Display module and display device

By setting the inclined surface and fitting surface on the substrate of the display module and designing a segmented connection trace structure, the problem of easy disconnection of connection traces is solved, ensuring the normal operation of the display module.

CN119654024AActive Publication Date: 2025-03-18CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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Patent Information

Application Number
CN202311200011.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-09-15
Publication Date
2025-03-18
Estimated Expiration
2043-09-15

AI Technical Summary

Technical Problem

The connection wiring is prone to breakage, which affects the normal use of the display module.

Method used

By providing an inclined surface on the first substrate and a bonding surface on the second substrate, and dividing the connection traces into a first part, a second part and a third part, the angle between the first part and the second part is greater than 90 degrees, and the angle between the second part and the third part is greater than 90 degrees, thereby reducing the possibility of the connection traces being broken.

Benefits of technology

It effectively reduces the possibility of connection wiring breakage and ensures the normal use of the display module.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a display module and a display device, and relates to the field of display technologies. The display module comprises a first display panel and a second display panel which are connected along a first direction; the first display panel comprises a first substrate, a light-emitting assembly, a driving chip and a connecting wire, and the second display panel comprises a second substrate; the light-emitting assembly is arranged on the first surface of the first substrate, and the driving chip is arranged on the second surface of the first substrate or the second surface of the second substrate; the first substrate is provided with an inclined surface, the included angle between the inclined surface and the first surface of the first substrate is larger than 90 degrees, and the second substrate is provided with a binding surface; the connecting wire comprises a first part, a second part and a third part which are connected, and the first part is arranged on the first surface of the first substrate; the second part is arranged on the inclined surface or the binding surface, and the third part is arranged on the second surface of the second substrate. According to the display module, the possibility that the connecting wires are broken is reduced, and normal use of the display module is guaranteed.
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Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] Light-Emitting Diode (LED) display modules have the characteristics of high brightness, low power consumption and simple driving method, and are widely used in display devices.

[0003] The display module includes a plurality of display panels spliced ​​together, each display panel includes a substrate, a light-emitting component and a driver chip, the light-emitting component is arranged on the first surface of the substrate, the driver chip is arranged on the second surface of the substrate, and the driver chip is electrically connected to the light-emitting component through a connecting wire to control the light-emitting process of the light-emitting component. However, the connecting wire is prone to breakage, etc., which affects the normal use of the display module. Summary of the invention

[0004] The embodiments of the present application provide a display module and a display device to solve the problem that connection wiring is prone to breakage, which affects the normal use of the display module.

[0005] The display module provided in the embodiment of the present application includes a first display panel and a second display panel connected to each other, wherein the first display panel and the second display panel are arranged along a first direction;

[0006] The first display panel includes a first substrate, a light-emitting component, a driving chip and connecting wires, and the second display panel includes a second substrate; the first substrate and the second substrate both have a first surface facing the light-emitting side and a second surface away from the light-emitting side; the light-emitting component is arranged on the first surface of the first substrate, and the driving chip is arranged on the second surface of the first substrate, or the driving chip is arranged on the second surface of the second substrate;

[0007] The first substrate is provided with an inclined surface, and the angle between the inclined surface and the first surface of the first substrate is greater than 90 degrees; in the first direction, the inclined surface faces the second substrate, and the second substrate is provided with a bonding surface, the bonding surface and the inclined surface are arranged parallel to each other along the first direction, and the angle between the bonding surface and the second surface of the second substrate is greater than 90 degrees;

[0008] The connecting trace includes a first part, a second part and a third part, wherein the first part is arranged on the first surface of the first substrate, and the first part is electrically connected to the light-emitting component; the second part is arranged on the inclined surface or the bonding surface, and the first end of the second part is electrically connected to an end of the first part away from the light-emitting component; the third part is arranged on the second surface of the second substrate, and the third part is electrically connected to the second end of the second part, and the third part is electrically connected to the driving chip.

[0009] By adopting the above technical solution, an inclined surface is provided on the first substrate, the angle between the inclined surface and the first surface of the first substrate is greater than 90 degrees, and a bonding surface is provided on the second substrate, the bonding surface and the inclined surface are arranged parallel to each other along the first direction, and the angle between the bonding surface and the second surface of the second substrate is greater than 90 degrees;

[0010] The connecting line is configured to include a first part, a second part and a third part, wherein the first part is configured on the first surface of the first substrate, the second part is configured on the inclined surface or the bonding surface, and the third part is configured on the second surface of the second substrate. The angle between the first part and the second part is greater than 90 degrees, and the angle between the second part and the third part is greater than 90 degrees, thereby reducing the possibility of breakage of the connecting line and ensuring the normal use of the display module.

[0011] In some possible implementations, the driving chip is disposed on the second surface of the second substrate;

[0012] The third portion extends along the first direction, a first end of the third portion is electrically connected to the driving chip, and a second end of the third portion is electrically connected to the second portion.

[0013] In some possible implementations, the driving chip is disposed on the second surface of the first substrate;

[0014] The connecting wire further includes a fourth portion, the fourth portion is disposed on the second surface of the first substrate, a first end of the fourth portion is electrically connected to the driving chip, and a second end of the fourth portion extends toward the inclined surface;

[0015] The third part is electrically connected to the fourth part, and the third part is electrically connected to the driving chip through the fourth part.

[0016] In some possible implementations, the display module further includes a connecting member, and the connecting member is disposed between the first display panel and the second display panel;

[0017] The first end of the connecting member is electrically connected to the third portion, and the second end of the connecting member is electrically connected to the fourth portion.

[0018] In some possible implementations, the angle between the inclined surface and the first surface of the first substrate is greater than or equal to 110 degrees and less than or equal to 160 degrees;

[0019] And / or, an angle between the bonding surface and the second surface of the second substrate is greater than or equal to 110 degrees and less than or equal to 160 degrees.

[0020] In some possible implementations, the second portion is disposed on the inclined surface, and the second portion is integrally disposed with the first portion;

[0021] Preferably, the bonding surface is further provided with a conductive portion, and a surface of the conductive portion facing away from the bonding surface is electrically connected to the second portion.

[0022] In some possible implementations, the second portion is disposed on the fitting surface, and the second portion is integrally disposed with the third portion;

[0023] Preferably, the inclined surface is further provided with a conductive portion, and a surface of the conductive portion facing away from the inclined surface is electrically connected to the second portion.

[0024] In some possible implementations, the first substrate is further provided with the bonding surface, and the second substrate is further provided with the inclined surface;

[0025] The inclined surface of the first substrate and the bonding surface of the first substrate are arranged at the same end of the first substrate along the first direction, the bonding surface of the first substrate and the inclined surface of the second substrate are arranged parallel to each other along the first direction, and the angle between the bonding surface of the first substrate and the first surface of the first substrate is less than 90 degrees;

[0026] Preferably, the number of the inclined surfaces and the number of the fitting surfaces are both set to be multiple, and the multiple inclined surfaces and the multiple fitting surfaces are alternately arranged in sequence along the second direction, and the second direction is perpendicular to the first direction.

[0027] In some possible implementations, the first substrate is further provided with the bonding surface, the inclined surface of the first substrate is provided at the first end of the first substrate along the first direction, the bonding surface of the first substrate is provided at the second end of the first substrate along the first direction, and the angle between the bonding surface of the first substrate and the first surface of the first substrate is less than 90 degrees;

[0028] Preferably, the display module also includes a third display panel, and the third display panel includes a third substrate; in the first direction, the third substrate is arranged at an end of the first substrate away from the second substrate, and the third substrate is also provided with the inclined surface; the bonding surface of the first substrate and the inclined surface of the third substrate are arranged parallel to each other along the first direction.

[0029] An embodiment of the present application further provides a display device, comprising any of the display modules described above.

[0030] Since the display device includes any of the display modules described above, the advantages of the display device including any of the display modules described above can be specifically described in the above related descriptions and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0032] Figure 1 A schematic diagram of the structure of a display module provided in an embodiment of the present application when the first display panel and the second display panel are not connected;

[0033] Figure 2 Provided in the embodiments of this application Figure 1 A schematic structural diagram of a display module when a first display panel and a second substrate of the display module are connected;

[0034] Figure 3 A schematic structural diagram of a display module when a first display panel and a second display panel are not connected according to another implementation mode provided in an embodiment of the present application;

[0035] Figure 4 Provided in the embodiments of this application Figure 3 A schematic structural diagram of a display module when a first display panel and a second substrate of the display module are connected;

[0036] Figure 5 A schematic structural diagram of a display module when a first display panel and a second display panel are not connected according to another implementation mode provided in an embodiment of the present application;

[0037] Figure 6 Provided in the embodiments of this application Figure 5 A schematic structural diagram of a display module when a first display panel and a second substrate of the display module are connected;

[0038] Figure 7 A schematic structural diagram of a display module when a first display panel and a second display panel are not connected according to another implementation mode provided in an embodiment of the present application;

[0039] Figure 8 Provided in the embodiments of this application Figure 7 A schematic structural diagram of a display module when a first display panel and a second substrate of the display module are connected;

[0040] Fig. 9 A schematic structural diagram of a display module including a conductive portion provided in an embodiment of the present application when the first display panel and the second display panel are not connected;

[0041] Fig.10 Provided in the embodiments of this application Fig. 9 A schematic structural diagram of a display module when a first display panel and a second substrate of the display module are connected;

[0042] Fig.11 A schematic structural diagram of another embodiment of a display module including a conductive portion provided in an embodiment of the present application when the first display panel and the second display panel are not connected;

[0043] Fig.12 Provided in the embodiments of this application Fig.11 A schematic structural diagram of a display module when a first display panel and a second substrate of the display module are connected;

[0044] Fig.13 A schematic diagram of the structure of a first substrate provided in an embodiment of the present application;

[0045] Fig.14 A schematic diagram of the structure of the first substrate and the second substrate provided in an embodiment of the present application;

[0046] Fig.15 A schematic diagram of the structure of the first substrate, the second substrate and the third substrate provided in the embodiment of the present application;

[0047] Fig.16 A schematic structural diagram of a first substrate in another embodiment of the present application;

[0048] Fig.17 A schematic structural diagram of a first substrate and a second substrate of another embodiment provided in an example of the present application;

[0049] Fig.18 A schematic structural diagram of a first substrate, a second substrate and a third substrate of another implementation manner provided in an example of the present application.

[0050] Description of reference numerals:

[0051] 100. a first display panel;

[0052] 110, first substrate; 111, inclined surface; 111a, first inclined surface; 111b, second inclined surface; 111c, third inclined surface; 120, light emitting component; 130, driver chip; 140, connection wiring; 141, first part; 142, second part; 143, third part; 144, fourth part; 145, connector; 146, conductive part; 150, connection terminal;

[0053] 200, a second display panel;

[0054] 210, second substrate; 211, bonding surface; 211a, first bonding surface; 211b, second bonding surface; 211c, third bonding surface;

[0055] 300. A third substrate.

[0056] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0057] As described in the background technology, the display module includes a plurality of display panels spliced ​​together, each display panel includes a substrate, a light-emitting component, a driver chip and a connecting wire, the light-emitting component is arranged on the first surface of the substrate, the driver chip is arranged on the second surface of the substrate, and the first surface and the second surface are respectively opposite two side surfaces in the thickness direction of the substrate. The first end of the connecting wire is electrically connected to the driver chip, and the second end of the connecting wire is electrically connected to the light-emitting component, so that the driver chip is electrically connected to the light-emitting component through the connecting wire, so that the driver chip can control the light-emitting process of the light-emitting component.

[0058] The connecting trace includes a first part, a second part and a third part. The first part is arranged on the first surface of the substrate, and the first part is electrically connected to the light-emitting component; the second part is arranged on the side of the substrate, the first end of the second part is located on the first surface of the substrate, and is electrically connected to an end of the first part away from the light-emitting component, and the second end of the second part is located on the second surface of the substrate; the third part is arranged on the second surface of the substrate, the third part is electrically connected to the driving chip, and the end of the third part away from the driving chip is electrically connected to the second end of the second part, so that the driving chip is electrically connected to the light-emitting component through the third part, the second part and the first part in sequence.

[0059] However, since the side surface of the substrate is usually arranged perpendicularly to the first surface of the substrate and the second surface of the substrate, in the connecting line, the first part and the second part are arranged perpendicularly, the third part and the second part are arranged perpendicularly, and the connection between the first part and the second part, and the connection between the third part and the second part are prone to breakage. When the side surface of the substrate is inclined relative to the first surface of the substrate, for example, the angle between the side surface of the substrate and the first surface of the substrate can be greater than 90 degrees, then the angle between the side surface of the substrate and the second surface of the substrate is less than 90 degrees, which makes the connection between the third part and the second part more prone to breakage, thereby affecting the normal use of the display module.

[0060] In order to solve the above technical problems, the embodiments of the present application provide a display module and a display device, wherein the display module includes a first display panel and a second display panel connected to each other, and the first display panel and the second display panel are arranged along a first direction; the first display panel includes a first substrate, a light-emitting component, a driving chip and a connecting wire, and the second display panel includes a second substrate; the light-emitting component is arranged on a first surface of the first substrate, and the driving chip is arranged on a second surface of the first substrate, or the driving chip is arranged on a second surface of the second substrate;

[0061] The first substrate of the display module is provided with an inclined surface, the angle between the inclined surface and the first surface of the first substrate is greater than 90 degrees, the inclined surface faces the second substrate, and the second substrate is further provided with a bonding surface, the bonding surface and the inclined surface are arranged parallel to each other along the first direction, and the angle between the bonding surface and the second surface of the second substrate is greater than 90 degrees;

[0062] The connecting line is configured to include a first part, a second part and a third part, wherein the first part is configured on the first surface of the first substrate, the second part is configured on the inclined surface or the bonding surface, and the third part is configured on the second surface of the second substrate. The angle between the first part and the second part is greater than 90 degrees, and the angle between the second part and the third part is greater than 90 degrees, thereby reducing the possibility of breakage of the connecting line and ensuring the normal use of the display module.

[0063] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0064] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0065] Reference Figure 1 and Figure 2 , the embodiment of the present application provides a display module, including a first display panel 100 and a second display panel 200 connected to each other, the first display panel 100 and the second display panel 200 are arranged along a first direction; wherein the first display panel 100 includes a first substrate 110, a light-emitting component 120, a driving chip 130 and a connecting wire 140, and the second display panel 200 includes a second substrate 210, and the second substrate 210 and the first substrate 110 are arranged in the same plane; the first substrate 110 and the second substrate 210 both have a first surface facing the light-emitting side and a second surface away from the light-emitting side;

[0066] In the first display panel 100, the light-emitting component 120 is arranged on the first surface of the first substrate 110, and the driving chip 130 is arranged on the second surface of the first substrate 110, or the driving chip 130 is arranged on the second surface of the second substrate 210, and the driving chip 130 is electrically connected to the light-emitting component 120 through the connecting line 140 to control the light-emitting process of the light-emitting component 120.

[0067] The first display panel 100 further includes a connection terminal 150 , which is disposed on the first surface of the first substrate 110 , and is electrically connected to the light-emitting component 120 . The connection terminal 150 is also electrically connected to the connection trace 140 , so that the connection trace 140 can be electrically connected to the light-emitting component 120 through the connection terminal 150 .

[0068] It should be noted that the structure of the second display panel 200 can be arranged in the same manner as the structure of the first display panel 100. For example, the second display panel 200 can also include a light-emitting component 120, a driving chip 130, and a connecting wire 140. In the second display panel 200, the light-emitting component 120 is arranged on the first surface of the second substrate 210, the driving chip 130 is arranged on the second surface of the second substrate 210, and the driving chip 130 is electrically connected to the light-emitting component 120 through the connecting wire 140 to control the light-emitting process of the second display panel 200. Alternatively, the structure of the second display panel 200 can also be different from that of the first display panel 100, and the embodiment of the present application does not impose further restrictions on this.

[0069] Reference Figure 1 and Figure 2In the first display panel 100, the first substrate 110 may be provided with an inclined surface 111, and the angle between the inclined surface 111 and the first surface of the first substrate 110 is greater than 90 degrees; in the first direction, the inclined surface 111 may face the second substrate 210, and the second substrate 210 is provided with a bonding surface 211, and the bonding surface 211 and the inclined surface 111 are arranged parallel to each other along the first direction, and the angle between the bonding surface 211 and the second surface of the second substrate 210 is greater than 90 degrees. Exemplarily, the first surface of the first substrate 110 may be arranged parallel to the second surface of the second substrate 210, so that the angle between the inclined surface 111 and the first surface of the first substrate 110 is equal to the angle between the bonding surface 211 and the second surface of the second substrate 210.

[0070] The connecting trace 140 includes a first part 141, a second part 142 and a third part 143 connected to each other, wherein the first part 141 can be arranged on the first surface of the first substrate 110, and the first part 141 is electrically connected to the light-emitting component 120; the second part 142 is arranged on the inclined surface 111 or the bonding surface 211, the first end of the second part 142 is electrically connected to the end of the first part 141 away from the light-emitting component 120, and the angle between the second part 142 and the first part 141 is equal to the angle between the inclined surface 111 and the first surface of the first substrate 110; the third part 143 is arranged on the second surface of the second substrate 210, the third part 143 is electrically connected to the second end of the second part 142, the angle between the third part 143 and the second part 142 is equal to the angle between the bonding surface 211 and the second surface of the second substrate 210, and the third part 143 is electrically connected to the driving chip 130, so that the driving chip 130 is electrically connected to the light-emitting component 120 through the third part 143, the second part 142 and the first part 141 in sequence.

[0071] Exemplarily, the angle between the inclined surface 111 and the first surface of the first substrate 110 can be set to be greater than or equal to 110 degrees and less than or equal to 160 degrees. For example, the angle between the inclined surface 111 and the first surface of the first substrate 110 can be set to one of 110 degrees, 120 degrees, 130 degrees, 140 degrees, 150 degrees and 160 degrees to increase the angle between the second portion 142 and the first portion 141 and reduce the possibility of fracture at the connection between the first portion 141 and the second portion 142.

[0072] And / or, the angle between the bonding surface 211 and the second surface of the second substrate 210 can be set to be greater than or equal to 110 degrees and less than or equal to 160 degrees. For example, the angle between the bonding surface 211 and the second surface of the second substrate 210 can be set to one of 110 degrees, 120 degrees, 130 degrees, 140 degrees, 150 degrees and 160 degrees to increase the angle between the second part 142 and the third part 143 and reduce the possibility of breakage at the connection between the second part 142 and the third part 143.

[0073] By adopting the above technical solution, the angle between the second part 142 and the first part 141 is equal to the angle between the inclined surface 111 and the first surface of the first substrate 110, and the angle between the second part 142 and the first part 141 is greater than 90 degrees; the angle between the third part 143 and the second part 142 is equal to the angle between the fitting surface 211 and the second surface of the second substrate 210, and the angle between the third part 143 and the second part 142 is greater than 90 degrees, thereby reducing the possibility of breakage of the connecting line 140 and ensuring the normal use of the display module.

[0074] Reference Figure 1-Figure 4 In some possible embodiments, the driver chip 130 can be disposed on the second surface of the second substrate 210; the third portion 143 extends along the first direction, the first end of the third portion 143 is electrically connected to the driver chip 130, and the second end of the third portion 143 is electrically connected to the second portion 142, so that the driver chip 130 can be electrically connected to the second portion 142 through the third portion 143.

[0075] It is easy to understand that when preparing the display module, a first portion 141 can be formed on the first surface of the first substrate 110, the first portion 141 is electrically connected to the light emitting component 120, and one end of the first portion 141 away from the light emitting component 120 is close to the inclined surface 111; a second portion 142 is formed on the inclined surface 111 or the bonding surface 211, and a third portion 143 is formed on the second surface of the second substrate 210, and one end of the third portion 143 away from the bonding surface 211 is electrically connected to the driving chip 130;

[0076] Reference Figure 1 and Figure 2 The end of the first part 141 away from the light-emitting component 120 is electrically connected to the second part 142, and the first substrate 110 and the second substrate 210 are brought close to each other, so that the end of the third part 143 away from the driving chip 130 is electrically connected to the second part 142, so that the first part 141, the second part 142 and the third part 143 form a connecting line 140.

[0077] Reference Figure 3 and Figure 4 The end of the third part 143 away from the driver chip 130 is electrically connected to the second part 142, and the first substrate 110 and the second substrate 210 are brought closer to each other, so that the end of the first part 141 away from the light-emitting component 120 is electrically connected to the second part 142, so that the first part 141, the second part 142 and the third part 143 form a connecting line 140.

[0078] Or, refer to Figure 5-Figure 8The driver chip 130 can also be arranged on the second surface of the first substrate 110; the connecting line 140 also includes a fourth part 144, the fourth part 144 is arranged on the second surface of the first substrate 110, the fourth part 144 can extend along the first direction, the first end of the fourth part 144 is electrically connected to the driver chip 130, and the second end of the fourth part 144 extends toward the inclined surface 111; the third part 143 is electrically connected to the fourth part 144, and the third part 143 is electrically connected to the driver chip 130 through the fourth part 144.

[0079] Exemplarily, the display module also includes a connector 145, which is disposed between the first display panel 100 and the second display panel 200; the first end of the connector 145 is electrically connected to the third part 143, and the second end of the connector 145 is electrically connected to the fourth part 144, so that the third part 143 is electrically connected to the fourth part 144 through the connector 145, so that the connection between the third part 143 and the fourth part 144 is more stable.

[0080] A first portion 141 may be formed on the first surface of the first substrate 110, the first portion 141 is electrically connected to the light emitting component 120, and one end of the first portion 141 away from the light emitting component 120 is close to the inclined surface 111; a fourth portion 144 may be formed on the second surface of the first substrate 110, the fourth portion 144 is electrically connected to the driving chip 130, and one end of the fourth portion 144 away from the driving chip 130 is close to the inclined surface 111; a second portion 142 may be formed on the inclined surface 111 or the bonding surface 211, and a third portion 143 may be formed on the second surface of the second substrate 210;

[0081] Then, the first substrate 110 and the second substrate 210 are brought close to each other so that the end of the first part 141 facing away from the light-emitting component 120 is electrically connected to the second part 142, the third part 143 is electrically connected to the second part 142, and the third part 143 is also electrically connected to the fourth part 144; and then the connecting member 145 is installed between the first display panel 100 and the second display panel 200, so that the first end of the first end of the connecting member 145 is electrically connected to the third part 143, and the second end of the connecting member 145 is electrically connected to the fourth part 144, so that the third part 143 is electrically connected to the fourth part 144 through the connecting member 145, and the first part 141, the second part 142, the third part 143 and the fourth part 144 form a connecting line 140.

[0082] Reference Fig. 9 and Fig.10In some possible embodiments, the second part 142 can be arranged on the inclined surface 111, and the second part 142 can be arranged integrally with the first part 141 to facilitate the molding process of the first part 141 and the second part 142; the bonding surface 211 can also be provided with a conductive part 146, and the surface of the conductive part 146 facing away from the bonding surface 211 is electrically connected to the second part 142, so that the conduction between the first part 141 and the third part 143 is achieved through the conductive part 146 and the second part 142; the conductive part 146 can also be integrally molded with the third part 143 to facilitate the molding process of the conductive part 146.

[0083] Or, refer to Fig.11 and Fig.12 The second part 142 can also be arranged on the fitting surface 211, and the second part 142 can be arranged integrally with the third part 143 to facilitate the molding process of the second part 142 and the third part 143; the inclined surface 111 can also be provided with a conductive part 146, and the surface of the conductive part 146 facing away from the inclined surface 111 is electrically connected to the second part 142, so that the conduction between the first part 141 and the third part 143 is achieved through the conductive part 146 and the second part 142; the conductive part 146 can also be integrally molded with the first part 141 to facilitate the molding process of the conductive part 146.

[0084] Reference Figure 13-Figure 18 In some possible implementations, the structure of the second display panel 200 may be arranged in the same manner as the structure of the first display panel 100, that is, the first substrate 110 is provided with a first inclined surface 111a and a first bonding surface 211a, the second substrate 210 is provided with a second inclined surface 111b and a second bonding surface 211b, the first inclined surface 111a and the second bonding surface 211b are arranged parallel to each other along a first direction, and the first bonding surface 211a and the second inclined surface 111b are arranged parallel to each other;

[0085] For example, refer to Figure 1 , Figure 2 and Figure 13-Figure 18 When the driving chip 130 of the first display panel 100 is disposed on the second surface of the second substrate 210, the driving chip 130 of the second display panel 200 may be disposed on the second surface of the first substrate 110, or the driving chip 130 of the second display panel 200 may also be disposed on the second surface of the second substrate 210. The connection traces 140 of the second display panel 200 may be disposed the same as the connection traces 140 of the first display panel 100, or the connection traces 140 of the second display panel 200 may also be different from the connection traces 140 of the first display panel 100.

[0086] For example, the driving chip 130 of the first display panel 100 and the driving chip 130 of the second display panel 200 can be both arranged on the second surface of the first display panel 100, and the connecting wire 140 of the first display panel 100 is configured as: including a first part 141, a second part 142, a third part 143 and a fourth part 144 connected to each other, and the connecting wire 140 of the second display panel 200 is configured as: including a first part 141, a second part 142 and a third part 143 connected to each other. The specific setting methods of the connecting wire 140 of the first display panel 100 and the connecting wire 140 of the second display panel 200 can refer to the above description, and the embodiments of the present application will not be repeated here.

[0087] Exemplarily, the shapes of the first substrate 110 and the second substrate 210 are described below by taking the structure of the first substrate 110 as an example. Fig.13 and Fig.14 , the first substrate 110 may be configured as follows: the first inclined surface 111a and the bonding surface 211 may be disposed at the same end of the first substrate 110 along the first direction, for example, the first inclined surface 111a and the first bonding surface 211a are both disposed at one end of the first substrate 110 close to the second substrate 210, and the first inclined surface 111a and the first bonding surface 211a may be symmetrically disposed relative to a plane parallel to the first substrate 110;

[0088] The number of the first inclined surfaces 111a and the number of the first bonding surfaces 211a can be set to multiple, and the multiple inclined surfaces 111 and the multiple first bonding surfaces 211a are alternately arranged in sequence along the second direction, and the second direction is perpendicular to the first direction. For example, the second direction can be set to the extension direction of the edge of the first substrate 110 toward the second substrate 210.

[0089] Alternatively, the first substrate 110 can also be configured as: the number of first inclined surfaces 111a and the number of first bonding surfaces 211a can both be set to multiple, at the first end of the first substrate 110 along the first direction, several first inclined surfaces 111a and several first bonding surfaces 211a are alternately arranged in sequence along the second direction, and at the second end of the first substrate 110 along the first direction, several first inclined surfaces 111a and several first bonding surfaces 211a are alternately arranged in sequence along the second direction; the second direction is perpendicular to the first direction, for example, the second direction can be set to the extension direction of the edge of the first substrate 110 toward the second substrate 210.

[0090] It is easy to understand that referring to Fig.13 and Fig.15The display module may further include a third display panel. In the first direction, the third substrate 300 may be disposed at one end of the first substrate 110 away from the second substrate 210. The shape and structure of the third display panel may be the same as those of the first display panel 100, that is, the third display panel may include a third substrate 300. The third substrate 300 has a plurality of third inclined surfaces 111c and a plurality of third bonding surfaces 211c. At one end of the third substrate 300 close to the first substrate 110, a plurality of third inclined surfaces 111c and a plurality of third bonding surfaces 211c are alternately disposed in sequence along the second direction. The third substrate 300 is used in conjunction with the first substrate 110. As for the connection method between the third substrate 300 and the first substrate 110, reference may be made to the connection method between the first substrate 110 and the second substrate 210 described above, and the embodiments of the present application will not be repeated herein.

[0091] Reference Fig.16 and Fig.17 In some possible embodiments, the first substrate 110 may be provided with a first inclined surface 111a and a first bonding surface 211a, the first inclined surface 111a is provided at the first end of the first substrate 110 along the first direction, the first bonding surface 211a is provided at the second end of the first substrate 110 along the first direction, the angle between the first bonding surface 211a and the first surface of the first substrate 110 is less than 90 degrees, and the first bonding surface 211a and the first inclined surface 111a are provided parallel to each other along the first direction.

[0092] Reference Fig.16 and Fig.18 Exemplarily, the display module may further include a third display panel. In the first direction, the third substrate 300 may be disposed at one end of the first substrate 110 away from the second substrate 210; and the shape and structure of the second display panel 200 and the shape and structure of the third display panel may be disposed in the same manner as the first display panel 100.

[0093] In the first direction, the first inclined surface 111a can be arranged parallel to the second bonding surface 211b, and the first bonding surface 211 can be arranged parallel to the third inclined surface 111c, so that the third substrate 300 is used in conjunction with the first substrate 110, and the first substrate 110 is used in conjunction with the second substrate 210.

[0094] It is easy to understand that in the display module, the number of display panels can be set to multiple, and the multiple display panels are arranged in sequence along the first direction, and the shape and structure of each display panel can be set in the same way on the first display panel 100, so that the multiple display panels can be used in conjunction with each other, thereby reducing the possibility of breakage of the connecting lines 140 in each display panel.

[0095] In summary, the display module includes a first display panel 100 and a second display panel 200 connected to each other, and the first display panel 100 and the second display panel 200 are arranged along a first direction; the first display panel 100 includes a first substrate 110, a light-emitting component 120, a driving chip 130 and a connecting wire 140, and the second display panel 200 includes a second substrate 210; the light-emitting component 120 is disposed on a first surface of the first substrate 110, and the driving chip 130 is disposed on a second surface of the first substrate 110, or the driving chip 130 is disposed on a second surface of the second substrate 210;

[0096] The first substrate 110 of the display module is provided with an inclined surface 111, the angle between the inclined surface 111 and the first surface of the first substrate 110 is greater than 90 degrees, the inclined surface 111 faces the second substrate 210, and the second substrate 210 is further provided with a bonding surface 211, the bonding surface 211 and the inclined surface 111 are arranged parallel to each other along the first direction, and the angle between the bonding surface 211 and the second surface of the second substrate 210 is greater than 90 degrees;

[0097] In the first display panel 100, the connecting line 140 is configured to include a first part 141, a second part 142 and a third part 143, wherein the first part 141 is arranged on the first surface of the first substrate 110, the second part 142 is arranged on the inclined surface 111 or the bonding surface 211, and the third part 143 is arranged on the second surface of the second substrate 210. The angle between the first part 141 and the second part 142 is greater than 90 degrees, and the angle between the second part 142 and the third part 143 is greater than 90 degrees, thereby reducing the possibility of the connecting line 140 being broken and ensuring the normal use of the display module.

[0098] The embodiment of the present application also provides a display device, including the display module described in any of the above embodiments. Since the display device includes the display module described in any of the above embodiments, the advantages of the display device including the display module described in any of the above embodiments can be specifically referred to the above related description, which will not be repeated here.

[0099] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0100] In the description of the present invention, it should be understood that the terms "including" and "having" and any variations thereof used herein are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0101] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense, for example, it can be fixedly connected, detachably connected, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, and it can make the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display module, characterized in that: It includes a first display panel and a second display panel, wherein the first display panel and the second display panel are arranged along a first direction; The first display panel includes a first substrate, a light-emitting component, a driving chip and connecting wires, and the second display panel includes a second substrate; the first substrate and the second substrate both have a first surface facing the light-emitting side and a second surface away from the light-emitting side; the light-emitting component is arranged on the first surface of the first substrate, and the driving chip is arranged on the second surface of the first substrate, or the driving chip is arranged on the second surface of the second substrate; The first substrate is provided with an inclined surface, and the angle between the inclined surface and the first surface of the first substrate is greater than 90 degrees; in the first direction, the inclined surface faces the second substrate, and the second substrate is provided with a bonding surface, the bonding surface is parallel to the inclined surface along the first direction, and the angle between the bonding surface and the second surface of the second substrate is greater than 90 degrees; The connecting trace includes a first part, a second part and a third part, wherein the first part is arranged on the first surface of the first substrate, and the first part is electrically connected to the light-emitting component; the second part is arranged on the inclined surface or the bonding surface, and the first end of the second part is electrically connected to the first part; the third part is arranged on the second surface of the second substrate, and the third part is electrically connected to the second end of the second part, and the third part is electrically connected to the driving chip.

2. The display module according to claim 1, characterized in that: The driving chip is disposed on the second surface of the second substrate; The third portion extends along the first direction, a first end of the third portion is electrically connected to the driving chip, and a second end of the third portion is electrically connected to the second portion.

3. The display module according to claim 1, characterized in that: The driving chip is disposed on the second surface of the first substrate; The connecting wire further includes a fourth portion, the fourth portion is disposed on the second surface of the first substrate, a first end of the fourth portion is electrically connected to the driving chip, and a second end of the fourth portion extends toward the second substrate; The third part is electrically connected to the fourth part, and the third part is electrically connected to the driving chip through the fourth part.

4. The display module according to claim 3, characterized in that: The display module further includes a connecting member, and the connecting member is arranged between the first display panel and the second display panel; The first end of the connecting member is electrically connected to the third portion, and the second end of the connecting member is electrically connected to the fourth portion.

5. The display module according to claim 1, characterized in that: The angle between the inclined surface and the first surface of the first substrate is greater than or equal to 110 degrees and less than or equal to 160 degrees; And / or, an angle between the bonding surface and the second surface of the second substrate is greater than or equal to 110 degrees and less than or equal to 160 degrees.

6. The display module according to claim 1, characterized in that: The second part is arranged on the inclined surface, and the second part is arranged integrally with the first part; Preferably, the bonding surface is further provided with a conductive portion, and a surface of the conductive portion facing away from the bonding surface is electrically connected to the second portion.

7. The display module according to claim 1, characterized in that: The second part is arranged on the fitting surface, and the second part is integrally arranged with the third part; Preferably, the inclined surface is further provided with a conductive portion, and a surface of the conductive portion facing away from the inclined surface is electrically connected to the second portion.

8. The display module according to any one of claims 1 to 7, characterized in that: The first substrate is further provided with the bonding surface, and the second substrate is further provided with the inclined surface; The inclined surface of the first substrate and the bonding surface of the first substrate are arranged at the same end of the first substrate along the first direction, the bonding surface of the first substrate and the inclined surface of the second substrate are arranged parallel to each other along the first direction, and the angle between the bonding surface of the first substrate and the first surface of the first substrate is less than 90 degrees; Preferably, the number of the inclined surfaces and the number of the fitting surfaces are both set to be multiple, and the multiple inclined surfaces and the multiple fitting surfaces are alternately arranged in sequence along the second direction, and the second direction is perpendicular to the first direction.

9. The display module according to any one of claims 1 to 7, characterized in that: The first substrate is further provided with the bonding surface, the inclined surface of the first substrate is provided at the first end of the first substrate along the first direction, the bonding surface of the first substrate is provided at the second end of the first substrate along the first direction, and the angle between the bonding surface of the first substrate and the first surface of the first substrate is less than 90 degrees; Preferably, the display module also includes a third display panel, and the third display panel includes a third substrate; in the first direction, the third substrate is arranged at an end of the first substrate away from the second substrate, and the third substrate is also provided with the inclined surface; the bonding surface of the first substrate and the inclined surface of the third substrate are arranged parallel to each other along the first direction.

10. A display device, characterized in that: Comprising a display module as described in any one of claims 1-9.

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