Chip packaging table electroplating jig

Abstract

The chip packaging table electroplating jig comprises an upper die assembly, a sealing assembly and a lower die assembly, the upper die assembly comprises a top plate and a positioning plate, the top plate is connected with the positioning plate, the positioning plate is provided with a containing groove used for containing a chip packaging table, and the bottom of the containing groove is provided with an electroplating through hole; the sealing assembly comprises a first sealing piece and a second sealing piece, the first sealing piece is arranged on the positioning plate around the placing groove, an extending sealing part is arranged on the inner wall of the electroplating through hole, and the second sealing piece is arranged on the extending sealing part; the lower die assembly is provided with an electroplating liquid spraying channel, and the electroplating liquid spraying channel communicates with the electroplating through hole. According to the electroplating jig for the chip packaging table, the upper die assembly, the sealing assembly and the lower die assembly are arranged, so that electroplating sealing protection can be carried out on the chip packaging table through the first sealing piece and the second sealing piece, and therefore the situation that other parts of the chip packaging table make contact with electroplating liquid, and consequently electroplating processing defective products are caused is avoided; and therefore, the electroplating processing quality is improved.

Description

Technical Field

[0001] The invention relates to the technical field of electroplating processing, and in particular to an electroplating fixture for a chip packaging station. Background Art

[0002] like Figure 1 As shown, a chip packaging platform 1 is provided with a boss 11 for chip mounting operation. In actual production and processing, it is necessary to perform electroplating on the boss 11 to meet the subsequent chip mounting process operation. In the existing electroplating processing method, it is first necessary to perform coating processing on the chip packaging platform 1, and then cut the coating layer at the boss 11 that needs to be electroplated, and finally place the chip packaging platform 1 on the corresponding electroplating equipment for electroplating. After the electroplating is completed, the remaining coating layer on the chip packaging platform 1 is peeled off, thereby completing the electroplating of the boss 11. However, the existing electroplating processing method has the following problems:

[0003] 1. Since the surface of the chip packaging platform 1 has a protective film, the protective film on the chip packaging platform 1 is easily cut during the coating layer cutting operation, thereby affecting the quality of the electroplating process; at the same time, when the coating layer is peeled off after the electroplating process, the protective film on the chip packaging platform 1 is easily peeled off, thereby affecting the subsequent processing operations;

[0004] 2. The electroplating method using coating layer protection not only increases the process steps, resulting in low production efficiency, but also increases production costs. Summary of the invention

[0005] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a chip packaging station electroplating fixture that can perform electroplating protection on a chip packaging station, thereby improving the efficiency and quality of the overall electroplating process.

[0006] The objective of the present invention is achieved through the following technical solutions:

[0007] A chip packaging station electroplating fixture includes: an upper mold assembly, a sealing assembly and a lower mold assembly, the upper mold assembly includes a top plate and a positioning plate, the top plate is connected to the positioning plate, a placement groove for placing the chip packaging station is provided on the positioning plate, a plated through hole is provided at the bottom of the placement groove, when the chip packaging station is placed in the placement groove, the boss of the chip packaging station is located in the plated through hole; the sealing assembly includes a first sealing member and a second sealing member, the first sealing member is arranged on the positioning plate around the placement groove, the inner wall of the plated through hole is provided with an extended sealing portion, and the second sealing member is arranged on the extended sealing portion; the lower mold assembly is connected to a side of the positioning plate away from the top plate, the lower mold assembly is provided with a plating liquid injection channel, and the plating liquid injection channel is connected to the plated through hole.

[0008] In one embodiment, a limiting groove is provided on the top plate, and a positioning boss is provided on the positioning plate. The positioning boss is arranged around the placement groove, and when the top plate is connected to the positioning plate, the positioning boss is located in the limiting groove.

[0009] In one embodiment, a sealing installation groove is formed on the positioning boss, and the first sealing member is disposed in the sealing installation groove.

[0010] In one embodiment, the first sealing component includes a first sealing rubber ring and a first sealing rubber strip, one end of the first sealing rubber strip is connected to the first sealing rubber ring, a first sealing positioning hole is opened on the sealing installation groove, and when the first sealing rubber ring is arranged in the sealing installation groove, the first sealing rubber strip is located in the first sealing positioning hole.

[0011] In one embodiment, the first sealing strip includes a first sealing deformation portion and a first sealing positioning portion connected in sequence, one end of the first sealing deformation portion is connected to the first sealing rubber ring, and the diameter of the first sealing deformation portion is greater than the diameter of the first sealing positioning portion.

[0012] In one embodiment, a plurality of the first sealing rubber strips are provided, and each of the first sealing rubber strips is connected to the first sealing rubber ring respectively.

[0013] In one embodiment, the second sealing member includes a second sealing rubber ring and a second sealing rubber strip, one end of the second sealing rubber strip is connected to the second sealing rubber ring, a second sealing positioning hole is opened on the extended sealing portion, and when the second sealing rubber ring is arranged on the extended sealing portion, the second sealing rubber strip is located in the second sealing positioning hole.

[0014] In one embodiment, the second sealing strip includes a second sealing deformation portion and a second sealing positioning portion connected in sequence, one end of the second sealing deformation portion is connected to the second sealing rubber ring, and the diameter of the second sealing deformation portion is greater than the diameter of the second sealing positioning portion.

[0015] In one embodiment, a plurality of the second sealing strips are provided, and each of the second sealing strips is connected to the second sealing ring respectively.

[0016] In one embodiment, a conductive joint is provided on the top of the top plate.

[0017] Compared with the prior art, the present invention has at least the following advantages:

[0018] 1. The chip packaging station electroplating jig of the present invention is provided with an upper mold assembly, a sealing assembly and a lower mold assembly, so that the chip packaging station can be electroplated and sealed through the first sealing member and the second sealing member to protect it, thereby preventing other parts of the chip packaging station from contacting the electroplating liquid and causing electroplating defective products, thereby improving the quality of the electroplating process.

[0019] 2. The chip packaging platform electroplating fixture of the present invention can simplify the production and processing process and improve production efficiency by directly electroplating, fixing and protecting the chip packaging platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 is a schematic structural diagram of a chip packaging station in one embodiment of the present invention;

[0022] Figure 2 It is a schematic structural diagram of a chip packaging station electroplating fixture in one embodiment of the present invention;

[0023] Figure 3 for Figure 2 An exploded view of the electroplating fixture for the chip packaging station;

[0024] Figure 4 for Figure 2 A schematic diagram of the structure of the positioning plate of the electroplating fixture of the chip packaging station;

[0025] Figure 5 for Figure 2A schematic diagram of the structure of the top plate of the electroplating fixture of the chip packaging station;

[0026] Figure 6 for Figure 2 A schematic structural diagram of a first sealing member of a chip packaging station electroplating fixture;

[0027] Figure 7 for Figure 2 A schematic structural diagram of a second sealing member of a chip packaging station electroplating fixture;

[0028] Figure 8 for Figure 2 Schematic diagram of the structure of the lower mold assembly of the chip packaging station electroplating fixture. DETAILED DESCRIPTION

[0029] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0032] like Figure 2-Figure 8As shown, a chip packaging station electroplating fixture 10 includes: an upper mold assembly 100, a sealing assembly 200 and a lower mold assembly 300. The upper mold assembly 100 includes a top plate 110 and a positioning plate 120. The top plate 110 is connected to the positioning plate 120. The positioning plate 120 is provided with a placement groove 121 for placing the chip packaging station 1. The bottom of the placement groove 121 is provided with a plated through hole 122. When the chip packaging station 1 is placed in the placement groove 121, the boss 11 of the chip packaging station 1 is located at the plated through hole 122. 2; the sealing assembly 200 includes a first sealing member 210 and a second sealing member 220, the first sealing member 210 is arranged on the positioning plate 120 around the placement groove 121, the inner wall of the electroplated through hole 122 is provided with an extended sealing portion 122a, and the second sealing member 220 is arranged on the extended sealing portion 122a; the lower mold assembly 300 is connected to a side of the positioning plate 120 away from the top plate 110, and the lower mold assembly 300 is provided with a plating liquid injection channel, and the plating liquid injection channel is connected to the electroplated through hole 122.

[0033] It should be noted that the chip packaging station electroplating fixture 10 is installed on the corresponding electroplating pool station. By installing and fixing the chip packaging station 1, the chip packaging station 1 in the chip packaging station electroplating fixture 10 can be directly electroplated during electroplating. Specifically, the chip packaging station 1 is placed in the placement groove 121 of the positioning plate 120. The placement groove 121 is set according to the shape of the chip packaging station 1, so that the chip packaging station 1 can be placed and positioned in the placement groove 121. At this time, the boss 11 of the chip packaging station 1 is located in the electroplating through hole 122. In this way, the electroplating liquid can be electroplated and sprayed on the boss 11 in the electroplating through hole 122 through the electroplating liquid injection channel of the lower mold assembly 300, thereby avoiding contact between other parts of the chip packaging station 1 and the electroplating liquid to cause electroplating defective products. Furthermore, the inner wall of the plated through hole 122 is provided with an extended sealing portion 122a, and the second sealing member 220 is provided on the extended sealing portion 122a, so that when the boss 11 is located in the plated through hole 122, the second sealing member 220 surrounds and seals the boss 11 for protection, so that when the plating liquid contacts the boss 11, the second sealing member 220 can prevent the plating liquid from entering the portion outside the boss 11, thereby protecting the chip packaging platform 1, thereby improving the quality of the electroplating process. Further, the first sealing member 210 is provided on the positioning plate 120 around the placement groove 121, so that when the chip packaging platform electroplating fixture 10 is electroplating, by providing the first sealing member 210, the plating liquid can be prevented from entering the placement groove 121 of the positioning plate 120, thereby preventing other parts of the chip packaging platform 1 from contacting with the plating liquid and causing electroplating defective products, thereby improving the quality of the electroplating process. The chip packaging station electroplating fixture 10 of the present invention is provided with an upper mold assembly 100, a sealing assembly 200 and a lower mold assembly 300, so that the chip packaging station 1 can be electroplated and sealed through the first sealing member 210 and the second sealing member 220 to protect it, thereby preventing other parts of the chip packaging station 1 from contacting the electroplating liquid and causing electroplating defective products, thereby improving the quality of the electroplating process. At the same time, the chip packaging station electroplating fixture 10 is used to fix and protect the chip packaging station 1 through electroplating, which can simplify the process flow of production and processing, so that production efficiency is improved.

[0034] In one embodiment, please refer to Figure 4 and Figure 5A limiting groove 111 is provided on the top plate 110, and a positioning boss 123 is provided on the positioning plate 120. The positioning boss 123 is arranged around the placement groove 121. When the top plate 110 is connected to the positioning plate 120, the positioning boss 123 is located in the limiting groove 111; in this way, the plating liquid can be blocked by the positioning boss 123, so that the plating liquid cannot directly enter the placement groove 121, thereby further improving the overall sealing performance; further, a sealing installation groove 123a is opened on the positioning boss 123, and the first sealing component 210 is arranged in the sealing installation groove 123a. In this way, the first sealing component 210 can be installed on the positioning boss 123 through the sealing installation groove 123a, thereby preventing the plating liquid from entering the placement groove 121, thereby further improving the overall sealing performance.

[0035] See also Figure 6 In one embodiment, the first sealing member 210 includes a first sealing rubber ring 211 and a first sealing rubber strip 212, one end of the first sealing rubber strip 212 is connected to the first sealing rubber ring 211, and a first sealing positioning hole is provided on the sealing installation groove 123a. When the first sealing rubber ring 211 is arranged in the sealing installation groove 123a, the first sealing rubber strip 212 is located in the first sealing positioning hole; in this way, the first sealing rubber ring 211 can be quickly installed through the cooperation of the first sealing rubber strip 212 and the first sealing positioning hole, and the first sealing rubber ring 211 can be tightly attached to the sealing installation groove 123a, thereby improving the overall sealing performance; further, the first sealing rubber strip 212 includes a first sealing deformation portion 212a and a first sealing positioning portion 212b connected in sequence, one end of the first sealing deformation portion 212a is connected to the first sealing rubber ring 211, and the first sealing deformation portion 212a is straight The diameter is larger than the diameter of the first sealing positioning portion 212b. In this way, when the first sealing strip 212 is placed in the first sealing positioning hole, due to the smaller diameter of the first sealing positioning portion 212b, it can be quickly installed in the first sealing positioning hole. When the first sealing deformation portion 212a enters the first sealing positioning hole, due to the larger diameter of the first sealing deformation portion 212a, the first sealing positioning hole can be completely blocked by extrusion deformation, thereby preventing the plating liquid from entering the placement groove 121 from the first sealing positioning hole, and preventing the first sealing rubber ring 211 from being displaced during processing and use, thereby improving the overall sealing performance. For example, a plurality of first sealing strips 212 are provided, and each first sealing strip 212 is respectively connected to the first sealing rubber ring 211. In this way, the first sealing rubber ring 211 can be installed more securely, thereby further improving the overall sealing performance.

[0036] In one embodiment, please refer to Figure 7The second sealing member 220 includes a second sealing rubber ring 221 and a second sealing rubber strip 222, one end of the second sealing rubber strip 222 is connected to the second sealing rubber ring 221, and a second sealing positioning hole is opened on the extended sealing portion 122a. When the second sealing rubber ring 221 is arranged on the extended sealing portion 122a, the second sealing rubber strip 222 is located in the second sealing positioning hole; in this way, the second sealing rubber ring 221 can be quickly installed through the cooperation between the second sealing rubber strip 222 and the second sealing positioning hole, and the second sealing rubber ring 221 can be tightly attached to the extended sealing portion 122a, thereby improving the overall sealing performance; further, the second sealing rubber strip 222 includes a second sealing deformation portion 222a and a second sealing positioning portion 222b connected in sequence, one end of the second sealing deformation portion 222a is connected to the second sealing rubber ring 221, and the diameter of the second sealing deformation portion 222a is greater than The diameter of the second sealing positioning portion 222b, such that, when the second sealing strip 222 is placed in the second sealing positioning hole, due to the smaller diameter of the second sealing positioning portion 222b, it can be quickly installed in the second sealing positioning hole, and when the second sealing deformation portion 222a enters the second sealing positioning hole, due to the larger diameter of the second sealing deformation portion 222a, the second sealing positioning hole can be completely blocked by extrusion deformation, thereby preventing the plating liquid from entering the placement groove 121 from the second sealing positioning hole, and preventing the second sealing rubber ring 221 from being displaced during processing and use, thereby improving the overall sealing performance; for example, a plurality of second sealing strips 222 are provided, and each second sealing strip 222 is respectively connected to the second sealing rubber ring 221, such that the second sealing rubber ring 221 can be installed more securely, thereby further improving the overall sealing performance.

[0037] Combination Figure 3 and Figure 8As shown, in one embodiment, the lower mold assembly 300 includes a lower mold connecting plate 310, a lower mold fixing plate 320, a conductive sheet 330 and a lower mold fixing seat 340, the lower mold connecting plate 310 is connected to the positioning plate 120, a lower mold connecting hole 311 is opened on the lower mold connecting plate 310, and the lower mold connecting hole 311 is connected to the electroplated through hole 122, the lower mold fixing plate 320 is connected to the lower mold connecting plate 310, the lower mold fixing plate 320 is opened on the lower mold connecting plate 310, a conductive mounting groove 321 is opened, the conductive sheet 330 is arranged in the conductive mounting groove 321, and the conductive mounting groove 330 is arranged in the conductive mounting groove 330. A conductive hole 322 is provided on 21, and the conductive hole 322 is connected to the lower mold connecting hole 311. A plating dispersion hole group 331 is provided on the conductive sheet 330, and the plating dispersion hole group 331 is aligned with the conductive hole 322. The lower mold fixing seat 340 is connected to the lower mold fixing plate 320. A lower mold plating entry hole 341 is provided on the lower mold fixing seat 340, and the lower mold plating entry hole 341 is connected to the conductive hole 322. The lower mold connecting hole 311, the conductive hole 322 and the lower mold plating entry hole 341 are interconnected to form a plating liquid injection channel.

[0038] It should be noted that a conductive connector 112 is provided on the top of the top plate 110, a conductive portion 332 is provided on the conductive sheet 330, and the conductive portion 332 extends to the outside of the lower mold fixing plate 320, so that the conductive connector 112 and the conductive portion 332 can be conductively connected to the external electroplating equipment, so that the chip packaging stage 1 can be electroplated. Further, the lower mold connection hole 311, the conductive hole 322 and the lower mold electroplating entry hole 341 are interconnected to form an electroplating liquid injection channel, so that the electroplating liquid can flow into the electroplating through hole 122 to electroplating the boss 11. Specifically, the electroplating liquid enters from the lower mold electroplating entry hole 341 under negative pressure, so that it can be contacted with the boss 11 in the electroplating through hole 122 by injection, thereby completing the electroplating process. In order to ensure that the sprayed electroplating liquid can be evenly dispersed on the boss 11, a plating dispersion hole group 331 is provided on the conductive hole 322. The plating dispersion hole group 331 can be composed of a plurality of rectangularly distributed circular hole structures. Thus, when the plating liquid passes through the plating dispersion hole group 331, it will be sprayed onto the boss 11 from each rectangularly distributed circular hole structure, so that the sprayed electroplating liquid can be evenly dispersed on the boss 11, avoiding excessive concentration of the plating liquid and resulting in defective electroplating products, thereby improving the quality of the overall electroplating process.

[0039] Combination Figure 3 and Figure 8As shown, in one embodiment, in order to allow the plating liquid to quickly flow out of the chip packaging station electroplating jig 10 after contacting the boss 11, and to avoid damage to the chip packaging station electroplating jig 10 due to excessive overall injection pressure, a drainage pipe 312 is provided on the lower mold connecting plate 310, and one end of the drainage pipe 312 is connected to the lower mold connecting hole 311, and the other end of the drainage pipe 312 extends to the outside of the lower mold connecting plate 310. In this way, when the plating liquid contacts the boss 11, part of the plating liquid will flow out from the drainage pipe 312, so that the plating liquid can quickly flow out of the chip packaging station electroplating jig 10 after contacting the boss 11, and to avoid damage to the chip packaging station electroplating jig 10 due to excessive overall injection pressure.

[0040] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims

1. A chip packaging station electroplating fixture, characterized in that: include: An upper mold assembly, the upper mold assembly comprising a top plate and a positioning plate, the top plate being connected to the positioning plate, the positioning plate being provided with a placement groove for placing a chip packaging stage, the bottom of the placement groove being provided with a plated through hole, when the chip packaging stage is placed in the placement groove, the boss of the chip packaging stage is located in the plated through hole; A sealing assembly, the sealing assembly comprising a first sealing member and a second sealing member, the first sealing member being arranged on the positioning plate around the placement groove, the inner wall of the electroplated through hole being provided with an extended sealing portion, and the second sealing member being arranged on the extended sealing portion; and A lower mold assembly is connected to a side of the positioning plate away from the top plate, and the lower mold assembly is provided with a plating liquid injection channel, and the plating liquid injection channel is connected to the electroplating through hole.

2. The chip packaging station electroplating fixture according to claim 1, characterized in that: The top plate is provided with a limiting groove, the positioning plate is provided with a positioning boss, the positioning boss is arranged around the placement groove, and when the top plate is connected to the positioning plate, the positioning boss is located in the limiting groove.

3. The chip packaging station electroplating fixture according to claim 2, characterized in that: A sealing installation groove is formed on the positioning boss, and the first sealing member is disposed in the sealing installation groove.

4. The chip packaging station electroplating fixture according to claim 3, characterized in that: The first sealing component includes a first sealing rubber ring and a first sealing rubber strip, one end of the first sealing rubber strip is connected to the first sealing rubber ring, a first sealing positioning hole is provided on the sealing installation groove, and when the first sealing rubber ring is arranged in the sealing installation groove, the first sealing rubber strip is located in the first sealing positioning hole.

5. The chip packaging station electroplating fixture according to claim 4, characterized in that: The first sealing strip includes a first sealing deformation portion and a first sealing positioning portion which are connected in sequence, one end of the first sealing deformation portion is connected to the first sealing rubber ring, and the diameter of the first sealing deformation portion is greater than the diameter of the first sealing positioning portion.

6. The chip packaging station electroplating fixture according to claim 5, characterized in that: A plurality of the first sealing rubber strips are provided, and each of the first sealing rubber strips is connected to the first sealing rubber ring respectively.

7. The chip packaging station electroplating fixture according to claim 1, characterized in that: The second sealing component includes a second sealing rubber ring and a second sealing rubber strip, one end of the second sealing rubber strip is connected to the second sealing rubber ring, a second sealing positioning hole is opened on the extended sealing part, and when the second sealing rubber ring is arranged on the extended sealing part, the second sealing rubber strip is located in the second sealing positioning hole.

8. The chip packaging station electroplating fixture according to claim 7, characterized in that: The second sealing strip includes a second sealing deformation portion and a second sealing positioning portion which are connected in sequence, one end of the second sealing deformation portion is connected to the second sealing rubber ring, and the diameter of the second sealing deformation portion is greater than the diameter of the second sealing positioning portion.

9. The chip packaging station electroplating fixture according to claim 8, characterized in that: A plurality of the second sealing rubber strips are provided, and each of the second sealing rubber strips is connected to the second sealing rubber ring respectively.

10. The chip packaging station electroplating fixture according to claim 1, characterized in that: A conductive joint is arranged on the top of the top plate.

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