Power exchange station thermal management controller based on single-chip microcomputer

Abstract

The invention provides a single-chip microcomputer-based battery swap station thermal management controller, which comprises a single-chip microcomputer, the single-chip microcomputer is in control connection with a power supply module, a communication module, an equipment control module and an AD signal acquisition module, the single-chip microcomputer adopts an STM32H7 series single-chip microcomputer as a core controller, and the single-chip microcomputer is connected with the power supply module, the communication module, the equipment control module and the AD signal acquisition module. The AD signal acquisition module is composed of a digital signal input channel circuit, a temperature sensor acquisition circuit, a liquid level sensor acquisition circuit and a pressure sensor acquisition circuit. The structure provided by the embodiment of the invention adopts a single chip microcomputer structure, and has the remarkable characteristics of high performance and low power consumption. The high performance of the system is reflected in that the system has a powerful processing core, high dominant frequency and rich instruction sets, and can quickly execute complex data processing tasks and control algorithm operation. And real-time analysis of a large amount of temperature data in the thermal management system of the battery swap station and implementation of complex strategies such as temperature prediction control based on a model can be dealt with.

Description

Technical Field

[0001] The present application relates to the field of controller technology, and in particular to a thermal management controller for a battery swap station based on a single-chip microcomputer. Background Art

[0002] Traditional thermal management systems for battery swap stations have many shortcomings. On the one hand, some thermal management systems use simple temperature control switches to control heat dissipation or heating equipment, which cannot be accurately adjusted according to the actual state of the battery and environmental conditions, resulting in energy waste and unsatisfactory thermal management effects. On the other hand, some existing thermal management systems lack intelligent control strategies, cannot monitor and predict temperature trends in real time, and respond slowly to sudden temperature anomalies. In addition, in terms of system integration and communication, traditional thermal management systems (PLC controller programming) often have problems such as poor compatibility, unstable data transmission, and insufficient data processing capabilities, which are not conducive to centralized management and remote monitoring of battery swap stations. Therefore, we propose a thermal management controller for battery swap stations based on a single-chip microcomputer. Summary of the invention

[0003] The present application provides a thermal management controller for a battery swap station based on a single chip microcomputer to solve the above-mentioned problems.

[0004] The present application provides a thermal management controller for a battery swap station based on a single chip microcomputer, comprising:

[0005] A single-chip microcomputer is controlled and connected with a power module, a communication module, a device control module and an AD signal acquisition module. The single-chip microcomputer adopts an STM32H7 series single-chip microcomputer as a core controller. The AD signal acquisition module is composed of a digital signal input channel circuit, a temperature sensor acquisition circuit, a liquid level sensor acquisition circuit and a pressure sensor acquisition circuit. The device control module includes a digital signal output channel circuit and a control output circuit.

[0006] Preferably, the communication module adopts multiple communication modes, including RS-485 bus and Wi-Fi wireless communication.

[0007] Preferably, a power conversion circuit is provided inside the power module, and the main power supply of the power module is divided into a 12V power supply and a 24V power supply. A reverse protection circuit is also provided inside the power module.

[0008] Preferably, the input ends of the temperature sensor acquisition circuit, the liquid level sensor acquisition circuit and the pressure sensor acquisition circuit are respectively connected to the temperature sensor, the liquid level sensor and the pressure sensor, and the output ends of the temperature sensor acquisition circuit, the liquid level sensor acquisition circuit and the pressure sensor acquisition circuit are communicatively connected to the input end of the digital signal input channel circuit, and the output end of the digital signal input channel circuit is connected to the input end of the single-chip microcomputer.

[0009] Preferably, the digital signal output channel circuit and the control output circuit are connected to the input and output terminals of the single chip microcomputer respectively.

[0010] Preferably, the 12V power supply is converted into a 4.3V power supply and a 3.3V power supply by a power conversion circuit, and the 4.3V power supply and the 3.3V power supply are used to power the communication module and the single-chip microcomputer respectively.

[0011] Preferably, the digital signal output channel circuit and the control output circuit respectively use a BTS4880R chip and a GP8401-TC50-EW chip, the communication module uses a MAX3485AESA+T chip and a SIT1022QTK chip, and the power module uses a TPS54540BDDAR chip.

[0012] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0013] The structure provided in the embodiment of the present application adopts a single-chip microcomputer structure with the remarkable characteristics of high performance and low power consumption. Its high performance is reflected in its powerful processing core, high main frequency and rich instruction set, which can quickly execute complex data processing tasks and control algorithm operations, and is sufficient to cope with the real-time analysis of a large amount of temperature data in the thermal management system of the battery swap station and the implementation of complex strategies such as model-based temperature prediction control. At the same time, its low power consumption characteristics help to reduce the energy consumption of the entire thermal management system during operation, improve energy utilization efficiency, and meet the needs of long-term stable operation and energy saving of battery swap stations; the single-chip microcomputer plays a key role in central coordination and control in the entire system, responsible for receiving and processing data information from each module, generating corresponding control instructions according to the preset thermal management control strategy, and then accurately regulating other modules to ensure the orderly operation of the thermal management system;

[0014] In order to ensure the power supply safety of the single-chip microcomputer controller, the main power supply of the power module is divided into 12V power supply and 24V power supply. The 24V power supply is mainly used for digital signal output, and the 12V power supply will be converted into 4.3V by the power conversion circuit for the 4G communication module and the 3.3V single-chip microcomputer power supply and single-chip microcomputer control signal. The power module is designed with 12V and 24V reverse protection circuits, using MOS tubes. The PN junction diode characteristics of the MOS tube are mainly used for power reverse protection. Its application: when the positive and negative poles of the battery are reversed, the MOS tube can automatically cut off the circuit to protect the circuit from damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0017] Figure 1 It is the overall principle diagram of the present invention;

[0018] Figure 2 It is a circuit diagram of the pressure sensor of the present invention;

[0019] Figure 3 It is a circuit diagram of the liquid level sensor of the present invention;

[0020] Figure 4 It is a temperature sensor acquisition circuit diagram of the present invention;

[0021] Figure 5 It is a circuit diagram of a digital signal input channel of the present invention;

[0022] Figure 6 The digital signal output channel circuit of the present invention;

[0023] Figure 7 is a control output circuit diagram of the present invention;

[0024] Figure 8 A circuit diagram of a communication module of the present invention;

[0025] Fig. 9 A circuit diagram of a communication module of the present invention;

[0026] Fig.10 A circuit diagram of a power module of the present invention;

[0027] Fig.11 A circuit diagram of a power module of the present invention;

[0028] Fig.12 A circuit diagram of a power module of the present invention;

[0029] Fig.13 This is a circuit diagram of a power module of the present invention. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0031] Various embodiments of the present application may exist in the form of a range. It should be understood that the description in the form of a range is only for convenience and simplicity and should not be understood as a hard limit to the scope of the present application; therefore, it should be considered that the range description has specifically disclosed all possible sub-ranges and single values ​​within the range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5 and 6, which are applicable regardless of the range. In addition, whenever a numerical range is indicated in the present application, it is meant to include any quoted numbers (fractions or integers) within the indicated range. Unless otherwise specified, various raw materials, reagents, instruments and equipment used in the present application, etc., can be purchased from the market or can be prepared by existing equipment.

[0032] In the present application, in the absence of any contrary description, the directional words used, such as "upper" and "lower", are specifically the directions of the drawings in the accompanying drawings. In addition, in the present application, the terms "include", "comprise", etc. refer to "including but not limited to". In the present application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. In the present application, "and / or" describes the association relationship of the associated objects, indicating that three relationships may exist, for example, A and / or B, which can represent: A exists alone, A and B exist at the same time, and B exists alone. Wherein A, B can be singular or plural. In the present application, "at least one" refers to one or more, and "plural" refers to two or more. "At least one", "at least one of the following" or similar expressions refer to any combination of these items, including any combination of singular items or plural items. For example, "at least one of a, b, or c" or "at least one of a, b and c" can both mean: a, b, c, ab, i.e. a and b, ac, bc or abc, where a, b, c can be single or plural, respectively.

[0033] like Figure 1-Figure 13As shown, the embodiment of the present application provides a thermal management controller for a battery swap station based on a single chip microcomputer, comprising:

[0034] A single-chip microcomputer, wherein the single-chip microcomputer is controlled and connected with a power module, a communication module, a device control module and an AD signal acquisition module. The single-chip microcomputer adopts an STM32H7 series single-chip microcomputer as a core controller. The AD signal acquisition module is composed of a digital signal input channel circuit, a temperature sensor acquisition circuit, a liquid level sensor acquisition circuit and a pressure sensor acquisition circuit. The device control module includes a digital signal output channel circuit and a control output circuit;

[0035] The communication module adopts a variety of communication methods, including RS-485 bus and Wi-Fi wireless communication.

[0036] The power module is provided with a power conversion circuit inside, and the main power supply of the power module is divided into a 12V power supply and a 24V power supply. The power module is also provided with a reverse protection circuit inside.

[0037] The input ends of the temperature sensor acquisition circuit, the liquid level sensor acquisition circuit and the pressure sensor acquisition circuit are respectively connected to the temperature sensor, the liquid level sensor and the pressure sensor, and the output ends of the temperature sensor acquisition circuit, the liquid level sensor acquisition circuit and the pressure sensor acquisition circuit are communicatively connected to the input end of the digital signal input channel circuit, and the output end of the digital signal input channel circuit is connected to the input end of the single-chip microcomputer.

[0038] The digital signal output channel circuit and the control output circuit are connected to the input and output terminals of the single chip computer respectively.

[0039] The 12V power supply is converted into a 4.3V power supply and a 3.3V power supply by a power conversion circuit. The 4.3V power supply and the 3.3V power supply are used to power the communication module and the single-chip microcomputer respectively.

[0040] The digital signal output channel circuit and the control output circuit respectively use the BTS4880R chip and the GP8401-TC50-EW chip, the communication module uses the MAX3485AESA+T chip and the SIT1022QTK chip, and the power module uses the TPS54540BDDAR chip.

[0041] Specifically, the pressure sensor acquisition circuit is connected by a pressure input interface to a resistor R53 and a cathode of a diode D17, the resistor R53 is connected in parallel to a resistor R60 and a resistor R54, the resistor R54 is connected to an output port and a capacitor C58, the anode of the diode D17, the resistor R60 and the capacitor C58 are grounded (such as Figure 2 shown);

[0042] The liquid level sensor acquisition circuit is connected to the resistor R123 by the liquid level input interface, the resistor R123 is connected to the pin 1 of the amplifier and the resistor R125, the resistor R125 and the pin 2 of the amplifier are grounded, the pin 3 and the pin 4 of the amplifier are connected, the pin 5 of the amplifier is connected to the 3.3V power supply, the pin 5 of the amplifier is connected to the output port, and the capacitor C114 and the bidirectional thyristor D47 are connected, one pin of the bidirectional thyristor D47 is grounded, and the other pin is connected to the capacitor C112, the capacitor C112 is grounded, and the capacitor C114 is grounded (such as Figure 3 shown);

[0043] The temperature sensor acquisition circuit is connected to the diode D35, capacitor C88, resistor R104 and resistor R96 by the temperature input interface, the resistor R96 is connected to the 3.3V power supply, the resistor R104 is connected to the output port and the capacitor C86, the diode D35, capacitor C88 and diode D35 are grounded (such as Figure 4 shown);

[0044] The digital signal input channel circuit transmits the data transmitted by the temperature sensor, liquid level sensor and pressure sensor connected to the temperature sensor acquisition circuit, liquid level sensor acquisition circuit and pressure sensor acquisition circuit respectively, and transmits the data to the single chip microcomputer (such as Figure 5 As shown), pins 1 and 2, pins 3 and 4, pins 5 and 6, and pins 7 and 6 of the digital signal input channel circuit chip are respectively connected to resistors and diodes, and the input ends of the resistors and diodes are connected to a module composed of a temperature sensor acquisition circuit, a liquid level sensor acquisition circuit, and a pressure sensor acquisition circuit, and pins 9 and 10, pins 11 and 12, pins 13 and 14, and pins 15 and 16 of the digital signal input channel circuit chip are respectively connected to capacitors and two resistors, and one of the two resistors is connected to a 3.3V power supply, and the output port of the other resistor is connected to a single-chip microcomputer;

[0045] The digital signal output channel circuit adopts the BTS4880R chip, the pin 3 of the BTS4880R chip is connected to the resistor R203, and the resistor R203 is grounded, the pin 6, pin 7, pin 8, pin 9, pin 10, pin 11, pin 12 and pin 13 of the BTS4880R chip are respectively connected to the resistor R211, the resistor R213, the resistor R217, the resistor R222, the resistor R226, the resistor R230, the resistor R234 and the resistor R236, the resistor R211, the resistor R2 13. The resistor R217, the resistor R222, the resistor R226, the resistor R230, the resistor R234 and the resistor R236 are connected to the resistor R209, the resistor R210, the resistor R212, the resistor R216, the resistor R221, the resistor R225, the resistor R229 and the resistor R233 respectively, and the resistor R209, the resistor R210, the resistor R212, the resistor R216, the resistor R221, the resistor R225, the resistor R229 and the resistor R233 are all grounded, and the resistors R211, R213 , resistor R217, resistor R222, resistor R226, resistor R230, resistor R234 and resistor R236 are also connected to resistor R199, resistor R200, resistor R201, resistor R202, resistor R244, resistor R243, resistor R242 and resistor R241 respectively, and the output ends of the resistors R199, resistor R200, resistor R201, resistor R202, resistor R244, resistor R243, resistor R242 and resistor R241 are connected to the microcontroller, and the BTS4880R Pins 21 and 22, pins 23 and 24, pins 25 and 26, pins 27 and 28, pins 29 and 30, pins 31 and 32, pins 33 and 34, and pins 35 and 36 of the chip are all connected to the signal output port, and are also connected to a diode and a capacitor coupler respectively, the anode of the diode is connected to the power supply, and pin 37 of the BTS4880R chip is connected to capacitor C140, capacitor C142 and a 24V power supply, and capacitors C140 and C142 are also connected to the power supply;

[0046] The chip pins 3 and 4 of the control output circuit are connected to the single-chip microcomputer through resistors 270 and 273 respectively, and the chip pin 5 of the control output circuit is connected to a 12V power supply and capacitor C50, and capacitor C50 is grounded, the chip pin 10 of the control output circuit is connected to capacitor C144, the chip pin 9 of the control output circuit is connected to capacitor C144 through resistor R271, the chip pins 7 and 8 of the control output circuit are connected to the control signal output port, the chip pin 7 of the control output circuit is connected to capacitor C146 and diode D90, and the chip pin 7 of the control output circuit is connected to a full-bridge circuit, and the chip pin 8 of the control output circuit is connected to capacitor C147 and diode D92, the capacitor C146, diode D90, capacitor C147 and diode D92 are connected to the chip pin 6 of the control output circuit (such as Figure 7 shown);

[0047] The communication module is mainly divided into 485 signal, LIN signal and CAN bus circuit design. In order to increase the multi-signal real-time performance of the device, the 485 signal is divided into multiple 485 buses. One 485 signal is only connected to several devices, which is convenient for the program to read data and send control instructions in a loop, and the signal sending delay time will not increase due to the large number of devices (such as Figure 8 );

[0048] The LIN signal also has such a design. Each LIN channel only connects 10 electronic two-way valves, which is convenient for better time allocation of the LIN schedule and increases the real-time performance of signal transmission. At the same time, the U215 double-pole double-position switch is designed to facilitate the setting of the master-slave device switching in the LIN bus (such as Fig. 9 );

[0049] The power module is designed with 12V and 24V reverse protection circuits. U109 and U112 are MOS tubes, which are used for power reverse protection mainly by utilizing the PN junction diode characteristics of the MOS tube. Its application: When the positive and negative poles of the battery are connected in reverse, the MOS tube can automatically cut off the circuit to protect the circuit from damage;

[0050] In order to ensure the power supply safety of the MCU controller, the main power supply of the power module is divided into 12V power supply and 24V power supply. The 24V power supply is mainly used for digital signal output, and the 12V power supply will be converted into 4.3V by the power conversion circuit for 4G communication module and 3.3V MCU power supply and MCU control signal (such as Fig.10 ,like Fig.11 ,like Fig.12 He Ru Fig.13 ).

[0051] The above is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. It will be apparent to those skilled in the art that various modifications to these embodiments are possible, and the general principles defined in the present application can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown in the present application, but will conform to the widest scope consistent with the principles and novel features applied for by the present application.

Claims

1. A thermal management controller for a battery swap station based on a single chip microcomputer, characterized in that: include: A single-chip microcomputer is controlled and connected with a power module, a communication module, a device control module and an AD signal acquisition module. The single-chip microcomputer adopts an STM32H7 series single-chip microcomputer as a core controller. The AD signal acquisition module is composed of a digital signal input channel circuit, a temperature sensor acquisition circuit, a liquid level sensor acquisition circuit and a pressure sensor acquisition circuit. The device control module includes a digital signal output channel circuit and a control output circuit.

2. According to the single chip microcomputer-based thermal management controller for a power swap station according to claim 1, it is characterized by: The communication module adopts a variety of communication methods, including RS-485 bus and Wi-Fi wireless communication.

3. According to the single chip microcomputer-based thermal management controller for a battery swap station according to claim 1, it is characterized in that: The power module is provided with a power conversion circuit inside, and the main power supply of the power module is divided into a 12V power supply and a 24V power supply. The power module is also provided with a reverse protection circuit inside.

4. The thermal management controller for a battery swap station based on a single chip microcomputer according to claim 1, characterized in that: The input ends of the temperature sensor acquisition circuit, the liquid level sensor acquisition circuit and the pressure sensor acquisition circuit are respectively connected to the temperature sensor, the liquid level sensor and the pressure sensor, and the output ends of the temperature sensor acquisition circuit, the liquid level sensor acquisition circuit and the pressure sensor acquisition circuit are communicatively connected to the input end of the digital signal input channel circuit, and the output end of the digital signal input channel circuit is connected to the input end of the single-chip microcomputer.

5. The thermal management controller for a battery swap station based on a single chip microcomputer according to claim 1, characterized in that: The digital signal output channel circuit and the control output circuit are connected to the input and output terminals of the single chip computer respectively.

6. The thermal management controller for a battery swap station based on a single chip microcomputer according to claim 3 is characterized in that: The 12V power supply is converted into a 4.3V power supply and a 3.3V power supply by a power conversion circuit. The 4.3V power supply and the 3.3V power supply are used to power the communication module and the single-chip microcomputer respectively.

7. The thermal management controller for a battery swap station based on a single chip microcomputer according to claim 1, characterized in that: The digital signal output channel circuit and the control output circuit respectively use the BTS4880R chip and the GP8401-TC50-EW chip, the communication module uses the MAX3485AESA+T chip and the SIT1022QTK chip, and the power module uses the TPS54540BDDAR chip.

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