Automatic trimming, forming and receiving track device for semiconductor elements

Abstract

The invention discloses a semiconductor element automatic trimming forming material receiving track device which comprises a working table bottom plate and a material receiving rack, a track is fixedly installed on the working table bottom plate through a groove-shaped installation block and an adjusting plate, the track is obliquely arranged, a second supporting plate is fixedly installed in the middle of the track, a bend is arranged at the top end of the track in a clamped mode, and a second supporting plate is fixedly installed in the middle of the bend. The bend is provided with two notches used for feeding semiconductor elements, and bent cover plates are arranged above the two notches. As the track is changed from an original single track to a double track, the capacity of the semiconductor element falling into the material pipe is doubled, and the competitiveness of the product is enhanced; when the semiconductor element slides in the track, air is blown into the track through the three air inlet connectors to prevent the semiconductor element from being stuck in the track, and the air is blown to the track through the ion fan, so that static electricity on the track is effectively eliminated, the semiconductor element is conveniently pushed into the material pipe, and whether the material pipe is pushed in place or not is detected through the optical fiber sensor.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor integrated circuit processing, in particular to an automatic rib cutting, forming and collecting track device for semiconductor components. Background Art

[0002] Most of my country's semiconductor integrated circuit lower punch automatic rib cutting and forming all-in-one machines use a single-track material collection mechanism. The semiconductor components are transported from a flat track to the mold for punching and forming, and then fall into the material tube from an inclined track. With the gradual upgrading and improvement of semiconductor integrated circuit technology, the equipment is running faster and faster, and the company's order volume has increased and the delivery time is tight. The single-track material collection mechanism can no longer meet market demand; at the same time, semiconductor components are prone to getting stuck when sliding on the track, which will affect the efficiency of semiconductor components falling into the material tube. Summary of the invention

[0003] The object of the present invention is to provide a semiconductor component automatic rib cutting, forming and collecting track device to solve the problems raised in the above background technology.

[0004] By adopting the above technical solution, the competitiveness of the product is enhanced.

[0005] The object of the present invention can be achieved through the following technical solutions: a semiconductor component automatic rib cutting and forming material collection track device, comprising a workbench bottom plate and a material collection frame, a track is fixedly installed on the workbench bottom plate through a slot-type mounting block and an adjustment plate, the track is inclined, and a second support plate is fixedly installed in the middle of the track, a curve is clamped at the top of the track, two notches for loading semiconductor components are opened on the curve, and a curved cover plate is arranged above the two notches; the semiconductor components are placed in the two notches of the curve and then enter the track, the track changes from the original single track to a double track, so that the production capacity of dropping semiconductor components into the material tube is doubled, thereby enhancing the competitiveness of the product;

[0006] The first track cover plate, the second track cover plate, the third track cover plate and the fourth track cover plate are installed on the track. The first track cover plate is connected to the bent cover plate and the third track cover plate end to end respectively, the second track cover plate is connected to the bent cover plate and the fourth track cover plate end to end respectively, and the third track cover plate and the fourth track cover plate are both provided with U-shaped notches.

[0007] A further technical improvement of the present invention is that a pushing mechanism for unloading semiconductor components is provided at the end of the track, and the pushing mechanism includes a fifth track cover plate and a sixth track cover plate fixedly connected to the upper end of the track, and a material pipe limit block and a material pipe pushing cylinder are fixedly installed below the end of the track, and a push rod for pushing the material pipe is fixedly connected to the protruding end of the material pipe pushing cylinder.

[0008] A further technical improvement of the present invention is that: the third rail cover plate and the fourth rail cover plate are both provided with mounting blocks, on which a vibrating cylinder is fixedly mounted for preventing the material tube from getting stuck, and the fifth rail cover plate and the sixth rail cover plate are both provided with sensor mounting seats, on which a fiber optic sensor for detecting whether the material tube is pushed into place is fixedly mounted.

[0009] A further technical improvement of the present invention is that a blower mechanism for eliminating static electricity on the track is provided on one side of the second support plate, and the blower mechanism includes a first ion blowing mounting plate fixedly connected to the middle of the track, and an ion fan is fixedly installed on the top of the first ion blowing mounting plate through a second ion blowing mounting plate, and the ion fan is arranged toward the track.

[0010] A further technical improvement of the present invention is that four stop cylinders are fixedly installed under the track between the second support plate and the mounting block, and the protruding ends of the four stop cylinders are fixedly installed with limit columns for controlling the semiconductor components to fall into the material tube in an orderly manner.

[0011] A further technical improvement of the present invention is that a light sensor for detecting whether there are semiconductor elements in the track is arranged above the track between the second support plate and the mounting block, the light sensor is a prior art, and the bottom of the light sensor is fixed to the track by the first sensor mounting plate and the second sensor mounting plate.

[0012] A further technical improvement of the present invention is that three air inlet connectors are respectively installed on both sides of the track, and the three air inlet connectors are arranged at equal distances; air is blown into the track through the three air inlet connectors to prevent the semiconductor components from getting stuck therein.

[0013] A further technical improvement of the present invention lies in that the bottom of the second support plate is fixedly connected to the receiving frame through the first support plate, and a bracket is also fixedly installed on the receiving frame, on which a camera for detecting whether the pins of semiconductor components are qualified is fixedly installed, and the camera corresponds to the positions of the two U-shaped notches; by using the camera to detect whether the pins of each semiconductor component are qualified through the two U-shaped notches, the workload of later detection is effectively reduced, and the labor cost is reduced.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: since the track is changed from the original single track to a double track, the production capacity of dropping semiconductor components into the material tube is doubled, thereby enhancing the competitiveness of the product; when the semiconductor component slides in the track, air is blown into the track through three air inlet joints to prevent the semiconductor component from getting stuck therein, and the track is blown with an ion fan to effectively eliminate the static electricity on the track, making it easier to push the semiconductor component into the material tube, and to detect whether the material tube is pushed into place through an optical fiber sensor. At the same time, the semiconductor component is controlled to fall into the material tube in an orderly manner through four stop cylinders and limit columns; the extended end of the material tube pushing cylinder is extended, so that the push rod pushes out the material tube filled with semiconductor components, and the material tube is prevented from getting stuck by turning on the vibrating cylinder on the mounting block; the camera detects whether the pins of each semiconductor component are qualified through the two U-shaped notches, which effectively reduces the workload of later inspection and reduces labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2 It is a structural schematic diagram of the ejection mechanism of the present invention;

[0018] Figure 3 It is a structural schematic diagram of the stop cylinder of the present invention;

[0019] Figure 4 It is a schematic top view of the overall structure of the present invention;

[0020] Figure 5 For the present invention Figure 4 A magnified view of the structure at center;

[0021] Figure 6 It is a three-dimensional schematic diagram of the overall structure of the present invention.

[0022] In the figure: 1. bend; 2. workbench bottom plate; 3. bent cover plate; 4. track; 5. first track cover plate; 6. second track cover plate; 7. third track cover plate; 8. fourth track cover plate; 9. slot-type mounting block; 10. adjustment plate; 11. first support plate; 12. second support plate; 13. receiving rack; 14. stop cylinder; 15. limit column; 16. ion fan; 17. first ion blowing mounting plate; 18. second ion blowing mounting plate; 19. light sensor; 20. first sensor mounting plate; 21. second sensor mounting plate; 22. bent plate; 23. air inlet joint; 24. fifth track cover plate; 25. sixth track cover plate; 26. material tube limit block; 27. material tube pushing cylinder; 28. push rod; 29. ​​mounting block; 30. vibration cylinder; 31. sensor mounting seat; 32. optical fiber sensor. DETAILED DESCRIPTION

[0023] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] See also Figure 1-Figure 6 As shown, a semiconductor component automatic rib cutting, forming and collecting track device includes a workbench base plate 2 and a collecting frame 13. A track 4 is fixedly installed on the workbench base plate 2 through a groove-type mounting block 9 and an adjustment plate 10. The track 4 is inclined, and a second support plate 12 is fixedly installed in the middle of the track 4. A bend 1 is clamped at the top of the track 4. Two notches for loading semiconductor components are opened on the bend 1, and a bend cover plate 3 is arranged above the two notches. The semiconductor components are placed in the two notches of the bend 1 and then enter the track 4. The track 4 is changed from the original single track to a double track, so that the production capacity of dropping semiconductor components into the material tube is doubled, thereby enhancing the competitiveness of the product.

[0025] See also Figure 1-Figure 6 As shown, the above-mentioned track 4 is installed with a first track cover plate 5, a second track cover plate 6, a third track cover plate 7 and a fourth track cover plate 8. The first track cover plate 5 is connected end to end with the bent cover plate 3 and the third track cover plate 7 respectively, the second track cover plate 6 is connected end to end with the bent cover plate 3 and the fourth track cover plate 8 respectively, and the third track cover plate 7 and the fourth track cover plate 8 are both provided with a U-shaped notch.

[0026] See also Figure 1-Figure 6As shown, the end of the above-mentioned track 4 is provided with an ejection mechanism for unloading semiconductor components, and the ejection mechanism includes a fifth track cover plate 24 and a sixth track cover plate 25 fixedly connected to the upper end of the track 4, and a material tube limit block 26 and a material tube ejection cylinder 27 are fixedly installed below the end of the track 4, and the protruding end of the material tube ejection cylinder 27 is fixedly connected with a push rod 28 for ejecting the material tube.

[0027] See also Figure 1-Figure 6 As shown, the third rail cover plate 7 and the fourth rail cover plate 8 are both provided with mounting blocks 29, on which a vibrating cylinder 30 is fixedly mounted for preventing the material tube from getting stuck, and the fifth rail cover plate 24 and the sixth rail cover plate 25 are both provided with sensor mounting seats 31, on which a fiber optic sensor 32 for detecting whether the material tube is pushed into place is fixedly mounted.

[0028] See also Figure 1-Figure 6 As shown, a blower mechanism for eliminating static electricity on the track 4 is provided on one side of the second support plate 12, and the blower mechanism includes a first ion blowing mounting plate 17 fixedly connected to the middle of the track 4, and an ion fan 16 is fixedly installed on the top of the first ion blowing mounting plate 17 through a second ion blowing mounting plate 18, and the ion fan 16 is arranged toward the track 4.

[0029] See also Figure 1-Figure 6 As shown, four stop cylinders 14 are fixedly installed below the track 4 between the second support plate 12 and the mounting block 29 , and the extending ends of the four stop cylinders 14 are fixedly installed with limit columns 15 for controlling the semiconductor components to fall into the material tube in an orderly manner.

[0030] See also Figure 1-Figure 6 As shown, a light sensor 19 for detecting whether there is a semiconductor element in the track 4 is arranged above the track 4 between the second support plate 12 and the mounting block 29. The light sensor 19 is a prior art, and the bottom of the light sensor 19 is fixed to the track 4 through the first sensor mounting plate 20 and the second sensor mounting plate 21.

[0031] See also Figure 3 and Figure 4 As shown, a bent plate 22 for fixing the sensor harness is also fixedly mounted on the first sensor mounting plate 20 .

[0032] See also Figure 1-Figure 6 As shown, three air inlet connectors 23 are respectively installed on both sides of the track 4, and the three air inlet connectors 23 are arranged at equal distances; air is blown into the track 4 through the three air inlet connectors 23 to prevent the semiconductor components from getting stuck therein.

[0033] See also Figure 1-Figure 6As shown, the bottom of the second support plate 12 is fixedly connected to the receiving frame 13 through the first support plate 11, and a bracket is also fixedly installed on the receiving frame 13, and a camera for detecting whether the pins of semiconductor components are qualified is fixedly installed on the bracket, and the camera corresponds to the positions of the two U-shaped notches; the camera detects whether the pins of each semiconductor component are qualified through the two U-shaped notches, which effectively reduces the workload of later detection and reduces labor costs.

[0034] Working principle: When the present invention is used, first, the semiconductor components are placed in the two notches of the bend 1, and then enter the track 4. The track 4 is changed from the original single track to a double track, so that the production capacity of dropping semiconductor components into the material tube is doubled, thereby enhancing the competitiveness of the product; when the semiconductor components slide in the track 4, three air inlet joints 23 are used to blow air into the track 4 to prevent the semiconductor components from getting stuck therein, and the track 4 is blown with the ion fan 16, so as to effectively eliminate the static electricity on the track 4, so as to facilitate pushing the semiconductor components into the material tube, and the optical fiber sensor 32 is used to detect whether the material tube is pushed into place. At the same time, the four stop cylinders 14 are used in conjunction with the limit column 15 to control the semiconductor components to fall into the material tube in an orderly manner; the extended end of the material tube pushing cylinder 27 is extended, so that the push rod 28 pushes out the material tube filled with semiconductor components, and the material tube is prevented from getting stuck by opening the vibration cylinder 30 on the mounting block 29; the camera is used to detect whether the pins of each semiconductor component are qualified through the two U-shaped notches, which effectively reduces the workload of later detection and reduces labor costs.

[0035] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A semiconductor component automatic cutting and forming material collection track device, comprising a workbench bottom plate (2) and a material collection frame (13), characterized in that: A track (4) is fixedly mounted on the workbench bottom plate (2) via a groove-shaped mounting block (9) and an adjustment plate (10); the track (4) is arranged at an angle, and a second support plate (12) is fixedly mounted in the middle of the track (4); a curved track (1) is clamped at the top end of the track (4); two notches for loading semiconductor components are provided on the curved track (1); and a curved cover plate (3) is provided above the two notches; The track (4) is provided with a first track cover plate (5), a second track cover plate (6), a third track cover plate (7) and a fourth track cover plate (8); the first track cover plate (5) is connected end to end with the bent cover plate (3) and the third track cover plate (7), respectively; the second track cover plate (6) is connected end to end with the bent cover plate (3) and the fourth track cover plate (8), respectively; and the third track cover plate (7) and the fourth track cover plate (8) are both provided with U-shaped notches.

2. The semiconductor component automatic rib cutting, forming and collecting track device according to claim 1, characterized in that: The end of the track (4) is provided with an ejection mechanism for unloading semiconductor components, the ejection mechanism comprising a fifth track cover plate (24) and a sixth track cover plate (25) fixedly connected to the upper end of the track (4), a material tube limit block (26) and a material tube ejection cylinder (27) are fixedly installed below the end of the track (4), and a push rod (28) is fixedly connected to the protruding end of the material tube ejection cylinder (27).

3. The semiconductor component automatic rib cutting, forming and collecting track device according to claim 2, characterized in that: The third rail cover plate (7) and the fourth rail cover plate (8) are both provided with a mounting block (29), and a vibrating cylinder (30) is fixedly mounted on the mounting block (29) to prevent the material pipe from getting stuck. The fifth rail cover plate (24) and the sixth rail cover plate (25) are both provided with an optical fiber sensor (32) for detecting whether the material pipe is pushed into place.

4. The semiconductor component automatic rib cutting, forming and collecting track device according to claim 1, characterized in that: A blower mechanism for eliminating static electricity on the track (4) is provided on one side of the second support plate (12), the blower mechanism comprising a first ion blower mounting plate (17) fixedly connected to the middle of the track (4), an ion fan (16) being fixedly mounted on the top of the first ion blower mounting plate (17) via a second ion blower mounting plate (18).

5. The semiconductor component automatic rib cutting, forming and collecting track device according to claim 1, characterized in that: Four stop cylinders (14) are fixedly mounted below the track (4) between the second support plate (12) and the mounting block (29), and limiting columns (15) for controlling the orderly falling of semiconductor components into the material tube are fixedly mounted at the protruding ends of the four stop cylinders (14).

6. The semiconductor component automatic rib cutting, forming and collecting track device according to claim 1, characterized in that: A light sensor (19) for detecting whether there is a semiconductor element in the track (4) is arranged above the track (4) between the second support plate (12) and the mounting block (29); the bottom of the light sensor (19) is fixed to the track (4) via a first sensor mounting plate (20) and a second sensor mounting plate (21).

7. The semiconductor component automatic rib cutting, forming and collecting track device according to claim 1, characterized in that: Three air inlet joints (23) are respectively installed on both sides of the track (4), and the three air inlet joints (23) are arranged at equal distances.

8. The semiconductor component automatic rib cutting, forming and collecting track device according to claim 1, characterized in that: The bottom of the second support plate (12) is fixedly connected to the receiving frame (13) via the first support plate (11); a bracket is also fixedly mounted on the receiving frame (13); a camera for detecting whether the pins of semiconductor components are qualified is fixedly mounted on the bracket; the camera corresponds to the positions of the two U-shaped notches.

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