Camera module

Abstract

The invention discloses a camera module, and the module is characterized in that the module comprises a first light path changing element which is used for changing the light transmitted in a first direction to a second direction; the second light path changing element is used for changing the light propagating in the second direction to the first direction; a lens focusing group disposed between the first optical path changing element and the second optical path changing element; the lens driving device is configured to drive the lens focusing group to move along a second direction; the light sensing surface of the light sensing component is perpendicular to the first direction, and the light emitted from the second light path changing element is projected to the light sensing surface of the light sensing component; the chip driving device is configured to drive the photosensitive component to move along a plane vertical to the first direction; in the first direction, at least one part of the lens driving device is overlapped with at least one part of the chip driving device; wherein the first direction is perpendicular to the second direction.

Description

Technical Field

[0001] The present application relates to the technical field of camera modules, and in particular to a telephoto camera module. Background Art

[0002] A telephoto camera module refers to a camera module with a long focal length, which can clearly capture subjects at a long distance. However, due to its relatively long focal length, the telephoto camera module requires a long total optical lens length (TTL), making the size of the telephoto camera module relatively large. Moreover, the camera module usually needs to perform optical focus and / or optical image stabilization functions, which requires the size of the telephoto camera module to be larger, making it unsuitable for assembly in small mobile devices.

[0003] The present application provides a solution to the above-mentioned problem, which miniaturizes the camera module and makes the camera module suitable for being installed in a small mobile device. Summary of the invention

[0004] One purpose of the present application is to provide a telephoto camera module that overcomes the deficiencies of the prior art, miniaturizes the camera module, and makes the camera module suitable for being installed in a small mobile device.

[0005] According to one aspect of the present application, a camera module is provided, including:

[0006] A first optical path changing element, used to change the light propagating along the first direction to the second direction;

[0007] A second optical path changing element, used for changing the light propagating along the second direction to the first direction;

[0008] A lens focus group is disposed between the first optical path changing element and the second optical path changing element;

[0009] A lens driving device, wherein the lens driving device is configured to drive the lens focus group to move along a second direction;

[0010] A photosensitive component, wherein a photosensitive surface of the photosensitive component is perpendicular to the first direction, and the light emitted from the second optical path changing element is projected onto the photosensitive surface of the photosensitive component;

[0011] A chip driving device, wherein the chip driving device is configured to drive the photosensitive component to move along a plane perpendicular to a first direction; along the first direction, at least a portion of the lens driving device overlaps with at least a portion of the chip driving device; wherein the first direction is perpendicular to the second direction.

[0012] In some embodiments, the lens driving device includes a base, a movable carrier, and a guide assembly, wherein the movable carrier moves along a first direction in the base through the guide assembly, the lens focusing group is fixed to the movable carrier, the guide assembly is arranged on the top of the base, and the chip driving device extends into the lens driving device from the bottom of the base.

[0013] In some embodiments, the lens driving device also includes a shell and a base, the shell and the base are interlocked to form a first installation space, and the two ends of the lens driving device are respectively formed with a light inlet and a light outlet that are interconnected with the first installation space; the chip driving device includes an upper cover and a lower cover, the upper cover and the lower cover are interlocked to form a second installation space, wherein the first installation space overlaps with the second installation space.

[0014] In some embodiments, the base includes a top wall and a first supporting portion and a mounting portion formed on the top wall, the first supporting portion includes a first arm and a second arm spaced apart, the first arm and the second arm are formed on the top wall and located on a side close to the light entrance; the mounting portion is formed on the top wall and located on a side close to the light exit, the mounting portion includes a mounting body and a first mounting side wall and a second mounting side wall connected to the mounting body, the mounting body and the first mounting side wall and the second mounting side wall form a mounting groove, and the second optical path changing element can be disposed in the mounting groove.

[0015] In some embodiments, the base also includes a lens barrel fixing portion, which is formed on the top wall and close to the first supporting portion, and the lens barrel fixing portion includes a first fixed side wall and a second fixed side wall, and the first fixed side wall and the second fixed side wall form an installation cavity; the camera module also includes a lens fixing group, and the lens barrel fixing group is fixed in the installation cavity.

[0016] In some embodiments, the top wall of the base is implemented as a metal part, and the metal part includes a main body, a first extension part, a second extension part and a third extension part, the first extension part is bent and extended from one end of the main body along a first direction, and the first extension part is embedded in the first arm and the second arm of the first support part; the second extension part is bent and extended from the other end of the main body along the first direction, and the second extension part is embedded in the mounting part; the third extension part is bent from the main body along the first direction, and the third extension part is embedded in the lens barrel fixing part to increase the strength of the first support part, the mounting part and the lens barrel fixing part.

[0017] In some embodiments, the movable carrier includes a carrier body and a first carrier side wall and a second carrier side wall connected to the carrier body, the first carrier side wall and the second carrier side wall extend along a second direction, the lens focusing group is fixed to the carrier body, and the first carrier side wall and the second carrier side wall are located on the left and right sides of the carrier body.

[0018] In some embodiments, the first carrier side wall and the second carrier side wall extend from the carrier body toward the light entrance, and the first carrier side wall, the second carrier side wall and the carrier body form a U-shaped structure with an opening toward the light entrance, and the lens fixing group is accommodated in the opening.

[0019] In some embodiments, the first carrier side wall and the second carrier side wall extend from the carrier body toward the light exit, and the first carrier side wall, the second carrier side wall and the carrier body form a U-shaped structure with an opening toward the light exit, and the second light path changing element is accommodated in the opening.

[0020] In some embodiments, the lens driving device also includes a focus driving component, which includes a first focus driving mechanism and a second focus driving mechanism, and the first focus driving mechanism and the second focus driving mechanism are respectively arranged on the left and right sides of the movable carrier to provide symmetrical driving force to the movable carrier.

[0021] In some embodiments, the first focus drive mechanism includes a first focus magnet and a first focus coil, the first focus magnet is arranged on the movable carrier, and the first focus coil is arranged opposite to the first focus magnet; a line connecting the center of the first focus magnet and the center of the lens focus group is not perpendicular to the optical axis of the lens focus group.

[0022] In some embodiments, the center of the first focusing magnet is located between the center of the lens focusing group and the center of the lens fixing group.

[0023] In some embodiments, the photosensitive component includes a photosensitive chip, a chip circuit board and a connecting circuit board, the photosensitive chip is arranged on the front side of the chip circuit board and is electrically connected to the chip circuit board, and the connecting circuit board is arranged on the back side of the chip circuit board and is electrically connected to the chip circuit board; the lens driving device includes a circuit component, along a first direction, at least a portion of the chip circuit board and / or at least a portion of the connecting circuit board overlaps with at least a portion of the circuit component, and at least a portion of the circuit component is located above at least a portion of the chip circuit board and / or at least a portion of the connecting circuit board.

[0024] In some embodiments, the connecting circuit board includes a fixed part, a movable part and a deformable connecting part, the movable part is located on the inner side of the fixed part, the deformable connecting part connects the movable part and the fixed part respectively, and the straight line where one side of the movable part connected by the deformable connecting part is located is not parallel to the straight line where one side of the fixed part is located; the movable part is fixed to the back side of the chip circuit board, and the fixed part is fixed to the lower cover.

[0025] In some embodiments, the chip driving device includes a frame and an anti-shake driving assembly, the frame is fixed to the upper cover, and the anti-shake driving assembly is arranged between the chip circuit board and the frame to drive the chip circuit board to drive the photosensitive chip and the movable part of the connecting circuit board to move along a plane perpendicular to the first direction; the anti-shake driving assembly includes a first anti-shake driving mechanism, a second anti-shake driving mechanism and a third anti-shake driving mechanism, and the first anti-shake driving mechanism, the second anti-shake driving mechanism and the third anti-shake driving mechanism are respectively arranged on the other three sides except the side of the chip driving device extending into the lens driving device.

[0026] In some embodiments, the lens driving device includes a movable carrier, the lens focus group is fixed to the movable carrier, and the movable carrier is driven to move along a second direction; along the first direction, at least a portion of the frame overlaps with at least a portion of the movable carrier, and at least a portion of the movable carrier is located above at least a portion of the frame.

[0027] In some embodiments, the chip driving device also includes a package body and a support component. The package body is integrally formed at two diagonals of the chip circuit board and the sides opposite to the line connecting the two diagonals. A ball groove is formed on the top surface of the package body. The support component is arranged in the ball groove to be clamped between the package body and the frame. The support component provides three-point support between the frame and the package body.

[0028] In some embodiments, the photosensitive component includes a photosensitive chip, a chip circuit board and a connecting circuit board, the photosensitive chip is arranged on the front side of the chip circuit board and is electrically connected to the chip circuit board; the chip driving device includes a circuit board type coil and a plurality of anti-shake magnets opposite thereto, the circuit board type coil includes a substrate and a plurality of anti-shake coils formed on the substrate, the substrate is arranged on the back side of the chip circuit board and is electrically connected to the chip circuit board, and the connecting circuit board is arranged on the back side of the substrate and is electrically connected to the substrate.

[0029] In some embodiments, the substrate of the circuit board type coil includes a first opening and a second opening, the top surface of the connecting circuit board has a PIN pin, and the PIN pin corresponds to the first opening, so as to set an electrical connection medium in the first opening; the connecting circuit board includes a third opening, and the second opening corresponds to the third opening, the bottom surface of the chip circuit board has a chip PIN pin, and the chip PIN pin corresponds to the second opening and the third opening, an electrical connection medium is set in the second opening and the third opening, the electrical connection medium passes through the second opening, and the height of the electrical connection medium in the third opening is greater than 50% of the thickness of the connecting circuit board.

[0030] Other embodiments and features are partially described in the following description, and those skilled in the art will understand after reviewing the specification or learn these embodiments and features through practice of the disclosed subject matter. A further understanding of the features and advantages of the present disclosure can be achieved by reference to the remainder of the specification and drawings which constitute a part of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the structure of a traditional telephoto camera module;

[0032] Figure 2A and Figure 2B are two structural schematic diagrams of a camera module according to an embodiment of the present application;

[0033] Figure 3 is a schematic diagram of another camera module structure according to an embodiment of the present application;

[0034] Figure 4 is an exploded view of a camera module according to an embodiment of the present application;

[0035] Figure 5A and Figure 5B are two top cross-sectional schematic diagrams of a camera module according to an embodiment of the present application;

[0036] Figure 6 is an exploded view of a lens module according to an embodiment of the present application;

[0037] Figure 7 is another exploded view of a lens module according to an embodiment of the present application;

[0038] Figure 8 is a schematic structural diagram of a base according to an embodiment of the present application;

[0039] Fig. 9 is a schematic diagram of the structure of a movable carrier according to an embodiment of the present application;

[0040] Fig.10 is a schematic top cross-sectional view of a lens module according to an embodiment of the present application;

[0041] Fig.11 is a front cross-sectional schematic diagram of a camera module according to an embodiment of the present application;

[0042] Fig.12 is an exploded view of a photosensitive module according to an embodiment of the present application;

[0043] Fig.13 is a schematic cross-sectional view of a photosensitive module according to an embodiment of the present application;

[0044] Fig.14 is an exploded view of a photosensitive component according to an embodiment of the present application;

[0045] Fig.15 is a schematic diagram of a photosensitive module according to an embodiment of the present application. DETAILED DESCRIPTION

[0046] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0047] The term "comprising" is open ended. As used in the appended claims, the term does not exclude additional structures or steps.

[0048] In the description of the present application, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present application.

[0049] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0050] The terms "including" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0051] It should be noted that, as used in this application, the terms "substantially", "approximately" and similar terms are used as terms to express approximation rather than as terms to express degree, and are intended to account for the inherent deviations in measurements or calculations that would be recognized by a person of ordinary skill in the art.

[0052] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, a contact connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0053] "Configured to" various units, circuits, or other components may be described or recited as "configured to" perform one or more tasks. In such contexts, "configured to" is used to imply a structure (e.g., circuitry) by indicating that the unit / circuit / component includes the structure that performs the one or more tasks during operation. In addition, "configured to" may include general structures (e.g., general circuitry) manipulated by software and / or firmware to operate in a manner that is capable of performing the one or more tasks to be solved. "Configured to" may also include adjusting a manufacturing process (e.g., a semiconductor fabrication facility) to manufacture a device (e.g., an integrated circuit) suitable for implementing or performing one or more tasks.

[0054] The terms used in the description herein are only for describing specific embodiments and are not intended to be limiting. As used in the specification and the appended claims, the singular forms of "one", "a kind of" and "the" are intended to also cover the plural forms, unless the context clearly indicates otherwise. It will also be understood that the term "and / or" used herein refers to and covers any and all possible combinations of one or more items in the items listed in association. It will also be understood that the terms "including" and / or "comprising" when used in this specification specify the presence of stated features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or their grouping.

[0055] As used herein, the term "if" may be interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [a stated condition or event] is detected" may be interpreted to mean "upon determining that" or "in response to determining that" or "upon detecting [a stated condition or event]" or "in response to detecting [a stated condition or event]," depending on the context.

[0056] like Figure 1 As shown, the traditional telephoto camera module is provided with a light reflecting element 1, such as a prism or a reflector, on the object side of the optical lens 2 to reflect the light from the first direction to the second direction. In addition, the photosensitive chip 3 is arranged perpendicular to the second direction to receive the light from the second direction. In this way, by folding the optical path, the longer total optical lens length (TTL) of the traditional telephoto camera module can be met, and it is also beneficial to reduce the height of the telephoto camera module. However, since the size of the traditional telephoto camera module is limited in the direction perpendicular to the second direction, the photosensitive surface of the photosensitive chip 3 cannot be set in a large size. However, it is understandable that as people put forward more stringent requirements on the imaging quality of the camera module, the increase in the size of the photosensitive chip is an inevitable development trend.

[0057] The present application provides a camera module to solve the above-mentioned problems.

[0058] Figures 2A to 14 The camera module 100 according to some embodiments of the present application is shown, and the camera module 100 includes a first optical path changing element 11, an optical lens, a second optical path changing element 12 and a photosensitive component 31 arranged in sequence from the object side to the image side, wherein the first optical path changing element 11 is used to change the light propagating along the first direction to the second direction, and the second optical path changing element 12 is used to change the light propagating in the second direction to the first direction. The first direction is perpendicular to the second direction. The photosensitive surface of the photosensitive component 31 is arranged perpendicular to the first direction to receive light from the first direction. The first optical path changing element 11 and the second optical path changing element 12 can be implemented as a prism or as a reflector. In this embodiment, the first optical path changing element 11 and the second optical path changing element 12 are described using a prism as an example.

[0059] It can be understood that by providing the first optical path changing element 11 and the second optical path changing element 12 in the camera module 100, the light can be reflected multiple times, and by folding the optical path, the longer total optical lens length (TTL) requirement of the camera module 100 can be met. Furthermore, the first optical path changing element 11 can reflect the light from the first direction to the second direction, and the second optical path changing element 12 can reflect the light from the second direction to the first direction, so that the photosensitive surface of the photosensitive component 31 can be set in a plane perpendicular to the first direction. Compared with the traditional telephoto camera module 100, the photosensitive surface of the photosensitive component 31 in the present application can be free from the size limitation of the camera module 100 in the second direction perpendicular to the second direction, and the photosensitive surface of the photosensitive component 31 can be designed with a larger size.

[0060] In one embodiment of the present application, the first optical path changing element 11 includes a first light incident surface 111, a first light emitting surface 112 and a first reflecting surface 113, and the first reflecting surface 113 is connected between the first light incident surface 111 and the first light emitting surface 112. There is an angle between the first light incident surface 111 and the first reflecting surface 113, and there is an angle between the first light emitting surface 112 and the first reflecting surface 113, and the first light incident surface 111 and the first light emitting surface 112 can be arranged at a right angle. The first light incident surface 111 is the object side surface of the first optical path changing element 11, and the first light emitting surface 112 is the image side surface of the first optical path changing element 11.

[0061] Of course, in the present application, the first light incident surface 111 and the first light emitting surface 112 can be planes, or spherical surfaces, cylindrical surfaces or free-form surfaces. A high-reflection film can also be provided on the first reflective surface 113 to improve the reflection efficiency so that the light can enter the subsequent optical element after being completely reflected.

[0062] In a specific example of the present application, the angle between the first light incident surface 111 and the first reflection surface 113 is the same as the angle between the first light emitting surface 112 and the first reflection surface 113. For example, the angle between the first light incident surface 111 and the first reflection surface 113 is 45°, and the angle between the first light emitting surface 112 and the first reflection surface 113 is 45°. Of course, in other embodiments of the present application, the angle between the first light incident surface 111 and the first reflection surface 113 and the angle between the first light emitting surface 112 and the first reflection surface 113 may also be different. For example, the angle between the first light incident surface 111 and the first reflection surface 113 is 30°, and the angle between the first light emitting surface 112 and the first reflection surface 113 is 60°. The present application does not impose any limitation on this.

[0063] The second optical path changing element 12 includes a second light incident surface 121, a second light emitting surface 122, and a second reflecting surface 123, wherein the second reflecting surface 123 is connected between the second light incident surface 121 and the second light emitting surface 122. There is an angle between the second light incident surface 121 and the second reflecting surface 123, and there is an angle between the second light emitting surface 122 and the second reflecting surface 123, and the second light incident surface 121 and the second light emitting surface 122 can be arranged at a right angle. The second light incident surface 121 is the object side surface of the second optical path changing element 12, and the second light emitting surface 122 is the image side surface of the second optical path changing element 12.

[0064] Of course, in the present application, the second light incident surface 121 and the second light emitting surface 122 can be planes, or spherical surfaces, cylindrical surfaces or free-form surfaces. A high-reflection film can also be provided on the second reflective surface 123 to improve the reflection efficiency so that the light can enter the subsequent optical element after being completely reflected.

[0065] In a specific example of the present application, the angle between the second light incident surface 121 and the second reflective surface 123 is the same as the angle between the second light emitting surface 122 and the second reflective surface 123. For example, the angle between the second light incident surface 121 and the second reflective surface 123 is 45°, and the angle between the second light emitting surface 122 and the second reflective surface 123 is 45°. Of course, in other embodiments of the present application, the angle between the second light incident surface 121 and the second reflective surface 123 and the angle between the second light emitting surface 122 and the second reflective surface 123 may also be different. For example, the angle between the second light incident surface 121 and the second reflective surface 123 is 30°, and the angle between the second light emitting surface 122 and the second reflective surface 123 is 60°. The present application does not limit this.

[0066] It should be understood that although most of the light is folded by the first optical path changing element 11 and the second optical path changing element 12 so as to pass through the optical lens and form an image on the photosensitive chip 312, some light (such as stray light) needs to be prevented from reaching the photosensitive chip 312. Therefore, in one embodiment of the present application, Figure 3 As shown, the size of the second light path changing element 12 is greater than that of the first light path changing element 11 , so that a light blocking element 13 is disposed on the edge of the second light incident surface 121 of the second light path changing element 12 .

[0067] The light blocking element 13 may be covered with an opaque material to block stray light. If more than 90% of the stray light will not reach the photosensitive chip 312 due to passing through the light blocking element 13, it means that the light blocking element 13 has a width sufficient to prevent the stray light from reaching the photosensitive chip 312. For example, along the first direction, the light blocking element 13 may have a width of 5%-10% of the second light incident surface 121 of the second optical path changing element 12, so that the light blocking element 13 can block most of the stray light.

[0068] Furthermore, the sizes of the first optical path changing element 11 and the second optical path changing element 12 will affect the height of the telephoto camera module 100. In order to prevent the increase in the size of the second optical path changing element 12 from causing an increase in the height of the telephoto camera module 100, in the present application, the angle between the second light incident surface 121 and the second reflection surface 123 is greater than the angle between the second light emitting surface 122 and the second reflection surface 123, so as to reduce the height of the second optical path changing element 12.

[0069] In other embodiments of the present application, the size of the first light path changing element 11 may also be larger than the size of the second light path changing element 12, so as to set a light blocking element 13 at the edge of the first light incident surface 111 of the first light path changing element 11. Of course, the light blocking element 13 may also be set on the first light emitting surface 112 of the first light path changing element 11, and the present application does not limit this.

[0070] Continue to refer Figures 2A to 3 The camera module 100 further includes at least one compensating lens 14, wherein the at least one compensating lens 14 is disposed on the first light incident surface 111 of the first optical path changing element 11, and the at least one compensating lens 14 can further modulate the incident light. For example, the light can be further converged by at least one compensating lens 14 to reduce the back focus, thereby achieving the purpose of reducing the size of the camera module 100. In one embodiment of the present application, the compensating lens 14 can be a lens with one surface being a plane and the other surface being a convex surface.

[0071] In the present application, the at least one compensation lens 14 and the first optical path changing element 11 can be an integrally formed design or a split design. For example, the at least one compensation lens 14 and the first optical path changing element 11 can be formed into an integrally formed structure by molding or grinding. Alternatively, the at least one compensation lens 14 is fixed to the first light incident surface 111 of the first optical path changing element 11 by gluing.

[0072] like Figures 4 to 14 As shown, in one embodiment of the present application, the camera module 100 includes a reflection module 10, a lens module 20 and a photosensitive module 30, and the reflection module 10, the lens module 20 and the photosensitive module 30 are arranged in sequence from the object side to the image side.

[0073] Wherein, the reflection module 10 includes an optical path changing element bracket 15, a first optical path changing element 11 and a compensation lens 14. The first optical path changing element 11 is fixedly connected to the optical path changing element bracket 15. When light from the outside enters the interior of the camera module 100, the light enters the compensation lens 14 from the first direction and is contracted in the compensation lens 14. Then, after the light is emitted from the compensation lens 14, it enters the first optical path changing element 11 through the first light incident surface 111 of the first optical path changing element 11, and the light is changed from the first direction to the second direction through the first reflection surface 113 of the first optical path changing element 11, and then emitted through the first light exit surface 112 of the first optical path changing element 11. Wherein, the first direction intersects with the second direction. In the present application, the first direction is the Z-axis direction, the second direction is the Y-axis direction, the first direction and the second direction are perpendicular to each other, and the Y-axis direction is also the optical axis direction of the optical lens. In other embodiments of the present application, the specific orientations of the first direction and the second direction are not strictly limited. In the present application, the X-axis direction is also included, which can also be called the third direction. The X-axis direction is perpendicular to the Y-axis direction and the Z-axis direction. Of course, for ease of understanding, the X-axis direction can also be called the width direction of the camera module 100, the Y-axis direction can also be called the length direction of the camera module 100, and the Z-axis direction can also be called the height direction of the camera module 100.

[0074] Furthermore, the optical path changing element bracket 15 includes a protective member 151, which extends from the bottom of the optical path changing element bracket 15 along the first direction, so that the protective member 151 can be located at the bottom of the first light emitting surface 112 of the first optical path changing element 11, which does not affect the propagation of light and can protect the first optical path changing element 11. When the camera module 100 is impacted or shaken, the first optical path changing element 11 will not fall off.

[0075] Of course, in other embodiments of the present application, a driving motor (not shown) may also be provided on the optical path changing element bracket 15 to drive the first optical path changing element 11 to move so as to realize the optical image stabilization function. The driving motor may be a voice coil motor, a shape memory alloy (SMA) motor, or a piezoelectric motor. The driving motor drives the first optical path changing element 11 to selectively move around the X-axis direction and / or the Z-axis direction so as to realize the optical image stabilization function in two directions.

[0076] like FIG. 5A to FIG. 10As shown, in one embodiment of the present application, the lens module 20 includes a lens driving device 24, a lens fixing group 22, a lens focusing group 21, and a second optical path changing element 12. In a specific example of the present application, the first optical path changing element 11, the lens fixing group 22, the lens focusing group 21, the second optical path changing element 12, and the photosensitive chip 312 are arranged in sequence from the object side to the image side.

[0077] Among them, the lens focus group 21 includes a first lens barrel 211 and at least one lens, the at least one lens is placed in the first lens barrel 211, and the number of the at least one lens can be one or more. The lens focus group 21 can be driven by the lens driving device 24 to move along the second direction (also referred to as the optical axis direction or the length direction) to achieve the optical focusing function. The lens fixed group 22 includes a second lens barrel 221 and at least one lens, the at least one lens is placed in the second lens barrel 221, and the number of the at least one lens can be one or more. The lens fixed group 22 can be used to compensate for image quality to improve the imaging quality of the camera module 100.

[0078] In one embodiment of the present application, the lens fixing group 22 can be arranged on the light incident side of the lens focusing group 21, and the second optical path changing element 12 is arranged on the light exiting side of the lens focusing group 21, that is, the light reflected by the first optical path changing element 11 passes through the lens fixing group 22, the lens focusing group 21 and the second optical path changing element 12 in sequence during the process of propagating along the second direction, and the light is changed from the second direction to the first direction by the second optical path changing element 12, so that the light reaches the photosensitive chip 312.

[0079] Of course, in another embodiment of the present application, the lens focusing group 21 can be arranged on the light incident side of the lens fixing group 22, and the second optical path changing element 12 is arranged on the light exiting side of the lens fixing group 22, that is, the light reflected by the first optical path changing element 11 passes through the lens focusing group 21, the lens fixing group 22 and the second optical path changing element 12 in sequence during the process of propagating along the second direction, and the light is changed from the second direction to the first direction by the second optical path changing element 12, so that the light reaches the photosensitive chip 312.

[0080] When shooting, the lens focus group 21 and the lens fixed group 22 cooperate with each other. When the lens focus group 21 needs to move a longer distance, the lens fixed group 22 can compensate the optical system so that the camera module 100 has a stronger focusing ability and improves the imaging quality.

[0081] Further, in one embodiment of the present application, Figure 2BAs shown, the lens module 20 may further include a lens zoom group 23, the lens zoom group 23 includes a third lens barrel and at least one lens, the at least one lens is disposed in the third lens barrel, and the number of the at least one lens may be one or more. The lens zoom group 23 and the lens focus group 21 may be driven by the lens driving device 24 to move along the second direction (also referred to as the optical axis direction or the length direction) to achieve optical zoom and optical focus functions, and may meet the shooting requirements of multiple focal lengths and multiple different scenes.

[0082] Continue to refer Figures 6 to 10 The lens driving device 24 includes: a housing 241, a base 242, a movable carrier 243, a guide assembly 245, and a focus driving assembly 244. The housing 241 and the base 242 are interlocked to form a first installation space 200, and the guide assembly 245, the focus driving assembly 244, the lens fixing group 22, the lens focusing group 21, and the second optical path changing element 12 are accommodated in the first installation space 200.

[0083] The two ends of the lens driving device 24 are respectively formed with a light inlet and a light outlet which are interconnected with the first installation space 200. An optical path is formed between the light inlet, the light outlet and the first installation space 200. In the first installation space 200, the lens fixing group 22, the lens focusing group 21 and the second optical path changing element 12 are arranged on the optical path. After entering from the light inlet, the light passes through the first installation space 200, and after being processed by the lens fixing group 22, the lens focusing group 21 and the second optical path changing element 12, it is emitted from the light outlet.

[0084] like Figure 6 and Figure 7 As shown, in one embodiment of the present application, along the Z-axis direction, the base 242 is placed on the housing 241, that is, the base 242 is arranged at the top, and the housing 241 is arranged at the bottom. During the assembly process, the movable carrier 243, the guide assembly 245, the focus drive assembly 244, the lens fixing group 22, the lens focus group 21, and the second optical path changing element 12 and other components can be installed in the base 242 from bottom to top, and finally the housing 241 is fixed to the base 242 from bottom to top. The fixing method of the base 242 and the housing 241 includes but is not limited to the connection method through screws, buckles, adhesives, etc.

[0085] Furthermore, in order to reduce the number of components of the camera module 100 and improve the integration of the camera module 100, in one embodiment of the present application, the optical path changing element bracket 15 of the reflection module 10 is integrated with the shell 241 of the lens module 20, that is, the optical path changing element bracket 15 and the shell 241 are combined into an integrated structure to improve the integration of the camera module 100 and improve the consistency of the camera module 100.

[0086] like Figure 6 As shown, the shell 241 includes a bottom plate 2411 and two side plates 2412 formed on two opposite sides of the bottom plate 2411, wherein the bottom plate 2411 covers the bottom of the base 242, and the two side plates 2412 cover the left and right sides of the base 242, and the light inlet and the light outlet are formed on the front and rear sides of the lens driving device 24.

[0087] Furthermore, if Figure 6 and Figure 8 As shown, the base 242 includes a top wall 2421 and a first supporting portion 2422, a lens barrel fixing portion 31622423 and a mounting portion 2424 formed on the top wall 2421, wherein the first supporting portion 2422, the lens barrel fixing portion 31622423 and the mounting portion 2424 can be an integrated structure with the top wall 2421, that is, the first supporting portion 2422, the lens barrel fixing portion 31622423 and the mounting portion 2424 can be integrally formed with the top wall 2421 to improve the strength and consistency of the base 242. Of course, the first support portion 2422, the lens barrel fixing portion 31622423 and the mounting portion 2424 can be a split structure with the top wall 2421, that is, the first support portion 2422, the lens barrel fixing portion 31622423 and the mounting portion 2424 can be separately formed with the top wall 2421 and then assembled into one by gluing, snapping, etc., and the present application does not impose any restrictions on this.

[0088] The first supporting portion 2422 includes a first arm 24221 and a second arm 24222 that are spaced apart from each other, wherein the first arm 24221 and the second arm 24222 are formed on the top wall 2421 and are located on a side close to the light entrance, the first arm 24221 and the second arm 24222 extend from the top wall 2421 along a first direction, and the first arm 24221 and the second arm 24222 are symmetrically arranged relative to the optical axis.

[0089] The lens barrel fixing part 31622423 is formed on the top wall 2421 and close to the first arm 24221 and the second arm 24222. The lens barrel fixing part 31622423 includes a first fixed side wall 24231 and a second fixed side wall 24232. The first fixed side wall 24231 and the second fixed side wall 24232 form a mounting cavity. The second lens barrel 221 of the lens fixing group 22 can be fixed in the mounting cavity by bonding, clamping or screwing. Further, the first arm 24221 can be connected to the first fixed side wall 24231, and the second arm 24222 can be connected to the second fixed side wall 24232, which can facilitate molding on the one hand and improve the strength and consistency of the camera module 100 on the other hand.

[0090] The mounting portion 2424 is formed on the top wall 2421 and is located on a side close to the light outlet. The mounting portion 2424 includes a mounting body 24241 and a first mounting side wall 24242 and a second mounting side wall 24243 connected to the mounting body 24241, wherein the mounting body 24241 and the first mounting side wall 24242 and the second mounting side wall 24243 form a mounting groove 24244, and the second optical path changing element 12 can be disposed in the mounting groove 24244. Further, the mounting body 24241 has an inclined surface, and the second reflecting surface 123 of the second optical path changing element 12 is disposed on the inclined surface, so that the second light incident surface 121 of the second optical path changing element 12 faces the light incident surface, and the second light emitting surface 122 of the second optical path changing element 12 faces the light outlet.

[0091] Further, the first arm 24221 and the first mounting side wall 24242 are spaced apart along the optical axis direction, and the second arm 24222 and the second mounting side wall 24243 are spaced apart along the optical axis direction. In other words, the left and right sides and the bottom of the base 242 have openings to facilitate the assembly of other components. The first arm 24221, the second arm 24222 and the top wall 2421 of the base 242 can be fixedly connected to the two side plates 2412 of the housing 241, so that the bottom plate 2411 and the two side plates 2412 of the housing 241 cover the left and right sides and the bottom of the base 242.

[0092] In one embodiment of the present application, Figure 8As shown, the top wall 2421 of the base 242 is implemented as a metal part, which includes a main body 24211, a first extension 24212, a second extension 24213 and a third extension 24214. The first extension 24212 is bent and extended from one end of the main body 24211 along the first direction, and the first extension 24212 is embedded in the first arm 24221 and the second arm 24222 of the first support 2422 to increase the strength of the first arm 24221 and the second arm 24222. Further, the second extension 24213 is bent and extended from the other end of the main body 24211 along the first direction, and the second extension 24213 is embedded in the mounting portion 2424 to increase the strength of the mounting portion 2424. In a specific example of the present application, the second extension portion 24213 may be first bent and extended from the main body portion 24211 along the first direction, then extended along the Y-axis direction, and then bent and extended along the X-axis direction, so as to increase the strength of the second extension portion 24213, and also enable the second extension portion 24213 to be embedded as much as possible in the mounting portion 2424. The third extension portion 24214 is bent from the main body portion 24211 along the first direction, the third extension portion 24214 is located on a side close to the first extension portion 24212, and the third extension portion 24214 is embedded in the first fixed side wall 24231 and the second fixed side wall 24232 of the lens barrel fixing portion 31622423, so as to increase the strength of the first fixed side wall 24231 and the second fixed side wall 24232.

[0093] Further, the first extension portion 24212 includes two portions symmetrically arranged with respect to the optical axis, the second extension portion 24213 includes two portions symmetrically arranged with respect to the optical axis, and the third extension portion 24214 includes two portions symmetrically arranged with respect to the optical axis.

[0094] It should be understood that the metal top wall 2421 can have a thinner thickness, so that the height space utilization rate of the lens module 20 is higher. Further, the base 242 can also include a light shielding sheet, which is arranged on the top wall 2421 to prevent the top wall 2421 from reflecting light, thereby preventing stray light from affecting the imaging effect.

[0095] like FIG. 5A to FIG. 7 and Fig. 9As shown, the movable carrier 243 is used to carry the lens focus group 21, and is driven to drive the lens focus group 21 to move along the optical axis direction to achieve the optical focus function. The movable carrier 243 includes a carrier body 2431 and a first carrier side wall 2432 and a second carrier side wall 2433 connected to the carrier body 2431, and the first carrier side wall 2432 and the second carrier side wall 2433 extend along the second direction. The first lens barrel 211 of the lens focus group 21 is fixed to the carrier body 2431 of the movable carrier 243, and the first carrier side wall 2432 and the second carrier side wall 2433 are located on the left and right sides of the lens focus group 21 and the carrier body 2431.

[0096] Furthermore, the first carrier side wall 2432 and the second carrier side wall 2433 extend toward one side of the light entrance, and when viewed along the first direction, the first carrier side wall 2432 and the second carrier side wall 2433 are closer to the light entrance than the carrier body 2431. In a specific example of the present application, the first carrier side wall 2432, the second carrier side wall 2433 and the carrier body 2431 form a U-shaped opening structure, the opening facing the light entrance, and the lens fixing group 22 can be accommodated in the opening. This arrangement not only makes the structure of the lens module 20 of the camera module 100 more compact, but also reduces the size of the lens module 20 along the second direction, which is conducive to reducing the size of the camera module 100.

[0097] In other words, in one embodiment of the present application, the lens fixing group 22 is located on the front side of the lens focusing group 21, the lens focusing group 21 and the carrier body 2431 of the movable carrier 243 are located on the rear side of the lens fixing group 22, the first carrier side wall 2432 and the second carrier side wall 2433 of the movable carrier 243 extend along the optical axis direction, and in the X-axis direction perpendicular to the optical axis direction, at least a portion of the first carrier side wall 2432 overlaps with at least a portion of the lens fixing assembly, and at least a portion of the second carrier side wall 2433 overlaps with at least a portion of the lens fixing group 22.

[0098] In one embodiment of the present application, the movable carrier 243 moves along the optical axis in the first installation space 200 through the guide assembly 245. Fig. 9 and Fig.10 The guide assembly 245 is arranged in the first installation space 200 to guide the moving direction of the movable carrier 243. The guide assembly 245 is arranged along the optical axis direction, and the guide assembly 245 can be a guide assembly 245 of the type of a slider, a ball, a guide rod, etc.

[0099] In one embodiment of the present application, the guide assembly 245 is implemented as a guide rod. The length direction of the guide assembly 245 is along the optical axis direction, one end of the guide assembly 245 is fixed to the first support portion 2422 of the base 242, and the other end of the guide assembly 245 is fixed to the mounting portion 2424 of the base 242. Specifically, the first support portion 2422 has a slot, so that one end of the guide assembly 245 extends into the slot and is fixedly connected to the first extension portion 24212 embedded in the first support portion 2422; correspondingly, the mounting portion 2424 has a slot, so that the other end of the guide assembly 245 extends into the slot and is fixedly connected to the mounting portion 2424.

[0100] In one embodiment of the present application, the guide assembly 245 includes a first guide rod 2451 and a second guide rod 2452, and the first guide rod 2451 and the second guide rod 2452 are arranged parallel to each other. The first guide rod 2451 is arranged between the first arm 24221 and the first installation side wall 24242, and the second guide rod 2452 is arranged between the second arm 24222 and the second installation side wall 24243.

[0101] Further, the top surfaces of the first carrier side wall 2432 and the second carrier side wall 2433 of the movable carrier 243 are respectively provided with guide grooves 2434, and correspondingly, the bottom surface of the top wall 2421 of the base 242 is provided with a slideway 24215, and the guide assembly 245 is clamped between the guide groove 2434 and the slideway 24215. Specifically, the guide groove 2434 includes a first guide groove 2434a and a second guide groove 2434b that are parallel to each other and spaced apart, and the slideway 24215 includes a first slideway 24215a and a second slideway 24215b that are parallel to each other and spaced apart. The first guide groove 2434a and the first slideway 24215a are arranged opposite to each other along the first direction, and the first guide rod 2451 is clamped between the first guide groove 2434a and the first slideway 24215a. The second guide groove 2434b and the second slideway 24215b are arranged opposite to each other along the first direction, and the second guide rod 2452 is clamped between the second guide groove 2434b and the second slideway 24215b.

[0102] In one embodiment of the present application, the guide groove 2434 is a V-shaped structure, and the slide 24215 is an L-shaped structure. It should be understood that the guide groove 2434 with a V-shaped structure can better perform sliding guidance, and the slide 24215 with an L-shaped structure can be used for tolerance to allow the movable carrier 243 to have a certain error, thereby ensuring that the movable carrier 243 can still be installed on the guide assembly 245 when an error exists.

[0103] Of course, in other embodiments of the present application, the positions of the guide groove 2434 and the slide 24215 can be swapped. For example, the top surfaces of the first carrier side wall 2432 and the second carrier side wall 2433 are respectively provided with slides 24215, and the bottom surface of the top wall 2421 of the base 242 is provided with a guide groove 2434. The present application does not impose any restrictions on this.

[0104] Further, in one embodiment of the present application, the slideway 24215 can be implemented as a separate structure formed on the top wall 2421 of the base 242, such as Figure 6 to Figure 7 As shown, the material of the slideway 24215 can be the same as the material of the top wall 2421, or can be different from the material of the top wall 2421. For example, the slideway 24215 is a rectangular parallelepiped structure, the slideway 24215 is formed on the bottom surface of the top wall 2421, and the length direction of the slideway 24215 is the same as the length direction of the guide assembly 245. The side of the slideway 24215 facing the guide assembly 245 is an L-shaped structure or a flat structure, so that the guide assembly 245 can be set on the slideway 24215. Through such a structure, not only is it easy to form the slideway 24215, but also a more stable support can be provided for the guide assembly 245.

[0105] Driven by the focus driving assembly 244, the movable carrier 243 can move along the first guide rod 2451 and the second guide rod 2452 relative to the base 242 along the optical axis direction. Figure 5A and Figure 6 As shown, the focus drive assembly 244 includes a first focus drive mechanism 2441 and a second focus drive mechanism 2442, and the first focus drive mechanism 2441 and the second focus drive mechanism 2442 are respectively arranged on the left and right sides of the lens barrel movable carrier 243 to simultaneously provide symmetrical driving forces to the movable carrier 243. Compared with providing driving force on one side, the movable carrier 243 can be prevented from tilting during movement, thereby ensuring that the movable carrier 243 moves more smoothly. In addition, the position information of the movable carrier 243 collected by the focus position sensing element 248 is also more accurate, which improves the control accuracy of the first focus drive mechanism 2441 and the second focus drive mechanism 2442, thereby improving the shooting effect of the camera module 100.

[0106] In one embodiment of the present application, the first focusing drive mechanism 2441 includes a first focusing magnet 24411 and a first focusing coil 24412, and the second focusing drive mechanism 2442 includes a second focusing magnet 24421 and a second focusing coil 24422, wherein the first focusing magnet 24411 is arranged at one of the movable carrier 243 and the shell 241, and the first focusing coil 24412 is arranged at the other of the movable carrier 243 and the shell 241; the second focusing magnet 24421 is arranged at one of the movable carrier 243 and the shell 241, and the second focusing coil 24422 is arranged at the other of the movable carrier 243 and the shell 241.

[0107] In one embodiment of the present application, the first focus driving mechanism 2441 and the second focus driving mechanism 2442 are symmetrically arranged on opposite sides of the movable carrier 243. The first carrier side wall 2432 and the second carrier side wall 2433 of the movable carrier 243 respectively have magnet mounting grooves 24244, and the first focus magnet 24411 and the second focus magnet 24421 are fixedly installed in the magnet mounting grooves 24244. The first focus coil 24412 and the second focus coil 24422 are fixed to the housing 241, that is, in one embodiment of the present application, the first focus magnet 24411 and the second focus magnet 24421 are movers, and the first focus coil 24412 and the second focus coil 24422 are stators.

[0108] The first focus magnet 24411 and the first focus coil 24412 are arranged opposite to each other along the X-axis direction, the second focus magnet 24421 and the second focus coil 24422 are arranged opposite to each other along the X-axis direction, and the planes where the first focus coil 24412 and the second focus coil 24422 are located are parallel to the optical axis direction to reduce the width of the camera module 100. Further, since the left and right sides of the base 242 have openings, the first focus magnet 24411 and the first focus coil 24412 are arranged opposite to each other through the openings, and the second focus magnet 24421 and the second focus coil 24422 are arranged opposite to each other through the openings.

[0109] It should be understood that the first focus magnet 24411 and the second focus magnet 24421 have a certain length, and the length direction of the first focus magnet 24411 and the second focus magnet 24421 is the same as the length direction of the first carrier side wall 2432 and the second carrier side wall 2433. The lens focus group 21 can move along the optical axis relative to the lens fixed group 22 and the second optical path changing element 12 under the drive of the movable carrier 243, and a certain moving distance needs to be reserved between the lens focus group 21 and the lens fixed group 22 and the second optical path changing element 12. If the center of the lens focus group 21 is aligned with the center of the first focus magnet 24411 (or the second focus magnet 24421), the distance between the lens focus group 21 and the second optical path changing element 12 will increase due to the length of the first focus magnet 24411, the second focus magnet 24421, the first carrier side wall 2432 and the second carrier side wall 2433, thereby increasing the length of the camera module 100.

[0110] like Figure 5A As shown, in one embodiment of the present application, the center of the lens focus group 21 is misaligned with the center of the first focus magnet 24411 (or the second focus magnet 24421), that is, the direction of the line connecting the center of the lens focus group 21 and the center of the first focus magnet 24411 (or the second focus magnet 24421) is not perpendicular to the optical axis. For example, the center of the first focus magnet 24411 (or the second focus magnet 24421) is closer to the light entrance than the center of the lens focus group 21. In this arrangement, the distance between the lens focus group 21 and the second optical path changing element 12 is reduced, thereby avoiding an increase in the length of the camera module 100.

[0111] Furthermore, the center of the first focus magnet 24411 (or the second focus magnet 24421) is located between the center of the lens focus group 21 and the center of the lens fixed group 22. This not only ensures the moving stroke of the lens focus group 21, but also shortens the distance from the side wall of the first movable carrier 243 to the first arm 24221, and shortens the distance from the side wall of the second movable carrier 243 to the second arm 24222, so as to achieve the purpose of reducing the length of the camera module 100.

[0112] In another embodiment of the present application, Figure 5B As shown, the U-shaped opening of the movable carrier 243 faces the second optical path changing element 12, and the second optical path changing element 12 is placed in the opening. In this embodiment, the center of the lens focus group 21 is closer to the light entrance than the center of the first focus magnet 24411 (or the second focus magnet 24421). This arrangement can not only ensure the moving range of the lens focus group 21, but also make the camera module 100 more integrated, which is conducive to reducing the length of the camera module 100.

[0113] In one embodiment of the present application, the lens driving device 24 further includes a circuit assembly 246, wherein the circuit assembly 246 includes a first circuit board 2461 and a second circuit board 2462, and the first circuit board 2461 and the second circuit board 2462 are relatively arranged on the left and right sides of the movable carrier 243. The first circuit board 2461 and the second circuit board 2462 are fixed to the two side plates 2412 of the housing 241, the first focus coil 24412 is indirectly fixed to the housing 241 through the first circuit board 2461, and the second focus coil 24422 is indirectly fixed to the housing 241 through the second circuit board 2462, wherein the plane where the first focus coil 24412 is located is parallel to the plane where the first circuit board 2461 is located, and the plane where the second focus coil 24422 is located is parallel to the plane where the second circuit board 2462 is located.

[0114] The first focusing coil 24412 is electrically connected to the first circuit board 2461, the second focusing coil 24422 is electrically connected to the second circuit board 2462, the first circuit board 2461 and the second circuit board 2462 are electrically connected via a connecting circuit 2463, and are electrically connected to an external electronic device via one of the first circuit board 2461 or the second circuit board 2462. In a specific example of the present application, the first circuit board 2461 extends a conductive pin, the second circuit board 2462 extends a conductive pin, and the two ends of the connecting circuit 2463 are respectively connected to the conductive pin of the first circuit board 2461 and the conductive pin of the second circuit board 2462 to achieve line conduction.

[0115] In one embodiment of the present application, the first circuit board 2461 and the second circuit board 2462 may be printed circuit boards (PCBs), or the first circuit board 2461 and the second circuit board 2462 may be flexible printed circuits (FPCs), hard boards, or hard-soft boards.

[0116] Continue to refer to Figure 5 to Figure 6 In one embodiment of the present application, the lens driving device 24 further includes a reinforcing plate 247. The number of the reinforcing plates 247 is two, and the two reinforcing plates 247 are respectively arranged between the first circuit board 2461 and the housing 241, and between the second circuit board 2462 and the housing 241. The reinforcing plates 247 can improve the strength of the first circuit board and the second circuit board.

[0117] In one embodiment of the present application, a plurality of positioning protrusions 2471 are provided on the reinforcement plate 247, and the plurality of positioning protrusions 2471 are located around the outer side and the inner side of the first focusing coil 24412 and the second focusing coil 24422. The first circuit board 2461 and the second circuit board 2462 are provided with openings at positions corresponding to the plurality of positioning protrusions 2471, so that after the first circuit board 2461 and the second circuit board 2462 are indirectly fixed to the shell 241 through the reinforcement plate 247, the plurality of positioning protrusions 2471 can play a role in positioning and supporting and protecting the first focusing coil 24412 and the second focusing coil 24422.

[0118] As shown in Figure 5 and Figure 6 As shown, in one embodiment of the present application, the base 242 further includes a buffer 2425, which can buffer and reduce the impact of the movable carrier 243. The buffer 2425 can be made of elastic material, for example, made of elastic soft rubber and other materials.

[0119] Specifically, the buffer 2425 may be disposed in the first arm 24221 and the second arm 24222 of the base 242, wherein the first arm 24221 and the second arm 24222 are hollow structures, and at least a portion of the buffer 2425 may be exposed to the air, so that the movable carrier 243 may contact the buffer 2425. Further, the buffer 2425 may also be disposed in the first mounting side wall 24242 and the second mounting side wall 24243 of the mounting portion 2424, wherein the first mounting side wall 24242 and the second mounting side wall 24243 have grooves for accommodating the buffer 2425, and at least a portion of the buffer 2425 is exposed to the air, so that the movable carrier 243 may contact the buffer 2425.

[0120] It should be understood that, along the optical axis direction, at least a portion of the buffer 2425 overlaps with at least a portion of the first carrier side wall 2432 of the movable carrier 243, and at least a portion of the buffer 2425 overlaps with at least a portion of the second carrier side wall 2433 of the movable carrier 243. In this way, the movable carrier 243 can contact the buffer 2425 during the movement along the optical axis direction, thereby buffering the impact of the movable carrier 243, avoiding abnormal noise caused by long-stroke impact, and reducing the problem of dust generation after impact, thereby improving the performance of the camera module 100.

[0121] In a specific example of the present application, with continued reference to FIG. 5 , along the optical axis direction, only a portion of the front and rear ends of the first carrier side wall 2432 of the movable carrier 243 overlap with the buffer 2425, that is, a portion of the front end surface and a portion of the rear end surface of the first carrier side wall 2432 collide with the buffer 2425, respectively, so that the area of ​​the movable carrier 243 collided with can be reduced, and the lens focus group 21 in the movable carrier 243 is protected. Similarly, along the optical axis direction, only a portion of the front and rear ends of the second carrier side wall 2433 of the movable carrier 243 overlap with the buffer 2425, that is, a portion of the front end surface and a portion of the rear end surface of the second carrier side wall 2433 collide with the buffer 2425, respectively, so that the area of ​​the movable carrier 243 collided with can be reduced, and the lens focus group 21 in the movable carrier 243 is protected.

[0122] In one embodiment of the present application, the lens driving device 24 further includes a focus position sensing element 248, which is disposed in the first focus coil 24412 or the second focus coil 24422, so that the focus position sensing element 248 can be disposed relative to the first focus magnet 24411 or the second focus magnet 24421. When the position of the movable carrier 243 changes, the relative position of the focus position sensing element 248 and the first focus magnet 24411 or the second focus magnet 24421 changes, so as to determine the position of the movable carrier 243 according to the sensed magnetic field strength, and then adjust the current of the first focus coil 24412 or the second focus coil 24422 to move the movable carrier 243 to the desired position. It should be understood that the focus position sensing element 248 can be a Hall sensor, a driver IC or a TMR, etc., and the present application does not limit this.

[0123] like Figures 11 to 14 As shown, in one embodiment of the present application, the photosensitive module 30 includes a photosensitive component 31 and a chip driving device 32. The chip driving device 32 can drive the photosensitive component 31 to move along a plane perpendicular to the first direction to achieve an optical image stabilization function. Of course, in the present application, the photosensitive component 31 can also be used as a part of the chip driving device 32, that is, the chip driving device 32 includes components in the photosensitive component 31.

[0124] The photosensitive component 31 includes a photosensitive chip 312, a chip circuit board 311, a filter element 314 bracket 313, a filter element 314 and at least one electronic component 315, wherein the photosensitive surface of the photosensitive chip 312 can be used to collect light and convert the optical image information carried by the light into an electrical signal, and the photosensitive chip 312 is electrically connected to the chip circuit board 311. The photosensitive chip 312 is directly or indirectly fixed to the front of the chip circuit board 311, and the photosensitive chip 312 includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area. The photosensitive chip 312 is electrically connected to the chip circuit board 311 through a chip pad located in the non-photosensitive area. For example, the photosensitive chip 312 can be electrically connected to the chip circuit board 311 by wire bonding (gold wire), welding, FC process (chip flip-chip) or RDL (rewiring layer technology).

[0125] At least one electronic component 315 can be implemented as a passive electronic device such as a capacitor or a resistor or an active electronic device such as a diode or a memory chip. At least one electronic component 315 is electrically connected to the chip circuit board 311. At least one electronic component 315 can be arranged on the front side of the chip circuit board 311 or on the back side of the chip circuit board 311. When at least one electronic component 315 is arranged on the same side as the photosensitive chip 312, at least one electronic component 315 can be arranged on the periphery of the photosensitive chip 312. At least one electronic component 315 can be located on one side, two sides, three sides and / or four sides of the photosensitive chip 312.

[0126] The filter element 314 is arranged on the light sensing path of the photosensitive chip 312 to filter out unnecessary stray light, such as infrared rays. The filter element 314 is supported on the filter element bracket 313 by, for example, gluing. The filter element bracket 313 is fixed to the chip circuit board 311 and surrounds the circumference of the photosensitive chip 312. Along the Z-axis direction, the projection of the filter element 314 overlaps with the projection of the photosensitive chip 312.

[0127] Furthermore, in one embodiment of the present application, the photosensitive component 31 further includes a connecting circuit board 316, which is disposed on the back of the chip circuit board 311, that is, on the side away from the photosensitive chip 312. The connecting circuit board 316 includes a connecting belt 3164 and a connector 3165, the connecting belt 3164 extends in a direction away from the camera module 100, and the connector 3165 is disposed at one end of the connecting belt 3164, and is electrically connected to an external electronic device through the connector 3165, so as to transmit the imaging information obtained by the photosensitive chip 312 to the external electronic device.

[0128] The connection circuit board 316 includes a fixed portion 3162, a movable portion 3161 and a deformable connection portion 3163, wherein the movable portion 3161 is located inside the fixed portion 3162, and the deformable connection portion 3163 connects the movable portion 3161 and the fixed portion 3162 respectively, so as to allow the deformable connection portion 3163 to suspend the movable portion 3161 in the fixed portion 3162. In one embodiment of the present application, the number of the deformable connection portions 3163 is four, wherein one end of each deformable connection portion 3163 is fixedly connected to one side of the movable portion 3161, and then bends and extends along the side and the adjacent side of the movable portion 3161, so that the other end of each deformable connection portion 3163 is fixedly connected to one side of the fixed portion 3162, and the straight line where one side of the movable portion 3161 connected to each deformable connection portion is located is not parallel to the straight line where one side of the fixed portion 3162 is located.

[0129] In other words, each deformable connecting portion 3163 is respectively connected to one side of the movable portion 3161 and one side of the fixed portion 3162 adjacent to the one side of the movable portion 3161 .

[0130] In the present application, in the photosensitive component 31, the chip circuit board 311 is a reference surface, and the photosensitive chip 312, at least one electronic component 315, the filter element 314, the filter element 314 bracket 313, and the connecting circuit board 316 are all arranged on the chip circuit board 311, which improves the integration of the photosensitive component 31 and has a higher flatness. Furthermore, driving the chip circuit board 311 to move can drive the photosensitive chip 312 and other components on the chip circuit board 311 to move together, and the driving efficiency is higher.

[0131] Continue to refer Fig.12 and Fig.13 In one embodiment of the present application, the chip driving device 32 includes a cover body 321, a frame 322, a packaging body 323, a support assembly 324 and an anti-shake driving assembly 325, wherein the cover body 321 includes an upper cover 3211 and a lower cover 3212, and along the first direction, the upper cover 3211 is located above the lower cover 3212, and the upper cover 3211 and the lower cover 3212 are buckled together to form a second installation space 300 to accommodate the frame 322, the packaging body 323, the support assembly 324, the anti-shake driving assembly 325 and the photosensitive assembly 31.

[0132] The upper cover 3211 includes a top cover 3211a with an opening and a side cover 3211b connected to the top cover 3211a, and the plane where the top cover 3211a is located is perpendicular to the plane where the side cover 3211b is located. Further, the top cover 3211a has a stepped structure, that is, a part of the top cover 3211a is higher than another part of the top cover 3211a.

[0133] In one embodiment of the present application, the movable portion 3161 is disposed on the back of the chip circuit board 311, and the fixed portion 3162 is disposed on the lower cover 3212 of the cover body 321. When the chip circuit board 311 is driven to move along a plane perpendicular to the first plane, the deformable connection portion 3163 is deformed to allow the chip circuit board 311 to drive the movable portion 3161 to translate, and in this process, the deformable connection portion 3163 always conducts the movable portion 3161 and the fixed portion 3162.

[0134] Furthermore, the connecting belt 3164 is connected to the fixing portion 3162 and extends from the fixing portion 3162 in a direction away from the camera module 100. The connector 3165 is disposed at one end of the connecting belt 3164 and is electrically connected to an external electronic device through the connector 3165, thereby transmitting imaging information acquired by the photosensitive chip 312 to the external electronic device.

[0135] In one embodiment of the application, the photosensitive component 31 further includes a reinforcing portion 317, which is disposed on the back of the connecting circuit board 316, and the connecting circuit board 316 is indirectly fixed to the lower cover 3212 through the reinforcing portion 317. In other words, the reinforcing portion 317 and the chip circuit board 311 are respectively disposed on opposite sides of the connecting circuit board 316. The reinforcing portion 317 can improve the strength of the connecting circuit board 316, and the reinforcing portion 317 has a better heat conduction effect. Among them, the reinforcing portion 317 can be a stainless steel plate or other materials, and the present application does not limit this.

[0136] The frame 322 is fixed to the upper cover 3211, and the frame 322 includes a first frame portion 3221, a second frame portion 3222, a third frame portion 3223 and a fourth frame portion 3224. The first frame portion 3221, the second frame portion 3222, the third frame portion 3223 and the fourth frame portion 3224 are connected end to end, and the middle part of the frame 322 has an opening to allow light to pass through. The first frame portion 3221 is close to the lens module 20, and the second frame portion 3222, the third frame portion 3223 and the fourth frame portion 3224 are arranged in sequence in a clockwise direction. In one embodiment of the present application, the first frame portion 3221 includes two bumps with a certain thickness, and a groove is formed between the two bumps.

[0137] The anti-shake driving assembly 325 is arranged between the chip circuit board 311 and the frame 322 to drive the chip circuit board 311 to move relative to the frame 322 and the cover 321. Specifically, the anti-shake driving assembly 325 includes a first anti-shake driving mechanism 3251, a second anti-shake driving mechanism 3252 and a third anti-shake driving mechanism 3253, and the first anti-shake driving mechanism 3251, the second anti-shake driving mechanism 3252 and the third anti-shake driving mechanism 3253 are respectively arranged on three sides of the photosensitive component 31. Among them, the first anti-shake driving mechanism 3251 includes a first anti-shake magnet 32511 and a first anti-shake coil 32512, the second anti-shake driving mechanism 3252 includes a second anti-shake magnet 32521 and a second anti-shake coil 32522, and the third anti-shake driving mechanism 3253 includes a third anti-shake magnet 32531 and a third anti-shake coil 32532. The first anti-shake magnet 32511 and the first anti-shake coil 32512 are arranged opposite to each other along the Z-axis direction, the second anti-shake magnet 32521 and the second anti-shake coil 32522 are arranged opposite to each other along the Z-axis direction, and the third anti-shake magnet 32531 and the third anti-shake coil 32532 are arranged opposite to each other along the Z-axis direction.

[0138] The second frame portion 3222, the third frame portion 3223 and the fourth frame portion 3224 of the frame 322 respectively have grooves opening toward the chip circuit board 311, the first anti-shake magnet 32511 is arranged in the second frame portion 3222, the second anti-shake magnet 32521 is arranged in the third frame portion 3223, and the third anti-shake magnet 32531 is arranged in the fourth frame portion 3224. Correspondingly, the first anti-shake coil 32512, the second anti-shake coil 32522 and the third anti-shake coil 32532 are arranged on the top surface of the chip circuit board 311. In one embodiment of the present application, the first anti-shake coil 32512, the second anti-shake coil 32522 and the third anti-shake coil 32532 are circuit board type coils, that is, three anti-shake coils are formed on a substrate 3254. In other words, the circuit board type coil includes a substrate 3254 and a plurality of anti-shake coils formed on the substrate 3254, and the plurality of anti-shake coils and the plurality of anti-shake magnets are arranged opposite to each other along the Z-axis direction. The plurality of anti-shake coils include a first anti-shake coil 32512, a second anti-shake coil 32522, and a third anti-shake coil 32532, and the first anti-shake coil 32512, the second anti-shake coil 32522, and the third anti-shake coil 32532 are all arranged on the substrate 3254. The circuit board type coil is arranged on the chip circuit board 311 and is electrically connected to the chip circuit board 311, so as to facilitate the electrical connection between the first anti-shake coil 32512, the second anti-shake coil 32522, and the third anti-shake coil 32532 and the chip circuit board 311.

[0139] In one embodiment of the present application, the chip driver 32 is not provided with a coil-magnet on the side facing the lens module 20, that is, the anti-shake drive assembly 325 is arranged on the other three sides except the side close to the lens module 20. In other words, the first anti-shake drive mechanism 3251, the second anti-shake drive mechanism 3252 and the third anti-shake drive mechanism 3253 are respectively arranged on the other three sides except the side where the chip driver 32 extends into the lens driver 24. This arrangement can avoid interference between the focus drive assembly 244 and the anti-shake drive assembly 325, affecting the imaging effect. Moreover, since the coil-magnet is not provided on the side where the chip driver 32 extends into the lens driver 24, the chip driver 32 and the lens driver 24 can be brought closer together, thereby reducing the height dimension of the camera module 100.

[0140] In one embodiment of the present application, the anti-shake driving assembly 325 further includes a magnetizing member 3255, which is disposed between the frame 322 and the first anti-shake magnet 32511, between the frame 322 and the second anti-shake magnet 32521, and between the frame 322 and the third anti-shake magnet 32531. That is, the magnetizing member 3255 is disposed on the first anti-shake magnet 32511, the second anti-shake magnet 32521, and the third anti-shake magnet 32531, respectively, which can not only increase the magnetic field strength, but also prevent the magnetic force of the first anti-shake magnet 32511, the second anti-shake magnet 32521, and the third anti-shake magnet 32531 from overflowing.

[0141] Specifically, the magnetizing component 3255 disposed on the first anti-shake magnet 32511 is taken as an example for introduction. For example, in one embodiment of the present application, the magnetizing component 3255 is set to an L-shaped structure, and the magnetizing component 3255 covers the side of the first anti-shake magnet 32511 away from the first anti-shake coil 32512, and the side of the first anti-shake magnet 32511 away from the photosensitive component 31. In other words, the magnetizing component 3255 covers the top side and the outer side of the first anti-shake magnet 32511, wherein the outer side is the side away from the photosensitive path. In this way, the magnetic force of the first anti-shake magnet 32511 can be concentrated toward the first anti-shake coil 32512 to increase the magnetic field strength between the first anti-shake magnet 32511 and the first anti-shake coil 32512. It should be understood that the magnetizing components 3255 disposed on the second anti-shake magnet 32521 and the third anti-shake magnet 32531 may have the same structure or different structures, and the present application does not impose any limitation on this.

[0142] Of course, in other embodiments of the present application, the magnetizing member 3255 may also be a planar structure, and only be disposed on one side of the first anti-shake device away from the first anti-shake coil 32512, and may also implement the beneficial effect of increasing the magnetic field strength between the first anti-shake magnet 32511 and the first anti-shake coil 32512. Furthermore, the magnetizing member 3255 may not contain magnetism, such as the magnetizing member 3255 may be made of ferrite, or the magnetizing member 3255 itself may be a permanent magnet.

[0143] In one embodiment of the present application, the lens driving device 24 extends into the chip driving device 32 to increase the space utilization efficiency of the camera module 100 and reduce the size of the camera module 100. Figure 5A and Fig.11 , along the Z-axis direction, at least a portion of the lens driving device 24 overlaps with at least a portion of the chip driving device 32. Of course, it can also be said that the chip driving device 32 extends into the lens driving device 24. In this way, the space utilization efficiency of the camera module 100 can be increased and the size of the camera module 100 can be reduced.

[0144] Specifically, as mentioned above, the first frame portion 3221 of the frame 322 is close to the lens module 20, and the groove of the first frame portion 3221 can be adapted to the lens focus group 21. Along the Z-axis direction, the lens focus group 21 and at least a portion of the movable carrier 243 overlap with at least a portion of the first frame portion 3221. When the movable carrier 243 drives the lens focus group 21 to move along the optical axis, the groove of the first frame portion 3221 can avoid collision between the lens focus group 21 and the first frame portion 3221. This arrangement can not only make the structure of the camera module 100 more compact, but also reduce the length of the camera module 100.

[0145] Specifically, in the present application, at least a portion of the first frame portion 3221 and at least a portion of the movable carrier 243 overlap along the first direction. For example, along the first direction, the carrier body 2431 of the movable carrier 243 is located above the first frame portion 3221 of the frame 322, so that the lens driving device 24 and the chip driving device 32 extend into each other. In this way, not only can the structure of the camera module 100 be made more compact, but also the size of the camera module 100 can be reduced.

[0146] In one embodiment of the present application, along the first direction, at least a portion of the circuit assembly 246 of the lens driving device 24 overlaps with at least a portion of the chip circuit board 311 of the chip driving device 32. In other words, along the first direction, the first circuit board 2461 and / or the second circuit board 2462 are disposed on the chip circuit board 311.

[0147] In one embodiment, along the first direction, at least a portion of the circuit assembly 246 of the lens driving device 24 overlaps at least a portion of the connection circuit board 316 of the chip driving device 32. In other words, along the first direction, the first circuit board 2461 and / or the second circuit board 2462 are disposed on the connection circuit board 316.

[0148] In the present application, the first installation space 200 of the lens module 20 and the second installation space 300 of the photosensitive module 30 overlap, so that the internal space utilization rate of the camera module 100 is higher and the size of the camera module 100 is also reduced. In other words, the lens module 20 and the photosensitive module 30 use each other's space.

[0149] Further, in the lens module 20, the guide assembly 245 is arranged at the top of the lens driving device 24. This arrangement structure reserves a certain space at the bottom of the lens driving device 24, so that the chip driving device 32 can extend from the bottom into the lens module 20. As mentioned above, the base 242 is arranged at the top, the housing 241 is arranged at the bottom, and the guide assembly 245 is fixed to the base 242, so that the guide assembly 245 can be located at the top of the lens driving device 24, so as to reserve a certain space at the bottom of the lens driving device 24, so that the chip driving device 32 can extend from the bottom into the lens module 20.

[0150] It should be understood that due to the structure of the camera module 100, interference may occur between the focus drive assembly 244 of the lens drive device 24 and the anti-shake drive assembly 325 of the chip drive device 32. Specifically, the first focus drive mechanism 2441 and the second focus drive mechanism 2442 of the focus drive assembly 244 are arranged on the left and right sides of the camera module 100 along the second direction, and the first anti-shake drive mechanism 3251 and the third anti-shake drive mechanism 3253 of the anti-shake drive assembly 325 are arranged on the left and right sides of the camera module 100 along the second direction. The overlapping arrangement of the lens drive assembly and the anti-shake drive assembly 325 may cause magnetic interference. More specifically, due to the mutual overlap between the lens drive assembly and the anti-shake drive assembly 325, magnetic interference may occur between the first focus magnet 24411 and the first anti-shake magnet 32511, and between the second focus magnet 24421 and the third anti-shake magnet 32531.

[0151] In order to avoid the above problems, in the present application, the first carrier side wall 2432 and the second carrier side wall 2433 of the movable carrier 243 are further extended toward the light entrance, so that the positions of the first focus magnet 24411 and the second focus magnet 24421 installed on the first carrier side wall 2432 and the second carrier side wall 2433 can be moved forward, that is, the first focus magnet 24411 and the second focus magnet 24421 are closer to the position of the light entrance. By increasing the distance between the first focus magnet 24411 and the first anti-shake magnet 32511, and increasing the distance between the second focus magnet 24421 and the third anti-shake magnet 32531, the magnetic interference between the lens driving device 24 and the chip driving device 32 can be reduced. In a specific example of the present application, the distance range between the first focusing magnet 24411 and the first anti-shake magnet 32511 is not less than 2 mm, and further, the distance range between the second focusing magnet 24421 and the third anti-shake magnet 32531 is not less than 2 mm.

[0152] like Fig.12 As shown, in order to improve the stability of the chip circuit board 311 during the optical image stabilization process and improve the imaging quality, a support component 324 is provided between the chip circuit board 311 and the frame 322, so that the chip circuit board 311 can always be supported when the chip circuit board 311 is driven to move relative to the frame 322. In one embodiment of the present application, the support component 324 is implemented as a ball 3241, and a ball groove 3231 needs to be provided on the bottom surface of the frame 322 and the top surface of the chip circuit board 311, respectively, to accommodate the ball 3241 therein.

[0153] However, it should be understood that it is more difficult to form the ball groove 3231 on the chip circuit board 311, and it will affect the flatness of the chip circuit board 311, and it may also cause damage to the chip circuit board 311. In order to avoid the above situation, in the present application, the package body 323 is formed on the chip circuit board 311, and the package body 323 can be integrally formed on the chip circuit board 311, or it can be prefabricated and then mounted on the chip circuit board 311. This application does not limit this. For example, in one embodiment of the present application, the package body 323 is integrally formed on the chip circuit board 311, and the ball groove 3231 is formed on the package body 323, which is not only simpler, but also has higher flatness. The support assembly 324 is clamped between the package body 323 and the frame 322 to always support the chip circuit board 311 when the chip circuit board 311 moves.

[0154] Specifically, in one embodiment of the present application, the package body 323 is integrally formed at two diagonal corners and the side opposite to the line connecting the two diagonal corners of the chip circuit board 311. The top surface of the package body 323 is formed with a ball groove 3231, and the ball 3241 is arranged in the ball groove 3231 so that the ball 3241 is clamped between the package body 323 and the frame 322.

[0155] Furthermore, the top surface of the package body 323 may be a first ball groove, and the corresponding bottom surface of the frame 322 may be a second ball groove, wherein the first ball groove and the second ball groove may be planar grooves, or the first ball groove and the second ball groove have a certain length direction, and the present application does not impose any restrictions on this.

[0156] In one embodiment of the present application, the number of balls 3241 is at least three, and the number of the first ball groove and the second ball groove is also at least three. For example, when the number of balls 3241 is four, the number of the first ball groove and the second ball groove is four, the first ball groove and the second ball groove are opposite to each other along the Z-axis direction, and the ball 3241 is clamped between the first ball groove and the second ball groove. Furthermore, one of the second ball grooves is arranged on the bottom surface between the second frame portion 3222 and the third frame portion 3223 of the frame 322, the other of the second ball grooves is arranged on the bottom surface between the third frame portion 3223 and the fourth frame portion 3224 of the frame 322, and the other two of the second ball grooves are arranged on the bottom surface of the first frame portion 3221 of the frame 322. At the position corresponding to the second ball groove, a package 323 having a first ball groove on the top surface is arranged on the chip circuit board 311.

[0157] In this way, the four balls 3241 can be arranged at two corners and one side of the chip driving device 32, respectively. It should be understood that the three balls 3241 can form a support plane. If the four balls 3241 are arranged at the four corners, four support planes will be formed. The multiple support planes make the chip circuit board 311 have the risk of tilting. In order to avoid the chip circuit board 311 from tilting, in the present application, two of the four balls 3241 are arranged at the adjacent corners of the chip circuit board 311, and the other two of the four balls 3241 are arranged at the opposite sides of the adjacent corners of the chip circuit board 311. The distance between the two balls 3241 located at the adjacent corners is greater than the distance between the two balls 3241 located at the sides, so as to ensure that the balls 3241 can stably support the chip circuit board 311.

[0158] As mentioned above, the first frame 322 includes two protrusions with a certain thickness, the bottom surfaces of the two protrusions are provided with second ball rolling grooves, and the top surface of the package body 323 is provided with first ball rolling grooves corresponding thereto. Since the first frame body has a certain thickness, it is convenient to form the ball rolling grooves 3231. In this arrangement, the two second ball rolling grooves can also be concentrated on the first frame body, and the two first ball rolling grooves can be concentrated on one side of the package body 323.

[0159] In one embodiment of the present application, the balls 3241 provide three-point support between the frame 322 and the package body 323. That is, when the number of balls 3241 is greater than or equal to three, only three balls 3241 provide support. For example, when the number of balls 3241 is four, three of the balls 3241 support the chip circuit board 311, and there is a certain gap between one ball 3241 and the first ball groove and / or the second ball groove. When the camera module 100 falls, the ball 3241 can support the chip circuit board 311 to reduce the impact.

[0160] The gap between the ball 3241 and the first ball groove and / or the second ball groove is not greater than 50 um.

[0161] In one embodiment of the present application, the anti-shake drive assembly 325 also includes a magnetic member (not shown), which is disposed on the substrate 3254 of the circuit board coil. For example, the magnetic member is disposed on the side of the first anti-shake coil 32512 away from the first anti-shake magnet 32511, so that the magnetic member and the first anti-shake magnet 32511 are arranged opposite to each other along the Z-axis direction. Further, along the Z-axis direction, at least a portion of the magnetic member overlaps with at least a portion of the first anti-shake magnet 32511, and the magnetic member can interact with the first anti-shake magnet 32511 to generate a magnetic force, so as to clamp the support assembly 324 between the frame 322 and the package body 323 through the magnetic force, so as to prevent the ball 3241 from falling off due to the shaking of the camera module 100. Of course, the magnetic element may also be disposed on the side of the second anti-shake coil 32522 away from the second anti-shake magnet 32521, and the magnetic element may also be disposed on the side of the third anti-shake coil 32532 away from the third anti-shake magnet 32531. In this way, attaching the magnetic element to the substrate 3254 of the circuit board coil can reduce the assembly steps and make the assembly of the camera module 100 simpler.

[0162] Of course, in other embodiments of the present application, a magnetic attraction component may also be provided in the package body 323, for example, the magnetic attraction component is built into the package body 323 through an insert injection molding process. In which, along the Z-axis direction, at least a portion of the magnetic attraction component overlaps with at least a portion of the first anti-shake magnet 32511, at least a portion of the second anti-shake magnet 32521, and at least a portion of the third anti-shake magnet 32531.

[0163] In one embodiment of the present application, the chip driving device 32 further includes an anti-shake position sensing element 326, and the anti-shake position sensing element 326 includes a first anti-shake sensing element 3261 and a second anti-shake sensing element 3262. The first anti-shake sensing element 3261 and the first anti-shake magnet 32511 are arranged opposite to each other along the Z-axis direction, and the second anti-shake sensing element 3262 and the second anti-shake magnet 32521 are arranged opposite to each other along the Z-axis direction. When the chip circuit board 311 moves, the relative position of the first anti-shake sensing element 3261 and the first anti-shake magnet 32511 changes, and the relative position of the second anti-shake sensing element 3262 and the second anti-shake magnet 32521 changes. The position of the chip circuit board 311 is determined according to the strength of the magnetic field sensed by the first anti-shake sensing element 3261 and the second anti-shake sensing element 3262, and then the current of the first anti-shake coil 32512 and the second anti-shake coil 32522 is adjusted to move the chip circuit board 311 to the required position. In the present application, the first anti-shake sensing element 3261 and the second anti-shake sensing element 3262 may be a Hall element, a driver IC or a TMR.

[0164] Specifically, in one embodiment of the present application, the first anti-shake sensing element 3261 and the second anti-shake sensing element 3262 are arranged on the substrate 3254 of the circuit board type coil. Specifically, the first anti-shake sensing element 3261 is arranged on the back of the first anti-shake coil 32512, that is, the first anti-shake coil 32512 is located between the first anti-shake sensing element 3261 and the first anti-shake magnet 32511; the second anti-shake sensing element 3262 is arranged on the back of the second anti-shake coil 32522, that is, the second anti-shake coil 32522 is located between the second anti-shake sensing element 3262 and the second anti-shake magnet 32521. In other words, the first anti-shake sensing element 3261 and the second anti-shake sensing element 3262 are arranged on adjacent sides of the substrate 3254.

[0165] More specifically, the chip circuit board 311 has openings at the positions of the first anti-shake sensing element 3261 and the second anti-shake sensing element 3262, so that the first anti-shake sensing element 3261 and the second anti-shake sensing element 3262 can be placed in the openings of the chip circuit board 311 to avoid increasing the height of the chip driving device 32 due to the presence of the anti-shake position sensing element 326.

[0166] It should be understood that in the present application, the magnetic attraction member and the anti-shake position sensing element 326 are both disposed on the substrate 3254 of the circuit board coil. For example, the magnetic attraction member and the anti-shake position sensing element 326 are both disposed on the back of the substrate 3254, and are disposed opposite to the anti-shake magnet along the Z-axis direction. In this way, the assembly steps of the chip driving device 32 can be reduced, making the structure of the chip driving device 32 simpler.

[0167] It is worth mentioning that, in one embodiment of the present application, a method for assembling a photosensitive module 30 is provided, which may include the following steps:

[0168] S110 , providing a chip circuit board 311 and at least one electronic component 315 , disposing at least one electronic component 315 on the chip circuit board 311 , and electrically connecting at least one electronic component 315 to the chip circuit board 311 .

[0169] S111 , forming a package body 323 at two diagonal corners of the chip circuit board 311 and at opposite sides of a line connecting the two diagonal corners, and forming a ball groove 3231 on a top surface of the package body 323 .

[0170] S112, providing a connecting circuit board 316, wherein the connecting circuit board 316 includes a fixed portion 3162, a movable portion 3161, and a deformable connecting portion 3163 connecting the fixed portion 3162 and the movable portion 3161, and the movable portion 3161 is attached upside down to the back side of the chip circuit board 311.

[0171] S113, provide a circuit board type coil, the circuit board type coil includes a substrate 3254, a first anti-shake coil 32512, a second anti-shake coil 32522 and a third anti-shake coil 32532, the first anti-shake coil 32512, the second anti-shake coil 32522 and the third anti-shake coil 32532 are formed on the substrate 3254, the circuit board type coil is arranged on the front side of the chip circuit board 311 and is electrically connected to the chip circuit board 311, and the circuit board type coil and the connecting circuit board 316 are respectively located on both sides of the chip circuit board 311.

[0172] S114, provide a photosensitive chip 312, a filter element 314 and a filter element 314 bracket 313, the photosensitive chip 312 is arranged on the front side of the chip circuit board 311, the filter element bracket 313 is fixed to the chip circuit board 311 and surrounds the circumference of the photosensitive chip 312, the filter element 314 is fixed to the filter element bracket 313, so that the filter element 314 is located on the light sensing path of the photosensitive chip 312; and a protective film is attached to the top surface of the filter element 314 to protect the filter element 314.

[0173] S115, provide an upper cover 3211 and a lower cover 3212, and fix the fixing portion 3162 of the circuit board 316 to the lower cover 3212; place the ball 3241 in the ball groove 3231 of the packaging body 323, and tear off the protective film to form a first semi-finished product.

[0174] S116, provide a frame 322 and a first anti-shake magnet 32511, a second anti-shake magnet 32521 and a third anti-shake magnet 32531, respectively install the first anti-shake magnet 32511, the second anti-shake magnet 32521 and the third anti-shake magnet 32531 at corresponding positions of the frame 322, so that the first frame portion 3221 of the frame 322 is not provided with an anti-shake magnet, and the first anti-shake magnet 32511, the second anti-shake magnet 32521 and the third anti-shake magnet 32531 are respectively provided at other positions except the first frame portion 3221; and fix the frame 322 in the upper cover 3211 to form a second semi-finished product.

[0175] S117 , assemble the first semi-finished product and the second semi-finished product into one, and fix the upper cover 3211 and the lower cover 3212 to each other to form a photosensitive module 30 .

[0176] In step S111, the ball groove 3231 on the top surface of the package body 323 may be a planar groove or a guide groove 2434 with a direction, and the shape of the ball groove 3231 may be specifically set as needed.

[0177] Among them, in step S112, the deformation of the deformable connecting portion 3163 of the connecting circuit board 316 may cause the movable portion 3161 to be offset or rotated relative to the fixed portion 3162, thereby affecting the movement stroke of the chip driving device 32. In one embodiment of the present application, the k value of the deformable connecting portion 3163 is increased to avoid unnecessary deformation of the deformable connecting portion 3163. It should be understood that the k value can also be called the elastic coefficient, which describes the magnitude of the elastic force generated per unit deformation. The larger the k value, the greater the force required for deformation per unit length, and the less likely it is to deform.

[0178] Moreover, since the movable part 3161 of the connecting circuit board 316 and the chip circuit board 311 are vertically welded up and down, the welding situation cannot be detected, and the risk of cold soldering between the movable part 3161 of the connecting circuit board 316 and the chip circuit board 311 increases. To solve the above problem, in one embodiment of the present application, a hole is opened on the movable part 3161 of the connecting circuit board 316 and / or the chip circuit board 311, and solder paste is set in the hole for soldering. After soldering, whether there is a cold soldering problem is detected by the amount of solder paste in the hole. This part will be described in detail later.

[0179] Among them, in step S115, the fixing part 3162 of the connecting circuit board 316 is only fixedly connected to the lower cover 3212, and has no fixed connection part with the upper cover 3211, which may affect the fixing strength of the connecting circuit board 316 and cause damage during the shaking or falling of the camera module 100. In order to solve the above problem, in the present application, the size of the fixing part 3162 of the connecting circuit board 316 is increased so that it can be fixedly connected not only to the lower cover 3212 but also to the upper cover 3211, so as to increase the connection strength of the chip driving device 32.

[0180] In another embodiment of the present application, a method for assembling a photosensitive module 30 is provided, which may include the following steps:

[0181] S210 , providing a chip circuit board 311 and at least one electronic component 315 , disposing at least one electronic component 315 on the chip circuit board 311 , and electrically connecting at least one electronic component 315 to the chip circuit board 311 .

[0182] S211 , forming a package body 323 at two diagonal corners of the chip circuit board 311 and at opposite sides of a line connecting the two diagonal corners, and forming a ball groove 3231 on a top surface of the package body 323 .

[0183] S212, provide a circuit board type coil, the circuit board type coil includes a substrate 3254, a first anti-shake coil 32512, a second anti-shake coil 32522 and a third anti-shake coil 32532, the first anti-shake coil 32512, the second anti-shake coil 32522 and the third anti-shake coil 32532 are arranged on the substrate 3254, and the circuit board type coil is arranged on the front side of the chip circuit board 311 and is electrically connected to the chip circuit board 311.

[0184] S213, provide a connecting circuit board 316, wherein the connecting circuit board 316 includes a fixed part 3162, a movable part 3161, and a deformable connecting part 3163 connecting the fixed part 3162 and the movable part 3161, and the movable part 3161 is attached upside down on the back side of the chip circuit board 311; the circuit board coil and the connecting circuit board 316 are respectively located on both sides of the chip circuit board 311 to form a third semi-finished product.

[0185] S214, provide a frame 322 and a first anti-shake magnet 32511, a second anti-shake magnet 32521 and a third anti-shake magnet 32531, respectively install the first anti-shake magnet 32511, the second anti-shake magnet 32521 and the third anti-shake magnet 32531 at corresponding positions of the frame 322, so that the first frame portion 3221 of the frame 322 is not provided with an anti-shake magnet, the first anti-shake magnet 32511, the second anti-shake magnet 32521 and the third anti-shake magnet 32531 are respectively provided at positions other than the first frame portion 3221, and the ball is placed in the ball groove 3231 of the frame 322; provide an upper cover 3211 and a lower cover 3212, fix the frame 322 in the upper cover 3211 to form a fourth semi-finished product

[0186] S215, assembling the fourth semi-finished product and the third semi-finished product into one.

[0187] S216, provide a photosensitive chip 312, a filter element 314 and a filter element 314 holder 313, the photosensitive chip 312 is arranged on the front side of the chip circuit board 311, the filter element 314 holder 313 is fixed to the chip circuit board 311 and surrounds the circumference of the photosensitive chip 312, the filter element 314 is fixed to the filter element holder 313, so that the filter element 314 is located on the light sensing path of the photosensitive chip 312; the photosensitive chip 312, the filter element 314 and the filter element holder 313 are arranged in the components assembled by the third semi-finished product and the fourth semi-finished product.

[0188] S217 , fixing the lower cover 3212 and the upper cover 3211 together to form a photosensitive module 30 .

[0189] Since the chip circuit board 311, the substrate 3254 of the circuit board type coil and the movable part 3161 connected to the circuit board 316 are vertically welded, the welding condition cannot be detected, and the welding of the three-layer circuit board is more complicated, which easily leads to an increased risk of poor welding between the circuit boards. Fig.15 As shown, in one embodiment of the present application, a through-hole solder paste welding structure is provided.

[0190] In this embodiment, the chip circuit board 311, the substrate 3254 of the circuit board type coil and the movable part 3161 connected to the circuit board 316 are arranged in sequence from top to bottom, the chip circuit board 311 is located on the front side of the substrate 3254 of the circuit board type coil, and the movable part 3161 connected to the circuit board 316 is located on the back side of the substrate 3254 of the circuit board type coil.

[0191] Specifically, the substrate 3254 of the circuit board type coil includes a first opening 3254a and a second opening 3254b, and the first opening 3254a and the second opening 3254b are staggered. The top surface of the movable part 3161 connected to the circuit board 316 has a PIN pin, which corresponds to the position of the first opening 3254a, and a conductive material, such as copper or other metals, is arranged on the inner surface of the first opening 3254a. And an electrical connection medium is arranged in the first opening 3254a, and the electrical connection medium climbs in the first opening 3254a to achieve electrical connection between the substrate 3254 of the circuit board type coil and the movable part 3161 connected to the circuit board 316. Among them, the electrical connection medium can be solder paste, and the solder paste is laser cured to achieve electrical connection between the substrate 3254 of the circuit board type coil and the movable part 3161 connected to the circuit board 316.

[0192] In one embodiment of the present application, the height of the electrical connection medium in the first opening 3254 a is greater than 50% of the thickness of the substrate 3254 .

[0193] More specifically, the movable part 3161 of the connection circuit board 316 includes a third opening 3161a, the third opening 3161a corresponds to the position of the second opening 3254b, the second opening 3254b and the third opening 3161a can be connected to form a through hole, and a conductive material, such as copper or other metal, is arranged on the inner surface of the second opening 3254b and the third opening 3161a. The bottom surface of the chip circuit board 311 has a chip PIN pin, the chip PIN pin corresponds to the position of the second opening 3254b and the third opening 3161a, and an electrical connection medium can be arranged in the through hole, and the electrical connection medium climbs in the through hole to achieve electrical connection between the chip circuit board 311, the base of the circuit board type coil and the movable part of the connection circuit board 316. In one embodiment of the present application, the electrical connection medium penetrates the second opening 3254b, and the height of the electrical connection medium in the third opening 3161a is greater than 50% of the thickness of the connection circuit board 316.

[0194] In one embodiment of the present application, the diameters of the second opening 3254b and the third opening 3161a are different. For example, the diameter of the third opening 3161a is larger than the diameter of the second opening 3254b, so that the electrical connection medium has a T-shaped structure in the through hole of the second opening 3254b and the third opening 3161a.

[0195] In one embodiment of the present application, conductive material may be disposed only on the inner surface of the third opening 3161a , and no conductive material may be disposed on the inner surface of the second opening 3254b , so that the chip circuit board 311 may be directly electrically connected to the connection circuit board 316 .

[0196] In one embodiment of the present application, a through-hole electrical connection medium welding method is provided, which comprises the steps of:

[0197] S310, providing a connecting circuit board 316, wherein the connecting circuit board 316 includes a fixed portion 3162, a movable portion 3161, and a deformable connecting portion 3163 connecting the fixed portion 3162 and the movable portion 3161, and the top surface of the movable portion 3161 has a PIN pin, and a solder ball is pre-mounted on the PIN pin.

[0198] S320, provide a circuit board type coil, and set the circuit board type coil on the front side of the connection circuit board 316. The circuit board type coil basically includes a first opening 3254a and a second opening 3254b, the first opening 3254a corresponds to the PIN pin, a conductive material is set on the inner surface of the first opening 3254a, and an electrical connection medium is set in the first opening 3254a to achieve electrical connection between the connection circuit board 316 and the circuit board type coil.

[0199] S330, provide a chip circuit board 311, set the chip circuit board 311 on the front of the substrate 3254 of the circuit board type coil, the back of the chip circuit board 311 has a chip PIN pin, and the chip PIN pin is pre-soldered. The movable part 3161 of the connecting circuit board 316 includes a third opening 3161a, the third opening 3161a, the second opening 3254b and the chip PIN pin correspond, and a conductive material is set on the inner surface of the second opening 3254b and the third opening 3161a. The third opening 3161a and the second opening 3254b are connected to form a through hole, and an electrical connection medium is set in the through hole to realize the electrical connection between the chip circuit board 311, the basic part of the circuit board type coil and the movable part of the connecting circuit board 316.

[0200] Further, in S320, the substrate 3254 of the circuit board type coil and the movable part 3161 connected to the circuit board 316 are assembled in a positive manner, that is, the photosensitive surface of the photosensitive chip 312 faces upward, and the electrical connection medium is arranged in the first opening 3254a in this direction.

[0201] Furthermore, in S330, the chip circuit board 311 and the circuit board coil are assembled by flipping, that is, the photosensitive surface of the photosensitive chip 312 faces downward, and the through hole formed by the second opening 3254b and the third opening 3161a of the electrical connection medium is arranged in this direction.

[0202] The above describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments. The above embodiments and the description only describe the principles of the present application. The present application may have various changes and improvements without departing from the spirit and scope of the present application. These changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the attached claims and their equivalents.

Claims

1. A camera module, characterized in that: include: A first optical path changing element, used to change the light propagating along the first direction to the second direction; A second optical path changing element, used for changing the light propagating along the second direction to the first direction; A lens focus group is disposed between the first optical path changing element and the second optical path changing element; A lens driving device, wherein the lens driving device is configured to drive the lens focus group to move along a second direction; A photosensitive component, wherein a photosensitive surface of the photosensitive component is perpendicular to the first direction, and the light emitted from the second optical path changing element is projected onto the photosensitive surface of the photosensitive component; A chip driving device, wherein the chip driving device is configured to drive the photosensitive component to move along a plane perpendicular to the first direction; Along a first direction, at least a portion of the lens driving device overlaps with at least a portion of the chip driving device; wherein the first direction is perpendicular to the second direction.

2. The camera module according to claim 1, characterized in that: The lens driving device includes a base, a movable carrier, and a guide assembly, wherein the movable carrier moves along a first direction in the base through the guide assembly, the lens focusing group is fixed to the movable carrier, the guide assembly is arranged on the top of the base, and the chip driving device extends into the lens driving device from the bottom of the base.

3. The camera module according to claim 1, characterized in that: The lens driving device also includes a shell and a base, the shell and the base are interlocked to form a first installation space, and the two ends of the lens driving device are respectively formed with a light inlet and a light outlet that are interconnected with the first installation space; the chip driving device includes an upper cover and a lower cover, the upper cover and the lower cover are interlocked to form a second installation space, wherein the first installation space overlaps with the second installation space.

4. The camera module according to claim 2, characterized in that: The base includes a top wall and a first supporting portion and a mounting portion formed on the top wall, the first supporting portion includes a first arm and a second arm arranged at intervals, the first arm and the second arm are formed on the top wall and are located on a side close to the light entrance; the mounting portion is formed on the top wall and is located on a side close to the light exit, the mounting portion includes a mounting body and a first mounting side wall and a second mounting side wall connected to the mounting body, the mounting body and the first mounting side wall and the second mounting side wall form a mounting groove, and the second optical path changing element can be arranged in the mounting groove.

5. The camera module according to claim 4, characterized in that: The base also includes a lens barrel fixing portion, which is formed on the top wall and close to the first supporting portion, and the lens barrel fixing portion includes a first fixed side wall and a second fixed side wall, and the first fixed side wall and the second fixed side wall form an installation cavity; the camera module also includes a lens fixing group, and the lens barrel fixing group is fixed in the installation cavity.

6. The camera module according to claim 5, characterized in that: The top wall of the base is implemented as a metal piece, and the metal piece includes a main body, a first extension part, a second extension part and a third extension part, the first extension part is bent and extended along a first direction from one end of the main body, and the first extension part is embedded in the first arm and the second arm of the first support part; The second extension portion is bent and extended from the other end of the main body along the first direction, and the second extension portion is embedded in the mounting portion; the third extension portion is bent from the main body along the first direction, and the third extension portion is embedded in the lens barrel fixing portion to increase the strength of the first supporting portion, the mounting portion and the lens barrel fixing portion.

7. The camera module according to claim 5, characterized in that: The movable carrier includes a carrier body and a first carrier side wall and a second carrier side wall connected to the carrier body, the first carrier side wall and the second carrier side wall extend along a second direction, the lens focus group is fixed to the carrier body, and the first carrier side wall and the second carrier side wall are located on the left and right sides of the carrier body.

8. The camera module according to claim 7, characterized in that: The first carrier side wall and the second carrier side wall extend from the carrier body toward the light entrance. The first carrier side wall, the second carrier side wall and the carrier body form a U-shaped structure with an opening toward the light entrance. The lens fixing group is accommodated in the opening.

9. The camera module according to claim 7, characterized in that: The first carrier side wall and the second carrier side wall extend from the carrier body toward the light exit, and the first carrier side wall, the second carrier side wall and the carrier body form a U-shaped structure with an opening toward the light exit, and the second light path changing element is accommodated in the opening.

10. The camera module according to any one of claims 1 to 9, characterized in that: The lens driving device also includes a focus driving assembly, which includes a first focus driving mechanism and a second focus driving mechanism. The first focus driving mechanism and the second focus driving mechanism are respectively arranged on the left and right sides of the movable carrier to provide symmetrical driving force to the movable carrier.

11. The camera module according to claim 10, characterized in that: The first focus drive mechanism includes a first focus magnet and a first focus coil, the first focus magnet is arranged on the movable carrier, and the first focus coil is arranged opposite to the first focus magnet; the line connecting the center of the first focus magnet and the center of the lens focus group is not perpendicular to the optical axis of the lens focus group.

12. The camera module according to claim 11, characterized in that: The center of the first focusing magnet is located between the center of the lens focusing group and the center of the lens fixing group.

13. The camera module according to claim 3, characterized in that: The photosensitive component includes a photosensitive chip, a chip circuit board and a connecting circuit board, the photosensitive chip is arranged on the front side of the chip circuit board and is electrically connected to the chip circuit board, and the connecting circuit board is arranged on the back side of the chip circuit board and is electrically connected to the chip circuit board; the lens driving device includes a circuit component, along a first direction, at least a portion of the chip circuit board and / or at least a portion of the connecting circuit board overlaps with at least a portion of the circuit component, and at least a portion of the circuit component is located above at least a portion of the chip circuit board and / or at least a portion of the connecting circuit board.

14. The camera module according to claim 13, characterized in that: The connecting circuit board includes a fixed part, a movable part and a deformable connecting part, the movable part is located on the inner side of the fixed part, the deformable connecting part connects the movable part and the fixed part respectively, and the straight line where one side of the movable part connected by the deformable connecting part is located is not parallel to the straight line where one side of the fixed part is located; the movable part is fixed to the back side of the chip circuit board, and the fixed part is fixed to the lower cover.

15. The camera module according to claim 14, characterized in that: The chip driving device includes a frame and an anti-shake driving component, the frame is fixed to the upper cover, and the anti-shake driving component is arranged between the chip circuit board and the frame to drive the chip circuit board to drive the photosensitive chip and the movable part of the connecting circuit board to move along a plane perpendicular to the first direction; the anti-shake driving component includes a first anti-shake driving mechanism, a second anti-shake driving mechanism and a third anti-shake driving mechanism, and the first anti-shake driving mechanism, the second anti-shake driving mechanism and the third anti-shake driving mechanism are respectively arranged on the other three sides except the side of the chip driving device extending into the lens driving device.

16. The camera module according to claim 15, characterized in that: The lens driving device includes a movable carrier, the lens focus group is fixed to the movable carrier, and the movable carrier is driven to move along the second direction; along the first direction, at least a portion of the frame overlaps with at least a portion of the movable carrier, and at least a portion of the movable carrier is located above at least a portion of the frame.

17. The camera module according to claim 15, characterized in that: The chip driving device also includes a package body and a support component. The package body is integrally formed at two diagonal corners of the chip circuit board and the sides opposite to the line connecting the two diagonal corners. A ball groove is formed on the top surface of the package body. The support component is arranged in the ball groove to be clamped between the package body and the frame. The support component provides three-point support between the frame and the package body.

18. The camera module according to claim 3, characterized in that: The photosensitive component includes a photosensitive chip, a chip circuit board and a connecting circuit board, wherein the photosensitive chip is arranged on the front side of the chip circuit board and is electrically connected to the chip circuit board; the chip driving device includes a circuit board type coil and a plurality of anti-shake magnets opposite thereto, wherein the circuit board type coil includes a substrate and a plurality of anti-shake coils formed on the substrate, wherein the substrate is arranged on the back side of the chip circuit board and is electrically connected to the chip circuit board, and the connecting circuit board is arranged on the back side of the substrate and is electrically connected to the substrate.

19. The camera module according to claim 17, characterized in that: The substrate of the circuit board type coil includes a first opening and a second opening, the top surface of the connecting circuit board has a PIN pin, and the PIN pin corresponds to the first opening, so that an electrical connection medium is set in the first opening; the connecting circuit board includes a third opening, and the second opening corresponds to the third opening, the bottom surface of the chip circuit board has a chip PIN pin, and the chip PIN pin corresponds to the second opening and the third opening, an electrical connection medium is set in the second opening and the third opening, the electrical connection medium passes through the second opening, and the height of the electrical connection medium in the third opening is greater than 50% of the thickness of the connecting circuit board.

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