Method for determining laser processing parameters and method and device for controlling laser processing

Abstract

The invention discloses a laser processing parameter determination method and a laser processing control method and device. The position of the center of a target cutting channel on the to-be-machined product under the wide-angle camera is obtained; the cutting channels are strip-shaped areas used for dividing the multiple target features on the to-be-machined product; position information of two intersection points which pass through the position, are parallel to the preset direction and intersect with the outline of the product to be machined is determined; the contour is obtained based on imaging extraction of the wide-angle camera on the to-be-processed product, and the preset direction corresponds to the direction of a straight line where the cutting channel is located; and on the basis of the relative position of the view center of the wide-angle camera and the laser light-emitting point and the position information of the two intersection points, a laser light-on position and a laser light-off position for laser processing of the to-be-processed product are obtained through conversion. According to the method, the accuracy of all the determined laser processing parameters is improved, high-accuracy light opening and closing control can be achieved in laser processing, the safety accident risk is reduced, and equipment can be better protected.

Description

Technical Field

[0001] The present application relates to the field of material processing technology, and in particular to a method for determining laser processing parameters, and a method and device for controlling laser processing. Background Art

[0002] When processing materials through high-power devices (such as lasers), if the starting and ending positions of the material processing are not accurately controlled, or the processing length of the material is not accurately controlled, it is very easy to cause unsatisfactory quality of the processed product. In addition, inaccurate control of the starting point, key position, and processing length of the material may lead to safety problems during processing and may also affect the service life of the processing equipment.

[0003] For example, during laser surface cutting, if the actual cutting length of the laser is greater than the length of the material cutting path, or the starting and ending points of the laser cutting are not on the material, the heat of the laser may damage the processing stage and shorten the service life of the equipment. If the cutting position falls on the blue film, the blue film may catch fire due to the heat, causing a safety accident. The above examples show the importance of accurate control of laser processing. How to improve the accuracy of laser processing control is a technical problem that needs to be solved urgently in this field. Summary of the invention

[0004] Based on the above problems, the present application provides a method for determining laser processing parameters, a method and device for controlling laser processing, with the aim of improving the accuracy of laser processing control.

[0005] The embodiments of the present application disclose the following technical solutions:

[0006] The first aspect of the present application provides a method for determining laser processing parameters, the method comprising:

[0007] Acquire the position of the center of the target cutting path on the product to be processed under the wide-angle camera; the cutting path is a strip area on the product to be processed for separating multiple target features;

[0008] Determine the position information of two intersection points that pass through the position and are parallel to a preset direction and intersect with the contour of the product to be processed; the contour is obtained based on the imaging extraction of the product to be processed by the wide-angle camera, and the preset direction corresponds to the direction of the straight line where the cutting path is located;

[0009] Based on the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the two intersection points, the laser on position and the laser off position for laser processing the product to be processed are converted.

[0010] In an optional implementation, the two intersection points include a first intersection point and a second intersection point; the conversion based on the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the two intersection points to obtain the laser light-on position and the laser light-off position for laser processing the product to be processed includes:

[0011] A first position conversion result is obtained by calculation based on the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the first intersection; and a second position conversion result is obtained by calculation based on the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the second intersection; one of the first position conversion result and the second position conversion result is used as the laser on position, and the other is used as the laser off position.

[0012] In an optional implementation, the calculation to obtain a first position conversion result based on the relative position of the field of view center of the wide-angle camera and the laser light-emitting point, and the position information of the first intersection, includes: according to the proportional relationship between the axis coordinate system and the pixel coordinate system, converting the position information of the first intersection from the pixel coordinate system to the axis coordinate system, to obtain the position information of the first intersection in the axis coordinate system;

[0013] According to the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the first intersection in the axis coordinate system, a first position conversion result is calculated as the laser opening position;

[0014] The second position conversion result is obtained by calculating the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the second intersection, including:

[0015] According to the proportional relationship, the position information of the second intersection is converted from the pixel coordinate system to the axis coordinate system to obtain the position information of the second intersection in the axis coordinate system;

[0016] According to the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the second intersection in the axis coordinate system, a second position conversion result is calculated as the laser light-off position.

[0017] In an optional implementation, the method further includes:

[0018] Pre-calibrating the relative position between the center of the field of view of the fine-tuning camera and the laser light-emitting point;

[0019] Based on the relative positions of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera, and the relative positions of the field of view center of the fine-tuning camera and the laser light-emitting point, the relative positions of the field of view center of the wide-angle camera and the laser light-emitting point are calculated.

[0020] In an optional implementation, the method further includes determining a relative position of a center of field of view of the wide-angle camera and a center of field of view of the fine-tuning camera by the following steps:

[0021] Pre-calibrating a first rotation center position of the processing platform when the field of view center of the wide-angle camera and the rotation center of the processing platform coincide with each other, wherein the processing platform is used to carry the product to be processed;

[0022] and pre-calibrating a second rotation center position of the processing stage when the field of view center of the fine-tuning camera and the rotation center of the processing stage coincide with each other;

[0023] Based on the first rotation center position and the second rotation center position, a relative position between a field of view center of the wide-angle camera and a field of view center of the fine-tuning camera is determined.

[0024] In an optional implementation, the method further comprises determining the contour of the product to be processed by the following steps:

[0025] When the rotation center of the processing platform coincides with the field of view center of the wide-angle camera, a first angle value of the rotation axis of the processing platform is obtained, and the product to be processed is imaged by the wide-angle camera to extract the initial contour of the product to be processed from the image; the processing platform is used to carry the product to be processed;

[0026] Controlling the processing stage to move the product to be processed successively to the bottom of the coarse adjustment camera and the bottom of the fine adjustment camera, and adjusting the center of the target cutting path on the product to be processed to coincide with the center of the field of view of the camera above after each movement;

[0027] Acquire a second angle value of the rotation axis of the processing stage when the center of the target cutting path coincides with the center of the field of view of the fine-tuning camera;

[0028] Determine an angle difference between the first angle value and the second angle value;

[0029] Based on the position information of each pixel in the initial contour, calculating the rotated position information corresponding to each pixel after each pixel in the initial contour is rotated by the angle difference around the field of view center of the wide-angle camera;

[0030] The contour of the product to be processed is obtained by fitting according to the rotated position information corresponding to each pixel.

[0031] In an optional implementation, controlling the processing stage to move the product to be processed successively to below the coarse adjustment camera and below the fine adjustment camera, and adjusting the center of the target cutting path on the product to be processed to coincide with the center of the field of view of the camera above after each movement, includes:

[0032] Controlling the processing stage to move the product to be processed to below the coarse adjustment camera;

[0033] Based on the target cutting line center determined within the field of view of the coarse adjustment camera, controlling the movement of the processing stage to perform a first alignment operation between the target cutting line center and the field of view center of the coarse adjustment camera;

[0034] Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If so, control the processing stage to move the product to be processed to the bottom of the fine-tuning camera. If not, adjust the angle of the rotation axis of the processing stage to make the first direction cutting path passing through the center of the target cutting path parallel to the preset direction, and then control the processing stage to move so that the center of the target cutting path and the center of the field of view of the coarse-tuning camera are aligned for the second time. After the second alignment operation is completed, continue to control the processing stage to move the product to be processed to the bottom of the fine-tuning camera.

[0035] Based on the target cutting line center determined within the field of view of the fine-tuning camera, controlling the movement of the processing stage to perform a first alignment operation between the target cutting line center and the field of view center of the fine-tuning camera;

[0036] Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If not, adjust the angle of the rotation axis of the processing platform to make the first direction cutting path passing through the center of the target cutting path parallel to the preset direction, and then control the movement of the processing platform to perform a second alignment operation between the center of the target cutting path and the center of the field of view of the fine-tuning camera.

[0037] In an optional implementation, the method of determining the center of the target cutting path within the field of view of the coarse adjustment camera is:

[0038] Acquire a first template image corresponding to the field of view of the coarse adjustment camera; the first template image includes a plurality of mutually segmented target features for identifying the center of the cutting path;

[0039] Based on the multiple mutually segmented target features in the first template image, feature matching is performed on pixels within the field of view of the coarse adjustment camera to determine one or more cutting lane centers;

[0040] If multiple cutting path centers are determined, a cutting path center that is closest to the center of the field of view of the coarse adjustment camera is used as the target cutting path center.

[0041] In an optional implementation, the method further includes:

[0042] When the center of the target cutting path coincides with the center of the field of view of the fine-tuning camera, and the first direction cutting path of the center of the target cutting path is parallel to the preset direction, obtaining first position information of the center of the target cutting path under the fine-tuning camera;

[0043] Pre-calibrating the first rotation center position of the processing platform when the field of view center of the wide-angle camera coincides with the rotation center of the processing platform, and pre-calibrating the second rotation center position of the processing platform when the field of view center of the fine-tuning camera coincides with the rotation center of the processing platform; the step of obtaining the position of the center of the target cutting path on the product to be processed under the wide-angle camera includes:

[0044] Based on the first position information and the relative position between the first rotation center position and the second rotation center position, reversely calculate the second position information of the target cutting lane center under the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage;

[0045] Based on the second position information, the first rotation center position and the pixel coordinates of the field of view center of the wide-angle camera, the pixel position of the target cutting path center within the field of view of the wide-angle camera is calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing platform.

[0046] In an optional implementation, the pixel position of the target cutting path center in the field of view of the wide-angle camera is calculated based on the second position information, the first rotation center position and the pixel coordinates of the field of view center of the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage, including:

[0047] Calculating, according to the second position information and the first rotation center position, the relative position of the target cutting path center and the field of view center of the wide-angle camera in the axial coordinate system when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage;

[0048] Based on the proportional relationship between the axis coordinate system and the pixel coordinate system, the relative position of the center of the target cutting path and the center of the field of view of the wide-angle camera in the axis coordinate system is converted to the pixel coordinate system, and when the center of the field of view of the wide-angle camera coincides with the rotation center of the processing stage, the relative position of the center of the target cutting path and the center of the field of view of the wide-angle camera in the pixel coordinate system is obtained;

[0049] Based on the relative positions of the target cutting path center and the field of view center of the wide-angle camera in the pixel coordinate system, and the pixel coordinates of the field of view center of the wide-angle camera, the pixel position of the target cutting path center within the field of view of the wide-angle camera is calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing platform.

[0050] In an optional implementation, the method further includes:

[0051] The laser processing length is calculated according to the laser on position and the laser off position.

[0052] A second aspect of the present application provides a laser processing control method, the method comprising:

[0053] Receiving laser processing parameters; the laser processing parameters include the laser opening position and the laser processing length obtained by the method for determining the laser processing parameters provided in the first aspect;

[0054] After the processing stage is moved to the corresponding position according to the laser opening position control,

[0055] Controlling to turn on the laser;

[0056] After the laser starts to process the product to be processed, the processing platform is controlled to move the laser processing length along a preset direction, and the laser is controlled to be turned off.

[0057] The third aspect of the present application provides a device for determining laser processing parameters, the device comprising:

[0058] An acquisition module, used for acquiring the position of the center of a target cutting path on the product to be processed under the wide-angle camera; the cutting path is a strip area on the product to be processed for separating a plurality of target features;

[0059] An intersection position determination module is used to determine the position information of two intersections passing through the position and parallel to a preset direction with the contour of the product to be processed; the contour is obtained based on the imaging extraction of the product to be processed by the wide-angle camera; the preset direction corresponds to the direction of the straight line where the cutting path is located;

[0060] The switch light position acquisition module is used to convert the laser light on position and laser light off position used for laser processing of the product to be processed based on the relative position of the field center of the wide-angle camera and the laser light output point, and the position information of the two intersection points.

[0061] A fourth aspect of the present application provides a laser processing control device, the device comprising:

[0062] A parameter receiving module, used to receive laser processing parameters; the laser processing parameters include the laser opening position and the laser processing length obtained by the method for determining the laser processing parameters in the first aspect;

[0063] A control module, used for controlling the processing stage to move to a corresponding position according to the laser opening position, and then controlling the laser to be turned on;

[0064] Furthermore, it is used to control the processing platform to move the laser processing length along a preset direction and control the laser to be turned off after the laser starts to process the product to be processed.

[0065] The fifth aspect of the present application provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the method for determining laser processing parameters as described in the first aspect is implemented, or the method for controlling laser processing as described in the second aspect is implemented.

[0066] Compared with the prior art, this application has the following beneficial effects:

[0067] In the method for determining laser processing parameters provided in the present application, first, the position of the center of the target cutting path on the product to be processed in the wide-angle camera is obtained to achieve accurate positioning of the center of the target cutting path in the wide-angle camera. Next, the position information of the two intersection points that pass through the position of the center of the target cutting path under the wide-angle camera and intersect with the contour of the product to be processed in parallel to the preset direction is determined. Among them, the preset direction corresponds to the direction of the straight line where the cutting path is located. Subsequently, since the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point can be calibrated, based on the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the above two intersection points, the laser on-position and laser off-position for laser processing of the product to be processed can be converted.

[0068] In the above method, by making use of the technical advantage of being able to identify the outline of the product to be processed under a wide-angle camera, the position of the center of the target cutting path on the product to be processed under the wide-angle camera is accurately located at the pixel level. Based on this, the two intersection points are accurately located at the pixel level, and based on this, the laser light-on position and the laser light-off position are determined, so that the accuracy of the laser light-on position and the laser light-off position is greatly improved. The method of determining the laser processing parameters in the technical solution of the present application has improved accuracy compared to the prior art. The various laser processing parameters determined by this method are conducive to achieving high-precision light-on and light-off control in laser processing, reducing the risk of safety accidents. In addition, it can also better protect the equipment and avoid the problem of shortened equipment life caused by improper laser processing control. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0070] Figure 1 A flowchart of a method for determining laser processing parameters provided in an embodiment of the present application;

[0071] Figure 2 A schematic diagram of a processing scenario provided in an embodiment of the present application;

[0072] Figure 3 A schematic diagram of a cutting path, a cutting path center and a target feature provided in an embodiment of the present application;

[0073] Figure 4 A schematic diagram of obtaining intersection position information provided in an embodiment of the present application;

[0074] Figure 5 A flowchart for determining the contour of a product to be processed provided in an embodiment of the present application;

[0075] Figure 6 A specific implementation flow chart of controlling the processing stage to move the product to be processed successively to the bottom of the coarse adjustment camera and the fine adjustment camera provided in the embodiment of the present application;

[0076] Figure 7 A flow chart of a laser processing control method provided in an embodiment of the present application;

[0077] Figure 8 A schematic diagram of the structure of a device for determining laser processing parameters provided in an embodiment of the present application;

[0078] Fig. 9 A schematic diagram of the structure of a laser processing control device provided in an embodiment of the present application;

[0079] Fig.10 A schematic diagram of a camera calibration interface provided in an embodiment of the present application;

[0080] Fig.11 A schematic diagram of a rotation center calibration interface provided in an embodiment of the present application. DETAILED DESCRIPTION

[0081] Lasers are high-power devices commonly used in laser processing, and their precise control affects the product processing yield. If they are not properly controlled, it is easy to cause production and processing safety accidents. In some cases, improper control of the laser may also shorten the service life of the equipment in this application. How to improve the accuracy of laser processing control is an urgent problem to be solved in the field of material processing.

[0082] In view of this problem, the inventors in this application propose a method for determining laser processing parameters, a method for controlling laser processing, and related devices. In this application, the advantage of a wide-angle camera being able to observe the complete outline of the product to be processed is utilized, and the center of the cutting path is located under the wide-angle camera, and the two intersection points of the line passing through the center of the cutting path and along the straight line direction corresponding to the cutting path are determined, and the two intersection points of the outline of the product to be processed are determined, so as to achieve pixel-level positioning of the two intersection points under the wide-angle camera. Subsequently, based on the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point, and the pixel-level position of the above-mentioned two intersection points, the laser light-on position and the laser light-off position of the laser processing product to be processed are converted. In this way, the conversion of the pixel-level positions of the two intersection points under the wide-angle camera to the axial coordinate system positions of the laser light-on and light-off under the laser processing head is achieved, so as to facilitate the accurate control of the processing stage under the axial coordinate system, and the accurate control of the laser light-on and light-off.

[0083] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0084] See also Figure 1 , which is a flow chart of a method for determining laser processing parameters provided in an embodiment of the present application. Figure 1 As shown, the method for determining the laser processing parameters includes:

[0085] S101, obtaining the position of the center of the target cutting path on the product to be processed under the wide-angle camera.

[0086] To facilitate understanding of the technical implementation of the technical solution of this application, the following first combines Figure 2 An exemplary introduction to laser processing scenarios is given.

[0087] Figure 2 A schematic diagram of a processing scenario provided in an embodiment of the present application. Figure 2The figure shows a partial structure of a laser processing device 200, including a laser processing head 201, a fine adjustment camera 202, a coarse adjustment camera 203, a wide angle camera 204, and a stage 205. The stage 205 is used to carry a workpiece to be processed (eg, a wafer to be processed). Figure 2 The relative positions of the components at a certain moment are only shown as an example. Figure 2 In the illustrated scene, generally speaking, the laser processing head 201, the fine adjustment camera 202, the coarse adjustment camera 203 and the wide-angle camera 204 do not move in a plane parallel to the stage 205, and the stage 205 can move in the plane where the stage 205 is located under the control of the processor or controller. Specifically, there are two mutually perpendicular directions, the X direction and the Y direction, in the plane, and the stage 205 can move in the positive or negative direction along the X direction under control, and can move in the positive or negative direction along the Y direction under control.

[0088] In order to facilitate the description of the implementation process of the technical solution of this application, the workpiece to be processed on the processing stage is called the product to be processed, which can be a wafer or other types of materials. The type of product to be processed and the purpose of the product after laser processing are not limited here.

[0089] In practical applications, the laser beam generated by the laser is transmitted to the laser processing head through a specific optical path. The laser processing head focuses and guides the laser beam to the product to be processed on the processing stage. Figure 2 A star-shaped mark is also shown below the laser processing head 201, and the center of the star-shaped mark represents the laser processing point 206. When the laser is controlled to be turned on, the laser beam hits the laser processing point 206. If the product to be processed is directly below the laser processing point 206, the energy transmitted by the laser beam can be used to process the product to be processed. Correspondingly, when the laser is controlled to be turned off, the laser processing point 206 no longer emits a laser beam, and the product to be processed on the carrier 205 is no longer laser processed.

[0090] The above briefly introduces the mechanism of laser processing and the control of turning on and off the laser. Combined with the previous introduction to the problems of laser processing control in the field of material processing, it can be seen that if the laser turning on and off is not properly controlled, and if the position of the product to be processed is not accurate, it is very likely to cause safety accidents and threaten the service life of the equipment. To this end, the technical solution of this application provides a new idea for solving the above problems:

[0091] The dicing road is a strip area on the product to be processed that is used to separate multiple target features. In one example, if the product to be processed is a wafer, the target feature may specifically be a grain. Figure 3A schematic diagram of a cutting path, a cutting path center, and a target feature provided in an embodiment of the present application. Figure 3 The cutting path 31 and the cutting path 32 are shown in FIG. Figure 3 The middle part is vertical, and the cutting path 32 is Figure 3 The middle direction is horizontal. Figure 3 Multiple target features are shown in 33.

[0092] The cutting path 31 and the cutting path 32 intersect to form a cross-like effect, and the center of the intersection of the two is the cutting path center 34. If laser processing is performed along the cutting path 32, a Figure 3 The cutting line 321 of the effect shown is a linear trace formed by laser processing.

[0093] In the embodiment of the present application, the center of a cutting path on the product to be processed is used as a reference point for laser processing to form a cutting line on the product to be processed, and the straight line direction of the cutting path is called the preset direction. The cutting line 321 can be regarded as a linear trace formed by processing along the straight line direction of the cutting path 32 and passing through or approaching the center of the cutting path 34 (ideally passing through the center of the cutting path).

[0094] Combined with the above examples, it can be seen that in order to achieve accurate processing control of the product to be processed, it is necessary to use the position information of the cutting path center. It is proposed in this application to obtain the position of the target cutting path center of the product to be processed under a wide-angle camera. The target cutting path center mentioned here is one of the cutting path centers presented on the product to be processed. The embodiment of this application takes the target cutting path center as an example to facilitate the clear introduction and explanation of the process of determining the laser processing parameters. Since the cutting path center is formed and determined by the horizontal and vertical intersecting cutting paths, the center position of the entire cutting path can be calibrated more accurately. In this way, the cutting line formed by the processing will not deviate from or even destroy the target features (such as grains) within the cutting path, and the product processing yield is more effectively guaranteed.

[0095] S102, determining position information of two intersection points that pass through the position and are parallel to a preset direction and intersect with the contour of the product to be processed.

[0096] exist Figure 2In the scene shown, a fine adjustment camera 202, a coarse adjustment camera 203 and a wide-angle camera 204 are shown. The field of view of the coarse adjustment camera 203 is larger than that of the fine adjustment camera 202, and the field of view of the wide-angle camera 204 is larger than that of the coarse adjustment camera 203. Compared with the coarse adjustment camera 203 and the fine adjustment camera 202, the wide-angle camera 204 has a larger field of view. When the stage 205 moves under the wide-angle camera 204, the wide-angle camera 204 can image the product to be processed on the stage 205 and extract the complete outline of the product to be processed. The extraction of the outline helps to accurately determine the laser processing parameters.

[0097] Since the position of the center of the target cutting path under the wide-angle camera has been obtained in S101, if a straight line is drawn through the center of the target cutting path and extends along a preset direction, the position information of the two intersection points where the straight line intersects with the contour of the product to be processed can be determined. Figure 4 is a schematic diagram for obtaining intersection location information. Figure 4 In the figure, multiple cutting paths that are staggered horizontally and vertically are shown. A horizontal straight line L is drawn through the center S of the target cutting path. The straight line L forms two intersection points K1 and K2 with the contour C of the product to be processed. The position information of these two intersection points is crucial for determining the laser processing parameters.

[0098] As mentioned above, the contour C of the product to be processed is extracted by imaging the product to be processed with a wide-angle camera, so the position of each point on the contour is pixel-level position information. Based on this, the position information of the two intersection points determined is also at the pixel level of the wide-angle camera.

[0099] S103, based on the relative position of the field of view center of the wide-angle camera and the laser light emitting point, and the position information of the two intersection points, convert and obtain the laser light on position and laser light off position for laser processing the product to be processed.

[0100] In one embodiment, the laser on position and the laser off position can be understood as: forming a laser processing cutting line, the position where the carrier should be when controlling the laser to be turned on and off; of course, in this case, during processing, the laser will not move along the cutting path, but the carrier moves along the cutting path to process the position where the cutting path is located.

[0101] Combination Figure 2 In the example scenario shown in , there is a position difference between the wide-angle camera and the laser light-emitting point. In order to obtain the laser light-on position and the laser light-off position, the above position difference cannot be ignored. In this step, based on the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the two intersection points determined in S102, the laser light-on position and the laser light-off position are converted.

[0102] It should be noted that, in the embodiment of the present application, the position of the center of the target cutting path under the wide-angle camera, specifically, when the field of view center of the wide-angle camera coincides with the rotation center of the stage, the pixel-level position of the center of the target cutting path under the wide-angle camera. Therefore, the position information of the two intersection points can also be understood as the pixel-level position information of the two intersection points relative to the field of view center of the wide-angle camera.

[0103] Assuming that the two intersections are the first intersection and the second intersection, in the present application, the first position conversion result is calculated based on the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the first intersection. The second position conversion result is calculated based on the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the second intersection. Of the first position conversion result and the second position conversion result, one is used as the laser on position, and the other is used as the laser off position.

[0104] Since the stage is generally controlled in an axis coordinate system, the laser on position and the laser off position can be position information in the axis coordinate system. The position information of the first intersection and the position information of the second intersection are position information in the pixel coordinate system of the wide-angle camera. Therefore, in order to achieve conversion, the position information can be optionally converted between different coordinate axes.

[0105] For example, for the first intersection:

[0106] According to the proportional relationship between the axis coordinate system and the pixel coordinate system, the position information of the first intersection is converted from the pixel coordinate system to the axis coordinate system to obtain the position information of the first intersection in the axis coordinate system;

[0107] According to the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the first intersection in the axis coordinate system, a first position conversion result is calculated as the laser opening position;

[0108] For example, for the second intersection:

[0109] According to the proportional relationship between the axis coordinate system and the pixel coordinate system, the position information of the second intersection point is converted from the pixel coordinate system to the axis coordinate system to obtain the position information of the second intersection point in the axis coordinate system;

[0110] According to the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the second intersection in the axis coordinate system, a second position conversion result is calculated as the laser light-off position.

[0111] In the above example of position information conversion, the proportional relationship between the axis coordinate system and the pixel coordinate system is used to realize the transformation of the position information of the first intersection and the second intersection from the pixel coordinate system to the axis coordinate system. Since the position information of the first intersection and the second intersection in the pixel coordinate system is determined by the position of the center of the target cutting path and the contour of the product to be processed, it has a certain accuracy. Therefore, through the transformation of the coordinate system, the position information of the two intersections in the axis coordinate system is also accurate.

[0112] Optionally, if the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point is calculated by respectively subtracting the horizontal and vertical coordinates of the center of the field of view of the wide-angle camera and the laser light-emitting point, then the position information of the first intersection in the axis coordinate system is subtracted from the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point to obtain the first position conversion result; if the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point is calculated by respectively subtracting the horizontal and vertical coordinates of the position of the laser light-emitting point and the center of the field of view of the wide-angle camera, then the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point is summed with the position information of the first intersection in the axis coordinate system to obtain the first position conversion result. The calculation method of the second position conversion result is similar to the calculation method of the first position conversion result described above, and will not be repeated here.

[0113] The relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point mentioned above can be calibrated with the help of the center of the field of view of the fine-tuning camera. Specifically, the relative position (△XP, △YP) between the center of the field of view of the fine-tuning camera and the laser light-emitting point can be calibrated in advance; then, based on the relative position between the center of the field of view of the wide-angle camera and the center of the field of view of the fine-tuning camera, and the relative position (△XP, △YP) between the center of the field of view of the fine-tuning camera and the laser light-emitting point, the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point is calculated. If the relative position of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera is calculated by respectively making a difference between the horizontal and vertical coordinates of the two positions, and the relative position of the field of view center of the fine-tuning camera and the laser light-emitting point is calculated by respectively making a difference between the horizontal and vertical coordinates of the two positions, then the relative position of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera, as well as the relative position of the field of view center of the fine-tuning camera and the laser light-emitting point, the horizontal and vertical coordinates can be summed to obtain the relative position of the field of view center of the wide-angle camera and the laser light-emitting point.

[0114] The relative position of the center of view of the wide-angle camera mentioned above and the center of view of the fine-tuning camera can be calibrated in the following way:

[0115] The first rotation center position (Xr1, Yr1) of the processing stage is pre-calibrated when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage, and the second rotation center position (Xr2, Yr2) of the processing stage is pre-calibrated when the field of view center of the fine-tuning camera coincides with the rotation center of the processing stage; based on the first rotation center position and the second rotation center position, the relative position of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera is determined. For example, the first rotation center position (Xr1, Yr1) and the second rotation center position (Xr2, Yr2) can be subtracted in the X direction and the Y direction respectively to obtain the relative position (Xr1-Xr2, Yr1-Yr2) of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera.

[0116] Based on the relative position of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera (Xr1-Xr2, Yr1-Yr2), and the relative position of the field of view center of the fine-tuning camera and the laser light-emitting point (△XP, △YP), the relative position of the field of view center of the wide-angle camera and the laser light-emitting point is calculated (Xr1-Xr2+△XP, Yr1-Yr2+△YP).

[0117] According to the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point (Xr1-Xr2+△XP, Yr1-Yr2+△YP), and the position information of the first intersection in the axis coordinate system (P1.X, P1.Y), the first position conversion result is calculated as the laser opening position (Xo1, Yo1), which is expressed by the formula:

[0118] Xo1=P1.X+Xr1-Xr2+△XP

[0119] Yo1=P1.Y+Yr1-Yr2+△YP

[0120] According to the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point (Xr1-Xr2+△XP, Yr1-Yr2+△YP), and the position information of the second intersection in the axis coordinate system (P2.X, P2.Y), the second position conversion result is calculated as the laser light-off position (Xo2, Yo2), which is expressed by the formula:

[0121] Xo2=P2.X+Xr1-Xr2+△XP

[0122] Yo2=P2.Y+Yr1-Yr2+△YP

[0123] In the above method, by making use of the technical advantage of being able to identify the outline of the product to be processed under a wide-angle camera, the position of the center of the target cutting path on the product to be processed under the wide-angle camera is accurately located at the pixel level. Based on this, the two intersection points are accurately located at the pixel level, and based on this, the laser light-on position and the laser light-off position are determined, so that the accuracy of the laser light-on position and the laser light-off position is greatly improved. The method of determining the laser processing parameters in the technical solution of the present application has improved accuracy compared to the prior art. The various laser processing parameters determined by this method are conducive to achieving high-precision light-on and light-off control in laser processing, reducing the risk of safety accidents. In addition, it can also better protect the equipment and avoid the problem of shortened equipment life caused by improper laser processing control.

[0124] Figure 5 A flowchart for determining the contour of a product to be processed provided in an embodiment of the present application. Figure 5 , with respect to the profile of the product to be processed mentioned in the above embodiment S102, it can be specifically determined by the following method, including the steps of:

[0125] S501, obtaining a first angle value of the rotation axis of the processing platform when the rotation center of the processing platform coincides with the field of view center of the wide-angle camera, imaging the product to be processed through the wide-angle camera, and extracting an initial contour of the product to be processed from the image.

[0126] Exemplarily, the first angle value and the following second angle value can be obtained by reading from an encoder.

[0127] In practical applications, the encoder can read the angle value of the rotation axis of the processing platform. In order to determine the contour of the product to be processed, the technical solution of this application proposes that when the rotation center of the processing platform coincides with the field of view center of the wide-angle camera, the product to be processed is imaged using a wide-angle camera and the angle value of the rotation axis of the processing platform at this position is extracted from the encoder. For easy distinction, this angle value is called the first angle value. The purpose of recording this first angle value is to provide a reference for the rotation angle for subsequent contour conversion operations.

[0128] S502, controlling the processing stage to move the product to be processed to the bottom of the coarse adjustment camera and the bottom of the fine adjustment camera in sequence, and adjusting the center of the target cutting path on the product to be processed to coincide with the center of the field of view of the camera above after each movement.

[0129] After the first angle value has been recorded and the initial contour of the product to be processed has been extracted, S502 is then executed to locate the center of the target cutting path on the product to be processed in turn through the coarse adjustment camera and the fine adjustment camera. When locating the center of the target cutting path, in order to ensure the accuracy of the positioning, the center of the target cutting path needs to be adjusted to coincide with the center of the field of view of the camera above it. It is understandable that, compared with a wide-angle camera, the center of the target cutting path can be observed more accurately and the position of the center of the target cutting path can be obtained through a relatively smaller field of view under the coarse adjustment camera and the fine adjustment camera.

[0130] S503, obtaining a second angle value of the rotation axis of the processing stage when the center of the target cutting path coincides with the center of the field of view of the fine-tuning camera.

[0131] In the implementation process of S502, the product to be processed is rotated during the adjustment period, and the specific implementation method is to adjust the rotation axis of the processing stage. When S502 is executed, the angle value of the rotation axis of the processing stage when the center of the target cutting path coincides with the center of the field of view of the fine adjustment camera can be read from the encoder. This angle value is defined as the second angle value.

[0132] S504: Determine an angle difference between the first angle value and the second angle value.

[0133] By calculating the angle difference between the first angle value and the second angle value, the rotation angle of the product to be processed can be determined.

[0134] S505 , based on the position information of each pixel in the initial contour, calculating the position information of each pixel after the rotation angle difference of each pixel in the initial contour around the field of view center of the wide-angle camera.

[0135] When the product to be processed rotates, each pixel on its contour also rotates accordingly. In the embodiment of the present application, the position information of each pixel in the initial contour can be obtained, and then the rotated position information corresponding to each pixel on the initial contour is obtained based on the angle difference calculated in S504.

[0136] S506: fitting the contour of the product to be processed according to the rotated position information corresponding to each pixel.

[0137] After obtaining the position information after rotation, the contour of the product to be processed can be obtained by fitting. Compared with the initial contour, this contour can also be regarded as a transformed contour. Figure 4 The outline C shown may also be understood as a converted outline determined by executing S501 to S506 .

[0138] Combination of the above embodiments Figure 5In the process of determining the contour of the product to be processed, it is mentioned in S502 that the processing stage needs to be controlled to move the product to be processed to the bottom of the coarse adjustment camera and the bottom of the fine adjustment camera in sequence, and after each movement, the center of the target cutting path on the product to be processed is adjusted to coincide with the center of the field of view of the camera above. This process is described in detail below. Figure 6 A specific implementation flow chart of controlling the processing stage to move the product to be processed to the bottom of the coarse adjustment camera and the fine adjustment camera in sequence provided in the embodiment of the present application. Figure 6 As shown, the process includes:

[0139] S5021, controlling the processing stage to move the product to be processed to below the coarse adjustment camera;

[0140] S5022, based on the target cutting path center determined within the field of view of the coarse adjustment camera, controlling the movement of the processing stage to perform a first alignment operation between the target cutting path center and the field of view center of the coarse adjustment camera;

[0141] The first alignment operation is to adjust the center of the target cutting path to coincide with the center of the field of view of the coarse adjustment camera. In this process, in order to achieve the purpose of adjustment and coincidence, it may be necessary to adjust the processing stage in the X direction and / or Y direction, and it may also be necessary to rotate the processing stage.

[0142] S5023, judging whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction, if so, proceeding to S5024; if not, proceeding to S5025;

[0143] Combination Figure 4 It can be understood that each cutting path center is formed by two cutting paths that intersect each other, that is, one cutting path center corresponds to the intersection of the two cutting paths. In the present application, the first direction cutting path may refer to one of the cutting paths planned for laser processing. Laser processing is generally performed along the X direction to form a cutting line along the X direction, so the preset direction here may refer to the X direction. To achieve processing, if after S5022, the first direction cutting path is not parallel to the preset direction, it is necessary to enter S5025, and it is necessary to adjust the first direction cutting path to be parallel to the preset direction. This operation can also be called a pull horizontal operation, and the X direction corresponds to the horizontal direction.

[0144] S5024, control the processing stage to move the product to be processed to the bottom of the fine adjustment camera, and enter S5026;

[0145] The product to be processed is moved under the fine-tuning camera, with the purpose of more accurately determining the position information of the center of the target cutting path on the product to be processed from the camera field of view with a smaller field of view.

[0146] S5025, adjusting the angle of the rotation axis of the processing stage so that the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction, and then controlling the movement of the processing stage so that the center of the target cutting path and the center of the field of view of the coarse adjustment camera are aligned for the second time. After the second alignment operation is completed, return to S5024;

[0147] S5026, based on the target cutting path center determined within the field of view of the fine-tuning camera, controlling the processing stage to move so that the target cutting path center and the field of view center of the fine-tuning camera are aligned for the first time;

[0148] The first alignment operation is to adjust the center of the target cutting path to coincide with the center of the field of view of the fine-tuning camera. In this process, in order to achieve the purpose of adjustment and coincidence, it may be necessary to adjust the processing stage in the X direction and / or Y direction, and it may also be necessary to rotate the processing stage.

[0149] S5027, judging whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction, if so, stopping the adjustment of the processing stage under the fine adjustment camera; if not, entering S5028;

[0150] S5028. Adjust the angle of the rotation axis of the processing stage so that the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction, and then control the movement of the processing stage to perform a second alignment operation on the center of the target cutting path and the center of the field of view of the fine-tuning camera.

[0151] Similar to the case of the coarse-adjustment camera, under the fine-adjustment camera, if the cutting path in the first direction is not parallel to the preset direction, it is still necessary to control the processing stage to move and rotate to achieve a parallel state, so as to achieve the leveling of the cutting path in the first direction.

[0152] During this period, each time the center of the target cutting path is adjusted to coincide with the field of view center of the camera, it is determined whether the first direction cutting path is parallel to the preset direction, thereby achieving stable maintenance of the direction of the first direction cutting path.

[0153] Combined with the previous Figure 6, through S5021 to S5028, a detailed description is given of how to control the processing stage to move the product to be processed successively to the bottom of the coarse-adjustment camera and the bottom of the fine-adjustment camera, and adjust the target cutting path center on the product to be processed to coincide with the field of view center of the camera above. The purpose of this series of operations is to obtain the first position information of the target cutting path center under the fine-adjustment camera when the target cutting path center coincides with the field of view center of the fine-adjustment camera and the first direction cutting path of the target cutting path center is parallel to the preset direction. The first position information can be understood as the position information read in the axis coordinate system. In practical applications, in order to accurately locate the first intersection point and the second intersection point, it is also necessary to locate the target cutting path center at the pixel level within the field of view of the wide-angle camera. In addition, as introduced above, since the first position information is formed by operations such as rotating the processing stage, the contour of the product to be processed has been transformed from the initial contour during this period. In other words, the first position information and the converted contour of the product to be processed correspond to each other in terms of state and stage. Therefore, when it is necessary to convert the first position information into a pixel-level position under a wide-angle camera, the converted position also corresponds to the converted contour of the product to be processed.

[0154] Combined with the above analysis, an example implementation of S101 in the above embodiment is described below. The technical solution of the present application pre-calibrates the first rotation center position (Xr1, Yr1) of the processing platform when the field of view center of the wide-angle camera and the rotation center of the processing platform coincide with each other, and pre-calibrates the second rotation center position (Xr2, Yr2) of the processing platform when the field of view center of the fine-tuning camera and the rotation center of the processing platform coincide with each other.

[0155] The step of obtaining the position of the center of the target cutting path on the product to be processed under the wide-angle camera includes:

[0156] First, based on the first position information and the relative position (Xr1-Xr2, Yr1-Yr2) between the first rotation center position and the second rotation center position, the second position information of the target cutting path center under the wide-angle camera is reversely calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing platform.

[0157] As mentioned above, in a specific implementation, when the center of the target cutting path coincides with the center of the field of view of the fine-tuning camera, and the first direction cutting path of the center of the target cutting path is parallel to the preset direction, the first position information of the center of the target cutting path under the fine-tuning camera is obtained. The first rotation center position (Xr1, Yr1) is the position of the processing platform when the center of the field of view of the wide-angle camera and the rotation center of the processing platform coincide, and the second rotation center position (Xr2, Yr2) is the position of the processing platform when the center of the field of view of the fine-tuning camera and the rotation center of the processing platform coincide. Therefore, based on the relative position of the first rotation center position and the second rotation center position (Xr1-Xr2, Yr1-Yr2), and the first position information of the center of the target cutting path under the fine-tuning camera, the second position information of the center of the target cutting path under the wide-angle camera can be calculated by reverse calculation. The following formula shows this calculation process.

[0158] Assume that the first position information of the target cutting path center under the fine-tuning camera is expressed as (X2, Y2), and the second position information of the target cutting path center under the wide-angle camera is expressed as (X3, Y3), see the following formula:

[0159] X3=Xr1-Xr2+X2

[0160] Y3=Yr1-Yr2+Y2

[0161] It can be understood that when the center of the target cutting road is at the second position information of the wide-angle camera, the center of the target cutting road coincides with the center of the field of view of the wide-angle camera.

[0162] Next, it is also necessary to calculate the pixel position of the target cutting path center in the field of view of the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the processing platform according to the second position information, the first rotation center position and the pixel coordinates of the field of view center of the wide-angle camera. This is because the second position information (X3, Y3) is only the position of the target cutting path center under the wide-angle camera when the field of view center of the wide-angle camera coincides with the field of view center of the wide-angle camera. It is also necessary to reversely deduce the pixel position of the target cutting path center in the field of view of the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the processing platform based on the second position information (X3, Y3). This is because the initial contour of the product to be processed is extracted from the image when the rotation center of the processing platform coincides with the field of view center of the wide-angle camera, which is equivalent to the need to reversely restore the position of the target cutting path center when the rotation center of the processing platform coincides with the field of view center of the wide-angle camera.

[0163] Specifically, based on the second position information (X3, Y3) and the first rotation center position (Xr1, Yr1), the relative position (△x, △y) of the target cutting path center and the field of view center of the wide-angle camera in the axial coordinate system can be calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing platform.

[0164] △x=X3-Xr1

[0165] △y=Y3-Yr1

[0166] Next, based on the proportional relationship between the axial coordinate system and the pixel coordinate system, the relative positions of the center of the target cutting path and the center of the field of view of the wide-angle camera in the axial coordinate system are converted to the pixel coordinate system, and when the center of the field of view of the wide-angle camera coincides with the rotation center of the processing platform, the relative positions of the center of the target cutting path and the center of the field of view of the wide-angle camera in the pixel coordinate system are obtained.

[0167] Assuming that the ratio between the axis coordinate system and the pixel coordinate system is k, the relative positions of the target cutting path center and the field of view center of the wide-angle camera in the axis coordinate system can be converted into the pixel coordinate system and expressed as △x / k, △y / k.

[0168] According to the relative position (△x / k, △y / k) of the center of the target cutting path and the center of the field of view of the wide-angle camera in the pixel coordinate system, and the pixel coordinates (Xc, Yc) of the center of the field of view of the wide-angle camera, the pixel position (X4, Y4) of the center of the target cutting path in the field of view of the wide-angle camera is calculated when the center of the field of view of the wide-angle camera coincides with the rotation center of the processing stage. It can be expressed by the formula:

[0169] X4=△x / k+Xc

[0170] Y4=△y / K+Yc

[0171] In practical applications, the laser processing length is calculated based on the laser on position and the laser off position. The laser processing length is also used as a laser processing parameter and can be used to achieve laser processing control.

[0172] With respect to the target cutting path center described in the above embodiment, a method for determining the target cutting path center is exemplarily provided below:

[0173] In an embodiment of the present application, a first template image corresponding to the field of view of the coarse adjustment camera can be obtained; the first template image includes a plurality of mutually segmented target features for identifying the center of the cutting path. For example, the first template image can be an image containing a plurality of mutually segmented grains for identifying the center of the cutting path. With the first template image, the center of the cutting path within the field of view of the coarse adjustment camera can be effectively identified. In specific implementation, feature matching can be performed on pixels within the field of view of the coarse adjustment camera based on the plurality of mutually segmented target features in the first template image to determine one or more cutting path centers. If only one cutting path center is determined, the cutting path center is used as the target cutting path center. In many actual processing scenarios, multiple cutting path centers can be determined by the first template image. In this case, the cutting path center closest to the center of the field of view of the coarse adjustment camera is used as the target cutting path center. Using the closest cutting path center as the target cutting path center can save the time for controlling the processing stage and improve the efficiency of determining laser processing parameters. It should be noted that if the two cutting lanes where the nearest cutting lane center is located have been laser processed, then for multiple cutting lane centers, the nearest cutting lane center with at least one cutting lane that has not been processed can be used as the target cutting lane center.

[0174] Similarly, in order to identify the target cutting path center under the fine-tuning camera, the template image can also be used for identification. For example, the second template image is used to identify the target cutting path center in the image taken under the fine-tuning camera. It should be noted that the target cutting path center determined within the field of view of the coarse-tuning camera and the fine-tuning camera should be the same target cutting path center.

[0175] The present application provides a method for controlling laser processing. Figure 7 As shown, the following steps are included:

[0176] S701, receiving laser processing parameters.

[0177] The laser processing parameters may include a laser opening position and a laser processing length obtained by a method for determining laser processing parameters.

[0178] S702, after controlling the processing stage to move to a corresponding position according to the laser opening position, controlling the laser to be turned on.

[0179] At this point, one of the two intersection points on the contour has been aligned with the laser processing point, and the laser can be controlled to start laser processing from the aligned intersection point.

[0180] S703: After the laser starts to process the product to be processed, the processing platform is controlled to move along a preset direction by the laser processing length, and the laser is controlled to be turned off.

[0181] After the laser processing starts, the processing stage needs to move a certain distance along the preset direction (X direction). This distance is determined by the laser processing length. After moving a distance equal to the laser processing length along this direction, another intersection point on the contour is aligned with the laser processing point. At this time, the cutting line has been formed and the laser can be controlled to be turned off.

[0182] It is understandable that the method for determining laser processing parameters and the method for controlling laser processing described in the above embodiments are described and introduced by taking cutting on one cutting path as an example. In practical applications, a product to be processed may include multiple parallel cutting paths waiting to be processed. The method for determining laser processing parameters on each cutting path and the control process of laser processing can refer to the description of the above method embodiments and will not be repeated here.

[0183] Based on the method for determining laser processing parameters described above, the present application also provides a device for determining laser processing parameters. Figure 8 As shown, the device comprises:

[0184] An acquisition module 801 is used to acquire the position of the center of a target cutting line on the product to be processed under the wide-angle camera; the cutting line is a strip area on the product to be processed for separating multiple target features;

[0185] The intersection position determination module 802 is used to determine the position information of two intersection points that pass through the position and are parallel to a preset direction and intersect with the contour of the product to be processed; the contour is obtained based on the imaging of the product to be processed by the wide-angle camera; the preset direction corresponds to the direction of the straight line where the cutting path is located;

[0186] The switch light position acquisition module 803 is used to convert the laser light on position and laser light off position for laser processing the product to be processed based on the relative position of the field center of the wide-angle camera and the laser light output point, and the position information of the two intersection points.

[0187] In an optional implementation, the two intersection points include a first intersection point and a second intersection point; and the switch light position acquisition module 803 is specifically used for:

[0188] A first position conversion result is obtained by calculation based on the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the first intersection; and a second position conversion result is obtained by calculation based on the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the second intersection; one of the first position conversion result and the second position conversion result is used as the laser on position, and the other is used as the laser off position.

[0189] In an optional implementation, the switch light position acquisition module 803 is specifically used to: convert the position information of the first intersection from the pixel coordinate system to the axis coordinate system according to the proportional relationship between the axis coordinate system and the pixel coordinate system, and obtain the position information of the first intersection in the axis coordinate system;

[0190] According to the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the first intersection in the axis coordinate system, a first position conversion result is calculated as the laser opening position;

[0191] According to the proportional relationship, the position information of the second intersection is converted from the pixel coordinate system to the axis coordinate system to obtain the position information of the second intersection in the axis coordinate system;

[0192] According to the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the second intersection in the axis coordinate system, a second position conversion result is calculated as the laser light-off position.

[0193] In an optional implementation, the device for determining laser processing parameters further includes:

[0194] A relative position calibration module, used to pre-calibrate the relative position between the field of view center of the fine-tuning camera and the laser light-emitting point;

[0195] The relative position calculation module is used to calculate the relative position of the field of view center of the wide-angle camera and the laser light-emitting point based on the relative position of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera, and the relative position of the field of view center of the fine-tuning camera and the laser light-emitting point.

[0196] In an optional implementation, the relative position calibration module is further used for:

[0197] Pre-calibrating a first rotation center position of the processing platform when the field of view center of the wide-angle camera and the rotation center of the processing platform coincide with each other, wherein the processing platform is used to carry the product to be processed;

[0198] and pre-calibrating a second rotation center position of the processing stage when the field of view center of the fine-tuning camera and the rotation center of the processing stage coincide with each other;

[0199] The relative position calculation module is further used to determine the relative position of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera based on the first rotation center position and the second rotation center position.

[0200] In an optional implementation, the laser processing parameter determination device further includes a contour determination module; the contour determination module is specifically used for:

[0201] When the rotation center of the processing platform coincides with the field of view center of the wide-angle camera, a first angle value of the rotation axis of the processing platform is obtained, and the product to be processed is imaged by the wide-angle camera to extract the initial contour of the product to be processed from the image; the processing platform is used to carry the product to be processed;

[0202] Controlling the processing stage to move the product to be processed successively to the bottom of the coarse adjustment camera and the bottom of the fine adjustment camera, and adjusting the center of the target cutting path on the product to be processed to coincide with the center of the field of view of the camera above after each movement;

[0203] Acquire a second angle value of the rotation axis of the processing stage when the center of the target cutting path coincides with the center of the field of view of the fine-tuning camera;

[0204] Determine an angle difference between the first angle value and the second angle value;

[0205] Based on the position information of each pixel in the initial contour, calculating the rotated position information corresponding to each pixel after each pixel in the initial contour is rotated by the angle difference around the field of view center of the wide-angle camera;

[0206] The contour of the product to be processed is obtained by fitting according to the rotated position information corresponding to each pixel.

[0207] In an optional implementation, the contour determination module is specifically used to:

[0208] Controlling the processing stage to move the product to be processed to below the coarse adjustment camera;

[0209] Based on the target cutting line center determined within the field of view of the coarse adjustment camera, controlling the movement of the processing stage to perform a first alignment operation between the target cutting line center and the field of view center of the coarse adjustment camera;

[0210] Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If so, control the processing stage to move the product to be processed to the bottom of the fine-tuning camera. If not, adjust the angle of the rotation axis of the processing stage to make the first direction cutting path passing through the center of the target cutting path parallel to the preset direction, and then control the processing stage to move so that the center of the target cutting path and the center of the field of view of the coarse-tuning camera are aligned for the second time. After the second alignment operation is completed, continue to control the processing stage to move the product to be processed to the bottom of the fine-tuning camera.

[0211] Based on the target cutting line center determined within the field of view of the fine-tuning camera, controlling the movement of the processing stage to perform a first alignment operation between the target cutting line center and the field of view center of the fine-tuning camera;

[0212] Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If not, adjust the angle of the rotation axis of the processing platform to make the first direction cutting path passing through the center of the target cutting path parallel to the preset direction, and then control the movement of the processing platform to perform a second alignment operation between the center of the target cutting path and the center of the field of view of the fine-tuning camera.

[0213] In an optional implementation, the laser processing parameter determination device further includes: a cutting path center determination module; the module is specifically used to determine the target cutting path center within the field of view of the coarse adjustment camera in the following manner.

[0214] Acquire a first template image corresponding to the field of view of the coarse adjustment camera; the first template image includes a plurality of mutually segmented target features for identifying the center of the cutting path;

[0215] Based on the multiple mutually segmented target features in the first template image, feature matching is performed on pixels within the field of view of the coarse adjustment camera to determine one or more cutting lane centers;

[0216] If multiple cutting path centers are determined, a cutting path center that is closest to the center of the field of view of the coarse adjustment camera is used as the target cutting path center.

[0217] In an optional implementation, the device for determining laser processing parameters further includes:

[0218] A cutting path center position determination module, used for obtaining first position information of the target cutting path center under the fine-tuning camera when the target cutting path center coincides with the field of view center of the fine-tuning camera and the first direction cutting path of the target cutting path center is parallel to the preset direction;

[0219] A relative position calibration module, used to pre-calibrate a first rotation center position of the processing stage when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage, and to pre-calibrate a second rotation center position of the processing stage when the field of view center of the fine-tuning camera coincides with the rotation center of the processing stage;

[0220] The acquisition module 801 is specifically used for:

[0221] Based on the first position information and the relative position between the first rotation center position and the second rotation center position, reversely calculate the second position information of the target cutting lane center under the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage;

[0222] Based on the second position information, the first rotation center position and the pixel coordinates of the field of view center of the wide-angle camera, the pixel position of the target cutting path center within the field of view of the wide-angle camera is calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing platform.

[0223] In an optional implementation, the acquisition module 801 is specifically used for:

[0224] Calculating, according to the second position information and the first rotation center position, the relative position of the target cutting path center and the field of view center of the wide-angle camera in the axial coordinate system when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage;

[0225] Based on the proportional relationship between the axis coordinate system and the pixel coordinate system, the relative position of the center of the target cutting path and the center of the field of view of the wide-angle camera in the axis coordinate system is converted to the pixel coordinate system, and when the center of the field of view of the wide-angle camera coincides with the rotation center of the processing stage, the relative position of the center of the target cutting path and the center of the field of view of the wide-angle camera in the pixel coordinate system is obtained;

[0226] Based on the relative positions of the target cutting path center and the field of view center of the wide-angle camera in the pixel coordinate system, and the pixel coordinates of the field of view center of the wide-angle camera, the pixel position of the target cutting path center within the field of view of the wide-angle camera is calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing platform.

[0227] In an optional implementation, the device for determining laser processing parameters further includes:

[0228] The processing length calculation module is used to calculate the laser processing length according to the laser light-on position and the laser light-off position.

[0229] Based on the laser processing control method described above, the present application also provides a laser processing control device. Fig. 9 As shown, this figure is a schematic diagram of the structure of the control device for laser processing. Fig. 9 As shown, a laser processing control device includes:

[0230] The parameter receiving module 901 is used to receive laser processing parameters; the laser processing parameters include the laser opening position and the laser processing length obtained by the laser processing parameter determination method described above;

[0231] The control module 902 is used to control the processing platform to move to the corresponding position according to the laser opening position, and then control the laser to be turned on; and is also used to control the processing platform to move the laser processing length along a preset direction and control the laser to be turned off after the laser starts to process the product to be processed.

[0232] In addition, the present application also provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, it implements the method for determining laser processing parameters as described above, or implements the method for controlling laser processing as described above.

[0233] Fig.10 A schematic diagram of a camera calibration interface provided in an embodiment of the present application. Fig.10 Pixel coordinates refer to the coordinates in the pixel coordinate system, and axon coordinates refer to the coordinates in the axis coordinate system. Fig.10 In the interface shown, calibration tests can be performed for the wide-angle camera, coarse-adjustment camera, and fine-adjustment camera respectively. Fig.11 A schematic diagram of a rotation center calibration interface provided in an embodiment of the present application.

[0234] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment. The device embodiment described above is merely schematic, in which the unit described as a separate component may or may not be physically separated, and the component prompted as a unit may or may not be a physical unit, that is, it may be located in one place, or it may be distributed on multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative work.

[0235] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for determining laser processing parameters, characterized in that: include: Obtaining the position of the center of the target cutting path on the product to be processed under the wide-angle camera; The cutting path is a strip area on the product to be processed for separating a plurality of target features; Determine the position information of two intersection points that pass through the position and are parallel to a preset direction and intersect with the contour of the product to be processed; the contour is obtained based on the imaging extraction of the product to be processed by the wide-angle camera, and the preset direction corresponds to the direction of the straight line where the cutting path is located; Based on the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the two intersection points, the laser on position and the laser off position for laser processing the product to be processed are converted.

2. The method according to claim 1, characterized in that The two intersection points include a first intersection point and a second intersection point; the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the two intersection points are converted to obtain a laser light-on position and a laser light-off position for laser processing of the product to be processed, including: A first position conversion result is obtained by calculation based on the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the first intersection; and a second position conversion result is obtained by calculation based on the relative position of the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the second intersection; one of the first position conversion result and the second position conversion result is used as the laser on position, and the other is used as the laser off position.

3. The method according to claim 2, characterized in that The first position conversion result is obtained by calculating the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the first intersection, including: according to the proportional relationship between the axis coordinate system and the pixel coordinate system, converting the position information of the first intersection from the pixel coordinate system to the axis coordinate system, and obtaining the position information of the first intersection in the axis coordinate system; According to the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the first intersection in the axis coordinate system, a first position conversion result is calculated as the laser opening position; The second position conversion result is obtained by calculating the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the second intersection, including: According to the proportional relationship, the position information of the second intersection is converted from the pixel coordinate system to the axis coordinate system to obtain the position information of the second intersection in the axis coordinate system; According to the relative position between the center of the field of view of the wide-angle camera and the laser light-emitting point, and the position information of the second intersection in the axis coordinate system, a second position conversion result is calculated as the laser light-off position.

4. The method according to claim 2, characterized in that: The method further comprises: Pre-calibrating the relative position between the center of the field of view of the fine-tuning camera and the laser light-emitting point; Based on the relative positions of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera, and the relative positions of the field of view center of the fine-tuning camera and the laser light-emitting point, the relative positions of the field of view center of the wide-angle camera and the laser light-emitting point are calculated.

5. The method according to claim 4, characterized in that The method further includes determining the relative position of the center of the field of view of the wide-angle camera and the center of the field of view of the fine-tuning camera by the following steps: Pre-calibrating a first rotation center position of the processing platform when the field of view center of the wide-angle camera and the rotation center of the processing platform coincide with each other, wherein the processing platform is used to carry the product to be processed; and pre-calibrating a second rotation center position of the processing stage when the field of view center of the fine-tuning camera and the rotation center of the processing stage coincide with each other; Based on the first rotation center position and the second rotation center position, a relative position between a field of view center of the wide-angle camera and a field of view center of the fine-tuning camera is determined.

6. The method according to claim 1, characterized in that The method further comprises determining the contour of the product to be processed by the following steps: When the rotation center of the processing platform coincides with the field of view center of the wide-angle camera, a first angle value of the rotation axis of the processing platform is obtained, and the product to be processed is imaged by the wide-angle camera to extract the initial contour of the product to be processed from the image; the processing platform is used to carry the product to be processed; Controlling the processing stage to move the product to be processed successively to the bottom of the coarse adjustment camera and the bottom of the fine adjustment camera, and adjusting the center of the target cutting path on the product to be processed to coincide with the center of the field of view of the camera above after each movement; Acquire a second angle value of the rotation axis of the processing stage when the center of the target cutting path coincides with the center of the field of view of the fine-tuning camera; Determine an angle difference between the first angle value and the second angle value; Based on the position information of each pixel in the initial contour, calculating the rotated position information corresponding to each pixel after each pixel in the initial contour is rotated by the angle difference around the field of view center of the wide-angle camera; The contour of the product to be processed is obtained by fitting according to the rotated position information corresponding to each pixel.

7. The method according to claim 6, characterized in that The controlling the processing stage to move the product to be processed successively to the bottom of the coarse adjustment camera and the bottom of the fine adjustment camera, and adjusting the center of the target cutting path on the product to be processed to coincide with the center of the field of view of the camera above after each movement, comprises: Controlling the processing stage to move the product to be processed to below the coarse adjustment camera; Based on the target cutting line center determined within the field of view of the coarse adjustment camera, controlling the movement of the processing stage to perform a first alignment operation between the target cutting line center and the field of view center of the coarse adjustment camera; Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If so, control the processing stage to move the product to be processed to the bottom of the fine-tuning camera. If not, adjust the angle of the rotation axis of the processing stage to make the first direction cutting path passing through the center of the target cutting path parallel to the preset direction, and then control the processing stage to move so that the center of the target cutting path and the center of the field of view of the coarse-tuning camera are aligned for the second time. After the second alignment operation is completed, continue to control the processing stage to move the product to be processed to the bottom of the fine-tuning camera. Based on the target cutting line center determined within the field of view of the fine-tuning camera, controlling the movement of the processing stage to perform a first alignment operation between the target cutting line center and the field of view center of the fine-tuning camera; Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If not, adjust the angle of the rotation axis of the processing platform to make the first direction cutting path passing through the center of the target cutting path parallel to the preset direction, and then control the movement of the processing platform to perform a second alignment operation between the center of the target cutting path and the center of the field of view of the fine-tuning camera.

8. The method according to claim 7, characterized in that The method of determining the center of the target cutting path within the field of view of the coarse adjustment camera is as follows: Acquire a first template image corresponding to the field of view of the coarse adjustment camera; the first template image includes a plurality of mutually segmented target features for identifying the center of the cutting path; Based on the multiple mutually segmented target features in the first template image, feature matching is performed on pixels within the field of view of the coarse adjustment camera to determine one or more cutting lane centers; If multiple cutting path centers are determined, a cutting path center that is closest to the center of the field of view of the coarse adjustment camera is used as the target cutting path center.

9. The method according to claim 7, characterized in that: The method further comprises: When the center of the target cutting path coincides with the center of the field of view of the fine-tuning camera, and the first direction cutting path of the center of the target cutting path is parallel to the preset direction, obtaining first position information of the center of the target cutting path under the fine-tuning camera; Pre-calibrating the first rotation center position of the processing platform when the field of view center of the wide-angle camera coincides with the rotation center of the processing platform, and pre-calibrating the second rotation center position of the processing platform when the field of view center of the fine-tuning camera coincides with the rotation center of the processing platform; the step of obtaining the position of the center of the target cutting path on the product to be processed under the wide-angle camera includes: Based on the first position information and the relative position between the first rotation center position and the second rotation center position, reversely calculate the second position information of the target cutting lane center under the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage; Based on the second position information, the first rotation center position and the pixel coordinates of the field of view center of the wide-angle camera, the pixel position of the target cutting path center within the field of view of the wide-angle camera is calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing platform.

10. The method according to claim 9, characterized in that The pixel position of the target cutting lane center in the field of view of the wide-angle camera is calculated based on the second position information, the first rotation center position and the pixel coordinates of the field of view center of the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage, including: Calculating, according to the second position information and the first rotation center position, the relative position of the target cutting path center and the field of view center of the wide-angle camera in the axial coordinate system when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage; Based on the proportional relationship between the axis coordinate system and the pixel coordinate system, the relative position of the center of the target cutting path and the center of the field of view of the wide-angle camera in the axis coordinate system is converted to the pixel coordinate system, and when the center of the field of view of the wide-angle camera coincides with the rotation center of the processing stage, the relative position of the center of the target cutting path and the center of the field of view of the wide-angle camera in the pixel coordinate system is obtained; Based on the relative positions of the target cutting path center and the field of view center of the wide-angle camera in the pixel coordinate system, and the pixel coordinates of the field of view center of the wide-angle camera, the pixel position of the target cutting path center within the field of view of the wide-angle camera is calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing platform.

11. The method according to any one of claims 1 to 10, characterized in that Also includes: The laser processing length is calculated according to the laser on position and the laser off position.

12. A laser processing control method, characterized in that: include: Receiving laser processing parameters; the laser processing parameters include the laser opening position and the laser processing length obtained by the method of claim 11; After the processing stage is moved to the corresponding position according to the laser opening position control, Controlling to turn on the laser; After the laser starts to process the product to be processed, the processing platform is controlled to move the laser processing length along a preset direction, and the laser is controlled to be turned off.

13. A device for determining laser processing parameters, characterized in that: include: An acquisition module, used for acquiring the position of the center of the target cutting path on the product to be processed under the wide-angle camera; The cutting path is a strip area on the product to be processed for separating a plurality of target features; An intersection position determination module is used to determine the position information of two intersections that pass through the position and are parallel to a preset direction and intersect with the contour of the product to be processed; the contour is obtained based on the imaging extraction of the product to be processed by the wide-angle camera; the preset direction corresponds to the direction of the straight line where the cutting path is located; The switch light position acquisition module is used to convert the laser light on position and laser light off position used for laser processing of the product to be processed based on the relative position of the field center of the wide-angle camera and the laser light output point, and the position information of the two intersection points.

14. A laser processing control device, characterized in that: include: A parameter receiving module, used for receiving laser processing parameters; the laser processing parameters include the laser opening position and the laser processing length obtained by the method according to claim 11; A control module, used for controlling the processing stage to move to a corresponding position according to the laser opening position, and then controlling the laser to be turned on; Furthermore, it is used to control the processing platform to move the laser processing length along a preset direction and control the laser to be turned off after the laser starts to process the product to be processed.

15. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method for determining laser processing parameters as described in any one of claims 1 to 11 is implemented, or the method for controlling laser processing as described in claim 12 is implemented.

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