Thin camera module and assembling method

Abstract

The invention discloses a thin camera module and an assembling method thereof, the thin camera module comprises a PCB, the upper surface of the PCB is provided with a step, and the PCB is hollow; the chip is suspended in the hollow part of the PCB, and the lower surface of the chip is flush with the lower surface of the PCB; the lens is arranged on the step of the PCB; the glass is arranged below the lens and directly faces the chip; the two shielding covers are arranged on the two sides of the lens; the lens is sleeved with the reinforcing part, one end of the reinforcing part is connected with the lens, and the other end of the reinforcing part is connected with the PCB. According to the thin camera module and the assembling method thereof, the lens is arranged on the step of the PCB, so that the overall thickness of the product is further reduced, the PCB and the lens are conveniently and quickly integrated by additionally arranging the reinforcing part, the overall strength of the product is high, the risk of chip fragmentation is effectively avoided, the actual use requirement is met, and the application range is wide. And the reliability and the yield are high.

Description

Technical Field

[0001] The present invention relates to the technical field of cameras, and in particular to a thin camera module and an assembling method thereof. Background Art

[0002] In today's era of rapid technological development, laptops have become an indispensable and important device in people's lives and work. With the continuous improvement of technology, the trend of thinner and lighter laptops has become more and more obvious. As one of the key components of a laptop camera, the traditional camera PCB design often has a certain redundancy in thickness and is difficult to fully adapt to development needs. In order to solve the above problems, the existing technology adopts a method of opening a hollow layer in the PCB and placing a chip in the hollow layer, thereby reducing the thickness of the camera module as a whole.

[0003] Regarding the above structure, it was found in actual use that although the overall thickness of the camera can be reduced, since the chip is set in the hollow of the PCB, the strength of the product is low, which can easily cause the chip to break, resulting in huge investment costs, high manufacturing costs, low yields and low reliability, and cannot meet the company's mass production and processing needs. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a thin camera module and an assembly method. The camera module product prepared by the present invention has high strength and yield rate, and can determine the flatness of the chip.

[0005] To achieve the above object, the technical solution adopted by the present invention is: a thin camera module, comprising:

[0006] PCB, wherein the upper surface of the PCB is provided with steps, and the inside of the PCB is hollow;

[0007] A chip is suspended in the hollow of the PCB, and the lower surface of the chip is flush with the lower surface of the PCB;

[0008] A lens is disposed on the step of the PCB;

[0009] Glass, arranged below the lens and facing the chip;

[0010] Shielding covers, two of which are arranged on both sides of the lens;

[0011] The reinforcing component is sleeved outside the lens, and one end of the reinforcing component is connected to the lens, and the other end is connected to the upper surface of the PCB.

[0012] Furthermore, the lower surface of the lens is connected to the upper surface of the PCB via AA fixing glue.

[0013] Furthermore, the chip is suspended in the hollow of the PCB with corresponding adhesive around the edges.

[0014] Furthermore, the reinforcing component is made of steel.

[0015] Furthermore, the reinforcing component includes a sleeve and a connecting piece; the sleeve is sleeved on the lens and connected to the outside of the lens; the two connecting pieces are arranged below the two ends of the sleeve and located between the shielding cover and the lens; the connecting piece is L-shaped, and the short side of the connecting piece is fixedly connected to the upper surface of the PCB by strong glue.

[0016] A method for assembling a thin camera module as claimed in claim 1, comprising the following steps:

[0017] S1. First, bond the PCB to the substrate to ensure its flatness.

[0018] S2. Apply glue on the short sides of the PCB in the Y direction close to the inner frame of the PCB from the front direction, then suspend the chip in the hollowed-out position of the PCB and stick the glue to the two side walls of the chip;

[0019] S3, carry out the WB wire bonding process, and then use the glue painting machine to paint glue on the front side of the long side of the chip in the X direction, so that the glue can be combined with the other two side walls of the chip and sealed and fixed;

[0020] S4. Draw AA fixing glue on the step of PCB, and then perform the operation to stick the lens on the step of PCB;

[0021] S5. Dispense glue on the upper surface of the PCB on the side close to the shielding cover;

[0022] S6. Use the vacuum of the machine to absorb the reinforcing component, put the reinforcing component between the lens and the shielding cover, and make the bottom of the reinforcing component bond with the glue in S5, so as to install the PCB and the lens as a whole.

[0023] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0024] 1. The thin camera module of the present invention further reduces the overall thickness of the product by setting the lens on the step of the PCB to meet the use requirements. At the same time, the lower surface of the chip and the PCB are flush to ensure the flatness of the chip.

[0025] 2. By adding a reinforcing component between the shielding cover and the lens, and connecting the reinforcing component to the PCB and the lens, the PCB and the lens can be quickly and conveniently integrated into one. The overall strength of the product is high, the risk of chip breakage is effectively avoided, the bending resistance is strong, the manufacturing cost is low, and the yield rate and reliability are high. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The technical solution of the present invention is further described below in conjunction with the accompanying drawings:

[0027] Figure 1 This is a schematic structural diagram of a thin camera module in one embodiment of the present invention;

[0028] Figure 2 is a cross-sectional view taken along line AA in one embodiment of the present invention;

[0029] Figure 3 is a cross-sectional view of BB in one embodiment of the present invention;

[0030] Among them: 1. PCB; 2. Chip; 3. Lens; 4. Glass; 5. Shielding cover; 6. Reinforcement component; 10. Step; 11. Hollowing; 12. Adhesive; 30. AA fixing glue; 60. Set plate; 61. Connector; 62. Super glue. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0032] The present invention provides a thin camera module and an assembly method to solve the problem in the prior art that a chip is arranged in a hollow layer of a PCB in order to reduce the thickness of the product, thereby reducing the overall strength of the camera module and causing the chip to break and be damaged.

[0033] For ease of understanding, the specific process in the embodiments of the present application is described below. Figures 1 to 3A thin camera module in an embodiment of the present application includes a PCB1, a chip 2, a lens 3, a glass 4, a shielding cover 5 and a reinforcing component 6; a step 10 is provided on the upper surface of the PCB1, and a hollow 11 is formed inside the PCB1; the chip 2 is suspended in the hollow of the PCB1, and the lower surface of the chip 2 is flush with the lower surface of the PCB1; the lens 3 is mounted on the step of the PCB; the glass 4 is arranged below the lens 3 and faces the chip 2; two shielding covers 5 are arranged on both sides of the lens 3; the reinforcing component 6 is sleeved outside the lens, and one end of the reinforcing component is connected to the lens, and the other end is connected to the upper surface of the PCB.

[0034] Furthermore, the lower surface of the lens 3 is connected to the upper surface of the PCB 1 via the AA fixing glue 30 , thereby enhancing the connection reliability between the lens 3 and the PCB 1 .

[0035] Furthermore, the chip 2 is suspended in the hollow of the PCB 1 with corresponding adhesive around the four sides thereof. During installation, it is necessary to ensure that the chip 2 is flush with the lower surface of the PCB 1, thereby ensuring the flatness of the chip 2.

[0036] Furthermore, the reinforcing component 6 is made of steel, and of course other materials may also be used as long as the overall strength of the product can be increased.

[0037] Furthermore, the reinforcing component 6 includes a sleeve plate 60 and a connecting piece 61; the sleeve plate 60 is sleeved on the lens 3 and connected to the outside of the lens 3; the two connecting pieces 61 are arranged below the two ends of the sleeve plate 60 and are located between the shielding cover 5 and the lens 3; the connecting piece 61 is L-shaped, and the short side of the connecting piece 61 is fixedly connected to the upper surface of the PCB1 by a strong glue 62.

[0038] Through the above-mentioned installation method, the reinforcing component 6 can be stably installed between the lens 3 and the shielding cover 5, and the reinforcing component 6 is installed in the form of being sleeved inside the lens 3. This not only sets the PCB 1 and the lens 3 into an integrated structure, but also improves the overall strength of the product, thereby preventing the chip in the hollow layer from being broken and damaged.

[0039] The thin camera module of the present invention further reduces the overall thickness of the product by setting the lens 3 on the step of PCB 1. Secondly, by adding a reinforcing component 6, the PCB and the lens are conveniently and quickly integrated into one. The overall strength of the product is high, the risk of chip breakage is effectively avoided, and actual usage requirements are met.

[0040] The reinforcing component 6 is sleeved between the lens 3 and the shielding cover 5 , so that the reinforcing component 6 increases the strength of the camera module in the lateral direction and can effectively prevent the chip from breaking.

[0041] In addition, the present invention also discloses a method for assembling a thin camera module, comprising the following steps:

[0042] S1. First, bond the PCB to the substrate film to ensure its flatness, thereby ensuring the flatness of the subsequent chips;

[0043] S2. Apply glue on the short sides of the PCB in the Y direction close to the inner frame of the PCB from the front direction, then suspend the chip in the hollowed-out position of the PCB and stick the glue to the two side walls of the chip;

[0044] S3, carry out the WB wire bonding process, and then use the glue painting machine to paint glue on the front side of the long side of the chip in the X direction, so that the glue can be combined with the other two side walls of the chip and sealed and fixed;

[0045] At this time, it is necessary to ensure that the chip is flush with the lower surface of the PCB. Since the lower surface of the PCB is horizontal, it can also be determined that the chip is in a horizontal setting.

[0046] S4. Draw AA fixing glue on the step of PCB, and then perform the operation to stick the lens on the step of PCB;

[0047] S5. Dispense glue on the upper surface of the PCB on the side close to the shielding cover;

[0048] S6. Use the vacuum of the machine to absorb the reinforcing component, put the reinforcing component between the lens and the shielding cover, and make the bottom of the reinforcing component bond with the glue in S5, so as to install the PCB and the lens as a whole.

[0049] In the above installation steps, in order to ensure the flatness of the chip 2, it is necessary to first attach the PCB1 to the bottom film of the carrier to ensure its flatness, and then attach the chip 2 to the hollow 11 of the PCB to ensure that the chip is flush with the lower surface of the PCB, so as to ensure the flatness of the chip 2, and the operation is convenient and quick.

[0050] In addition, by installing the reinforcing component 6 on the lens 3, the operation is convenient and labor-saving. At the same time, the reinforcing component 6 can effectively integrate the PCB and the lens, thereby improving the overall strength and bending resistance of the camera module, which meets actual usage requirements.

[0051] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A thin camera module, characterized in that: include: A PCB (1), wherein a step (10) is provided on the upper surface of the PCB (1), and the inside of the PCB (1) is hollow (11); A chip (2) is suspended in the hollow (11) of the PCB (1), and the lower surface of the chip (2) is flush with the lower surface of the PCB (1); A lens (3) is disposed on a step (10) of the PCB (1); Glass (4), arranged below the lens (3) and facing the chip (2); Shielding covers (5), two shielding covers (5) are arranged on both sides of the lens (3); A reinforcing component (6) is sleeved outside the lens (3), and one end of the reinforcing component (6) is connected to the lens (3), and the other end is connected to the upper surface of the PCB (1).

2. The thin camera module according to claim 1, characterized in that: The lower surface of the lens (3) is connected to the upper surface of the PCB (1) via AA fixing glue (30).

3. The thin camera module according to claim 1, characterized in that: The chip (2) is suspended in the hollow (11) in the PCB (1) by corresponding adhesive glue (12) around its periphery.

4. The thin camera module according to claim 1, characterized in that: The reinforcing component (6) is made of steel.

5. The thin camera module according to claim 1, characterized in that: The reinforcing component (6) comprises a sleeve (60) and a connecting piece (61); the sleeve (60) is sleeved on the lens (3) and connected to the outside of the lens (3); the two connecting pieces (61) are arranged below the two ends of the sleeve (60) and are located between the shielding cover (5) and the lens (3); the connecting piece (61) is L-shaped, and the short side of the connecting piece (61) is fixedly connected to the upper surface of the PCB (1) by means of a strong glue (62).

6. A method for assembling a thin camera module as claimed in claim 1, characterized in that: The steps include: S1. First, PCB (1) is bonded to the substrate film to ensure its flatness; S2, applying glue from the front direction on the short sides of the PCB (1) in the Y direction close to the inner frame of the PCB (1), then suspending the chip (2) at the hollow (11) position of the PCB (1) and sticking the glue to the two side walls of the chip (2); S3, carry out the WB wire bonding process, and then use a glue painting machine to paint glue on the front side of the long side of the chip (2) in the X direction, so that the glue is combined with the other two side walls of the chip (2) and sealed and fixed; S4, drawing AA fixing glue (30) on the step (10) of the PCB (1), and then performing an operation to adhere the lens (3) to the step (10) of the PCB (1); S5, dispensing glue on the upper surface of the PCB (1) on the side close to the shielding cover (5); S6. Use the vacuum of the machine to suck the reinforcing component (6), put the reinforcing component (6) between the lens (3) and the shielding cover (5), and make the bottom of the reinforcing component (6) bond with the glue in S5, so that the PCB (1) and the lens (3) are installed as a whole.

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