Shell assembly, manufacturing method thereof and electronic equipment

Abstract

The invention provides a shell assembly and a manufacturing method thereof, and electronic equipment, the shell assembly comprises a frame and a bearing plate, the frame is internally provided with a cavity, and the cavity extends along at least one side edge of the frame; the bearing plate is arranged in an installation space defined by the frame, and the circumferential edge of the bearing plate is fixedly connected with the frame. According to the shell assembly, the frame of the shell assembly is designed to be of the hollow structure, the thermal performance of the frame is improved under the condition that the shell assembly meets the light and thin design requirement, and the overall strength of the shell assembly can be improved.

Description

Technical Field

[0001] The present application relates to the field of terminal technology, and in particular to a housing assembly and a manufacturing method thereof, and an electronic device. Background Art

[0002] In electronic devices, a shell assembly (such as a middle frame) is usually used to carry and protect functional devices. However, as electronic devices develop towards being lighter and thinner, the weight and thickness of the shell assembly are also reduced, resulting in the shell assembly's strength failing to meet demand, and the shell assembly's thermal performance (such as thermal insulation or thermal conductivity) is poor. Summary of the invention

[0003] The present application provides a shell assembly and a manufacturing method thereof, and an electronic device, which improve the thermal performance and strength of the shell assembly while meeting the design requirements of thinness and lightness of the shell assembly.

[0004] According to some embodiments, a first aspect of the present application provides a housing assembly, comprising a frame and a bearing plate, wherein a cavity is provided inside the frame, and the cavity extends along at least one side of the frame;

[0005] The carrying plate is arranged in an installation space surrounded by the frame, and a circumferential edge of the carrying plate is fixedly connected to the frame.

[0006] In the housing assembly provided in the first aspect of the present application, a cavity extending along at least one side of the frame is provided inside the frame. By providing the cavity inside the frame, the weight of the housing assembly can be reduced. Moreover, the cavity inside the frame can form a heat-insulating space, thereby improving the heat-insulating performance of the frame and further improving the thermal performance of the housing assembly. In addition, the bearing plate is located in the installation space surrounded by the frame, and the bearing plate can serve as a supporting frame of the frame to improve the overall strength of the housing assembly.

[0007] In some embodiments, a first connection portion is provided on one side of the frame connected to the carrying plate, and the first connection portion extends along the circumference of the frame;

[0008] A second connection portion is disposed on the circumferential edge of the bearing plate. The second connection portion extends along the circumference of the bearing plate. The second connection portion is engaged and fixed with the first connection portion.

[0009] In some embodiments, the first connecting portion has two side walls that are arranged opposite to each other, at least one of the two side walls is provided with a slot, and the slot extends along the circumference of the frame;

[0010] The second connecting portion wraps around two side walls of the first connecting portion, and the second connecting portion includes a protrusion embedded in the slot, and the protrusion extends along the circumference of the frame.

[0011] In some embodiments, the second connecting portion includes a connecting plate fixedly connected to the circumferential edge of the bearing plate, and two side plates arranged at opposite ends of the connecting plate, each side plate correspondingly wrapping around the outer side of one of the side walls;

[0012] At least one of the two side plates is provided with the protrusion.

[0013] In some embodiments, taking a plane perpendicular to the extension direction of the frame as a cross section, the cross-sectional shapes of the card slot and the protrusion are both arc-shaped, triangular, square, or trapezoidal.

[0014] In some embodiments, the cavity of the frame is a closed space, and the cavity is filled with a heat-conducting medium.

[0015] In some embodiments, a heat insulating medium is disposed in the cavity of the frame.

[0016] In some embodiments, the frame is provided with at least one break and at least one shielding member corresponding to the at least one break, and the at least one break divides the frame into at least one frame segment that can serve as an antenna radiator;

[0017] A shielding member is correspondingly arranged in each of the fractures, and the shielding member blocks the fracture.

[0018] In some embodiments, the shielding member is bonded and fixed to two side surfaces of the fracture.

[0019] In some embodiments, taking a plane perpendicular to the extension direction of the frame as a cross section, the cross-sectional shape of the shielding member is the same as the cross-sectional shape of the frame.

[0020] In some embodiments, the carrier plate is provided with at least one antenna clearance area and at least one filling piece corresponding to the at least one antenna clearance area, each antenna clearance area is close to an edge of the carrier plate, and the antenna clearance area is a through hole penetrating the carrier plate in a direction perpendicular to the plane where the carrier plate is located;

[0021] Each of the filling pieces fills the corresponding antenna clearance area.

[0022] According to some embodiments of the present application, a second aspect of the present application further provides an electronic device, which includes the housing assembly described in any of the above embodiments.

[0023] In the electronic device provided in the second aspect of the present application, since it includes the housing assembly described in the first aspect, the electronic device also has the advantages of the housing assembly, which will not be elaborated here.

[0024] According to some embodiments of the present application, a third aspect of the present application further provides a method for manufacturing a housing assembly, including:

[0025] Providing rod-shaped blanks;

[0026] Extruding the rod-shaped blank to form a hollow tube;

[0027] Bending the tube to form a frame;

[0028] The frame is placed in a die-casting mold for die-casting to form a bearing plate located in the installation space surrounded by the frame, and the circumferential edge of the bearing plate is fixedly connected to the frame.

[0029] In the method for manufacturing a shell assembly provided in the third aspect of the present application, the frame and the bearing plate of the shell assembly are manufactured using two different processes, wherein the frame is manufactured into a hollow structure using an extrusion process, and then the bearing plate is die-casted on the frame using a die-casting process. Compared with manufacturing the shell assembly using full CNC processing, manufacturing the shell assembly using the extrusion process and the die-casting process reduces the process difficulty and processing time, improves the production efficiency of the shell assembly and reduces the processing cost of the shell assembly. Moreover, compared with full CNC processing, manufacturing the shell assembly using the extrusion process and the die-casting process requires little or no cutting of material, which improves the utilization rate of the rod-shaped blank and the raw material for forming the bearing plate, thereby reducing the waste of raw materials and reducing the cost of the shell assembly.

[0030] In addition, since the bearing plate is made by die-casting, not only can the bearing plate of the required shape be made at one time, but the bearing plate and the frame can also be connected as one, saving the process of welding or bonding the bearing plate and the frame together, thereby improving the production efficiency of the shell assembly. Furthermore, the shell assembly formed by the above method reduces the weight of the shell assembly because the frame is made of hollow pipes; and the cavity in the frame can be used for heat insulation, thereby improving the thermal performance of the shell assembly.

[0031] In some embodiments, the step of extruding the rod-shaped blank to form a hollow tube comprises:

[0032] Fixing the rod-shaped blank in an extrusion barrel;

[0033] Using a male die to squeeze the rod-shaped blank from one end of the rod-shaped blank to the other end;

[0034] The male die is withdrawn to form a hollow tube.

[0035] In some embodiments, the frame is provided with a first connection portion, and the first connection portion is provided with a groove;

[0036] The first connecting portion, the groove and the hollow tube are formed in the same extrusion process.

[0037] In some embodiments, the step of bending the tube to form a frame includes:

[0038] Bending the straight-line pipe into the frame-shaped pipe;

[0039] The head end and the tail end of the frame-shaped pipe are welded to form a frame of an integral structure of the frame-shaped pipe.

[0040] In some embodiments, after the step of placing the frame in a die-casting mold for die-casting to form a bearing plate located in the installation space surrounded by the frame, the manufacturing method further includes:

[0041] The frame and the carrier plate are cut to form at least one fracture in the frame and at least one antenna clearance area in the carrier plate, wherein the antenna clearance area is close to the edge of the carrier plate.

[0042] In some embodiments, after the step of cutting the frame and the carrier plate to form at least one fracture in the frame and at least one antenna clearance area in the carrier plate, the manufacturing method further comprises:

[0043] Adhere and fix the shielding member in each of the slits;

[0044] The frame and the carrier plate bonded with the shielding member are placed in an injection mold to form at least one filling member filling each antenna clearance area, and each filling member fills a corresponding antenna clearance area. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0046] Figure 1 A three-dimensional view of a housing assembly provided in an embodiment of the present application.

[0047] Figure 2 An exploded view of the housing assembly provided in an embodiment of the present application.

[0048] Figure 3 for Figure 1 Sectional view along AA direction.

[0049] Figure 4 for Figure 1 Enlarged view of area B in the middle.

[0050] Figure 5 When viewing along the Y direction Figure 4 Schematic diagram of one side of the interrupted seam.

[0051] Figure 6 for Figure 1 Schematic diagram of the shielding element.

[0052] Figure 7 A flowchart for manufacturing a shell assembly provided in an embodiment of the present application.

[0053] Figure 8 This is a front view of the rod-shaped blank in the embodiment of the present application.

[0054] Fig. 9 for Figure 8 Cross-section of the rod-shaped blank.

[0055] Fig.10 This is an end view of a hollow tube formed by extruding a rod-shaped blank in an embodiment of the present application.

[0056] Fig.11 Schematic diagram of the extrusion process of a rod-shaped blank being extruded to form a hollow tube in an embodiment of the present application.

[0057] Fig.12 This is a structural flow chart of forming a shell assembly in an embodiment of the present application.

[0058] Description of reference numerals:

[0059] 100-housing assembly;

[0060] 110-border;

[0061] 111 - fracture, 112 - shielding member, 113 - first connecting portion, 114 - slot, 115 - cavity;

[0062] 120-carrying plate;

[0063] 121 - filling piece, 122 - connecting plate, 123 - side plate, 124 - protrusion, 125 - second connecting portion, 126 - antenna clearance area;

[0064] 130-rod-shaped blank, 131-hollow tube;

[0065] 300-extrusion cylinder, 310-punch. DETAILED DESCRIPTION

[0066] As electronic devices become thinner and lighter, the weight and thickness of housing components such as the middle frame are also reduced or decreased, resulting in insufficient strength and poor thermal performance of the housing components. In addition, housing components are usually processed by computer numerical control (CNC) machine tools, which has low production efficiency and high cost.

[0067] In view of this, in order to improve the strength and thermal performance of the shell assembly in the context of lightweight electronic devices, an embodiment of the present application provides a shell assembly, which can be applied to electronic devices such as mobile phones, tablet computers, laptops, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, personal digital assistants (PDAs), driving recorders, and wearable devices (smart watches, smart bracelets) to carry and protect functional components in electronic devices.

[0068] It is understandable that the housing assembly may be a front frame, a middle frame and / or a back cover. For example, the housing assembly is used in a mobile phone, and the housing assembly may be a front frame, a middle frame and / or a battery cover of the mobile phone. The front frame, the middle frame and the battery cover are arranged in sequence along the thickness direction of the mobile phone, wherein the front frame is used to carry and protect the display screen of the mobile phone, the middle frame is used to carry and protect the motherboard, and the battery cover is used to carry and protect the battery.

[0069] like Figure 1-Figure 3 As shown, the housing assembly 100 includes a frame 110 and a carrier plate 120, wherein the frame 110 is used to protect the functional components in the electronic device. The frame 110 can be a polygonal frame such as a triangular frame or a rectangular frame, or a circular frame such as a circular frame or an elliptical frame. When the frame 110 is a polygonal frame, the frame 110 includes at least one side. For example, when the frame 110 is a rectangular frame, the frame includes four sides; when the frame 110 is a circular frame, the frame 110 includes one side.

[0070] The frame 110 is provided with a cavity 115 extending along at least one side of the frame, that is, the cavity 115 may be provided in part of the side of the frame 110, or the cavity 115 may be provided in the entire frame of the frame 110. For example, the frame 110 is a rectangular frame, and the cavity 115 may be provided in one side of the rectangular frame, or in four sides. When the cavity 115 is provided in four sides, the cavity 115 extends in parallel along the circumference of the frame 110 to form a ring, that is, the frame 110 is a hollow structure, or the frame 110 is a hollow structure.

[0071] A cavity 115 is provided in the frame 110. On the one hand, it can reduce the weight of the frame 110 to meet the design requirements of the shell assembly 100 to be lightweight. On the other hand, the cavity 115 inside the frame 110 is used to form a heat-insulating space to prevent heat from being transferred from the inside of the shell assembly 100 to the outside of the shell assembly 100 (user side), and to prevent heat from being transferred from the outside of the shell assembly 100 to the inside of the shell assembly 100, thereby improving the heat insulation performance of the frame 110 and thus improving the user experience.

[0072] The overall shape of the frame 110 can be circular, oval or rectangular. The shape of the supporting plate 120 matches the overall shape of the frame 110. Figure 1 As shown, the overall shape of the frame 110 is a rectangle, and the shape of the carrier plate 120 is also a rectangle. The inner side of the frame 110 encloses an installation space that can accommodate functional devices. The carrier plate 120 is arranged in the installation space enclosed by the frame 110, and the circumferential edge of the carrier plate 120 is fixedly connected to the frame 110. The carrier plate 120 is used to carry functional devices such as batteries, motherboards, cameras, and cables. By arranging the carrier plate 120 on the inner side of the frame 110, the carrier plate 120 can be used to carry functional devices in the electronic device, and can also be used as a supporting skeleton to improve the strength of the frame 110, thereby improving the overall strength of the housing assembly 100.

[0073] In the housing assembly provided in the embodiment of the present application, a cavity 115 is provided inside the frame 110, which can not only reduce the weight of the housing assembly 100. Moreover, the cavity 115 inside the frame 110 can form a heat-insulating space, thereby improving the heat-insulating performance of the frame 110. In addition, the bearing plate 120 is located in the installation space surrounded by the frame 110, and the bearing plate 120 can serve as a supporting frame of the frame 110, thereby improving the overall strength of the housing assembly 100.

[0074] In the above embodiment, the cavity 115 of the frame 110 is used to form an insulating space to improve the thermal insulation performance of the frame 110. In some embodiments, a thermal insulation medium may be provided in the cavity 115 of the frame 110, and the thermal insulation medium includes a porous thermal insulation material (such as honeycomb paper), a fibrous thermal insulation material (such as asbestos or ceramic fiber) and / or a powdered thermal insulation material (such as diatomaceous earth or expanded perlite). By providing a thermal insulation medium in the cavity 115 of the frame 110, the thermal insulation performance of the frame 110 can be further enhanced by the thermal insulation medium, for example, to prevent the heat generated inside the electronic device from being transferred to the frame 110 and affecting the user experience, thereby improving the thermal performance of the housing assembly 100.

[0075] In other embodiments, there is air in the cavity 115 of the frame 110, so that heat is transferred from the high temperature area to the low temperature area along the extension direction of the cavity 115, thereby achieving rapid heat dissipation of the housing assembly 100 and improving the thermal performance of the housing assembly 100. In other embodiments, the cavity 115 of the frame 110 is a closed space, and the closed space is filled with a heat-conducting medium, which can be water, oil, heat-conducting gel or heat-conducting silica gel. By filling the cavity 115 with a heat-conducting medium, heat is transferred from the high temperature area to the low temperature area along the extension direction of the cavity 115, thereby achieving rapid heat dissipation of the housing assembly 100, thereby improving the thermal performance of the housing assembly 100.

[0076] The frame 110 is fixedly connected to the peripheral edge of the carrier plate 120. As an example, Figure 3 As shown, a first connection portion 113 is provided on one side of the frame 110 connected to the carrier plate 120, and the first connection portion 113 extends along the circumference of the frame 110. In other words, the first connection portion 113 is provided on the side of the frame 110 facing the carrier plate 120, and the first connection portion 113 is located in the installation space surrounded by the frame 110 and extends along the circumference of the frame 110.

[0077] The circumferential edge of the carrier plate 120 is provided with a second connection portion 125, and the carrier plate 120 and the frame 110 are fixedly connected through the second connection portion 125 and the first connection portion 113. As an example, Figure 3 As shown, the second connection part 125 is embedded and fixed with the first connection part 113, that is, a part of the second connection part 125 is embedded in the first connection part 113, and / or a part of the first connection part 113 is embedded in the second connection part 125, so that the first connection part 113 and the second connection part 125 are embedded and fixed.

[0078] The first connection portion 113 may be a strip-shaped structure located in the installation space of the frame 110, and the cross-sectional shape of the first connection portion 113 may be a rectangle, with the plane perpendicular to the circumference of the frame 110 as the cross section. The second connection portion 125 may be a U-shaped structure located at the circumferential edge of the carrier plate 120, with the opening of the U-shaped structure facing the frame 110, and the second connection portion 125 in the U-shaped structure wraps the first connection portion 113, that is, the first connection portion 113 is embedded in the second connection portion 125, so as to realize the fixed connection between the first connection portion 113 and the second connection portion 125.

[0079] The first connecting portion 113 includes two side walls arranged opposite to each other. Figure 3Taking the shown orientation as an example, the two side walls are respectively the upper side wall and the lower side wall of the first connection part 113. The two side walls are wrapped by the second connection part 125 to achieve the interlocking fixation between the first connection part 113 and the second connection part 125. At least one of the two side walls is provided with a card slot 114, and the card slot 114 extends along the circumference of the frame 110, that is, the card slot 114 can be an annular groove extending along the circumference of the frame 110. Both side walls can be provided with a card slot 114, or one of the side walls can be provided with a card slot 114. In addition, the number of card slots 114 in the two side walls can be the same or different.

[0080] The second connection portion 125 wraps around two side walls of the first connection portion 113. As an example, Figure 3 As shown, the second connection portion 125 includes a protrusion 124 corresponding to the slot 114, the protrusion 124 extends along the circumference of the frame 110, and the protrusion 124 is embedded in the slot 114. The protrusion 124 and the slot 114 are embedded to improve the embedding force or bite force between the first connection portion 113 and the second connection portion 125, prevent the first connection portion 113 from being separated from the second connection portion 125, improve the connection reliability between the first connection portion 113 and the second connection portion 125, and further improve the connection reliability between the frame 110 and the carrier plate 120.

[0081] like Figure 3 and Figure 5 As shown, the second connection portion 125 also includes a connection plate 122 fixedly connected to the circumferential edge of the carrier plate 120, and two side plates 123 arranged at opposite ends of the connection plate 122, and the two side plates 123 correspond to the two side walls of the first connection portion 113 one by one and wrap the corresponding side walls. One of the two side plates 123 is provided with the above-mentioned protrusion 124, or both side plates 123 are provided with the above-mentioned protrusion 124. In this embodiment, both side plates 123 are provided with the protrusion 124, and correspondingly, both side walls of the first connection portion 113 are provided with the card slot 114.

[0082] The shape of the slot 114 matches the shape of the protrusion 124. Taking the plane perpendicular to the extension direction of the frame 110 as the cross section, the cross-sectional shape of the slot 114 and the protrusion 124 can be arc, triangle, square or trapezoid. Figure 3 and Figure 5 As shown, in this embodiment, the cross-sectional shapes of the slot 114 and the protrusion 124 are both arc-shaped.

[0083] The frame 110 may be a metal frame or a non-metal frame. For example, the frame 110 may be a stainless steel frame, a titanium frame, or a titanium alloy frame. In addition to protecting the functional components of the electronic device, the frame 110 may also serve as an antenna radiator of the electronic device for receiving and transmitting electromagnetic wave signals. Figure 1 , Figure 2 and Figure 4 As shown, the frame 110 is provided with at least one break 111, and the at least one break 111 divides the frame 110 into at least two frame segments. As an example, Figure 1 As shown, the frame 110 is provided with four breaks 111, which divide the frame into four frame segments. Some or all of these frame segments can be used as antenna radiators, thereby improving the signal strength of the electronic device using the housing assembly 100 and being applicable to multiple signal frequency bands.

[0084] In the case where the frame 110 is provided with a break 111, in order to ensure the strength of the frame 110, in some embodiments, a shielding member 112 is provided in each break 111, and the shielding member 112 blocks the break 111. That is, the number of shielding members 112 is the same as the number of break 111, and each shielding member 112 blocks a corresponding break 111. With such a design, the shielding member 112 can fill the break 111 of the frame 110 on the one hand, and ensure the performance of the antenna while ensuring that at least part of the frame 110 is used as the antenna radiator, so that the frame segments of the frame 110 remain integrated, and the strength of the frame 110 at the break position is improved; on the other hand, the frame 110 can be made continuous as a whole, and the aesthetics of the frame 110 can be improved. On the other hand, when a filling member is subsequently formed in the antenna clearance area, the shielding member 112 is used to prevent the molten plastic from flowing from the break 111 into the cavity 115 of the frame 110, so as to ensure that the frame 110 is a hollow structure.

[0085] When the shielding member 112 is used to close the break 111 , the shielding member 112 is connected to the end of the frame at the break 111 , for example, the shielding member 112 is bonded and fixed to the two side surfaces of the break 111 by adhesive or bonding agent.

[0086] The shielding member 112 may be made of metal or non-metal. For example, the shielding member 112 is a metal member made of the same material as the frame 110. For example, the shielding member 112 is a stainless steel shielding member. Figure 5 and Figure 6 As shown, taking the plane perpendicular to the extension direction of the frame 110 as the cross section, the shape of the shielding member 112 is the same as the cross-sectional shape of the slit 111. With such a design, the shape of the shielding member 112 is adapted to the cross-sectional shape of the frame 110, while ensuring the antenna performance when the frame is used as an antenna radiator, improving the strength of the frame 110 at the slit position, and ensuring the overall aesthetics of the frame 110.

[0087] The material of the support plate 120 may be a metal material or an alloy material. For example, the material of the support plate 120 is an aluminum alloy. Figure 1 and Figure 2As shown, the carrier plate 120 is provided with at least one antenna clearance area 126, each antenna clearance area 126 is close to the edge of the carrier plate 120, and the antenna clearance area 126 is a through hole that penetrates the carrier plate 120 in a direction perpendicular to the plane where the carrier plate 120 is located, that is, the antenna clearance area 126 is along the Figure 2 The middle Z direction penetrates the carrier board 120. By setting the antenna clearance area 126 in the carrier board 120, the antenna bandwidth can be improved, the distributed capacitance can be reduced, and the antenna performance using the frame 110 as the antenna radiator can be improved.

[0088] like Figure 1 and Figure 2 As shown, the carrier plate 120 is further provided with at least one filling piece 121, and at least one filling piece 121 corresponds to at least one antenna clearance area 126, that is, a filling piece 121 is correspondingly provided in each antenna clearance area 126, that is, each filling piece 121 fills the corresponding antenna clearance area 126. The filling piece 121 can be a plastic piece, so that the filling piece 121 can fill the antenna clearance area 126 without affecting the performance of the antenna clearance area 126.

[0089] The embodiment of the present application also provides an electronic device, which includes a display device, a back cover, and a housing assembly in any of the above embodiments, wherein a display screen is disposed on the front side of the housing assembly, and a back cover is disposed on the rear side of the housing assembly. Since the electronic device adopts the housing assembly in any of the above embodiments, the electronic device also has the advantages of the above middle frame mechanism, and the details can be referred to the above related description.

[0090] It is understandable that the electronic device may be a mobile or fixed terminal such as a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a personal digital assistant (PDA), a driving recorder, a hand-worn device (smart watch, smart bracelet), etc. The housing component may be a front frame, a middle frame and / or a back cover. For example, when the electronic device is a mobile phone, the housing component may be a front frame, a middle frame and / or a battery cover of the mobile phone. The front frame, the middle frame and the battery cover are arranged in sequence along the thickness direction of the mobile phone, wherein the front frame is used to carry and protect the display screen of the mobile phone, the middle frame is used to carry and protect the motherboard, and the battery cover is used to carry and protect the battery.

[0091] like Figure 7-Figure 12 as well as Figure 1-Figure 3 As shown, the embodiment of the present application also provides a method for manufacturing a housing assembly, the manufacturing method comprising:

[0092] Step S210, providing a rod-shaped blank.

[0093] like Figure 8 and Fig. 9 As shown, the rod-shaped blank 130 is a straight rod, or in other words, the length direction of the rod-shaped blank 130 extends in a straight line. A plane perpendicular to the extension direction of the rod-shaped blank 130 is a cross section, and the cross-sectional shape of the rod-shaped blank 130 can be circular, approximately circular, rectangular, approximately rectangular or other polygonal. In this embodiment, the cross-sectional shape of the rod-shaped blank 130 is a rectangle. The material of the rod-shaped blank 130 can be stainless steel, titanium, titanium alloy, aluminum alloy or magnesium alloy. In this embodiment, the material of the rod-shaped blank 130 is stainless steel.

[0094] Step S220: Extruding the rod-shaped blank to form a hollow tube.

[0095] Before extruding the rod-shaped blank 130, the rod-shaped blank 130 needs to be fixed in an extrusion die such as an extrusion cylinder, and then the rod-shaped blank 130 is extruded from one end to the other end using a punch. After the extrusion is completed, the punch penetrates the rod-shaped blank 130 along the length direction of the rod-shaped blank 130. After the punch is pulled out, Fig.10 As shown, the extruded rod-shaped blank 130 is formed into a hollow tube 131 .

[0096] Step S230: bending the tube to form a frame.

[0097] In the bending mold, the hollow tube 131 formed in step S220 is bent to form a frame 110 of a desired shape and size. After the straight tube 131 is bent to form a frame, in some embodiments, the head and tail ends of the tube need to be welded, such as Fig.12 As shown, the head end and the tail end of the tube 131 are Fig.12 The welding in the middle C area connects the head end and the tail end of the tube 131 together, so that the formed frame 110 is an integrated structure, which makes the size of the frame 110 stable and improves the dimensional accuracy and dimensional stability of the supporting plate 120 formed in the subsequent die-casting mold.

[0098] Step S240, placing the frame in a die-casting mold for die-casting to form a bearing plate located in the installation space surrounded by the frame, wherein the circumferential edge of the bearing plate is fixedly connected to the frame.

[0099] After the frame formed in step S230 is placed in the die-casting mold, molten metal is injected into the cavity of the die-casting mold under the action of the die-casting machine, and the molten metal solidifies to form the carrier plate 120 .

[0100] In the manufacturing method of the shell assembly provided in the embodiment of the present application, the frame 110 and the bearing plate 120 of the shell assembly 100 are manufactured by two different processes, wherein the frame 110 is manufactured into a hollow structure by an extrusion process, and then the bearing plate 120 fixedly connected to the frame 110 is die-casted in the installation space surrounded by the frame 110 by a die-casting process. Compared with the shell assembly manufactured by all CNC processing, the shell assembly 100 is manufactured by the embodiment of the present application by an extrusion process and a die-casting process, which reduces the process difficulty and processing time, improves the production efficiency of the shell assembly and reduces the processing cost of the shell assembly. Moreover, compared with the full CNC processing, the shell assembly manufactured by the extrusion process and the die-casting process has little or no cutting and removing of materials, which improves the utilization rate of the rod-shaped blank and the raw materials for forming the bearing plate, thereby reducing the waste of raw materials and reducing the cost of the shell assembly.

[0101] In addition, the shell assembly 100 formed by the above method, because the frame 110 adopts a hollow structure, on the one hand, the weight of the frame 110 is reduced; on the other hand, the hollow structure is used for heat insulation, that is, the frame 110 is formed into a heat insulation layer by using the hollow structure, which improves the heat insulation performance of the frame 110, thereby improving the thermal performance of the shell assembly 100. Further, because the bearing plate 120 is made by a die-casting process, not only can the bearing plate 120 of the required shape be made at one time, but the bearing plate 120 and the frame 110 can also be connected as a whole, saving the process of welding or bonding the bearing plate 120 and the frame 110 together, thereby improving the production efficiency of the shell assembly 100.

[0102] In some embodiments, Fig.11 As shown, the steps of extruding a rod-shaped blank to form a hollow tube include:

[0103] First, the rod-shaped blank 130 is fixed in the extrusion cylinder 300 of the die-casting mold; then, the punch 310 is used to extrude the rod-shaped blank 130 from one end to the other end of the rod-shaped blank 130. Under the extrusion of the punch 310, the rod-shaped blank 130 is extruded into a hollow tube 131 in a direction opposite to the extrusion direction of the punch 310; then, the punch 310 is pulled out from the hollow tube 131.

[0104] Compared with CNC processing, the hollow frame 110 is made by extrusion process, which reduces the process difficulty and processing time, and improves the production efficiency of the middle frame. Moreover, the rod-shaped blank 130 can be fully utilized, which reduces the waste of raw materials and reduces the production cost of the housing assembly 100.

[0105] In some embodiments, Figure 3 and Figure 5As shown, the frame 110 is provided with a first connection portion 113, and the first connection portion 113 is provided with a groove 114. The first connection portion 113 and the groove 114 are used to be fixedly connected with the second connection portion 125 of the carrier plate 120, so as to achieve a fixed connection between the frame 110 and the carrier plate 120. For the frame 110 having the first connection portion 113 and the card slot 114, when the hollow tube 131 is manufactured by an extrusion process, as shown in FIG. Fig.10 As shown, the first connection portion 113, the groove 114 and the hollow tube 131 are formed in the same extrusion process. Such a design can produce the required structure at one time while meeting the structural requirements of the frame 110, simplify the manufacturing process of the frame 110, and improve the production efficiency of the housing assembly 100.

[0106] After the step of placing the frame 110 in a die-casting mold for die-casting to form the carrier plate 120 located in the installation space surrounded by the frame 110, the manufacturing method further includes:

[0107] like Fig.12 As shown, the frame 110 and the carrier plate 120 are subjected to cutting processing, such as milling processing, to form at least one break 111 in the frame 110 and at least one antenna clearance area 126 in the carrier plate 120, and the antenna clearance area 126 is close to the edge of the carrier plate 120. Among them, at least one break 111 divides and cuts the frame 110 into multiple frame segments, and part or all of these frame segments can be used as antenna radiators, thereby improving the signal strength of the electronic device using the housing assembly 100. By providing the antenna clearance area 126, the antenna bandwidth can be improved, the distributed capacitance can be reduced, and the antenna performance using the frame 110 as the antenna radiator can be improved.

[0108] After the frame 110 and the carrier plate 120 are cut to form at least one fracture 111 in the frame 110 and at least one antenna clearance area 126 in the carrier plate 120, the manufacturing method further includes:

[0109] A shielding member 112 is bonded and fixed in each slit 111. Figure 1-Figure 6 As shown, the shielding member 112 can block the gap 111, preventing the molten plastic from flowing into the cavity 115 of the frame 110 when the filling member 121 is subsequently formed by injection molding, thereby ensuring that the frame 110 is a hollow structure.

[0110] After the shielding member 112 is set in the gap 111, the frame 110 and the carrier plate 120 bonded with the shielding member 112 are placed in an injection mold, and molten plastic is injected into the injection mold by an injection molding machine. After the molten plastic solidifies, at least one filling member 121 is formed to block the antenna clearance area 126, and each filling member 121 fills a corresponding antenna clearance area 126.

[0111] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0112] The description with reference to the terms "one example", "some embodiments", "illustrative implementation", "example", "specific example" or "some examples" etc. means that the specific features, structures, steps or characteristics described in conjunction with the implementation or example are included in at least one implementation or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same implementation or example. Moreover, the specific features, structures, steps or characteristics described may be combined in any one or more implementations or examples in a suitable manner.

[0113] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A housing assembly, characterized in that: It comprises a frame and a carrying plate, wherein a cavity is provided inside the frame, and the cavity extends along at least one side of the frame; The carrying plate is arranged in an installation space surrounded by the frame, and a circumferential edge of the carrying plate is fixedly connected to the frame.

2. The housing assembly according to claim 1, characterized in that: A first connection portion is provided on one side of the frame connected to the carrying plate, and the first connection portion extends along the circumference of the frame; A second connection portion is disposed on the circumferential edge of the bearing plate. The second connection portion extends along the circumference of the bearing plate. The second connection portion is engaged and fixed with the first connection portion.

3. The housing assembly according to claim 2, characterized in that: The first connecting portion has two side walls arranged opposite to each other, at least one of the two side walls is provided with a slot, and the slot extends along the circumference of the frame; The second connecting portion wraps around two side walls of the first connecting portion, and the second connecting portion includes a protrusion embedded in the slot, and the protrusion extends along the circumference of the frame.

4. The housing assembly according to claim 3, characterized in that: The second connecting portion includes a connecting plate fixedly connected to the circumferential edge of the bearing plate, and two side plates arranged at opposite ends of the connecting plate, each side plate correspondingly wrapping around the outer side of one of the side walls; At least one of the two side plates is provided with the protrusion.

5. The housing assembly according to claim 4, characterized in that: Taking a plane perpendicular to the extension direction of the frame as a cross section, the cross-sectional shapes of the slot and the protrusion are both arc-shaped, triangular, square or trapezoidal.

6. The housing assembly according to any one of claims 1 to 5, characterized in that: The cavity of the frame is a closed space, and the cavity is filled with a heat-conducting medium.

7. The housing assembly according to any one of claims 1 to 5, characterized in that: A heat insulating medium is arranged in the cavity of the frame.

8. The housing assembly according to any one of claims 1 to 5, characterized in that: The frame is provided with at least one break and at least one shielding member corresponding to the at least one break, and the at least one break divides the frame into at least one frame segment that can serve as an antenna radiator; A shielding member is correspondingly arranged in each of the fractures, and the shielding member blocks the fracture.

9. The housing assembly according to claim 8, characterized in that: The shielding member is bonded and fixed to two side surfaces of the fracture.

10. The housing assembly according to claim 8, characterized in that Taking a plane perpendicular to the extension direction of the frame as a cross section, the cross-sectional shape of the shielding member is the same as the cross-sectional shape of the frame.

11. The housing assembly according to claim 8, characterized in that: The carrier plate is provided with at least one antenna clearance area and at least one filling piece corresponding to the at least one antenna clearance area, each antenna clearance area is close to the edge of the carrier plate, and the antenna clearance area is a through hole penetrating the carrier plate in a direction perpendicular to the plane where the carrier plate is located; Each of the filling pieces fills the corresponding antenna clearance area.

12. An electronic device, characterized in that: Comprising a housing assembly as described in any one of claims 1-11.

13. A method for manufacturing a housing assembly, characterized in that: include: Providing rod-shaped blanks; Extruding the rod-shaped blank to form a hollow tube; Bending the tube to form a frame; The frame is placed in a die-casting mold for die-casting to form a bearing plate located in the installation space surrounded by the frame, and the circumferential edge of the bearing plate is fixedly connected to the frame.

14. The manufacturing method according to claim 13, characterized in that: The step of extruding the rod-shaped blank to form a hollow tube comprises: Fixing the rod-shaped blank in an extrusion barrel; Using a male die to squeeze the rod-shaped blank from one end of the rod-shaped blank to the other end; The male die is withdrawn to form a hollow tube.

15. The method for manufacturing a housing assembly according to claim 14, characterized in that: The frame is provided with a first connecting portion, and the first connecting portion is provided with a groove; The first connecting portion, the groove and the hollow tube are formed in the same extrusion process.

16. The method for manufacturing a housing assembly according to claim 13, characterized in that: The step of bending the tube to form a frame includes: Bending the straight-line pipe into the frame-shaped pipe; The head end and the tail end of the frame-shaped pipe are welded to form a frame of an integral structure of the frame-shaped pipe.

17. The method for manufacturing a housing assembly according to claim 13, characterized in that: After the step of placing the frame in a die-casting mold for die-casting to form a bearing plate located in the installation space surrounded by the frame, the manufacturing method further comprises: The frame and the carrier plate are cut to form at least one fracture in the frame and at least one antenna clearance area in the carrier plate, wherein the antenna clearance area is close to the edge of the carrier plate.

18. The method for manufacturing a housing assembly according to claim 17, characterized in that: After the step of cutting the frame and the carrier plate to form at least one fracture in the frame and at least one antenna clearance area in the carrier plate, the manufacturing method further comprises: Adhere and fix the shielding member in each of the slits; The frame and the carrier plate bonded with the shielding member are placed in an injection mold to form at least one filling member filling each antenna clearance area, and each filling member fills a corresponding antenna clearance area.

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