A semiconductor module cooling device

Abstract

The present invention relates to the technical field of semiconductor cooling equipment, and specifically to a semiconductor module cooling device, comprising a cooling box, a water cooling mechanism is provided at the upper end of the cooling box, an air cooling mechanism is fixedly connected to the water cooling mechanism, the water circulation component is fixedly connected to the upper end of the cooling box, a sprinkler component is fixedly connected inside the water circulation component, the air outlet component is arranged in the cooling box, the water outlet end of the water pump is fixedly connected to a double-conical water guide pipe through a hose, the water inlet end of the water pump is fixedly connected to the lower end of a spiral tube, and when the water pump works, cooling water in the spiral tube enters the double-conical water guide pipe, and then enters the sprinkler component and is sprayed out, and the sprayed water falls into a conical reflux barrel, and from the bottom of the conical reflux barrel, passes through the conical tube and the valve in sequence, and enters the spiral tube, and so on and so forth, cooling the cooling box while purifying the air in the inner cavity of the conical reflux barrel, so as to prevent impurities mixed in the air from falling onto the surface of the semiconductor and affecting its performance.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor cooling equipment, in particular to a semiconductor module cooling device. Background Art

[0002] In the manufacturing process of semiconductor devices, the semiconductor devices need to be cooled. The existing semiconductor device cooling method generally sets the flow rate of nitrogen into the semiconductor device bearing area during the cooling process stage, and adjusts the wind speed of the cooling fan to a higher level. On the premise of ensuring that the oxygen content meets the standard, the semiconductor device is continuously cooled to a specified temperature.

[0003] The existing publication number is: CN117153731A, which is a semiconductor cooling device, including a radiator that dissipates heat through heat conduction, a dustproof box that holds the entire device, and a water pump that supplies heat exchange liquid; the top plate of the box is provided with two sets of flange mounting ports, the bottom of the flange mounting ports are facing two sets of fans, the fan base is fixedly mounted on the top of the radiator, the bottom plate of the radiator is mounted on the upper open end of the stratified water tank, the water pipe inside the water supply butt sleeve at the bottom of the stratified water tank extends into the water supply sleeve, and the extended water pipe is connected to the water supply of the water pump; the radiator is inserted with a plug to be dissipated, and the plug is embedded with semiconductor sheets. A plug-in semiconductor cooling device, a cabinet-type structure to install the cooling device, and the semiconductor cooling plug is inserted into the radiator to complete the batch semiconductor cooling process. The radiator completes heat dissipation and liquid exchange through the drainage structure of the upper and lower sealing layers. The refined pipeline at the bottom of the radiator is adapted to the refined heat dissipation fins of the radiator to transmit the heat exchange liquid;

[0004] The existing semiconductor cooling devices mainly have the following disadvantages:

[0005] When the semiconductor is air-cooled, the surface temperature of the semiconductor is high. When it is cooled, the temperature drops. As the temperature drops, the water vapor around the semiconductor will condense into small water droplets mixed with impurities in the air and fall onto the surface of the semiconductor. After the water droplets dry, the impurities condense on the surface of the semiconductor and affect its performance. Summary of the invention

[0006] The object of the present invention is to provide a semiconductor module cooling device to solve the problems raised in the above background technology.

[0007] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme:

[0008] A semiconductor module cooling device is provided, comprising a cooling box, wherein a water cooling mechanism is provided at the upper end of the cooling box, and an air cooling mechanism is fixedly connected to the water cooling mechanism;

[0009] The water cooling mechanism comprises:

[0010] A water circulation assembly, wherein the water circulation assembly is fixedly connected to the upper end of the cooling box, and a sprinkler assembly is fixedly connected inside the water circulation assembly; and

[0011] The air cooling mechanism comprises:

[0012] A connecting component is fixedly connected to the water circulation component, an air outlet component is fixedly connected to the connecting component, the air outlet component is arranged in a cooling box, an air pressure control component is fixedly connected to the upper end of the cooling box, and a vacuum pump is fixedly connected to one side of the cooling box.

[0013] Furthermore, the water circulation component includes:

[0014] A conical reflux barrel, the conical reflux barrel is fixedly connected to the top of the cooling box, the lower end of the conical reflux barrel is fixedly connected to the upper end of the conical tube, the lower end of the conical tube is fixedly connected to the upper end of the valve, the lower end of the valve is fixedly connected to the upper end of the spiral tube, and the spiral tube is arranged in the cooling box; and

[0015] The side of the conical reflux barrel is provided with a plurality of air outlets, a water pump is fixedly connected to the conical reflux barrel, a water leakage block is fixedly connected to the bottom of the inner cavity of the conical reflux barrel, the water leakage block is fixedly connected to the lower end of the double-conical water guide pipe, and the upper end of the double-conical water guide pipe is fixedly connected to the lower end of the sprinkler assembly; and

[0016] An air duct is fixedly connected inside the conical reflux barrel, a plurality of air guide ports are opened on the air duct, a plurality of annular anti-splashing baffles are fixedly connected to the outer side of the air duct, and the plurality of annular anti-splashing baffles are arranged at the positions of the air guide ports, a primary air inlet plate and a secondary air inlet plate are fixedly connected to the conical reflux barrel, and the secondary air inlet plate is arranged at the upper end of the primary air inlet plate.

[0017] Furthermore, a water inlet is provided on one side of the double-conical water pipe, and a plurality of water outlets are provided on the water drain block; and

[0018] A plurality of primary air inlets are provided at a position close to the edge of the primary air inlet plate, and a plurality of secondary air inlets are provided at a central position of the secondary air inlet plate.

[0019] Furthermore, the sprinkler assembly includes:

[0020] Bearing 1, the bearing 1 is fixedly connected to the upper end of the double-conical water guide pipe, the bearing 1 is fixedly connected to the lower end of the water spray pipe, the water spray pipe is provided with a plurality of water outlets, a hollow connecting plate is fixedly connected to the position of the water outlets, a plurality of nozzles are fixedly connected to the tangent position of the hollow connecting plate, and a cover 1 is fixedly connected to the upper end of the hollow connecting plate.

[0021] Furthermore, the connection component includes:

[0022] An annular air storage chamber, the annular air storage chamber is fixedly connected to the position of the air outlet, condensers are fixedly connected to both sides of the annular air storage chamber, one side of the condenser is fixedly connected to an air pump, the air pump is fixedly connected to one end of the angled tube, the other end of the angled tube is fixedly connected to the air outlet assembly, and a second cover is fixedly connected to the annular air storage chamber.

[0023] Furthermore, the air outlet component includes:

[0024] An air outlet pipe, wherein a plurality of air outlet nozzles are fixedly connected to the tangent line of the outer surface of the air outlet pipe, two ends of the inner cavity of the air outlet pipe are fixedly connected to bearing 2, two ends of the air outlet pipe are fixedly connected to conical covers, and the other end of the angled pipe is fixedly connected to bearing 2.

[0025] Furthermore, the air pressure control component includes:

[0026] A connecting control tube, the connecting control tube is fixedly connected to the upper end of the cooling box, a piston is slidably connected inside the connecting control tube, the piston is fixedly connected to the lower end of the ejector pin, the ejector pin is slidably connected to the connecting control tube, the ejector pin is fixedly connected to one end of a spring, the other end of the spring is fixedly connected to the upper end of the connecting control tube, and a plurality of air outlet holes are annularly opened on the connecting control tube.

[0027] Compared with the prior art, one or more of the above technical solutions have the following beneficial effects:

[0028] 1. The water outlet of the water pump is fixedly connected to the double-conical water pipe through a hose, and the water inlet of the water pump is fixedly connected to the lower end of the spiral tube. When the water pump works, the cooling water in the spiral tube enters the double-conical water pipe, and then enters the sprinkler assembly for spraying. The sprayed water falls into the conical reflux barrel, and from the bottom of the conical reflux barrel, it passes through the conical tube and the valve in turn and enters the spiral tube. This reciprocating process cools the cooling box while purifying the air in the inner cavity of the conical reflux barrel to prevent impurities in the air from falling onto the surface of the semiconductor and affecting its performance.

[0029] 2. The air pump and the condenser work together, so that the purified air in the conical reflux barrel passes through the condenser and the air pump in turn and enters the angled tube. The air entering the angled tube further enters the air outlet pipe and is ejected from the air outlet nozzle. At the same time, the air outlet pipe rotates, so that the semiconductor surface is cooled evenly.

[0030] 3. The cooling water enters the double-conical water pipe from the water inlet. The falling water after spraying enters the conical pipe from the water outlet. The outside air enters the conical reflux barrel through the secondary air inlet and the primary air inlet. After the cooling water enters the double-conical water pipe, it enters the water spray pipe, enters the hollow connecting plate from the water outlet, and is sprayed out from the nozzle. According to Newton's third law, the water spray pipe rotates at the same time to remove impurities in the air more completely. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0032] In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0034] Figure 2 It is a schematic diagram of the overall three-dimensional structure of the cooling box of the present invention;

[0035] Figure 3 It is a schematic diagram of the overall three-dimensional structure of the water cooling mechanism of the present invention;

[0036] Figure 4 It is a schematic diagram of the overall three-dimensional structure of the water cooling mechanism of the present invention;

[0037] Figure 5 It is a schematic diagram of the overall three-dimensional structure of the water circulation component of the present invention;

[0038] Figure 6 It is a schematic diagram of the overall three-dimensional structure of the sprinkler assembly of the present invention;

[0039] Figure 7 It is a schematic diagram of the overall three-dimensional structure of the sprinkler assembly of the present invention;

[0040] Figure 8 It is a schematic diagram of the overall three-dimensional structure of the double-conical water pipe of the present invention;

[0041] Fig. 9 It is a schematic diagram of the overall three-dimensional structure of the air guide pipe of the present invention;

[0042] Fig.10It is a schematic diagram of the overall three-dimensional structure of the connection assembly of the present invention;

[0043] Fig.11 It is a schematic diagram of the overall three-dimensional structure of the connection assembly of the present invention;

[0044] Fig.12 It is a schematic diagram of the overall three-dimensional structure of the air outlet assembly of the present invention;

[0045] Fig.13 It is a schematic diagram of the overall three-dimensional structure of the air pressure control assembly of the present invention;

[0046] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0047] 1. Cooling box; 11. Vacuum pump;

[0048] 2. Water cooling mechanism; 21. Water circulation assembly; 211. Conical reflux barrel; 2111. Air outlet; 2112. First-stage air inlet plate; 2113. Second-stage air inlet plate; 2114. First-stage air inlet; 2115. Second-stage air inlet; 212. Conical pipe; 213. Valve; 214. Spiral pipe; 215. Water pump; 216. Water leak block; 2161. Water outlet; 217. Double-conical water guide pipe; 2171. Water inlet; 218. Air guide pipe; 2181. Air guide port; 2182. Annular anti-splash baffle; 22. Sprinkler assembly; 221. Bearing 1; 222. Spray pipe; 2221. Water outlet; 223. Hollow connecting plate; 224. Nozzle; 225. Cover 1;

[0049] 3. Air cooling mechanism; 31. Connecting assembly; 311. Annular air storage chamber; 312. Condenser; 313. Air pump; 314. Angle pipe; 315. Second cover; 32. Air outlet assembly; 321. Air outlet pipe; 322. Air outlet nozzle; 323. Second bearing; 324. Conical cover; 33. Air pressure control assembly; 331. Connecting control pipe; 3311. Air outlet hole; 332. Piston; 333. Ejector pin; 334. Spring. DETAILED DESCRIPTION

[0050] In order to enable those skilled in the art to better understand the solution of the present application, the following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application.

[0051] Reference Figure 1-4As shown in Figure 12, a semiconductor module cooling device comprises a cooling box 1, a water cooling mechanism 2 is provided at the upper end of the cooling box 1, and an air cooling mechanism 3 is fixedly connected to the water cooling mechanism 2;

[0052] The water cooling mechanism 2 includes:

[0053] A water circulation component 21, wherein the water circulation component 21 is fixedly connected to the upper end of the cooling box 1, and a sprinkler component 22 is fixedly connected inside the water circulation component 21; and

[0054] The air cooling mechanism 3 includes:

[0055] A connecting component 31 is fixedly connected to the water circulation component 21, an air outlet component 32 is fixedly connected to the connecting component 31, and the air outlet component 32 is arranged in the cooling box 1. An air pressure control component 33 is fixedly connected to the upper end of the cooling box 1, and a vacuum pump 11 is fixedly connected to one side of the cooling box 1.

[0056] The semiconductor module is placed in the cooling box 1, and the cooling box 1 is evacuated by the vacuum pump 11. The water circulation component 21 works so that the cooling water enters the sprinkler component 22 and is sprayed out. At the same time, the sprinkler component 22 rotates so that the impurities in the air in the inner cavity of the water circulation component 21 fall onto the water circulation component 21 along with the sprayed water to purify the air. The water that falls after spraying enters the lower end of the water circulation component 21, and its lower end is arranged in the cooling box 1, so that the cooling water can cool the semiconductor module and maintain the temperature in the cooling box 1 stable. At the same time, the connecting component 31 works to cool the purified air in the water circulation component 21 and then spray it out through the air outlet component 32 to cool the semiconductor module.

[0057] Reference Figure 5 and 8 As shown in -9, the water circulation component 21 includes:

[0058] A conical reflux barrel 211, the conical reflux barrel 211 is fixedly connected to the top of the cooling box 1, the lower end of the conical reflux barrel 211 is fixedly connected to the upper end of a conical tube 212, the lower end of the conical tube 212 is fixedly connected to the upper end of a valve 213, the lower end of the valve 213 is fixedly connected to the upper end of a spiral tube 214, and the spiral tube 214 is arranged in the cooling box 1; and

[0059] The side of the conical reflux barrel 211 is provided with a plurality of air outlets 2111, a water pump 215 is fixedly connected inside the conical reflux barrel 211, a water leak block 216 is fixedly connected to the bottom of the inner cavity of the conical reflux barrel 211, the water leak block 216 is fixedly connected to the lower end of the double-conical water guide pipe 217, and the upper end of the double-conical water guide pipe 217 is fixedly connected to the lower end of the sprinkler assembly 22; and

[0060] An air duct 218 is fixedly connected inside the conical reflux barrel 211, and a plurality of air guide ports 2181 are opened on the air duct 218. A plurality of annular anti-splashing baffles 2182 are fixedly connected to the outer side of the air duct 218, and the plurality of annular anti-splashing baffles 2182 are arranged at the positions of the air guide ports 2181. A primary air inlet plate 2112 and a secondary air inlet plate 2113 are fixedly connected to the conical reflux barrel 211, and the secondary air inlet plate 2113 is arranged at the upper end of the primary air inlet plate 2112.

[0061] The water outlet of the water pump 215 is fixedly connected to the double-conical water pipe 217 through a hose, and the water inlet of the water pump 215 is fixedly connected to the lower end of the spiral tube 214. When the water pump 215 works, the cooling water in the spiral tube 214 enters the double-conical water pipe 217, and then enters the sprinkler assembly 22 for spraying. The sprayed water falls into the conical reflux barrel 211, and from the bottom of the conical reflux barrel 211, it passes through the conical tube 212 and the valve 213 in sequence and enters the spiral tube 214. This reciprocating process cools the cooling box 1 while purifying the air in the inner cavity of the conical reflux barrel 211.

[0062] A water inlet 2171 is provided on one side of the double-conical water pipe 217, and a plurality of water outlets 2161 are provided on the water drain block 216; and

[0063] A plurality of primary air inlets 2114 are provided at a position close to the edge of the primary air inlet plate 2112 , and a plurality of secondary air inlets 2115 are provided at a central position of the secondary air inlet plate 2113 .

[0064] The cooling water enters the double-conical water pipe 217 from the water inlet 2171 , and the falling water after spraying enters the conical pipe 212 from the water outlet 2161 , and the outside air enters the conical reflux barrel 211 through the secondary air inlet 2115 and the primary air inlet 2114 .

[0065] Reference Figure 6-7 As shown, the sprinkler assembly 22 includes:

[0066] A bearing 221 is fixedly connected to the upper end of the double-conical water pipe 217, and the bearing 221 is fixedly connected to the lower end of a water spray pipe 222. The water spray pipe 222 is provided with a plurality of water outlets 2221, and a hollow connecting plate 223 is fixedly connected to the position of the water outlets 2221, and a plurality of nozzles 224 are fixedly connected to the tangent position of the hollow connecting plate 223, and a cover 225 is fixedly connected to the upper end of the hollow connecting plate 223.

[0067] After the cooling water enters the double-conical water pipe 217, it enters the water spray pipe 222, enters the hollow connecting plate 223 from the water outlet 2221, and is sprayed out from the nozzle 224. According to Newton's third law, the water spray pipe 222 rotates at the same time.

[0068] Reference Figure 10-11 As shown, the connecting component 31 includes:

[0069] An annular air storage chamber 311 is fixedly connected to the position of the air outlet 2111, condensers 312 are fixedly connected to both sides of the annular air storage chamber 311, one side of the condenser 312 is fixedly connected to an air pump 313, the air pump 313 is fixedly connected to one end of an angled tube 314, the other end of the angled tube 314 is fixedly connected to the air outlet assembly 32, and a cover 2 315 is fixedly connected to the annular air storage chamber 311.

[0070] At the same time, the air pump 313 and the condenser 312 work together, so that the purified air in the conical reflux barrel 211 passes through the condenser 312 and the air pump 313 in turn and enters the angled tube 314.

[0071] The air outlet assembly 32 includes:

[0072] An air outlet pipe 321, wherein a plurality of air outlet nozzles 322 are fixedly connected to the tangent line of the outer surface of the air outlet pipe 321, bearings 323 are fixedly connected to both ends of the inner cavity of the air outlet pipe 321, conical covers 324 are fixedly connected to both ends of the air outlet pipe 321, and the other end of the angled tube 314 is fixedly connected to bearings 323.

[0073] The air entering the angled tube 314 further enters the air outlet pipe 321 and is ejected from the air outlet nozzle 322 , causing the air outlet pipe 321 to rotate.

[0074] Reference Fig.13 As shown, the air pressure control component 33 includes:

[0075] A connecting control tube 331 is fixedly connected to the upper end of the cooling box 1, a piston 332 is slidably connected inside the connecting control tube 331, the piston 332 is fixedly connected to the lower end of the ejector pin 333, the ejector pin 333 is slidably connected to the connecting control tube 331, the ejector pin 333 is fixedly connected to one end of a spring 334, the other end of the spring 334 is fixedly connected to the upper end of the connecting control tube 331, and a plurality of air outlet holes 3311 are annularly opened on the connecting control tube 331.

[0076] When the air pressure in the cooling box 1 is too high, the piston 332 moves upward, driving the ejector pin 333 to move upward, so that the spring 334 is stretched. When the piston 332 moves above the plane where the air outlet 3311 is located, the gas in the cooling box 1 flows out from the air outlet 3311.

[0077] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection, or it can be the internal communication of two elements, it can be a direct connection, or it can be an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0078] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor module cooling device, characterized in that: It comprises a cooling box (1), wherein a water cooling mechanism (2) is provided at the upper end of the cooling box (1), and an air cooling mechanism (3) is fixedly connected to the water cooling mechanism (2); wherein The water cooling mechanism (2) comprises: A water circulation component (21), the water circulation component (21) being fixedly connected to the upper end of the cooling box (1), and a sprinkler component (22) being fixedly connected inside the water circulation component (21); and The air cooling mechanism (3) comprises: A connecting component (31), the connecting component (31) being fixedly connected to the water circulation component (21), an air outlet component (32) being fixedly connected to the connecting component (31), and the air outlet component (32) being arranged in the cooling box (1); The water circulation component (21) comprises: A conical reflux barrel (211), the conical reflux barrel (211) being fixedly connected to the top of the cooling box (1), the lower end of the conical reflux barrel (211) being fixedly connected to the upper end of a conical tube (212), the lower end of the conical tube (212) being fixedly connected to the upper end of a valve (213), the lower end of the valve (213) being fixedly connected to the upper end of a spiral tube (214), and the spiral tube (214) being arranged in the cooling box (1); and The side of the conical reflux barrel (211) is provided with a plurality of air outlets (2111); a water pump (215) is fixedly connected inside the conical reflux barrel (211); a water leak block (216) is fixedly connected to the bottom of the inner cavity of the conical reflux barrel (211); the water leak block (216) is fixedly connected to the lower end of a double-conical water guide pipe (217); and the upper end of the double-conical water guide pipe (217) is fixedly connected to the lower end of a sprinkler assembly (22); and An air guide pipe (218) is fixedly connected inside the conical reflux barrel (211), a plurality of air guide ports (2181) are provided on the air guide pipe (218), and a primary air inlet plate (2112) and a secondary air inlet plate (2113) are fixedly connected to the conical reflux barrel (211); The connecting component (31) comprises: An annular air storage chamber (311), the annular air storage chamber (311) being fixedly connected to the position of the air outlet (2111), the two sides of the annular air storage chamber (311) being fixedly connected to condensers (312), one side of the condenser (312) being fixedly connected to an air pump (313), the air pump (313) being fixedly connected to one end of a folded angle tube (314), and the other end of the folded angle tube (314) being fixedly connected to an air outlet assembly (32).

2. A semiconductor module cooling device according to claim 1, characterized in that: A water inlet (2171) is provided on one side of the double-conical water guide pipe (217), and a plurality of water outlets (2161) are provided on the water drain block (216); and The first-level air inlet plate (2112) is provided with a plurality of first-level air inlets (2114) at a position close to the edge, and the second-level air inlet plate (2113) is provided with a plurality of second-level air inlets (2115) at a central position; The upper end of the cooling box (1) is fixedly connected to an air pressure control assembly (33), one side of the cooling box (1) is fixedly connected to a vacuum pump (11), the outer side of the air guide pipe (218) is fixedly connected to a plurality of annular anti-splash baffles (2182), the plurality of annular anti-splash baffles (2182) are arranged at the position of the air guide port (2181), the secondary air inlet plate (2113) is arranged at the upper end of the primary air inlet plate (2112), and the annular air storage chamber (311) is fixedly connected to a second cover (315).

3. A semiconductor module cooling device according to claim 2, characterized in that: The watering assembly (22) comprises: Bearing 1 (221), the bearing 1 (221) is fixedly connected to the upper end of the double-conical water guide pipe (217), the bearing 1 (221) is fixedly connected to the lower end of the water spray pipe (222), the water spray pipe (222) is provided with a plurality of water outlets (2221), a hollow connecting plate (223) is fixedly connected at the position of the water outlets (2221), a plurality of nozzles (224) are fixedly connected at the tangent position of the hollow connecting plate (223), and a cover 1 (225) is fixedly connected to the upper end of the hollow connecting plate (223).

4. A semiconductor module cooling device according to claim 3, characterized in that: The air outlet component (32) comprises: An air outlet pipe (321), wherein a plurality of air outlet nozzles (322) are fixedly connected on a tangent line of an outer surface of the air outlet pipe (321), two ends of an inner cavity of the air outlet pipe (321) are fixedly connected to bearing 2 (323), two ends of the air outlet pipe (321) are fixedly connected to conical covers (324), and the other end of the angled pipe (314) is fixedly connected to bearing 2 (323).

5. A semiconductor module cooling device according to claim 4, characterized in that: The air pressure control component (33) comprises: A connecting control pipe (331) is fixedly connected to the upper end of the cooling box (1); a piston (332) is slidably connected inside the connecting control pipe (331); the piston (332) is fixedly connected to the lower end of a ejector pin (333); the ejector pin (333) is slidably connected to the connecting control pipe (331); the ejector pin (333) is fixedly connected to one end of a spring (334); the other end of the spring (334) is fixedly connected to the upper end of the connecting control pipe (331); and a plurality of air outlet holes (3311) are annularly provided on the connecting control pipe (331).

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