Circuit board processing control method, method for detecting alignment degree of circuit board and circuit board processing equipment

Abstract

The invention provides a circuit board processing control method, which comprises the steps that a plurality of reference positions are preset on a target circuit board, and each reference position comprises a plurality of layers of reference patterns; at the reference position, firstly controlling circuit board processing equipment to process a through hole with a first diameter; controlling the circuit board processing equipment to sequentially and deeply process a plurality of blind holes with a second diameter, wherein the second diameter is greater than the first diameter; according to the center coordinates of the through hole and the blind hole, the alignment degree of the multiple layers of reference patterns and the expansion and shrinkage deviation of the target circuit board are determined. The invention also discloses a method for detecting the alignment of the circuit board and circuit board processing equipment. According to the method and the equipment, the precision and the quality of processing the multi-layer circuit board are improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field related to methods for manufacturing circuit boards, and in particular to a circuit board processing control method, a method for detecting circuit board alignment, and circuit board processing equipment. Background Art

[0002] Printed circuit boards are the cornerstone of electronic products, providing electrical connections for various chips and components on PCB boards. Today's electronic products have increasingly powerful high-performance computing capabilities, but at the same time, printed circuit boards are becoming lighter, thinner, smaller and more portable, pushing PCB boards towards high-frequency and higher-density interconnection: more and more layers, smaller line width and line spacing L / S, smaller apertures, and higher micro-hole density.

[0003] Compared with single-layer circuit boards, multi-layer circuit boards, especially high-layer circuit boards (more than 10 layers), have more layers, are thicker, have denser lines and vias, larger unit sizes, thinner dielectric layers, etc., and have stricter requirements for inner layer space, interlayer alignment, impedance control, and reliability. High-layer circuit boards have many layers, and the design end has increasingly stringent requirements for the alignment of each layer of the PCB, requiring the interlayer alignment tolerance to be controlled within ±75μm. Considering the large unit size design, the temperature and humidity of the graphic transfer workshop environment, and the misalignment superposition caused by the inconsistency of the expansion and contraction of different core board layers, the interlayer positioning method and other factors, the interlayer alignment control of high-layer boards has always been a process problem.

[0004] The production of multi-layer PCBs adopts batch manufacturing. In order to control the quality of production, the first piece sampling inspection of each part number and each machine is indispensable. Among them, the current mainstream method for detecting the alignment between laminate layers and the offset of through-hole drilling relative to the inner layer pattern is to perform manual visual inspection or manual measurement through a 2D X-Ray inspection machine or a 3D X-Ray precision measuring machine to obtain data such as the maximum offset of the reference pattern between inner layers or the maximum offset of the through hole relative to the inner layer reference pattern.

[0005] However, the existing X-Ray-based multilayer board interlayer offset detection technology is limited by the X-Ray imaging characteristics, and the image edges are distorted, which can easily cause misjudgment of manual visual inspection and errors in manual measurement. In addition, in reality, due to the regional settings of modern factories, there is often a certain distance between the drilling workshop and the inspection workshop, and the manual transfer of the products to be inspected to the corresponding fixed inspection machines for inspection makes the inspection process inefficient. And because the PCB products to be tested often come from different times, different batches (different material numbers) and different drilling machines, the inspection process needs to be constantly adjusted according to the source of the products to be tested, and it is completely dependent on manual material transfer, inspection, data recording and traceability of the products to be tested. Finally, the existing X-Ray-based multi-layer board interlayer offset detection technology cannot perform immediate detection at the "first site" of the processing machine when the product to be detected is transported from one area to another. There are changes in time, space, and environment (temperature, humidity and other conditions), which are very likely to cause abnormal expansion and contraction of the board to be detected, affecting the authenticity of the test results, resulting in the test results being unable to truthfully feedback or "restore" the original processing accuracy capability level of the processing machine, and thus unable to achieve higher processing accuracy through various debugging or compensation technical means.

[0006] In short, from the perspective of the accuracy of the test results, the existing printed circuit board processing inspection methods and processes make it difficult to further optimize and improve the processing accuracy of the processing machines; at the same time, the inefficient inspection process is also an obstacle to reducing costs and increasing efficiency in lean-operated factories, and an innovative inspection method and equipment are urgently needed.

[0007] In view of this, it is necessary to design an accurate, timely and efficient inspection method, process and device for the existing PCB factories after printed circuit board processing. Through this process method and device, the waiting time, the redundant links of the first material space transfer and the inconsistency between the working environment conditions of the two links of processing and inspection can be avoided or reduced, the accuracy and reliability of the inspection results can be improved, the efficiency of the inspection process can be improved, better processing quality control can be achieved, and the goal of reducing costs and increasing efficiency can be achieved.

[0008] Application Contents

[0009] In order to solve the problems existing in the prior art, the present disclosure provides a circuit board processing control method, a circuit board alignment detection method and a circuit board processing device.

[0010] According to a first aspect of the present disclosure, a circuit board processing control method is provided, comprising: presetting a plurality of reference positions on a target circuit board, each reference position comprising a multi-layer reference graphic; at the reference position, first controlling a circuit board processing device to process a through hole of a first diameter; then controlling the circuit board processing device to sequentially control and process a plurality of blind holes of a second diameter, the second diameter being greater than the first diameter; and determining the alignment of the multi-layer reference graphic and the expansion and contraction deviation of the target circuit board according to the center coordinates of the through hole and the blind hole.

[0011] In one embodiment of the present disclosure, each layer of the reference pattern corresponds to a blind hole, and the alignment degree is determined according to the coordinate deviation between the average value of the center coordinates of the plurality of blind holes and the center coordinates of the through hole.

[0012] In one embodiment of the present disclosure, if the coordinate deviation is within a preset threshold range, the alignment is judged to be qualified; if the coordinate deviation is not within the preset threshold range, the interactive information is output, the correction information is obtained, and the alignment of the target circuit board is determined again.

[0013] In one embodiment of the present disclosure, a circuit board processing device includes a vision component, and the vision component detects the center coordinates of a through hole and a blind hole in sequence.

[0014] In one embodiment of the present disclosure, the reference pattern includes a metal conductive layer, and the metal conductive layer has the same shape along the stacking direction of the multiple layers of the reference pattern.

[0015] In one embodiment of the present disclosure, the reference pattern is in a cross shape, and after the blind hole is processed, at least one section of the metal conductive layer is in an arc ring structure.

[0016] In one embodiment of the present disclosure, each reference position includes the center coordinates of a plurality of blind holes, an average value of each reference position is determined based on the plurality of center coordinates, and the expansion and contraction deviation of the target circuit board is determined based on the plurality of average values.

[0017] In one embodiment of the present disclosure, during machining of the blind hole of the second diameter, the cutting tool has an edge angle greater than or equal to 145 degrees and less than or equal to 160 degrees.

[0018] According to a second aspect of the present disclosure, a method for detecting the alignment of a circuit board is provided, which is applied to a multi-layer circuit board processing device, and includes the following steps: presetting a reference pattern at a reference position of a multi-layer target circuit board; calling a first group of drilling components to process a through hole of a first diameter at the reference position; calling a second group of drilling components to process a blind hole of a second diameter at the reference position, wherein the second diameter is greater than the first diameter; and determining the interlayer alignment of the target circuit board based on the center coordinates of the through hole and the blind hole.

[0019] According to a third aspect of the present disclosure, a circuit board processing device is provided, including: obtaining a first-piece inspection task corresponding to a multi-layer target circuit board; calling a second group of drilling components to detect the top surface position of a reference position of the target circuit board; calling a first group of drilling components to process a through hole of a first diameter at the reference position; calling a second group of drilling components to process a blind hole of a second diameter at the reference position, the second diameter being greater than the first diameter; determining the interlayer alignment of the target circuit board and the expansion and shrinkage deviation of the target circuit board based on the center coordinates of the through hole and the blind hole; and correcting the alignment based on the expansion and shrinkage deviation when the alignment is not within a preset threshold range.

[0020] The circuit board processing control method, circuit board alignment detection method and circuit board processing equipment have the beneficial effects of: processing through holes and blind holes in the same reference position, and determining the interlayer alignment of the reference position through the center coordinates of the through holes and blind holes. On the one hand, the automated process integrating detection and processing saves cost and time, and improves efficiency and accuracy; on the other hand, the alignment of the target circuit board detected in the first piece can improve the processing accuracy and quality of the multi-layer circuit board.

[0021] Other features and advantages of the present disclosure will become apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0023] Figure 1 is a schematic diagram of a partial structure of a target circuit board provided by an embodiment of the present disclosure;

[0024] Figure 2 is a schematic diagram of a partial structure of a target circuit board provided by an embodiment of the present disclosure;

[0025] Figure 3 It is a partial structural schematic diagram of a circuit board processing device for processing a through hole provided by an embodiment of the present disclosure;

[0026] Figure 4 It is a partial structural schematic diagram of a circuit board processing device for processing blind holes provided by an embodiment of the present disclosure;

[0027] Figure 5 is a partial structural schematic diagram of a blind hole provided by an embodiment of the present disclosure;

[0028] Figure 6 is a partial structural schematic diagram of a blind hole provided by an embodiment of the present disclosure;

[0029] Figure 7 is a partial structural schematic diagram of a target circuit board provided by an embodiment of the present disclosure;

[0030] Figure 8 It is a partial flow chart of a circuit board processing control method provided by an embodiment of the present disclosure;

[0031] Figures 1 to 8 The one-to-one correspondence between the component names and the reference numerals is as follows:

[0032] 10. Target circuit board; 11. Sub-circuit board; 12. Reference position; 121. Reference pattern; 122. Arc ring; 13. Through hole; 14. Blind hole; 15. Conductive circuit; 21. First group of drilling components; 22. Second group of drilling components. DETAILED DESCRIPTION

[0033] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of the components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present disclosure. The following description of at least one exemplary embodiment is actually merely illustrative and is by no means intended to limit the present disclosure and its application or use. Techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered part of the specification. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0034] The specific embodiments of the present disclosure are described below in conjunction with the accompanying drawings. In this article, "upper", "lower", "front", "back", "left", "right", etc. are only used to indicate the relative position relationship between the relevant parts, rather than to limit the absolute positions of these relevant parts. In this article, "first", "second", etc. are only used to distinguish each other, rather than to indicate the importance and order, as well as the premise of mutual existence, etc. In this article, "equal", "same", "synchronous", "sequentially", "consistent", "symmetrical", "copy", "ring", etc. are not strict mathematical and / or geometric limitations, but also include errors that can be understood by those skilled in the art and allowed by manufacturing or use.

[0035] In the back drilling process, the inter-layer alignment of multi-layer circuit boards is a key technical parameter. Figure 7As shown, how to accurately detect the inter-layer alignment and correct this unqualified alignment is the key to improving the accuracy and quality of multi-layer back drilling processing. To this end, the present disclosure provides a circuit board processing control method for determining the alignment of a multi-layer reference graphic at a reference position of a target circuit board and the expansion and shrinkage deviation of a target circuit board on a circuit board processing device. The present disclosure also provides a method for detecting the alignment of a circuit board, which is used to detect the position deviation between the conductive metal layers at the reference position of a multi-layer target circuit board on a circuit board processing device. The present disclosure also provides a circuit board processing device for first-piece inspection, and when the alignment of the target circuit board does not meet a preset threshold range, the expansion and shrinkage deviation is used to correct the alignment.

[0036] In one embodiment of the present disclosure, a circuit board processing device includes a base, a crossbeam, a spindle assembly, a workbench, etc. The workbench is arranged on the base, and a crossbeam is erected above the workbench. At least one spindle assembly is slidably connected to the crossbeam, and each spindle assembly moves along a first direction on the crossbeam. The workbench is on the base and moves along a second direction. At least one processing position is arranged on the workbench, and a target circuit board is placed on each processing position. Each spindle assembly corresponds to the target circuit board on each processing position one by one, and the tool clamped at the bottom end of each spindle assembly moves along a third direction to process the corresponding target circuit board. The first direction, the second direction, and the third direction are perpendicular to each other. In the contextual embodiment of the present disclosure, the circuit board processing device can be implemented as a drilling device, a molding device, a gong machine device, a drilling and gonging integrated device, etc., which is not limited here. In the upper and lower embodiments of the present disclosure, at least one spindle assembly is slidably connected to the crossbeam of the circuit board processing device, and the number of spindle assemblies here can be one, two, three, four, six, ten, twelve, etc., and the structure and function of each spindle assembly are basically the same, which is not limited here.

[0037] In one embodiment of the present disclosure, the target circuit boards are of different types, and their materials, sizes, thicknesses, softness and hardness are all different, and the physical properties of the target circuit boards of different types are very different. However, these target circuit boards are all fixed in the processing position on the workbench, and the high-speed moving spindle assembly clamps the tool and moves along the third direction to process the target circuit board. There are many ways to fix the target circuit board on the workbench, including but not limited to: air clamps, bakelite boards, adsorption devices, etc. These fixing methods can achieve the target circuit board Stably and reliably fixed in the processing position on the workbench, so that the high-speed moving tool does not move when processing the target circuit board.

[0038] Each processing position on the workbench carries a target circuit board, such as Figure 1 and Figure 2As shown, each target circuit board 10 includes a plurality of sub-circuit boards 11, and the plurality of sub-circuit boards 11 have the same layout structure and are arranged in a matrix structure on the entire target circuit board. Each sub-circuit board includes a plurality of holes, and these holes are arranged in the sub-circuit board according to a predetermined layout structure. The spindle assembly clamps the tool and processes the plurality of holes on the sub-circuit board in sequence according to a predetermined path and sequence.

[0039] The target circuit board includes multilayer boards and single-layer boards. The multilayer and single-layer here mainly refer to the metal conductive circuit layer, and the multilayer board contains multiple metal conductive circuit layers. The multilayer board can integrate multiple circuit layouts to reduce the volume of the target circuit board, carry more circuit layouts, increase the scale of integrated circuits per unit area, and reduce the volume of the target circuit board. In the field of ultra-precision electronic technology, multilayer boards are widely used. Multilayer circuit boards need to achieve selective electrical conduction between multilayer circuits, which requires the use of back drilling technology to process through holes or blind holes. Back drilling is a secondary drilling process. After the front side is processed through the through hole, it undergoes a copper plating process, and a secondary drilling process is performed on the back side to remove the excess copper layer, so as to achieve selective electrical conduction between some layers in the through hole. Some layers are connected through metal copper, and some layers are not conductive after the copper is removed.

[0040] In the above and below embodiments of the present disclosure, Figure 7 As shown, the target circuit board is a multi-layer circuit board, and multi-layer means that the number of layers of the conductive circuit 15 is greater than or equal to three layers. The multi-layer circuit board is formed by laminating multiple layers of conductive circuits, and each layer of the conductive circuit includes a metal conductive layer, and the metal conductive layer forms an electrical connection and conduction in the same layer. At the same time, between different layers, the metal conductive layer is connected or disconnected through through holes and / or blind holes.

[0041] For this reason, Figure 8 As shown, the present disclosure provides a circuit board processing control method, including: presetting multiple reference positions on the target circuit board, each of the reference positions includes a multi-layer reference pattern; at the reference position, first controlling the circuit board processing equipment to process a through hole of a first diameter; then controlling the circuit board processing equipment to sequentially control the deep processing of multiple blind holes of a second diameter, the second diameter being greater than the first diameter; according to the center coordinates of the through hole and the blind hole, determining the alignment of the multi-layer reference pattern at the reference position and the expansion and contraction deviation of the target circuit board. This circuit board processing control method processes through holes and blind holes in the same reference position in sequence, and determines the inter-layer alignment of the reference position by the center coordinates of the through holes and the blind holes. On the one hand, the automated process integrating detection and processing saves cost and time, and improves efficiency and accuracy; on the other hand, the alignment of the target circuit board detected by the first piece can improve the processing accuracy and quality of the multi-layer circuit board.

[0042] In some embodiments of the present disclosure, each layer of the reference pattern corresponds to one blind hole, and the alignment degree is determined according to the deviation between the average value of the center coordinates of the plurality of blind holes and the center coordinates of the through hole. Figure 5 As shown, at the reference position 12 of the target circuit board 10, a reference graphic 121 is preset. The target circuit board is a multi-layer circuit board. A reference graphic is set on each layer of the circuit board in the same layer and process as the conductive metal layer. Each layer of the reference graphic 121 corresponds to a blind hole 14, and multiple blind holes are superimposed to form an integral hole. The alignment of the laminated multi-layer reference graphics has deviations, resulting in that the multiple blind holes at the reference position may include different center coordinates. Using the center coordinates of the blind holes to represent the deviation of the alignment is more accurate and reliable. Therefore, among the center coordinates of the multiple blind holes, the average value of the center coordinates of the blind holes is obtained through the average value algorithm, and then compared with the center coordinates of the through hole, so that the deviation of the alignment of the reference graphic can be determined.

[0043] Specifically, the average value of the center coordinates of the blind hole and the center coordinates of the through hole are compared. If the deviation between the two is within the preset threshold range, the alignment of the target circuit board is determined to be qualified; if the deviation between the two is not within the preset threshold range, the interactive information is output, the correction information is obtained, and the alignment of the target circuit board is determined again. For the target circuit board, when the alignment is detected for the first time, when the deviation between the two meets the predetermined threshold requirement, it means that the alignment of the reference position is qualified, the first piece inspection is qualified, and multiple target circuit boards can be processed in batches. When the deviation between the two does not meet the predetermined threshold requirement, it means that the alignment of the reference position is unqualified, the first piece inspection is unqualified, and the circuit board processing equipment outputs interactive information through the human-computer interaction interface. After the technician makes a choice, the correction parameters are automatically compensated. Based on the corrected alignment, the alignment of the target circuit board is detected for the second time until the alignment of the target circuit board meets the predetermined threshold requirement and the first piece inspection is qualified.

[0044] In some embodiments of the present disclosure, the circuit board processing equipment includes a visual component, and the visual component detects the center coordinates of the through hole and the blind hole in sequence. The spindle assembly of the circuit board processing equipment also includes a visual component, and the visual component includes a camera for detecting the position and center coordinates of the through hole and the blind hole. In the upper and lower embodiments of the present disclosure, the center coordinates of the reference position are detected and determined by the visual component. The circuit board processing equipment controls the spindle assembly to process a through hole of a first diameter at the reference position, and after completing the through hole processing, controls the visual component to detect the center coordinates of the through hole, and records the center coordinates of the through hole.

[0045] In the process of processing blind holes, a reference pattern is preset at the reference position. Each time a blind hole is processed, a layer of the reference pattern is passed through. When the reference pattern is a cross structure, each layer of the reference pattern forms an arc ring structure in the blind hole. Therefore, after processing the blind holes of the first layer, the visual component can detect the center coordinates of the first layer of the arc ring 122 using the remaining arc ring 122 structure of the first layer of the reference pattern 121. Each time a layer of the reference pattern 121 is processed, a metal conductive layer of the arc ring 122 structure will be exposed in the superimposed blind holes. By processing multiple layers of blind holes in sequence and detecting the center coordinates of the remaining arc ring 122 structure of each layer of the reference pattern, the center coordinates of each layer of the blind holes can be determined. The inner layer of the target circuit board is a multi-layer structure. Each time a layer of blind holes is processed, the visual component is used to detect the center coordinates of the reference pattern of that layer.

[0046] In some embodiments of the present disclosure, the reference pattern includes a metal conductive layer, and the shape of the metal conductive layer is the same along the stacking direction of the multi-layer reference pattern. The multi-layer circuit board includes a multi-layer conductive circuit, and each layer of the conductive circuit includes a plurality of electrically connected metal conductive layers. The metal conductive layer of the reference pattern and the metal conductive layer of the conductive circuit are made in the same layer and the same process, and are manufactured using the same exposure and etching process, which can ensure that the metal conductive layer of the reference pattern directly feeds back the interlayer alignment of the multi-layer conductive circuit. Specifically, at the reference position, the multi-layer reference pattern is preset on the target circuit board, and each layer of the reference pattern includes a metal conductive layer. Along the stacking direction of the multi-layer reference pattern, that is, the thickness direction of the target circuit board, the shape and structure of the metal conductive layer are the same. The same metal conductive layer can reduce the difficulty and cost of the process, reduce the interference of the reference pattern itself, and improve the accuracy of the interlayer alignment of the reference pattern.

[0047] In some embodiments of the present disclosure, the reference pattern is in the shape of a cross, and after the blind hole is processed, at least one section of the metal conductive layer is in the shape of an arc ring. Figure 5 As shown in the figure, it is a schematic diagram of the structure before processing the blind hole. Figure 6 The figure shows a schematic diagram of the structure of the arc ring formed after the blind hole is processed. In the multi-layer reference graphics at the reference position, a cross-shaped structure is preferred, which has a simple process and is convenient for subsequent center coordinate detection. After the blind hole is processed, part of the metal conductive layer of each layer of the reference graphics is removed, and the remaining metal conductive layer constitutes an arc ring structure. This arc ring structure is four-section arc rings that are arranged to form a circular structure. Because the diameter of the blind hole is larger than the diameter of the through hole, the arc ring is located at the periphery of the through hole, and the through hole is located inside the arc ring. The visual component needs to detect the center coordinates of the blind holes on each layer of the reference graphics. Therefore, by capturing the target with the arc ring, the visual component clearly determines the center coordinates of the blind holes in this layer. The position of each layer of the reference graphics is slightly different. By determining the center coordinates of each layer of the reference graphics, the inter-layer alignment of each layer of the reference graphics can be directly fed back.

[0048] In some embodiments of the present disclosure, each of the reference positions includes the center coordinates of a plurality of the blind holes, and the average value of each of the reference positions is determined based on the plurality of the center coordinates, and the expansion and contraction deviation of the target circuit board is determined based on the plurality of the average values. On the target circuit board, a plurality of reference positions are preset, and each reference position is preset with a reference pattern. By processing blind holes on each layer of the reference pattern, the center coordinates of a plurality of blind holes in different layers are formed, which is conducive to calculating the average value of a plurality of center coordinates of a single reference position after the visual component detects the center coordinates. After obtaining the average value of each reference position, the target circuit board is provided with a plurality of reference positions in the peripheral area of ​​the sub-circuit board, and the center coordinates of each reference position include the actual center coordinates and the theoretical center coordinates, and the average value is the actual center coordinate. According to the deviation between the average value of the center coordinates of each reference position and the theoretical center coordinate, the expansion and contraction deviation of the target circuit board is obtained by fitting. For the target circuit board, it is preferred to set four reference positions, and select four reference positions around the plurality of sub-circuit boards on the target circuit board to accurately detect the expansion and contraction deviation of the target circuit board. At the same time, the average value of the center coordinates of each reference position and the deviation of the theoretical center coordinates are fitted to obtain the expansion and shrinkage coefficient of the target circuit board, and the expansion and shrinkage deviation is mapped by the expansion and shrinkage coefficient to determine the expansion and shrinkage deviation of the target circuit board. After determining the expansion and shrinkage deviation, data information support is provided for subsequent compensation and correction.

[0049] In some embodiments of the present disclosure, during the process of processing the blind hole of the second diameter, the blade angle of the tool is greater than 135 degrees and less than 180 degrees. In the circuit board processing equipment, multiple spindle assemblies are included, and each spindle assembly processes the corresponding target circuit board synchronously or independently. During the process of processing the blind hole of the second diameter, the tool clamped by the spindle assembly performs mechanical drilling processing. The tool has a blade angle, and the blade angle is greater than or equal to 145 degrees. A larger blade angle is conducive to secondary drilling processing, and the width of the remaining arc ring of the blind hole is wider, which is conducive to accurately detecting the center coordinates of the arc ring; at the same time, a large blade angle is conducive to multi-layer and multiple processing of multi-layer target circuit boards, reducing the damage and influence of the two previous and subsequent processing on the conductive metal layers of the blind holes and arc rings of each layer. In addition, the blade angle of the tool is less than or equal to 160 degrees, and a smaller blade angle is conducive to accurately controlling the depth during the deep processing of the blind hole. Therefore, the blade angle of the tool needs to maintain a reasonable balance between accurate depth control and accurate detection of the center coordinates. Selecting a blade angle greater than or equal to 145 degrees and less than or equal to 160 degrees is conducive to taking into account the balance between the two. In the upper and lower embodiments of the present disclosure, the smaller the blade angle, the sharper the tool tip, and the larger the blade angle, the flatter the tool tip. Typically, the blade angle of the tool ranges from 90 to 180 degrees.

[0050] The present disclosure also provides a method for detecting the alignment of a circuit board, comprising the following steps: S100, presetting a reference pattern at a reference position of a multi-layer target circuit board; S200, calling a first set of drilling components to process a through hole of a first diameter at the reference position; S300, calling a second set of drilling components to process a blind hole of a second diameter at the reference position, wherein the second diameter is greater than the first diameter; S400, determining the interlayer alignment of the target circuit board according to the center coordinates of the through hole and the blind hole. This method for detecting the alignment of a circuit board sets a reference pattern at a reference position, processes through holes and blind holes on the reference pattern, detects the center coordinates of the through holes and the blind holes, determines the interlayer position deviation of the target circuit board through the center coordinates of the central through hole and the multiple blind holes, and judges the alignment of the target circuit board through the interlayer position deviation. This method of directly detecting the interlayer alignment of a multi-layer circuit board using a reference pattern integrates detection and processing, not only saves cost and detection time, but also improves efficiency and accuracy; on the other hand, the alignment of the target circuit board can be improved by first detecting the alignment of the target circuit board.

[0051] The present disclosure also provides a circuit board processing device, including: obtaining a first-piece inspection task corresponding to a multi-layer target circuit board; calling a second group of drilling components to detect the top surface position of the reference position of the target circuit board; calling a first group of drilling components to process a through hole of a first diameter at the reference position; calling a second group of drilling components to process a blind hole of a second diameter at the reference position, the second diameter being greater than the first diameter; determining the interlayer alignment of the target circuit board and the expansion and contraction deviation of the target circuit board according to the center coordinates of the through hole and the blind hole; when the alignment is less than a preset threshold, correcting the alignment according to the expansion and contraction deviation. This circuit board processing device performs a first-piece inspection before batch processing of target circuit boards, and after obtaining the first-piece inspection task, successively processes through holes and blind holes, judges, determines, and corrects the interlayer alignment of the multi-layer target circuit board according to the center coordinates of the through holes and the blind holes, and corrects the alignment using the fitted expansion and contraction deviation, thereby improving the interlayer alignment and improving the processing accuracy and quality.

[0052] In the upper and lower embodiments of the present disclosure, the reference position is a predetermined point position arbitrarily selected on the target circuit board, and the point position is set in the non-processing area, that is, the reference position is located at the periphery of the sub-circuit board or the area between adjacent sub-circuit boards. In order to ensure that multiple reference positions accurately feedback the expansion and contraction deviation of the target circuit board, preferably, the reference position is set at the four corners of the target circuit board, and each corner is preset with a reference position. Each reference position includes multiple reference graphics, and the reference graphics are preferably a cross-shaped metal conductive layer. The reference graphics are made in the same layer and process as each layer of the conductive circuit of the multi-layer circuit board, and the inter-layer alignment and expansion and contraction deviation of the target circuit board are directly obtained using the reference graphics.

[0053] Application scenario 1

[0054] This embodiment takes a six-axis circuit board processing device as an example to explain in detail the circuit board processing control method, the method for detecting the alignment of the circuit board, and the specific structure of the circuit board processing device. In this embodiment, the circuit board processing device is a mechanical drilling process. Figure 1 , Figures 3 to 8 shown.

[0055] In this embodiment, the circuit board processing equipment includes a workbench, a spindle assembly, a crossbeam and a base. The workbench is arranged on the base, and a crossbeam is mounted above the workbench. Six identical spindle assemblies are slidably connected to the crossbeam, and each spindle assembly moves along the first direction on the crossbeam. The workbench is on the base and moves along the second direction. Six processing positions are arranged on the workbench, and a target circuit board is placed in each processing position. The spindle assembly moves along the third direction to process the target circuit board carried on the corresponding processing position. In the upper and lower embodiments of the present disclosure, the first direction, the second direction, and the third direction are perpendicular to each other.

[0056] In this embodiment, the circuit board processing equipment includes a control system, and the control system has multiple built-in object parameters for processing circuit boards. The target circuit boards correspond to the target object parameters one by one, and the same target object parameters are used to process the same batch or type of target circuit boards. Figure 1 As shown, in the target object parameters, the target circuit board 10 includes 20 sub-circuit boards 11, and each sub-circuit board 11 includes a plurality of holes. Four reference positions 12 are set around the target circuit board 10, and at each reference position 12, a plurality of reference patterns 121 are stacked along the thickness direction of the target circuit board 10, and each layer of the reference pattern 121 is manufactured in the same layer and process as each layer of the conductive circuit of the multilayer circuit board 10.

[0057] In this embodiment, a visual component is provided on each spindle assembly, and the visual component is implemented as a camera, which can be implemented to detect the coordinate position of each position on the target circuit board, including the center coordinate position of the through hole and the blind hole at the reference position 12, and feed back the center coordinate position to the control system. The control system calculates, judges and determines the alignment of the target circuit board based on the center coordinate position.

[0058] In this embodiment, if Figure 1 , Figures 3 to 7As shown, before the circuit board processing equipment performs batch processing, it must first perform first-piece inspection to confirm that the various parameters of the circuit board processing equipment meet the predetermined quality requirements. Therefore, after triggering or entering the first-piece inspection task, the loading and unloading mechanism is controlled to move a target circuit board to the workbench, and the first-piece inspection task corresponding to the multi-layer target circuit board is obtained. The first-piece inspection task includes information such as the position of the reference pattern and the depth of the blind hole control processing. In the circuit board processing equipment, the first spindle assembly is called to detect the top surface position of the reference position of the target circuit board. As shown in FIG. Figure 1 As shown, there are four reference positions 12, and the top surface positions of the four reference positions 12 are detected respectively to determine the positions of the subsequent blind hole depth control processing. Figure 3 As shown, in the present embodiment, the first group of drilling components 21 is implemented as a first spindle component. After the first spindle component 21 picks up a tool of the first diameter, the first spindle component 21 is called to process a through hole 13 of the first diameter at four reference positions 12 in sequence. After processing the through hole 13, the visual component detects the center coordinate position of each through hole in sequence. The first spindle component 21 replaces the tool and picks up a tool of the second diameter. The cross-sectional diameter of the tool of the second diameter is much larger than the cross-sectional diameter of the tool of the first diameter. At the first reference position, the processing is performed continuously for multiple times, and each time a layer of the reference figure is drilled through to form a blind hole. The blind hole is a U-shaped opening with an opening at the top and a non-penetrating bottom. As shown Figure 4 As shown, at the first reference position, the first spindle assembly 22 picks up a tool of the second diameter to process multiple blind holes 14 multiple times, and checks the center position of each blind hole 14, and records the center coordinates of each blind hole. Due to the slight difference in the position of the reference graphics of each layer, the position of the center coordinate of each blind hole is different. Select the center coordinates of multiple blind holes, calculate the average value, compare it with the center coordinate of the through hole, and determine the deviation between the average value and the center coordinate of the through hole as the interlayer deviation at the reference position, that is, the alignment. For the four reference positions of the entire circuit board, each reference position has an actual center coordinate. The average value of the center coordinate of each blind hole is compared with the actual center coordinate of the reference position. The difference between the two is the deviation of the reference position. The expansion and contraction deviation of the target circuit board is determined by the deviation of the four reference positions. For circuit board processing equipment, when the alignment does not meet the predetermined threshold requirement, the alignment can be corrected, and the alignment of the reference position can be re-detected until the alignment meets the predetermined threshold requirement. Specifically, the method of compensating and correcting the alignment can correct the interlayer alignment by reversely compensating the expansion and contraction deviation into the alignment, thereby improving the processing accuracy and quality of the circuit board processing equipment.

[0059] In the circuit board processing equipment of this embodiment, a circuit board processing control method is applied, such as Figure 1 , Figures 3 to 8 As shown, the specific steps include:

[0060] First, a plurality of reference positions are preset on the target circuit board, each of which includes a plurality of layers of reference patterns. Figure 1 As shown, four reference positions 12 are set on each target circuit board 10, and the four reference positions 12 are set in the four corner areas of the target circuit board 10. In this embodiment, it is preferably set in the four corner areas of the target circuit board 10. At each reference position 12, a cross-shaped metal conductive layer is set on the same layer as each layer of conductive circuits of the multi-layer circuit board. This cross metal conductive layer is made using the same exposure and etching process as each layer of conductive circuits of the multi-layer circuit board. The cross reference pattern 121 is made on the same layer and process, which can directly feedback and detect the interlayer alignment of the multi-layer circuit board. In this embodiment, when the multi-layer circuit board includes six inner layers of conductive circuits, six stacked reference patterns 121 are set at the reference position, and a non-conductive matrix layer is set between each layer of reference patterns 121.

[0061] Secondly, at the reference position 12, the circuit board processing equipment is first controlled to process a through hole of a first diameter; and then the circuit board processing equipment is controlled to sequentially process a plurality of blind holes of a second diameter, wherein the second diameter is greater than the first diameter. Figure 3 As shown, in this embodiment, the first group of drilling components 21 is implemented as a first spindle component. At each reference position 12, the first spindle component of the circuit board processing equipment is controlled to process a through hole 13 according to a preset theoretical center coordinate position. The through hole runs through all the conductive layers and matrix layers of the multi-layer circuit board and is a through hole. Four through holes 13 are processed in sequence at four reference positions. The visual component is called to detect and record the center coordinate positions of the four through holes 13 in sequence.

[0062] After machining the through hole, the first spindle assembly changes the tool, unloads the tool of the first diameter to the cutter head, and then picks up the tool of the second diameter from the cutter head, which is much larger than the first diameter. Figure 4 As shown, in this embodiment, the second drilling assembly 22 is implemented as a first spindle assembly that picks up a second diameter tool. After the first spindle assembly 22 picks up the second diameter tool, the blind holes 14 are processed in sequence at each reference position 12 according to the preset theoretical center coordinate position. Since the center coordinates of each layer of the cross reference pattern are slightly different, in the process of the first spindle assembly 22 processing the blind holes in sequence according to the theoretical center coordinate position, after the cross reference pattern 121 is processed with the blind holes, as shown in FIG. Figure 5 and Figure 6As shown, the remaining metal conductive layer is an arc ring 122 structure, and the center coordinates of each layer of the arc ring 122 structure are slightly deviated. At the reference position, the visual component is called to detect the center coordinates of the six arc rings in turn, and the center coordinates of the six arc rings are recorded. In this embodiment, the blind hole 14 refers to a non-through hole. In a multi-layer circuit board, each blind hole only penetrates to the corresponding reference figure, that is, starting from the surface of the multi-layer circuit board, the first blind hole penetrates to the reference figure of the first layer, the second blind hole penetrates the first layer to the reference figure of the second layer, and so on. The sixth blind hole penetrates to the sixth reference figure. In the process of processing the blind hole 14, after removing multiple layers of metal from the cross metal conductive layer, the metal conductive layer of the remaining arc ring 122 structure is detected. The center coordinates of each layer of the arc ring 122 are recorded.

[0063] Finally, the alignment of the multi-layer reference pattern at the reference position and the expansion and contraction deviation of the target circuit board are determined according to the center coordinates of the through hole and the blind hole. In this embodiment, the blind hole 14 and the through hole 13 are both processed based on the same theoretical coordinates of the reference position 12. However, in the stacking direction, Figure 7 As shown, there is a deviation in the position of each layer of the reference pattern, resulting in different center coordinates of the remaining arc rings after the blind hole is processed. The average value of the center coordinates of the six arc rings is calculated and determined as the actual center coordinate of the blind hole 14. According to the deviation between the actual center coordinate of the through hole 13 and the actual center coordinate of the blind hole 14, the interlayer deviation of the reference position 12 is determined, that is, the alignment degree of the reference position 12. According to the deviation between the actual center coordinate of the blind hole 14 and the theoretical center coordinate at the reference position, the expansion and contraction deviation of the reference position is determined. According to the expansion and contraction deviations of the four reference positions 12, the expansion and contraction deviation of the target circuit board 10 is determined.

[0064] In the circuit board processing equipment of this embodiment, a method for detecting the alignment of a circuit board is applied. This detection method can detect the inter-layer alignment of a target circuit board, that is, the inter-layer alignment of a multi-layer circuit board. Figure 1 , Figures 3 to 7 As shown, the specific steps include:

[0065] S100, preset a reference pattern at a reference position of a multi-layer target circuit board. The target circuit board is any one of the batch of circuit boards to be processed. The reference position is set on the target circuit board, and multiple reference patterns are set in the direction of the multi-layer stacked conductive circuit at the reference position. The reference pattern 121 can be a cross metal conductive layer, such as Figure 5As shown, each layer of the reference pattern is manufactured in the same layer and process as the conductive circuit of the multi-layer circuit board. In this way, the interlayer position deviation of the multi-layer circuit board can be directly fed back through the interlayer position deviation of multiple reference patterns at the reference position, that is, the interlayer alignment of the multi-layer circuit board. In this embodiment, the reference positions are set at the four corners of the target circuit board. When the target circuit board includes six layers of conductive circuits inside, a stacked six-layer cross-structured metal conductive layer is set at each reference position.

[0066] S200, calling a first set of drilling components to process a through hole of a first diameter at the reference position. Figure 3 As shown, in this embodiment, the difference between the first group of drilling components and the second group of drilling components is that the tool diameters of the tools are different. The first spindle component that picks up the tool of the first diameter is called the first group of drilling components, and the first spindle component that picks up the tool of the second diameter is called the second group of drilling components. Therefore, calling the first group of drilling components to process a through hole is essentially to control the first spindle component to pick up the tool of the first diameter, and to process the through hole at the reference position according to the preset theoretical center coordinates. After each through hole is processed, the visual component is called to detect the center coordinate position of the through hole. When four reference positions are set at the four corners of the target circuit board, four through holes are processed in turn, and the center coordinate positions of the four through holes are detected and recorded. It should be noted that the through hole runs through each layer of the cross reference figure at the reference position, but the diameter of the through hole is smaller.

[0067] S300, calling a second set of drilling components to process a blind hole of a second diameter at the reference position, wherein the second diameter is larger than the first diameter. Figure 4 As shown in the figure, after machining the through hole, the first spindle assembly changes the tool, unloads the tool of the first diameter, picks up the tool of the second diameter, and moves the first spindle assembly that picks up the tool of the second diameter to the reference position, and processes the blind holes in sequence according to the predetermined theoretical center coordinate position. After machining each blind hole, the visual component is called to detect the center coordinates of the remaining arc rings at the blind hole, and the center coordinates of the arc rings at the blind holes of the six inner layers are detected and recorded to provide data information support for the subsequent inter-layer alignment.

[0068] S400, determining the interlayer alignment of the target circuit board according to the center coordinates of the through hole and the blind hole. After determining the actual center coordinate of the through hole, the average value of the actual center coordinates of the six arc rings is calculated and counted as the actual center coordinate of the blind hole. According to the deviation between the actual center coordinate of the through hole and the actual center coordinate of the blind hole, the interlayer deviation at the reference position is determined, that is, the interlayer alignment at the reference position. According to the deviation between the actual center coordinate of the blind hole and the theoretical center coordinate at the reference position, it is determined as the expansion and contraction deviation. The target circuit board sets four reference positions, and the expansion and contraction deviation of the target circuit board can be determined by the expansion and contraction deviation of the four reference positions. According to the expansion and contraction deviation, it can be reversely compensated to the alignment to correct the deviation of the alignment, and then a target circuit board is replaced, and the alignment of the target circuit board is detected again until the alignment meets the predetermined threshold.

[0069] This circuit board processing equipment, circuit board processing control method and circuit board alignment detection method processes through holes and blind holes in the same reference position, and determines the interlayer alignment of the reference position through the center coordinates of the through holes and blind holes. On the one hand, the automated process integrating detection and processing saves cost and time, and improves efficiency and accuracy; on the other hand, the alignment of the target circuit board detected by the first piece can improve the processing accuracy and quality of the multi-layer circuit board.

[0070] Application scenario 2

[0071] This embodiment takes a circuit board processing device as an example to explain in detail the circuit board processing control method, the method for detecting the alignment of the circuit board, and the specific structure of the circuit board processing device. In this embodiment, the circuit board processing device is a laser drilling device. Figures 2 to 8 shown.

[0072] The circuit board processing equipment of this embodiment is slightly different from the first embodiment. The circuit board processing control method and the method for detecting the alignment of the circuit board are basically the same as those of the first embodiment. The difference from the first embodiment is that in this embodiment, the circuit board processing equipment uses laser to process the circuit board instead of mechanical drilling. The reference position is set between adjacent areas of multiple sub-circuit boards, which is closer to the sub-circuit board to be processed and can more accurately feedback the inter-layer alignment.

[0073] The circuit board processing equipment of this embodiment includes a workbench, a laser head assembly, a crossbeam and a base. The workbench is arranged on the base, and a crossbeam is mounted above the workbench. Two identical laser head assemblies are slidably connected on the crossbeam, and each laser head assembly moves along the first direction on the crossbeam. The workbench is on the base and moves along the second direction. Two processing positions are arranged on the workbench, and a target circuit board is placed in each processing position. The laser head assembly can emit a laser beam along a third direction to process the target circuit board carried on the corresponding processing position. In the upper and lower embodiments of the present disclosure, the first direction, the second direction, and the third direction are perpendicular to each other.

[0074] In this embodiment, the circuit board processing equipment includes a control system, and the control system has multiple built-in object parameters for processing circuit boards. The target circuit boards correspond to the target object parameters one by one, and the same target object parameters are used to process the same batch or type of target circuit boards. Figure 2 As shown, in the target object parameters, the target circuit board 10 includes 20 sub-circuit boards 11, and each sub-circuit board 11 includes a plurality of holes. Nine reference positions 12 are set between two adjacent sub-circuit boards 11, and at each reference position 12, a plurality of reference patterns 121 are stacked along the thickness direction of the target circuit board 10, and each layer of the reference pattern 121 is manufactured in the same layer and process as each layer of the conductive circuit of the multilayer circuit board 10.

[0075] In this embodiment, a visual component is provided on each laser head assembly, and the visual component can be implemented to detect the coordinate position of each position on the target circuit board, including the center coordinate position of the through hole and the blind hole at the reference position 12, and feed back the center coordinate position to the control system. The control system calculates, judges and determines the alignment degree of the target circuit board based on the center coordinate position.

[0076] like Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7As shown, in this embodiment, the circuit board processing equipment must first perform first piece inspection before batch processing to confirm that the various parameters of the circuit board processing equipment meet the predetermined quality requirements. Therefore, after triggering or entering the first piece inspection task, the loading and unloading mechanism is controlled to move a target circuit board to the workbench, and the first piece inspection task corresponding to the multi-layer target circuit board is obtained. The first piece inspection task includes information such as the position of the reference figure and the depth of the blind hole control processing. In the circuit board processing equipment, the first drilling machine component 21 is implemented as a first laser head component, and the first laser head component 21 is called to detect the top surface position of the reference position 12 of the target circuit board 10. There are nine reference positions 12, and the top surface positions of the nine reference positions are detected respectively, so as to determine the position of the subsequent blind hole control processing. The first laser head component 21 emits a first laser beam and processes a through hole 13 of a first diameter at the nine reference positions in turn. After processing the through hole 13, the visual component detects the center coordinate position of each through hole in turn. The second drilling assembly 22 is implemented as the first laser head assembly, which adjusts the laser optical path and aperture of the first laser head assembly, controls the first laser head assembly 22 to emit a second laser beam, and the spot diameter of the second laser beam is much larger than the spot diameter of the first laser beam. At the first reference position, continuous processing is performed multiple times, and each processing forms a blind hole 14. The blind hole 14 is a U-shaped opening, with an opening at the upper end and a non-through bottom end. At the first reference position 12, the first laser head assembly 22 processes multiple blind holes 14 multiple times, and checks the center position of each blind hole 14, and records the center coordinates of each blind hole 14. Since the positions of the reference figures of each layer are slightly different, the positions of the center coordinates of each blind hole 14 are different. The center coordinates of multiple blind holes 14 are selected, and the average value is calculated, and compared with the center coordinates of the through hole 13, and the deviation between the average value and the center coordinate of the through hole is determined as the interlayer deviation at the reference position, that is, the alignment degree. For the nine reference positions of the entire target circuit board, each reference position has an actual center coordinate. The average value of the center coordinate of each blind hole is compared with the actual center coordinate of the reference position. The difference between the two is the deviation of the reference position. The expansion and contraction deviation of the target circuit board is determined by the deviation of the nine reference positions. For circuit board processing equipment, when the alignment does not meet the predetermined threshold requirement, the alignment can be corrected and the alignment of the reference position can be re-tested until the alignment meets the predetermined threshold requirement. Specifically, the method of compensating and correcting the alignment can correct the inter-layer alignment by reversely compensating the expansion and contraction deviation into the alignment, thereby improving the processing accuracy and quality of the circuit board processing equipment.

[0077] In the circuit board processing equipment of this embodiment, a circuit board processing control method is applied, such as Figures 2 to 8 As shown, the specific steps include:

[0078] First, a plurality of reference positions are preset on the target circuit board 10, each of which includes a multi-layer reference pattern. Nine reference positions 12 are set on each target circuit board 10, and the nine reference positions 12 are set in the area between a plurality of adjacent sub-circuit boards 11 on the target circuit board. At each reference position 12, a cross-shaped metal conductive layer is set on the same layer as each layer of conductive circuits of the multi-layer circuit board. This cross metal conductive layer is made using the same exposure and etching process as each layer of conductive circuits of the multi-layer circuit board. The cross reference pattern 121 is made on the same layer and with the same process, which can directly feedback and detect the interlayer alignment of the multi-layer circuit board. In this embodiment, when the multi-layer circuit board includes 10 inner layers of conductive circuits, 10 stacked reference patterns are set at the reference position accordingly, and a non-conductive matrix layer is set between each layer of reference patterns.

[0079] Secondly, at the reference position 12, the circuit board processing equipment is first controlled to process a through hole of the first diameter; then the circuit board processing equipment is controlled to sequentially process multiple blind holes of the second diameter, wherein the second diameter is greater than the first diameter. At each reference position, the first laser head assembly of the circuit board processing equipment is controlled to process a through hole 13 according to a preset theoretical center coordinate position, and the through hole 13 penetrates all conductive layers and matrix layers of the multilayer circuit board and is a through hole. Nine through holes 13 are processed sequentially at nine reference positions. The visual assembly is called to sequentially detect and record the center coordinate positions of the nine through holes 13.

[0080] After processing the through hole 13, the first laser head assembly adjusts the laser optical path and the aperture, and controls the first laser head assembly to emit a second laser beam, and the spot diameter of the second laser beam is much larger than the spot diameter of the first laser beam. The second drilling assembly 22 is implemented as the first laser head assembly that emits the second laser beam. The first laser head assembly 22 sequentially processes the blind holes 14 at each reference position 12 according to the preset theoretical center coordinate position. Since the center coordinates of each layer of the cross reference figure 121 are slightly different, during the process of the first laser head assembly 22 sequentially processing the blind holes 14 according to the theoretical center coordinate position, after the cross reference figure 121 is processed into the blind hole 14, the remaining metal conductive layer is a circular arc ring 122 structure, and the center coordinates of each layer of the circular arc ring 122 structure are slightly deviated. At the reference position 12, the visual component is called to detect the center coordinates of 10 circular arc rings in sequence, and the center coordinates of the 10 circular arc rings are recorded. In this embodiment, the blind hole 14 refers to a non-through hole. In the multi-layer circuit board, each blind hole only penetrates to the corresponding reference pattern. That is, starting from the surface of the multi-layer circuit board, the first blind hole penetrates to the reference pattern of the first layer, the second blind hole penetrates to the reference pattern of the first layer, and the second blind hole penetrates to the reference pattern of the second layer, and so on. The tenth blind hole penetrates to the tenth reference pattern. In the process of processing the blind hole 14, after removing multiple layers of metal from the cross metal conductive layer, the metal conductive layer of the arc ring 122 structure remains, and the center coordinates of each layer of the arc ring 122 are detected and recorded.

[0081] Finally, the alignment of the multi-layer reference graphics 121 at the reference position and the expansion and contraction deviation of the target circuit board 10 are determined based on the center coordinates of the through hole 13 and the blind hole 14. In this embodiment, both the blind hole and the through hole are processed based on the same theoretical coordinates of the reference position. However, in the stacking direction, there is a deviation in the position of each layer of the reference graphics, resulting in different center coordinates of the remaining arc rings after the blind hole is processed. The average value of the center coordinates of the 10 arc rings is calculated and determined as the actual center coordinate of the blind hole. According to the deviation between the actual center coordinate of the through hole and the actual center coordinate of the blind hole, the interlayer deviation of the reference position is determined, that is, the alignment of the reference position. According to the deviation between the actual center coordinate of the blind hole and the theoretical center coordinate at the reference position, it is determined as the expansion and contraction deviation of the reference position. According to the expansion and contraction deviation of the nine reference positions, it is determined as the expansion and contraction deviation of the target circuit board.

[0082] This embodiment also discloses a method for detecting the alignment of a circuit board. Figures 2 to 8As shown, it specifically includes: S500, preset a reference pattern 121 at the reference position of the multi-layer target circuit board. S600, call the first group of drilling components 21, and process a through hole of a first diameter at the reference position 10; in this example, the first group of drilling components 21 is a first laser beam emitted by a laser head assembly. S700, call the second group of drilling components, and process a blind hole of a second diameter at the reference position, and the second diameter is greater than the first diameter. In this example, the second group of drilling components 22 is a second laser beam emitted by a laser head assembly, and the spot diameter of the second laser beam is much larger than the spot diameter of the first laser beam. S800, determine the interlayer alignment of the target circuit board according to the center coordinates of the through hole 13 and the blind hole 14.

[0083] This circuit board processing equipment, circuit board processing control method and circuit board alignment detection method processes through holes and blind holes in the same reference position, and determines the interlayer alignment of the reference position through the center coordinates of the through holes and blind holes. On the one hand, the automated process integrating detection and processing saves cost and time, and improves efficiency and accuracy; on the other hand, the alignment of the target circuit board detected by the first piece can improve the processing accuracy and quality of the multi-layer circuit board.

[0084] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the marketplace, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present disclosure is defined by the appended claims.

Claims

1. A circuit board processing control method, characterized in that: include: Presetting a plurality of reference positions on a target circuit board, each of the reference positions comprising a plurality of layers of reference patterns; At the reference position, firstly control the circuit board processing equipment to process a through hole of a first diameter; then control the circuit board processing equipment to sequentially control the depth of processing a plurality of blind holes of a second diameter, wherein the second diameter is greater than the first diameter; The alignment of the multi-layer reference pattern and the expansion and contraction deviation of the target circuit board are determined according to the center coordinates of the through holes and the blind holes.

2. The circuit board processing control method according to claim 1, characterized in that: Each layer of the reference pattern corresponds to one blind hole, and the alignment degree is determined according to the coordinate deviation between the average value of the center coordinates of the plurality of blind holes and the center coordinates of the through hole.

3. The circuit board processing control method according to claim 2, characterized in that: If the coordinate deviation is within the preset threshold range, the alignment is judged to be qualified; if the coordinate deviation is not within the preset threshold range, the interaction information is output, the correction information is obtained, and the alignment of the target circuit board is determined again.

4. The circuit board processing control method according to claim 2, characterized in that: The circuit board processing equipment includes a visual component, and the visual component detects the center coordinates of the through hole and the blind hole in sequence.

5. The circuit board processing control method according to claim 1, characterized in that: The reference pattern includes a metal conductive layer, and along the stacking direction of the multi-layer reference pattern, the metal conductive layer has the same shape.

6. The circuit board processing control method according to claim 5, characterized in that: The reference pattern is in a cross shape, and after the blind hole is processed, at least one section of the metal conductive layer is in an arc ring structure.

7. The circuit board processing control method according to any one of claims 1 to 6, characterized in that: Each of the reference positions includes the center coordinates of a plurality of the blind holes, an average value of each of the reference positions is determined according to the plurality of the center coordinates, and the expansion and contraction deviation of the target circuit board is determined according to the plurality of the average values.

8. The circuit board processing control method according to any one of claims 1 to 6, characterized in that: In the process of machining the blind hole of the second diameter, the cutting tool has an edge angle greater than or equal to 145 degrees and less than or equal to 160 degrees.

9. A method for detecting alignment of a circuit board, characterized in that: include: S100, presetting a reference pattern at a reference position of a multi-layer target circuit board; S200, calling a first set of drilling components to machine a through hole of a first diameter at the reference position; S300, calling a second set of drilling components to machine a blind hole of a second diameter at the reference position, wherein the second diameter is greater than the first diameter; S400, determining the interlayer alignment of the target circuit board according to the center coordinates of the through holes and the blind holes.

10. A circuit board processing device, characterized in that: include: Obtaining a first-piece inspection task corresponding to a multi-layer target circuit board; calling a second set of drilling components to detect a top surface position of a reference position of the target circuit board; Calling a first set of drilling components to process a through hole of a first diameter at the reference position; calling a second set of drilling components to process a blind hole of a second diameter at the reference position, wherein the second diameter is greater than the first diameter; Determining the interlayer alignment of the target circuit board and the expansion and contraction deviation of the target circuit board according to the center coordinates of the through holes and the blind holes; When the alignment degree is not within a preset threshold range, the alignment degree is corrected according to the expansion and contraction deviation.

Images