Acoustic device and wireless communication device

Abstract

The application relates to an acoustic device and a wireless communication device. The acoustic device comprises an external terminal, a band-stop terminal and a band-pass terminal; a band-pass filter, one end of which is electrically connected to the band-pass terminal, and the other end of which is electrically connected to the external terminal; a band-stop filter, one end of which is electrically connected to the band-stop terminal, and the other end of which is electrically connected to the external terminal; and a filter capacitor, which is connected in parallel to the band-stop filter between the external terminal and the band-stop terminal. The application can effectively improve the insertion loss deterioration problem of the high-frequency band-pass part of the band-stop filter.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wireless communication, and in particular to an acoustic device and a wireless communication device. BACKGROUND

[0002] The wireless communication device can communicate based on multiple wireless communication modes of different frequency bands. In order to meet these communication modes, a band-pass filter and a band-stop filter need to be designed at the antenna end. However, due to the harmonic effect of the high-frequency end of the band-pass filter, the energy of the high-frequency band part in the passband of the band-stop filter is not easy to transmit in the main path, causing the insertion loss of the high-frequency band passband part of the band-stop filter to deteriorate. SUMMARY

[0003] Therefore, it is necessary to provide an acoustic device and a wireless communication device which can improve the problem of deteriorating insertion loss of the high-frequency band passband part of the band-stop filter.

[0004] An acoustic device, comprising:

[0005] an external terminal, a band-stop terminal, and a band-pass terminal;

[0006] a band-pass filter, one end of which is electrically connected to the band-pass terminal, and the other end of which is electrically connected to the external terminal;

[0007] a band-stop filter, one end of which is electrically connected to the band-stop terminal, and the other end of which is electrically connected to the external terminal;

[0008] a filter capacitor, which is connected in parallel between the external terminal and the band-stop terminal.

[0009] In one of the embodiments, the band-stop filter comprises at least one first acoustic resonator, and the band-pass filter comprises at least one second acoustic resonator,

[0010] The acoustic device comprises:

[0011] a conductive terminal layer, comprising the external terminal, the band-stop terminal, and the band-pass terminal;

[0012] a conductive device layer, comprising the first acoustic resonator, the second acoustic resonator, a conductive interconnection strip, and the filter capacitor, the first acoustic resonator and the second acoustic resonator being interconnected through the conductive interconnection strip, and the filter capacitor comprising a first capacitor electrode plate and a second capacitor electrode plate arranged oppositely, the first capacitor electrode plate being electrically connected to the external terminal, and the second capacitor electrode plate being electrically connected to the band-stop terminal.

[0013] In one embodiment, the band reject filter includes a plurality of first acoustic resonators connected in series, the second capacitor plate is connected to the first acoustic resonator closest to the external terminal, and the band reject filter is connected to the band pass filter through a common conductive interconnect.

[0014] In one embodiment, the conductive device layer further includes a common conductive pad, the band pass filter and the band reject filter are connected to the common conductive pad through different conductive interconnects, and the common conductive pad is electrically connected to the external terminal through a different conductive path from the filter capacitor.

[0015] In one embodiment, the acoustic device further includes a first inductor between the conductive terminal layer and the conductive device layer, the first inductor is electrically connected to the common conductive pad and the external terminal, respectively.

[0016] In one embodiment, the conductive device layer further includes:

[0017] a first conductive pad at an end of the first capacitor plate and electrically connected to the external terminal.

[0018] In one embodiment, the conductive device layer further includes:

[0019] a second conductive pad at an end of the second capacitor plate and electrically connected to the band reject terminal.

[0020] In one embodiment, the filter capacitor includes a planar capacitor or an acoustic resonator capacitor.

[0021] In one embodiment, the band reject filter includes at least one first acoustic resonator, the band pass filter includes at least one second acoustic resonator,

[0022] The acoustic device includes:

[0023] a conductive terminal layer including the external terminal, the band reject terminal, and the band pass terminal;

[0024] a conductive device layer including the first acoustic resonator, the second acoustic resonator, the conductive interconnect, the first conductive pad, and the first capacitor plate, the first acoustic resonator and the second acoustic resonator are interconnected through the conductive interconnect, the first conductive pad is at an end of the first capacitor plate and electrically connected to the external terminal,

[0025] An intermediate wiring layer is located between the conductive terminal layer and the conductive device layer, and includes a second conductive pad and the second capacitor plate, the second conductive pad is located at the end of the second capacitor plate and electrically connected to the band-stop terminal, and the second capacitor plate is oppositely arranged with the first capacitor plate to form the filter capacitor.

[0026] In one embodiment, the acoustic device further comprises:

[0027] A third inductor is connected in parallel with the filter capacitor.

[0028] A wireless communication device comprises:

[0029] The acoustic device described above;

[0030] An antenna is electrically connected to the external terminal.

[0031] The acoustic device and the wireless communication device described above, the filter capacitor is connected in parallel with the band-stop filter between the external terminal and the band-stop terminal, so that capacitive coupling can be performed between the external terminal and the band-stop terminal. Therefore, in the passband of the band-stop filter, the energy of the high frequency part can be transmitted through the second transmission path where the filter capacitor is located, even if it is not easy to pass through the first signal transmission path where the band-stop filter is located due to the harmonic effect of the high frequency end of the band-pass filter. Therefore, the deterioration of the insertion loss of the high frequency passband part of the band-stop filter can be effectively reduced. At the same time, other frequency bands in the passband of the band-stop filter can also be partially transmitted through the second transmission path, thereby reducing the transmission of these frequency band signals to the band-pass filter due to the harmonic effect of the high frequency end of the band-pass filter, thereby improving the isolation of the band-pass filter and the band-stop filter. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0033] Figure 1 A module block diagram of a wireless communication device of an embodiment;

[0034] Figure 2 A circuit schematic diagram of an acoustic device of an embodiment;

[0035] Figure 3 A comparison diagram of the passband insertion loss effect of the band-stop filter in the acoustic device of the embodiment of the present application and the conventional acoustic device;

[0036] Figure 4A perspective view schematic diagram of an acoustic device according to an embodiment;

[0037] Figure 5 A top view schematic diagram of a conductive device layer according to an embodiment;

[0038] Figure 6 A schematic diagram of an implementation of a filter capacitor according to an embodiment;

[0039] Figure 7 A schematic diagram of an implementation of a filter capacitor according to another embodiment;

[0040] Figure 8 A schematic diagram of an implementation of a filter capacitor according to yet another embodiment.

[0041] BRIEF DESCRIPTION OF DRAWINGS

[0042] 100 - conductive terminal layer; 110 - external terminal; 120 - band-stop terminal; 130 - band-pass terminal; 200 - conductive device layer, 210 - band-stop filter; 211 - first acoustic resonator; 212 - second inductor, 220 - band-pass filter; 221 - second acoustic resonator; 230 - filter capacitor; 231 - first capacitor plate; 232 - second capacitor plate; 240 - conductive interconnect strip; 250 - first conductive pad; 260 - second conductive pad; 270 - third conductive pad; 280 - common conductive pad, 300 - intermediate wiring layer; 310 - first inductor; 10 - conductive connection pad, 20 - conductive plug. DETAILED DESCRIPTION

[0043] For the purpose of the present application, the application will be described in relation to the enclosed drawings in which embodiments of the present application are shown. The application can be implemented in numerous ways, including the embodiments described herein. Rather, the present application should be construed as illustrative only of the application. There is no intention to limit the application to the precise forms disclosed herein.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application.

[0045] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. It is also possible in the present application that terms could be transposed or interchanged, without departing from the scope of the application.

[0046] It can be understood that "connection" in the following embodiments should be understood as "electrical connection", "communication connection" and the like if the circuits, modules, units and the like connected by the connection have transmission of electrical signals or data between each other.

[0047] It can be understood that "at least one" means one or more, and "multiple" means two or more. "At least part of an element" means part or all of the element.

[0048] As used herein, the singular forms "a", "an" and "the" can include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "comprise / comprising" or "have / having" or the like specifies the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but does not exclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in the specification includes any and all combinations of the related listed items.

[0049] In one embodiment, a wireless communication device is provided.

[0050] As an example, the wireless communication device can communicate based on multiple wireless communication modes such as a CELL communication mode, a WI-FI communication mode, and a GPS communication mode.

[0051] Referring to Figure 1 The wireless communication device includes an acoustic device 1 and an antenna 2.

[0052] In one embodiment, referring to Figure 2 An acoustic device is provided, which includes an external terminal 110, a band-stop terminal 120, a band-pass terminal 130, a band-pass filter 220, a band-stop filter 210, and a filter capacitor 230.

[0053] The external terminal 110, the band-stop terminal 120, and the band-pass terminal 130 are terminals for connecting with external devices. The external terminal 110 can be connected with an antenna or the like. The band-stop terminal 120 and the band-pass terminal 130 can receive external signals or transmit signals to the outside.

[0054] The band-pass filter 220 is used to pass a certain range of carrier frequencies. The band-stop filter 210 is used to limit the passage of a certain range of carrier frequencies. As an example, the stop band of the band-stop filter 210 can be the pass band of the band-pass filter 220, and the pass band of the band-stop filter 210 can be the stop band of the band-pass filter 220.

[0055] The band-pass filter 220 is electrically connected to the band-pass terminal 130 at one end and to the external terminal 110 at the other end. An external signal enters the band-pass filter 220 from the band-pass terminal 130, then is transmitted to the antenna through the external terminal 110, and is finally emitted by the antenna. Conversely, a signal from the antenna can also enter the band-pass filter 220 through the external terminal 110, and then be output through the band-pass terminal 130.

[0056] The band-stop filter 210 is electrically connected to the band-stop terminal 120 at one end and to the external terminal 110 at the other end. An external signal enters the band-stop filter 210 from the band-stop terminal 120, then is transmitted to the antenna through the external terminal 110, and is finally emitted by the antenna. Conversely, a signal from the antenna can also enter the band-stop filter 210 through the external terminal 110, and then be output through the band-stop terminal 120.

[0057] As an example, the acoustic device can include a two-port combiner. The band-pass filter 220 and the band-stop filter 210 can simultaneously receive an external signal. Also, the signals that pass through the band-pass filter 220 and the band-stop filter 210 can be simultaneously transmitted to the external terminal 110.

[0058] Of course, the acoustic device is not limited to being a two-port combiner. The band-pass filter 220 and the band-stop filter 210 can work simultaneously or not, and there is no limitation here.

[0059] The filter capacitor 230 can include one capacitor or a plurality of capacitors. The plurality of capacitors can be arranged in series, in parallel, or in a combination of series and parallel.

[0060] The filter capacitor 230 and the band-stop filter 210 are connected in parallel between the external terminal 110 and the band-stop terminal 120, so that capacitive coupling can be performed between the external terminal 110 and the band-stop terminal 120. At this time, there are two signal transmission paths between the external terminal 110 and the band-stop terminal 120. The two signal transmission paths can be a first signal transmission path and a second signal transmission path, respectively. The first signal transmission path can include the external terminal 110, the band-stop filter 210, and the band-stop terminal 120. The second signal transmission path can include the external terminal 110, the filter capacitor 230, and the band-stop terminal 120.

[0061] At this time, in the passband of the band-stop filter 210, a signal can be transmitted through the first signal transmission path or the second signal transmission path.

[0062] Therefore, in the passband of the bandstop filter 210, the energy of the high frequency band portion can be transmitted through the second transmission path even if it is not easily transmitted through the first signal transmission path due to the harmonic effect of the high frequency end of the bandpass filter 220, so that the deterioration of the insertion loss of the high frequency band passband portion of the bandstop filter 210 can be effectively reduced.

[0063] As an example, the stopband of the bandstop filter 210 can include 1.166GHz-1.187GHz. The passband of the bandstop filter 210 can include 0.617GHz-0.96GHz and 1.427GHz-5GHz. Meanwhile, the passband of the bandpass filter 220 can include 1.166GHz-1.187GHz. The stopband of the bandpass filter 220 can include 0.617GHz-0.96GHz and 1.427GHz-5GHz.

[0064] At this time, the high frequency band portion (such as 4GHz-5GHz) in the passband of the bandstop filter 210 can be transmitted through the second transmission path including the filter capacitor 230, so that the deterioration of the insertion loss of the high frequency band passband portion of the bandstop filter 210 can be effectively reduced.

[0065] Meanwhile, other frequency bands (such as 1.55GHz-1.6GHz) in the passband of the bandstop filter 210 can also be partially transmitted through the second transmission path, so that the transmission of the signals of these frequency bands to the bandpass filter 220 due to the harmonic effect of the high frequency end of the bandpass filter 220 is reduced, so that the isolation of the bandpass filter 220 and the bandstop filter 210 can be improved.

[0066] Meanwhile, please refer to Figure 3 , Figure 3 The passband insertion loss comparison chart of the bandstop filter 210 in the implementation scheme of the present embodiment, in which the filter capacitor 230 is provided between the external terminal 110 and the bandstop terminal 120 (solid line), and the implementation scheme of the conventional manner, in which the filter capacitor 230 is not provided between the external terminal 110 and the bandstop terminal 120 (dashed line). It can be seen that the present embodiment can effectively reduce the deterioration of the insertion loss of the high frequency band passband portion of the bandstop filter 210, and improve the isolation of the bandpass filter 220 and the bandstop filter 210.

[0067] In one embodiment, please refer to Figure 4 , the acoustic device includes a conductive terminal layer 100 and a conductive device layer 200.

[0068] As an example, the acoustic device can include a substrate and a plurality of conductive trace layers located on the substrate. The plurality of conductive trace layers can be spaced apart by a dielectric layer. The conductive terminal layer 100 can be the conductive trace layer located at the bottommost layer. The conductive device layer 200 can be the conductive trace layer located at the topmost layer.

[0069] Referring to Figure 4 The conductive terminal layer 100 includes the external terminal 110, the band-stop terminal 120, and the band-pass terminal 130. In addition, the conductive terminal layer 100 can also include a ground terminal 140, etc. The external terminal 110, the band-stop terminal 120, the band-pass terminal 130, and the ground terminal 140, etc. can be different terminals formed by patterning the same conductive material layer.

[0070] Meanwhile, the band-stop filter 210 includes at least one first acoustic resonator 211. The band-pass filter 220 includes at least one second acoustic resonator 221. The first acoustic resonator 211 and the second acoustic resonator 221 can both be located in the conductive device layer 200.

[0071] Referring to Figure 5 All the first acoustic resonators 211 in the band-stop filter 210 can be located in the conductive device layer 200.

[0072] As an example, the band-stop filter 210 can include two first acoustic resonators 211 connected in series between the band-stop terminal 120 and the band-stop terminal 120.

[0073] Meanwhile, as an example, the band-stop filter 210 can also include a second inductor 212. The second inductor 212 can be electrically connected between a node between the two first acoustic resonators 211 and a ground terminal. The second inductor 212 can be located in another conductive trace layer between the conductive terminal layer 100 and the conductive device layer 200.

[0074] The band-pass filter 220 includes at least one second acoustic resonator 221 connected in series, and can also include at least one second acoustic resonator 221 connected in parallel. All the second acoustic resonators 221 in the band-pass filter 220 can be located in the conductive device layer 200.

[0075] As an example, the band-pass filter 220 can include three second acoustic resonators 221 connected in series between the band-stop terminal 120 and the band-stop terminal 120, and also include three second acoustic resonators 221 connected in parallel.

[0076] Meanwhile, the conductive device layer 200 also includes a conductive interconnection strip 240 and a filter capacitor 230.

[0077] The first acoustic resonator 211 and the second acoustic resonator 221 are interconnected through the conductive interconnection strip 240.

[0078] As an example, when a plurality of first acoustic resonators 211 are included in the bandpass filter 220, each of the first acoustic resonators 211 can be connected in series and / or in parallel by the conductive interconnection strips 240. Meanwhile, the bandpass filter 220 and the bandstop filter 210 can also be interconnected by the conductive interconnection strips 240.

[0079] The filter capacitor 230 includes a first capacitor plate 231 and a second capacitor plate 232 arranged opposite to each other. The size of the filter capacitor 230 can be adjusted by changing the size of the distance between the first capacitor plate 231 and the second capacitor plate 232.

[0080] The filter capacitor 230 can be implemented in various ways, which are not limited herein. As an example, the filter capacitor 230 can include a planar capacitor (see Figure 5 or Figure 6 ) or an acoustic resonator capacitor 290 (see Figure 7 ). The acoustic resonator capacitor can include a surface acoustic wave filter capacitor or a bulk acoustic wave filter capacitor, etc.

[0081] Meanwhile, the first capacitor plate 231 is electrically connected to the external terminal 110, and the second capacitor plate 232 is electrically connected to the bandstop terminal 120.

[0082] As an example, the conductive device layer 200 can further include a first conductive pad 250. The first conductive pad 250 is located at the end of the first capacitor plate 231 and is electrically connected to the external terminal 110, thereby electrically connecting the first capacitor plate 231 to the external terminal 110.

[0083] Specifically, the first conductive pad 250 and the external terminal 110 can be arranged opposite to each other and can be interconnected by the conductive connection pads 10 in other conductive wiring layers between the conductive device layer 200 and the conductive terminal layer 100 and the conductive plugs 20 between the conductive wiring layers.

[0084] In other examples, the end of the first capacitor plate 231 can also not be provided with the first conductive pad 250. At this time, the end of the first capacitor plate 231 can be arranged opposite to the external terminal 110.

[0085] As an example, the conductive device layer 200 can further include a second conductive pad 260. The second conductive pad 260 is located at the end of the second capacitor plate 232 and is electrically connected to the bandstop terminal 120, thereby electrically connecting the second capacitor plate 232 to the bandstop terminal 120.

[0086] Specifically, the second conductive pad 260 can be arranged opposite to the stopband terminal 120, and the two can be connected to each other through the conductive connection pads 10 in other conductive trace layers between the conductive device layer 200 and the conductive terminal layer 100 and the conductive plugs 20 between the conductive trace layers.

[0087] In other examples, the end of the second capacitor plate 232 can also not be provided with the second conductive pad 260. At this time, the end of the second capacitor plate 232 can be arranged opposite to the stopband terminal 120.

[0088] In addition, as an example, the conductive device layer 200 can also include a third conductive pad 270. The third conductive pad 270 can be arranged opposite to the passband terminal 130, and the two can be connected to each other through the conductive connection pads 10 in other conductive trace layers between the conductive device layer 200 and the conductive terminal layer 100 and the conductive plugs 20 between the conductive trace layers. At the same time, the third conductive pad 270 can be connected to the second acoustic filter of the passband filter 220 away from the common conductive pad 280 through the conductive interconnection strip 240.

[0089] In the present embodiment, the filter capacitor 230 is arranged in the conductive device layer 200 in which the first acoustic resonator 211 of the stopband filter 210 and the second acoustic resonator 221 of the passband filter 220 are arranged, so that in the process of manufacturing the acoustic device, only the conductive device layer 200 needs to be finely processed, and the processing fineness requirement of other layers can be relatively reduced, thereby reducing the process cost and improving the process efficiency.

[0090] In other embodiments, the filter capacitor 230 can also be arranged in other conductive trace layers between the conductive device layer 200 and the conductive terminal layer 100.

[0091] In one embodiment, please refer to Figure 5 The stopband filter 210 includes a plurality of first acoustic resonators 211 connected in series. The second capacitor plate 232 is connected to the first acoustic resonator 211 close to the external terminal 110 and is connected to the stopband terminal 120 at the same time.

[0092] Specifically, in the stopband filter 210, the first acoustic resonator 211 connected to the stopband terminal 120 can be closer to the external terminal 110 than the other first acoustic resonators 211. At this time, the second capacitor plate 232 is connected to the first acoustic resonator 211 close to the external terminal 110, and the first capacitor plate 231 is connected to the external terminal 110 at the same time, thereby facilitating the arrangement of the filter capacitor 230.

[0093] In one embodiment, please refer to Figure 5The conductive device layer 200 further includes a common conductive pad 280, and the bandpass filter 220 and the bandstop filter 210 are connected to the common conductive pad 280 through different conductive interconnection strips 240. At this time, the common conductive pad 280 can collect signals of the bandpass filter 220 and the bandstop filter 210.

[0094] Meanwhile, the common conductive pad 280 and the filter capacitor 230 are electrically connected to the external terminal 110 through different conductive paths.

[0095] As an example, the acoustic device further includes a first inductor 310 between the conductive terminal layer 100 and the conductive device layer 200. The first inductor 310 has two ends electrically connected to the common conductive pad 280 and the external terminal 110, respectively.

[0096] Specifically, the first inductor 310 can be located in other conductive wiring layers between the conductive terminal layer 100 and the conductive device layer 200, and the two ends of the first inductor 310 can be electrically connected to the common conductive pad 280 and the external terminal 110, respectively, through different wirings on the conductive wiring layers where the first inductor 310 is located, conductive connection pads 10 in other conductive wiring layers, and conductive plugs 20 between the conductive wiring layers.

[0097] As an example, the conductive device layer 200 includes a second conductive pad 260, a third conductive pad 270, and conductive interconnection strips 240.

[0098] Referring to FIG. 1, when an external signal enters from the bandstop terminal 120, the signal is transmitted from the second conductive pad 260 to the left first acoustic resonator 211, and then transmitted to the right first acoustic resonator 211 through the conductive interconnection strip 240 and the second inductor 212 between the two first acoustic resonators 211. The two first acoustic resonators 211 generate two bandstop zeros, and the signal is finally transmitted to the common conductive pad 280.

[0099] Similarly, when an external signal enters from the bandpass terminal 130, the signal passes through the third conductive pad 270 and then sequentially passes through each second acoustic resonator 221 through the conductive interconnection strip 240. Through the filtering effect of each second acoustic resonator, the signal is finally collected to the common conductive pad 280. Then, the signals of the bandpass filter 220 and the bandstop filter 210 are jointly transmitted by the common conductive pad 280 to the external terminal 110 through the first inductor 310, and finally connected to the antenna for transmission.

[0100] At this time, between the external terminal 110 and the bandstop terminal 120, the first signal transmission path can include the external terminal 110, the common conductive pad 280, the bandstop filter 210, and the bandstop terminal 120. The second signal transmission path can include the external terminal 110, the first capacitor plate 231, the second capacitor plate 232, and the bandstop terminal 120.

[0101] At this time, when the energy of the high frequency band portion in the passband of the band-stop filter 210 is not easily transmitted through the transmission path of the external terminal 110, the common conductive pad 280, the band-stop filter 210, and the band-stop terminal 120 due to the harmonic effect of the high frequency end of the band-pass filter 220, it can be transmitted through the transmission path of the external terminal 110, the first capacitor plate 231, the second capacitor plate 232, and the band-stop terminal 120.

[0102] In one embodiment, referring to Figure 8 The acoustic device includes a conductive terminal layer 100, a conductive device layer 200, and an intermediate wiring layer 300.

[0103] As an example, the acoustic device can include a substrate and a plurality of conductive wiring layers located on the substrate. The plurality of conductive wiring layers can be spaced apart by a dielectric layer. The conductive terminal layer 100 can be the conductive wiring layer located at the bottommost layer. The conductive device layer 200 can be the conductive wiring layer located at the topmost layer. The intermediate wiring layer 300 can be one of the conductive wiring layers between the conductive terminal layer 100 and the conductive device layer 200.

[0104] The conductive terminal layer 100 includes an external terminal 110, a band-stop terminal 120, and a band-pass terminal 130.

[0105] The band-stop filter 210 includes at least one first acoustic resonator 211, and the band-pass filter 220 includes at least one second acoustic resonator 221. The first acoustic resonator 211 and the second acoustic resonator 221 can be located in the conductive device layer 200.

[0106] Meanwhile, the conductive device layer 200 can further include a conductive interconnection strip 240, a first conductive pad 250, and a first capacitor plate 231. The first acoustic resonator 211 and the second acoustic resonator 221 are interconnected by the conductive interconnection strip 240, the first conductive pad 250 is located at the end of the first capacitor plate 231, and is electrically connected to the external terminal 110.

[0107] The first acoustic resonator 211, the second acoustic resonator 221, the conductive interconnection strip 240, the first conductive pad 250, and the first capacitor plate 231 are similar to the foregoing embodiments and will not be described again here.

[0108] The difference between the foregoing embodiment and the present embodiment is that, in the present embodiment, the second conductive pad 260 and the second capacitor plate 232 are not located in the conductive device layer 200, but are arranged in the intermediate wiring layer 300 between the conductive terminal layer 100 and the conductive device layer 200. The intermediate wiring layer 300 comprises the second conductive pad 260 and the second capacitor plate 232, the second conductive pad 260 is located at the end of the second capacitor plate 232 and is electrically connected to the band-stop terminal 120. The second capacitor plate 232 is arranged opposite to the first capacitor plate 231 to form the filter capacitor 230.

[0109] At this time, the filter capacitor 230 is a three-dimensional capacitor structure, and the capacitance value can be adjusted by the front area of the first capacitor plate 231 and the second capacitor plate 232 in the device thickness direction.

[0110] Of course, the filter capacitor 230 can also be other forms of three-dimensional capacitor structures. For example, the second conductive pad 260 and the second capacitor plate 232 can also be arranged in the conductive device layer 200, and the first conductive pad 250 and the first capacitor plate 231 are arranged in the intermediate wiring layer 300, and so on.

[0111] In one embodiment, the acoustic device further comprises a third inductor (not shown). The third inductor is connected in parallel with the filter capacitor 230.

[0112] The third inductor can comprise one inductor or a plurality of inductors coupled to each other.

[0113] The third inductor can be inductively coupled between the external terminal 110 and the band-stop terminal 120. At this time, in addition to the first signal transmission path and the second signal transmission path, a signal transmission path can be added between the external terminal 110 and the band-stop terminal 120.

[0114] At this time, in the passband of the band-stop filter 210, the signal can be transmitted through more transmission paths, so that the deterioration of the insertion loss of the high-frequency passband part of the band-stop filter 210 can be more effectively reduced.

[0115] In the description of the present specification, the description referring to the terms "some embodiments", "other embodiments", and the like means that the specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. The illustrative description of the above terms in the present specification does not necessarily refer to the same embodiment or example.

[0116] The technical features of the above-described embodiments can be combined in any manner. In order to make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, however, as long as the combinations of the technical features do not contradict each other, they should be considered within the scope of the present specification.

[0117] The above-described embodiments are merely illustrative of several embodiments of the present application, which are described in more detail and in a specific manner, but should not be construed as limiting the scope of the present application. It should be noted that, for those of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. An acoustic device, characterized in that, include: External terminals, resistive terminals, and pass-through terminals; A bandpass filter, one end of which is electrically connected to the bandpass terminal, and the other end of which is electrically connected to the external terminal; A band-stop filter, one end of which is electrically connected to the band-stop terminal, and the other end of which is electrically connected to the external terminal; A filter capacitor is connected in parallel with the band-stop filter between the external terminal and the band-stop terminal; There are two signal transmission paths between the external terminal and the band-stop terminal. The two signal transmission paths are a first signal transmission path and a second signal transmission path. The first signal transmission path includes an external terminal, a band-stop filter, and a band-stop terminal. The second signal transmission path includes an external terminal, a filter capacitor, and a band-stop terminal. The stopband of the band-stop filter is the passband of the band-pass filter, and the passband of the band-stop filter is the stopband of the band-pass filter. In the passband of the band-stop filter, the energy of the high-frequency band is suppressed by the band-pass filter in the first signal transmission path, and the energy of the high-frequency band is transmitted through the second transmission path.

2. The acoustic device according to claim 1, characterized in that, The band-stop filter includes at least one first acoustic resonator, and the band-pass filter includes at least one second acoustic resonator. The acoustic device includes: The conductive terminal layer includes the external terminal, the resistive terminal, and the pass-through terminal; The conductive device layer includes a first acoustic resonator, a second acoustic resonator, a conductive interconnect strip, and a filter capacitor. The first acoustic resonator and the second acoustic resonator are interconnected through the conductive interconnect strip. The filter capacitor includes a first capacitor plate and a second capacitor plate disposed opposite to each other. The first capacitor plate is electrically connected to the external terminal, and the second capacitor plate is electrically connected to the stop terminal.

3. The acoustic device according to claim 2, characterized in that, The band-stop filter includes multiple first acoustic resonators connected in series. The second capacitor plate is in contact with the first acoustic resonator near the external terminal and is connected to the band-stop terminal at the same time as the first acoustic resonator.

4. The acoustic device according to claim 2, characterized in that, The conductive device layer also includes a common conductive pad. The bandpass filter and the bandstop filter are connected to the common conductive pad through different conductive interconnects. The common conductive pad and the filter capacitor are electrically connected to the external terminal through different conductive paths.

5. The acoustic device according to claim 4, characterized in that, The acoustic device further includes a first inductor located between the conductive terminal layer and the conductive device layer, with the two ends of the first inductor electrically connected to the common conductive pad and the external terminal, respectively.

6. The acoustic device according to claim 2, characterized in that, The conductive device layer further includes: The first conductive pad is located at the end of the first capacitor plate and is electrically connected to the external terminal.

7. The acoustic device according to claim 2, characterized in that, The conductive device layer further includes: The second conductive pad is located at the end of the second capacitor plate and is electrically connected to the resistive terminal.

8. The acoustic device according to claim 1 or 2, characterized in that, The filter capacitor includes a planar capacitor or an acoustic resonator capacitor.

9. The acoustic device according to claim 1, characterized in that, The band-stop filter includes at least one first acoustic resonator, and the band-pass filter includes at least one second acoustic resonator. The acoustic device includes: The conductive terminal layer includes the external terminal, the resistive terminal, and the pass-through terminal; The conductive device layer includes a first acoustic resonator, a second acoustic resonator, a conductive interconnect strip, a first conductive pad, and a first capacitor plate. The first acoustic resonator and the second acoustic resonator are interconnected through the conductive interconnect strip. The first conductive pad is located at the end of the first capacitor plate and is electrically connected to the external terminal. The intermediate trace layer is located between the conductive terminal layer and the conductive device layer, and includes a second conductive pad and a second capacitor plate. The second conductive pad is located at the end of the second capacitor plate and is electrically connected to the resistive terminal. The second capacitor plate is disposed opposite to the first capacitor plate to form the filter capacitor.

10. The acoustic device according to claim 1, characterized in that, The acoustic device also includes: The third inductor is connected in parallel with the filter capacitor.

11. A wireless communication device, characterized in that, include: The acoustic device according to any one of claims 1-10; The antenna is electrically connected to the external terminal.

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