Substrate conveyance system and substrate position adjustment method

Abstract

The present invention improves productivity when conveying at least two substrates. Provided is a substrate transfer system comprising: a transfer unit that has a holding member that holds at least two substrates together so as to be arranged in the horizontal direction, and that transfers the held substrates from a transfer source to a transfer destination; a plurality of mounting tables which are provided at a transfer destination in which the substrates held by the holding member are respectively mounted on the plurality of mounting tables; a support member provided on each of the mounting tables, capable of moving in the vertical direction relative to each of the mounting tables, the support member temporarily supporting each of the substrates in the midway of mounting each of the substrates from the holding member to each of the mounting tables, and separating each of the substrates from the holding member; and a plurality of moving units that individually move the respective support members in the horizontal direction, in which the position adjustment of the respective substrates with respect to the respective mounting tables is performed by the movement of the first substrate and the movement of the second substrate, and in the movement of the first substrate, the position of the respective substrates with respect to the respective mounting tables is adjusted by the movement of the second substrate. In the first substrate movement, the substrates held by the holding members are moved on the mounting tables by the conveying unit, and in the second substrate movement, the substrates supported by the supporting members are moved on the mounting tables by the moving unit.

Description

Technical Field

[0001] The present invention relates to a substrate transport system and a substrate position adjustment method. Background Art

[0002] When plasma treatment is applied to a wafer, for example, it is necessary to accurately arrange the wafer at a specified position in a process chamber. Therefore, various wafer alignment methods have been proposed in the past. For example, a device is disclosed in patent document 1, which has a conveying arm for conveying wafers, a loading platform for loading wafers, a substrate handover device for handing over wafers from the conveying arm to the loading platform, and a substrate position detection device for detecting the position of the wafer in the horizontal direction when handing over the wafer. In the device described in the patent document 1, the substrate handover device has a plurality of pins supporting the wafer and a driving unit driving the pins in the horizontal direction (X direction and Y direction). In addition, the substrate position detection device has a plurality of camera units for photographing the peripheral portion of the wafer. Moreover, in the device described in patent document 1, when the substrate handover device receiving the wafer from the conveying arm places the wafer on the loading platform, based on the camera results of each camera unit, the pins are driven in the horizontal direction for each wafer, thereby performing position deviation correction of the wafer in the horizontal direction.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2008-66372 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] The technology according to the present disclosure improves the productivity when conveying at least two substrates.

[0008] Solutions for solving problems

[0009] One mode of the technology involved in the present disclosure comprises: a conveying unit having a holding member for holding at least two substrates together in a manner of arranging them in a horizontal direction, the conveying unit conveying each of the substrates held by the holding member from a conveying source to a conveying destination; a plurality of loading tables, the plurality of loading tables being arranged at the conveying destination, and at the conveying destination, each of the substrates held by the holding member is respectively placed on the plurality of loading tables; a supporting member, which is arranged at each of the loading tables and can move in a vertical direction relative to each of the loading tables, and the supporting member carries each of the substrates from the holding member to each of the loading tables. Temporarily supporting each of the substrates in the middle of the substrate to separate each of the substrates from the holding members; and a plurality of moving units, which move each of the supporting members independently in the horizontal direction, wherein the position of each of the substrates relative to each of the mounting tables is adjusted by a first substrate movement and a second substrate movement, in which the first substrate movement is performed, the conveying unit is used to move each of the substrates held on the holding members on each of the mounting tables, and in which the second substrate movement is performed, the moving unit is used to move each of the substrates supported on the supporting members on each of the mounting tables.

[0010] Effects of the Invention

[0011] According to the present disclosure, it is possible to improve the productivity when conveying at least two substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic plan view schematically showing an example of the structure of a substrate transfer system as a first embodiment of the technology involved in the present disclosure.

[0013] Figure 2A is shown in order Figure 1 Three views of an example of the operating state of the substrate transport system shown.

[0014] Figure 2B is shown in order Figure 1 Three views of an example of the operating state of the substrate transport system shown.

[0015] Figure 2C is shown in order Figure 1 Three views of an example of the operating state of the substrate transport system shown.

[0016] Figure 2D is shown in order Figure 1 Three views of an example of the operating state of the substrate transport system shown.

[0017] Figure 2E is shown in order Figure 1Three views of an example of the operating state of the substrate transport system shown.

[0018] Figure 2F is shown in order Figure 1 Three views of an example of the operating state of the substrate transport system shown.

[0019] Figure 2G is shown in order Figure 1 Three views of an example of the operating state of the substrate transport system shown.

[0020] Figure 2H is shown in order Figure 1 Three views of an example of the operating state of the substrate transport system shown.

[0021] Fig.2I is shown in order Figure 1 Three views of an example of the operating state of the substrate transport system shown.

[0022] Figure 2J is shown in order Figure 1 Three views of an example of the operating state of the substrate transport system shown.

[0023] Figure 3 It is a schematic plan view schematically showing an example of the structure of a substrate transfer system as a second embodiment of the technology involved in the present disclosure. DETAILED DESCRIPTION

[0024] In the technology of the above-mentioned patent document 1, it is necessary to drive the pins in the X direction and the Y direction, so the structure of the pin driving unit becomes complicated and the cost also increases. Therefore, it is also proposed that in the position alignment of the wafer, the wafer is moved by using a transfer arm so that the wafer does not need to be moved by using pins. In addition, it is also proposed that the transfer arm transfers multiple wafers to improve the transfer efficiency and processing efficiency of the wafer.

[0025] However, when the transfer arm transfers a plurality of wafers, if the transfer arm is used to align the wafers, the transfer arm must be moved in the X and Y directions each time each wafer is aligned. This may deteriorate the productivity of aligning all wafers.

[0026] Below, an embodiment of the technology involved in the present disclosure is described with reference to the accompanying drawings. However, the structure described in the following embodiment is only an example and is not limited to the structure. For example, each part and each unit included in the structure can be replaced by any structure that can perform the same function. In addition, any structure can also be added.

[0027] <First Embodiment>

[0028] Below, refer to Figure 1 to Figure 2J The first embodiment will be described. In each figure, three mutually orthogonal directions are assumed, and two mutually orthogonal directions in the horizontal direction are respectively referred to as "X direction" and "Y direction", and the vertical direction is referred to as "Z direction". In addition, the direction pointed by the arrows in each direction is referred to as "positive side (or +)", and the opposite direction is referred to as "negative side (or -)". Figure 1 It is a schematic plan view schematically showing an example of the structure of a substrate transfer system as a first embodiment of the technology involved in the present disclosure. Figure 1 The substrate transport system 1 shown is used to transport substrates having a diameter of, for example, 300 mm to 450 mm. The substrate transfer system 1 includes a load port 11, a load module (load chamber) 12, a load lock module (load lock chamber) 13, a transfer module (substrate transfer chamber) 14, and a process module (substrate processing chamber) 15.

[0029] A front-opening wafer transfer box (FOUP) (not shown) serving as a container for accommodating a plurality of wafers W is placed on the loading port 11. In the present embodiment, four loading ports 11 are arranged along the Y direction, but the number of loading ports 11 is not limited to four. A loading module 12 is arranged adjacent to the negative side of the four loading ports 11 in the X direction. The interior of the loading module 12 is always in an atmospheric pressure atmosphere. In addition, a transport robot (not shown) for carrying wafers W in and out of the front-opening wafer transfer box is arranged in the loading module 12. Thus, the wafer W is transported between the front-opening wafer transfer box placed on the loading port 11 and the loading interlock module 13 through the loading module 12. Two loading interlock modules 13 are arranged adjacent to each other on the negative side of the loading module 12 in the X direction. The two loading interlock modules 13 are arranged along the Y direction. Each loading interlock module 13 is configured so that its interior can be selectively switched to a vacuum atmosphere or an atmospheric pressure atmosphere. The interior of each load lock module 13 is set to atmospheric pressure when communicating with the load module 12 and is set to vacuum atmosphere when communicating with the transfer module 14. Each load lock module 13 serves as an intermediate transfer chamber for transferring wafers W between the load module 12 and the transfer module 14.

[0030] A transfer module 14 is arranged adjacent to the negative side of the two load interlock modules 13 in the X direction. The interior of the transfer module 14 always maintains a specified vacuum degree. In addition, a transfer robot 16 is arranged in the transfer module 14 as a transfer unit for transferring wafers W. The transfer robot 16 has a multi-jointed arm 161 and a fork (pickup device) 162 which is mounted on the front end of the multi-jointed arm 161 and is roughly U-shaped (long strip-shaped) when viewed from above. The fork 162 is a holding member that holds at least two wafers W together in a matrix arrangement in the horizontal direction. The number of wafers W that the fork 162 can hold is a maximum of four in this embodiment (for example, refer to Figure 2A ), but is not limited thereto. In addition, the fork 162 can stably hold each wafer W by, for example, static electricity. In addition, in the transport robot 16, the multi-joint arm 161 performs a telescopic action while each wafer W is held by the fork 162, thereby being able to transport each wafer W from a transport source to a transport destination. This transport includes transport between each process module 15 and transport between a process module 15 and a load lock module 13.

[0031] In addition, the substrate transport system 1 is provided with a sensor pair 23 as a detection unit for detecting the position of each wafer W relative to the fork 162 during the transport. The sensor pair 23 is arranged in front of each process module 15 in the interior of the transfer module 14 so as to face each process module 15, and the sensor pair 23 includes a left sensor 23L located on the left side when facing the process module 15 and a right sensor 23R located on the right side when facing the process module 15. In each sensor pair 23, the right sensor 23R and the left sensor 23L are separated from each other by a gap smaller than the diameter of the wafer W, and are both arranged facing the back side of the wafer W transported by the transport robot 16. The right sensor 23R and the left sensor 23L detect the outer edge (hereinafter referred to as "edge") of the wafer W passing above each sensor. In addition, the substrate transport system 1 is provided with a control unit 17 for controlling the operation of each component of the substrate transport system 1 (for example, the transport robot 16, etc.). The control unit 17 includes a CPU, a memory, etc. The CPU executes the substrate position adjustment method described below according to the program stored in the memory or the like. The control unit 17 calculates the position of each wafer W relative to the fork 162 when the edge of the wafer W passes above the right sensor 23R and the left sensor 23L, specifically, the center of gravity position of each wafer W, based on the encoder values ​​of the three motors of the transfer robot 16. In addition, the position of the sensor pair 23 for detecting the position of each wafer W is not limited to Figure 1 The position of the sensor pair 23 is shown.

[0032] Each of the six process modules 15 is arranged around the transfer module 14 in an adjacent manner with a gate valve 18 interposed therebetween. In the present embodiment, three of the six process modules 15 are arranged on the positive side of the Y direction of the transfer module 14 along the X direction, and the remaining three process modules 15 are arranged on the negative side of the Y direction of the transfer module 14 along the X direction. The gate valve 18 is used to control the communication between the transfer module 14 and the process module 15. The interior of each process module 15 is maintained at a predetermined vacuum degree. In addition, a plurality of loading tables 19 are arranged in each process module 15. A wafer W held on a fork 162 is placed on each loading table 19. And, a predetermined plasma treatment such as a plasma etching treatment is performed on the wafer W placed on the loading table 19. In the present embodiment, four loading tables 19 are arranged in each process module 15. Two of the four loading tables 19 are arranged along the X direction and the Y direction, respectively. In addition, the number and arrangement method of the loading tables 19 are not limited to. Figure 1 The number and arrangement of the mounting tables 19 are shown.

[0033] like Figure 2A to Figure 2J As shown, each loading platform 19 is respectively provided with a lifter 24 that can move in the up-down direction, i.e., the Z direction, relative to the loading platform 19. The lifter 24 is a supporting member that temporarily lifts and supports each wafer W from below when the fork 162 is loaded onto each loading platform 19 on the fork 162. Through this support, each wafer W can be separated from the fork 162. Each lifter 24 has three pins 25 that protrude upward, i.e., on the positive side of the Z direction and are arranged to be separated from each other in the horizontal direction. Through these three pins 25, the wafer W can be supported at three points. Thus, the posture of the wafer W can be stably maintained horizontally. In addition, the number of pins 25 possessed by the lifter 24 is at least three, and there is no limit to this number. In addition, the lifter 24 is connected to a drive source (not shown) such as a motor or a cylinder, and can move in the up-down direction through the drive source.

[0034] Each lifter 24 is connected to a piezoelectric actuator 26 as a moving unit that moves the lifter 24 independently in the horizontal direction. In addition, the direction in which each piezoelectric actuator 26 moves the lifter 24 is different depending on the lifter 24 connected to the piezoelectric actuator 26, but is either the X direction or the Y direction. The piezoelectric actuator 26 is used to perform position adjustment (fine adjustment) when the wafer W is placed on the mounting table 19. The piezoelectric actuator 26 varies in size depending on its type, but is relatively small and easy to connect to the lifter 24. In addition, it has high resolution in position adjustment. In addition, as a moving unit that moves the lifter 24 independently in the horizontal direction, a piezoelectric actuator 26 is used in this embodiment, but it is not limited to this. For example, a servo motor or the like can also be used.

[0035] Next, refer to Figure 2A to Figure 2J The substrate position adjustment method will be described below. Figure 2A to Figure 2J They are shown in order Figure 1 1 and 2 are three views of an example of the operating state of the substrate transport system shown in FIG. (a) of these drawings is a top view, and (b) and (c) are side views, respectively. The substrate position adjustment method includes a position adjustment step of using the substrate transport system 1 to adjust the position of each wafer W relative to each mounting table 19. In addition, one process module 15 among the six process modules 15 is representatively described as the transport destination of the wafer W to be subjected to the position adjustment step.

[0036] like Figure 2A As shown, in the process module 15, two wafers W are held in an arrangement in the X direction at the front end side (positive side in the Y direction) of the fork 162, and two wafers W are also held in an arrangement in the X direction at the base end side (negative side in the Y direction). That is, in the process module 15, two wafers W are held on the fork 162 along the X direction and the Y direction, respectively. Hereinafter, the wafer W located on the most positive side in the X direction and the Y direction among the four wafers W is referred to as "wafer W1", the wafer W located on the negative side of the wafer W1 in the X direction is referred to as "wafer W2", the wafer W located on the negative side of the wafer W1 in the Y direction is referred to as "wafer W3", and the wafer W located on the negative side of the wafer W3 in the X direction is referred to as "wafer W4". In addition, the mounting table 19 on which the wafer W1 is mounted is referred to as “mounting table 191”, the mounting table 19 on which the wafer W2 is mounted is referred to as “mounting table 192”, the mounting table 19 on which the wafer W3 is mounted is referred to as “mounting table 193”, and the mounting table 19 on which the wafer W4 is mounted is referred to as “mounting table 194”. In addition, the elevator 24 for lifting the wafer W1 is referred to as “elevator 241”, the elevator 24 for lifting the wafer W2 is referred to as “elevator 242”, the elevator 24 for lifting the wafer W3 is referred to as “elevator 243”, and the elevator 24 for lifting the wafer W4 is referred to as “elevator 244”. In addition, the piezoelectric actuator 26 that moves the lifter 241 in the horizontal direction is referred to as "piezoelectric actuator 261", the piezoelectric actuator 26 that moves the lifter 242 in the horizontal direction is referred to as "piezoelectric actuator 262", the piezoelectric actuator 26 that moves the lifter 243 in the horizontal direction is referred to as "piezoelectric actuator 263", and the piezoelectric actuator 26 that moves the lifter 244 in the horizontal direction is referred to as "piezoelectric actuator 264". In addition, the direction in which the piezoelectric actuator 261 moves the lifter 241 is the Y direction, the direction in which the piezoelectric actuator 262 moves the lifter 242 is the X direction, the direction in which the piezoelectric actuator 263 moves the lifter 243 is the Y direction, and the direction in which the piezoelectric actuator 264 moves the lifter 244 is the X direction.

[0037] like Figure 2AAs shown, the fork 162 enters the process module 15 while holding the wafers W1 to W4 and stops. At this time, the wafer W1 is located on the stage 191, the wafer W2 is located on the stage 192, the wafer W3 is located on the stage 193, and the wafer W4 is located on the stage 194. In addition, the wafers W1 to W4 have not yet been positionally adjusted (aligned). That is, the wafer W1 is in a state where a position deviation of "+ΔX1" has occurred in the X direction and a position deviation of "+ΔY1" has occurred in the Y direction. The wafer W2 is in a state where a position deviation of "+ΔX2" has occurred in the X direction and a position deviation of "+ΔY2" has occurred in the Y direction. The wafer W3 is in a state where a position deviation of "+ΔX3" has occurred in the X direction and a position deviation of "+ΔY3" has occurred in the Y direction. The wafer W4 is in a state where a position deviation of "+ΔX4" has occurred in the X direction and a position deviation of "+ΔY4" has occurred in the Y direction. Each of these positional deviation amounts (deviation amounts) is calculated by the control unit 17 based on the detection results detected by the sensor pair 23. Therefore, in the present embodiment, the control unit 17 has a function as a calculation unit. The position adjustment process is started from this state.

[0038] First, from Figure 2A From the state shown, the positional deviation in the X direction of the wafer W1 (one wafer W) of the wafer W1 and the wafer W2 located on the front end side is eliminated. Figure 2B As shown, the fork 162 (transport robot 16) is moved to the negative side of the X direction by a distance corresponding to "+ΔX1" (first substrate movement). Through the movement of the first substrate, the position deviation of the wafer W1 in the X direction is eliminated, that is, offset (no X-direction position deviation), and the position adjustment of the wafer W1 in the X direction is completed. At this time, the new deviation "+ΔX1" is added to the negative side of the X direction to the original deviation "+ΔX2" of the wafer W2 through the movement of the first substrate of the wafer W1. As a result, the total deviation (total deviation) of the wafer W2 in the X direction becomes "+ΔX2-(+ΔX1)". Similarly, the new deviation "(+ΔX1)" is added to the negative side of the X direction to the original deviation "+ΔX3" of the wafer W3 through the movement of the first substrate of the wafer W1. As a result, the total deviation of the wafer W3 in the X direction becomes "+ΔX3-(+ΔX1)". In addition, by moving the first substrate of wafer W1, a new deviation "+ΔX1" is added to the negative side of the X direction to the original deviation "+ΔX4" of wafer W4 in the X direction. As a result, the total deviation of wafer W4 in the X direction becomes "+ΔX4-(+ΔX1)". The calculation of each total deviation is also performed by the control unit 17 (the same applies to the following total deviation, that is, the movement amount of each substrate movement).

[0039] Next, from Figure 2BThe state shown eliminates the position deviation of the wafer W2 (another wafer W) in the Y direction. Figure 2C As shown, the fork 162 is moved to the negative side of the Y direction by a distance corresponding to "+ΔY2" (movement of the first substrate). Through the movement of the first substrate, the position deviation of the wafer W2 in the Y direction is eliminated (no position deviation in the Y direction), and the position adjustment of the wafer W2 in the Y direction is completed. At this time, the new deviation "+ΔY2" is added to the negative side of the Y direction to the original deviation "+ΔY1" of the wafer W1 through the movement of the first substrate of the wafer W2. Similarly, the new deviation "+ΔY2" is added to the negative side of the Y direction to the original deviation "+ΔY3" of the wafer W3 through the movement of the first substrate of the wafer W2. As a result, the total deviation of the wafer W3 in the Y direction becomes "+ΔY3-(+ΔY2)". In addition, by moving the first substrate of wafer W2, a new deviation “(+ΔY2)” is added to the negative side of the Y direction to the original deviation “+ΔY4” of wafer W4 in the Y direction. As a result, the total deviation of wafer W4 in the Y direction becomes “+ΔY4-(+ΔY2)”.

[0040] Then, if Figure 2D As shown, the lifter 241 is moved toward the positive side (upper side) in the Z direction, and the lifter 242 is also moved toward the positive side in the Z direction. At this time, the wafer W1 is lifted and separated from the fork 162 while maintaining the state in which the position deviation in the X direction is eliminated. The wafer W2 is lifted and separated from the fork 162 while maintaining the state in which the position deviation in the Y direction is eliminated.

[0041] Next, from Figure 2D From the state shown, the positional deviation in the X direction of the wafer W3 (one wafer W) among the wafer W3 and the wafer W4 located on the base end side is eliminated. Figure 2E As shown, the fork 162 is moved to the negative side in the X direction by a distance corresponding to the above-mentioned total deviation amount "+ΔX3-(+ΔX1)" (first substrate movement). By means of the movement of the first substrate, the position deviation of the wafer W3 in the X direction is eliminated (no position deviation in the X direction), and the position adjustment of the wafer W3 in the X direction is completed. At this time, by means of the movement of the first substrate of the wafer W3, a new deviation amount "+ΔX3-(+ΔX1)" is added to the negative side in the X direction to the previous (original) deviation amount "+ΔX4-(+ΔX1)" of the wafer W4. As a result, the total deviation amount of the wafer W4 in the X direction becomes "+ΔX4-(+ΔX1)-(+ΔX3-(+ΔX1))".

[0042] Next, from Figure 2E The state shown eliminates the position deviation of the wafer W4 (another wafer W) in the Y direction. Figure 2FAs shown, the fork 162 is moved to the negative side in the Y direction by a distance corresponding to the above-mentioned total deviation amount "+ΔY4-(+ΔY2)" (first substrate movement). By means of the movement of the first substrate, the position deviation of the wafer W4 in the Y direction is eliminated (no position deviation in the Y direction), and the position adjustment of the wafer W4 in the Y direction is completed. At this time, the new deviation amount "+ΔY4-(+ΔY2)" is added to the negative side in the Y direction to the previous deviation amount "+ΔY3-(+ΔY2)" of the wafer W3 by means of the movement of the first substrate of the wafer W4. As a result, the total deviation amount of the wafer W3 in the Y direction becomes "+ΔY3-(+ΔY2)-(+ΔY4-(+ΔY2))".

[0043] Then, if Figure 2G As shown, the lifter 243 is moved toward the positive side (upper side) in the Z direction, and the lifter 244 is also moved toward the positive side in the Z direction. At this time, the wafer W3 is lifted and separated from the fork 162 while maintaining the state in which the position deviation in the X direction is eliminated. The wafer W4 is lifted and separated from the fork 162 while maintaining the state in which the position deviation in the Y direction is eliminated.

[0044] As described above, the wafers W1 to W4 are all separated from the fork 162. Figure 2H As shown, the fork 162 is moved to the negative side in the Y direction to be withdrawn from the process module 15 .

[0045] Next, from Figure 2H From the state shown, the position deviation of wafer W1 in the Y direction, the position deviation of wafer W2 in the X direction, the position deviation of wafer W3 in the Y direction, and the position deviation of wafer W4 in the X direction are eliminated. In addition, as described above, the position deviation of wafer W1 in the X direction, the position deviation of wafer W2 in the Y direction, the position deviation of wafer W3 in the X direction, and the position deviation of wafer W4 in the Y direction have all been eliminated. Fig.2IAs shown, the piezoelectric actuator 261 moves the lifter 241 to the negative side in the Y direction by a distance corresponding to "+ΔY1" (second substrate movement). By the movement of the second substrate, the position deviation of the wafer W1 in the Y direction is eliminated (no position deviation in the Y direction), and the position adjustment of the wafer W1 in the Y direction is completed. In addition, the piezoelectric actuator 262 moves the lifter 242 to the negative side in the X direction by a distance corresponding to the above-mentioned total deviation "+ΔX2-(+ΔX1)" (second substrate movement). By the movement of the second substrate, the position deviation of the wafer W2 in the X direction is eliminated (no position deviation in the X direction), and the position adjustment of the wafer W2 in the X direction is completed. In addition, the piezoelectric actuator 263 moves the lifter 243 to the negative side in the Y direction by a distance corresponding to the above-mentioned total deviation "+ΔY3-(+ΔY2)-(+ΔY4-(+ΔY2))" (second substrate movement). By moving the second substrate, the position deviation of the wafer W3 in the Y direction is eliminated (no position deviation in the Y direction), and the position adjustment of the wafer W3 in the Y direction is completed. In addition, the piezoelectric actuator 264 moves the lifter 244 to the negative side in the X direction by a distance corresponding to the above-mentioned total deviation amount "+ΔX4-(+ΔX1)-(+ΔX3-(+ΔX1))" (second substrate movement). By moving the second substrate, the position deviation of the wafer W4 in the X direction is eliminated (no position deviation in the X direction), and the position adjustment of the wafer W4 in the X direction is completed.

[0046] Then, if Figure 2J As shown, lifters 241 to 244 are respectively moved to the negative side (lower side) in the Z direction. As a result, wafer W1 is lowered while maintaining a state in which the position deviation in the X direction and the Y direction is eliminated, and is placed on stage 191 in a state in which it is accurately positioned. Similarly, wafer W2 is lowered while maintaining a state in which the position deviation in the X direction and the Y direction is eliminated, and is placed on stage 192 in a state in which it is accurately positioned. In addition, wafer W3 is lowered while maintaining a state in which the position deviation in the X direction and the Y direction is eliminated, and is placed on stage 193 in a state in which it is accurately positioned. Wafer W4 is lowered while maintaining a state in which the position deviation in the X direction and the Y direction is eliminated, and is placed on stage 194 in a state in which it is accurately positioned.

[0047] As described above, in the position adjustment process, the first substrate movement and the second substrate movement are performed as the position adjustment of the wafer W1. In the first substrate movement, the wafer W1 held by the fork 162 is moved on the mounting table 191 in the X direction by the transport robot 16 (see Figure 2B ), during the second substrate movement, the wafer W1 supported by the lifter 241 is moved on the stage 191 in the Y direction by the piezoelectric actuator 261 (see Fig.2I). In addition, as a position adjustment of the wafer W2, a first substrate movement and a second substrate movement are performed. In the first substrate movement, the wafer W2 held on the fork 162 is moved on the mounting table 192 in the Y direction by the transport robot 16 (refer to Figure 2C ), during the second substrate movement, the wafer W2 supported by the lifter 242 is moved on the stage 192 in the X direction by the piezoelectric actuator 262 (refer to Fig.2I ). In addition, as a position adjustment of the wafer W3, a first substrate movement and a second substrate movement are performed. In the first substrate movement, the wafer W3 held on the fork 162 is moved on the mounting table 193 in the X direction by the transport robot 16 (refer to Figure 2E ), during the second substrate movement, the wafer W3 supported by the lifter 243 is moved on the stage 193 in the Y direction by the piezoelectric actuator 263 (refer to Fig.2I ). In addition, as a position adjustment of the wafer W4, a first substrate movement and a second substrate movement are performed. In the first substrate movement, the wafer W4 held on the fork 162 is moved on the mounting table 194 in the Y direction by the transport robot 16 (refer to Figure 2F ), during the second substrate movement, the wafer W4 supported by the lifter 244 is moved on the stage 194 in the X direction by the piezoelectric actuator 264 (refer to Fig.2I ).

[0048] Furthermore, as described above, conventionally, when a transfer arm transfers a plurality of wafers, if the transfer arm is used to align the wafers, the transfer arm needs to be moved in the X and Y directions each time the position of each wafer is aligned. As a result, the productivity until all wafers are aligned may be deteriorated.

[0049] In contrast, the substrate transport system 1 (substrate position adjustment method) allows the transport robot 16 and the piezoelectric actuator 26 to share the position adjustment of each wafer W in the X direction and the position adjustment in the Y direction. As a result, it is not necessary to move the transport robot 16 (transport arm) in the X direction and the Y direction during the alignment of wafers W1 to W4, and the productivity of the alignment of wafers W1 to W4 can be improved. In addition, the piezoelectric actuator 26 only needs to be responsible for the position adjustment in the X direction or the Y direction, so that the structure for position determination can be simplified compared to a structure in which the piezoelectric actuator 26 is responsible for the position adjustment in both the X direction and the Y direction.

[0050] In addition, in the position adjustment process, the position of the wafer W1 and the wafer W2 on the front end side is adjusted before the position of the wafer W3 and the wafer W4 on the base end side is adjusted. Therefore, the wafer W1 and the wafer W2 are separated from the fork 162 before the wafer W3 and the wafer W4. Try to consider the situation where, on the contrary, it is assumed that the wafer W3 and the wafer W4 are separated from the fork 162 before the wafer W1 and the wafer W2. In this case, even if the fork 162 is to be withdrawn from the process module 15 due to various reasons such as errors, there is a concern that the wafer W1 on the fork 162 collides with the pin 25 of the lifter 243 and the wafer W2 on the fork 162 collides with the pin 25 of the lifter 244, thereby hindering the withdrawal. However, in the above-mentioned position adjustment process, the wafer W1 and the wafer W2 are separated from the fork 162 before the wafer W3 and the wafer W4, so the fork 162 can be quickly withdrawn from the process module 15. Furthermore, when it is impossible to withdraw the fork 162 from the process module 15 in the middle of aligning the positions of the wafers, the positions of the wafers W3 and W4 may be adjusted before the positions of the wafers W1 and W2 are adjusted.

[0051] Alternatively, you may not implement Figure 2A The first substrate movement of the wafer W1 in the X direction can also be performed at the same timing (refer to Figure 2B ) and the wafer W2 moves toward the first substrate in the Y direction (refer to Figure 2C ). Similarly, the wafer W3 may be moved toward the first substrate in the X direction at the same timing (see Figure 2E ) and the wafer W4 moves toward the first substrate in the Y direction (refer to Figure 2F ). In this case, the first substrate movement of wafer W1 and wafer W2, and the first substrate movement of wafer W3 and wafer W4 are performed at different timings. This is because the positions in the X direction and the Y direction that can be adjusted at one time by the transfer robot 16 are each at one place. Therefore, when the fork 162 maintains the positional relationship between wafers W1 to W4, wafer W1 and wafers W3 and wafer W4 cannot perform the first substrate movement in the X direction and the first substrate movement in the Y direction at the same timing. On the other hand, the second substrate movement of wafer W1 in the Y direction, the second substrate movement of wafer W2 in the X direction, the second substrate movement of wafer W3 in the Y direction, and the second substrate movement of wafer W4 in the X direction are performed at the same timing (refer to Fig.2I ). This is because each piezoelectric actuator 26 is configured to work independently, so the second substrate movement in the X direction and the second substrate movement in the Y direction can be performed at the same timing. In addition, performing the second substrate movement in the X direction and the second substrate movement in the Y direction at the same timing helps to improve the productivity of the position alignment of each wafer.

[0052] In this embodiment, the number of wafers W held by the fork 162 is an even number. In this case, in the position adjustment process, the position adjustment based on the first substrate movement and the second substrate movement can be repeated for every two wafers W arranged along the X direction, thereby adjusting the positions of all the wafers W. Figure 2D After the state shown, the wafer W1 is moved toward the second substrate in the Y direction and the wafer W2 is moved toward the second substrate in the X direction. Fig.2I In the state shown, the wafer W1 moves toward the second substrate in the Y direction and the wafer W2 moves toward the second substrate in the X direction.

[0053] <Second Embodiment>

[0054] Below, refer to Figure 3 The second embodiment will be described below, but the description will be centered on the differences from the above embodiment, and the description of the same matters will be omitted. This embodiment is the same as the above first embodiment except that the number of wafers held on the fork is different. Specifically, the number of wafers arranged on the fork is an even number in the above first embodiment, but is an odd number in this embodiment.

[0055] Figure 3 1 is a schematic top view schematically showing an example of the structure of a substrate transfer system as a second embodiment of the technology involved in the present disclosure. Figure 3 As shown, wafer W1 and wafer W2 are arranged along the X direction on the front end side of fork 162 in process module 15, and wafer W3 is arranged on the base end side. The X coordinate of wafer W3 is the coordinate in the middle of the X coordinate of wafer W1 and the X coordinate of wafer W2. In the position adjustment process of this embodiment, as the position adjustment of wafer W1 and wafer W2, the same position adjustment as the position adjustment of wafer W1 and wafer W2 in the above-mentioned first embodiment can be used. In addition, the position adjustment of wafer W3 is performed by moving in the X direction and the Y direction using fork 162. As a result, the movement in the horizontal direction in the state where wafer W3 is supported by lifter 24 can be omitted.

[0056] As described above, in this embodiment, when the position adjustment process is performed when the number of wafers W arranged on the fork 162 is an odd number, the position adjustment based on the first substrate movement and the second substrate movement can be repeated for every two wafers W arranged along the X direction. Then, the position of the remaining wafer W is adjusted by the movement of the fork 162. In this way, all the wafers W can be placed on the mounting table 19 in a state where they are accurately positioned. In addition, the position of the remaining wafer W can also be adjusted by moving the piezoelectric actuator 26 in the horizontal direction.

[0057] As mentioned above, although the preferred embodiment of this disclosure was described, this disclosure is not limited to the above-mentioned embodiment, Various deformation|transformation and change are possible within the range of the summary.

[0058] This application claims priority based on Japanese patent application No. 2022-178163 filed on November 7, 2022, the entire contents of which are incorporated herein by reference.

[0059] Description of Reference Numerals

[0060] 1: substrate transport system; 16: transport robot; 162: fork (pickup); 19, 191, 192, 193, 194: mounting table; 24, 241, 242, 243, 244: lifter; 26, 261, 262, 263, 264: piezoelectric actuator; W, W1, W2, W3, W4: wafer.

Claims

1. A substrate transport system comprising: A conveying unit having a holding member for holding at least two substrates together in a manner of arranging them in a horizontal direction, wherein the conveying unit conveys the substrates held by the holding member from a conveying source to a conveying destination; a plurality of mounting tables, the plurality of mounting tables being provided at the transport destination, and the substrates held by the holding member being respectively placed on the plurality of mounting tables at the transport destination; a supporting member provided on each of the mounting tables and capable of moving in the up-down direction relative to each of the mounting tables, wherein the supporting member temporarily supports each of the substrates in the middle of mounting each of the substrates from the holding member to each of the mounting tables to separate each of the substrates from the holding member; as well as a plurality of moving units, wherein the plurality of moving units independently move each of the supporting members in a horizontal direction, Among them, the position of each substrate relative to each of the loading tables is adjusted by moving the first substrate and the second substrate. During the movement of the first substrate, each of the substrates held on the holding members is moved on each of the loading tables by the conveying unit, and during the movement of the second substrate, each of the substrates supported on the supporting members is moved on each of the loading tables by the moving unit.

2. The substrate transport system according to claim 1, wherein: A moving direction of the first substrate and a moving direction of the second substrate are orthogonal to each other.

3. The substrate transport system according to claim 2, wherein: The moving direction of one of the two substrates in the first substrate movement is orthogonal to the moving direction of the other substrate in the first substrate movement, and the moving direction of one substrate in the second substrate movement is orthogonal to the moving direction of the other substrate in the second substrate movement.

4. The substrate transport system according to claim 2, wherein: The second substrate movement of the one substrate and the second substrate movement of the other substrate are performed at the same timing.

5. The substrate transport system according to claim 2, wherein: When the X direction and Y direction are assumed to be orthogonal to each other and the moving direction of the one substrate in the first substrate movement is set to the X direction, the moving direction of the other substrate in the first substrate movement is set to the Y direction, the moving direction of the one substrate in the second substrate movement is set to the Y direction, and the moving direction of the other substrate in the second substrate movement is set to the X direction, adjusting the position of the one substrate in the X direction by moving the first substrate of the one substrate, The position of the other substrate in the Y direction is adjusted by the movement of the first substrate of the other substrate.

6. The substrate transport system according to claim 5, wherein: By moving the first substrate of the other substrate, a new deviation in the Y direction is added to the original deviation in the Y direction of the one substrate, and by moving the second substrate of the one substrate, a total deviation obtained by adding the deviation in the Y direction of the one substrate to the new deviation is offset, thereby adjusting the position of the one substrate in the Y direction, By moving the first substrate of the one substrate, a new deviation in the X direction is added to the original deviation in the X direction of the other substrate, and by moving the second substrate of the other substrate, a total deviation obtained by adding the deviation in the X direction of the other substrate to the new deviation is offset, thereby adjusting the position of the other substrate in the X direction.

7. The substrate transport system according to claim 1, wherein: The holding member is in an elongated shape, and two of the substrates are held at the front end side of the holding member, and two of the substrates are held at the base end side of the holding member. When the position adjustment is performed, the two substrates on the distal end side are positionally adjusted before the two substrates on the proximal end side are positionally adjusted.

8. The substrate transport system according to claim 1, wherein: When the position adjustment is performed when the number of the substrates held by the holding member is an even number, the position adjustment based on the first substrate movement and the second substrate movement is repeated for every two substrates.

9. The substrate transport system according to claim 1, wherein: When the position adjustment is performed when the number of the substrates held by the holding member is an odd number, the position adjustment based on the movement of the first substrate and the movement of the second substrate is repeated for every two substrates, and the position adjustment of the remaining substrate is performed by moving the remaining substrate using the conveying unit.

10. The substrate transport system according to claim 1, further comprising: a detection unit configured to detect a position of each of the substrates relative to the holding member while each of the substrates is being transported from the transport source to the transport destination; and A calculation unit calculates the movement amount of each substrate caused by the first substrate movement and the movement amount of each substrate caused by the second substrate movement, respectively, based at least on the detection result of the detection unit.

11. The substrate transport system according to claim 1, wherein: The moving unit has a piezoelectric actuator.

12. The substrate transport system according to claim 1, wherein: The supporting member mounts each of the substrates on each of the mounting tables after the position adjustment.

13. The substrate transport system according to claim 1, wherein: The supporting member supports each of the substrates at least at three points.

14. A method for adjusting a substrate position, using a substrate transport system, the substrate transport system comprising: A conveying unit having a holding member for holding at least two substrates together in a manner of arranging them in a horizontal direction, wherein the conveying unit conveys the substrates held by the holding member from a conveying source to a conveying destination; a plurality of mounting tables, the plurality of mounting tables being provided at the transport destination, and at the transport destination, the respective substrates held by the holding member are respectively placed on the plurality of mounting tables; a supporting member provided on each of the mounting tables and capable of moving in the up-down direction relative to each of the mounting tables, wherein the supporting member temporarily supports each of the substrates in the middle of mounting each of the substrates from the holding member to each of the mounting tables to separate each of the substrates from the holding member; as well as a plurality of moving units, wherein the plurality of moving units independently move each of the supporting members in a horizontal direction, The substrate position adjustment method includes a position adjustment step of using the substrate transfer system to adjust the position of each substrate relative to each mounting table. In the position adjustment process, a first substrate movement and a second substrate movement are performed. In the first substrate movement, each of the substrates held on the holding members is moved on each of the loading tables by the conveying unit, and in the second substrate movement, each of the substrates supported on the supporting members is moved on each of the loading tables by the moving unit.

15. The substrate position adjustment method according to claim 14, wherein: A moving direction of the first substrate and a moving direction of the second substrate are orthogonal to each other.

16. The substrate position adjustment method according to claim 15, wherein: The moving direction of one of the two substrates in the first substrate movement is orthogonal to the moving direction of the other substrate in the first substrate movement, and the moving direction of one substrate in the second substrate movement is orthogonal to the moving direction of the other substrate in the second substrate movement.

17. The substrate position adjustment method according to claim 15, wherein: The second substrate movement of the one substrate and the second substrate movement of the other substrate are performed at the same timing.

18. The method for adjusting the position of a substrate according to claim 15, wherein: Assuming that the X direction and the Y direction are orthogonal to each other and that the moving direction of the one substrate in the first substrate movement is set to the X direction, the moving direction of the other substrate in the first substrate movement is set to the Y direction, the moving direction of the one substrate in the second substrate movement is set to the Y direction, and the moving direction of the other substrate in the second substrate movement is set to the X direction, adjusting the position of the one substrate in the X direction by moving the first substrate of the one substrate, The position of the other substrate in the Y direction is adjusted by the movement of the first substrate of the other substrate.

19. The substrate position adjustment method according to claim 18, wherein: By moving the first substrate of the other substrate, a new deviation in the Y direction is added to the original deviation in the Y direction of the one substrate, and by moving the second substrate of the one substrate, a total deviation obtained by adding the deviation in the Y direction of the one substrate to the new deviation is offset, thereby adjusting the position of the one substrate in the Y direction, By moving the first substrate of the one substrate, a new deviation in the X direction is added to the original deviation in the X direction of the other substrate, and by moving the second substrate of the other substrate, a total deviation obtained by adding the deviation in the X direction of the other substrate to the new deviation is offset, thereby adjusting the position of the other substrate in the X direction.

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