Heat sink and power module

Abstract

The present application relates to a heat dissipation device and a power module. The heat dissipation device includes a shell assembly and a disturbance assembly. The shell assembly includes a base and a shell cover; the shell cover is arranged on one side of the base, and the shell cover and the base are surrounded to form a receiving cavity; the surface of the base facing the shell cover is configured as a support surface. The disturbance assembly is arranged in the receiving cavity and on the support surface. The disturbance assembly includes a plurality of disturbance members, and the plurality of disturbance members are stacked along the thickness direction of the base. In the same disturbance member, the disturbance member includes a plurality of protrusions and a plurality of blocking members, the extension direction of the protrusions and the extension direction of the blocking members intersect, the plurality of protrusions are arranged at intervals along a first direction, and a blocking member is arranged between two adjacent protrusions. In two adjacent disturbance members, the orthographic projection of the protrusion of one disturbance member on the support surface partially overlaps with the orthographic projection of the blocking member of the other disturbance member on the support surface. The heat dissipation device of the present application can improve the heat dissipation effect of the heat dissipation device.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a power module. Background Art

[0002] With the continuous advancement of electronic technology, power modules are becoming increasingly important in various applications, such as new energy vehicles, industrial automation, and renewable energy systems. These applications place higher demands on the performance and reliability of power modules, especially heat dissipation performance.

[0003] By connecting a heat sink to the power module, the heat dissipation effect of the power module can be improved. In related art, the heat sink includes a housing and multiple protrusions arranged in an array within the housing to form a pin-fin structure. When coolant is injected into the housing, the pin-fin-shaped protrusions significantly improve the coolant's flow path, thereby increasing the heat dissipation surface area and significantly improving heat dissipation efficiency.

[0004] However, the pin-fin-shaped protrusions will increase the resistance to the coolant flow, and the coolant flow rate between the pin-fin-shaped protrusions will decrease. During the heat transfer process, the resistance in the coolant flow will reduce the coolant heat transfer effect, and ultimately affect the heat dissipation effect of the heat dissipation device. Summary of the Invention

[0005] Based on this, it is necessary to provide a heat dissipation device and a power module to solve the problem of poor heat dissipation effect of the heat dissipation device.

[0006] In a first aspect, a heat dissipation device comprises:

[0007] The shell assembly includes a base and a shell cover; the shell cover is arranged on one side of the base, and the shell cover and the base are arranged to form a receiving cavity; the surface of the base facing the shell cover is configured as a supporting surface.

[0008] A disturbance assembly is disposed in the accommodating cavity and on the supporting surface, wherein the disturbance assembly includes a plurality of disturbance members stacked along the thickness direction of the base;

[0009] In the same disruptor, the disruptor includes a plurality of protrusions and a plurality of blocking portions, the extension direction of the protrusions intersects the extension direction of the blocking portions, the plurality of protrusions are arranged at intervals along the first direction, and a blocking portion is provided between two adjacent protrusions;

[0010] Among two adjacent disrupting members, the orthographic projection of the protrusion of one disrupting member on the support surface partially overlaps with the orthographic projection of the blocking portion of the other disrupting member on the support surface.

[0011] In some embodiments, the disruptor comprises:

[0012] a first disrupting member disposed on the supporting surface, wherein the protruding portion of the first disrupting member is a first protruding portion, and the blocking portion of the first disrupting member is a first blocking portion;

[0013] The first protrusion includes a first sub-protrusion, a second sub-protrusion and a third sub-protrusion, wherein the first sub-protrusion, the second sub-protrusion and the third sub-protrusion are arranged at intervals along the second direction, and the second sub-protrusion is located between the first sub-protrusion and the third sub-protrusion;

[0014] On one side of the first blocking portion along the first direction, the first sub-protrusion and the third sub-protrusion of one first protrusion portion are both connected to the first blocking portion, and a first gap is formed between the second sub-protrusion of the first protrusion portion and the first blocking portion along the first direction;

[0015] On the other side of the first blocking portion along the first direction, the second sub-protrusion of another first protrusion is connected to the first blocking portion, and the first sub-protrusion and the third sub-protrusion of the first protrusion both have a first gap with the first blocking portion along the first direction;

[0016] The second direction intersects the first direction.

[0017] In some embodiments, a plurality of first blocking portions are arranged at intervals along the first direction to form a first blocking portion group, there are a plurality of first blocking portion groups, and the plurality of first blocking portion groups are arranged at intervals along the second direction;

[0018] The first disrupter further includes a fourth sub-protrusion; the fourth sub-protrusion is provided between two adjacent first blocking portions along the second direction, and an extension direction of the fourth sub-protrusion intersects an extension direction of the first blocking portion;

[0019] Along the second direction, a second gap is formed between the fourth sub-protrusion and the first blocking portion.

[0020] In some embodiments, the disruptor further comprises:

[0021] a second disrupting member, wherein the protrusion of the second disrupting member is a second protrusion, and the blocking portion of the second disrupting member is a second blocking portion;

[0022] The second raised portion includes a plurality of fifth sub-protrusions arranged along the second direction, all the fifth sub-protrusions of the second raised portion and two adjacent second blocking portions enclose a plurality of openings, and the plurality of openings are arranged along the second direction;

[0023] Part of the first gap is located within the orthographic projection of the opening on the supporting surface.

[0024] In some embodiments, there are a plurality of second disrupting members, and orthographic projections of the plurality of second disrupting members on the support surface at least partially do not overlap.

[0025] In some embodiments, there are multiple first disrupting members, and the multiple first disrupting members are distributed on both sides of the second disrupting member;

[0026] The orthographic projection of the protrusion of the first disruptor on one side of the second disruptor on the support surface at least partially overlaps with the orthographic projection of the protrusion of the first disruptor on the other side of the second disruptor on the support surface.

[0027] In some embodiments, the heat dissipation device further includes a plurality of blocking members, the blocking members extending along the second direction, and the plurality of blocking members being arranged at intervals along the first direction;

[0028] Along the first direction, there are multiple disturbance components, and a barrier is provided between two adjacent disturbance components;

[0029] The surface of the shell cover facing the base is configured as a buckling surface; the blocking member connects the supporting surface and the buckling surface, and a third gap is formed between the blocking member and the side wall of the shell cover.

[0030] In some embodiments, the shell cover includes a liquid inlet and a liquid outlet, both of which are connected to the accommodating cavity, and the liquid inlet and the liquid outlet are spaced apart.

[0031] In some embodiments, the housing assembly is an integrally formed structure.

[0032] In a second aspect, a power module includes a power module and the heat dissipation device according to the first aspect, wherein the heat dissipation device is connected to the power module.

[0033] The above-mentioned heat dissipation device includes a shell assembly and a disturbance assembly. The shell assembly includes a base and a shell cover; the shell cover is arranged on one side of the base, and the shell cover and the base are surrounded to form an accommodating cavity; the surface of the base facing the shell cover is configured as a support surface. The disturbance assembly is arranged in the accommodating cavity and on the support surface. The disturbance assembly includes a plurality of disturbance members, and the plurality of disturbance members are stacked along the thickness direction of the base. In the same disturbance member, the disturbance member includes a plurality of protrusions and a plurality of blocking portions, the extension direction of the protrusions and the extension direction of the blocking portions intersect, the plurality of protrusions are arranged at intervals along the first direction, and a blocking portion is provided between two adjacent protrusions. In two adjacent disturbance members, the orthographic projection of the protrusion of one disturbance member on the support surface partially overlaps with the orthographic projection of the blocking portion of the other disturbance member on the support surface.

[0034] The heat dissipation device of the present application has a blocking portion provided between two adjacent protrusions in the same disturbing member, and the extension direction of the protrusion intersects with the extension direction of the blocking portion. Therefore, when the coolant flows through the protrusion, the blocking portion can block the coolant, thereby changing the flow direction of the coolant, and further causing the coolant to form turbulence between the protrusion and the blocking portion, thereby increasing the flow velocity of the coolant and improving the heat dissipation effect of the heat dissipation device.

[0035] Similarly, since, in two adjacent disruptors, the orthographic projection of the raised portion of one disruptor on the support surface partially coincides with the orthographic projection of the blocking portion of the other disruptor on the support surface, that is, in the process of the coolant flowing through the two adjacent disruptors, when the coolant flows through the raised portion of one disruptor, the coolant can be blocked by the blocking portion of the other disruptor, thereby changing the flow direction of the coolant. At the same time, when the coolant flows through the blocking portion of one disruptor, the coolant can be blocked by the raised portion of the other disruptor, thereby changing the flow direction of the coolant, so that the coolant forms turbulent flow between the two adjacent disruptors, thereby further increasing the flow velocity of the coolant and improving the heat dissipation effect of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 Schematic diagram of the structure of a heat dissipation device in one embodiment of the present application.

[0037] Figure 2 Schematic diagram of the structure of the connection between the heat dissipation device and the power module in one embodiment of the present application.

[0038] Figure 3 for Figure 1 Partial cross-sectional view of the heat dissipation device.

[0039] Figure 4 This is a structural schematic diagram of the first disturbing member of the present application being arranged on the base.

[0040] Figure 5 This is a schematic structural diagram of the second disturbing member of the present application.

[0041] Figure 6 This is a schematic structural diagram of the first disturbing member of the present application being arranged on the shell cover.

[0042] Description of reference numerals:

[0043] 10. heat dissipation device; 100. power module; 110. power module;

[0044] 1. Shell assembly; 2. Disturbance assembly;

[0045] 11. Base; 12. Shell cover;

[0046] 121. Liquid inlet; 122. Liquid discharge port;

[0047] 21. Disturbing member; 22. First disturbing member; 23. Second disturbing member;

[0048] 211, raised portion; 212, blocking portion;

[0049] 221, first protrusion; 222, first blocking portion; 223, fourth sub-protrusion; 224, first gap; 225, second gap;

[0050] 2211, first sub-protrusion; 2212, second sub-protrusion; 2213, third sub-protrusion;

[0051] 231, second protrusion; 232, second blocking portion;

[0052] 2311. The fifth sub-protrusion; 2312. The opening. DETAILED DESCRIPTION

[0053] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0054] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0055] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0056] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0057] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0058] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0059] With the continuous advancement of electronic technology, power modules are becoming increasingly important in various applications. Consequently, higher requirements are being placed on the performance and reliability of power modules, particularly heat dissipation performance. The heat dissipation device provided in this application is used to dissipate heat from a target component. It is understood that the target component may be the aforementioned power module, or, of course, other heat dissipation components that require heat dissipation. For example, the heat dissipation device of this application is described using the example of dissipating heat from a power module.

[0060] It should be noted that, after research, the applicant found that in the related art, the heat dissipation method of the power module is mainly improved by optimizing the main thermal resistance parts such as the radiator, thermal interface material and ceramics. Furthermore, from the evolution of the heat dissipation structure of the heat dissipation device, the use of direct water cooling technology can eliminate the thermal interface material layer and improve the heat dissipation efficiency. For example, a shell and multiple protrusions are provided, and multiple protrusion arrays are arranged in the shell to form a pin-fin structure. When the coolant is injected into the shell, the heat dissipation device can greatly improve the flow path of the coolant through the pin-fin-shaped protrusions, thereby increasing the heat dissipation surface area, thereby greatly improving the heat dissipation efficiency. Alternatively, double-sided water cooling technology can be used to improve the heat dissipation effect of the power module by providing a second heat dissipation channel on the upper layer of the chip.

[0061] However, the provision of pin-fin-shaped protrusions will, on the one hand, increase the resistance to the flow of the coolant, and the coolant flow rate between the pin-fin-shaped protrusions will decrease. During the heat transfer process, the resistance to the coolant flow will reduce the effect of the coolant heat transfer, ultimately affecting the heat dissipation effect of the heat dissipation device. On the other hand, the shell that accommodates the pin-fin-shaped protrusions requires the use of a sealing ring during use, which may cause the sealing ring to leak, affecting the heat dissipation performance. As for the double-sided water cooling technology, on the one hand, the structure of the double-sided water cooling technology is complex, which increases the difficulty of manufacturing; on the other hand, the double-sided water cooling technology will increase material and manufacturing costs, and the cost in the production process is relatively high.

[0062] Furthermore, based on the above research, the inventors designed a three-dimensional heat dissipation device to further improve the heat dissipation effect of the heat dissipation device.

[0063] See Figure 1 、 Figure 2 and Figure 3 As shown. A heat dissipation device 10 provided in one embodiment of the present application includes a shell assembly 1 and a disturbance assembly 2. The shell assembly 1 includes a base 11 and a shell cover 12; the shell cover 12 is provided on one side of the base 11, and the shell cover 12 and the base 11 are arranged to form an accommodating cavity; the surface of the base 11 facing the shell cover 12 is configured as a support surface. The disturbance assembly 2 is provided in the accommodating cavity and on the support surface. The disturbance assembly 2 includes a plurality of disturbance members 21, and the plurality of disturbance members 21 are stacked along the thickness direction of the base 11. In the same disturbance member 21, the disturbance member 21 includes a plurality of protrusions 211 and a plurality of blocking members 212, the extension direction of the protrusion 211 and the extension direction of the blocking member 212 intersect, the plurality of protrusions 211 are arranged at intervals along the first direction, and a blocking member 212 is provided between two adjacent protrusions 211. Among two adjacent disrupting members 21 , the orthographic projection of the protrusion 211 of one disrupting member 21 on the support surface partially overlaps with the orthographic projection of the blocking portion 212 of the other disrupting member 21 on the support surface.

[0064] Specifically, the housing assembly 1, serving as the main structure of the heat sink 10, accommodates the disturbance assembly 2 and provides a working space for the disturbance assembly 2. Furthermore, it connects to the power module 110 to dissipate heat from the power module 110. It should be noted that a coolant must be injected into the housing cavity to dissipate heat from the power module 110 connected to the housing assembly 1. The type of coolant is not limited.

[0065] Furthermore, since the agitation assembly 2 is disposed in the accommodating cavity and the agitation assembly 2 includes a plurality of agitation members 21 , the plurality of agitation members 21 are stacked along the thickness direction of the base 11 .

[0066] In the process of the coolant flowing through the same disruptor 21, since a blocking portion 212 is provided between two adjacent protrusions 211 in the same disruptor 21, and the extension direction of the protrusion 211 and the extension direction of the blocking portion 212 intersect, when the coolant flows through the protrusion 211, the blocking portion 212 can block the coolant and change the flow direction of the coolant, thereby increasing the flow speed of the coolant and improving the heat dissipation effect of the heat dissipation device 10.

[0067] Similarly, when the coolant flows through two adjacent disruptors 21, since the orthographic projection of the protrusion 211 of one of the disruptors 21 on the support surface partially coincides with the orthographic projection of the blocking portion 212 of the other disruptor 21 on the support surface, when the coolant flows through the protrusion 211 of one of the disruptors 21, the blocking portion 212 of the other disruptor 21 can block the coolant, thereby changing the flow direction of the coolant. At the same time, when the coolant flows through the blocking portion 212 of one of the disruptors 21, the protrusion 211 of the other disruptor 21 can block the coolant, thereby changing the flow direction of the coolant and forming multiple vortices, thereby destroying the laminar flow between the two adjacent disruptors 21 and mixing the adjacent flow layers, so that the coolant forms turbulent flow between the two adjacent disruptors 21, thereby further increasing the flow velocity of the coolant and improving the heat dissipation effect of the heat dissipation device 10.

[0068] For the convenience of explanation, the first direction is Figure 3 The X direction in ; the direction intersecting with the first direction is the second direction, that is Figure 3 The stacking direction along the thickness direction of the base 11 is the third direction, ie Figure 3 The Z direction in .

[0069] It can be understood that the coolant flows in the three directions of XYZ in the heat dissipation device 10, that is, the disturbance component 2 of the present application forms a three-dimensional heat dissipation structure. Based on the above description, it can be seen that in the process of the coolant flowing through the same disturbance member 21, the coolant forms turbulence between the protrusion 211 and the blocking portion 212. In the process of the coolant flowing through two adjacent disturbance members 21, the coolant forms turbulence between the two adjacent disturbance members 21, that is, in the process of the coolant flowing in the heat dissipation device 10, turbulence will be formed in the three directions of XYZ.

[0070] Due to the irregular movement and vortex of the coolant, the particles in the coolant are mixed more violently. This mixing effect can more effectively transfer heat from the heat dissipation structure to the coolant, thereby improving the heat exchange efficiency. In addition, due to the irregular movement of turbulence, the temperature difference in the flow field is smaller than that in the laminar state, which means that the heat transfer is more uniform, thereby improving the heat exchange efficiency of the heat dissipation device 10. In addition, since the flow direction of the coolant changes when passing through the protrusion 211 and the blocking portion 212, becoming perpendicular to the flow direction, the stability of the boundary layer is destroyed, making the heat transfer more direct and rapid, reducing the thermal resistance, and thus further improving the heat dissipation effect of the heat dissipation device 10.

[0071] In some embodiments, see Figure 4 As shown, the disruptor 21 includes a first disruptor 22. The first disruptor 22 is disposed on the support surface, the protrusion 211 of the first disruptor 22 is a first protrusion 221, and the blocking portion 212 of the first disruptor 22 is a first blocking portion 222; the first protrusion 221 includes a first sub-protrusion 2211, a second sub-protrusion 2212, and a third sub-protrusion 2213, the first sub-protrusion 2211, the second sub-protrusion 2212, and the third sub-protrusion 2213 being arranged at intervals along the second direction, and the second sub-protrusion 2212 being located between the first sub-protrusion 2211 and the third sub-protrusion 2213; on one side of the first blocking portion 222 along the first direction, one of the first protrusions The first sub-protrusion 2211 and the third sub-protrusion 2213 of the part 221 are both connected to the first blocking part 222, and the second sub-protrusion 2212 of the first protrusion part 221 has a first gap 224 with the first blocking part 222 along the first direction; on the other side of the first blocking part 222 along the first direction, the second sub-protrusion 2212 of another first protrusion part 221 is connected to the first blocking part 222, and the first sub-protrusion 2211 and the third sub-protrusion 2213 of the first protrusion part 221 have a first gap 224 with the first blocking part 222 along the first direction; wherein the second direction intersects with the first direction.

[0072] In this way, in the process of the coolant flowing through the first disturbing member 22, the coolant flowing through the first blocking part 222 can be blocked by the first sub-protrusion 2211, the second sub-protrusion 2212 and the third sub-protrusion 2213 respectively, so that the flow direction of the coolant can be further changed and diverted, so that the coolant forms more irregular motion and vortex, and a larger number of vortices can be formed, so that the laminar flow is more seriously destroyed, resulting in more intense mixing of particles in the coolant, thereby further improving the heat dissipation effect of the heat dissipation device 10.

[0073] In some embodiments, multiple first blocking portions 222 are arranged at intervals along the first direction to form a first blocking portion 222 group, there are multiple first blocking portion 222 groups, and multiple first blocking portion 222 groups are arranged at intervals along the second direction; the first disruptor 22 also includes a fourth sub-protrusion 223; a fourth sub-protrusion 223 is provided between two adjacent first blocking portions 222 along the second direction, and an extension direction of the fourth sub-protrusion 223 intersects with an extension direction of the first blocking portion 222; along the second direction, a second gap 225 is provided between the fourth sub-protrusion 223 and the first blocking portion 222.

[0074] In this way, when the coolant flows through the blocking portion 212, the coolant can be blocked by the protrusion 211, thereby changing the flow direction of the coolant, and then the coolant forms turbulence between the protrusion 211 and the blocking portion 212, so that the coolant forms more irregular movement and vortex, and a larger number of vortices can be formed, so that the laminar flow is more seriously destroyed, resulting in more intense mixing of particles in the coolant, thereby further improving the heat dissipation effect of the heat dissipation device 10.

[0075] In some embodiments, see Figure 5 As shown, the disruptor 21 further includes a second disruptor 23. The protrusion 211 of the second disruptor 23 is a second protrusion 231, and the blocking portion 212 of the second disruptor 23 is a second blocking portion 232. The second protrusion 231 includes a plurality of fifth sub-protrusions 2311 arranged along the second direction. All the fifth sub-protrusions 2311 of the second protrusion 231 and two adjacent second blocking portions 232 together form a plurality of openings 2312 arranged along the second direction. A portion of the first gap 224 is located within the orthographic projection of the opening 2312 on the support surface.

[0076] In this way, when the coolant flows along the Z direction, when the coolant flows through the first protrusion 221, the coolant can be blocked by the second blocking portion 232 to change the flow direction of the coolant. At the same time, when the coolant flows through the first blocking portion 222, the coolant can be blocked by the fifth sub-protrusion 2311 of the second protrusion 231 to change the flow direction of the coolant, so that the coolant forms more irregular motion and vortex in the Z direction, and a larger number of vortices can be formed, so that the laminar flow is more seriously destroyed, resulting in more intense mixing of particles in the coolant, thereby further improving the heat dissipation effect of the heat dissipation device 10.

[0077] In addition, since all the fifth sub-protrusions 2311 of the second protrusion 231 and the two adjacent second blocking portions 232 are enclosed to form a plurality of openings 2312, the plurality of openings 2312 are arranged along the second direction; part of the first gap 224 is located within the positive projection of the opening 2312 on the supporting surface, so that when the coolant flows along the Z direction, on the one hand, the coolant can flow smoothly in the Z direction through the opening 2312; on the other hand, the flow in the Z direction can be formed through the opening 2312 while the flow in the X and Y directions is formed, so that the coolant in the Z direction has a spiral flow direction or an inclined flow direction, thereby increasing the heat dissipation area in the Z direction and improving the heat dissipation effect.

[0078] In some embodiments, there are multiple second disrupting members 23 , and the orthographic projections of the multiple second disrupting members 23 on the support surface at least partially do not overlap.

[0079] In this way, since the orthographic projections of the multiple second disturbance members 23 on the supporting surface do not overlap at least partially, the openings 2312 are misaligned during the flow of the coolant along the Z direction, which can further change the direction of the coolant flowing along the Z direction, thereby further improving the effect of the spiral flow or oblique flow of the coolant in the Z direction, so that the coolant forms more irregular motion and vortexes, and can form a larger number of vortices, so that the laminar flow is more severely destroyed, resulting in more intense mixing of particles in the coolant, thereby further improving the heat dissipation effect of the heat dissipation device 10.

[0080] Of course, the present application does not limit the number of the second disruptors 23. The present application can select a suitable number of the second disruptors 23 according to the overall height of the heat dissipation device 10 and actual processing and production. The number of the second disruptors 23 will not be elaborated here.

[0081] In some embodiments, see Figure 6As shown, there are multiple first disrupting members 22, and the multiple first disrupting members 22 are distributed on both sides of the second disrupting member 23; the orthographic projection of the protrusion 211 of the first disrupting member 22 on one side of the second disrupting member 23 on the support surface is at least partially overlapped with the orthographic projection of the protrusion 211 of the first disrupting member 22 on the other side of the second disrupting member 23 on the support surface.

[0082] In this manner, the turbulence of the coolant along the X, Y, and Z directions can be continuously varied by stacking multiple first and second disruptors 22, 23, thereby improving the heat dissipation effect of the heat dissipation device 10. Furthermore, since there are multiple first disruptors 22, turbulence of the coolant can be achieved within a relatively small range, further improving the heat exchange efficiency of the coolant.

[0083] In some embodiments, the heat dissipation device 10 further includes a plurality of barriers, which extend along the second direction and are arranged at intervals along the first direction; along the first direction, there are multiple disturbance components 2, and a barrier is provided between two adjacent disturbance components 2; the surface of the shell cover 12 facing the base 11 is configured as a snap-fit ​​surface; the barrier connects the support surface and the snap-fit ​​surface, and a third gap is provided between the barrier and the side wall of the shell cover 12.

[0084] It is understood that because the barrier connects the support surface and the fastening surface, and a third gap is defined between the barrier and the sidewall of the housing cover 12, coolant can only flow through the third gap to achieve communication between the multiple disturbance assemblies 2. Thus, the barrier can be used to divide the multiple disturbance assemblies 2 into multiple distinct zones. Within each corresponding zone of the multiple disturbance assemblies 2, a large amount of coolant flows within each zone, thereby ensuring uniform coolant temperature within each disturbance assembly 2. This prevents the coolant from being too hot near the liquid inlet 121 and too hot near the liquid outlet 122, thereby improving the heat dissipation effect of various parts of the heat dissipation device 10.

[0085] In some embodiments, see Figure 1 As shown, the shell cover 12 includes a liquid inlet 121 and a liquid outlet 122 . Both the liquid inlet 121 and the liquid outlet 122 are communicated with the accommodating cavity, and the liquid inlet 121 and the liquid outlet 122 are arranged at intervals.

[0086] In this way, the coolant can be introduced and discharged through the liquid inlet 121 and the liquid outlet 122 respectively, so that the coolant in the accommodating cavity is always controlled at a lower temperature, thereby improving the heat dissipation effect of the heat dissipation device 10.

[0087] Optionally, the liquid inlet 121 and the liquid outlet 122 are provided on the fastening surface of the housing cover 12. In this way, the coolant in the accommodating cavity can be circulated in the X and Y directions through the liquid inlet 121 and the liquid outlet 122. At the same time, the coolant can be controlled to flow along the Z direction, thereby improving the flow path of the coolant and enhancing the cooling effect of the coolant.

[0088] Of course, the positions of the liquid inlet 121 and the liquid outlet 122 can be flexibly changed according to the designed flow direction. On the one hand, the flow direction of the coolant in the accommodating cavity can be changed by the positions of the liquid inlet 121 and the liquid outlet 122. On the other hand, it can facilitate the design requirements of the heat dissipation device 10.

[0089] In some embodiments, the housing assembly 1 is an integrally formed structure.

[0090] In this way, since the shell assembly 1 is an integrally formed structure, it can ensure that the coolant is always in the accommodating cavity surrounded by the shell assembly 1, thereby avoiding leakage of the coolant and improving the overall sealing performance of the heat dissipation device 10.

[0091] Optionally, the base 11 and the shell cover 12 are connected by welding, the first disruptor 22 and the second disruptor 23 are connected by welding, the first disruptor 22 on one side of the second disruptor 23 and the base 11 are connected by welding, the first disruptor 22 on the other side of the second disruptor 23 and the top cover are connected by welding, and the multiple second disruptors 23 are connected by welding.

[0092] Optionally, during the welding connection process, the welding process used includes but is not limited to stir friction welding, active brazing, or hot pressing welding, etc.; wherein the solder used in the brazing process includes at least one of tin, silver, copper and precious metals (such as titanium).

[0093] During the preparation process, the base 11 and the shell cover 12 can be welded to the disturbance component 2 respectively, and then the base 11 and the shell cover 12 can be welded, thereby further reducing the production process cost and reducing the manufacturing difficulty of the heat dissipation device 10.

[0094] In the second aspect, a power module 100, referring to Figure 1 and Figure 2 As shown, the power module 100 includes a power module 110 and the heat dissipation device 10 in the first aspect, and the heat dissipation device 10 is connected to the power module 110 .

[0095] In this way, the heat dissipation device 10 can dissipate heat from the power module 110, thereby ensuring normal use of the power module 110. At the same time, since the present application can improve the heat dissipation effect of the heat dissipation device 10, the performance of the power module 110 can be improved.

[0096] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The above embodiments merely illustrate several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A heat dissipation device, characterized in that: include: A housing assembly, comprising a base and a housing cover; The shell cover is arranged on one side of the base, and the shell cover and the base are arranged to form a receiving cavity; the surface of the base facing the shell cover is configured as a supporting surface. A disturbance component is disposed in the accommodating cavity and on the supporting surface, wherein the disturbance component includes a plurality of disturbance members stacked along the thickness direction of the base; In the same disruptor, the disruptor comprises a plurality of protrusions and a plurality of blocking portions, the extension direction of the protrusions intersects the extension direction of the blocking portions, the plurality of protrusions are arranged at intervals along the first direction, and the blocking portion is provided between two adjacent protrusions; In two adjacent disrupting members, an orthographic projection of the protruding portion of one of the disrupting members on the supporting surface partially overlaps with an orthographic projection of the blocking portion of the other disrupting member on the supporting surface.

2. The heat dissipation device according to claim 1, characterized in that: The disruptor comprises: a first disrupting member disposed on the supporting surface, wherein the protrusion of the first disrupting member is a first protrusion, and the blocking portion of the first disrupting member is a first blocking portion; The first protrusion includes a first sub-protrusion, a second sub-protrusion and a third sub-protrusion, the first sub-protrusion, the second sub-protrusion and the third sub-protrusion are arranged at intervals along the second direction, and the second sub-protrusion is located between the first sub-protrusion and the third sub-protrusion; On one side of the first blocking portion along the first direction, the first sub-protrusion and the third sub-protrusion of one of the first protruding portions are both connected to the first blocking portion, and a first gap is formed between the second sub-protrusion of the first protruding portion and the first blocking portion along the first direction; On the other side of the first blocking portion along the first direction, the second sub-protrusion of another first protrusion is connected to the first blocking portion, and the first sub-protrusion and the third sub-protrusion of the first protrusion both have the first gap with the first blocking portion along the first direction; The second direction intersects with the first direction.

3. The heat dissipation device according to claim 2, characterized in that: A plurality of the first blocking portions are arranged at intervals along the first direction to form a first blocking portion group, and there are a plurality of the first blocking portion groups, and the plurality of the first blocking portion groups are arranged at intervals along the second direction; The first disrupter further includes a fourth sub-protrusion; the fourth sub-protrusion is provided between two adjacent first blocking portions along the second direction, and an extension direction of the fourth sub-protrusion intersects with an extension direction of the first blocking portion; Along the second direction, a second gap is formed between the fourth sub-protrusion and the first blocking portion.

4. The heat dissipation device according to claim 2, characterized in that: The disruptor also includes: a second disrupting member, wherein the protrusion of the second disrupting member is a second protrusion, and the blocking portion of the second disrupting member is a second blocking portion; The second protrusion includes a plurality of fifth sub-protrusions arranged along the second direction, all the fifth sub-protrusions of the second protrusion and two adjacent second blocking portions enclose a plurality of openings, and the plurality of openings are arranged along the second direction; Part of the first gap is located within the orthographic projection of the opening on the supporting surface.

5. The heat dissipation device according to claim 4, characterized in that: There are a plurality of second disrupting members, and the orthographic projections of the plurality of second disrupting members on the support surface at least partially do not overlap.

6. The heat dissipation device according to claim 4, characterized in that: There are multiple first disrupting members, and the multiple first disrupting members are distributed on both sides of the second disrupting member; An orthographic projection of the protrusion of the first disruptor on one side of the second disruptor on the support surface at least partially overlaps with an orthographic projection of the protrusion of the first disruptor on the other side of the second disruptor on the support surface.

7. The heat dissipation device according to any one of claims 2 to 6, characterized in that: The heat dissipation device further includes a plurality of blocking members, the blocking members extending along the second direction, and the plurality of blocking members being arranged at intervals along the first direction; Along the first direction, there are multiple disturbance components, and the blocking member is provided between two adjacent disturbance components; The surface of the shell cover facing the base is configured as a buckling surface; the blocking member connects the supporting surface and the buckling surface, and a third gap is formed between the blocking member and the side wall of the shell cover.

8. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The shell cover includes a liquid inlet and a liquid discharge port, both of which are communicated with the accommodating cavity, and the liquid inlet and the liquid discharge port are spaced apart.

9. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The housing assembly is an integrally formed structure.

10. A power module, characterized in that: The heat dissipation device comprises a power module and the heat dissipation device according to any one of claims 1 to 9, wherein the heat dissipation device is connected to the power module.

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