Pick-and-place device for integrated circuit chip

Abstract

The invention relates to the field of electronic manufacturing and production, in particular to an integrated circuit chip taking and placing device which comprises a workbench, a placing table and a taking and placing table are arranged on the workbench from back to front, and a moving seat is arranged at the rear end of the workbench. A cleaning disc, a dust suction ring, high-pressure suction pipes and other structures in the cleaning assembly work cooperatively, impurities on the surface of a chip are cleaned away rapidly before a suction nozzle rod adsorbs the chip, the high-pressure suction pipes in an annular array are matched with dust suction grooves in the bottom, the surface of the chip can be fully covered, it is ensured that the impurities are sucked away as much as possible, and the service life of the chip is prolonged. And the sealing gasket below the cleaning disc is in contact with the surface of the chip table to form a sealed space, so that a local negative pressure environment is formed when the air exhaust main disc generates negative pressure, the air flow centrality is enhanced, impurities on the surface of the chip are sucked into the dust exhaust groove more quickly, the impurity cleaning efficiency is further improved, and the risk that the impurities block air holes of the suction nozzles is reduced.

Description

Technical Field

[0001] The invention relates to the field of electronic manufacturing, and in particular to a device for taking and placing integrated circuit chips. Background Art

[0002] With the continuous advancement of science and technology, the integration of integrated circuit chips continues to rise, and their functions become more and more powerful. People gradually integrate many electronic components on a piece of semiconductor material, thus forming an integrated circuit chip. In the large-scale integrated circuit production and manufacturing process, a large number of chips need to be quickly transported and assembled, so a pick-and-place device is required. This device can pick up and place chips very accurately and quickly, effectively ensuring the safe transfer and accurate positioning of chips in each process flow. The pick-and-place device can also cooperate with other automated equipment to achieve multi-station collaborative operation, thereby greatly improving production efficiency.

[0003] An existing pick-and-place device for integrated circuit chips usually uses a mechanical arm to drive a nozzle to move on the chip, and the nozzle descends to the chip surface and contacts the chip. The vacuum generation system starts to work, forming a negative pressure inside the nozzle, and the chip is adsorbed on the nozzle. After the chip is adsorbed on the nozzle, the mechanical arm moves the chip to the target position for storage, thereby completing the pick-and-place operation.

[0004] There are certain defects in the use of a pick-and-place device for integrated circuit chips: during the chip manufacturing process, impurities such as metal ions, organic matter or particles will remain on the surface of the wafer. When the chip is picked up and placed, the suction nozzle is easily in contact with these impurities, causing the particle impurities to block the nozzle pores, affecting the generation and maintenance of negative pressure inside the nozzle, which may cause the chip to shake or even fall off during movement, reducing the chip picking and placing effect. In addition, due to the different chip thicknesses, the force of the robot arm will change dynamically when it is working. If the force applied by the robot arm is too large, the speed at which the nozzle contacts the chip may be faster, thereby generating a larger impact force, directly impacting the chip surface. Under this forced push, the friction between the bottom surface of the chip and the placement plane increases, causing damage to the chip surface.

[0005] Therefore, it is necessary to propose a pick-and-place device for integrated circuit chips to solve the above technical problems. Summary of the invention

[0006] In view of the deficiencies in the prior art, the present invention provides a picking and placing device for integrated circuit chips, which solves the technical problems that residual impurities in chip manufacturing are prone to block the air holes of the suction nozzle, affecting the generation and maintenance of negative pressure, causing the chip to shake or fall off when moving, reducing the picking and placing effect, and the different chip thicknesses cause the strength of the robot arm to change. When the force is too large, the suction nozzle contacts the chip at a fast speed and generates impact force, causing damage to the chip surface.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: The technical solution adopted by the present invention to solve its technical problems is: a device for picking up and placing integrated circuit chips, including a workbench, on which a placement table and a pick-up and placement table are respectively arranged from back to front, a moving seat is arranged at the rear end of the workbench, a plurality of suction nozzle rods for adsorbing chips are arranged on the moving seat, a limiting plate that moves along the front and back directions is arranged at the bottom of the moving seat, a cleaning component is arranged on the limiting plate on the side corresponding to the suction nozzle rod, which is used to quickly clean impurities on the surface of the chip before the suction nozzle rod adsorbs the chip, and a suspended buffer component is arranged in the placement table to prevent the surface of the chip from being rubbed and squeezed when the suction nozzle rod adsorbs the chip.

[0008] Preferably, the cleaning assembly includes a cleaning plate in a hollow configuration, the inner cavity of the cleaning plate is equipped with a high-pressure exhaust pipe in an annular array, a dust extraction ring connected to the high-pressure exhaust pipe is installed at the bottom of the cleaning plate, a dust extraction groove is provided at the bottom of the dust extraction ring, a dust collection groove is provided at the top of the dust extraction ring for one end of the high-pressure exhaust pipe to be connected with the dust extraction groove, and a dust collection groove is provided at the top of the dust extraction ring. A filter ring is installed on the outer side of the cleaning plate, one end of the high-pressure exhaust pipe passes through the inner cavity of the filter ring and a filter screen is installed, and the filter screen is arranged in an inclined shape, a collection box for collecting impurities is threadedly connected under the filter ring, a collection groove connected to the collection box is provided under the filter ring, an exhaust main plate connected to the high-pressure exhaust pipe is provided on the top of the filter ring, the top of the exhaust main plate is plugged and installed under the limit plate, and a plurality of telescopic spring rods are installed between the exhaust main plate and the filter ring.

[0009] Preferably, the dust extraction groove is arranged in a square shape as a whole, the dust extraction groove is arranged to expand outward in the axial direction close to the dust extraction ring, the dust extraction groove is arranged in an upward arc shape in the axial direction away from the dust extraction ring, and the longitudinal section of the dust storage groove is arranged to converge upward.

[0010] Preferably, a sealing gasket is installed below the cleaning disk and outside the dust extraction ring, and a plurality of chip tables are arranged on the placement table. A chip slot for storing chips is opened in the chip table. When cleaning dust, the sealing gasket contacts the surface of the chip table to quickly clean the dust on the surface of the chip.

[0011] Preferably, a fixed seat is installed on the top of the filter ring, a return spring rod is installed in the fixed seat, the top of the return spring rod is slidably connected to an L-shaped seat connected to the inner side of the fixed seat through a slide rail, the horizontal end of the L-shaped seat is rotatably connected to a blocking plate, the vertical end of the L-shaped seat is installed with a torsion spring connected to the blocking plate, the spring potential energy of the torsion spring is greater than the return spring rod, and the cleaning disk is located inside the high-pressure exhaust pipe and an electronic valve is installed.

[0012] Preferably, the suspension buffer assembly includes a support seat for supporting the chip stage, the inner cavity of the workbench is provided with an opening for storing the chip stage, the support seat is fixedly connected at the bottom end of the opening, a connecting seat is installed between a group of six chip stages, the placement table is provided with a connecting groove between adjacent openings, the top of the placement table is provided with a limiting groove connected to the opening, the limiting groove is adapted to the collection box, the placement table is provided with a square groove below the opening, a magnet ring is installed on one side of the bottom wall of the square groove corresponding to the magnet, and magnetic control devices are provided on the left and right sides of the placement table.

[0013] Preferably, the magnetic control device includes a shielding plate slidably connected to the front and rear sides of the square groove, rack plates are installed on both left and right ends of the shielding plate, the front and rear ends of the square groove are rotatably connected to transmission gears that mesh with the rack plates located at the front and rear ends, and the left and right ends of the placement table are rotatably connected to torsion rods for driving the transmission gears to rotate.

[0014] Preferably, a distance sensor for detecting the thickness of the chip stage is installed on the support seat, a dial is installed on the left side of the placement table, and a pointer head is installed on the outer side of the torsion rod.

[0015] Preferably, a vertically arranged damping spring rod is installed on the inner side of the connecting groove of the placing platform, and the damping spring rod is slidably connected to the connecting seat.

[0016] Preferably, a pair of U-shaped rubber pads are installed on the inner wall of the chip slot of the chip stage, and the pair of rubber pads are arranged to be vertically connected to each other.

[0017] Beneficial effects: (1) The present invention sets a cleaning component, in which the cleaning disk, dust extraction ring, high-pressure exhaust pipe and other structures work together to quickly clean the impurities on the chip surface before the suction nozzle rod adsorbs the chip. The high-pressure exhaust pipe of the annular array cooperates with the dust extraction groove at the bottom to fully cover the chip surface, ensuring that as many impurities as possible are sucked away, and the sealing pad under the cleaning disk contacts the surface of the chip table to form a sealed space. When the total exhaust disk generates negative pressure, a local negative pressure environment is formed, which enhances the concentration of airflow and allows impurities on the chip surface to be sucked into the dust extraction groove more quickly, further improving the efficiency of cleaning impurities and reducing the risk of impurities blocking the air holes of the suction nozzle.

[0018] (2) The present invention sets a suspension buffer component. The magnetic ring in the suspension buffer component interacts with the magnet on the chip stage to generate magnetic force, so that the chip stage is suspended in the opening. When the nozzle rod adsorbs the chip, it can prevent the chip surface from being squeezed by friction, thereby avoiding damage to the chip surface due to increased friction. According to the different thicknesses of the chip, the position of the shielding plate is adjusted by rotating the torsion rod to control the size of the magnetic field. Different thicknesses of chips require different suspension forces when adsorbed by the nozzle rod. Accurately adjusting the magnetic field can ensure that the chip will not be squeezed by friction and can maintain a stable suspension state, avoiding damage to the chip surface due to excessive impact force caused by changes in the strength of the robot arm. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the mobile seat of the present invention; Figure 3 It is a schematic diagram of the nozzle rod of the present invention; Figure 4 It is a schematic diagram of the cleaning component of the present invention; Figure 5 An exploded view of the cleaning assembly of the present invention; Figure 6 A partial cross-sectional view of a cleaning assembly of the present invention; Figure 7 for Figure 6 A partial enlarged view of middle A; Figure 8 A schematic diagram of a chip stage of the present invention; Fig. 9 for Figure 4 A partial enlarged view of B in the middle; Fig.10 It is a schematic diagram of the suspension buffer assembly of the present invention; Fig.11 for Fig.10 A partial enlarged view of middle C; Fig.12 It is a schematic diagram of a dial of the present invention.

[0021] Numbers in the figure: 1. Workbench; 11. Placement table; 111. Chip table; 1111. Rubber pad; 12. Pick-and-place table; 13. Moving seat; 14. Suction nozzle rod; 15. Limiting plate; 2. Cleaning assembly; 21. Cleaning plate; 22. High-pressure exhaust pipe; 23. Dust extraction ring; 24. Dust extraction slot; 25. Dust accumulation slot; 26. Filter ring; 27. Filter net; 28. Collection box; 29. ​​Total exhaust plate; 210. Telescopic spring rod; 221. Fixed seat; 222. Reset spring rod; 223. L-shaped seat; 224. Blocking plate; 225. Torsion spring; 226. Electronic valve; 3. Suspension buffer assembly; 31. Support seat; 32. Connecting seat; 321. Connecting slot; 33. Magnet; 34. Limiting slot; 35. Square slot; 36. Magnet ring; 310. Magnetic control device; 311. Shielding plate; 312. Rack plate; 313. Transmission gear; 314. Torsion rod; 315. Dial; 316. Pointer head; 331. Damping spring rod.

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0023] like Figure 1-Figure 3 As shown, a device for taking and placing integrated circuit chips comprises a workbench 1, on which a placing table 11 and a taking and placing table 12 are respectively arranged from back to front, a moving seat 13 is arranged at the rear end of the workbench 1, a first driving mechanism for driving the moving seat 13 to reach the positions of the placing table 11 and the taking and placing table 12 is installed on the workbench 1, a plurality of suction nozzle rods 14 for adsorbing chips are arranged on the moving seat 13, an air pump for gas extraction is arranged on the suction nozzle rod 14, a limiting plate 15 moving along the front and rear directions is arranged at the bottom of the moving seat 13, an electric push rod for driving the limiting plate 15 is installed on the moving seat 13, a cleaning component 2 is arranged on the limiting plate 15 on the side corresponding to the suction nozzle rod 14, which is used to quickly clean the impurities on the surface of the chip before the suction nozzle rod 14 adsorbs the chip, and a cleaning component 2 is arranged on the moving seat 13 A second driving mechanism is installed to drive the suction nozzle rod 14 and the limit plate 15 to move up and down. It should be noted that, first, the chip to be picked up and placed is placed on the placement table 11, and the first driving mechanism drives the movable seat 13 to move to the position of the placement table 11. The air pump is started, and the suction nozzle rod 14 generates an adsorption force to prepare for adsorbing the chip. Before adsorbing the chip, the cleaning component 2 on the limit plate 15 cleans the impurities on the surface of the chip. After the suction nozzle rod 14 adsorbs the chip, the driving mechanism drives the movable seat 13 to move to the position of the pick-up and placement table 12. At the pick-up and placement table 12, the air pump stops working, and the suction nozzle rod 14 releases the chip to complete the chip pick-up and placement operation, thereby realizing automatic pick-up and placement of the integrated circuit chip between the placement table 11 and the pick-up and placement table 12, and cleaning the impurities on the surface of the chip before adsorbing it to ensure the quality and reliability of the chip.

[0024] like Figure 4-Figure 7As shown, the cleaning assembly 2 includes a cleaning disc 21 arranged in a hollow shape, the inner cavity of the cleaning disc 21 is installed with a high-pressure exhaust pipe 22 in an annular array, the bottom of the cleaning disc 21 is installed with a dust extraction ring 23 connected to the high-pressure exhaust pipe 22, the bottom of the dust extraction ring 23 is provided with a dust extraction groove 24, the top of the dust extraction ring 23 is provided with a dust accumulation groove 25 for connecting one end of the high-pressure exhaust pipe 22 with the dust extraction groove 24, and a filter ring 26 is installed on the outer side of the cleaning disc 21, and one end of the high-pressure exhaust pipe 22 passes through the inner cavity of the filter ring 26. The cavity is installed with a filter screen 27, and the filter screen 27 is arranged in an inclined shape. A collection box 28 for collecting impurities is threadedly connected to the bottom of the filter ring 26. A collection groove connected to the collection box 28 is provided at the bottom of the filter ring 26. A vacuum plate 29 connected to the high-pressure vacuum pipe 22 is provided on the top of the filter ring 26. The top of the vacuum plate 29 is plugged and installed under the limit plate 15. The vacuum plate 29 is connected to the air pump. A plurality of telescopic spring rods 210 are installed between the vacuum plate 29 and the filter ring 26.

[0025] It should be noted that, first, when the cleaning component 2 is working, the electric push rod drives the limit plate 15 to move onto the placement table 11, and the second driving mechanism drives the limit plate 15 and the suction nozzle rod 14 to move toward the placement table 11, and the air pump starts the vacuum plate 29 to generate negative pressure, and the air is sucked from the dust extraction groove 24 at the bottom of the dust extraction ring 23 through the high-pressure suction pipe 22. The impurities on the surface of the chip are sucked into the dust extraction groove 24 along with the airflow, and then enter the dust accumulation groove 25, and then enter the filter ring 26 through the high-pressure suction pipe 22. The filter screen 27 filters the impurities, and the inclined filter screen 27 allows the impurities to slide down to the collection box 28 under the action of gravity and airflow. The collection box 28 is conveniently disassembled and cleaned through a threaded connection to ensure that the impurities will not return to the high-pressure suction pipe 22 again. The telescopic spring rod 210 can adjust the position of the dust extraction ring 23 according to the thickness of different chips during operation to improve the cleaning effect. like Figure 6-Figure 7 As shown, the dust extraction groove 24 is arranged in a square shape as a whole. The dust extraction groove 24 is arranged to expand outward in the axial direction close to the dust extraction ring 23, providing a larger dust collection coverage area, which can more comprehensively cover the chip surface and ensure that as many impurities as possible are sucked away during the cleaning process. The dust extraction groove 24 is arranged in an upward arc shape away from the axial direction of the dust extraction ring 23. When the vacuum main disk 29 generates negative pressure, the arc design can make the airflow enter the dust extraction groove 24 more smoothly, thereby improving the dust collection efficiency. The longitudinal section of the dust accumulation groove 25 is arranged to be gathered upward. As the airflow carries impurities into the dust accumulation groove 25, the gathered structure can prevent the impurities from diffusing in the dust accumulation groove 25, thereby ensuring that the impurities can smoothly pass through the high-pressure exhaust pipe 22 into the filter ring 26 for filtration.

[0026] like Figure 8As shown, a sealing gasket is installed below the cleaning disk 21 and on the outside of the dust extraction ring 23. A plurality of chip tables 111 are arranged on the placement table 11. The chip tables 111 are provided with chip slots for storing chips. When cleaning dust, the sealing gasket contacts the surface of the chip table 111 to quickly clean the dust on the surface of the chip.

[0027] It should be noted that when the cleaning disk 21 is close to the chip stage 111 for dust cleaning, the sealing gasket contacts the surface of the chip stage 111. At this time, the sealing gasket plays a sealing role, and the space between the bottom of the cleaning disk 21 and the chip stage 111 is relatively closed. Under the action of the negative pressure generated by the exhaust main disk 29, a local negative pressure environment will quickly form in this sealed space. This local negative pressure causes the air around the chip to quickly flow to the dust extraction slot 24 with dust, thereby enhancing the concentration of the airflow.

[0028] The chip table 111 is located on the inner wall of the chip slot and is equipped with a pair of U-shaped rubber pads 1111, and the pair of rubber pads 1111 are arranged to be vertically connected to each other. Since the two rubber pads 1111 are vertically connected to each other, they can apply a certain pressure to the chip in both horizontal and vertical directions to prevent the chip from moving or shaking in the chip slot, thereby ensuring the stability of the chip position during the placement and taking process, and effectively reducing the impact of such vibration on the chip.

[0029] like Figure 4 and Fig. 9 As shown, a fixed seat 221 is installed on the top of the filter ring 26, and a return spring rod 222 is installed in the fixed seat 221. The top of the return spring rod 222 is slidably connected to an L-shaped seat 223 which is connected to the inner side of the fixed seat 221 through a slide rail. A blocking plate 224 is rotatably connected to the horizontal end of the L-shaped seat 223. A torsion spring 225 connected to the blocking plate 224 is installed in the vertical end of the L-shaped seat 223. The spring potential energy of the torsion spring 225 is greater than that of the return spring rod 222. The cleaning disk 21 is located inside the high-pressure exhaust pipe 22 and an electronic valve 226 is installed.

[0030] It should be noted that when the air pump is started, the suction nozzle rod 14 moves downward to prepare for adsorbing the chip. During the movement, the suction nozzle rod 14 contacts the blocking plate 224. Since the spring potential energy of the torsion spring 225 is greater than the reset spring rod 222 at this time, the blocking plate 224 will not be pushed open, but the pressure of the suction nozzle rod 14 causes the entire L-shaped seat to slide downward along the reset spring rod 222. As the L-shaped seat slides down, the blocking plate 224 continues to remain closed, concentrating the airflow on the high-pressure exhaust pipe 22. At this time, the electronic valve 226 opens, the exhaust main disk 29 generates negative pressure, and the high-pressure exhaust pipe 22 starts to work. The cleaning component 2 quickly cleans impurities on the surface of the chip before the suction nozzle rod 14 contacts the chip. The suction nozzle rod 14 continues to descend, driving the blocking plate 224 and the L The L-shaped seat continues to slide along the return spring rod 222. During this process, the cleaning component 2 continues to work, sucking impurities on the chip surface into the dust extraction groove 24 and the dust accumulation groove 25, and entering the collection box 28 after being filtered by the filter screen 27. When the cleaning component 2 finishes working, the suction nozzle rod 14 continues to descend and contacts the chip for adsorption. At this time, the suction nozzle rod 14 drives the blocking plate 224 to rotate in the horizontal end of the L-shaped seat, and the torsion spring 225 enters a compressed state. When the suction nozzle rod 14 takes the chip away, the suction nozzle rod 14 moves upward. At this time, the spring potential energy of the torsion spring 225 and the return spring rod 222 is released, and the torsion spring 225 returns to its original state to drive the blocking plate 224 to reset. The return spring rod 222 extends and pushes the L-shaped seat back to its initial position. Through the cooperation of the blocking plate 224 and the L-shaped seat, the airflow can be concentrated on the high-pressure exhaust pipe 22 during the descent of the suction nozzle rod 14, so that the cleaning component 2 can be quickly started and efficiently cleaned before the suction nozzle rod 14 contacts the chip, thereby greatly improving the cleaning efficiency of impurities on the chip surface.

[0031] like Figure 10-11 As shown, a suspension buffer component 3 is provided in the placement table 11, which is used to prevent the surface of the chip from being rubbed and squeezed when the nozzle rod 14 is adsorbed. The suspension buffer component 3 includes a support seat 31 for supporting the chip stage 111. The inner cavity of the workbench 1 is provided with an opening for storing the chip stage 111. The support seat 31 is fixedly connected at the bottom end of the opening, and a connecting seat 32 is installed between the chip stages 111 in a group of six. The placement table 11 is provided with a connecting groove 321 between adjacent openings, and a limiting groove 34 connected to the opening is provided on the top of the placement table 11, and the limiting groove 34 is adapted to the collection box 28. The placement table 11 is provided with a square groove 35 below the opening, and a magnet ring 36 is installed on one side of the bottom wall of the square groove 35 corresponding to the magnet 33.

[0032] It should be noted that when the cleaning component 2 is working, the collection box 28 is located in the limit groove 34, ensuring the stable position of the cleaning component 2, and also limiting the position of the chip stage 111 and the suction nozzle rod 14 to a certain extent. When the suction nozzle rod 14 approaches the chip to prepare for adsorption, the magnet 33 on the chip stage 111 interacts with the magnet ring 36 on the bottom wall of the square groove 35 to generate magnetic force, causing the chip stage 111 to move upward in the opening and be in a suspended state, thereby preventing the chip surface from being rubbed and squeezed during the adsorption process of the suction nozzle rod 14, thereby protecting the surface quality of the chip.

[0033] like Fig.11 As shown, a vertically arranged damping spring rod 331 is installed on the inner side of the connection groove 321 of the placement platform 11 , and the damping spring rod 331 is slidably connected to the connection seat 32 .

[0034] It should be noted that when the chip stage 111 is subjected to magnetic force, the connecting seat 32 will produce a certain displacement in the connecting groove 321. Since the damping spring rod 331 is vertically arranged and slidingly connected to the connecting seat 32, the displacement of the connecting seat 32 will cause the damping spring rod 331 to be compressed or stretched. The damping spring rod 331 can provide a certain buffering effect. On the other hand, the existence of damping can consume energy, slow down the movement speed of the connecting seat 32, and make the movement of the entire system more stable.

[0035] like Figure 10-12 As shown, a magnetic control device 310 is provided on the left and right sides of the placement table 11, and the magnetic control device 310 includes a shielding plate 311 slidably connected to the front and rear sides of the square groove 35, the shielding plate 311 is a shielding material, and rack plates 312 are installed on the left and right ends of the shielding plate 311. The front and rear ends of the square groove 35 are rotatably connected to the transmission gear 313 meshing with the rack plates 312 located at the front and rear ends, and the left and right ends of the placement table 11 are rotatably connected to the torsion rod 314 for driving the transmission gear 313 to rotate.

[0036] It should be noted that the operator determines the size of the magnetic field to be adjusted according to the different thicknesses of the chips, specifically by rotating the torsion rod 314 at the left and right ends of the placement table 11. The rotation of the torsion rod 314 drives the transmission gear 313 connected thereto to rotate. Since the transmission gear 313 is meshed with the rack plates 312 at the left and right ends of the shielding plate 311, the rotation of the transmission gear 313 causes the rack plate 312 to move relative to each other. The movement of the rack plate 312 then drives the shielding plate 311 to slide on the front and rear sides of the square groove 35. When it is necessary to enhance the magnetic field, the torsion rod 314 is rotated to move the shielding plate 311 away from the magnet ring 36 and the magnet 33 of the chip table 111, thereby reducing the shielding effect on the magnetic field. When it is necessary to weaken the magnetic field, the torsion rod 314 is rotated in the opposite direction to make the shielding plate 311 close to the magnet ring 36 and the magnet 33, thereby enhancing the shielding effect and reducing the magnetic field strength. Chips of different thicknesses may require different suspension forces when being adsorbed by the nozzle rod 14. By adjusting the spacing between the shielding plates 311 to control the magnetic field size, precise adjustments can be made according to the specific thickness of the chip to ensure that the chip will not be subjected to friction or compression during the process of taking and placing, and can maintain a stable suspension state. A distance sensor for detecting the thickness of the chip stage 111 is installed on the support seat 31 , a dial plate 315 is installed on the left side of the placement table 11 , a pointer head 316 is installed on the outer side of the torsion rod 314 , and a display screen is installed on the placement table 11 .

[0037] It should be noted that the distance sensor transmits the detected thickness information of the chip stage 111 to the control system of the placement table 11. The control system calculates the appropriate magnetic field size based on the thickness of the chip stage 111 and displays it on the display screen. The operator calculates the thickness information of the chip stage 111 and the recommended magnetic field adjustment plan based on the thickness information of the chip stage 111 displayed on the display screen. The pointer head 316 on the outside of the torsion rod 314 moves on the dial 315 as the torsion rod 314 rotates. The operator can roughly understand the moving distance of the shielding plate 311 and the degree of magnetic field adjustment through the position of the pointer head 316 on the dial 315.

[0038] The working principle of the present invention is as follows: when the cleaning assembly 2 is working, the electric push rod drives the cleaning disk 21 on the limit plate 15 to approach the chip stage 111. The sealing pad under the cleaning disk 21 contacts the surface of the chip stage 111 to form a sealed space, and the air pump starts the exhaust main disk 29 to generate negative pressure, and the air is sucked from the dust extraction groove 24 at the bottom of the dust extraction ring 23 through the high-pressure exhaust pipe 22 in the inner cavity of the cleaning disk 21 in a ring array. The dust extraction groove 24 is square in shape as a whole, expanding outwards in the direction close to the axis of the dust extraction ring 23 to provide a larger dust collection coverage area; it is in an upward arc shape away from the axis of the dust extraction ring 23, so that the airflow enters the dust extraction groove 24 more smoothly, and the impurities on the surface of the chip are sucked into the dust extraction groove 24 along with the airflow, and then enter the dust accumulation groove 25. The longitudinal section of the dust accumulation groove 25 is upwardly contracted to prevent the diffusion of impurities, ensuring that the impurities can smoothly pass through the high-pressure exhaust pipe 22 into the filter ring 26. The filter screen 27 in the filter ring 26 is arranged in an inclined shape to filter the impurities. The impurities slide down to the collection box 28 with thread connection below under the action of gravity and airflow; The air pump starts the suction nozzle rod 14 to move down to prepare for adsorbing the chip and contact the plugging plate 224. The L-shaped seat slides down along the return spring rod 222. The plugging plate 224 is closed to concentrate the airflow on the high-pressure exhaust pipe 22. The electronic valve 226 is opened. The cleaning component 2 cleans the impurities before the suction nozzle rod 14 contacts the chip. The suction nozzle rod 14 moves down to drive the plugging plate 224 and the L-shaped seat to slide. When the work is finished, the suction nozzle rod 14 drives the plugging plate 224 to rotate. After the chip is taken away, the torsion spring 225 and the return spring rod 222 are reset. When the suction nozzle rod 14 approaches the chip and is ready to be sucked, the magnet 33 on the chip stage 111 interacts with the magnet ring 36 on the bottom wall of the square groove 35 to generate magnetic force, so that the chip stage 111 moves upward in the opening and is in a suspended state. At the same time, the collection box 28 is located in the limit groove 34 connected to the opening at the top of the placement table 11, ensuring the stability of the cleaning component 2, and also plays a certain role in limiting the position of the chip stage 111 and the suction nozzle rod 14. When the chip stage 111 is subjected to magnetic force, the connecting seat 32 will produce a certain displacement in the connecting groove 321, and the damping spring rod 331 slidably connected to the connecting seat 32 will be compressed or stretched to provide a buffering effect.

[0039] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A pick-and-place device for integrated circuit chips, characterized in that; The invention comprises a workbench (1), wherein a placement table (11) and a pick-up and drop table (12) are respectively arranged on the workbench (1) from the back to the front, a movable seat (13) is arranged at the rear end of the workbench (1), a plurality of suction nozzle rods (14) for adsorbing chips are arranged on the movable seat (13), a limiting plate (15) movable along the front-back direction is arranged at the bottom of the movable seat (13), a cleaning component (2) is arranged on the limiting plate (15) on the side corresponding to the suction nozzle rod (14), and is used for quickly cleaning impurities on the surface of the chip before the suction nozzle rod (14) adsorbs the chip surface, and a suspension buffer component (3) is arranged in the placement table (11), and is used for preventing the surface of the chip from being rubbed and squeezed when the suction nozzle rod (14) adsorbs the chip.

2. A pick-and-place device for integrated circuit chips according to claim 1, characterized in that; The cleaning assembly (2) comprises a cleaning disc (21) arranged in a hollow shape, the inner cavity of the cleaning disc (21) being provided with a ring-shaped array of high-pressure exhaust pipes (22), the bottom of the cleaning disc (21) being provided with a dust extraction ring (23) connected to the high-pressure exhaust pipes (22), the bottom of the dust extraction ring (23) being provided with a dust extraction groove (24), the top of the dust extraction ring (23) being provided with a dust accumulation groove (25) for connecting one end of the high-pressure exhaust pipe (22) with the dust extraction groove (24), a filter ring (26) being provided on the outer side of the cleaning disc (21), one end of the high-pressure exhaust pipe (22) passing through the dust extraction groove (24), and a filter ring (26) being provided on the outer side of the cleaning disc (21). A filter screen (27) is installed in the inner cavity of the filter ring (26), and the filter screen (27) is arranged in an inclined shape. A collection box (28) for collecting impurities is threadedly connected below the filter ring (26). A collection groove connected to the collection box (28) is provided below the filter ring (26). A suction main plate (29) connected to the high-pressure suction pipe (22) is provided on the top of the filter ring (26). The top of the suction main plate (29) is plugged and installed below the limit plate (15). A plurality of telescopic spring rods (210) are installed between the suction main plate (29) and the filter ring (26).

3. A pick-and-place device for integrated circuit chips according to claim 2, characterized in that; The dust extraction groove (24) is arranged in a square shape as a whole, the dust extraction groove (24) is arranged in an outward expansion direction close to the axial direction of the dust extraction ring (23), the dust extraction groove (24) is arranged in an upward arc shape away from the axial direction of the dust extraction ring (23), and the longitudinal section of the dust accumulation groove (25) is arranged in an upward contraction shape.

4. A pick-and-place device for integrated circuit chips according to claim 2, characterized in that; A sealing gasket is installed below the cleaning disk (21) and outside the dust extraction ring (23); a plurality of chip tables (111) are arranged on the placement table (11); chip slots for storing chips are provided in the chip tables (111); when cleaning dust, the sealing gasket contacts the surface of the chip table (111) to quickly clean the dust on the surface of the chip.

5. A pick-and-place device for integrated circuit chips according to claim 2, characterized in that; A fixed seat (221) is installed on the top of the filter ring (26), a return spring rod (222) is installed in the fixed seat (221), the top of the return spring rod (222) is slidably connected to an L-shaped seat (223) connected to the inner side of the fixed seat (221) via a slide rail, a blocking plate (224) is rotatably connected to the horizontal end of the L-shaped seat (223), a torsion spring (225) connected to the blocking plate (224) is installed in the vertical end of the L-shaped seat (223), the spring potential energy of the torsion spring (225) is greater than that of the return spring rod (222), and an electronic valve (226) is installed on the cleaning disk (21) located inside the high-pressure exhaust pipe (22).

6. A pick-and-place device for integrated circuit chips according to claim 1, characterized in that; The suspension buffer component (3) includes a support seat (31) for supporting the chip stage (111), the inner cavity of the workbench (1) is provided with an opening for storing the chip stage (111), the support seat (31) is fixedly connected at the bottom end of the opening, and a connecting seat (32) is installed between six chip stages (111) in a group, the placement table (11) is provided with a connecting groove (321) between adjacent openings, the top of the placement table (11) is provided with a limiting groove (34) connected to the opening, the limiting groove (34) is adapted to the collection box (28), the placement table (11) is provided with a square groove (35) below the opening, and a magnet ring (36) is installed on the bottom wall of the square groove (35) corresponding to the side of the magnet (33), and a magnetic control device (310) is provided on the left and right sides of the placement table (11).

7. A pick-and-place device for integrated circuit chips according to claim 6, characterized in that; The magnetic force control device (310) comprises a shielding plate (311) slidably connected to the front and rear sides of the square slot (35); rack plates (312) are installed at both left and right ends of the shielding plate (311); the front and rear ends of the square slot (35) are rotatably connected to transmission gears (313) meshing with the rack plates (312) located at the front and rear ends; and the left and right ends of the placement platform (11) are rotatably connected to torsion rods (314) for driving the transmission gears (313) to rotate.

8. A pick-and-place device for integrated circuit chips according to claim 7, characterized in that; A distance sensor for detecting the thickness of the chip stage (111) is installed on the support seat (31), a scale plate (315) is installed on the left side of the placement table (11), and a pointer head (316) is installed on the outer side of the torsion rod (314).

9. A pick-and-place device for integrated circuit chips according to claim 4, characterized in that; The placement platform (11) is provided with a vertically arranged damping spring rod (331) located inside the connection groove (321), and the damping spring rod (331) is slidably connected to the connection seat (32).

10. A pick-and-place device for integrated circuit chips according to claim 8, characterized in that; A pair of U-shaped rubber pads (1111) are installed on the inner wall of the chip platform (111) located at the chip slot, and the pair of rubber pads (1111) are arranged to be vertically connected to each other.

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