Non-contact optical probe for increasing and measuring back drilling hole contour depth
Through the non-contact optical probe detection device, the drilling hole is continuously irradiated with a light beam and recorded the reflection point to generate a drilling depth plan, which solves the problems of low precision of the back drilling depth and destructive detection methods in the prior art, and achieves efficient and accurate detection effects.
Patent Information
- Application Number
- CN202311218214.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-20
- Publication Date
- 2025-03-21
AI Technical Summary
During the back drilling operation, the existing circuit board manufacturing methods fail to effectively consider the difference in board thickness and the uniformity of board thickness, resulting in low machining accuracy of back drilling depth, prone to eccentricity and inclination problems, and the existing detection methods are destructive and inefficient.
A non-contact optical probe detection device is used to continuously irradiate the drilling holes by the light beam and record the reflection points, generate a drilling depth plan, calculate the plate thickness, drilling depth and eccentricity, and achieve non-destructive and efficient detection.
It improves the detection accuracy of the back drilling depth, reduces errors, can detect eccentricity, avoids the disadvantages of destructive detection, and achieves fast and accurate detection.
Smart Images
Figure CN119665867A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a circuit board back drilling detection device, in particular to a non-contact non-contact optical probe capable of measuring the thickness, drilling depth and eccentricity of a PCB board and measuring the back drilling profile depth. Background Art
[0002] The existing circuit board manufacturing method uses the copper surface of the circuit board as a reference to unify the depth of the drill when performing back drilling operations. It does not take into account the impact of the thickness difference between circuit boards or the poor thickness uniformity on the processing accuracy of the back drilling depth. Therefore, when the thickness difference between circuit boards is large or the thickness uniformity is poor, the processing accuracy of the back drilling depth will increase with the depth of the back drilling, and eccentricity and tilt may also occur.
[0003] The back drilling inspection method of the prior art is a destructive inspection method, which randomly samples and destroys the circuit board slices and then observes whether each back drilling hole meets the requirements. However, the destructive inspection is time-consuming and can only be observed from a specific angle, which is the biggest disadvantage of the prior art inspection method. Therefore, there is still a need for improvement.
[0004] In view of this, the inventor has accumulated many years of research and practical experience in related fields and uses the present invention to improve the deficiencies of the above-mentioned prior art. Summary of the invention
[0005] The main purpose of the present invention is to provide a non-contact optical probe for measuring the depth of the back-drilled hole profile, which includes: a fixing device connected to a first moving module, the first moving module includes a first power source, the fixing device is provided with a reflection fixture, the top surface of the reflection fixture is provided with at least one plate body, the plate body includes at least one first drill hole; at least one optical probe body, which is arranged above the fixing device; and a computer, which is electrically connected to the optical probe body and the first moving module, the computer includes an output unit, the computer starts the optical probe body to emit a light beam, the diameter of the light beam is smaller than the radius of the first drill hole, the light beam irradiates the plate body, and at the same time, the computer controls the first power source to drive the fixing device to move, so that the first drill hole passes under the optical probe body, the first drill hole is continuously irradiated by the light beam, the computer records a plurality of first reflection points of the light beam entering and leaving the first drill hole and the reflection fixture, and generates a first drill hole depth plane map according to each first reflection point, and the first drill hole depth plane map is output by the output unit.
[0006] The plate body further has at least one second borehole, and there is a predetermined distance between the second borehole and the first borehole. When the first borehole passes under the optical probe body, the computer controls the first power source to drive the fixing device to move so that the second borehole passes under the optical probe body. The second borehole is continuously irradiated by the light beam. The computer records multiple second reflection points from the light beam entering to leaving the second borehole and the reflection fixture, and generates a second borehole depth plane map based on each second reflection point, and the output unit outputs the second borehole depth plane map.
[0007] The plate body includes at least one first through hole and at least one second through hole, and the first drilled hole and the second drilled hole are drilled in the first through hole and the second through hole respectively, so that the first drilled hole and the second drilled hole overlap with the first through hole and the second through hole respectively, and the diameters of the first drilled hole and the second drilled hole are respectively larger than the first through hole and the second through hole; the thickness of the plate body, the depth of the first drilled hole and the second drilled hole, the eccentricity between the first drilled hole and the first through hole, and the eccentricity between the second drilled hole and the second through hole are inspected by the first drilled hole depth plan view and the second drilled hole depth plan view; the eccentricity is the distance between the center of the first through hole and the center of the first drilled hole, and the distance between the center of the second through hole and the center of the second drilled hole.
[0008] Each first reflection point and each second reflection point are positions where the light beam irradiates the surface of the plate, is blocked inside the first borehole and the second borehole, and reflects the light beam back to the optical probe body. The computer records and calculates the position and distance of each first reflection point and the position and distance of each second reflection point, and connects each first reflection point and each second reflection point to form the first borehole depth plane diagram and each second borehole depth plane diagram.
[0009] The computer further includes an input unit, through which the coordinates of the first drilling hole and the second drilling hole and the moving route of the first moving module are input.
[0010] The coordinates are the center of the first borehole and the center of the second borehole. When the first moving module moves the plate, the moving route is the diameter of the first borehole and the second borehole, so that the first borehole and the second borehole pass under the optical probe body.
[0011] A non-contact optical probe for measuring the depth of a back-drilled hole profile comprises: a fixing device, at least one plate body is installed on the top surface of the fixing device, a reflection fixture is arranged below the plate body, and the plate body comprises at least one first drill hole; at least one optical probe body is detachably arranged on a second movable module, the second movable module comprises a second power source, and the second movable module is located above the fixing device; and a computer, which is electrically connected to the optical probe body and the second movable module, the computer comprises an output unit, the computer is used to activate the optical probe body to emit a light beam, the diameter of the light beam is smaller than the radius of the first drill hole, the light beam irradiates the plate body, and the computer controls the second power source to drive the optical probe body to move, so that the optical probe body passes above the first drill hole, the first drill hole is continuously irradiated by the light beam, the computer records a plurality of first reflection points of the light beam entering and leaving the first drill hole and the reflection fixture, and generates a first drill hole depth plane map according to each first reflection point, and the output unit outputs the first drill hole depth plane map.
[0012] The plate body further has at least one second borehole, and there is a predetermined distance between the second borehole and the first borehole. When the optical probe body passes over the first borehole, the computer controls the second power source to drive the optical probe body to move so that the optical probe body passes over the second borehole. The second borehole is continuously irradiated by the light beam. The computer records multiple second reflection points of the light beam entering and leaving the second borehole and the reflection fixture, and generates a second borehole depth plane map based on each second reflection point, and the second borehole depth plane map is output by the output unit.
[0013] The plate body includes at least one first through hole and at least one second through hole, and the first drilled hole and the second drilled hole are drilled in the first through hole and the second through hole respectively, so that the first drilled hole and the second drilled hole overlap with the first through hole and the second through hole respectively, and the diameters of the first drilled hole and the second drilled hole are respectively larger than the first through hole and the second through hole; the thickness of the plate body, the depth of the first drilled hole and the second drilled hole, the eccentricity between the first drilled hole and the first through hole, and the eccentricity between the second drilled hole and the second through hole are inspected by the first drilled hole depth plan view and the second drilled hole depth plan view; the eccentricity is the distance between the center of the first through hole and the center of the first drilled hole, and the distance between the center of the second through hole and the center of the second drilled hole.
[0014] Each first reflection point and each second reflection point are positions where the light beam irradiates the surface of the plate, is blocked inside the first borehole and the second borehole, and reflects the light beam back to the optical probe body. The computer records and calculates the position and distance of each first reflection point and the position and distance of each second reflection point, and connects each first reflection point and each second reflection point to form the first borehole depth plane diagram and each second borehole depth plane diagram.
[0015] The computer further comprises an input unit, through which the coordinates of the first drilling hole and the second drilling hole and the moving route of the second moving module are input.
[0016] The coordinates are the center of the first borehole and the center of the second borehole. When the second moving module moves the optical probe body, the moving route is the diameter of the first borehole and the second borehole, so that the optical probe body passes over the first borehole and the second borehole. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0018] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a side view of the plate body of the present invention; Figure 3 A schematic diagram of the computer architecture of the present invention; Figure 4 It is a schematic diagram of the use state of the present invention; Figure 5 for Figure 4 Schematic diagram of the first borehole being irradiated by the light beam; Figure 6 A schematic diagram of computer operation of the present invention; Figure 7 A depth plan view of the first borehole and the second borehole of the present invention; Figure 8 for Figure 7 an enlarged plan view of the first borehole depth; Fig. 9 for Figure 4 Schematic diagram of the second borehole being irradiated by the light beam; Fig.10 A plan view of the depths of the first drilling hole and the second drilling hole of the present invention without using a reflection fixture; Fig.11 A schematic diagram of a moving route set for the computer of the present invention; Fig.12 It is a schematic structural diagram of another embodiment of the present invention.
[0019] Description of Reference Numerals 10. Fixing device; 101. Reflection fixture; 11. The first mobile module; 12. The first power source; 20. Optical probe body; 21. Beam; 211, first reflection point; 212, second reflection point; 22. The second mobile module; 221. Second power source; 30. Computer; 31. Output unit; 32. Input unit; 40. Plan view of the first drilling depth; 50. Second drilling depth plan view; A. Plate body; A1, first drilling; A2, second drilling hole; B1, first through hole; B2, the second through hole. DETAILED DESCRIPTION
[0020] To facilitate the description of the content and effects of the present invention, please refer to Figures 1 to 3 , which is a first embodiment of the present invention for improving the non-contact optical probe for measuring the depth of back-drilled hole profile, comprising: A fixing device 10 is connected to a first movable module 11, which includes a first power source 12. The fixing device 10 is provided with a reflection fixture 101, and the top surface of the reflection fixture 101 is provided with at least one plate A, which includes at least one first drill hole A1, wherein the plate has a predetermined thickness.
[0021] At least one optical probe body 20 is disposed above the fixing device 10 .
[0022] Please refer to Figure 1 and Figure 3 A computer 30 is electrically connected to the optical probe body 20 and the first power source 12 of the first moving module 11. The computer 30 includes an output unit 31. The output unit 31 includes a display and a printer.
[0023] Please refer to Figure 4 and Figure 5 The present invention is used in that the computer 30 activates the optical probe body 20 to emit a light beam 21, the diameter of the light beam 21 is smaller than the radius of the first bore hole A1 (but not limited thereto), the light beam 21 irradiates the plate body A, and at the same time the computer 30 controls the first power source 12 to drive the fixing device 10 to move, so that the first bore hole A1 passes under the optical probe body 20, please refer to Figures 5 to 7 The first drilling hole A1 is continuously irradiated by the light beam 21, and the computer 30 records the light beam 21 entering and leaving the first drilling hole A1 and multiple first reflection points 211 of the reflection fixture 101, and generates a first drilling depth plane map 40 according to each first reflection point 211, and the first drilling depth plane map 40 is output by the output unit 31.
[0024] Please refer to Figure 2 and Figure 8 The plate body A also has at least one second bore hole A2, and there is a predetermined distance between the second bore hole A2 and the first bore hole A1. When the first bore hole A1 passes under the optical probe body 20, the computer 30 controls the first power source 12 to drive the fixing device 10 to move, so that the second bore hole A2 passes under the optical probe body 20. The second bore hole A2 is continuously irradiated by the light beam 21. The computer 30 records multiple second reflection points 212 from the light beam 21 entering to leaving the second bore hole A2 and the reflection fixture 101, and generates a second bore hole depth plane map 50 according to each second reflection point 212, and the second bore hole depth plane map 50 is output by the output unit 31.
[0025] In short, the present invention can quickly detect multiple drill holes through the setting of the computer 30, and after the detection is completed, each plate body A is still in an intact state, which overcomes the disadvantage of the prior art that destructive detection is required.
[0026] Please refer to Figure 2 In detail, please refer to the plate body A including at least one first through hole B1 and at least one second through hole B2, the first drilled hole A1 and the second drilled hole A2 are respectively drilled in the first through hole B1 and the second through hole B2, so that the first drilled hole A1 and the second drilled hole A2 coincide with the first through hole B1 and the second through hole B2 respectively, and the diameters of the first drilled hole A1 and the second drilled hole A2 are respectively larger than the first through hole B1 and the second through hole B2.
[0027] Please refer to Figures 5 to 8 , each first reflection point 211 and each second reflection point 212 are positions where the light beam irradiates the surface of the plate A, is blocked inside the first borehole A1 and the second borehole A2, and reflects the light beam back to the optical probe body 20. The computer 30 records and calculates the position and distance of each first reflection point 211 and the position and distance of each second reflection point 212, and connects each first reflection point 211 and each second reflection point 212 to form the first borehole depth plane map 40 and each second borehole depth plane map 50.
[0028] Please refer to Figure 7 and Figure 8 The thickness of the plate A, the depth of the first borehole A1 and the second borehole A2, the eccentricity between the first borehole A1 and the first through hole B1, and the eccentricity between the second borehole A2 and the second through hole B2 are inspected by the first borehole depth plane diagram 40 and the second borehole depth plane diagram 50. The eccentricity is the distance between the center of the first through hole B1 and the center of the first borehole A1, and the distance between the center of the second through hole B2 and the center of the second borehole A2.
[0029] The cause of eccentricity is that the drill bit does not correspond to the center of the through hole during drilling, or the drill bit swings during drilling. In practice, the eccentricity is almost impossible to identify with the naked eye. Therefore, the present invention can easily analyze the first drill hole A1 and the second drill hole A2 through the first drill hole depth plane diagram 40 and the second drill hole depth plane diagram 50.
[0030] Therefore, in the present invention Figure 1 and Fig. 9 In the figure, the second drill hole A2 and the second through hole B2 are intentionally drawn into an eccentric shape, thereby demonstrating the function of the present invention in detecting eccentricity.
[0031] Please refer to Fig.10 Since the plate A has the predetermined thickness, if the reflection fixture 101 is not used, the light beam 21 cannot be detected, resulting in the first drilling depth plane map 40 and the second drilling depth plane map 50 output by the computer 30 being unable to fully present the graphics of the first through hole B1 and the second through hole B2. Therefore, it is necessary to use the reflection fixture 101 to reflect the light beam 21.
[0032] Please refer to Figure 3 and Fig.11 The computer 30 further includes an input unit 32 , through which the coordinates of the first borehole A1 and the second borehole A2 and the moving route of the first moving module 11 are input.
[0033] The coordinates are the center of the first bore hole A1 and the center of the second bore hole A2. When the first moving module 11 moves the plate A, the moving route is the diameter of the first bore hole A1 and the second bore hole A2, so that the first bore hole A1 and the second bore hole A2 pass under the optical probe body 20.
[0034] Please refer to Fig.12 , which is the second embodiment of the present invention. Since the main structure of this embodiment is the same as the previous embodiment, the similarities will not be repeated and will be described first.
[0035] In this embodiment, the optical probe body 20 is detachably mounted on a second movable module 22, which is electrically connected to the computer 30 and includes a second power source 221. The second movable module 22 is located above the fixing device 10. Therefore, when the computer 30 inputs the coordinates and movement routes of the first borehole A1 and the second borehole A2, the optical probe body 20 is driven by the second power source 221 to move, while the fixing device 10 remains stationary, thereby enabling the light beam 21 to pass through the first borehole A1 and the second borehole A2, and the computer 30 outputs the first borehole depth plan view 40 and each second borehole depth plan view 50.
[0036] However, what is described above is only a preferred embodiment of the present invention and should not be used to limit the scope of the present invention. Any changes and modifications that can be obviously made by those skilled in the art should be regarded as not departing from the essential content of the present invention.
Claims
1. A non-contact optical probe for measuring the depth of back-drilled hole profile, characterized in that: include: A fixing device connected to a first moving module, the first moving module including a first power source, the fixing device is provided with a reflection fixture, the top surface of the reflection fixture is provided with at least one plate body, the plate body includes at least one first drill hole; At least one optical probe body, which is disposed above the fixing device; as well as A computer is electrically connected to the optical probe body and the first movable module. The computer includes an output unit. The computer is used to activate the optical probe body to emit a light beam. The diameter of the light beam is smaller than the radius of the first borehole. The light beam irradiates the plate. At the same time, the computer controls the first power source to drive the fixing device to move so that the first borehole passes under the optical probe body. The first borehole is continuously irradiated by the light beam. The computer records multiple first reflection points from the light beam entering to leaving the first borehole and the reflection fixture, and generates a first borehole depth plane map based on each first reflection point. The first borehole depth plane map is output by the output unit.
2. The non-contact optical probe for measuring back-drilled hole profile depth according to claim 1, characterized in that: The plate body also has at least one second borehole, and there is a predetermined distance between the second borehole and the first borehole. When the first borehole passes under the optical probe body, the computer controls the first power source to drive the fixing device to move so that the second borehole passes under the optical probe body. The second borehole is continuously irradiated by the light beam. The computer records multiple second reflection points from the light beam entering to leaving the second borehole and the reflection fixture, and generates a second borehole depth plane map based on each second reflection point, and the second borehole depth plane map is output by the output unit.
3. The non-contact optical probe for measuring the depth of back-drilled hole profile according to claim 2, characterized in that: The plate body includes at least one first through hole and at least one second through hole, and the first drilled hole and the second drilled hole are drilled in the first through hole and the second through hole respectively, so that the first drilled hole and the second drilled hole overlap with the first through hole and the second through hole respectively, and the diameters of the first drilled hole and the second drilled hole are respectively larger than the first through hole and the second through hole; the thickness of the plate body, the depth of the first drilled hole and the second drilled hole, the eccentricity between the first drilled hole and the first through hole, and the eccentricity between the second drilled hole and the second through hole are inspected by the first drilled hole depth plan view and the second drilled hole depth plan view; the eccentricity is the distance between the center of the first through hole and the center of the first drilled hole, and the distance between the center of the second through hole and the center of the second drilled hole.
4. The non-contact optical probe for measuring back-drilled hole profile depth according to claim 2, characterized in that: Each first reflection point and each second reflection point are positions where the light beam irradiates the surface of the plate, is blocked inside the first borehole and the second borehole, and reflects the light beam back to the optical probe body. The computer records and calculates the position and distance of each first reflection point and the position and distance of each second reflection point, and connects each first reflection point and each second reflection point to form the first borehole depth plane diagram and each second borehole depth plane diagram.
5. The non-contact optical probe for measuring back-drilled hole profile depth according to claim 3, characterized in that: The computer further comprises an input unit, through which the coordinates of the first drilling hole and the second drilling hole and the moving route of the first moving module are input.
6. The non-contact optical probe for measuring the depth of back-drilled hole profile according to claim 5, characterized in that: The coordinates are the center of the first borehole and the center of the second borehole. When the first moving module moves the plate, the moving route is the diameter of the first borehole and the second borehole, so that the first borehole and the second borehole pass under the optical probe body.
7. A non-contact optical probe for measuring the depth of back-drilled hole profile, characterized in that: include: A fixing device is provided with a reflection fixture, at least one plate body is installed on the top surface of the reflection fixture, and the plate body includes at least one first drilling hole; At least one optical probe body, which is detachably mounted on a second movable module, the second movable module includes a second power source, and the second movable module is located above the fixing device; as well as A computer is electrically connected to the optical probe body and the second movable module, and the computer includes an output unit. The computer is used to activate the optical probe body to emit a light beam, and the diameter of the light beam is smaller than the radius of the first borehole. The light beam irradiates the plate and the computer controls the second power source to drive the optical probe body to move, so that the optical probe body passes over the first borehole. The first borehole is continuously irradiated by the light beam. The computer records multiple first reflection points of the light beam entering and leaving the first borehole and the reflection fixture, and generates a first borehole depth plane map based on each first reflection point, and the output unit outputs the first borehole depth plane map.
8. The non-contact optical probe for measuring back-drilled hole profile depth according to claim 7, characterized in that: The plate body also has at least one second borehole, and there is a predetermined distance between the second borehole and the first borehole. When the optical probe body passes over the first borehole, the computer controls the second power source to drive the optical probe body to move so that the optical probe body passes over the second borehole. The second borehole is continuously irradiated by the light beam. The computer records multiple second reflection points of the light beam entering and leaving the second borehole and the reflection fixture, and generates a second borehole depth plane map based on each second reflection point, and the second borehole depth plane map is output by the output unit.
9. The non-contact optical probe for measuring the depth of back-drilled hole profile according to claim 8, characterized in that: The plate body includes at least one first through hole and at least one second through hole, and the first drilled hole and the second drilled hole are drilled in the first through hole and the second through hole respectively, so that the first drilled hole and the second drilled hole overlap with the first through hole and the second through hole respectively, and the diameters of the first drilled hole and the second drilled hole are respectively larger than the first through hole and the second through hole; the thickness of the plate body, the depth of the first drilled hole and the second drilled hole, the eccentricity between the first drilled hole and the first through hole, and the eccentricity between the second drilled hole and the second through hole are inspected by the first drilled hole depth plan view and the second drilled hole depth plan view; the eccentricity is the distance between the center of the first through hole and the center of the first drilled hole, and the distance between the center of the second through hole and the center of the second drilled hole.
10. The non-contact optical probe for measuring the depth of back-drilled hole profile according to claim 8, characterized in that: Each first reflection point and each second reflection point are positions where the light beam irradiates the surface of the plate body, is blocked inside the first borehole and the second borehole, and reflects the light beam back to the optical probe body. The computer records and calculates the position and distance of each first reflection point and the position and distance of each second reflection point, and connects each first reflection point and each second reflection point to form the first borehole depth plane diagram and each second borehole depth plane diagram; the computer also includes an input unit, through which the coordinates of the first borehole and the second borehole and the moving route of the second moving module are input; the coordinates are the center of the first borehole and the center of the second borehole, and when the second moving module moves the optical probe body, the moving route is the diameter of the first borehole and the second borehole, so that the optical probe body passes over the first borehole and the second borehole.