Cutting device and cutting method

Abstract

The invention discloses a cutting device and a cutting method. The cutting device comprises a cutter, an energy supply assembly and a liquid guide assembly. The cutter is used for cutting a workpiece to be machined, and the cutter is made of a light-transmitting material. The energy supply assembly is configured to be capable of emitting laser, the laser penetrates through the tool and irradiates a machining part at the cutting position of the tool, the liquid guide assembly is suitable for providing reaction liquid for the machining part, and the reaction liquid is configured to be used for reacting with the machining part under irradiation of the laser so that materials of the machining part can be modified. And therefore, the difficulty in machining of the material at the machining part is improved, and the cutter can remove the material at the machining part of the to-be-machined workpiece conveniently. Under the dual effects of an energy field provided by the energy supply assembly and physical and chemical reactions of the reaction liquid, the material property of the processing part is rapidly and accurately changed, and on the premise of ensuring the processing quality, the controllability of material modification is realized, and the modification efficiency of the material is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of cutting equipment, and in particular to a cutting device and a cutting method. Background Art

[0002] Traditional mechanical processing methods for materials include cutting (turning, milling) and grinding (grinding, polishing). In addition, non-traditional energy field processing methods can also be used: thermal energy processing (such as laser processing), electrical energy processing (such as electrical discharge machining), acoustic energy processing (such as ultrasonic processing), and chemical energy and electrochemical energy processing (such as chemical milling and electrochemical machining). These processing methods can be used to process most materials, but the processing efficiency for brittle and hard materials is extremely low, and the processing quality is very low, making it extremely difficult to meet the use requirements.

[0003] The manufacturing of optical parts is mainly divided into two categories, which are planes (rotationally symmetrical parts) and free-form surfaces (non-rotationally symmetrical parts) according to the final forming structure of the parts. The parts are divided into two categories according to their machinability, plastic easy-to-machining materials and hard and brittle difficult-to-machining materials. For plastic easy-to-machining (planes and free-form surfaces), the above-mentioned mechanical processing methods and energy field processing methods can be used to achieve it. However, for brittle and hard materials, the use of traditional mechanical processing methods will lead to high cutting forces, which will cause the workpiece to break during the cutting process (if the cutting force is reduced, it will lead to the inability to remove materials), and the cutting process will have high temperatures, fast tool wear, low material removal rate, low machining accuracy, poor surface finish and machining defects. The use of non-traditional energy field processing methods, on the one hand, cannot process brittle and hard materials into free-form surfaces, and on the other hand, even if it can be processed, the processing efficiency is low, the product quality is inconsistent, the heat-affected zone of the processing process is large, the energy consumption is high and the processing cost is high. At present, there is no better processing method to implement processing while ensuring processing efficiency, morphological accuracy, surface quality and sub-surface quality. In short, existing processing methods either cannot produce the product, or the product is of poor quality and cannot be used. Summary of the invention

[0004] The main purpose of the present invention is to provide a cutting device and a cutting method, aiming to solve the technical problem of how to ensure the processing quality of brittle and hard materials while improving the processing efficiency.

[0005] To achieve the above object, the present invention provides a cutting device, comprising: A tool for cutting a workpiece to be processed, wherein the tool is made of a light-transmitting material, a liquid flow channel is provided inside the tool, and the liquid flow channel is configured to guide the reaction liquid to the processing part, the tool includes a cutting edge for cutting the processing part, and an outlet of the liquid flow channel is provided at the cutting edge; An energy supply component, the energy supply component is configured to emit a laser, the laser passes through the tool and irradiates the processing part at the cutting position of the tool; a liquid guiding component, adapted to provide the reaction liquid to the processing part or the liquid flow channel, wherein the reaction liquid is configured to react with the processing part under the irradiation of the laser so as to modify the material of the processing part; A plurality of liquid flow channels are arranged inside the tool, and the laser penetrates into the tool and forms a light spot at the cutting edge, and the light spot at least covers an outlet of one of the liquid flow channels.

[0006] In some embodiments, the cutting device further comprises a reaction liquid, and the liquid guide assembly comprises a liquid storage portion, and the liquid storage portion is used to store the reaction liquid; The workpiece to be processed is a glass material, and the reaction liquid is an alkaline solution; or, The workpiece to be processed is a metal material, and the reaction liquid is an acidic solution.

[0007] In some embodiments, the reaction solution is a sodium hydroxide solution; or, The reaction liquid is a hydrogen peroxide solution; or, The reaction solution is a potassium hydroxide solution; or, The reaction solution is a sodium carbonate solution; or, The reaction liquid is a hydrofluoric acid solution.

[0008] In some embodiments, the tool comprises a cutting edge and a zoom curved surface, the zoom curved surface is located on a side of the tool away from the cutting edge, and the energy supply component is further configured to change the path of the laser in response to a change in a cutting point of the cutting edge; The zoom curved surface is configured so that the focus of the laser light is located at the cutting point of the cutting edge after the path of the laser light is switched.

[0009] In some embodiments, the energy supply component includes a laser generator and a galvanometer component, the laser generator is used to generate the laser, the galvanometer component is used to change the path of the laser, the laser has an output section and a reflection section, the output section is located between the laser generator and the galvanometer component, and the reflection section passes through the tool and irradiates the processing part.

[0010] In some embodiments, the galvanometer assembly includes a first reflector and a second reflector, the first reflector is configured to rotate around a first axis, the second reflector is configured to rotate around a second axis, the first axis intersects with the second axis, the exit segment is reflected by the first reflector and then reflected to the second reflector, and is reflected by the second reflector to form the reflection segment.

[0011] The second aspect of the present invention further provides a cutting method, which is suitable for controlling the cutting device described in any one of the above embodiments, and the cutting method comprises: Controlling the liquid guiding component to provide the reaction liquid so that the reaction liquid contacts the processing part; The energy supply component is controlled to apply the energy field to the processing part, so that the reaction liquid reacts with the material of the processing part.

[0012] Compared with the prior art, the present invention has the following beneficial effects: In the technical solution of the present invention, the cutting device includes a tool for cutting a workpiece to be processed, an energy supply component and a liquid guide component. The energy supply component is configured to emit a laser, the laser passes through the tool and irradiates the processing part at the cutting position of the tool, and the laser is configured to modify the material of the processing part. The liquid guide component is suitable for providing a reaction liquid to the processing part, and the reaction liquid is configured to react with the processing part under the irradiation of the laser of the energy supply component, so that the material of the processing part is modified, thereby reducing the difficult processing of the material of the processing part, so that the tool can remove the material from the processing part of the workpiece to be processed. Compared with the solution in the related art that reduces its brittleness by heating the workpiece, in the present application, in addition to modifying the processing part under the action of the laser, the reaction liquid can also react with the processing part under the condition of the energy field to further modify the material of the processing part. In other words, under the dual action of the laser provided by the energy supply component and the physical and chemical reaction of the reaction liquid, the material properties of the processing part are controllably, accurately and quickly changed, which improves the efficiency of material modification, thereby realizing the machinability of difficult-to-process materials, and effectively improving the processing efficiency while ensuring the processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0014] Figure 1 A schematic diagram of the structure of a tool in one embodiment of the present invention; Figure 2 is a schematic structural diagram of a tool from a first perspective in another embodiment of the present invention; Figure 3 is a structural schematic diagram of a tool from a second viewing angle in another embodiment of the present invention; Figure 4 In another embodiment of the present invention, a tool is Figure 3 An enlarged schematic diagram of the local A in the middle; Figure 5 It is a schematic diagram of the structure in which a tool is assembled on a tool carrier in one embodiment of the present invention; Figure 6 It is a schematic structural diagram of a tool from a third viewing angle in one embodiment of the present invention; Figure 7 The tool edge of an embodiment of the present invention Figure 6 An enlarged schematic diagram of the cutting edge after sectioning in the middle BB direction; wherein a liquid flow channel is provided in the tool for the reaction liquid to flow to the workpiece; Figure 8 It is a working principle diagram of the cutting device in the first embodiment of the present invention; wherein the cutting device includes a galvanometer assembly; Fig. 9 This is a working principle diagram of the cutting device in the second embodiment of the present invention; wherein the reaction liquid can flow to the workpiece through the liquid flow channel provided in the tool; Fig.10 It is a working principle diagram of the cutting device in the third embodiment of the present invention; wherein the laser adjustment device includes a refraction part; Fig.11 It is a working principle diagram of the cutting device in the fourth embodiment of the present invention; wherein the laser adjustment device includes a reflecting part; Fig.12 It is a working principle diagram of the cutting device in the fifth embodiment of the present invention; wherein the galvanometer assembly includes a first reflector; Fig.13 It is a working principle diagram of the cutting device in the sixth embodiment of the present invention; wherein the galvanometer assembly includes a first reflector and a second reflector; Fig.14 A schematic diagram of a cutting method according to an embodiment of the present invention; Fig.15 It is the surface topography of the workpiece to be processed before processing; Fig.16 A surface topography image of a workpiece after being processed by a cutting device; Fig.17 This is the first actual picture of the workpiece to be processed using the cutting device; Fig.18This is a second actual picture of using the cutting device to process the workpiece; wherein, for ease of observation, the laser generator is turned off.

[0015] Description of Figure Numbers: Cutting device 100; Tool 110; Cutting edge 111; zoom curved surface 112; first end 113; second end 114; liquid flow channel 115; Energy supply component 120; Laser generator 121; laser regulator 122; reflecting part 1221; refracting part 1222; laser 123; light spot 1231; emission section 1232; reflecting section 1233; galvanometer assembly 124; first reflecting mirror 1241; second reflecting mirror 1242; Tool carrier 130; Liquid guiding component 140; liquid storage part 141; Reaction solution 150; A workpiece to be processed 200; The first direction X.

[0016] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] In the manufacturing process of non-planar optical parts, since the non-planar parts have irregular shapes and small sizes, fast tool servo systems are usually used to process such parts. After processing workpieces with excellent material properties, formability and cutting properties, the traditional fast tool servo system can obtain parts whose surface morphology and surface accuracy meet the product use requirements. However, it is difficult for traditional fast tool servo systems to process materials with high hardness, high brittleness and low fracture toughness. Brittle and hard materials mainly refer to brittle materials such as aerospace hard metals, optical glass, silicon carbide, diamond chip substrates, etc. These materials have poor formability and cutting properties, and will break irregularly during the cutting process. Material removal is discontinuous, making it difficult to control product quality and the cutting efficiency is very low.

[0019] In other words, brittle and hard materials have low elasticity and plasticity or even almost no elasticity and plasticity. These characteristics result in almost no plastic deformation or elastic deformation when a certain external force is applied to these materials. Therefore, when the external force reaches a certain level, the force-bearing part of the parts made of this material will suddenly collapse, and there is no obvious plastic deformation when it collapses. The existence of these characteristics causes irregular and uncontrollable collapse of the workpiece during the cutting process, resulting in discontinuous material removal, endangering the surface quality and sub-surface quality, and ultimately making it difficult for the surface morphology and surface accuracy of the processed parts to meet the product use requirements, and the product quality is difficult to control.

[0020] The applicant has discovered that when a laser beam is irradiated onto the surface of a brittle hard material, its energy will be absorbed and converted into heat energy, causing the surface of the material to heat up rapidly. As the temperature rises, the moisture and gas on the surface of the material evaporate, forming a layer of "vapor film". This vapor film can effectively prevent heat conduction, making it impossible for the heat inside the material to diffuse to the surface, thereby forming a high temperature inside the material. At high temperatures, the strength and hardness of brittle hard materials decrease, making them easier to cut. In other words, under the thermal effect of the laser, the thermal motion of the atoms or molecules of the irradiated material is enhanced, thereby changing the brittle hardness of the material and making it easier to remove. However, in the process of heating the workpiece to modify its material, the following defects exist: 1. The high temperature resistance of the processed material and the tool is different, and laser assistance cannot be used. Specifically, the high temperature resistance of some materials may be as high as 2000 degrees Celsius. The high temperature resistance of diamond tools is usually only about 600 degrees Celsius. In order to avoid the temperature damage of the diamond tool by the laser, the radiation temperature of the laser is usually controlled to be lower than the high temperature resistance index of the diamond tool, but at this temperature, the cutting performance of the material changes very little or may not change. If the radiation temperature of the laser is controlled at 2000 degrees Celsius, it is easy for the cutting performance of the material to change before the turning tool has melted or oxidized. Therefore, laser-assisted processing can only be carried out within the temperature range allowed by the tool, usually below 600 degrees Celsius. However, when processing optical materials, the most important indicator of optical materials is the heat resistance index. Taking optical glass as an example, the material modification temperature of optical glass is about 1500 degrees Celsius. Therefore, the cutting process of the workpiece cannot be assisted by laser in the conventional scheme.

[0021] 2. Even if cutting can be achieved with the assistance of laser, the tool wears and oxidizes very quickly under high temperatures, and the material and manufacturing costs of the tool are very high, which leads to low economic efficiency.

[0022] 3. The use of laser irradiation to modify materials may cause problems with the heat-affected zone (HAZ) of the material, resulting in degradation of the performance of the processed material: some materials may undergo microstructural changes (such as grain coarsening and phase change) at high temperatures, resulting in performance degradation.

[0023] The presence of heat-affected zones may cause microcracks or thermal cracks in the workpiece: the uneven thermal expansion and contraction of various parts of the workpiece may cause thermal stress and lead to crack formation, especially for materials with a large thermal expansion coefficient, which are very prone to microcracks or thermal cracks.

[0024] 4. Side reactions such as oxidation and chemical reactions lead to very unsatisfactory processing quality. During laser processing, if the material is exposed to air, high temperature will cause surface oxidation or other chemical reactions, which may have an adverse effect on the processing quality of the workpiece. For example, the oxide layer may reduce the performance of the product or introduce surface defects. For some sensitive materials (such as silicon carbide), secondary phases may form on the surface, affecting the quality of the processed surface.

[0025] Although there are laser and liquid-assisted processing methods in related technologies, namely water-guided laser processing, liquid laser ablation, laser-induced back wet etching, and etching-assisted laser modification processing, the above laser-compounded liquid methods mainly rely on the thermal effect of the laser and the impact force of the liquid; or the processing technology that combines laser-induced material modification with chemical corrosion selective removal, the material removal amount is at the nanometer level, that is, the material removal amount is extremely low, and the processing efficiency is very low.

[0026] Specifically, the relevant technology usually involves immersing the workpiece in a composite liquid and then using laser ablation to remove the material. However, this will cause the part of the workpiece immersed in the composite liquid to be affected, making it difficult to effectively process the specified position of the workpiece, and the quality of the processed product is low.

[0027] However, when the composite liquid is poured onto the surface of the workpiece, a layer of liquid film will be formed on the surface of the workpiece after the liquid covers the surface of the workpiece. This layer of liquid film will block the contact between the laser and the surface of the workpiece, causing the laser to fail. Even the laser will have irregular refraction and reflection when passing through the dynamic liquid film, and it cannot be accurately focused on the actual required processing surface, resulting in laser scattering and defocusing, and ultimately causing the processing process to lose the effect of laser modification. In particular, when the workpiece is rotating, the composite liquid can form a dynamic, irregular liquid film to cover the surface of the workpiece, completely blocking the laser. In order to overcome the influence of the liquid film on the laser, the related technology uses a water-guided laser to process the workpiece, that is, the liquid wraps the laser and shoots it synchronously to the surface of the workpiece. The laser modifies the workpiece material, and the liquid on the outer peripheral side of the laser provides impact force, thereby achieving material removal. Although this reduces the influence of the liquid on the laser, the processing efficiency is low, and it can only be used to cut the workpiece but cannot process the surface shape of the workpiece.

[0028] For this reason, please see Figures 1 to 11 The present invention provides a cutting device 100, which includes a tool 110, an energy supply component 120 and a liquid guide component 140. The tool 110 is used to perform cutting processing on a workpiece 200 to be processed, and specifically, the material is removed by contacting and moving the cutting edge 111 with the surface of the workpiece 200 to be processed. It should be noted that the movement of the cutting edge 111 relative to the surface of the workpiece 200 to be processed can be the movement of the tool 110 relative to the workpiece 200 to be processed, or the movement of the workpiece 200 to be processed relative to the tool 110, or the movement of the tool 110 and the workpiece 200 to be processed. The movement mode of the tool 110 includes but is not limited to movement. The energy supply component 120 is used to provide an energy field so that at least the processing part of the workpiece 200 to be processed can be located in the energy field, wherein the energy field is configured to modify the material of the processing part. It should be noted that the energy field includes but is not limited to light field (laser field), electric field, magnetic field, ion field, radiation field, electromagnetic wave energy field and mechanical wave energy field, etc. For the convenience of description, the laser field is used as an example for description below. The liquid guide component 140 is responsible for guiding the reaction liquid 150 to the processing part. Under the condition of the energy field provided by the energy supply component 120, the reaction liquid 150 can react chemically or physically with the processing part, thereby changing the material properties of the processing part and improving its brittleness to facilitate cutting. It should be noted that the degree of reaction of the reaction liquid 150 with the workpiece 200 to be processed under normal conditions is less than the degree of reaction of the reaction liquid 150 with the workpiece 200 to be processed under the condition of the energy field of the energy supply component 120. It can be considered that "the reaction liquid 150 reacts with the processing part under the condition of the energy field".

[0029] Compared with the related art of using laser to irradiate the workpiece to modify the material for easy cutting, the energy field in the present application can modify the material, and the reaction liquid 150 can react with the material of the processing part under the condition of the energy field, so that the microstructure, intermolecular bond energy, lattice structure, physical properties, etc. of the material of the workpiece 200 to be processed are modified under the joint action of the energy field and the reaction liquid 150, so that the cutting performance of hard and brittle materials is improved, the material modification efficiency is higher, and the degree of material modification is also better. At this time, the tool 110 can easily remove material from the workpiece 200 to be processed, thereby improving the processing efficiency while ensuring the product processing quality, and reducing the wear of the tool 110.

[0030] The heating-assisted material modification or laser material modification used in the related art can easily cause the material to be instantly overburned, liquefied or vaporized, and damaged due to the difficulty in controlling local heating and the high density of laser energy, and the degree of material modification cannot be accurately controlled. In the present application, the energy field and the reaction liquid 150 are used to modify the material, which can improve the controllability of the material modification of the processing part, and the control of the modified area of ​​the workpiece 200 to be processed is more accurate, and the efficiency of material modification is higher and the degree of material modification is better.

[0031] In addition, under the combined action of the energy field and the reaction liquid 150, the material of the tool 110 can be made of a material with a lower hardness, thereby reducing the cost of the tool 110. Therefore, the tool 110 in the present application can be made of a transparent material such as single crystal silicon carbide that can transmit a laser of a specific wavelength, thereby greatly reducing the cost of the tool 110 and further reducing the processing cost. In order to remove materials with a higher hardness, the related art usually uses extremely expensive materials such as diamond and sapphire with a very high hardness to make turning tools.

[0032] It should be noted that the reaction liquid 150 in the present application is different from the coolant in the workpiece turning process in the related art. The coolant in the related art mainly plays the role of cooling and lubricating during the workpiece processing, while the reaction liquid 150 in the present application can modify the material of the processing part. In addition, in some embodiments, the formula of the reaction liquid 150 can be adjusted so that the reaction liquid 150 has the functions of cooling, lubricating and slag removal.

[0033] The cutting device 100 further comprises a tool carrier 130 for carrying the tool 110 so that the tool 110 can be installed on the cutting device 100 , that is, in a specific embodiment, the tool 110 is located at the tip of the tool carrier 130 , which can directly contact and cut the workpiece.

[0034] For ease of description, the following is an example of the energy supply component 120 being used to provide a laser field (laser 123). In some embodiments, the energy supply component 120 can irradiate the workpiece 200 to be processed with laser 123, so that when the tool 110 cuts the processing part, the laser 123 can just cover the position to be processed, and at the same time, the material to be processed is modified under the joint action of the reaction liquid 150 and the laser 123, and the material is removed by the cutting movement of the tool 110. The power of the laser 123 and the size of the spot 1231 formed by the laser 123 at the processed position determine the degree of material modification. At the same time, the nature and concentration of the reaction liquid 150 also determine the degree of material modification. Taking end face cutting as an example, the length A of the cutting edge used for cutting (the cutting edge is defined as the part of the cutting edge 111 actually used for cutting) satisfies the cutting depth B and the arc radius C of the tool 110: A is proportional to B×C. That is, the greater the cutting depth B of the tool 110 and the arc radius C of the tool 110, the greater the cutting edge length A.

[0035] In other words, after ensuring that the diameter of the spot 1231 formed by the laser 123 on the surface of the workpiece can completely cover the actual cutting position (or the spot 1231 covers the length of the cutting edge), the greater the power of the laser 123, the higher the material modification efficiency. Take the processing material as quartz glass, the laser 123 as an infrared laser, and the chemical liquid as a sodium hydroxide solution as an example. When the cutting depth B is 0.5 mm, for the tool 110 with an arc radius C of 0.5 mm. The radius of the spot 1231 of the laser 123 is configured to be 200 microns, and the power of the laser 123 is configured to be 2-40W, which can effectively react with the workpiece material. When the power of the laser 123 is less than 2W, the material modification effect is not obvious, or even basically does not react with the workpiece material.

[0036] Therefore, in the process of adjusting and positioning the laser 123, the power of the laser 123 irradiated on the processing part can be configured to be less than 2W, so that the laser 123 does not react with the workpiece, avoiding affecting the subsequent processing accuracy, thereby ensuring the cutting quality and cutting efficiency of the workpiece, and at the same time improving the safety of the processing process of the workpiece 200 to be processed. It should be noted that when the power of the laser 123 is greater than 40W, the effect of the reaction between the laser 123 and the material of the workpiece will be reduced. Therefore, the power of the laser 123 is configured in the range of 2-40W, which can ensure that the greater the power of the laser 123, the higher the modification efficiency and the better the cutting effect.

[0037] For ease of description, the following is an example of the energy supply component 120 being used to provide thermal energy. In some embodiments, the energy supply component 120 can heat the workpiece to be processed so that when the tool 110 cuts the processing part, the temperature range of the processing part is between 40 and 600°C. Within this range, the degree of reaction between the reaction liquid 150 and the processing part is conducive to the cutting process of the tool 110. In other embodiments, the reaction liquid 150 can be configured to not react with the processing part when the temperature of the processing part is less than 40, so as to avoid affecting the processing accuracy, thereby ensuring the cutting quality and cutting efficiency while improving the safety of the processing process of the workpiece 200 to be processed. It should be noted that the tool 110 can be made of a material that does not react with the reaction liquid 150, or the tool 110 is made of a material that reacts with the reaction liquid 150 to a much lower degree than the reaction between the reaction liquid 150 and the workpiece, or the temperature at which the material used by the tool 110 reacts with the reaction liquid 150 is higher than the temperature range of 40 to 600°C, thereby ensuring the service life of the tool 110.

[0038] The tool 110 can be made of cemented carbide, has good wear resistance and hardness, and also has high thermal conductivity, which is suitable for high-precision cutting tasks. In some embodiments, the energy supply component 120 can be in the form of a resistance heating wire or a ceramic heating plate, directly installed near the tool 110 or integrated inside the tool 110 to ensure that heat can be effectively transferred to the processing part. In other embodiments, the energy supply component 120 is configured to emit a laser 123, and the laser 123 can be irradiated on the processing part, thereby heating the processing part. In some embodiments, the energy supply component 120 can also be designed to surround the tool 110 so that the entire processing area can be evenly heated. At the same time, in order to improve the utilization rate and effect of the reaction liquid 150, a liquid guide component 140 in the form of a nozzle can be set above the processing part, which can not only ensure that the reaction liquid 150 accurately reaches the target position, but also control the flow rate and enhance the reaction efficiency. The liquid guide component 140 may include a pump and a pipeline, etc. The pump extracts the reaction liquid 150 from the liquid storage container and accurately delivers it to the processing part through the pipeline.

[0039] Similarly, depending on the energy field, electric fields, magnetic fields, or high-energy radiation fields such as ions or radiation can be arranged to provide energy field conditions for the processed area, greatly stimulating the joint modification effect of the energy field and chemical liquid.

[0040] In order to further understand the relationship between material modification and removal intensity and laser properties, cutting parameters, reaction fluid properties and workpiece material properties, the following relationship is established: 1. Regarding the strength of material modification:

[0041] 2. Regarding material removal strength:

[0042] Wherein, the reaction liquid 150 includes a modified substance and a base liquid; is the wavelength factor of the laser 123, and its value range is: [0, 10]; t is the time factor of the laser 123 irradiating the workpiece surface, and its value range is: [0, 8]; P is the power factor of the laser 123, and its value range is: [0, 78]; v is the cutting speed factor, and its value range is: [0, 5000]; A is the tool cutting depth factor, and its value range is: [0, 200]; f is the tool cutting feed speed factor, and its value range is: [0, 200]; q is the property factor of the modified substance, and its value range is: [0, 10], and the properties of the modified substance include but are not limited to the composition of the modified substance and the particle size of the modified substance; w is the concentration factor of the reaction solution 150, and its value range is: [0, 100]; is the material property factor of the workpiece to be processed, and its value range is: (0, 10]. The larger the value of these factors is within a certain range, the better the material removal intensity of the workpiece is. d is the diameter factor of the spot 1231 formed by the laser 123 on the surface of the workpiece, and its value range is: (0, 5000]; l is the length factor of the cutting edge, and its value range is: (0, 500], that is, the length of the part of the cutting edge actually used to cut the workpiece; is the property factor of the base liquid, and its value range is: (0, 10]. The lower the diameter of the spot 1231, the length of the cutting edge and the base liquid factor of the reaction liquid 150, the better the material removal strength of the workpiece. α is the regulating factor, which controls the influence of the modified strength on the material itself and the material removal rate, and its value range is: (0, 100].

[0043] It should be noted that the material of the workpiece 200 to be processed includes but is not limited to inorganic glass, organic glass, amorphous semiconductor glass, etc. In some embodiments, the material of the workpiece 200 to be processed may also be a metal material, etc.

[0044] In some embodiments, the cutting device 100 also includes a reaction liquid 150, wherein the liquid guide component 140 includes a liquid storage portion 141 for storing the reaction liquid 150. This design makes the cutting device 100 a complete system, which not only has the ability to perform cutting operations, but also integrates the supply function of the reaction liquid 150, so that the operator can select the appropriate type of reaction liquid 150 according to different processing requirements, and ensure that the reaction liquid 150 can be supplied to the processing part in time when needed. In some embodiments, the liquid storage portion 141 can be a sealed tank with a built-in stirring device for keeping the components of the reaction liquid 150 evenly distributed. In addition, the liquid storage portion 141 can also be equipped with a liquid level sensor to monitor the remaining amount in real time and remind the user to replenish it when necessary. In some embodiments, the liquid storage portion 141 can also take insulation measures or add an anti-corrosion coating to extend the shelf life of the reaction liquid 150, so that the reaction liquid 150 can be suitable for scenes that are easily volatile or sensitive to changes in the external environment.

[0045] It should be noted that the liquid guide assembly 140 also includes a liquid guide tube, which is connected to the liquid inlet of the liquid storage part 141 so that the reaction liquid 150 can be added to the liquid storage part 141. The outlet of the liquid guide tube connected to the liquid storage part 141 can be used to guide the reaction liquid 150 inside the liquid storage part 141. The liquid guide tube and the liquid storage part 141 are made of a composite material of polytetrafluoroethylene and metal. In some embodiments, the interior of the liquid guide tube and the interior of the liquid storage part 141 are made of polytetrafluoroethylene material, and the outer wall of the liquid guide tube and the outer wall of the liquid storage part 141 are made of metal material.

[0046] In some embodiments, considering that different types of workpieces 200 to be processed may require the use of multiple different reaction liquids 150, a plurality of independent liquid storage sections 141 may be provided on the cutting device 100, and each liquid storage section 141 is equipped with its own liquid guide channel and control valve. In this way, the type of reaction liquid 150 used can be flexibly switched according to actual needs, without the need to frequently replace the external container, thereby improving work efficiency while also reducing the risk of contamination. In addition, in order to further simplify the operating process, an automatic proportioning system may be introduced to allow the user to set a specific ratio to mix two or more reaction liquids 150 to adapt to more complex processing conditions.

[0047] In some embodiments, when the workpiece 200 to be processed is a glass material, the reaction liquid 150 used may be an alkaline solution or hydrofluoric acid (HF). Specifically, in the process of processing glass products, sodium hydroxide (NaOH) or a similar strong base is used as the reaction liquid 150, which reacts chemically after contacting the glass surface, thereby reducing the brittleness of the material of the workpiece 200 to be processed, thereby facilitating the cutting process of the workpiece 200 by the tool 110.

[0048] Because glass is relatively stable and not susceptible to attack by common chemicals, using alkaline solutions at specific concentrations and temperatures can achieve local modifications without affecting the overall integrity. For example, this method can help create a smoother, more transparent and scratch-resistant surface when manufacturing certain types of optical lenses.

[0049] In addition, for different types of glass materials (such as soda-lime glass, borosilicate glass, etc.), alkaline solutions with different composition ratios can be selected to optimize the reaction effect. At the same time, in order to ensure safety and prevent excessive corrosion, a pH value monitoring system can also be introduced to adjust the strength of the reaction solution 150 in real time.

[0050] In other embodiments, if the workpiece 200 to be processed is a metal material, an acidic solution can be selected as the reaction liquid 150. For example, when the workpiece 200 to be processed is an iron-based alloy material, the reaction liquid 150 can be dilute sulfuric acid (H2SO4) or hydrochloric acid (HCl), which can react with the metal surface oxide layer under appropriate conditions to remove impurities and improve the surface quality. In some embodiments, in order to prevent the reaction liquid 150 from affecting the material of the machine tool, a protective cover can be set during the process of using the reaction liquid 150 to modify the workpiece, so that the machine tool is isolated from the reaction liquid 150 to prevent the reaction liquid 150 from contacting the machine tool.

[0051] In some embodiments, the reaction solution 150 may be sodium hydroxide solution, hydrogen peroxide solution, potassium hydroxide solution, sodium carbonate solution, hydrofluoric acid solution, etc. These solutions have good chemical activity and can be applied to different application scenarios and technical requirements, ensuring applicability.

[0052] Sodium hydroxide solution: It is suitable for surface modification of glass materials and silicon-containing materials. Under the laser irradiation condition of the energy supply component 120, the glass materials can be modified quickly to facilitate cutting by the tool 110. In addition, for other wetted parts of the workpiece 200 to be processed that are not covered by the energy field provided by the energy supply component 120, the solution can also effectively improve the physical and chemical properties of the glass surface.

[0053] Hydrogen peroxide solution: As a mild but highly effective oxidant, hydrogen peroxide can be used for cleaning and passivation of metal surfaces. It removes pollutants on the surface of the workpiece 200 to be processed by oxidation, which is conducive to the energy of the energy supply component 120 acting on the surface of the workpiece. At the same time, after the energy of the energy supply component 120 acts on the hydrogen peroxide solution, the material of the processing part is modified, which facilitates the cutting of the tool 110. For other areas outside the processing part of the workpiece 200 to be processed, a dense protective film can be formed on its surface under the action of the hydrogen peroxide solution to enhance the corrosion resistance. It is particularly suitable for products with high requirements for subsequent coating, such as automotive parts, household appliance housings, etc.

[0054] Potassium hydroxide solution: Similar to sodium hydroxide, potassium hydroxide is also a strong base, but it has a higher solubility. When processing thicker or more complex glass parts, potassium hydroxide solution can provide better permeability and reaction rate, thereby further improving processing efficiency. In addition, potassium hydroxide solution is also applicable to some metals, such as aluminum and its alloys.

[0055] In some embodiments, the mixed reaction liquid 150 can also be customized according to the specific conditions of different types of workpieces. For example, a certain proportion of hydrogen peroxide is mixed with an alkaline substance (such as sodium hydroxide or potassium hydroxide), which can not only maintain a strong oxidizing ability, but also adjust the pH value to a suitable range, thereby expanding the scope of application and improving the processing efficiency. In addition, considering the requirements of environmental protection, the reaction liquid 150 can be a combination of a biodegradable surfactant and a weak alkaline substance, which not only ensures a good processing effect, but also reduces the impact on the environment.

[0056] For example, when the workpiece 200 to be processed is fused silica glass, the reaction liquid 150 may be a sodium hydroxide solution. When the workpiece 200 to be processed is a zinc sulfide material, the reaction liquid 150 may be a hydrogen peroxide solution. When the workpiece 200 to be processed is a silicon semiconductor material, the reaction liquid 150 may be a potassium hydroxide solution.

[0057] In some embodiments, the energy supply component 120 is configured to emit a laser 123, which directly irradiates the processing part of the workpiece 200 to be processed. The characteristic of the laser 123 for material modification is that its highly concentrated energy can transfer energy to the processing part in a very short time. Under the irradiation condition of the laser 123, the reaction liquid 150 can react with the processing part without affecting the material properties of the parts of the workpiece 200 to be processed other than the processing part.

[0058] In some embodiments, the energy supply component 120 includes a laser generator 121 for emitting a laser 123, and the laser generator 121 can be a CO2 laser, a fiber laser, or a Nd:YAG (neodymium-doped yttrium aluminum garnet) laser. These lasers have different wavelengths and power ranges, and the wavelength and emission time can be selected according to the absorption characteristics of the processed material. For example, when processing metal materials, a solid laser with a shorter wavelength and higher power can be selected; when processing non-metallic materials such as glass, a laser with a longer wavelength but moderate power can be selected.

[0059] In order to ensure that the laser 123 acts accurately on the processing part, a fine-tuning platform can be installed near the tool 110 to allow the operator to manually adjust the position and angle of the laser beam. In addition, an automatic focusing system can be equipped to detect the distance change of the processing surface using a sensor and provide real-time feedback to the control system to keep the focus of the laser 123 always in the best position (the focus of the laser 123 can move with the change of the actual processing part of the workpiece 200 to be processed). This can not only improve the processing accuracy, but also effectively avoid product quality problems caused by focus offset.

[0060] In some embodiments, in addition to the basic static laser 123 irradiation, a dynamic adjustment mechanism can be introduced, that is, the laser 123 parameters such as power, frequency, pulse width, etc. can be dynamically adjusted according to the actual situation during the processing. For example, when it is detected that the surface of the workpiece 200 to be processed is uneven or the temperature fluctuates greatly, the local irradiation effect can be enhanced by increasing the pulse frequency; on the contrary, if it is found that some areas have reached the ideal modification state, the power can be appropriately reduced to reduce unnecessary energy consumption, so as to further optimize the processing quality and efficiency.

[0061] In addition, considering the different absorption rates of laser 123 by different materials, in some embodiments, multiple types of laser sources can be integrated on the same device, and different processing requirements can be met by switching different laser 123 modes. For example, a low-power continuous wave laser 123 is used for preheating treatment first, and then a high-power pulsed laser 123 is switched to complete the final modification process. This combination ensures process flexibility and improves overall performance.

[0062] In some embodiments, the material of the tool 110 is a light-transmitting material, and the energy supply component 120 is configured to emit a laser 123, and the laser 123 is configured to be able to penetrate the tool 110 and irradiate the processing part, thereby irradiating the processing part, and at the same time, the reaction liquid 150 reacts with the material of the processing part, so that the material of the processing part is quickly modified, so that the tool 110 can cut it. The energy supply component 120 directly uses the laser 123 to modify the material of the processing part without setting up a complex optical transmission path, which simplifies the device structure and improves work efficiency.

[0063] In addition, in the solution of the present application, when the tool 110 is close to the workpiece and cuts the processing part, please refer to Figure 8, the tool 110 can cut off the liquid film formed by the reaction liquid 150 on the surface of the workpiece, so that the laser 123 can penetrate from the cutting edge 111 of the tool 110 and act on the processing part, thereby modifying the material of the processing part, so that the tool 110 can perform cutting processing. Under the action of the liquid guide component 140, the reaction liquid 150 can be continuously provided to the workpiece, so that the reaction liquid 150 still exists near the contact position of the cutting edge 111 of the tool 110 on the workpiece 200 to be processed. These reaction liquids 150 react with the material of the processing part under the radiation of the energy of the laser 123, thereby further improving the degree of material modification of the processing part, and then improving the material removal efficiency of the tool 110 on the workpiece. That is, the solution of the present application overcomes the technical barrier in the related art that the laser cannot act on the workpiece due to the obstruction of the liquid film, and the solution of the present application is more accurate and efficient in modifying the modified area of ​​the workpiece material, which can well ensure the quality of the material processed surface.

[0064] See also Figure 7 and Fig. 9 In some embodiments, a liquid flow channel 115 is provided inside the tool 110, and the outlet of the liquid flow channel 115 is located in the cutting edge 111 (it should be noted that if the outlet of the liquid flow channel 115 is located within a certain range near the cutting edge 111, and the reaction liquid 150 can act on the processing part through the outlet, it can be considered that the outlet of the liquid flow channel 115 is located in the cutting edge 111), and the liquid guide component 140 can guide the reaction liquid 150 to the liquid flow channel 115, so that the reaction liquid 150 can accurately act on the processing part of the workpiece 200 to be processed, further improving the cutting quality of the cutting device. The number and diameter of the liquid flow channel 115 can be set according to the cutting requirements, and the inlet position of the liquid flow channel 115 can be set at a position convenient for processing according to the requirements.

[0065] Specifically, see Figure 7, the laser 123 is injected into the tool 110 and forms a light spot 1231 at the cutting edge 111. A plurality of liquid flow channels 115 are arranged inside the tool 110. In the process that the position of the light spot 1231 at the cutting edge 111 changes with the change of the actual cutting position of the cutting edge 111, the light spot 1231 has at least one outlet of the liquid flow channel 115 within the coverage range of the cutting edge 111. For the convenience of description, the plane where the light spot 1231 is located is defined as the projection plane. Two adjacent liquid flow channels 115 form a first projection and a second projection on the projection plane. The third projection formed by the light spot 1231 on the projection plane covers the first projection and the second projection. The projection formed by the outlets of other liquid flow channels 115 other than the aforementioned two adjacent liquid flow channels 115 on the projection plane is defined as the fourth projection, and the fourth projection is located outside the range of the third projection. In this way, it is ensured that the area irradiated by the light spot 1231 can always have the outlet of the liquid flow channel 115, thereby ensuring that the reaction liquid 150 can contact the processing part and also ensuring that the laser 123 can effectively act on the processing part.

[0066] In some embodiments, a plurality of liquid flow channels 115 are evenly distributed in the tool 110, and during the process of the tool 110 cutting the workpiece 200 to be processed, each liquid flow channel 115 can simultaneously pass the reaction liquid 150. Alternatively, each liquid flow channel 115 can independently control whether the reaction liquid 150 is passed into the interior thereof through the liquid guide assembly 140. In other words, the liquid flow channel 115 at the actual cutting position closest to the cutting edge 111 among the liquid flow channels 115 can provide the reaction liquid 150 to the processing part, and the other liquid flow channels 115 temporarily stop passing the reaction liquid 150. Therefore, during the process of the light spot 1231 moving along the trajectory of the cutting edge 111 as the actual cutting position of the cutting edge 111 changes, the outlet of the liquid flow channel 115 can always exist within the range of the light spot 1231, so that the laser 123 and the reaction liquid 150 can act on the processing part together.

[0067] Compared with the solution of the tool without liquid flow channel in the related art, the liquid flow channel 115 is set inside the tool 110 in the present application to generate local high pressure in the cutting area, and the effect of the reaction liquid 150 is better and more stable. It can better make the photo-chemical-mechanical action act synchronously on the removed material (area). It is equivalent to modifying the removed material (area) while removing the material. Compared with the pre-modification of the area to be processed in the related art, for example, when the area to be processed is modified by laser assistance, it may overheat and burn the processed surface, and the scope of chemical corrosion may exceed the thickness of the removed material, causing damage to the processed surface. In other words, the pretreatment of the workpiece material modification in the related art, or the energy field assisted processing may lead to the instability of the modified layer, such as incomplete removal, or the modified layer affects the surface after processing. The solution of the present application acts on the removed material synchronously through the photo-chemical-mechanical action, which can keep the modification process from damaging the processed surface, and the modified layer is accurately removed by the tool 110.

[0068] It should be noted that the processing method (such as milling and grinding) in which the tool (the part used for milling and grinding) in the related art rotates makes it difficult to achieve the synchronous action of laser, chemical modification and mechanical processing, and can only be modified in advance and then removed. In addition, it is difficult for the part of the tool used for milling and grinding in the related art to achieve the follow-up of the laser focus, and it is even more impossible to realize the design of setting a liquid flow channel. For example, the part of the milling cutter actually used for milling has multiple blades, each blade is arranged in a spiral shape, and there is a chip removal space between adjacent blades, which makes it impossible to design other additional structures at each blade, such as a liquid flow channel.

[0069] In one embodiment, the material used for the tool 110 can be a transparent material relative to a laser of a specific wavelength. In another embodiment, the material used for the tool 110 can also be other light-transmitting materials with color. In some embodiments, the tool 110 can be made of a super-hard alloy material with light-transmitting properties. In other embodiments, the tool 110 can also be made of a crystal material with light-transmitting properties, and the crystal material can be crystal, or diamond, etc.

[0070] In some embodiments, the cutter 110 may use transparent ceramic as a substrate, so that the cutter 110 not only has good mechanical strength and wear resistance, but also has excellent optical transmittance, and can effectively transmit the light emitted from the laser generator 121. In order to further ensure that the laser 123 can smoothly reach the processing part, in some embodiments, the cutter 110 can use a transparent ceramic material suitable for the penetration of the laser 123 of a specific wavelength, including but not limited to aluminum oxide (Al2O3), silicon nitride (Si3N4), etc., so that the cutter 110 has good transmittance in the visible light and near-infrared regions. The shape of the cutter 110 can adopt a conical or wedge-shaped structure, so that the laser 123 can propagate to the cutting edge 111 along a predetermined path after entering the cutter 110. At the same time, a reflective surface or a light-guiding fiber can be provided inside the cutter 110 to help guide the laser 123 to the specified position.

[0071] In some embodiments, in order to avoid local high temperature of the tool 110 caused by the irradiation of the laser 123, an effective heat dissipation method can be adopted to prevent the tool 110 from overheating and deforming. A cooling channel can be arranged inside the tool 110, and a coolant can be passed through to remove excess heat; or a heat insulation coating can be applied to the outer surface to reduce the conduction of heat to other parts.

[0072] In other embodiments, a special coating, such as an anti-reflection film or an anti-reflection film, may be added to the surface of the tool 110 to improve the transmission efficiency of the laser 123 and reduce energy loss. At the same time, according to different types of reaction liquids 150 and their chemical properties, an anti-corrosion or anti-oxidation coating may be selectively applied to protect the tool 110 from erosion and extend its service life.

[0073] See also Figures 1 to 4 In some embodiments, the tool 110 includes not only a cutting edge 111 for cutting, but also a zoom surface 112, which is located on the side of the tool 110 away from the cutting edge 111. The energy supply component 120 is also configured to change the path of the laser 123 in response to the change of the cutting point of the cutting edge 111, and the zoom surface 112 is configured to make the focus of the laser 123 located at the cutting point of the cutting edge 111 after the path of the laser 123 is switched. That is, no matter how the cutting point of the cutting edge 111 on the workpiece 200 to be processed changes, under the action of the zoom surface 112, it can always ensure that the focus of the laser 123 is located at the current cutting point. This design enables the laser 123 to accurately act on the processing part that needs to be modified during the processing, no matter how the position of the cutting edge 111 changes, thereby improving the processing accuracy and efficiency.

[0074] In some embodiments, the zoom curved surface 112 may be located on a side of the tool 110 away from the cutting edge 111. In other embodiments, the zoom curved surface 112 may also be disposed on any side of the tool 110 adjacent to the cutting edge 111.

[0075] The zoom surface 112 refers to a specially designed curved lens structure that can focus light on a point, but the position of this point can be changed. By changing the shape and position of the curved surface, the position of the focus point can be changed, thereby achieving the effect of a zoom lens. That is, the zoom surface 112 can focus the transmitted laser 123, so that the focus of the laser 123 passing through the zoom surface 112 can be located at the cutting point of the cutting edge 111.

[0076] It should be noted that the cutting point will change as the shape of the workpiece being processed changes. Specifically, since the processing surface of the workpiece is not always in a plane or a curved surface, it may be a stepped, tortuous, or uneven surface. During the processing of the tool 110, the contact position between the cutting edge 111 and the workpiece surface will change as the characteristics of the workpiece surface change, so the position where the cutting edge 111 actually plays a cutting role (i.e., the cutting point) changes.

[0077] In addition, considering that long-term use may cause wear or aging of the zoom surface 112, a wear-resistant and light-transmitting protective film can be coated on its surface, which will not affect the laser 123 transmission performance and extend the service life. For some application scenarios with high precision requirements, it is also possible to consider using an adaptive optical system to automatically compensate for slight deviations caused by environmental factors (such as temperature and humidity changes) to ensure that the ideal laser 123 focusing effect can be obtained every time.

[0078] In some embodiments, the liquid guide component 140 is configured to spray the reaction liquid 150 to the processing part, and the position of the liquid guide component 140 relative to the workpiece is configured to change with the change of the cutting point of the tool 110 relative to the workpiece 200 to be processed, so as to ensure that the reaction liquid 150 can always be sprayed on the processing part to modify the material of the processing part. It should be noted that in the case where the liquid guide component 140 can ensure that the reaction liquid 150 is always sprayed on the processing part, the laser 123 does not need to penetrate the tool 110 to irradiate the processing part, so that the cutting device 100 can be used in the situation where the tolerance temperature of the workpiece material is higher than the tolerance temperature of the tool 110. In some embodiments, the cutting device 100 also includes a driving element, which can drive the liquid guide component 140 to move so that it can always spray the reaction liquid 150 on the processing part. In some embodiments, the energy supply component 120 emits a laser 123 that can irradiate the workpiece 200 to be processed, and the liquid guiding component 140 guides the reaction liquid 150 to the processing part, so that the reaction liquid 150 reacts with the material of the processing part under the energy supply condition of the energy supply component 120 to modify the material of the processing part, thereby facilitating the cutting process of the tool 110.

[0079] In some embodiments, the tool 110 is provided with a channel through which the reaction liquid 150 can flow to the processing part. Therefore, during the cutting process of the tool 110, the contact position between the reaction liquid 150 and the workpiece 200 to be processed can change as the tool 110 changes relative to the workpiece 200 to be processed, thereby achieving more precise material modification of the processing part of the workpiece 200 to be processed.

[0080] See also Fig.10 and Fig.11 In some embodiments, the energy supply component 120 includes a laser generator 121 and a laser regulator 122. The laser generator 121 is responsible for generating the required laser beam, while the laser regulator 122 is used to change the path of the laser 123 to ensure that the laser 123 can irradiate the processing part according to the predetermined route. Specifically, the laser regulator 122 is provided with a reflective part 1221 and / or a refractive part 1222, so that the path of the laser 123 can be changed by reflection and refraction to ensure that the focus of the laser 123 can change with the change of the processing part, and the focus of the laser 123 can always irradiate the processing part.

[0081] The laser generator 121 can be arranged on any side of the reflective portion 1221. For ease of description, the laser generator 121 is arranged on the side of the reflective portion 1221 close to the zoom curved surface 112. The reflective portion 1221 in the laser regulator 122 can be composed of a mirror with high reflectivity, and can be moved or rotated along a specific track by a mechanical driving device to achieve effective control of the path of the laser 123. The refractive portion 1222 can include a prism or other optical elements with an appropriate refractive index, which can guide the path change of the laser beam by changing its own angle or position.

[0082] For example, during the processing, if the cutting edge 111 moves along a straight path, the reflective part 1221 can keep the path of the laser 123 unchanged by translating in the same direction; if the cutting edge 111 moves in a curve, the refractive part 1222 can rotate around the vertical axis to dynamically adjust the path of the laser 123 to ensure that the laser 123 always accurately irradiates the cutting point. This flexible laser 123 path adjustment mechanism greatly improves the controllability and adaptability of the processing process and is suitable for processing workpieces of various complex geometric shapes.

[0083] In order to further optimize the working performance of the laser regulator 122, a redundant design can be introduced between the reflection part 1221 and the refraction part 1222, that is, two path adjustment methods are provided at the same time, so that when a component fails, it can quickly switch to another mode to continue operation and ensure processing continuity.

[0084] In some embodiments, the laser regulator 122 can also be equipped with a dedicated module. For example, for the need of large-area uniform irradiation, the laser regulator 122 can be equipped with a diffuser or a scatterer to make the energy of the laser 123 more evenly distributed in the processing area; for the processing of fine structures, the laser regulator 122 can be equipped with a tiny reflector or a refracting prism to achieve extremely high positioning accuracy. Such a modular design concept not only enhances the functional diversity of the equipment, but also provides users with more customized solutions.

[0085] See also Figure 4 and Fig.11 In some embodiments, the cutting edge 111 has a first end 113 and a second end 114 arranged relatively to each other. For ease of description, the direction from the first end 113 to the second end 114 is defined as a first direction X. The laser adjuster 122 includes a reflective portion 1221, which can adjust the path of the laser 123 by translating along the first direction X. For example, in the actual processing process, as the tool 110 moves, the control system will issue instructions according to the change in the position of the cutting edge 111, and drive the reflective portion 1221 to move accordingly along the first direction X, so that the path of the laser 123 changes synchronously, and the focus of the laser 123 is always located at the cutting point of the cutting edge 111. This design ensures that no matter how the cutting edge 111 moves, the laser 123 can accurately act on the processing part that needs to be modified, thereby improving the processing accuracy and efficiency.

[0086] In some embodiments, the laser adjuster 122 includes a refraction portion 1222, which can change the path of the laser 123 by rotating around an axis perpendicular to the first direction X. In this case, the rotation angle of the refraction portion 1222 can be dynamically adjusted by the control system according to the position of the cutting edge 111, so that the refracted laser beam can be translated in the first direction X, and the effect of making the focus of the laser 123 follow the movement of the cutting edge 111 is also achieved. Such a design is particularly suitable for processing tasks with complex curves or non-linear paths, because the refraction portion 1222 can flexibly respond to various different motion trajectories, ensuring that the path of the laser 123 and the position of the cutting edge 111 are always consistent.

[0087] In order to further improve the response speed and accuracy of the system, a fast response mechanism such as a piezoelectric ceramic driver or other high-precision positioning device can be integrated in the reflective part 1221 or the refractive part 1222. These components can complete position adjustment within milliseconds, significantly reducing the delay time and enhancing the real-time performance of the system. In addition, a closed-loop feedback control system can be introduced to monitor the actual position of the cutting edge 111 using a high-resolution sensor, and the data is fed back to the main control unit in real time. The algorithm calculates the optimal adjustment plan of the reflective part 1221 or the refractive part 1222, thereby achieving more accurate laser 123 path control.

[0088] See also Fig.12 and Fig.13 In some embodiments, the energy supply component 120 includes a laser generator 121 and a galvanometer component 124. The laser generator 121 is used to generate laser 123. The galvanometer component 124 is used to change the path of the laser 123. The laser 123 has an emission section 1232 and a reflection section 1233. The emission section 1232 is located between the laser generator 121 and the galvanometer component 124. The reflection section 1233 passes through the tool 110 and irradiates the processing part. Among them, the galvanometer component 124 is configured to change the trajectory of the reflection section 1233 according to the position change of the cutting point of the cutting edge 111, so that the reflection section 1233 can always irradiate the cutting point (i.e., the processing part) of the cutting edge 111, so that the material of the processing part is modified to facilitate cutting, thereby improving the processing efficiency and reducing the difficulty of the tool 110 in processing brittle and hard materials.

[0089] The galvanometer assembly 124 includes a first reflector 1241 and a second reflector 1242. The first reflector 1241 is configured to rotate around a first axis, and the second reflector 1242 is configured to rotate around a second axis. The first axis intersects the second axis. The emission segment 1232 is reflected by the first reflector 1241 and then reflected to the second reflector 1242, and then reflected by the second reflector 1242 to form a reflection segment 1233. The first reflector 1241 and the second reflector 1242 are used to change the angle and position of the reflection segment 1233 entering the tool 110, so as to reduce the control difficulty of the galvanometer assembly 124.

[0090] See also Fig.13 When the tool 110 is driven to move and cut the workpiece, the position of the tool 110 relative to the galvanometer assembly 124 changes, which may cause the laser 123 to be unable to accurately and always irradiate the cutting point of the cutting edge 111. At this time, the first reflector 1241 can rotate around the first axis, and the second reflector 1242 can rotate around the second axis, thereby changing the incident angle and / or incident position of the reflective segment 1233 entering the tool 110, so as to ensure that the laser 123 entering the tool 110 can always irradiate the cutting point of the cutting edge 111.

[0091] For the cutting device, only the first reflector 1241 is used to change the path and position of the reflective segment 1233 entering the tool 110, and the material cost is low. The path and position of the reflective segment 1233 of the laser 123 entering the tool 110 change, which can ensure that when the relative position of the tool 110 and the galvanometer assembly 124 changes, the laser 123 can always irradiate the cutting point of the cutting edge 111 (the laser 123 that penetrates the cutting point can irradiate the cutting position of the workpiece, thereby changing the material properties of the cutting position of the workpiece, so as to facilitate cutting by the tool 110).

[0092] See also Fig.12 In some embodiments, the first reflector 1241 is configured to be able to rotate around the first axis and also around the second axis. In other words, the incident angle and / or incident position of the reflection segment 1233 of the laser 123 entering the tool 110 can be adjusted by adjusting the rotation angle of the first reflector 1241 around the first axis and the rotation angle of the second axis to ensure that the laser 123 entering the tool 110 can always irradiate the cutting point of the cutting edge 111.

[0093] See also Fig.14 In some embodiments, the second aspect of the present invention further provides a cutting method, which is suitable for controlling the cutting device 100 described in any of the above embodiments. The cutting method comprises: S101: Control the liquid guiding component 140 to provide the reaction liquid 150 so that the reaction liquid 150 contacts the processing part; S102: Control the energy supply component 120 to apply an energy field to the processing part, so that the reaction liquid 150 reacts with the material of the processing part.

[0094] In the specific operation process, when a new processing task is started, the system activates the liquid guide component 140, and sprays an appropriate amount of reaction liquid 150 evenly onto the processing part according to the preset program. Then, the energy supply component 120 (such as a laser source) is started so that the energy generated by it directly acts on the processing part. At this time, due to the presence of the reaction liquid 150 and the energy field provided by the energy supply component 120, the material of the processing part will undergo chemical or physical changes, achieving the purpose of modification.

[0095] In some embodiments, for ease of description, the energy field provided by the energy supply component 120 is taken as a laser 123 for example, that is, the energy supply component 120 can emit a laser 123, and the laser 123 can act on the processing part. Specifically, before controlling the liquid guiding component 140 to provide the reaction liquid 150, the energy supply component 120 can also be used to supply energy to the processing part. Therefore, when the reaction liquid 150 is directed to the workpiece 200 to be processed, the reaction liquid 150 can reduce the influence range of the heat-affected zone, avoid the workpiece 200 to be processed from being burned by the temperature of the energy supply component 120, and at the same time ensure the modification of the material of the processing part.

[0096] Example The workpiece 200 to be processed before processing (the material of the workpiece 200 to be processed is fused quartz glass) is photographed using a white light interferometer. Fig.15, the figure shows the surface morphology of the workpiece 200 to be processed, wherein, among the surface roughness parameters of the workpiece 200 to be processed, the surface arithmetic mean height Sa is 1.073 μm, the root mean square deviation Sq of the surface roughness is 1.488 μm, and the maximum height Sz of the surface roughness is 24.636 μm.

[0097] After the workpiece 200 is cut by the cutting method of the present application, the cutting device 100 is controlled (the turning feed speed is 20 μm, the cutting depth is 50 μm, the laser 123 power is 10 W, and the wavelength is 1064 nm), and the workpiece is photographed again using the white light interferometer. The material of the tool 110 is diamond, the front angle of the tool 110 is -35°, and the back angle is 20°. The reaction liquid 150 is sodium hydroxide solution. Please refer to Fig.16 , which is a surface topography of the workpiece after processing, wherein the surface arithmetic mean height Sa of the workpiece is 0.575 μm, the root mean square deviation Sq of the surface roughness is 0.740 μm, and the maximum height Sz of the surface roughness is 15.143 μm. Therefore, the cutting device 100 of the present application can effectively improve the surface quality of the workpiece.

[0098] in Fig.17 and Fig.18 This is a real picture of the cutting device 100 cutting fused silica glass, and the shooting equipment is a high-speed camera.

[0099] For ease of understanding, the following description is made by taking the workpiece 200 to be processed as fused quartz glass and silicon wafer as an example. The processing conditions corresponding to the workpieces of different material types are shown in Table 1 below. Table 1 Processing conditions of workpiece to be processed

[0100] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0101] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or", "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0102] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A cutting device, characterized in that: include: A tool for cutting a workpiece to be processed, wherein the tool is made of a light-transmitting material, a liquid flow channel is provided inside the tool, and the liquid flow channel is configured to guide the reaction liquid to the processing part, the tool includes a cutting edge for cutting the processing part, and an outlet of the liquid flow channel is provided at the cutting edge; An energy supply component, the energy supply component is configured to emit a laser, the laser passes through the tool and irradiates the processing part at the cutting position of the tool; a liquid guiding component, adapted to provide the reaction liquid to the processing part or the liquid flow channel, wherein the reaction liquid is configured to react with the processing part under the irradiation of the laser so as to modify the material of the processing part; A plurality of the liquid flow channels are arranged inside the tool, and the laser penetrates into the tool and forms a light spot at the cutting edge, and the light spot at least covers an outlet of one of the liquid flow channels.

2. The cutting device according to claim 1, characterized in that The cutting device further comprises a reaction liquid, and the liquid guide assembly comprises a liquid storage portion, and the liquid storage portion is used to store the reaction liquid; The workpiece to be processed is a glass material, and the reaction liquid is an alkaline solution; or, The workpiece to be processed is a metal material, and the reaction liquid is an acidic solution.

3. The cutting device according to claim 2, characterized in that The reaction solution is a sodium hydroxide solution; or, The reaction liquid is a hydrogen peroxide solution; or, The reaction solution is a potassium hydroxide solution; or, The reaction solution is a sodium carbonate solution; or, The reaction liquid is a hydrofluoric acid solution.

4. The cutting device according to claim 1, characterized in that: The tool comprises a cutting edge and a zoom curved surface, the zoom curved surface is located on a side of the tool away from the cutting edge, and the energy supply component is further configured to change the path of the laser in response to a change in a cutting point of the cutting edge; The zoom curved surface is configured so that the focus of the laser light is located at the cutting point of the cutting edge after the path of the laser light is switched.

5. The cutting device according to claim 1, characterized in that: The energy supply component includes a laser generator and a galvanometer component, the laser generator is used to generate the laser, the galvanometer component is used to change the path of the laser, the laser has an output section and a reflection section, the output section is located between the laser generator and the galvanometer component, and the reflection section passes through the tool and irradiates the processing part.

6. The cutting device according to claim 5, characterized in that: The galvanometer assembly includes a first reflector and a second reflector, the first reflector is configured to rotate around a first axis, the second reflector is configured to rotate around a second axis, the first axis intersects with the second axis, the exit segment is reflected by the first reflector and then reflected to the second reflector, and is reflected by the second reflector to form the reflection segment.

7. A cutting method, characterized in that: Suitable for controlling the cutting device according to any one of claims 1 to 6, the cutting method comprising: Controlling the liquid guiding component to provide the reaction liquid so that the reaction liquid contacts the processing part; The energy supply component is controlled to apply the energy field to the processing part, so that the reaction liquid reacts with the material of the processing part.

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