A smart phone with a rear cover touch structure

Abstract

The present invention discloses a smart phone with a rear cover touch structure. In the present invention, the touch component adopts a magnetic connection method to achieve stable signal transmission and power supply with the smart phone body, ensuring high sensitivity and reliability of touch operations; the heat dissipation system realizes flexible heat conduction through the extrusion bumps made of silicone material and the elastic heat conduction strips, and the expansion blocks made of thermally expandable polymer material push the heat dissipation deformation sheet to deform, dynamically opening the heat dissipation holes to enhance the air convection heat dissipation efficiency; at the same time, the color marking coating on the heat dissipation deformation sheet provides an intuitive temperature status indication function, which can remind the user to stop using and disassemble it for heat dissipation when it is overheated. The overall design solves the heat dissipation obstacle problem of the touch component while ensuring the heat dissipation efficiency, safety and stability of the touch function of the device, and has the remarkable advantages of simple structure, reliable performance and strong heat dissipation and touch compatibility.

Description

Technical Field

[0001] The present invention relates to the technical field of smart phones, and more specifically, to a smart phone with a touch structure on the back cover. Background Art

[0002] The back cover of smart phones has gradually been given more functions, and a touch component is installed to realize functions such as multi-finger touch and gesture operation, further expanding the interaction mode between users and devices. This design not only improves the functionality of smart phones, but also provides users with a more flexible and convenient operation experience. Especially in scenarios such as games and office work, the back cover touch function can significantly enhance the user's usage efficiency and immersion, becoming an important direction for the function expansion of smart phones.

[0003] However, in addition to being a part of the device structure, the back cover of a smart phone also undertakes an important heat dissipation function, releasing internal heat to the external air by contacting the external environment. In the existing designs, a touch module is fixedly installed on the back cover, and the coverage of the touch component will hinder the normal transfer of heat, resulting in a decline in the heat dissipation performance of the device. The electrical components of the touch module will also generate additional heat during operation, further exacerbating the heat accumulation problem of the device. If the heat dissipation design is insufficient, it will not only affect the performance of the device and the stability of the touch module, but may also lead to a shortened service life of the whole machine.

[0004] Therefore, in view of the above technical problems, it is necessary to provide a smart phone with a touch structure on the back cover. Summary of the Invention

[0005] The purpose of the present invention is to provide a smart phone with a touch structure on the back cover to solve the above problems.

[0006] To achieve the above purpose, the technical solution provided by an embodiment of the present invention is as follows:

[0007] A smart phone with a touch structure on the back cover includes: a smart phone body, a touch component, a touch integration block, and a mounting component. The touch component is magnetically mounted at one end of the smart phone body; the touch component includes a touch integration block and a mounting component. The touch integration block is embedded on the mounting component, and a plurality of metal contacts are arranged on the touch integration block for signal transmission and power supply with the smart phone body; the touch integration block includes a protective housing, and a touch sensing layer, a light guide plate, and a control circuit board electrically connected to the touch sensing layer are installed in the protective housing; the mounting component includes a mounting frame, a heat dissipation plate is installed on the inner wall of the mounting frame, a plurality of uniformly distributed heat dissipation holes are formed in the heat dissipation plate, and a heat dissipation component is installed in the heat dissipation holes.

[0008] As a further improvement of the present invention, a plurality of uniformly distributed extrusion bumps are installed at the bottom end of the heat dissipation plate, and the corresponding shape of the extrusion bumps is set to be spherical.

[0009] As a further improvement of the present invention, the heat dissipation component includes heat conduction columns arranged in the heat dissipation holes. A plurality of uniformly distributed elastic heat conduction strips are fixedly connected to the bottom ends of the heat conduction columns, and the corresponding shapes of the plurality of elastic heat conduction strips are set to be frustum-shaped.

[0010] As a further improvement of the present invention, the corresponding materials of the extrusion bumps and the elastic heat conduction strips are both set to be silicone materials.

[0011] As a further improvement of the present invention, a plurality of uniformly distributed heat conduction rods are installed outside the heat conduction columns, and one ends of the plurality of heat conduction rods far away from the heat conduction columns are all connected to the inner wall of the heat dissipation holes.

[0012] As a further improvement of the present invention, an expansion block is installed at the top end of the heat conduction column. The material of the expansion block is set to be a thermally expandable polymer material, and the expansion temperature range of the expansion block is 40 - 80 °C.

[0013] As a further improvement of the present invention, a heat dissipation deformation sheet is installed at the top end of the heat dissipation plate and outside the surrounding of the heat dissipation holes, and the center of the heat dissipation deformation sheet abuts against the expansion block.

[0014] As a further improvement of the present invention, a plurality of uniformly distributed heat dissipation holes are formed in the heat dissipation deformation sheet. The heat dissipation holes are in a sealed state due to the self-extrusion force of the heat dissipation deformation sheet in the non-deformed state of the heat dissipation deformation sheet, and the heat dissipation holes are exposed when the heat dissipation deformation sheet deforms.

[0015] As a further improvement of the present invention, a color marking coating is applied on the heat dissipation deformation sheet. When the heat dissipation deformation sheet expands to different degrees, different colors are sequentially displayed. The color marking coating is a multi-layer structure, including a first color layer, a second color layer, and a third color layer coated in sequence. The first color layer covers the outermost layer. When the heat dissipation deformation sheet expands, the first color layer is gradually stretched or peeled off, exposing the second color layer below, and the third color layer is displayed when further expanding.

[0016] As a further improvement of the present invention, the thicknesses of the multiple color layers in the color marking coating are 10 - 50 microns.

[0017] Compared with the prior art, the advantages of the present invention are as follows:

[0018] This solution combines a touch integrated circuit with a heat dissipation system. Aiming at the problem of the hindrance to the heat dissipation of the rear cover caused by the touch module, through optimizing the structural design, the compatibility between the touch function and efficient heat dissipation is achieved. The touch component adopts a magnetic connection method to achieve stable signal transmission and power supply with the main body of the smart phone, ensuring the high sensitivity and reliability of touch operations. The heat dissipation system realizes flexible heat conduction through the extrusion bumps and elastic heat conduction strips made of silica gel material. The expansion block made of thermally expandable polymer material pushes the heat dissipation deformation sheet to deform, dynamically opening the heat dissipation holes to enhance the heat dissipation efficiency of air convection. At the same time, the color marking coating on the heat dissipation deformation sheet provides an intuitive temperature status indication function, which can remind the user to stop using and disassemble it for heat dissipation when it is overheated. The overall design solves the problem of heat dissipation hindrance of the touch component while ensuring the heat dissipation efficiency, safety and stability of the touch function of the device, and has the significant advantages of simple structure, reliable performance and strong compatibility between heat dissipation and touch. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a three-dimensional structural schematic diagram of the present invention;

[0020] Figure 2 is a three-dimensional structural schematic diagram of the touch component of the present invention;

[0021] Figure 3 is a side cross-sectional structural schematic diagram of the touch component of the present invention;

[0022] Figure 4 is of the present invention Figure 3 structural schematic diagram at position A in;

[0023] Figure 5 is a structural schematic diagram of the heat dissipation component of the present invention;

[0024] Figure 6 is a structural schematic diagram of the heat dissipation component of the present invention during heat dissipation.

[0025] Explanation of the reference numerals in the figures:

[0026] 1. Main body of the smart phone; 2. Touch component; 3. Touch integrated circuit; 4. Installation component; 5. Heat dissipation component; 41. Installation frame; 42. Heat dissipation plate; 43. Extrusion bump; 44. Heat dissipation hole; 51. Heat conduction column; 52. Elastic heat conduction strip; 53. Heat conduction rod; 54. Expansion block; 55. Heat dissipation deformation sheet. DETAILED DESCRIPTION OF THE INVENTION

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention. Embodiment

[0028] Please refer to Figures 1-6 , a smart phone with a rear cover touch structure, including: a smart phone main body 1, a touch component 2, a touch integrated block 3 and a mounting component 4. One end of the smart phone main body 1 is magnetically mounted with the touch component 2; the touch component 2 includes a touch integrated block 3 and a mounting component 4. The touch integrated block 3 is embedded on the mounting component 4. A plurality of metal contacts are arranged on the touch integrated block 3 for realizing signal transmission and power supply with the smart phone main body 1; the touch integrated block 3 includes a protective housing, and a touch sensing layer, a light guide plate and a control circuit board electrically connected to the touch sensing layer are installed in the protective housing; the mounting component 4 includes a mounting frame 41, a heat dissipation plate 42 is installed on the inner wall of the mounting frame 41, a plurality of uniformly distributed heat dissipation holes 44 are formed in the heat dissipation plate 42, and a heat dissipation component 5 is installed in the heat dissipation holes 44.

[0029] Among them, the touch integrated block 3 realizes signal transmission and power supply connection with the smart phone main body 1 through a plurality of metal contacts. The metal contacts are tightly attached to the smart phone main body 1 by magnetic attraction to ensure stable electrical connection and reliable touch response. The protective housing of the touch integrated block 3 integrates a touch sensing layer, a light guide plate and a control circuit board electrically connected to the touch sensing layer. The touch sensing layer is responsible for sensing the touch operation of the user and transmitting the signal to the control circuit board for processing; the light guide plate optimizes the light distribution in the screen display or touch state to improve the visual effect of the touch area. The overall structural design realizes highly sensitive touch operation, and at the same time ensures the efficient interaction between the touch signal and the smart phone main body 1 through the stable transmission of the metal contacts.

[0030] By innovatively combining the touch integrated block 3 with the heat dissipation system, a magnetic connection is used to achieve a stable electrical connection between the touch component 2 and the smartphone body 1, ensuring high sensitivity and reliability of touch operation. At the same time, the heat dissipation design realizes flexible heat conduction and electrical isolation through the extrusion bumps 43 of silicone material and the elastic heat conductive strips 52, avoiding damage to the back cover and enhancing thermal conductivity; the expansion block 54 of the thermal expansion polymer material drives the heat dissipation deformation sheet 55 to deform, dynamically adjusts the opening degree of the heat dissipation holes, and significantly improves the heat dissipation efficiency; the heat dissipation deformation sheet 55 coated with a color-coded coating also provides an intuitive temperature status indication function. The overall design has the characteristics of simple structure, stable performance, and high heat dissipation efficiency, while taking into account the electrical safety and reliability of the equipment, greatly improving the heat dissipation performance and touch experience of the smartphone.

[0031] A plurality of evenly distributed extrusion protrusions 43 are installed at the bottom end of the heat dissipation plate 42 , and the corresponding shape of the extrusion protrusions 43 is set to be spherical.

[0032] The structural design of the extrusion convex point 43 enables it to provide a larger contact area when in contact with the smartphone body 1. Since the convex point of the spherical structure has good distribution characteristics when subjected to force, it can evenly disperse the pressure, avoid damage to the back cover of the smartphone body 1 due to excessive local force, and at the same time enhance the fit with the back cover, thereby improving the heat transfer efficiency.

[0033] The extrusion convex points 43 are evenly distributed so as to cover most of the bottom area of ​​the heat sink 42, ensuring that the heat sink 42 can efficiently transfer heat to the smartphone body 1 through the multiple extrusion convex points 43, maximizing the heat absorption and heat dissipation effect. In addition, the spherical design can maintain stable contact and heat conduction performance when the surface of the smartphone body 1 is slightly deformed or bent, further improving the reliability of the heat dissipation system.

[0034] It not only provides excellent contact performance and thermal conductivity, but also realizes the functions of protecting the smartphone body 1 and efficiently dissipating heat through the flexibility and thermal conductivity of the silicone material. It has a simple structure, stable performance and high reliability.

[0035] The heat dissipation assembly 5 includes a heat-conducting column 51 disposed in the heat dissipation hole 44 . A plurality of evenly distributed elastic heat-conducting strips 52 are fixedly connected to the bottom end of the heat-conducting column 51 . The corresponding shapes of the plurality of elastic heat-conducting strips 52 are set to be truncated cones.

[0036] Among them, the heat-conducting column 51 serves as a core heat transfer component, which can transfer the heat generated by the back cover of the smartphone body 1 to other parts of the heat dissipation component 5 through absorption by the elastic heat-conducting strip 52, thereby achieving efficient heat transfer and diffusion.

[0037] The elastic heat-conducting strip 52 is fixed at the bottom end of the heat-conducting column 51 in a uniformly distributed manner. Its flexible design can adapt to different shapes or minor deformations when contacting the back cover of the smartphone body 1, ensuring good fit and heat-conducting performance.

[0038] The corresponding shape of the heat-conducting rod 53 is set as a frustum of a cone. Its design can provide a larger contact area. When the heat-conducting column 51 transfers heat, the frustum-of-a-cone structure can further transfer the heat to the heat-dissipating plate 42 and the external air, enhancing the heat-dissipating effect. In addition, the heat-conducting rod 53 with a frustum-of-a-cone design has good structural stability and can maintain efficient heat-conduction performance during long-term use, avoiding the decline of heat-dissipating performance caused by deformation or fatigue.

[0039] The corresponding materials of the extrusion bumps 43 and the elastic heat-conducting strip 52 are both set as silicone materials.

[0040] Among them, the corresponding materials of the extrusion bumps 43 and the elastic heat-conducting strip 52 are both set as silicone materials. The selection of silicone materials has superior flexibility, heat conductivity, and durability, enabling the extrusion bumps 43 and the elastic heat-conducting strip 52 to better adapt to different working conditions and provide efficient heat-dissipating effects during the heat-dissipating process. They can not only provide good flexibility and heat-conducting performance but also have high temperature resistance, anti-aging, and excellent surface adaptability, enabling the heat-dissipating component to maintain efficient and stable heat-dissipating effects during long-term use.

[0041] A plurality of uniformly distributed heat-conducting rods 53 are installed outside the heat-conducting column 51. One end of each of the plurality of heat-conducting rods 53 away from the heat-conducting column 51 is connected to the inner wall of the heat-dissipating hole 44. An expansion block 54 is installed at the top end of the heat-conducting column 51. The material of the expansion block 54 is set as a thermally expandable polymer material, and the expansion temperature range of the expansion block 54 is 40 - 80 °C.

[0042] A heat-dissipating deformation sheet 55 is installed at the top end of the heat-dissipating plate 42 and outside the periphery of the heat-dissipating hole 44. The center of the heat-dissipating deformation sheet 55 abuts against the expansion block 54.

[0043] A plurality of uniformly distributed heat-dissipating holes are formed in the heat-dissipating deformation sheet 55. The heat-dissipating holes are in a sealed state due to the self-extrusion force of the heat-dissipating deformation sheet 55 in the non-deformed state of the heat-dissipating deformation sheet 55, and the heat-dissipating holes are exposed when the heat-dissipating deformation sheet 55 deforms.

[0044] Among them, after absorbing the heat transferred from the smartphone body 1, the heat-conducting column 51 can quickly disperse the heat to the plurality of heat-conducting rods 53 surrounding it. The heat-conducting rods 53 are uniformly distributed and connected to the inner wall of the heat-dissipating hole 44, thus forming an efficient heat-transfer path. The heat-conducting rods 53 can not only further spread the heat but also reduce the loss of heat during the transmission process, and finally transfer the heat to the heat-dissipating plate 42 and the external air through the heat-dissipating hole 44 to achieve rapid heat dissipation.

[0045] At the top of the heat-conducting column 51, an expansion block 54 is installed. The material of the expansion block 54 is set as a thermally expandable polymer material, and the expansion temperature range of the expansion block 54 is 40 - 80 °C. As a key component driven by temperature, the material characteristics of the expansion block 54 cause it to expand in volume when it reaches the set temperature range, thereby pushing the heat-dissipating deformation sheet 55 in contact with it to deform. Utilizing the controllable expansion characteristics of the thermally expandable polymer, the expansion block 54 can accurately respond to heat changes as the temperature rises. Within the common operating temperature range of 40 - 80 °C for electronic devices, it ensures that the deformation of the heat-dissipating deformation sheet 55 can match the temperature condition of the device, providing a dynamic heat-dissipating adjustment function.

[0046] At the top of the heat-dissipating plate 42 and outside the surrounding of the heat-dissipating holes 44, a heat-dissipating deformation sheet 55 is installed. The center of the heat-dissipating deformation sheet 55 abuts against the expansion block 54. Through contact with the expansion block 54, the heat-dissipating deformation sheet 55 can generate corresponding deformations as the temperature of the expansion block 54 expands. The deformation of the heat-dissipating deformation sheet 55 can not only increase its contact area with the outside air, thereby improving the heat-dissipating efficiency, but also further enhance the air convection effect through the specially designed heat-dissipating holes on its surface, and at the same time release the heat inside the device.

[0047] Multiple evenly distributed heat-dissipating holes are provided on the heat-dissipating deformation sheet 55. The heat-dissipating holes are in a sealed state due to the self-extrusion force of the heat-dissipating deformation sheet 55 when the heat-dissipating deformation sheet 55 is in an undeformed state. When the heat-dissipating deformation sheet 55 deforms, the heat-dissipating holes are exposed. When not deformed, the heat-dissipating deformation sheet 55 seals the heat-dissipating holes by relying on its own extrusion force, which can effectively prevent external dust or foreign objects from entering, thereby protecting the internal components of the device.

[0048] When the heat-dissipating deformation sheet 55 deforms under the push of the expansion block 54, the heat-dissipating holes on it gradually open. The heat inside the device can be convectively exchanged with the outside air through the holes, further enhancing the heat-dissipating ability. At the same time, the uniform distribution design of the heat-dissipating holes ensures the overall uniform heat-dissipating performance of the heat-dissipating deformation sheet 55, avoiding local overheating and improving the stability and reliability of the heat-dissipating system.

[0049] In summary, the heat-conducting column 51, the heat-conducting rod 53, the expansion block 54, and the heat-dissipating deformation sheet 55 work together to form an intelligent and efficient heat-dissipating system. This system uses the thermal expansion characteristics of the expansion block 54 to drive the deformation of the heat-dissipating deformation sheet 55, thereby opening the heat-dissipating holes, significantly enhancing the heat-dissipating effect, ensuring the normal operating temperature of the device, and realizing intelligent heat dissipation through the dynamic adjustment function of the heat-dissipating deformation sheet 55. At the same time, the design of sealing and opening the heat-dissipating holes takes into account both the protection performance and the heat-dissipating performance of the device, and has the beneficial effects of simple structure, reliable performance, and high heat-dissipating efficiency.

[0050] It should be noted that the material of the expansion block 54 is set as a thermally expandable polymer material, and its specific material is preferably polyvinylidene fluoride (PVDF). This material has excellent thermal expansion performance and mechanical stability, and can generate stable and controllable volume expansion within the temperature range of 40 - 80°C. The expansion rate is moderate, which can effectively drive the heat dissipation deformation sheet 55 to deform.

[0051] The thermal expansion coefficient of PVDF is generally 200 - 300 ppm / °C. Within the temperature range of 40 - 80°C, its volume expansion rate can reach 1.2% - 1.5%. This expansion rate can provide sufficient driving force to stably deform the heat dissipation deformation sheet 55, gradually opening the heat dissipation holes, thereby significantly enhancing the heat dissipation capacity of the device.

[0052] At the same time, PVDF has high mechanical strength and fatigue resistance. Even in the long-term thermal expansion - contraction cycle, it can still maintain the stability of shape and performance, and will not affect the service life of the heat dissipation component due to fatigue loss.

[0053] A color marking coating is coated on the heat dissipation deformation sheet 55. When the heat dissipation deformation sheet 55 expands to different degrees, different colors appear in sequence. The color marking coating is a multi-layer structure, including a first color layer, a second color layer, and a third color layer coated in sequence. The first color layer covers the outermost layer. When the heat dissipation deformation sheet 55 expands, the first color layer is gradually stretched or peeled off, exposing the second color layer below, and the third color layer appears when further expanding.

[0054] The thickness of the multiple color layers in the color marking coating is 10 - 50 microns.

[0055] Among them, a color marking coating is coated on the heat dissipation deformation sheet 55. The color marking coating is a multi-layer structure, including a first color layer, a second color layer, and a third color layer coated in sequence. This coating indicates the deformation degree of the heat dissipation deformation sheet 55 driven by the expansion block 54 through the appearance of different colors, thereby intuitively reflecting the temperature or heat dissipation state of the device. The multi-layer structure design of the color marking coating enables it to show different colors at different stages of the deformation of the heat dissipation deformation sheet 55. Users or the device management system can quickly judge the working state of the device through the color change.

[0056] When the heat dissipation deformation sheet 55 is in the initial flat state, the first color layer completely covers the outermost surface, and only the color of the first color layer can be seen from the outside, indicating that the device is in a low temperature or normal working state. As the heat dissipation deformation sheet 55 expands initially due to the push of the expansion block 54, the first color layer begins to be stretched, cracks appear or partially peels off, gradually exposing the second color layer below, and the color changes, indicating that the internal temperature of the device rises and enters the medium temperature range. When it expands further, the first color layer is completely peeled off or transparent, and the second color layer is completely revealed, indicating that the device has entered a higher temperature state. As the heat dissipation deformation sheet 55 expands to the maximum extent, the second color layer is also stretched or peeled off, and the third color layer appears, indicating that the device temperature has reached a high temperature critical state, indicating that further heat dissipation or protection measures need to be taken. The color change process is determined by the stretching and peeling characteristics of the coating. The coating thickness is 10-50 microns, which ensures that each layer of color appears in sequence at different expansion stages to avoid ambiguity caused by the simultaneous appearance of color layers.

[0057] The design principle of the color marking coating is based on the layered structure of the coating and the deformation characteristics of the material. The first color layer uses a flexible coating, such as polyurethane or elastic silicone, which has a low tensile strength and can crack or peel off when the heat dissipation deformation sheet 55 is slightly deformed, exposing the color layer below. The second and third color layers use high adhesion or high temperature resistant coatings, which are used for color display under moderate and maximum expansion states, respectively, to ensure that the color is clear and the coating performance is not affected by high temperature. The thickness of the color layer is designed to be 10-50 microns, which not only ensures the stability of the coating, but also enables it to display color layer by layer when deformed, forming an intuitive temperature indication effect.

[0058] The color change can intuitively reflect the deformation degree of the heat dissipation deformation sheet 55 and the temperature state of the equipment, which is convenient for users or systems to quickly judge the thermal state of the equipment; the multi-layer design of the color-coded coating provides graded indications of multi-level thermal states, corresponding to low temperature, medium temperature and high temperature states, which is helpful for precise control of the thermal management of the equipment; the structure is simple, the manufacturing cost is low, and no complex electronic sensors or additional power support are required, and it is suitable for wide application in smart devices, industrial equipment, consumer electronics and other fields; the coating material has stable performance, is not easy to fail due to high temperature or long-term use, and has good reliability and durability.

[0059] Through the above design, the color-coded coating is used in conjunction with the heat dissipation deformation sheet 55 to achieve a visual indication of the temperature status, effectively improving the intelligence level of the heat dissipation system and the safety of the equipment, while providing users with a more intuitive user experience.

[0060] It should be noted that the extrusion bumps 43 made of silicone material, the elastic heat-conducting strips 52, the expansion blocks 54 made of thermally expandable polymer material, and the heat-dissipating plate 42 and heat-dissipating deformation sheet 55 coated with insulating coatings achieve electrical isolation between components while ensuring efficient heat transfer, effectively avoiding short-circuit problems caused by direct metal contact or thermal expansion. The overall structure has excellent heat-conducting performance and electrical safety, ensuring the stable operation of the device during high-temperature heat dissipation and significantly improving the reliability and service life of the smartphone.

[0061] Working principle:

[0062] The efficient heat dissipation and rear-cover touch function of the smartphone are achieved through the collaborative work of the innovative touch component 2 and the heat-dissipation system: The touch integration block 3 is connected to the smartphone body 1 by magnetic attraction. The metal contacts achieve signal transmission and power supply. The touch sensing layer inside it senses the user's operation and processes the signal through the control circuit board. The light guide plate optimizes the light distribution in the touch area to improve the touch performance; In the heat-dissipation system, the spherical extrusion bumps 43 evenly distributed at the bottom of the heat-dissipating plate 42 are in close contact with the rear cover of the smartphone body 1, providing a large contact area to enhance heat transfer. At the same time, the silicone material avoids damaging the rear cover; The heat-conducting columns 51 arranged in the heat-dissipation holes 44 absorb heat and transfer the heat to the heat-dissipating plate 42 and the outside air through the elastic heat-conducting strips 52 and the frustum-shaped heat-conducting rods 53; The expansion blocks 54 are made of thermally expandable polymer material. When the temperature reaches 40 - 80 °C, they expand and push the heat-dissipating deformation sheet 55 to deform. The heat-dissipating deformation sheet 55 forms a convection with the outside air by opening the heat-dissipation holes to further release heat; The color marking coating applied on the heat-dissipating deformation sheet 55 shows different colors in sequence according to the degree of expansion, intuitively indicating the temperature state of the device. The entire system combines heat conduction, dynamic deformation and temperature indication, not only achieving efficient heat dissipation, but also ensuring the touch reliability and structural safety of the device.

[0063] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0064] In addition, it should be understood that although this specification is described by way of examples, not every example only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each example can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims

1. A smart phone with a back cover touch structure, characterized in that: include: A smart phone body (1), wherein a touch control component (2) is magnetically mounted on one end of the smart phone body (1); A touch control component (2), the touch control component (2) comprising a touch control integrated block (3) and a mounting component (4), the touch control integrated block (3) being embedded in the mounting component (4), and the touch control integrated block (3) being provided with a plurality of metal contacts for realizing signal transmission and power supply with a smart phone body (1); A touch integrated block (3), the touch integrated block (3) comprising a protective shell, in which a touch sensing layer, a light guide plate and a control circuit board electrically connected to the touch sensing layer are installed; An installation component (4), the installation component (4) comprising an installation frame (41), a heat sink (42) being installed on an inner wall of the installation frame (41), the heat sink (42) being provided with a plurality of evenly distributed heat sink holes (44), and a heat sink component (5) being installed in the heat sink hole (44); The heat dissipation component (5) comprises a heat-conducting column (51) arranged in the heat dissipation hole (44); a plurality of uniformly distributed elastic heat-conducting strips (52) are fixedly connected to the bottom end of the heat-conducting column (51); the corresponding shapes of the plurality of elastic heat-conducting strips (52) are set to be truncated cone-shaped; a plurality of uniformly distributed heat-conducting rods (53) are installed outside the heat-conducting column (51); the ends of the plurality of heat-conducting rods (53) away from the heat-conducting column (51) are connected to the inner wall of the heat dissipation hole (44); an expansion block (54) is installed at the top end of the heat-conducting column (51); the material of the expansion block (54) is set to be a thermal expansion polymer material, and the expansion temperature range of the expansion block (54) is 40-80°C.

2. The smart phone with a rear cover touch structure according to claim 1, characterized in that: A plurality of evenly distributed extrusion convex points (43) are installed at the bottom end of the heat dissipation plate (42), and the corresponding shape of the extrusion convex points (43) is set to be spherical.

3. The smart phone with a rear cover touch structure according to claim 2, characterized in that: The materials corresponding to the extrusion protrusions (43) and the elastic heat-conducting strips (52) are both set to be silicone materials.

4. The smart phone with a rear cover touch structure according to claim 1, characterized in that: A heat dissipation deformation sheet (55) is installed at the top end of the heat dissipation plate (42) and located outside the heat dissipation hole (44), and the center of the heat dissipation deformation sheet (55) is in contact with the expansion block (54).

5. The smart phone with a rear cover touch structure according to claim 4, characterized in that: The heat dissipation deformation sheet (55) is provided with a plurality of evenly distributed heat dissipation holes, and the heat dissipation holes are sealed due to the extrusion force of the heat dissipation deformation sheet (55) itself when the heat dissipation deformation sheet (55) is in an undeformed state, and the heat dissipation holes are exposed when the heat dissipation deformation sheet (55) is deformed.

6. The smart phone with a rear cover touch structure according to claim 4, characterized in that: The heat dissipation deformation sheet (55) is coated with a color marking coating, and when the heat dissipation deformation sheet (55) is expanded to different degrees, different colors are displayed in sequence, and the color marking coating is a multi-layer structure, comprising a first color layer, a second color layer and a third color layer that are coated in sequence, and the first color layer covers the uppermost layer, and when the heat dissipation deformation sheet (55) expands, the first color layer is gradually stretched or peeled off to expose the second color layer below, and the third color layer is displayed when it expands further.

7. The smart phone with a rear cover touch structure according to claim 6, characterized in that: The thickness of the multiple color layers in the color marking coating is 10-50 microns.

Images