Etching forming method and system based on laser scanning strategy

Abstract

The invention discloses an etching forming method and system based on a laser scanning strategy, and relates to the technical field of computer platform load balancing, and the method comprises the steps: importing a three-dimensional etching model into a coordinate system for hierarchical division, and generating a two-dimensional plane etching pattern for region division; the laser energy input of each etching area is dynamically adjusted; and performing additive manufacturing to supplement materials in real time, and controlling the etching depth and the surface quality. According to the etching forming method based on the laser scanning strategy, laser energy input of each etching area is dynamically adjusted, the etching forming method is suitable for deep etching and micromachining of a complex structure, and more accurate depth control and surface quality optimization are achieved. Path optimization is carried out by combining curvature and local laser energy requirements, minimization of a laser etching path and maximization of energy efficiency are achieved, and the overall performance of laser etching can be remarkably improved in the field of fine structure and complex surface machining.

Description

Technical Field

[0001] The present invention relates to the field of laser etching technology, and in particular to an etching forming method and system based on a laser scanning strategy. Background Art

[0002] With the continuous development of laser technology, laser etching and additive manufacturing technologies have gradually been widely used in the field of precision machining. As a high-precision and high-efficiency surface processing method, laser etching plays an important role in many fields such as microelectronics, aerospace, and medical devices. By focusing the laser beam on the surface of the material for energy transmission, laser etching can accurately remove materials to form the required microstructures and complex geometries. In addition, additive manufacturing technologies (such as laser spraying or local material deposition) have also made significant progress, which can thicken or repair the surface of the material in real time and optimize defects or depth problems in the processing process. In recent years, the combination of laser etching and additive manufacturing technology has become a new trend, aiming to overcome the limitations of traditional laser processing methods to achieve more efficient and precise surface treatment.

[0003] However, the existing laser etching methods still have certain technical bottlenecks in terms of precision control, energy distribution and material deposition. Traditional laser etching technology usually relies on simple two-dimensional plane etching patterns, ignoring the differences in surface geometry and local energy requirements, which leads to uneven etching effects on complex surfaces or non-uniform materials, especially in areas with large curvature, where over-etching is prone to occur. On the other hand, the input of laser energy lacks a flexible dynamic adjustment mechanism, resulting in the fixed mode of laser power and scanning path being unable to adapt to the needs of different regions. In addition, additive manufacturing in the prior art is usually used as a post-processing method, which is only used to repair or supplement materials. It is impossible to dynamically adjust the deposition amount of additive manufacturing in real time during the etching process, resulting in low precision in etching depth and surface quality control. Therefore, it is difficult for the existing technology to effectively solve the problems of uneven energy distribution, insufficient etching depth or uneven surface in different regions. A new technical solution is urgently needed to comprehensively optimize the laser etching process and real-time feedback control of additive manufacturing, so as to improve etching accuracy, material utilization and surface quality. Summary of the invention

[0004] In view of the above-mentioned problems, the present invention is proposed.

[0005] Therefore, the technical problem solved by the present invention is: the existing laser etching methods have problems such as uneven energy distribution, inaccurate etching depth, and difficult to control surface quality, as well as how to optimize the etching effect by dynamically adjusting laser energy input and real-time material replenishment through additive manufacturing.

[0006] To solve the above technical problems, the present invention provides the following technical solutions: an etching forming method based on a laser scanning strategy, comprising: importing a three-dimensional etching model into a coordinate system for hierarchical division, generating a two-dimensional plane etching pattern for regional division. Dynamically adjusting the laser energy input of each etching area. Performing additive manufacturing to replenish materials in real time, and controlling etching depth and surface quality.

[0007] As a preferred solution of the etching forming method based on laser scanning strategy described in the present invention, wherein: the hierarchical division by importing the three-dimensional etching model into the coordinate system includes importing the three-dimensional etching model to be processed into the coordinate system, and the coordinate system includes a working coordinate system and a Cartesian coordinate system.

[0008] The working coordinate system is consistent with the machine tool coordinate system of the laser etching equipment.

[0009] The Cartesian coordinate system is used to describe the standard three-dimensional coordinate system (x, y, z) in physical space.

[0010] As a preferred solution of the etching forming method based on the laser scanning strategy described in the present invention, the generation of two-dimensional plane etching graphics for area division includes dividing the surface of the three-dimensional model in the working coordinate system, and each divided layer will become the basic layer for laser etching path planning.

[0011] Calculate the normal direction of each surface point, divide the 3D model into several layers based on the normal direction, and for a given surface point, the curvature radius It is expressed as: in, is the curvature of the point. The curvature is calculated by the second-order derivative of the surface. If the surface is parameterized as ,but: in, They are The first and second order partial derivatives of .

[0012] Calculate the area of ​​each two-dimensional plane etching pattern and distribute the laser energy to the area. The area is obtained by numerical integration and is expressed as: in, is the domain of the planar etching pattern, is the height of the shape, and are the boundary coordinates of the shape.

[0013] By extracting the contour on each layer, a two-dimensional etching pattern is generated, and the planar etching pattern is used for planning the laser etching path.

[0014] As a preferred solution of the etching forming method based on the laser scanning strategy described in the present invention, the generating of the two-dimensional planar etching pattern for regional division also includes the requirements for laser energy distribution and path optimization. The goal of path optimization is to minimize the total path length. The objective function is constructed by combining the curvature radius and the local laser energy requirement, which is expressed as: in, is the optimized path length, It is The coordinates of the points, It is The radius of curvature of a point, is the curvature influence coefficient.

[0015] As a preferred solution of the etching forming method based on the laser scanning strategy described in the present invention, the dynamic adjustment of the laser energy input to each etching area includes determining the energy input of the laser, which is expressed as: in, is the power of the laser beam, is the spacing between scan paths, is the scanning speed.

[0016] As a preferred solution of the etching forming method based on the laser scanning strategy described in the present invention, the dynamic adjustment of the laser energy input to each etching area also includes obtaining the curvature and surface roughness of the path area, and determining the adjustment coefficient of the path area, which is expressed as: in, is the radius of curvature of the path area, is the surface roughness of the path area, is the average roughness of the entire processing area, and They are the curvature adjustment coefficient and the roughness adjustment coefficient respectively.

[0017] As a preferred solution of the etching forming method based on the laser scanning strategy described in the present invention, wherein: the real-time material replenishment by additive manufacturing and the control of etching depth and surface quality include, during the laser etching process, material thickening by laser spraying or local material deposition and real-time material replenishment by additive manufacturing.

[0018] Another object of the present invention is to provide an etching forming system based on a laser scanning strategy, which can import the three-dimensional etching model into a specific coordinate system for hierarchical division, and combine dynamic laser energy regulation and additive manufacturing to replenish materials in real time, thereby solving the problem that the current traditional laser etching system cannot accurately control the energy input of complex geometric surfaces, resulting in inconsistent etching depth and poor surface quality.

[0019] As a preferred solution of the etching forming system based on the laser scanning strategy described in the present invention, it includes a model division module, an energy input module, and an etching processing module. The model division module is used to generate a two-dimensional plane etching pattern for regional division by importing the three-dimensional etching model into the coordinate system for hierarchical division. The energy input module is used to dynamically adjust the laser energy input of each etching area. The etching processing module is used to perform real-time material replenishment for additive manufacturing and control the etching depth and surface quality.

[0020] A computer device comprises a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of an etching forming method based on a laser scanning strategy.

[0021] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the steps of an etching forming method based on a laser scanning strategy.

[0022] Beneficial effects of the present invention: The etching forming method based on the laser scanning strategy provided by the present invention is suitable for deep etching and micro-machining of complex structures by dynamically adjusting the laser energy input of each etching area, thereby achieving more precise depth control and surface quality optimization. By combining curvature and local laser energy requirements for path optimization, the laser etching path is minimized and the energy efficiency is maximized, which can significantly improve the overall performance of laser etching in the field of microstructures and complex surface processing. The present invention achieves better results in terms of applicability, refinement and overall performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0024] Figure 1 An overall flow chart of an etching forming method based on a laser scanning strategy provided for the first embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the drawings of the specification. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary persons in the art without creative work should fall within the scope of protection of the present invention.

[0026] Example 1, reference Figure 1 , as an embodiment of the present invention, provides an etching forming method based on a laser scanning strategy, comprising: S1: The three-dimensional etching model is imported into the coordinate system for hierarchical division, and a two-dimensional plane etching pattern is generated for regional division.

[0027] Furthermore, the hierarchical division is performed by importing the three-dimensional etching model into a coordinate system, which includes importing the three-dimensional etching model to be processed into the coordinate system, and the coordinate system includes a working coordinate system and a Cartesian coordinate system.

[0028] The working coordinate system is consistent with the machine coordinate system of the laser etching equipment. It is defined according to the working principle and space limitations of the equipment to ensure that the equipment can accurately perform etching operations. In order to accurately convert and process data, the 3D model is first imported into this coordinate system. The purpose of this is to ensure that all subsequent operations are based on a unified coordinate reference and will not cause errors due to differences in coordinate systems.

[0029] The Cartesian coordinate system is used to describe the standard three-dimensional coordinate system (x, y, z) in physical space.

[0030] It should be noted that generating a two-dimensional planar etching pattern for area division includes segmenting the surface of the three-dimensional model in the working coordinate system, and each segmentation layer will become the basic layer for laser etching path planning.

[0031] Calculate the normal direction of each surface point, divide the 3D model into several layers based on the normal direction, and for a given surface point, the curvature radius It is expressed as: in, is the curvature of the point. The curvature is calculated by the second-order derivative of the surface. If the surface is parameterized as ,but: in, They are The first and second order partial derivatives of .

[0032] Calculate the area of ​​each two-dimensional plane etching pattern and distribute the laser energy to the area. The area is obtained by numerical integration and is expressed as: in, is the domain of the planar etching pattern, is the height of the shape, and are the boundary coordinates of the shape.

[0033] By extracting the contour on each layer, a two-dimensional etching pattern is generated, and the planar etching pattern is used for planning the laser etching path.

[0034] It should also be noted that the generation of two-dimensional planar etching patterns for regional division also includes requirements for laser energy distribution and path optimization. The goal of path optimization is to minimize the total path length. The objective function is constructed by combining the curvature radius and the local laser energy requirement, which is expressed as: in, is the optimized path length, It is The coordinates of the points, It is The radius of curvature of a point, is the curvature influence coefficient.

[0035] S2: Dynamically adjust the laser energy input to each etching area.

[0036] Furthermore, dynamically adjusting the laser energy input for each etching region includes determining the laser energy input, expressed as: in, is the power of the laser beam, is the spacing between scan paths, is the scanning speed.

[0037] It should be noted that the dynamic adjustment of the laser energy input to each etching area also includes obtaining the curvature and surface roughness of the path area and determining the adjustment coefficient of the path area, which is expressed as: in, is the radius of curvature of the path area. The greater the curvature, The smaller it is, the less laser energy input will be. is the surface roughness of the path area, is the average roughness of the entire processing area, and They are the curvature adjustment coefficient and the roughness adjustment coefficient respectively.

[0038] according to Adjusting laser parameters specifically includes: By adjusting and The present invention can realize accurate control of laser energy input. Each parameter is directly related to the input amount of laser energy and the processing effect.

[0039] Laser power It is the direct source of the energy output of the laser beam. and surface roughness Adjust the power to suit the etching requirements of each area.

[0040] Larger curvature ( Smaller): In areas with greater curvature (such as edges or sharp corners of a model), the power is higher because it is necessary to avoid over-etching. At this time, the laser power and the adjustment coefficient Inversely proportional to the energy consumption, ensuring that the energy allocation is not too high.

[0041] Large surface roughness ( Larger): In rough areas, the laser energy needs to be increased to compensate for the surface unevenness. When it increases, the laser power will increase accordingly.

[0042] Based on these principles, the laser power is adjusted using the following relationship: in, is the initial laser power, It is the laser power adjusted according to the regional characteristics.

[0043] Scan speed It is the speed at which the laser beam moves across the surface of the material. A higher scanning speed means that the laser covers a larger area per unit time, thereby reducing the energy input. A lower scanning speed increases the energy input.

[0044] Larger curvature ( Smaller): The area with larger curvature requires lower laser energy, so the corresponding scanning speed will be reduced. By slowing down the scanning speed, the present invention can focus the laser beam on the area with larger curvature, thereby avoiding excessive engraving.

[0045] Large surface roughness ( Larger): Rougher areas of the surface require more energy to ensure uniform etching, so the scan speed will be faster. By increasing the scan speed, the laser energy is distributed more evenly in the rough areas.

[0046] Based on these principles, the scanning speed can be adjusted by the following relationship: in, is the initial scan speed, It is the scanning speed adjusted according to the regional characteristics.

[0047] Scanning distance It is the distance between each point on the scanning path of the laser beam. Smaller spacing means higher energy density of the laser, while larger spacing will disperse the energy of the laser.

[0048] Larger curvature ( Smaller): In areas with greater curvature, less laser energy is required, so the scanning spacing will increase to reduce the concentration of laser energy and thus prevent over-etching.

[0049] Large surface roughness ( Larger): In areas with rougher surfaces, the laser requires higher energy, so the scanning spacing will be reduced to ensure higher energy density and overcome surface heterogeneity.

[0050] Based on these principles, the present invention uses the following relationship to adjust the scanning pitch: in, is the initial scan spacing. It is the scanning distance adjusted according to the regional characteristics.

[0051] Combined with the above adjustment rules, the present invention can dynamically adjust the three key parameters of the laser according to the curvature and surface roughness of each area: power , Scanning speed and scanning pitch , thereby achieving optimal energy distribution. The specific steps are as follows: For each region, first calculate the curvature and surface roughness Calculate .

[0052] For areas with greater curvature (such as edges or sharp corners), reduce the power , reduce the scanning speed , increase the scanning distance .

[0053] For rough surface areas, increase the power , improve scanning speed , reduce the scanning distance .

[0054] According to the adjusted parameters, the laser etching operation is performed, and the surface temperature and etching depth are monitored through real-time feedback to further optimize the energy input and ensure that the etching effect in each area meets the expectations.

[0055] S3: Perform additive manufacturing to replenish materials in real time and control etching depth and surface quality.

[0056] Furthermore, additive manufacturing is performed to replenish materials in real time, and the etching depth and surface quality are controlled, including using laser spraying or local material deposition to thicken the material during the laser etching process, and replenishing materials in real time through additive manufacturing.

[0057] It should be noted that when additional contours are required during etching, additional contours are added to the original outer contours of the etching pattern during the etching process. These additional contours will help optimize the energy distribution in the deep etching area.

[0058] According to the addition of additional contours, the area is re-divided and the laser energy input is adjusted.

[0059] Based on the effect of the additional contours, the area energy fill changes to: in, is the energy filling amount of the additional contour area, is the laser power of the additional profile, is the adjustment coefficient of energy filling, is the area change of the additional contour area.

[0060] Example 2, an embodiment of the present invention, provides an etching forming method based on a laser scanning strategy. In order to verify the beneficial effects of the present invention, scientific demonstration is carried out through economic benefit calculation and simulation experiments.

[0061] First, the test object is a group of metal alloy parts, the surface of which has a certain curvature and surface roughness, representing a typical industrial processing scenario. In order to verify the effectiveness of the present invention, we used the three-dimensional etching path planning and energy distribution method described in the present invention, and evaluated the advantages of the present method in terms of accuracy, efficiency and surface quality control by comparing with the prior art.

[0062] First, the 3D etching model to be processed is imported into the working coordinate system and the Cartesian coordinate system. In this process, the machine coordinate system of the laser etching equipment is consistent with the working coordinate system to ensure the accuracy of the coordinates. By dividing the 3D model into layers, a 2D plane engraving figure is obtained, and the curvature of each area is calculated. and surface roughness .

[0063] According to the curvature of each area and surface roughness , using the formula Dynamic adjustment of laser power , Scanning speed and scanning pitch , ensuring that each area receives the optimal energy input. In this step, through real-time feedback and adjustment of the area, the laser energy input is ensured to be consistent with the area's needs.

[0064] During the etching process, additive manufacturing technology is used to supplement local materials in deep etching areas to ensure that the etching depth and surface quality meet expectations. The depth control of etching is optimized by adjusting the laser energy distribution and additive manufacturing strategy.

[0065] After the experiment, the laser parameters and surface quality of each area during the experiment were recorded and data analysis was performed, focusing on comparing the differences between the method of the present invention and the prior art in terms of etching depth control, surface quality and processing efficiency.

[0066]

[0067] For regions with smaller curvature (such as regions 3 and 6), the laser power is lower (10 W and 11 W, respectively) because these regions have smaller curvatures and require less energy input. This is consistent with the adjustment of the formula in the present invention. The formula is consistent, reducing the laser power in areas with greater curvature.

[0068] For regions with larger curvature (such as regions 2 and 4), the laser power is higher (respectively and 15W), ensuring that the energy can cover surfaces with greater curvature and optimizing processing depth.

[0069] In areas with greater surface roughness (such as Area 2 and Area 4), the scanning speed is lower (800 mm / s and 150 mm / s, respectively). This is to ensure sufficient laser energy concentration on the irregular surface to avoid over-etching.

[0070] In areas with smoother surfaces (such as Area 1 and Area 3), the scanning speed is higher (100 mm / s and 120 mm / s, respectively) because the surface irregularities are lower and the laser energy can be effectively and evenly distributed through the higher scanning speed.

[0071] In areas with greater surface roughness, the scanning interval is smaller (such as areas 2 and 4) to ensure that the laser energy is concentrated and the etching effect is enhanced. In areas with smooth surfaces, the scanning interval is larger (such as areas 1 and 3) to avoid excessive energy concentration.

[0072] By comparing the etching depth of different areas and surface quality It can be seen that the method of the present invention significantly optimizes the control of etching depth and maintains good surface quality by accurately adjusting the laser power, scanning speed and scanning spacing. For example, the etching depth of area 1 is 0.15mm and the surface quality is , while the etching depth of area 4 is 0.25 mm and the surface quality is Although the etching depth is deep, the surface quality is still well controlled.

[0073] Embodiment 3, an embodiment of the present invention, provides an etching forming system based on a laser scanning strategy, including a model division module, an energy input module, and an etching processing module.

[0074] The model division module is used to import the three-dimensional etching model into the coordinate system for hierarchical division and generate a two-dimensional plane etching pattern for regional division. The energy input module is used to dynamically adjust the laser energy input of each etching area. The etching processing module is used to supplement materials in real time for additive manufacturing and control the etching depth and surface quality.

[0075] If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc. Various media that can store program codes.

[0076] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as an ordered list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by an instruction execution system, device or apparatus (such as a computer-based system, a system including a processor, or other system that can fetch instructions from an instruction execution system, device or apparatus and execute instructions), or in conjunction with such instruction execution systems, devices or apparatuses. For the purposes of this specification, "computer-readable medium" can be any device that can contain, store, communicate, propagate or transmit a program for use by an instruction execution system, device or apparatus, or in conjunction with such instruction execution systems, devices or apparatuses.

[0077] More specific examples of computer-readable media (a non-exhaustive list) include the following: an electrical connection with one or more wires (electronic devices), a portable computer disk case (magnetic devices), a random access memory (RAM), a read-only memory (ROM), an erasable and programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disk read-only memory (CDROM). In addition, the computer-readable medium may even be a paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, deciphering or, if necessary, processing in another suitable manner, and then stored in a computer memory.

[0078] It should be understood that the various parts of the present invention can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logical function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc. It should be noted that the above embodiments are only used to illustrate the technical solution of the present invention and are not limited. Although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention, which should be included in the scope of the claims of the present invention.

[0079] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. An etching forming method based on a laser scanning strategy, characterized in that: include: By importing the three-dimensional etching model into the coordinate system for hierarchical division, a two-dimensional plane etching pattern is generated for regional division; Dynamically adjust the laser energy input to each etching area; Perform additive manufacturing to replenish materials in real time and control etching depth and surface quality.

2. The etching forming method based on the laser scanning strategy as claimed in claim 1, characterized in that: The step of performing hierarchical division by importing the three-dimensional etching model into a coordinate system includes importing the three-dimensional etching model to be processed into a coordinate system, wherein the coordinate system includes a working coordinate system and a Cartesian coordinate system; The working coordinate system is consistent with the machine tool coordinate system of the laser etching equipment; The Cartesian coordinate system is used to describe the standard three-dimensional coordinate system (x, y, z) in physical space.

3. The etching forming method based on laser scanning strategy as claimed in claim 2, characterized in that: The generating of the two-dimensional plane etching pattern for area division includes dividing the surface of the three-dimensional model in the working coordinate system, and each divided layer will become the basic layer of the laser etching path planning; Calculate the normal direction of each surface point, divide the 3D model into several layers based on the normal direction, and for a given surface point, the curvature radius It is expressed as: in, is the curvature of the point. The curvature is calculated by the second-order derivative of the surface. If the surface is parameterized as ,but: in, They are The first and second partial derivatives of ; Calculate the area of ​​each two-dimensional plane etching pattern and distribute the laser energy to the region. The area is obtained by numerical integration and is expressed as: in, is the domain of the planar etching pattern, is the height of the shape, and are the boundary coordinates of the figure; By extracting the contour on each layer, a two-dimensional etching pattern is generated, and the planar etching pattern is used for planning the laser etching path.

4. The etching forming method based on the laser scanning strategy as claimed in claim 3, characterized in that: The generating of the two-dimensional planar etching pattern for area division also includes requirements for laser energy distribution and path optimization. The goal of path optimization is to minimize the total path length. The objective function is constructed by combining the curvature radius and the local laser energy requirement, which is expressed as: in, is the optimized path length, It is The coordinates of the points, It is The radius of curvature of a point, is the curvature influence coefficient.

5. The etching forming method based on laser scanning strategy as claimed in claim 4, characterized in that: The dynamic adjustment of the laser energy input to each etching area includes determining the energy input of the laser, which is expressed as: in, is the power of the laser beam, is the spacing between scan paths, is the scanning speed.

6. The etching forming method based on laser scanning strategy as claimed in claim 5, characterized in that: The dynamic adjustment of the laser energy input to each etching area also includes obtaining the curvature and surface roughness of the path area and determining the adjustment coefficient of the path area, which is expressed as: in, is the radius of curvature of the path area, is the surface roughness of the path area, is the average roughness of the entire processing area, and They are the curvature adjustment coefficient and the roughness adjustment coefficient respectively.

7. The etching forming method based on laser scanning strategy as claimed in claim 6, characterized in that: The method of performing additive manufacturing to replenish materials in real time and control etching depth and surface quality includes, during the laser etching process, using laser spraying or local material deposition to thicken the material and replenishing materials in real time through additive manufacturing.

8. A system using the etching forming method based on the laser scanning strategy as claimed in any one of claims 1 to 7, characterized in that: Including model division module, energy input module, etching processing module; The model division module is used to generate a two-dimensional plane etching pattern for regional division by importing the three-dimensional etching model into a coordinate system for hierarchical division; The energy input module is used to dynamically adjust the laser energy input of each etching area; The etching processing module is used to supplement materials in real time during additive manufacturing and control etching depth and surface quality.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the etching and shaping method based on the laser scanning strategy described in any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the etching and shaping method based on a laser scanning strategy according to any one of claims 1 to 7 are implemented.

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