Power supply member and vibration device

Abstract

The power supply member is provided with: a bonding member having a bonding surface that can be bonded to the piezoelectric element; at least one contact part provided on the bonding member and electrically connectable to an electrode of the piezoelectric element; and a wiring portion drawn out from the bonding member. When viewed in a first direction intersecting the bonding surface, a connection portion where the bonding member and the wiring portion are connected and the contact portion are located at positions shifted from each other.

Description

Technical Field

[0001] The present invention relates to a power supply member and a vibration device having the power supply member. Background Art

[0002] Patent Document 1 discloses a droplet ejecting device having a function of reliably and efficiently ejecting droplets adhering to a beam passing region of a dome-shaped drip-proof cover. In the droplet ejecting device of Patent Document 1, a piezoelectric element and a piezoelectric element control unit are electrically connected via a flexible substrate.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-170303 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] In the droplet removal device, electrodes for applying voltage to the piezoelectric element are arranged on the extension of the flexible substrate. Therefore, when a load is applied to the flexible substrate, the electrodes may be peeled off and voltage may not be applied to the piezoelectric element.

[0008] An object of the present invention is to provide a power supply member having high bonding reliability to a piezoelectric element and a vibration device including the power supply member.

[0009] Solutions for solving problems

[0010] A power supply component according to a technical solution of the present invention comprises:

[0011] a bonding member having a bonding surface capable of bonding with the piezoelectric element;

[0012] at least one contact portion provided on the bonding member and capable of being electrically connected to an electrode of the piezoelectric element; and

[0013] a wiring portion led out from the joining member,

[0014] When viewed along a first direction intersecting the bonding surface, a connection portion where the bonding member is connected to the wiring portion and the contact portion are located at offset positions.

[0015] A vibration device according to a technical solution of the present invention comprises:

[0016] The power supply component of the technical solution;

[0017] The piezoelectric element is bonded to the bonding surface;

[0018] a vibrator that amplifies vibration of the piezoelectric element; and

[0019] A light-transmitting body is connected to one end of the vibrating body in the first direction.

[0020] Effects of the Invention

[0021] According to the present invention, it is possible to provide a power supply member having high bonding reliability to a piezoelectric element and a vibration device including the power supply member. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a perspective view showing a vibration device according to one embodiment of the present invention.

[0023] Figure 2 It is along Figure 1 Cross-sectional view along line II-II.

[0024] Figure 3 Yes means Figure 1 A stereoscopic view of a power supply component of a vibration device.

[0025] Figure 4 yes Figure 1 Bottom view of the vibration device.

[0026] Figure 5 Yes means Figure 3 A stereoscopic view of a first variant of a power supply component.

[0027] Figure 6 Yes Figure 5 Bottom view of the vibration device of the power supply component.

[0028] Figure 7 It is along Figure 6 A cross-sectional view taken along line VII-VII.

[0029] Figure 8 It means in Figure 1 A side view of a state in which a wiring portion is pulled in a vibration device.

[0030] Fig. 9 yes Figure 8 Bottom view of the vibration device.

[0031] Fig.10 This is a graph showing the relationship between the angle and the stress acting on the adhesive layer.

[0032] Fig.11 Yes means Figure 5 A cross-sectional schematic diagram of a first variant of the power supply device.

[0033] Fig.12 Yes means Figure 5A cross-sectional schematic diagram of a second variant of the power supply device.

[0034] Fig.13 Yes means Figure 5 A cross-sectional schematic diagram of a third variant of the power supply device.

[0035] Fig.14 Yes means Figure 5 A cross-sectional schematic diagram of a fourth variant of the power supply device.

[0036] Fig.15 Yes means Figure 5 A schematic top view of a fifth variant of the power supply device.

[0037] Fig.16 Yes means Figure 5 A schematic top view of a sixth variant of the power supply device.

[0038] Fig.17 Yes means Figure 5 A schematic top view of the 7th variant of the power supply device.

[0039] Fig.18 Yes means Figure 5 A schematic top view of an 8th variant of the power supply device.

[0040] Fig.19 Yes means Figure 5 A schematic top view of a 9th variant of the power supply device.

[0041] Fig. 20 Yes means Figure 1 FIG. 4 is a diagram of the simulation results of the displacement distribution in the vibration device.

[0042] Fig.21 Yes means Figure 1 A schematic cross-sectional view of a first variant of the vibration device.

[0043] Fig. 22 Yes means Figure 3 A schematic top view of a 10th variant of the power supply device.

[0044] Fig.23 Yes means Figure 5 A schematic top view of an 11th variant of the power supply device. DETAILED DESCRIPTION

[0045] A first aspect of the present invention provides a power supply member comprising:

[0046] a bonding member having a bonding surface capable of bonding with the piezoelectric element;

[0047] at least one contact portion provided on the bonding member and capable of being electrically connected to an electrode of the piezoelectric element; and

[0048] a wiring portion led out from the joining member,

[0049] When viewed along a first direction intersecting the bonding surface, a connection portion where the bonding member is connected to the wiring portion and the contact portion are located at offset positions.

[0050] According to the power supply member of the first embodiment, when viewed along the first direction intersecting the bonding surface, the connection portion and the contact portion where the bonding member is connected to the wiring portion are located at non-overlapping offset positions, thereby reducing the load applied to the contact portion when a load is applied to the wiring portion. As a result, a power supply member with high bonding reliability relative to the piezoelectric element can be realized.

[0051] A power supply member according to a second aspect of the present invention is the power supply member according to the first aspect, wherein:

[0052] The joining member has:

[0053] a component body having the joint surface; and

[0054] at least one protrusion provided on the component body, extending from the component body in a direction along the bonding surface when viewed along the first direction, and capable of bonding to a vibrating body that amplifies vibration of the piezoelectric element,

[0055] The contact portion is located at the protruding portion.

[0056] According to the power supply component of the second embodiment, the contact portion is located at the protruding portion, so when viewed along the first direction, the connecting portion where the component body is connected to the wiring portion and the protruding portion are located at offset positions. Therefore, when a load is applied to the wiring portion, the load applied to the protruding portion is reduced, and the reliability of the connection of the protruding portion with respect to the internal vibrating body can be improved.

[0057] A power supply member according to a third aspect of the present invention is the power supply member according to the second aspect, wherein:

[0058] The engaging member has a plurality of the protrusions.

[0059] According to the power supply member of the third aspect, the bonding area of ​​the protrusion to the internal vibrating body increases, and thus the bonding reliability of the protrusion to the internal vibrating body can be further improved.

[0060] A power supply member according to a fourth aspect of the present invention is the power supply member according to the second aspect or the third aspect, wherein:

[0061] The contact portion and the vibrating body are joined on a plane along the joining surface.

[0062] According to the power supply member of the fourth aspect, the contact portion and the vibrating body are bonded on the same plane, so the bonding reliability with respect to the piezoelectric element is further improved.

[0063] A fifth aspect of the present invention is a power supply member according to the first aspect, wherein:

[0064] The joining member has:

[0065] a member body capable of being joined to a vibrating body that amplifies vibration of the piezoelectric element; and

[0066] At least one protrusion is provided on the member body, extends from the member body in a direction along the joining surface when viewed along the first direction, and has the joining surface.

[0067] According to the power supply member of the fifth aspect, it is possible to realize a power supply member that can be used with vibration devices of various structures, and it is possible to increase the degree of freedom in designing the vibration device.

[0068] A sixth aspect of the present invention is a power supply member according to any one of the first to fifth aspects, wherein:

[0069] The wiring portion is led out from a portion of the joining member where vibration is small.

[0070] According to the power supply member of the sixth aspect, the wiring portion is led out from the portion of the bonding member where vibration is small, so that stress generated at the boundary between the wiring portion and the contact portion is reduced, thereby improving bonding reliability with respect to the piezoelectric element.

[0071] A seventh aspect of the present invention provides a vibration device comprising:

[0072] The power supply member according to any one of the first to sixth aspects;

[0073] The piezoelectric element is bonded to the bonding surface;

[0074] a vibrator that amplifies vibration of the piezoelectric element; and

[0075] A light-transmitting body is connected to one end of the vibrating body in the first direction.

[0076] According to the vibration device of the seventh aspect, a vibration device with high reliability can be realized by using the power supply member.

[0077] Hereinafter, an embodiment of the present invention will be described according to the accompanying drawings. In addition, the following description is essentially only illustrative and is not intended to limit the present invention, its application, or its use. Furthermore, the accompanying drawings are schematic, and the ratios of various dimensions may not be consistent with reality.

[0078] like Figure 1 and Figure 2 As shown, the vibration device 1 according to one embodiment of the present invention includes a power supply member 10 , a piezoelectric element 20 , an internal vibrator 30 (an example of a vibrator) and a lens 40 (an example of a light-transmitting body). In this embodiment, the vibration device 1 further includes a lens module 41 and an external vibrator 50 .

[0079] like Figure 2 As shown, the power supply component 10 is joined to the piezoelectric element 20, and is configured, for example, to be able to supply a drive signal from a drive circuit 60 to the piezoelectric element 20. The drive circuit 60 is composed, for example, of a printed circuit board on which mounting components are mounted. The piezoelectric element 20 supplied with the drive signal causes the internal vibrator 30 to vibrate in a first direction (for example, a Z direction) intersecting a bonding surface 111 of the power supply component 10 described later. The piezoelectric element 20 vibrates, thereby vibrating the lens 40, and foreign matter such as water droplets attached to the lens 40 is removed.

[0080] like Figure 3 As shown, the power supply member 10 includes a bonding member 11 , a contact portion 12 provided on the bonding member 11 , and a wiring portion 13 led out from the bonding member 11 .

[0081] The bonding member 11 is composed of, for example, a flexible printed circuit board, and has a member body 16, and the member body 16 has a bonding surface 111. In the present embodiment, the member body 16 has a substantially annular shape, but is not limited thereto, and can adopt any shape. The bonding surface 111 is configured to be able to be bonded to the piezoelectric element 20, and a pair of strip-shaped electrode patterns 112 and 113 are formed. The electrode patterns 112 and 113 are composed of, for example, copper foil. The bonding surface 111 is configured to have a larger bonding area with the piezoelectric element 20, thereby increasing the bonding strength relative to the piezoelectric element 20 and improving the bonding reliability relative to the piezoelectric element 20.

[0082] The contact portion 12 is configured to be electrically connectable to the electrode of the piezoelectric element 20. In this embodiment, the power supply member 10 has two contact portions 12, and one end of the electrode patterns 112 and 113 constitutes the contact portion 12. The other ends of the electrode patterns 112 and 113 are located at the top of the wiring portion 13.

[0083] The wiring portion 13 is configured to be able to communicate with the drive circuit 60 (see Figure 2 ) is electrically connected and led out from the component body 16. In the present embodiment, the wiring portion 13 is composed of a substantially T-shaped plate member extending in the radial direction from the radially inner side surface of the component body 16.

[0084] like Figure 3As shown, when observed along the first direction Z, the connection portion 14 and the contact portion 12 where the component body 16 of the joining component 11 is connected to the wiring portion 13 are located at non-overlapping offset positions. In the present embodiment, the contact portion 12 is located at a position offset in the circumferential direction relative to the connection portion 14, and an imaginary straight line L1 connecting the center point CP of the component body 16 and the connection portion 14 and an imaginary straight line L2 connecting the center point CP and the contact portion 12 form an angle θ greater than zero. In other words, the contact portion 12 is not located on the imaginary straight line L1. As an example, the imaginary straight line L2 is set to the point that passes through the center point CP and the contact portion 12 and is closest to the imaginary straight line L1 in the circumferential direction relative to the center point CP (for example Figure 4 The straight line of point 121).

[0085] The piezoelectric element 20 includes a piezoelectric body and electrodes. The piezoelectric element 20 is connected to a second portion 32 of an internal vibrating body 30 described later, for example, by an adhesive. In the present embodiment, the piezoelectric element 20 is formed in a substantially annular shape when viewed along the first direction Z.

[0086] like Figure 4 As shown, on the surface 201 (see Figure 2 ) is provided with two electrodes 21 and 22 which are electrically independent of each other. The electrode 21 contacts the contact portion 12 formed by one end of the electrode pattern 112 located on the radially outer side. The electrode 22 contacts the contact portion 12 formed by one end of the electrode pattern 113 located on the radially inner side. The surface 202 (refer to Figure 2 ) is provided with an electrode (not shown) connected to the electrode 22. The electrode 22 on the surface 201 and the electrode 21 on the surface 202 are connected via an electrode (not shown) provided on the side surface of the piezoelectric element 20.

[0087] The piezoelectric element 20 may be made of, for example, barium titanate (BaTiO3), lead zirconate titanate (PZT: PbTiO3·PbZrO3), lead titanate (PbTiO3), lead metaniobate (PbNb2O6), bismuth titanate (Bi4Ti3O 12 ), (K,Na)NbO3 and other piezoelectric ceramics, or LiTaO3, LiNbO3 and other piezoelectric single crystals.

[0088] The electrode of the piezoelectric element 20 is composed of, for example, a Ni electrode or an electrode of a metal thin film containing Ag or Au. The electrode containing a metal thin film is formed by, for example, sputtering, plating, or vapor deposition.

[0089] The internal vibrator 30 is configured to amplify the vibration from the piezoelectric element 20 and vibrate the lens 40. The internal vibrator 30 is formed of, for example, a metal such as stainless steel, aluminum, iron, titanium, duralumin, or ceramics. The surface of the internal vibrator 30 may also be subjected to surface treatment such as oxidation treatment or aluminum anodizing treatment in order to improve the adhesion of the adhesive. If the surface of the internal vibrator 30 is, for example, black, it is possible to further prevent the degradation of optical performance caused by diffuse reflection of light.

[0090] In this embodiment, as an example, the internal vibrating body 30 has a cylindrical body. Figure 2 As shown, the internal vibrator 30 includes a first portion 31 in contact with the lens 40, a second portion 32 on which the piezoelectric element 20 is mounted, and a third portion 33 having a substantially S-shaped cross-sectional shape connecting the first portion 31 and the second portion 32. The first portion 31 has a cylindrical shape extending along the axial direction of the cylindrical body (that is, the first direction Z). The radially outer end of the first portion 31 constitutes a fitting portion 34 connected to the external vibrator 50. The second portion 32 is a portion that vibrates together with the piezoelectric element 20, and has a larger plate thickness than the first portion 31 and the third portion 33. As a result, it is easier to efficiently transmit the vibration of the piezoelectric element 20 to the lens 40. The third portion 33 is a portion that supports the first portion 31 and transmits the vibration of the second portion 32 to the first portion 31. The first portion 31, the second portion 32, and the third portion 33 may be formed integrally or separately. The maximum outer dimension of the third portion 33 (for example, the maximum dimension in the X direction) is larger than that of the first portion 31, and the maximum outer dimension of the second portion 32 is larger than that of the third portion 33. Thus, the vibration of the piezoelectric element 20 can be efficiently transmitted to the lens 40.

[0091] The lens 40 cooperates with the lens module 41 arranged in series in the first direction Z to form an optical imaging surface. The lens 40 is made of glass, for example, and has a convex shape protruding in the direction away from the power supply member 10 in the first direction Z. The surface of the lens 40 is coated with, for example, a water-repellent film and an anti-reflection film (AR coating). Figure 2 As shown, the surface of the lens 40 facing the lens module 41 is composed of a flat surface portion 42 and a concave portion 43. The flat surface portion 42 is connected to the first portion 31 of the internal vibrator 30.

[0092] The lens module 41 is composed of a plurality of lenses, and is located in the internal space of the internal vibrator 30. The lens module 41 has an optical performance capable of forming an image as an imaging element by being combined with the lens 40.

[0093] The external vibrator 50 can prevent the vibration of the internal vibrator 30 from being released to components other than the lens 40, and can efficiently transmit the vibration to the lens 40. In addition, the external vibrator 50 is provided in a manner covering the entire internal vibrator 30, protecting the internal vibrator 30 and the lens module 41. The external vibrator 50 is made of a metal material such as stainless steel, aluminum, iron, titanium, duralumin, or resin.

[0094] In this embodiment, as an example, the external vibrator 50 has a hollow quadrangular prism shape. Figure 2 As shown, the external vibrator 50 includes a first connection portion 51 , a second connection portion 52 connected to the first connection portion 51 , and a fixing portion 53 connected to the second connection portion 52 .

[0095] The first connection portion 51 is configured to be able to sandwich the radially outer end of the lens 40 in the first direction Z together with the first portion 31 of the internal vibrating body 30. This prevents the lens 40 from falling off from the vibration device 1 when the lens 40 vibrates. In the present embodiment, the first connection portion 51 is located radially outside the first portion 31 of the internal vibrating body 30 and the lens 40, and extends from the second connection portion 52 along the first direction Z toward the outside of the vibration device 1. A protrusion 511 that protrudes radially toward the lens 40 is provided at one end of the first connection portion 51 in the first direction Z. The radially outer end of the lens 40 is sandwiched in the first direction Z by the protrusion 511 and the first portion 31 of the internal vibrating body 30.

[0096] The second connection portion 52 is configured to absorb vibration generated in the lens 40. In the present embodiment, the second connection portion 52 extends in a ring shape from the other end of the first connection portion 51 in the first direction Z to a direction intersecting the first direction Z (e.g., the X direction). The thickness of the second connection portion 52 is smaller than the thickness of the fixing portion 53, for example, a thickness of not less than 0.2 mm and not more than 1.0 mm. In addition, the thickness of the second connection portion 52 is not less than 0.2 times and not more than 1.5 times the thickness of the third portion 33. Since the second connection portion 52 has such a thin wall thickness, it has a function as a leaf spring.

[0097] The fixing portion 53 is connected to components such as a housing for storing an imaging element and a lens module 41. The fixing portion 53 is configured so that there are nodes that suppress vibrations of less than 1 / 100 of the displacement of the lens 40, and the vibrations are not propagated to the connected components. The larger the volume of the fixing portion 53, the more the vibration of the fixing portion 53 can be suppressed. In the present embodiment, the fixing portion 53 has a quadrilateral shape. If the outer shape is a quadrilateral shape, the volume of the fixing portion 53 can be increased without increasing the size of the vibration device 1. For example, the volume of a 25 mm × 25 mm cube is larger than the volume of a cylindrical shape with a diameter of 25 mm.

[0098] If there are recesses such as grooves in the external vibrator 50, foreign matter such as water droplets and mud may accumulate there, and the accumulated foreign matter may cause the vibration performance to deteriorate. In the present embodiment, the corners of the external vibrator 50 are chamfered to, for example, R2.5 or more. As a result, metal fatigue caused by ultrasonic vibration is reduced, and the formation of recesses in the external vibrator 50 can be suppressed. In addition, by chamfering the corners of the external vibrator 50, even a wide-angle lens 40 with a viewing angle of 180 degrees or more can prevent the corners of the external vibrator 50 from being captured.

[0099] According to the power supply member 10 and the vibration device 1 of the present invention, the following effects can be achieved.

[0100] The power supply component 10 includes: a bonding member 11 having a bonding surface 111 capable of bonding to the piezoelectric element 20; a contact portion 12, which is provided on the bonding member 11 and can be electrically connected to the electrode of the piezoelectric element 20; and a wiring portion 13, which is led out from the bonding member 11. When viewed along the first direction intersecting the bonding surface 111, the connection portion 14 and the contact portion 12, where the bonding member 11 is connected to the wiring portion 13, are located at offset positions. With such a structure, the load applied to the contact portion 12 when a load is applied to the wiring portion 13, can be reduced. As a result, a power supply component 10 with higher bonding reliability relative to the piezoelectric element 20 can be realized.

[0101] The vibration device 1 includes a power supply member 10, a piezoelectric element 20 bonded to a bonding surface 111, an internal vibration body 30 for amplifying the vibration of the piezoelectric element 20, and a lens 40 connected to one end in the first direction of the internal vibration body 30. With such a structure, a vibration device 1 with high reliability can be realized.

[0102] The power supply member 10 and the vibration device 1 of the present invention can also be configured as follows.

[0103] like Figure 5 to Figure 7 As shown in FIG. 1 , the bonding member 11 may also include: a member body 16 having a bonding surface 111; and at least one protrusion 15 provided on the member body 16. The protrusion 15 is configured to extend from the member body 16 in a direction along the bonding surface 111 when viewed along the first direction Z, and can be bonded to the internal vibrator 30 that amplifies the vibration of the piezoelectric element 20. In the present embodiment, the protrusion 15 has a substantially rectangular shape in which the circumferential direction relative to the center point CP becomes the longitudinal direction, but the present invention is not limited thereto, and any shape can be adopted.

[0104] exist Figure 5 to Figure 7 In the power supply member 10, the contact portion 12 is located at the protruding portion 15. Figure 5 to Figure 7In the power supply member 10 , the contact portion 12 of the radially outer electrode pattern 112 is located at the bonding surface 111 of the member body 16 , and the contact portion 12 of the radially inner electrode pattern 113 is located at the protruding portion 15 .

[0105] The imaginary straight line connecting the center point CP and the contact portion 12 of the electrode pattern 112 on the radially outer side is set as L3, and the imaginary straight line connecting the center point CP and the contact portion 12 of the electrode pattern 113 on the radially inner side is set as L4. The imaginary straight line L1 and the imaginary straight line L3 form an angle θ1 greater than zero, and the imaginary straight line L1 and the imaginary straight line L4 form an angle θ2 greater than zero. As an example, the imaginary straight lines L3 and L4 are set to the points that pass through the center point CP and the contact portion 12 in the circumferential direction relative to the center point CP (for example, Figure 6 In this way, the connection portion 14 and the protrusion 15 connecting the component body 16 and the wiring portion 13 are located at offset positions, specifically, at different positions in the circumferential direction relative to the center point CP, so when a load is applied to the wiring portion 13, the load applied to the protrusion 15 is reduced, and the bonding reliability of the protrusion 15 with respect to the internal vibrator 30 can be improved.

[0106] exist Figure 5 to Figure 7 In the power supply component 10, as Figure 7 As shown, the second portion 32 of the internal vibrating body 30 has a protrusion 321 extending toward the protrusion 15 of the power supply member 10. The protrusion 321 is a substantially annular shape that is substantially quadrilateral in cross-sectional view, and the top end surface 322 opposite to the protrusion 15 and the surface 201 of the piezoelectric element 20 opposite to the bonding surface 111 are located substantially on the same plane. The contact portion 12 and the internal vibrating body 30 are bonded on a plane along the bonding surface 111. Thus, power can be supplied from the internal vibrating body 30 to the surface of the piezoelectric element 20 opposite to the internal vibrating body 30. As a result, it is not necessary to provide a wiring layer for attenuating vibration between the piezoelectric element 20 and the internal vibrating body 30, and the vibration performance of the vibration device 1 having the power supply member 10 can be improved. In addition, since the contact portion 12 and the internal vibrating body 30 are bonded on the same plane, the bonding reliability with respect to the piezoelectric element 20 is further improved.

[0107] Here, it is assumed that, in the vibration device 1, the wiring portion 13 is pulled in the first direction Z in a direction away from the lens 40 at a force F=1500 N / m (see Figure 8 ), the power supply member 10 and the piezoelectric element 20 of the connecting portion 14 are bonded by an adhesive layer. In this case, by arranging the protrusion 15 at a position where the stress (maximum principal stress) acting on the adhesive layer due to pulling the wiring portion 13 becomes less than the strength of the adhesive layer, the bonding reliability of the protrusion 15 relative to the internal vibrator 30 can be improved. The adhesive layer can be composed of any material.

[0108] Fig.10 represents the angle θ5 formed between the imaginary straight line L1 and an arbitrary imaginary straight line L5 passing through the center point CP (see Fig. 9 ) and the stress of the adhesive layer acting on the imaginary straight line L5. Fig.10 As shown, when the strength of the adhesive layer is 40 MPa, a stress of less than 40 MPa acts on the adhesive layer at a position where the angle θ5 is greater than 2.5 degrees. That is, when the strength of the adhesive layer is 40 MPa, by providing the protrusion 15 at a position farther from the imaginary straight line L1 than the imaginary straight line L5 at which the angle θ5 is 2.5 degrees in the circumferential direction, the reliability of the connection of the protrusion 15 with respect to the internal vibrating body 30 is improved.

[0109] The force F pulling the wiring portion 13 is defined as "1500 N / m" based on the force applied to the handrail in Experiment No. 5 described in "Measurement Experiment of Horizontal Load on Handrail by Various Human Movements, Technical Report Collection of the Architectural Institute of Japan, Vol. 16, No. 33, 649-654, June 2010".

[0110] As an example, the protrusion height of the protrusion 15 (in other words, the length of the protrusion 15 protruding in the radial direction from the radial inner side of the component body 16) is set so that the protrusion 15 overlaps with the protrusion 321 of the internal vibrator 30 but does not overlap with the lens 40 when viewed along the first direction Z. Thus, interference between the protrusion 15 and the lens 40 and the lens module 41 can be avoided.

[0111] like Fig.11 As shown in FIG. 1 , the wiring portion 13 can be bent. By positioning the wiring portion 13 on the piezoelectric element 20 side, interference between the wiring portion 13 and internal components (eg, the lens module 41) can be avoided. Fig.12 As shown, the protrusion 15 may be a substantially L-shaped cross-sectional shape that engages with the top end surface 322 and the side surface 323 of the protrusion 321 of the internal vibrator 30. Fig.13 and Fig.14 As shown, the protrusion 15 may also be configured to be engageable with the side surface 324 of the second portion 32. Fig.14 In the embodiment, an inclined surface 325 is formed on the side surface 324 (the side surface opposite to the side surface 323) of the internal vibrating body 30, and the protrusion 15 is in surface contact with the inclined surface 325. Fig.15 As shown, the protrusion 15 is not limited to one, such as Fig.15 As shown, multiple settings can be made. Fig.15 In the embodiment, the power supply member 10 includes two protrusions 15. With this configuration, the bonding area of ​​the protrusion 15 with respect to the internal vibrating body 30 increases, so the bonding reliability of the protrusion 15 with respect to the internal vibrating body 30 is further improved. Figure 11 to Figure 14In FIG. 1 , components other than the power supply component 10, the piezoelectric element 20, and the internal vibrator 30 are omitted. Fig.15 In FIG. 1 , the electrode pattern of the bonding surface 111 is omitted.

[0112] When a plurality of protrusions 15 are provided, the plurality of protrusions 15 may be located at equal intervals in the circumferential direction, or may be located at symmetrical positions with respect to the center point CP of the member body 16 .

[0113] The component body 16 is not limited to being substantially annular in shape, but may also be Figure 16 to Figure 18 As shown in the figure, it is substantially C-shaped. By configuring in this way, the wiring portion 13 can be formed longer, for example, to facilitate inspection. In this case, the power supply member 10 can also be configured as shown below. In the following structure, Fig.23 As shown in FIG. 1 , the angle formed by the virtual straight line L1 and the virtual straight line L6 is set to θ6, the angle formed by the virtual straight line L6 and the virtual straight line L7 is set to θ7, the angle formed by the virtual straight line L1 and the virtual straight line L8 is set to θ8, and the angle formed by the virtual straight line L8 and the virtual straight line L9 is set to θ9. The virtual straight line L6 is set to be a virtual straight line passing through the center point CP and the portion of the protrusion 15 closest to the virtual straight line L1 in the circumferential direction. The virtual straight line L7 is set to be a virtual straight line passing through the center point CP and the portion of the protrusion 15 farthest from the virtual straight line L1 in the circumferential direction. The virtual straight line L8 is set to be a virtual straight line symmetrical to the virtual straight line L6 with respect to the virtual straight line L1, and the virtual straight line L9 is set to be a virtual straight line symmetrical to the virtual straight line L7 with respect to the virtual straight line L1. That is, the angle θ6 and the angle θ8 are the same angle, and the angle θ7 and the angle θ9 are the same angle.

[0114] Angle θ6 = Angle θ8 ≥ 2.5 degrees

[0115] Angle θ7 = Angle θ9 ≥ 30 degrees

[0116] By setting the angle θ6 and the angle θ8 to be greater than 2.5 degrees, as described above, it is possible to improve the reliability of the connection between the protrusion 15 and the internal vibrator 30. By setting the angle θ7 and the angle θ9 to be greater than 30 degrees, it is possible to more reliably ensure the conduction between the protrusion 15 and the internal vibrator 30, and to ensure a sufficient bonding area of ​​the power supply member 10 to the internal vibrator 30.

[0117] The wiring portion 13 is not limited to Fig.16 and Fig.18 As shown in FIG. 1 , the radially inner side of the component body 16 may be provided. Fig.17 and Fig.19 As shown, it is provided radially outside the component body 16.

[0118] like Fig.18As shown in FIG. 1 , the component body 16 may be joined to the internal vibrating body 30, and the protruding portion 15 may have a joining surface 111. Fig.18 In the power supply member 10, the member body 16 is configured to be engageable with the protrusion 321 of the internal vibrator 30. In this way, the power supply member 10 that can be used with the vibration device 1 of various structures can be realized, and the degree of freedom in designing the vibration device 1 can be increased.

[0119] The wiring portion 13 may be led out from a portion of the bonding member 11 where vibration is small. With this configuration, stress generated at the boundary between the wiring portion 13 and the contact portion 12 is reduced, and bonding reliability to the piezoelectric element 20 is improved.

[0120] Here, refer to Fig. 20 The simulation results of the displacement distribution in the vibration device 1 are described below. In the simulation, Femtet (registered trademark) manufactured by Murata Software Co., Ltd. Figure 7 The vibration device 1 of FIG. 1 was subjected to piezoelectric analysis (resonance analysis). In the simulation, a member made of a material equivalent to glass was used for the lens 40, a member made of a material equivalent to stainless steel was used for the internal vibration body 30 and the external vibration body 50, and a member made of a material equivalent to PZT (lead zirconate titanate) was used for the piezoelectric element. Fig. 20 As shown, it can be seen that Figure 7 In the vibration device 1, the radial inner side of the component body 16 is a portion with smaller vibration (amplitude).

[0121] In the possession Fig.21 In the vibration device 1 having the substantially C-shaped internal vibration body 30 shown in the figure, the internal vibration body 30 behaves like a tuning fork. Therefore, the end 203 of the piezoelectric element 20 close to the portion (indicated by the dotted line) of the internal vibration body 30 extending in the first direction Z vibrates less, and the end 203 of the piezoelectric element 20 away from the internal vibration body 30 in the direction intersecting the first direction Z (for example, the X direction) vibrates less. Fig.21 The end portion 204 of the portion indicated by the dotted line in FIG. 1 vibrates more. Fig.21 In the vibration device of the internal vibrator 30 shown, the wiring portion 13 is led out from a portion of the bonding member 11 close to the end portion 203 of the piezoelectric element 20 , so that the bonding reliability with respect to the piezoelectric element 20 can be improved.

[0122] The direction of the lead-out wiring portion 13 can be set arbitrarily. Fig. 22 As shown, the wiring portion 13 is led out from the radially inner side of the member body 16 toward the radially outer side.

[0123] In the bonding member 11 , not limited to the electrode patterns 112 and 113 , an electrode pattern of any structure in which the contact portion 12 is not located on the virtual straight line L1 can be formed.

[0124] The power supply member 10 is not limited to being applied to the vibration device 1 of the above-described embodiment, but can also be applied to vibration devices of other structures.

[0125] By appropriately combining any of the various embodiments or variations, the effects of each embodiment or variation can be achieved. In addition, the embodiments can be combined with each other, the embodiments can be combined with each other, or the embodiments and the embodiments can be combined, and the features in different embodiments or embodiments can also be combined with each other.

[0126] In each embodiment, the present invention is described in detail to a certain extent, but the disclosure of these embodiments should be changed in structural details, and the combination and order of elements in each embodiment can be achieved without departing from the scope and concept of the claimed invention.

[0127] Description of Reference Numerals

[0128] 1. Vibration device; 10. Power supply member; 11. Joining member; 12. Contact portion; 13. Wiring portion; 14. Connecting portion; 15. Protrusion; 16. Component body; 20. Piezoelectric element; 21, 22. Electrode; 30. Internal vibrator; 31. First part; 32. Second part; 33. Third part; 34. Fitting portion; 40. Lens; 41. Lens module; 42. Plane portion; 43. Concave portion; 50. External vibrator; 51. First connecting portion; 511. Protrusion; 52. Second connecting portion; 53. Fixing portion; 60. Driving circuit; 111. Joining surface; 112, 113. Electrode pattern.

Claims

1. A power supply component, comprising: a bonding member having a bonding surface capable of bonding with the piezoelectric element; at least one contact portion provided on the bonding member and capable of being electrically connected to an electrode of the piezoelectric element; and a wiring portion led out from the joining member, When viewed along a first direction intersecting the bonding surface, a connection portion where the bonding member is connected to the wiring portion and the contact portion are located at offset positions.

2. The power supply member according to claim 1, wherein: The joining member has: a component body having the joint surface; and at least one protrusion provided on the component body, extending from the component body in a direction along the bonding surface when viewed along the first direction, and capable of bonding to a vibrating body that amplifies vibration of the piezoelectric element, The contact portion is located at the protruding portion.

3. The power supply member according to claim 2, wherein: The engaging member has a plurality of the protrusions.

4. The power supply member according to claim 2 or 3, wherein: The contact portion and the vibrating body are joined on a plane along the joining surface.

5. The power supply member according to claim 1, wherein The joining member has: a member body capable of being joined to a vibrating body for amplifying vibration of the piezoelectric element; as well as At least one protrusion is provided on the member body, extends from the member body in a direction along the joining surface when viewed along the first direction, and has the joining surface.

6. The power supply member according to any one of claims 1 to 5, wherein: The wiring portion is led out from a portion of the joining member where vibration is small.

7. A vibration device comprising: The power supply component according to any one of claims 1 to 6; The piezoelectric element is bonded to the bonding surface; a vibrator that amplifies vibration of the piezoelectric element; and A light-transmitting body is connected to one end of the vibrating body in the first direction.

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