the processing waste liquid forms the spraying acid liquid and flows out of the cavity to process the electronic copper foil.

[0051] Specifically, the two ends of the cathode plate 24 are in communication with the negative electrode of the direct current power supply 21, the two ends of the anode plate 25 are in communication with the positive electrode of the direct current power supply 21, the processing waste liquid is in communication with the cathode plate 24 and the anode plate 25 to form a direct current loop, and then the electrodeposition treatment is carried out on the processing waste liquid. The electrodeposition treatment (also known as electroplating or electrochemical deposition) is a surface treatment technology for depositing copper on the surface of the cathode plate 24 by using the principle of electrolysis. It can reduce the copper ions in the processing waste liquid to metal copper and form a dense copper plating layer on the side surface of the cathode plate 24. When the side surface of the cathode plate 24 is not completely covered with the dense copper plating layer and no longer continues to generate the dense copper plating layer, the copper ion content in the processing waste liquid is zero or close to zero, the processing waste liquid is reduced to the spraying acid liquid, the spraying acid liquid is sprayed on the electronic copper foil to remove the surface copper oxide, and the processing waste liquid is formed again to form a complete cycle, thereby reducing the use cost of the material.

[0052] S3: the scraper 34 moves relative to the cathode plate 24 and scrapes off the dense copper plating layer adhered to the cathode plate 24, so that the copper plating layer is gathered into copper mud and falls off.

[0053] Specifically, when the side surface of the cathode plate 24 is completely covered with the dense copper plating layer or when the processing waste liquid is completely changed into the spraying acid liquid, the operator opens the cover plate 15 and the liquid outlet 13 until all the liquid in the holding container flows out. Secondly, the operator slides the sliding horizontal plate 35 and then slides the scraper 34, moves it from one end of the cathode plate 24 to the other end, and then scrapes off the dense copper plating layer and gathers it into a group and falls on the receiving plate 36. The operator opens the sealing plate 16, moves the receiving plate 36 and removes it from the holding container, collects the work, and then completes the scraping and collecting work of the dense copper plating layer. Put the receiving plate 36, close the sealing plate 16, cover plate 15 and liquid outlet 13, connect the liquid inlet 12, and flow into the processing waste liquid again to form a cycle of material processing.

[0054] Further, the electrodeposition treatment refers to that the electrons flowing from the cathode plate 24 to the anode plate 25 react with the copper ions in the processing waste liquid to generate the dense copper plating layer.

[0055] Specifically, the direct current power supply 21, the anode plate 25, the cathode plate 24 and the processing waste liquid form a complete direct current loop. The copper ion is positively charged and the electron is negatively charged. During the process of the electron flowing from the cathode plate 24 to the anode plate 25, the copper ion and the electron react to generate metal copper, and the metal copper adheres to the side surface E of the cathode plate 24 to form the dense copper plating layer.

[0056] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary and that changes in form and detail can be made without departing from the principles and spirit of the application, the scope of which is defined by the appended claims and their equivalents.

[0057] The technology, shape, configuration part not described in detail in the present application are well-known technologies.

Claims

1. An electrolysis device for removing copper ions from a dilute acid solution, characterized in that: include: A containing component (1) having a cavity formed therein, wherein a dilute acid solution rich in copper ions is placed in the cavity; An electrolytic component (2) is disposed in the cavity and in contact with the dilute acid solution, wherein the electrolytic component (2) when energized comprises at least one cathode plate (24), wherein the cathode plate (24) is capable of providing electrons to copper ions for reduction to metallic copper; A copper cleaning component (3) is arranged in the cavity, and the copper cleaning component (3) includes a scraper (34) that moves relative to the cathode plate (24), and the top end of the scraper (34) contacts the cathode plate (24) to remove the dense copper plating layer.

2. The electrolysis device according to claim 1, characterized in that: Both ends of the cathode plate (24) are connected to the negative electrode of the DC power supply (21); the surface of the cathode plate (24) on which the dense copper plating layer is formed is a side surface E; and the length direction of the side surface E is consistent with the length direction of the cathode plate (24); The moving direction of the scraper (34) is consistent with the length direction of the side surface E, the top end of the scraper (34) contacts the side surface E, and the width of the scraper (34) is not less than the width of the side surface E.

3. The electrolysis device according to claim 2, characterized in that: The electrolytic assembly (2) further comprises: an anode plate (25) having both ends connected to the positive electrode of a DC power supply (21), the anode plate (25) and the cathode plate (24) being placed in parallel in the cavity and both immersed in the dilute acid solution; and The DC power supply (21) is electrically connected to the anode plate (25) and the cathode plate (24), and the DC power supply (21) is capable of controlling the magnitude of the current flowing through the cathode plate (24). The DC power supply (21) is placed outside the containing component (1).

4. The electrolysis device according to claim 3, characterized in that: The electrolytic assembly (2) further comprises a copper busbar (23) with one end arranged at both ends of the cathode plate (24) or the anode plate (25); the other end of the copper busbar (23) is connected to a conductive plate (22); the conductive plate (22) is connected to the negative electrode or the positive electrode of the DC power supply (21); the conductive plate (22) passes through the side wall of the cavity and is connected to the DC power supply (21); the DC power supply (21), the conductive plate (22), the copper busbar (23), the cathode plate (24), the anode plate (25) and the dilute acid solution form a DC circuit.

5. The electrolysis device according to claim 2, characterized in that: The copper cleaning component (3) further comprises: a supporting vertical plate (31) provided on a side of the cathode plate (24) close to the side surface E, wherein the length direction of the supporting vertical plate (31) is consistent with the length direction of the side surface E; A sliding transverse plate (35) connected to the supporting vertical plate (31) is connected to the scraper (34). The sliding transverse plate (35) can drive the scraper (34) to move along the length direction of the supporting vertical plate (31).

6. The electrolysis device according to claim 5, characterized in that: The copper cleaning component (3) further comprises a chute (32) and an opening groove (33) formed on the supporting vertical plate (31), the length directions of the chute (32) and the opening groove (33) are consistent with the length direction of the supporting vertical plate (31), and the lengths of the chute (32) and the opening groove (33) are not less than the length of the supporting vertical plate (31); The opening groove (33) is arranged relative to the side surface E, and the scraper (34) is arranged in the opening groove (33) and moves along the length direction of the opening groove (33).

7. The electrolysis device according to claim 6, characterized in that: The copper cleaning component (3) further comprises a receiving plate (36) arranged at the bottom of the cathode plate (24), wherein the receiving plate (36) is capable of collecting all the metallic copper that falls from the cathode plate (24), a protrusion is formed at the bottom of the receiving plate (36), and a long groove (37) is formed on the side wall of the cavity, wherein the protrusion and the long groove (37) cooperate with each other, and the length directions of the protrusion and the long groove (37) are both perpendicular to the length direction of the cathode plate (24).

8. The electrolysis device according to claim 1, characterized in that: The containing assembly (1) comprises an acid container (11) forming a cavity, the top of the acid container (11) forming an opening end 1, the bottom of the acid container (11) forming an opening end 2, the top of the acid container (11) being connected to a cover plate (15) covering the opening end 1, the bottom of the acid container (11) being connected to a sealing plate (16) covering the opening end 2, and the side wall of the acid container (11) forming a liquid inlet (12), a liquid outlet (13) and an exhaust port (14) communicating with the cavity.

9. A processing method based on the electrolysis device according to any one of claims 1 to 8, characterized in that: The processing method includes the following steps: S1: dilute acid solution rich in copper ions flows into the cavity to form processing waste liquid; S2: The electrolytic component (2) performs an electroplating treatment on the processing waste liquid, so that the processing waste liquid generates metallic copper and forms a dense copper plating layer on the side of the cathode plate (24), and the processing waste liquid forms a spray acid solution and flows out of the cavity to process the electronic copper foil; S3: The scraper (34) moves relative to the cathode plate (24) and scrapes off the dense copper plating layer, thereby increasing the contact area between the cathode plate (24) and the dilute acid solution.

10. The processing method according to claim 9, characterized in that: The electroplating process refers to the reduction reaction between the electrons flowing through the cathode plate (24) and the copper ions in the processing waste liquid to form a dense copper plating layer.

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