Manufacturing method of OIS coil board
By adopting the two-plated method in the production of OIS coil plates, the balance problem between copper thickness and line width is solved, and the electroplated copper area with a smaller line distance is achieved, short circuit abnormalities are avoided, and product reliability and electrical performance are improved.
Patent Information
- Application Number
- CN202411877531.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-03-21
AI Technical Summary
The existing OIS coil plate production technology is difficult to find a balance between copper thickness and line width, resulting in the product line width of thicker copper thickness that cannot be larger, short circuit abnormalities are prone to occur, and the production capacity of high copper thickness products is lacking.
The method of two-time electroplating is adopted. The first electroplating is used to initially prepare the line width and line spacing, and the second electroplating further increases the copper thickness and reduces the line spacing. The layout of the electroplating copper area is optimized through the pressing step.
The electroplated copper area with a smaller line distance on the OIS coil plate is achieved, which avoids short circuit abnormalities and improves product reliability and electrical performance.
Smart Images
Figure CN119676976A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of OIS coil plates, and in particular, relates to a method for manufacturing an OIS coil plate. Background Art
[0002] In the existing technology, as the requirements of mobile phones for cameras become higher and higher, OIS products are being used more and more widely, and low-end and mid-end mobile phones are also gradually introducing applications, so the market demand is growing.
[0003] Regarding the OIS products in the current camera modules, generally speaking, only products with a copper thickness of about 30um can be produced, and there is currently no production capacity for such products with higher copper thickness.
[0004] Normal operation methods can only be electroplated once, which leads to a conflict between line width and line spacing and copper thickness, that is, the line width of products with thicker copper cannot be increased. If the copper thickness and line width are not well established, the entire board will be short-circuited and the product will be scrapped.
[0005] To address the above problems, no effective solution has been proposed yet.
[0006] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present invention and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because these solutions are described in the background technology section of the present invention. Summary of the invention
[0007] The purpose of this application is to provide a method for manufacturing an OIS coil plate to solve the above problems.
[0008] The present application provides a method for manufacturing an OIS coil plate, comprising:
[0009] Cutting the substrate;
[0010] Performing laser drilling on the substrate to obtain positioning holes on the substrate;
[0011] Laminating and exposing the substrate, wherein the exposure position corresponds to the positioning hole, so as to obtain a circuit layer on the substrate;
[0012] The substrate is subjected to DES, AOI, Desmear, PTH, and SAP line pre-processing to obtain a PTH hole on the substrate;
[0013] laminating, exposing and developing the substrate;
[0014] Performing a first electroplating on the substrate to obtain a plurality of electroplated copper areas on the substrate;
[0015] Stripping and flash etching are performed on the substrate, and AOI inspection is performed on the substrate to inspect defects on the substrate;
[0016] The substrate is electroplated for a second time and pressed:
[0017] The second electroplating is used to increase the copper thickness in the copper electroplating area and reduce the line spacing between any copper electroplating area and the adjacent copper electroplating area.
[0018] Preferably, after the step of "performing AOI inspection on the substrate", the substrate is depalladiumed to prevent copper from being formed on the copper-free area during the second electroplating.
[0019] Preferably, after the first electroplating, the line distance between any electroplated copper region and an adjacent electroplated copper region is 15 μm-25 μm, and the copper thickness is 50 μm.
[0020] Preferably, after the second electroplating, the line distance between any of the electroplated copper regions and the adjacent electroplated copper regions is 5 μm-15 μm, and the copper thickness is 50 μm.
[0021] Preferably, after the second electroplating, the line width of the electroplated copper area is less than 50 um.
[0022] Preferably, in the step of "performing a second electroplating on the substrate", an electrical lead is used as a conductor to conduct electricity for the second electroplating.
[0023] Compared with the prior art, the present invention has the following beneficial effects:
[0024] 1. The present invention can form a copper electroplating area with a smaller line pitch on a substrate by setting the first electroplating process and the second electroplating process. The preliminary copper thickness and line pitch are made during the first electroplating process. During the second electroplating process, the copper thickness on the copper electroplating area can be further increased, so that the line pitch can be gradually reduced, thereby obtaining a copper electroplating area with a smaller line pitch on the substrate.
[0025] 2. The present invention uses a palladium removal liquid to clean the copper-free area on the substrate, so that the palladium ions in the copper-free area on the substrate can be cleaned and removed. The palladium removal process can ensure the removal of palladium ions in the copper-free area of the product, thereby preventing copper from being electroplated on the copper-free area during the second electroplating, resulting in short circuit abnormalities. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0027] Figure 1 It is an overall flow chart of a method for manufacturing an OIS coil plate provided in an embodiment of the present application;
[0028] Figure 2 This is a substrate structure diagram of a method for manufacturing an OIS coil plate provided in an embodiment of the present application.
[0029] In the figure: 1. substrate; 11. copper electroplating area. DETAILED DESCRIPTION
[0030] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application.
[0031] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "upper", "middle", "lower", "inner", "outer", "front", "back", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. The terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The following describes an implementation method of the present invention based on its overall structure.
[0032] Reference Figure 1 As shown, the embodiment of the present application provides a method for manufacturing an OIS coil plate, comprising:
[0033] Cutting the substrate 1;
[0034] Performing laser drilling on the substrate 1 to obtain positioning holes on the substrate;
[0035] Laminating and exposing the substrate 1, wherein the exposure position corresponds to the positioning hole, so as to obtain a circuit layer on the substrate 1;
[0036] The substrate 1 is subjected to DES, AOI, Desmear, PTH, and SAP line pre-processing to obtain a PTH hole on the substrate 1;
[0037] Laminating, exposing and developing the substrate 1;
[0038] Performing a first electroplating on the substrate 1 to obtain a plurality of electroplated copper areas 11 on the substrate;
[0039] The substrate 1 is stripped and flash-etched, and the substrate is subjected to AOI inspection to check for defects on the substrate 1;
[0040] The substrate 1 is electroplated for the second time and pressed:
[0041] The second electroplating is used to increase the copper thickness in the electroplated copper region 11 and reduce the line spacing between any electroplated copper region 11 and the adjacent electroplated copper region 11 .
[0042] In the above process, after the substrate 1 is cut, a person skilled in the art can perform laser drilling on the substrate 1. It is understandable that positioning holes will be formed on the substrate 1 after the laser drilling.
[0043] After the positioning holes on the substrate 1 are processed, the substrate 1 is further laminated and exposed. During the exposure process, the exposure is positioned according to the position of the positioning holes, so that the exposure position can be more accurate.
[0044] After the above exposure process is completed, a circuit layer can be obtained on the substrate 1. Further, the substrate 1 is subjected to DES, AOI, Desmear, PTH, and SAP circuit pre-processing. Among them, the PTH process can obtain a PTH hole on the substrate 1. In the DES process, the substrate 1 can be developed, etched, and film-removed. The AOI process can be used to automatically optically inspect the substrate 1, so that the defects on the substrate 1 can be scanned and repaired. The Desmear process can remove the debris generated by the processing on the substrate 1, so as to ensure the stability of the processing process of the substrate 1.
[0045] Further, the skilled person in the art continues to perform lamination, exposure and development on the substrate 1, so as to form a clear circuit on the substrate 1. Then, the skilled person in the art can perform a first electroplating on the substrate 1. During the first electroplating process, the skilled person in the art can preliminarily obtain the line width.
[0046] It is understandable that during the first electroplating process, multiple electroplated copper areas can be obtained on the substrate 1. After the first electroplating process is completed, the line width can be preliminarily obtained, that is, the distance between any electroplated copper area 11 and the adjacent electroplated copper area can be preliminarily obtained, that is, the line spacing can be preliminarily obtained.
[0047] After the first electroplating is completed, the substrate 1 is stripped and flash-etched, and the substrate is subjected to AOI inspection again. In this embodiment, after the stripping and flash-etching processes are completed, the substrate 1 is continuously subjected to AOI inspection, so that the defects on the surface of the substrate 1 can be scanned and repaired again.
[0048] Furthermore, the substrate 1 is electroplated for a second time, and the substrate 1 is pressed. In this embodiment, the substrate 1 is electroplated for a second time to continue to increase the copper thickness. It is understandable that in the process of increasing the copper thickness of the electroplated copper area, the line spacing between any electroplated copper area 11 and the adjacent electroplated copper area 11 will gradually decrease.
[0049] In summary, through the first electroplating and the second electroplating process, a copper electroplating area 11 with a smaller line pitch can be formed on the substrate 1. Specifically, the initial copper thickness and line pitch are produced during the first electroplating process, and during the second electroplating process, the copper thickness on the copper electroplating area can be further increased, so that the line pitch can be gradually reduced, thereby obtaining a copper electroplating area with a smaller line pitch on the substrate.
[0050] In an optional embodiment, preferably, after the step of "performing AOI inspection on substrate 1", palladium is removed from substrate 1 to prevent copper from being plated on the copper-free area during the second electroplating. That is, after the AOI inspection of substrate 1 is completed, before the second electroplating process begins, a person skilled in the art can arrange to remove palladium from substrate 1. The palladium removal process can ensure that palladium ions are removed from the copper-free area of the product, and prevent copper from being plated on the copper-free area during the second electroplating, which may cause short circuit abnormalities.
[0051] Specifically, those skilled in the art may use a palladium removal solution to clean the copper-free area on the substrate 1 , thereby cleaning and removing the palladium ions in the copper-free area on the substrate 1 .
[0052] Preferably, after the first electroplating, the line spacing between any electroplated copper area and the adjacent electroplated copper area is 15μm-25μm, and the copper thickness is 50μm. According to the above settings, in this embodiment, after the first electroplating, the line spacing between adjacent electroplated copper areas can be 15μm-25μm, and the copper thickness is 50μm. More preferably, after the second electroplating, the line spacing between any electroplated copper area and the adjacent electroplated copper area is 5μm-15μm, and the copper thickness is 50μm. That is, after the second electroplating, the line spacing between adjacent electroplated copper areas can be processed to 5μm-15μm, and the copper thickness can be maintained at 50μm.
[0053] To sum up, after the first electroplating and the second electroplating, according to the above-mentioned settings, the line spacing between adjacent electroplated copper areas can be accurately processed between 5μm-15μm, and the copper thickness can be kept unchanged, that is, the line spacing between adjacent electroplated copper areas can be more finely processed through the secondary electroplating to obtain a smaller line spacing.
[0054] Preferably, after the second electroplating, the line width of the electroplated copper area is less than 50 um.
[0055] In an optional embodiment, preferably, in the step of "performing a second electroplating on the substrate", an electric lead is used as a conductor to conduct the second electroplating. During the second electroplating process, those skilled in the art can use the electric lead to perform electroplating, so that the second electroplating can be completed stably. And the electroplating method of the electric lead can significantly improve the electrical performance, corrosion resistance and reliability of the substrate 1.
[0056] Although different specific embodiments are mentioned in the content of this application, this application is not limited to the situations described in the industry standards or embodiments, etc. Some industry standards or slightly modified implementation plans based on the implementation of the custom methods or embodiments can also achieve the same, equivalent or similar, or predictable implementation effects after deformation of the above embodiments. The embodiments of data acquisition, processing, output, judgment methods, etc. after these modifications or deformations can still fall within the scope of the optional implementation plans of this application.
[0057] Although the present application has been described through embodiments, those skilled in the art will appreciate that there are many modifications and changes to the present application without departing from the spirit of the present application. It is intended that the attached embodiments include these modifications and changes without departing from the present application.
Claims
1. A method for manufacturing an OIS coil plate, characterized in that: include: Cutting the substrate; Performing laser drilling on the substrate to obtain positioning holes on the substrate; Laminating and exposing the substrate, wherein the exposure position corresponds to the positioning hole, so as to obtain a circuit layer on the substrate; The substrate is subjected to DES, AOI, Desmear, PTH, and SAP line pre-processing to obtain a PTH hole on the substrate; laminating, exposing and developing the substrate; Performing a first electroplating on the substrate to obtain a plurality of electroplated copper areas on the substrate; Stripping and flash etching are performed on the substrate, and AOI inspection is performed on the substrate to inspect defects on the substrate; The substrate is electroplated for a second time and pressed: The second electroplating is used to increase the copper thickness in the copper electroplating area and reduce the line spacing between any copper electroplating area and the adjacent copper electroplating area.
2. The method for manufacturing an OIS coil plate according to claim 1, characterized in that: After the step of "performing AOI inspection on the substrate", the substrate is depalladiumed to prevent copper from being formed on the copper-free area during the second electroplating.
3. The method for manufacturing an OIS coil plate according to claim 1, characterized in that: After the first electroplating, the line distance between any electroplated copper area and the adjacent electroplated copper area is 15 μm-25 μm, and the copper thickness is 50 μm.
4. The method for manufacturing an OIS coil plate according to claim 1, characterized in that: After the second electroplating, the line distance between any of the electroplated copper regions and the adjacent electroplated copper regions is 5 μm-15 μm, and the copper thickness is 50 μm.
5. The method for manufacturing an OIS coil plate according to claim 1, characterized in that: After the second electroplating, the line width of the electroplated copper area is less than 50 um.
6. The method for manufacturing an OIS coil plate according to claim 1, characterized in that: In the step of "performing a second electroplating on the substrate", an electrical lead is used as a conductor to conduct electricity for the second electroplating.